Chip mounting head, chip mounting machine and chip mounting process

Abstract

The present invention discloses a patch head, a patch machine and a patch process, comprising a heating base, a bonding head, a bonding head base and a connecting base, wherein the heating base is arranged horizontally, one end of the heating base is connected to the connecting base, the connecting base is located on one side of the heating base and is extended, and the other side is fixed to one side of the bonding head base, the bonding head base is installed with the bonding head, and the bonding head is installed on the side of the bonding head base close to the heating base; wherein the bonding head is rotatably mounted on the bonding head base, the heating base is provided with a mounting hole, a heating bearing is installed in the heating base mounting hole, the bonding head is cooperatively connected with the inner ring of the heating bearing, a heating unit and a temperature measuring unit are provided in the heating base, and one end of the bonding head away from the bonding head base extends out of the heating bearing, and this end of the bonding head is used to fix the heated workpiece. The patch head of the present invention can achieve 360-degree rotation, thereby meeting the needs of patches at different angles, and the wires of the heating unit and the temperature measuring unit will not become a factor affecting the rotation of the patch head.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip placement equipment, and in particular relates to a chip placement head, a chip placement machine and a process. Background Art

[0002] SMT, short for Surface Mounted Technology, is the most popular technology and process in the electronics assembly industry. It involves placing leadless or short-lead surface mount components (SMC / SMD, also known as chip components) onto the surface of a heated printed circuit board (PCB) or other substrate using a placement machine, and then soldering them together through methods such as reflow soldering or dip soldering.

[0003] Automatic placement machines are used to achieve high-speed, high-precision, and fully automatic placement of components. They are the most critical and complex equipment in the entire SMT production line. The placement machine is the main equipment in the SMT production line.

[0004] In the prior art, most chips require the bonding head to be heated to a certain temperature before bonding. At this time, some heating mechanisms need to be added to the bonding head. The usual practice is to place a heating rod and a thermocouple, or other forms of heating elements, in the workpiece of the bonding head to achieve heating of the bonding head. However, this heating structure requires a section of wire at the tail of the heating rod and the thermocouple for heating and signal transmission. Due to the requirements of the patch, the patch head needs to be able to rotate 360 ​​degrees to meet the needs of patches at different angles. At this time, the wires of the heating rod and the thermocouple will become a factor affecting the rotation. If the wire is reserved very long, it will take up a lot of space. If the wire is reserved too short, it will affect the rotation angle. However, in either case, the resistance to the rotation of the patch head will increase. At the same time, the way the wire is set also makes the patch head structure not very compact.

[0005] Application No. 202022575007.X discloses a heating nozzle and a chip placement machine, wherein the heating nozzle includes an outer frame, a heating element, and a thermal head. The outer frame is provided with a housing for accommodating the heating element. The heating element is installed in the housing. The thermal head is connected to the outer frame. One end of the thermal head extends into the housing and contacts the heating element, while the other end of the thermal head is located outside the housing. The heat from the heating element is transferred from one end of the thermal head to the other end of the thermal head, thereby heating the chip through the thermal head. The heating area is reduced, the temperature is more controllable, and the heating nozzle has a compact structure and a small heating volume. It can quickly heat up and cool down, thereby improving production efficiency.

[0006] Its disadvantages are that the structure of the heating nozzle is not compact enough, and the heat conducting head or heating element needs to be replaced when heating chips of different sizes. The operation process is complicated and the structure is relatively complex. Therefore, there is an urgent need for a chip placement machine that can meet current production needs. Summary of the Invention

[0007] The structure of the heating nozzle of the existing placement machine is not compact enough, and the thermal head or heating element needs to be replaced when heating chips of different sizes. The operation process is complicated and the structure is relatively complex. Therefore, there is an urgent need for a placement machine that can meet existing production needs.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0009] A patch head, comprising a heating base, a bonding head, a bonding head base, and a connecting base, wherein the heating base is arranged horizontally, one end of the heating base is connected to the connecting base, the connecting base is located on one side of the heating base and is extended, and the other side of the connecting base is fixed to one side of the bonding head base, the bonding head is installed on the bonding head base, and the bonding head is installed on the side of the bonding head base close to the heating base;

[0010] Among them, the bonding head is rotatably installed on the bonding head base, the heating seat is provided with a mounting hole, a heating bearing is installed in the mounting hole of the heating seat, the bonding head is cooperatively connected with the inner ring of the heating bearing, a heating unit and a temperature measuring unit are provided in the heating seat, and one end of the bonding head away from the bonding head base extends out of the heating bearing, and this end of the bonding head is used to fix the heated workpiece.

[0011] Furthermore, the heating unit is a heating rod, and the temperature measuring unit is a thermocouple or a thermal resistor.

[0012] Furthermore, there are two heating rods, which are respectively arranged on both sides of the heating bearing. The two heating rods are arranged parallel to each other, and each heating rod is correspondingly provided with a thermocouple or thermal resistor.

[0013] Furthermore, the heating unit is provided with a plurality of temperature-adjustable gears.

[0014] Furthermore, the laminating head is coaxially connected to an output shaft of a rotary motor, and the rotary motor is used to drive the laminating head to rotate.

[0015] Furthermore, the connecting seat is a plate-shaped structure, and the connecting seat and the heating seat are arranged vertically.

[0016] The present invention also seeks protection for a chip placement machine, which is equipped with any one of the above-mentioned chip placement heads, and the bonding head fixes the heated workpiece by vacuum adsorption.

[0017] The present invention also claims protection for a patch process comprising the following steps:

[0018] Step 1: Clean the heated workpiece, clean the surface of the heated workpiece, and remove dust from the surface of the heated workpiece;

[0019] Step 2: Fix the heated workpiece by adsorbing and fixing it on the end of the bonding head;

[0020] Step 3: Place components on the heated workpiece using a placement machine;

[0021] Step 4: Soldering and fixing, soldering and fixing the components;

[0022] Step 5: Detection of the heated workpiece: Perform circuit detection on the heated workpiece after welding.

[0023] Compared with the prior art, the beneficial effects of this solution are:

[0024] 1. The present invention provides a patch head, including a heating seat, a bonding head, a bonding head base and a connecting seat. The heating seat is horizontally arranged, and the bonding head is rotatably installed on the bonding head base. The heating seat is provided with a mounting hole, and a heating bearing is installed in the mounting hole of the heating seat. The bonding head is cooperatively connected with the inner ring of the heating bearing. A heating unit and a temperature measuring unit are arranged in the heating seat. One end of the bonding head away from the bonding head base extends out of the heating bearing. The patch head of the present invention can achieve 360-degree rotation to meet the needs of patches at different angles. Relative to the way of setting the wires, the heating unit and the temperature measuring unit of the present invention are installed in the heating seat and are fixed relative to the overall placement machine. Therefore, the wires of the heating unit and the temperature measuring unit will not become a factor affecting the rotation of the patch head.

[0025] 2. Under certain specific conditions, the present invention is provided with a heating unit and a temperature measuring unit in the heating seat, and one end of the bonding head away from the bonding head base extends out of the heating bearing, and the heated workpiece fixed at this end of the bonding head is heated by heat conduction, so that the bonding head structure is simplified. The wires of the heating unit and the temperature measuring unit of the present invention will not become factors affecting the rotation of the bonding head, so the bonding head rotates more smoothly. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A structural diagram of the present invention;

[0027] Figure 2 Another structural diagram of the present invention;

[0028] Figure 3 This is another structural diagram of the present invention;

[0029] Figure 4 This is the main view of the present invention;

[0030] Figure 5 It is a side view of the present invention.

[0031] The reference numerals are as follows: heating seat 1, mounting hole 11, heating bearing 12, heating rod 13, thermocouple 14, bonding head 2, rotating motor 21, bonding head base 3, connecting seat 4, adsorption component 5. DETAILED DESCRIPTION

[0032] The present invention will be described in further detail below with reference to the accompanying drawings.

[0033] A patch header, such as Figure 1-Figure 3 As shown, it includes a heating seat 1, a laminating head 2, a laminating head base 3 and a connecting seat 4. The heating seat 1 is arranged horizontally, and one end of the heating seat 1 is connected to the connecting seat 4. The connecting seat 4 is located on one side of the heating seat 1 and is extended, and the other side is fixed to one side of the laminating head base 3. The laminating head 2 is installed on the laminating head base 3, and the laminating head 2 is installed on the side of the laminating head base 3 close to the heating seat 1.

[0034] Among them, the laminating head 2 is rotatably mounted on the laminating head base 3, the heating seat 1 is provided with a mounting hole 11, a heating bearing 12 is installed in the mounting hole 11 of the heating seat 1, the laminating head 2 is cooperated with the inner ring of the heating bearing 12, a heating unit and a temperature measuring unit are provided in the heating seat 1, and one end of the laminating head 2 away from the laminating head base 3 extends out of the heating bearing 12, and this end of the laminating head 2 is used to fix the heated workpiece.

[0035] According to a specific embodiment provided by the present invention, the heating seat 1 is arranged horizontally, the connecting seat 4 can be vertically fixed and welded to the upper part of one side of the heating seat 1, the bonding head base 3 is located on one side of the connecting seat 4 and is fixed, and the bonding head 2 is rotatably installed on the bonding head base 3, so that the heated workpiece can be heated on the inner ring of the heating bearing 12. The heat conduction method is contact heat conduction. The heating bearing 12 is a high-temperature bearing. The bonding head 2 is tightly fitted with the inner ring of the high-temperature bearing, and the heating seat 1 is tightly fitted with the outer ring of the high-temperature bearing.

[0036] Through the arrangement of the above structure, the present invention is provided with a heating unit and a temperature measuring unit in the heating seat 1, and one end of the bonding head 2 away from the bonding head base 3 extends to the outside of the heating bearing 12, and the heated workpiece fixed at this end of the bonding head 2 is heated by heat conduction. The patch head of the present invention can achieve 360-degree rotation, thereby meeting the needs of patches at different angles. Relative to the way of setting the wires, the heating unit and the temperature measuring unit of the present invention are installed in the heating seat 1 and are fixed relative to the overall placement machine. Therefore, the wires of the heating unit and the temperature measuring unit will not become a factor affecting the rotation of the patch head.

[0037] Furthermore, the heating unit is a heating rod 13, and the temperature measuring unit is a thermocouple 14 or a thermal resistor. In the embodiment of the present invention, the heating rod 13 plays a heating role, while the thermocouple 14 and the thermal resistor play a temperature measuring role.

[0038] like Figure 4 and Figure 5 As shown, the heating rod 13 of the present invention is mounted within the heating base 1. When the rotating motor 21 adjusts the angle of the laminating head 2, only the laminating head 2 and the inner ring of the heating bearing 12 move. The heating base 1, the heating rod 13 affixed therein, and the thermocouple 14 do not rotate. Simultaneously, the heat from the heating base 1 is transferred to the laminating head 2 via the heating bearing 12, enabling the laminating head 2 to heat the workpiece.

[0039] Furthermore, in order to make the effect of the heating seat 1 more uniform, there are two heating rods 13 and they are respectively arranged on both sides of the heating bearing 12. The two heating rods 13 are arranged parallel to each other, and each heating rod 13 is correspondingly provided with a thermocouple 14 or a thermal resistor.

[0040] Furthermore, the heating unit is provided with a plurality of temperature-adjustable gears.

[0041] In the prior art, when heating chips of different sizes is required, the heat conducting head or heating element needs to be replaced, and the operation process is complicated and the structure is relatively complicated.

[0042] The heating unit of the present invention is provided with a plurality of temperature-adjustable gears, and the appropriate heating temperature is adjusted according to the heating requirements of the heated workpiece. There is no need to replace the thermal head or the heating element, so the patch head structure design is very compact.

[0043] Furthermore, in order to heat the heated workpiece evenly and efficiently, the laminating head 2 is coaxially connected to the output shaft of the rotary motor 21, and the rotary motor 21 is used to drive the laminating head 2 to rotate.

[0044] Furthermore, the connecting seat 4 is a plate-shaped structure, and the connecting seat 4 and the heating seat 1 are arranged perpendicularly.

[0045] In addition, the present invention also requests protection for a chip placement machine, which is equipped with any one of the above-mentioned chip placement heads, and the bonding head fixes the heated workpiece by vacuum adsorption. Specifically, a cavity is opened inside the bonding head, and an adsorption component 5 is provided at the end of the bonding head, and the adsorption component 5 has an adsorption hole, thereby fixing the heated workpiece.

[0046] In addition, the present invention also claims protection for a patch process comprising the following steps:

[0047] Step 1: Clean the heated workpiece, clean the surface of the heated workpiece, and remove dust from the surface of the heated workpiece;

[0048] Step 2: Fix the heated workpiece by adsorbing and fixing the heated workpiece on the end of the bonding head 2;

[0049] Step 3: Place components on the heated workpiece using a placement machine;

[0050] Step 4: Soldering and fixing, soldering and fixing the components;

[0051] Step 5: Detection of the heated workpiece: Perform circuit detection on the heated workpiece after welding.

[0052] The placement process of the placement machine of the present invention is as follows: the bonding head first absorbs components from the material tray, turns on the heating switch, adjusts the heating unit to an appropriate temperature level according to the heating requirements, and then moves the suction nozzle mechanism to a suitable position on the surface of the heated workpiece, presses the components down to the surface of the heated workpiece, and then moves the bonding head to the material tray to re-absorb the components, and repeats this cycle until all components are placed.

[0053] Finally, it should be noted that in the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limiting the present invention.

[0054] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0055] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A patch head, characterized by: It includes a heating base, a laminating head, a laminating head base and a connecting base. The heating base is arranged horizontally, one end of the heating base is connected to the connecting base, the connecting base is located on one side of the heating base and is extended, and the other side is fixed to one side of the laminating head base. The laminating head is installed on the laminating head base, and the laminating head is installed on the side of the laminating head base close to the heating base. The laminating head is rotatably mounted on the laminating head base, the heating seat is provided with a mounting hole, a heating bearing is mounted in the mounting hole of the heating seat, the laminating head is cooperatively connected with the inner ring of the heating bearing, a heating unit and a temperature measuring unit are provided in the heating seat, and one end of the laminating head away from the laminating head base extends out of the heating bearing, and this end of the laminating head is used to fix the heated workpiece; The heating bearing is a high-temperature bearing, the outer ring of the heating bearing is tightly fitted with the heating seat, and the inner ring of the heating bearing is tightly fitted with the fitting head; The conductive wires of the heating unit and the temperature measuring unit are fixed in the heating seat and do not rotate with the bonding head.

2. A patch head according to claim 1, characterized in that: The heating unit is a heating rod, and the temperature measuring unit is a thermocouple or a thermal resistor.

3. A patch head according to claim 2, characterized in that: There are two heating rods, which are respectively arranged on both sides of the heating bearing. The two heating rods are arranged parallel to each other, and each heating rod is correspondingly provided with a thermocouple or thermal resistor.

4. A patch head according to claim 3, characterized in that: The heating unit is provided with a plurality of gears for adjusting the temperature.

5. A patch head according to any one of claims 1 to 4, characterized in that: The laminating head is coaxially connected to the output shaft of the rotary motor, and the rotary motor is used to drive the laminating head to rotate.

6. A patch head according to claim 5, characterized in that: The connecting seat is a plate-shaped structure, and the connecting seat and the heating seat are arranged vertically.

7. A chip mounter, characterized in that: The placement machine is equipped with the placement head according to any one of claims 1 to 6, and the placement head fixes the heated workpiece by vacuum adsorption.

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