Temperature sensor and process for manufacturing the same

Abstract

The application relates to the technical field of temperature measurement, in particular to a temperature sensor and a preparation process thereof. The temperature sensor comprises a shell, a first insulating layer and a first thermal sensitive layer; the shell comprises a bottom wall and a peripheral wall, the peripheral wall is arranged around the bottom wall to form an accommodating space, the first insulating layer and the first thermal sensitive layer are arranged in the accommodating space, one maximum surface of the first insulating layer is attached to the inner surface of the bottom wall, and the other maximum surface is attached to one maximum surface of the first thermal sensitive layer. The first insulating layer is directly arranged on the inner surface of the bottom wall of the shell, then the first thermal sensitive layer for sensing temperature change is arranged on the first insulating layer, the bottom wall of the shell is used as a base body, compared with the existing temperature sensor, the base body or the filling material is less arranged in the structure, the temperature change of the external environment is conducted to the first thermal sensitive layer through the shell and the first insulating layer, the conducting path is shortened, the response time of the first thermal sensitive layer is shortened, and rapid temperature measurement is realized.

Description

Technical Field

[0001] This invention relates to the field of temperature measurement technology, and in particular to a temperature sensor and its fabrication process. Background Technology

[0002] Temperature detection is a common task in modern industrial production and scientific research, requiring the use of temperature measuring instruments. Temperature sensors are the core component of these instruments, converting temperature variables into standardized, transmittable output signals. There are many types of temperature sensors, which can be categorized by measurement method into contact and non-contact sensors. Contact temperature sensors require physical contact with the object being sensed and use conduction to detect temperature changes; they can be used to detect solids, liquids, or gases over a wide temperature range. Non-contact temperature sensors use convection and radiation to monitor temperature changes and can be used to detect liquids and gases.

[0003] The commonly used PT100 temperature sensor mainly consists of a temperature sensing element, an outer casing, and a junction box. The temperature sensing element mainly consists of a resistance wire, a frame (insulating material, such as mica or ceramic), a filling material, and a lead wire. The temperature is conducted to the resistance wire through the outer casing and the filling material. However, the filling material has a large specific heat capacity, which leads to a long temperature conduction time, resulting in a long response time for the temperature sensing element, thus limiting the application scenarios of the temperature sensor.

[0004] For example, Chinese utility model patent CN210243023U, entitled "A High-Temperature Resistant and High-Precision Temperature Measurement Probe," includes a platinum resistance thermometer, a high-temperature resistant thermally conductive filler, a grooved high-temperature resistant double-hole ceramic cylinder, a high-temperature resistant pure nickel wire, and a stainless steel temperature probe. A platinum resistance thermometer is installed inside one end of the stainless steel temperature probe. The two leads of the platinum resistance thermometer are connected to one end of the high-temperature resistant pure nickel wire via laser welding. The other end of the high-temperature resistant pure nickel wire passes through the stainless steel temperature probe and is connected to an electrical wire. A grooved high-temperature resistant double-hole ceramic cylinder is fitted inside the stainless steel temperature probe. The welding points of the platinum resistance thermometer, the high-temperature resistant pure nickel wire, and the platinum resistance thermometer are all located inside the grooved high-temperature resistant double-hole ceramic cylinder. One end of the grooved high-temperature resistant double-hole ceramic cylinder is filled with a high-temperature resistant thermally conductive filler. The welding points of the platinum resistance thermometer, the high-temperature resistant pure nickel wire, and the platinum resistance thermometer are located within the high-temperature resistant thermally conductive filler. The platinum resistance thermometer is located in a groove at the head of the grooved high-temperature resistant double-hole ceramic cylinder. The two high-temperature resistant pure nickel wires are located in the two holes of the grooved high-temperature resistant double-hole ceramic cylinder.

[0005] Therefore, how to shorten the response time of the temperature sensing element in a temperature sensor is a technical problem that engineers need to solve. Summary of the Invention

[0006] This invention provides a temperature sensor and its fabrication process, which solves the technical problem in the prior art where temperature sensors achieve temperature conduction between the sensing element and the outer shell through a substrate or filling material, resulting in a long response time for the sensing element.

[0007] The first aspect of the present invention provides a temperature sensor, comprising:

[0008] The housing, the first insulating layer, and the first thermally sensitive layer;

[0009] The housing includes a bottom wall and a peripheral wall, with the peripheral wall surrounding the bottom wall to form an accommodating space.

[0010] The first insulating layer and the first thermally sensitive layer are disposed within the accommodating space;

[0011] One of the largest surfaces of the first insulating layer is attached to the inner surface of the bottom wall, and the other largest surface is attached to one of the largest surfaces of the first thermally sensitive layer.

[0012] The first possible implementation of the temperature sensor in the first aspect also includes:

[0013] Inner shell, second insulating layer, and second thermal sensing layer;

[0014] The inner housing is disposed within the receiving space and is spaced apart from the first thermally sensitive layer;

[0015] The inner shell is equipped with a connecting pipe;

[0016] The connecting pipe penetrates the peripheral wall, connecting the liquid space enclosed by the inner shell to the external environment;

[0017] One of the largest surfaces of the second insulating layer is attached to the outer surface of the inner housing, and the other largest surface is attached to one of the largest surfaces of the second thermally sensitive layer;

[0018] The second thermal layer is spaced apart from the peripheral wall.

[0019] In conjunction with the first possible implementation of the temperature sensor of the first aspect, the second possible implementation of the temperature sensor of the first aspect further includes:

[0020] Penetrating tube;

[0021] The inner shell also includes a first partition, a second partition, and an annular plate;

[0022] The first partition, the second partition, and the bottom wall are spaced parallel to each other, with the first partition close to the bottom wall;

[0023] The second insulating layer is attached to the surface of the first partition near the bottom wall;

[0024] The annular plate is connected to the first partition and the second partition to form the liquid-containing space;

[0025] The through-tube penetrates vertically through the second thermal layer, the second insulating layer, the first partition, and the second partition, and passes through the liquid-containing space.

[0026] In conjunction with the second possible implementation of the temperature sensor of the first aspect, the third possible implementation of the temperature sensor of the first aspect further includes:

[0027] Insulation layer;

[0028] The heat insulation layer covers the outer surface of the inner shell, or is embedded in the first partition, the second partition, and the annular plate.

[0029] In the fourth possible implementation of the temperature sensor in the first aspect, the inner surface of the bottom wall is provided with N square grooves, where N is an integer greater than or equal to 1;

[0030] The side surface of the square groove is perpendicular to the bottom wall;

[0031] The first insulating layer covers the port face, side surface, and bottom surface of the square groove.

[0032] In conjunction with the fourth possible implementation of the temperature sensor in the first aspect, in the fifth possible implementation of the temperature sensor in the first aspect, when N>1, N square grooves are evenly arranged on the inner surface of the bottom wall.

[0033] In a sixth possible implementation of the temperature sensor in conjunction with the first aspect, the first possible implementation of the first aspect, the second possible implementation of the first aspect, the third possible implementation of the first aspect, the fourth possible implementation of the first aspect, or the fifth possible implementation of the first aspect, the bottom wall is detachably connected to the peripheral wall.

[0034] In conjunction with the sixth possible implementation of the temperature sensor in the first aspect, in the seventh possible implementation of the temperature sensor in the first aspect, the bottom wall is a circular plate structure;

[0035] The surrounding wall is a cylindrical structure;

[0036] The diameter of the circular plate structure is equal to the inner diameter of the cylindrical structure;

[0037] The circular plate structure has external threads on its circumferential surface.

[0038] The inner circumferential surface of the cylindrical structure near the port is provided with an internal thread that matches the external thread.

[0039] The second aspect of this invention provides a temperature sensor fabrication process for fabricating any of the possible temperature sensors provided in the first aspect, comprising:

[0040] S1: Obtain the shell;

[0041] S2: A first insulating layer is prepared on the inner surface of the bottom wall of the housing using a thin film deposition method;

[0042] S3: A first thermally sensitive layer is prepared on the surface of the first insulating layer furthest from the bottom wall using a thin film deposition method.

[0043] In the first possible temperature sensor fabrication process of the second aspect, the process after S1 and before S2 includes:

[0044] S11: A square groove is formed on the inner surface of the bottom wall;

[0045] S12: Grind the port face, side surface and bottom surface of the square groove.

[0046] As can be seen from the above technical solutions, the present invention has the following advantages:

[0047] The temperature sensor provided by this invention directly sets the first insulating layer on the inner surface of the bottom wall of the housing, and then sets the first thermal sensing layer for sensing temperature changes on the first insulating layer. With the bottom wall of the housing as the substrate, the structure has fewer substrates or filling materials compared with existing temperature sensors. The temperature change of the external environment is conducted to the first thermal sensing layer through the housing and the first insulating layer, shortening the conduction path and thus shortening the response time of the first thermal sensing layer, thereby realizing rapid temperature measurement.

[0048] The temperature sensor does not require additional substrate or filling material, which simplifies the structure and allows for further reduction in the size of the temperature sensor. Furthermore, the first insulating layer and the first thermal sensing layer are directly manufactured on the inner surface of the bottom wall, which simplifies the manufacturing process, reduces material consumption, and thus reduces manufacturing costs. Attached Figure Description

[0049] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0050] Figure 1 A partial cross-sectional view of a temperature sensor provided in an embodiment of the present invention;

[0051] Figure 2This is another partial cross-sectional view of a temperature sensor provided in an embodiment of the present invention;

[0052] Figure 3 This is another partial cross-sectional view of a temperature sensor provided in an embodiment of the present invention;

[0053] Figure 4 This is a schematic flowchart illustrating a temperature sensor fabrication process provided in an embodiment of the present invention.

[0054] in:

[0055] 10. Bottom wall 20. Peripheral wall 30. First insulating layer

[0056] 40, First thermal layer; 50, First partition; 60, Second partition

[0057] 70, Annular plate; 80, Second insulating layer; 90, Second thermally sensitive layer

[0058] 100, through-tube 110, containment space 120, liquid-containing space

[0059] 130. Connecting pipe. Detailed Implementation

[0060] This invention provides a temperature sensor and its fabrication process. The technical problem it addresses is that in the prior art, temperature sensors achieve temperature conduction between the sensing element and the outer shell through a substrate or filling material, resulting in a long response time for the sensing element.

[0061] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0062] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0063] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a replaceable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0064] The commonly used PT100 temperature sensor mainly consists of a temperature sensing element, an outer casing, and a junction box. There are two main types of temperature sensing elements: one type consists of a resistance wire, a frame (insulating material, such as mica or ceramic), a filler material, and lead wire, etc., with temperature conducted to the resistance wire through the outer casing and the filler material. The other type uses bonding or welding to fix the substrate of the molded thin-film temperature sensor to the inner surface of the outer casing, with temperature conducted to the first thermal sensing layer through the outer casing, the substrate, and the first insulating layer. However, the substrate and the filler material have a high specific heat capacity, which results in a longer time required for temperature to be conducted from the outer casing to the resistance wire or the first thermal sensing layer, thus causing a long response time of the temperature sensing element, which limits the application scenarios of the temperature sensor.

[0065] Example 1

[0066] Please see Figure 1-3 The temperature sensor provided in this embodiment of the invention includes:

[0067] The housing includes a first insulating layer 30 and a first thermally sensitive layer 40. The housing includes a bottom wall 10 and a peripheral wall 20, with the peripheral wall 20 surrounding the bottom wall 10 to form a receiving space 110. The first insulating layer 30 and the first thermally sensitive layer 40 are disposed within the receiving space 110. One of the largest surfaces of the first insulating layer 30 is attached to the inner surface of the bottom wall 10, and the other largest surface is attached to one of the largest surfaces of the first thermally sensitive layer 40.

[0068] It should be noted that:

[0069] The housing protects the first insulating layer 30 and the first thermal sensing layer 40 from interference and damage from various environmental factors: preventing the intrusion of water and other liquids, protecting the first thermal sensing layer 40 from the influence of water or other liquids; preventing the entry of fine particles such as dust, ensuring measurement accuracy; preventing corrosive chemicals from contacting the first thermal sensing layer 40, protecting it from corrosion; and providing mechanical protection against external impacts or collisions. This ensures the stability and accuracy of the first thermal sensing layer 40 in various environments. The shape of the housing is not specifically limited here; its bottom wall 10 can be any enclosed shape, such as circular, square, or triangular. The port formed by the peripheral wall 20 away from the bottom wall 10 is used for the lead wire electrically connected to the first thermal sensing layer 40 to pass through and connect to the junction box. The junction box is connected to this port to enclose the receiving space 110.

[0070] The first insulating layer 30 is used to provide electrical insulation to prevent the current formed by the first thermal sensing layer 40 from being conducted to the housing, thereby preventing current leakage or short circuit and ensuring the normal operation and measurement accuracy of the sensor. It can be made of any kind of high temperature resistant and high thermal conductivity insulating material.

[0071] The first thermal sensing layer 40 is used to sense changes in ambient temperature and convert them into an electrical signal output. It is made of thermocouple or resistance thermometer material. When it senses a temperature change, its internal electronic structure and chemical bonds change, resulting in a change in electromotive force or resistance. This signal is received and processed by a signal converter, ultimately outputting an electrical signal proportional to the temperature change. No specific limitation is made to the first thermal sensing layer 40; any commercially available thin-film temperature sensor can be used. It should be understood that to prevent the current generated by the first thermal sensing layer 40 from being conducted to the peripheral wall 20, a gap should exist between the first thermal sensing layer 40 and the peripheral wall, or an insulating material should be used to separate them.

[0072] The other components of the temperature sensor are the same as those of the existing PT100 temperature sensor, and will not be described in detail here.

[0073] The beneficial effects of this embodiment include:

[0074] ① By directly setting the first insulating layer 30 on the inner surface of the bottom wall 10 of the housing, and then setting the first thermal sensing layer 40 for sensing temperature changes on the first insulating layer 30, with the bottom wall 10 of the housing as the substrate, the structure has fewer substrates or filling materials compared with the existing temperature sensors. The temperature change of the external environment is conducted to the first thermal sensing layer 40 through the housing and the first insulating layer 30, the conduction path is shortened, thereby shortening the response time of the first thermal sensing layer 40 and realizing rapid temperature measurement.

[0075] ② The temperature sensor does not require additional substrate or filling material, which simplifies the structure and allows for further reduction in the size of the temperature sensor. Furthermore, the first insulating layer 30 and the first thermal sensing layer 40 are directly manufactured on the inner surface of the bottom wall 10, which simplifies the manufacturing process, reduces material consumption, and thus reduces manufacturing costs.

[0076] Further optimization of temperature sensors: Existing temperature sensors mainly achieve self-testing in two ways. The first method uses specialized instruments for self-testing. This method requires specialized equipment and must be performed after the temperature sensor has stopped working, making it cumbersome and unable to self-test a temperature sensor in operation. The second method uses multiple temperature sensing elements to simultaneously measure the same environment, comparing the temperature values ​​detected by multiple elements for self-testing. While this method can self-test a temperature sensor in operation, the multiple sensing elements are set up in the same way, meaning they are subjected to the same conditions for measurement. When the temperature sensing part (the part that conducts temperature to the heat-sensing layer) is covered by an obstacle, the fluid being measured cannot directly contact the sensing part. However, multiple sensing elements can still obtain consistent temperatures under the same measurement conditions, failing to detect faults caused by the external environment. In other words, this self-testing method can only achieve... The temperature sensor can only self-check internal faults, not external faults. To address this issue, an inner shell, a second insulating layer 80, and a second thermal sensing layer 90 are added. The inner shell is located within the receiving space 110 and is spaced apart from the first thermal sensing layer 40. The inner shell has a connecting pipe 130 that penetrates the peripheral wall 20 of the shell, connecting the liquid space 120 enclosed by the inner shell to the external environment, allowing the fluid to be measured in the external environment to flow into the liquid space 120 through the connecting pipe 130. One of the largest surfaces of the second insulating layer 80 is in contact with the outer surface of the inner shell, and the other largest surface is in contact with one of the largest surfaces of the second thermal sensing layer 90. The second thermal sensing layer 90 is spaced apart from the peripheral wall 20. The characteristics of the second insulating layer 80 are the same as those of the first insulating layer 30, and the characteristics of the second thermal sensing layer 90 are the same as those of the first thermal sensing layer 40. It should be noted that the second thermal sensing layer 90 is used to sense the temperature change of the fluid to be measured in the liquid space 120. The fluid to be measured from the external environment is guided into the liquid storage space 120 through the connecting pipe 130, and then its temperature is measured by the second thermal sensing layer 90. Since the temperature sensing part corresponding to the second thermal sensing layer 90 is located in the housing space 110, as long as the obstacle does not completely isolate the temperature sensor from the external environment, the fluid to be measured can flow into the liquid storage space 120 and be measured by the second thermal sensing layer 90. Then, a self-check is performed by comparing the temperatures detected by the first thermal sensing layer 40 and the second thermal sensing layer 90: if the difference between the two is small, it can be determined that the detection failure is caused by the external environment; if the difference between the two is large, it can be determined that the hardware failure is present. That is, the self-check of internal and external failures is realized.It should be noted that there can be multiple connecting pipes 130. The connection positions of multiple connecting pipes 130 to the outer wall of the shell can be set relatively far apart, that is, the connection positions should be far apart, so as to ensure that the fluid to be measured can still flow into the liquid space 120 when a certain part of the shell is covered by an obstacle. The connecting pipes 130 can be set at an angle to facilitate the inflow and outflow of the fluid to be measured. The connecting pipes 130 can be equipped with filter components to prevent foreign objects from entering and causing blockage.

[0077] For example: Figure 2 As shown, the bottom wall 10 of the shell is a circular plate structure; the peripheral wall 20 of the shell is a cylindrical structure; the diameter of the circular plate structure is equal to the inner diameter of the cylindrical structure; the inner shell includes a first partition 50, a second partition 60, and an annular plate 70, wherein the first partition 50 and the second partition 60 are the same circular plate structure as the bottom wall 10, and the annular plate 70 is a circular ring plate 70; the first partition 50, the second partition 60, and the bottom wall 10 of the shell are spaced parallel to each other, the first partition 50 is close to the bottom wall 10, that is, the first partition 50 is located between the second partition 60 and the bottom wall 10, and the circumferential surfaces of the first partition 50 and the second partition 60 are in contact with the inner circumferential surface of the peripheral wall 20; the second insulating layer 80 is in contact with the surface of the first partition 50 near the bottom wall 10, that is, the upper surface of the second insulating layer 80 is in contact with the lower surface of the first partition 50; the annular plate 70 is connected to the second partition 60 and the second partition 60 to form a liquid-containing space 120, that is, the annular plate 70 is a circular plate. The upper annular surface of the 0 is connected to the lower surface edge of the second partition 60, and the lower annular surface of the ring plate 70 is connected to the upper surface edge of the first partition 50, forming a cylindrical liquid-containing space 120. The penetrating tube 100 vertically penetrates the second thermal sensing layer 90, the second insulating layer 80, the first partition 50 and the second partition 60, and passes through the liquid-containing space 120. The axis of the cylindrical penetrating tube 100 is collinear with the axis of the peripheral wall 20. The first partition 50 and the second insulating layer 80 are both made of high thermal conductivity material. The heat of the fluid in the solution space 120 can be conducted to the second thermal sensing layer 90 through the first partition 50 and the second insulating layer 80. The outer diameter of the penetrating tube 100 is smaller than the inner diameter of the liquid-containing space 120. That is, the liquid-containing space 120 can accommodate the fluid to be measured in a cylindrical shape. The cylindrical space enclosed by the penetrating tube 100 is used for the lead wires of the first thermal sensing layer 40 and the second thermal sensing layer 90 to pass through. To further optimize the system and reduce heat loss from the fluid being measured entering the liquid space 120, a heat insulation layer is added to the temperature sensor. The heat insulation layer can cover the outer surface of the inner shell, or it can be embedded in the first partition 50, the second partition 60, and the annular plate 70. That is, the first partition 50, the second partition 60, and the annular plate 70 are all configured as a sandwich structure. By setting the heat insulation layer, heat loss from the fluid being measured in the liquid space 120 is reduced, and at the same time, the influence of the external environment on the fluid being measured in the liquid space 120 is reduced.

[0078] Optimization of the bottom wall 10 of the housing: N square grooves are formed on the inner surface of the bottom wall 10, where N is an integer greater than or equal to 1; the side surfaces of the square grooves are perpendicular to the bottom wall 10, that is, the depth direction of the square grooves is parallel to the thickness direction of the bottom wall 10; the first insulating layer 30 covers the port surface, side surface, and bottom surface of the square grooves, where the port surface of the square grooves is the area of ​​the inner surface of the bottom wall 10 excluding the square grooves. By forming square grooves on the bottom wall 10, the adhesion area of ​​the first insulating layer 30 can be increased, thereby improving adhesion. At the same time, the temperature sensing part of the first thermal sensing layer 40 can be placed in the grooves, further shortening the temperature conduction path and thus further shortening the response time of the first thermal sensing layer 40. In addition, after forming square grooves, the material required for the bottom wall 10 is reduced, thereby reducing manufacturing costs.

[0079] Further optimization: When N>1, N square grooves are evenly arranged on the inner surface of the bottom wall 10, that is, multiple square grooves are evenly opened on the inner surface of the bottom wall 10. This not only facilitates the grooving process of the bottom wall 10, but also allows the bottom wall 10 to have better structural stability. In addition, it is easier to prepare the first insulating layer 30 and the first thermally sensitive layer 40.

[0080] The maximum thickness of the bottom wall 10 is equal to the thickness of the peripheral wall 20, that is, the wall thickness of the bottom wall 10 before the square groove is opened is the same as the wall thickness of the peripheral wall 20.

[0081] Optimization of the housing: The bottom wall 10 and the peripheral wall 20 are detachably connected.

[0082] For example: Figure 3 As shown, the bottom wall 10 is a circular plate structure; the peripheral wall 20 is a cylindrical structure; the diameter of the circular plate structure is equal to the inner diameter of the cylindrical structure; a circular surface of the circular plate structure has multiple square grooves, the ends of which are rectangular, with the long side of the rectangle parallel to the first center line of the circular surface; the multiple square grooves are arranged at equal intervals along the second center line of the circular surface, and the first and second center lines are perpendicular to each other; the circumferential surface of the circular plate structure has external threads; the inner circumferential surface of the cylindrical structure near the ends has internal threads that match the external threads. Furthermore, for ease of processing, the square grooves can be configured as through grooves, meaning the square grooves penetrate the circumferential surface of the bottom wall 10.

[0083] Preferred material for the casing: The casing is made of metal, such as stainless steel.

[0084] The preferred material for the first insulating layer 30 is aluminum nitride. Aluminum nitride (AlN) is a covalent crystal with the chemical formula AlN. It belongs to the diamond-like nitride system, has a hexagonal crystal structure, and a wurtzite-type crystal structure. It is non-toxic and white or grayish-white in color. It has high thermal conductivity, which facilitates rapid temperature conduction and can further shorten the response time of the first thermally sensitive layer 40.

[0085] Example 2

[0086] Please see Figure 1-4 The temperature sensor manufacturing process provided in this embodiment of the invention includes:

[0087] S1: Obtain the shell;

[0088] In this step, the processed housing is sent to the first insulating layer 30 preparation station and fixed.

[0089] S2: A first insulating layer 30 is prepared on the inner surface of the bottom wall 10 of the housing using a thin film deposition method;

[0090] There are many thin film deposition methods, including Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), solution deposition, lithography, spraying, ion beam deposition (IBD), and atomic layer deposition (ALD). Physical Vapor Deposition (PVD): Uses high-energy particles or thermal energy to convert solid materials into gaseous substances, which are then deposited onto a substrate to form a thin film. Chemical Vapor Deposition (CVD): Uses chemical reactions to deposit gaseous precursors onto a substrate to form a thin film. Solution deposition: Disperses materials in a solution and controls reaction conditions (such as temperature and concentration) to deposit the materials onto a substrate to form a thin film. Lithography: Uses methods such as photolithography and electron beam etching to deposit materials onto a substrate to form patterned thin films. Spraying: Uses a sprayer to spray solutions, suspensions, or aerosols onto a substrate to form a thin film. Ion beam deposition (IBD): Uses an ion beam to bombard solid materials, causing them to become gaseous substances, which are then deposited onto a substrate to form a thin film. In this step, a suitable thin film deposition method is selected according to the material properties of the first insulating layer 30 to form a uniform thin film composed of insulating material on the inner surface of the bottom wall 10, thereby completing the preparation of the first insulating layer 30.

[0091] S3: A first thermally sensitive layer 40 is prepared on the largest surface of the first insulating layer 30 away from the bottom wall 10 using a thin film deposition method.

[0092] In this step, at least two thermocouples are formed on the largest surface of the first insulating layer 30 away from the bottom wall 10, according to the material properties of the first thermal layer 40, to form a hot junction and a cold junction.

[0093] Optimized: This includes the section between S1 and S2, and also includes:

[0094] S11: A square groove is formed on the inner surface of the bottom wall 10;

[0095] Specifically, a square groove is made on the inner surface of the bottom wall 10 by milling.

[0096] S12: Grind the port face, side surface and bottom surface of the square groove.

[0097] Specifically, the port surface, side surface, and bottom surface of the square groove are successively ground with sandpaper of 400-500 grit, 1000-1200 grit, and 2000-2200 grit to improve the flatness and surface activity of the adhesion surface of the first insulating layer 30, thereby improving the adhesion of the first insulating layer 30, ensuring a good bond between the first insulating layer 30 and the bottom wall 10, and improving the quality and stability of the first insulating layer 30.

[0098] In addition, the first partition 50, the second partition 60, the annular plate 70, the second insulating layer 80, the second insulating layer 90, the through pipe 100, and the connecting pipe 130 are manufactured as a whole and then assembled into the receiving space by means of threaded connection or welding.

[0099] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, other working processes of the method described above can be referred to the corresponding processes in the foregoing embodiments, and will not be repeated here.

[0100] In the several embodiments provided in this application, it should be understood that the disclosed methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0101] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0102] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0103] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0104] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A temperature sensor, characterized in that, include: The housing, the first insulating layer, and the first thermally sensitive layer; The shell includes a bottom wall and a peripheral wall, and the peripheral wall surrounds the bottom wall to form an accommodating space. The first insulating layer and the first thermally sensitive layer are disposed within the accommodating space; One of the largest surfaces of the first insulating layer is attached to the inner surface of the bottom wall, and the other largest surface is attached to one of the largest surfaces of the first thermally sensitive layer; Also includes: Inner shell, second insulating layer, and second thermal sensing layer; The inner shell is disposed within the accommodating space and is spaced apart from the first thermally sensitive layer; The inner shell is provided with a connecting pipe; The connecting pipe penetrates the peripheral wall and connects the liquid space enclosed by the inner shell with the external environment; One of the largest surfaces of the second insulating layer is attached to the outer surface of the inner housing, and the other largest surface is attached to one of the largest surfaces of the second thermally sensitive layer; The second thermal layer is spaced apart from the peripheral wall.

2. A temperature sensor according to claim 1, characterized in that, Also includes: Penetrating tube; The inner shell also includes a first partition, a second partition, and an annular plate; The first partition, the second partition, and the bottom wall are spaced parallel to each other, with the first partition close to the bottom wall; The second insulating layer is attached to the surface of the first partition near the bottom wall; The annular plate is connected to the first partition and the second partition to form the liquid-containing space; The through-tube penetrates vertically through the second thermal layer, the second insulating layer, the first partition and the second partition, and passes through the liquid-containing space.

3. A temperature sensor according to claim 2, characterized in that, Also includes: Insulation layer; The heat insulation layer covers the outer surface of the inner shell or is embedded in the first partition, the second partition, and the annular plate.

4. A temperature sensor according to claim 1, characterized in that: The inner surface of the bottom wall is provided with N square grooves, where N is an integer greater than or equal to 1; The side surface of the square groove is perpendicular to the bottom wall; The first insulating layer covers the port surface, side surface, and bottom surface of the square groove.

5. A temperature sensor according to claim 4, characterized in that: When N > 1, the N square grooves are evenly distributed on the inner surface of the bottom wall.

6. A temperature sensor according to any one of claims 1 to 5, characterized in that: The bottom wall and the peripheral wall are detachably connected.

7. A temperature sensor according to claim 6, characterized in that: The bottom wall is a circular plate structure; The peripheral wall has a cylindrical structure; The diameter of the circular plate structure is equal to the inner diameter of the cylindrical structure; The circular plate structure has external threads on its circumferential surface. The inner circumferential surface of the cylindrical structure near the port is provided with an internal thread that matches the external thread.

8. A temperature sensor fabrication process for fabricating the temperature sensor as described in any one of claims 1 to 7, characterized in that, include: S1: Obtain the shell; S2: A first insulating layer is prepared on the inner surface of the bottom wall of the housing using a thin film deposition method; S3: A first thermally sensitive layer is prepared on the surface of the first insulating layer furthest from the bottom wall using a thin film deposition method.

9. The temperature sensor manufacturing process according to claim 8, characterized in that... The content following S1 and preceding S2 includes: S11: A square groove is formed on the inner surface of the bottom wall; S12: Grind the port surface, side surface and bottom surface of the square groove.

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