Laser emission module and laser ranging device

Abstract

The embodiment of the present application discloses a laser emission module and a laser ranging device, wherein the laser emission module comprises an emission substrate, a light-emitting chip, at least one anode driving chip and at least one cathode driving chip; the light-emitting chip is mounted on the first board surface of the emission substrate, and a laser array is integrated therein, and the laser array comprises m*n lasers; in the laser array, the anodes of the lasers located in the same row are electrically connected and lead to a common anode terminal, and the cathodes of the lasers located in the same column are electrically connected and lead to a common cathode terminal; the anode driving chip is mounted on the emission substrate, and m anode driving circuits are integrated therein; the m anode driving circuits are electrically connected to the m common anode terminals one by one respectively; the cathode driving chip is mounted on the emission substrate, and n cathode driving circuits are integrated therein; the n cathode driving circuits are electrically connected to the n common cathode terminals one by one; the embodiment of the present application can reduce the size of the laser emission module.

Description

Technical Field

[0001] The present application relates to the technical field of laser ranging technology, and in particular to a laser emission module and a laser ranging device. Background Art

[0002] A laser ranging device is a radar system that uses laser to detect characteristic quantities such as the position and speed of a target object. Its working principle is to first emit an outgoing laser for detection to the target, then receive the echo laser reflected from the target object, and then perform signal processing on the received echo laser to obtain relevant information of the target object, such as distance, direction, altitude, speed, attitude, and even shape and other parameters.

[0003] In the related art, the laser distance measuring device usually uses a laser emitting circuit 100 to emit an outgoing laser. Figure 1 As shown, the laser emission circuit 100 includes a laser 210 and an emission drive circuit 220. The laser 210 is used to emit an emission laser, and the emission drive circuit 220 is electrically connected to the laser 210 to drive the laser 210 to emit an emission laser. At present, the laser emission circuit 100 usually adopts the method of assembling the various discrete electronic components included in the emission drive circuit 220 on a circuit board, and then completing the electrical connection between the various discrete electronic components by the circuit board to complete the assembly of the laser emission circuit 100. However, the use of discrete electronic components to assemble the laser emission circuit 100 will result in a larger size of the circuit board used to assemble the laser emission circuit 100, and then the assembly size of the laser emission circuit 100 will be larger, which is not conducive to the miniaturization design of the laser ranging device.

[0004] How to reduce the assembly size of the laser emitting circuit 100 has become a problem that those skilled in the art need to solve. Summary of the invention

[0005] The embodiments of the present application provide a laser emission module and a laser ranging device, which reduce the size of the laser emission module.

[0006] In a first aspect, an embodiment of the present application provides a laser emission module, the laser emission module comprising:

[0007] The emitting substrate comprises a first panel surface;

[0008] A light-emitting chip, mounted on the first panel, with a laser array integrated therein; the laser array includes m*n lasers, m and n are respectively the number of rows and columns of the lasers included in the laser array, m and n are both positive integers, and at least one of m and n is greater than 1; in the laser array, the anodes of the lasers located in the same row are electrically connected and lead to a common anode terminal, and the cathodes of the lasers located in the same column are electrically connected and lead to a common cathode terminal;

[0009] At least one anode driving chip is mounted on the emitting substrate and has m anode driving circuits integrated therein; the m anode driving circuits are electrically connected to the m common anode terminals one by one;

[0010] At least one cathode driving chip is mounted on the emitting substrate and has n cathode driving circuits integrated therein; the n cathode driving circuits are electrically connected to the n common cathode terminals in a one-to-one correspondence.

[0011] In a second aspect, an embodiment of the present application provides a laser ranging device, comprising a laser emission module as described in any of the above items.

[0012] The laser emission module 300 provided in the present application can reduce the area occupied by the anode drive circuit 131 and the cathode drive circuit 140 on the emission substrate 350 by performing chip integration processing on the anode drive circuit 131 and the cathode drive circuit 140, and assembling the anode drive chip 330 and the cathode drive chip 340 obtained after the chip integration processing on the emission substrate 350. Furthermore, by reducing the area of ​​the emission substrate 350, the size of the laser emission module 300 can be reduced, which is convenient for the miniaturized design of the laser ranging device. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0014] Figure 1 It is a structural schematic diagram of a laser emission circuit in the related art;

[0015] Figure 2 is a circuit structure block diagram of a laser emission module in Embodiment 1 of the present application;

[0016] Figure 3 1 is a schematic diagram of a top view of the structure of the laser emission module in the first embodiment of the present application (the packaging protection cover and the light-transmitting cover plate are not shown);

[0017] Figure 4 yes Figure 3 A schematic diagram of a cross-sectional structure of a laser emission module in the AA direction;

[0018] Figure 5 yes Figure 3 A schematic diagram of a cross-sectional structure of a laser emission module in the BB direction;

[0019] Figure 6 1 is another schematic diagram of a top view structure of a laser emission module in the first embodiment of the present application (the packaging protection cover and the light-transmitting cover plate are not shown);

[0020] Figure 7 yes Figure 5 A schematic diagram of a cross-sectional structure of a laser emission module in the AA direction;

[0021] Figure 8 yes Figure 5 A schematic diagram of a cross-sectional structure of a laser emission module in the BB direction;

[0022] Fig. 9 1 is a schematic diagram of a top view of a laser emission module in the first embodiment of the present application (the packaging protection cover and the light-transmitting cover plate are not shown);

[0023] Fig.10 yes Fig. 9 A schematic diagram of a cross-sectional structure of a laser emission module in the AA direction;

[0024] Fig.11 yes Fig. 9 A schematic diagram of a cross-sectional structure of a laser emission module in the BB direction;

[0025] Fig.12 1 is a schematic diagram of a top view of another laser emission module in the first embodiment of the present application (the packaging protection cover and the light-transmitting cover plate are not shown);

[0026] Fig.13 yes Fig.12 A schematic diagram of a cross-sectional structure of a laser emission module in the AA direction;

[0027] Fig.14 yes Fig.12 A schematic diagram of a cross-sectional structure of a laser emission module in the BB direction;

[0028] Fig.15 It is a schematic cross-sectional structure diagram of an emission substrate, a packaging protection cover and a light-transmitting cover plate when the laser emission module adopts LGA packaging in the first embodiment of the present application;

[0029] Fig.16 This is a side structural schematic diagram of the laser emission module when the laser emission module adopts QFN packaging in the first embodiment of the present application;

[0030] Fig.17 This is a circuit diagram of a laser emission module in the first embodiment of the present application;

[0031] Fig.181 is a schematic diagram of a top view structure of a laser emission module in the second embodiment of the present application (the packaging protection cover and the light-transmitting cover plate are not shown);

[0032] Fig.19 yes Fig.18 A schematic diagram of a cross-sectional structure of a laser emission module in the AA direction;

[0033] Fig. 20 yes Fig.18 A schematic diagram of a cross-sectional structure of a laser emission module in the BB direction;

[0034] Fig.21 is a schematic cross-sectional structure diagram of another laser emission module in the AA direction in the second embodiment of the present application;

[0035] Fig. 22 1 is a schematic diagram of a top view of another laser emission module in the second embodiment of the present application (the packaging protection cover and the light-transmitting cover plate are not shown);

[0036] Fig.23 yes Fig. 22 A schematic diagram of a cross-sectional structure of a laser emission module in the AA direction;

[0037] Fig.24 yes Fig. 22 A schematic diagram of a cross-sectional structure of a laser emission module in the BB direction;

[0038] Fig.25 is a schematic cross-sectional structure diagram of another laser emission module in the AA direction in the second embodiment of the present application;

[0039] Fig.26 It is a schematic diagram of the cross-sectional structure of a laser emission module in the AA direction in the third embodiment of the present application;

[0040] Fig. 27 yes Fig.26 A schematic diagram of a cross-sectional structure of a laser emission module in the BB direction;

[0041] Fig.28 It is a schematic cross-sectional structure diagram of another laser emission module in the AA direction in the third embodiment of the present application;

[0042] Fig.29 yes Fig.28 A schematic diagram of the cross-sectional structure of the laser emission module in the BB direction. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application. It should be noted that when an element is referred to as being "assembled on" or "assembled on" or "set on" or "set on" another element, it can be directly on another element or indirectly on the other element through other elements. When an element is referred to as being "connected to" another element or "connected to" another element, it can be directly connected to another element or indirectly connected to the other element through other elements. It should also be noted that the orientation or positional relationship indicated by the terms "row", "column", etc. is based on the orientation or positional relationship shown in the accompanying drawings, which is only a relative concept or a reference to the normal use state of the product. For the convenience of describing the present application and simplifying the description, it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of the features.

[0044] In addition, in the description of the present application, unless otherwise specified, "plurality" refers to two or more than two. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. Unless otherwise defined, all technical and scientific terms used in this document have the same meaning as commonly understood by technicians in the technical field to which this application belongs. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" used in this document includes any and all combinations of one or more related listed items.

[0045] See also Figure 1The related art provides a laser emitting circuit 100, which includes a laser 210 and an emission driving circuit 220. The laser 210 is used to emit an outgoing laser, and the emission driving circuit 220 is electrically connected to the emission driving circuit 220 to drive the laser 210 to emit an outgoing laser. At present, the laser emitting circuit 100 usually adopts the method of assembling the various discrete electronic components included in the emission driving circuit 220 on a circuit board, and then completing the electrical connection between the various discrete electronic components by the circuit board to complete the assembly of the laser emitting circuit 100. However, the use of discrete electronic components to assemble the laser emitting circuit 100 results in a larger size of the circuit board used to assemble the laser emitting circuit 100.

[0046] It is not conducive to the miniaturization design of the laser distance measuring device. How to reduce the assembly size of the laser emitting circuit 100 has become a problem that needs to be solved by those skilled in the art. In order to solve the technical problem that the laser emitting circuit 100 is assembled with discrete electronic components in the related art, resulting in a large assembly size of the laser emitting circuit 100, such as Figure 2 As shown, the present application provides a laser emission module 300, which has a small assembly size and is convenient for miniaturized design of a laser ranging device.

[0047] See also Figures 2 to 14 As shown, the laser emission module 300 includes a light emitting chip 310, an anode driving chip 330, an anode energy storage element 132, a cathode driving chip 340 and an emission substrate 350. The emission substrate 350 includes a first board surface 351. The light emitting chip 310 is mounted on the first board surface 351 of the emission substrate 350, and a laser array LDm*n is integrated inside. The laser array LDm*n includes m*n light-emitting units 111, m is the number of rows of the light-emitting units 111 included in the laser array LDm*n, n is the number of columns of the light-emitting units 111 included in the laser array LDm*n, m and n are both positive integers, and at least one of m and n is greater than 1, that is, the laser array LDm*n is a one-dimensional array or a two-dimensional array; in the laser array LDm*n, the anodes of the lasers 311 located in the same row are electrically connected and lead to a common anode terminal 311a, and m rows of lasers 311 lead to m common anode terminals 311a in total; the cathodes of the lasers 311 located in the same column are electrically connected and lead to a common cathode terminal 311b, and n columns of lasers 311 lead to n common cathode terminals 311b in total.

[0048] like Figures 2 to 14As shown, the anode drive chip 330 is mounted on the emission substrate 350, and m anode drive circuits 131 are integrated inside. One end of the m anode drive circuits 131 is used to receive the current IL, and the other end is electrically connected to one end of the m anode energy storage elements 132 in a one-to-one correspondence. The number of anode energy storage elements 132 is m, and the m anode energy storage elements 132 are mounted on the emission substrate 350. One end of the m anode energy storage elements 132 is electrically connected to the m anode drive circuits 131 in a one-to-one correspondence, and is also electrically connected to the m common anode terminals 311a derived from the laser array LDm*n in a one-to-one correspondence. The other end of the m anode energy storage elements 132 is grounded GND.

[0049] like Figures 2 to 14 As shown, the cathode driving chip 340 is mounted on the emitting substrate 350, and n cathode driving circuits 140 are integrated inside. One end of the n cathode driving circuits 140 is connected to the n common cathode terminals 311b led out of the laser array LDm*n one by one, and the other end of the n cathode driving circuits 140 is grounded GND.

[0050] Further, m anode drive circuits 131 and n cathode drive circuits 140 are combined to form m*n emission drive channels P1*1~P1*n, ..., Pm*1~Pm*n, wherein the emission drive channel Px*y includes the xth anode drive circuit 131 and the yth cathode drive circuit 140, the xth anode drive circuit 131 is the anode drive circuit 131 connected to the xth common anode terminal 311a, the yth cathode drive circuit 140 is the cathode drive circuit 140 connected to the yth common cathode terminal 311b, x and y are both positive integers, and 1≤x≤m, 1≤y≤n (the same below). The m common anode terminals 311a and the n common cathode terminals 311b are combined to form m*n emission driving terminal combinations G1*1~G1*n,…,Gm*1~Gm*n, wherein the emission driving terminal combination Gx*y includes the xth common anode terminal and the yth common cathode terminal, the xth common anode terminal 311a is the common anode terminal 311a led out of the xth row laser 311, and the yth common cathode terminal 311b is the common cathode terminal 311b led out of the yth row laser 311.

[0051] In this embodiment, m*n emission drive channels P1*1~P1*n, ..., Pm*1~Pm*n are started in sequence according to a preset timing to receive the current IL, and use the electric energy stored in the anode energy storage element 132 to apply a forward bias voltage between the common anode terminal 311a and the common cathode terminal 311b included in the m*n emission drive end combinations G1*1~G1*n, ..., Gm*1~Gm*n in sequence, and then apply a forward bias voltage between the anode and cathode of the m*n lasers 311 in sequence, driving the m*n lasers 311 to emit light in sequence according to a preset timing, so that the outgoing lasers emitted by the m*n lasers 311 traverse the detection area in a scanning manner. For example, when the emission drive channel Px*y is started, the emission drive channel Px*y uses the electrical energy stored in the anode energy storage element 132 to apply a forward bias voltage to the laser 311 located at the (x, y) position, that is, the laser 311 in the xth row and yth column, to drive the laser 311 at the (x, y) position to emit light.

[0052] The "preset timing" refers to the start sequence preset by the control part. The m*n emission drive channels P1*1~P1*n, ..., Pm*1~Pm*n drive the m*n lasers 311 to emit laser light in sequence according to the preset timing, which can be to first drive the laser 311 at the (1, 1) position to start and emit light, then drive the laser 311 at the (1, 2) position to start and emit light... until the laser 311 at the (1, n) position is driven to start and emit light, then start to drive the laser 311 at the (2, 1) position to start and emit light, then drive the laser 311 at the (2, 2) position to start and emit light... drive the laser 311 at the (2, n) position to start and emit light... until the laser 311 at the (m, n) position is driven to start and emit light.

[0053] In the embodiment of the present application, the activation of m*n emission drive channels P1*1~P1*n, ..., Pm*1~Pm*n includes two stages: energy conversion stage and energy release stage. The two stages of the emission drive channel activation are introduced below, taking the emission drive channel Px*y as an example.

[0054] Energy conversion stage: the xth anode drive circuit 131 included in the emission drive channel Px*y is turned on in the direction of the current toward the xth anode energy storage element 132, and the xth anode drive circuit 131 charges the xth anode energy storage element 132 using the received current IL; wherein the xth anode energy storage element 132 is the anode energy storage element 132 connected to the xth anode drive circuit 131;

[0055] Energy release stage: After the energy conversion is completed, the yth cathode driving circuit 140 included in the emission driving channel Px*y is turned on in the direction from the xth common cathode terminal 311b to the ground GND, and the xth anode energy storage element 132 uses the stored electric energy to form a forward bias voltage between the xth common anode terminal 311a and the yth common cathode terminal 311b included in the emission driving end combination Gx*y, and the forward bias voltage drives the laser 311 located at the xth row and yth column to emit light.

[0056] The laser emission module 300 provided in the present application can reduce the area occupied by the anode drive circuit 131 and the cathode drive circuit 140 on the emission substrate 350 by performing chip integration processing on the anode drive circuit 131 and the cathode drive circuit 140, and assembling the anode drive chip 330 and the cathode drive chip 340 obtained after the chip integration processing on the emission substrate 350. Furthermore, by reducing the area of ​​the emission substrate 350, the size of the laser emission module 300 can be reduced, which is convenient for the miniaturized design of the laser ranging device.

[0057] Furthermore, compared with the related art that uses m*n discrete lasers 311 to form a laser array LDm*n, the laser emission module 300 provided in the embodiment of the present application integrates the laser array LDm*n through the light-emitting chip 310, which can also reduce the area occupied by the laser array LDm*n on the emission substrate 350, thereby facilitating the reduction of the area of ​​the emission substrate 350, and further reducing the assembly size of the laser emission module 300.

[0058] In a specific implementation, the light emitting chip 310 is a VSCEL (Vertical-Cavity Surface-Emitting Laser) array chip.

[0059] like Figure 3 , 6, 8, and 11, the top surface 411 of the light-emitting chip 310 is provided with m common anode terminal bonding points 411a and n common cathode terminal bonding points 411b, the m common anode terminal bonding points 411a are respectively electrically connected to the m common anode terminals 311a led out of the laser array LDm*n integrated inside the light-emitting chip 310 in a one-to-one correspondence, and the n common cathode terminal bonding points 411b are respectively electrically connected to the n common cathode terminals 411b led out of the laser array LDm*n integrated inside the light-emitting chip 310 in a one-to-one correspondence.

[0060] like Figure 3, 6, 9, and 12, the anode driver chip 330 is a bare chip, and the top surface 431 of the anode driver chip 330 is provided with m anode driver bonding points 331a; the m anode driver bonding points 331a are electrically connected one-to-one with the m anode driver circuits 131 integrated inside the anode driver chip 330. The m anode energy storage elements 132 are bonded to the m anode driver bonding points 331a through m first bonding wires 151 to achieve one-to-one electrical connection with the m anode driver circuits 131. The m anode energy storage elements 132 are also bonded to the m common anode terminal bonding points 411a through m second bonding wires 152 to achieve one-to-one electrical connection with the m common anode terminals 311a. Among them, the "bare chip" is the product form after the semiconductor components are manufactured and before packaging. "Bond wire" is a thin metal wire that uses heat, pressure, and ultrasonic energy to tightly weld to the pad to achieve electrical interconnection between the chip and the substrate and information exchange between chips.

[0061] like Figure 3 , 6, 9, and 12, the cathode driver chip 340 is a bare chip, and the top surface 441 of the cathode driver chip 340 is provided with n cathode driver bonding points 341a; the n cathode driver bonding points 341a are electrically connected to one end of the n cathode driver circuits 140 integrated inside the cathode driver chip 340, and are bonded to the n common cathode terminal bonding points 411b through n third bonding wires 153, so as to realize a one-to-one electrical connection between the n cathode driver circuits 140 and the n common cathode terminals 411b.

[0062] Furthermore, the surface 331 of the anode driver chip 330 is also provided with a charging bonding point (not shown), which is electrically connected to the other end of the m anode driver circuits 131 integrated inside the anode driver chip 330 for receiving the current IL. The surface 341 of the cathode driver chip 340 is also provided with a grounding bonding point (not shown), which is electrically connected to the other end of the n cathode driver circuits 140 integrated inside the cathode driver chip 340 for grounding GND.

[0063] Compared with the related art, when discrete electronic components are used to assemble the anode drive circuit 131 and the cathode drive circuit 140 on the circuit board, each discrete electronic component needs to be first bound to the solder joints on the circuit board, and then electrically connected through the solder joints on the circuit board, resulting in more solder joints on the circuit board and a larger area of ​​the circuit board. The laser emission module 300 provided in the embodiment of the present application reduces the solder joints on the emission substrate 350 by performing chip integration processing on the anode drive circuit 131 and the cathode drive circuit 140, and then electrically connecting them with other electronic components through bonding wires, thereby further reducing the area of ​​the emission substrate 350, thereby further reducing the assembly size of the laser emission module 300.

[0064] At the same time, the laser emission module 300 provided in the present application uses bonding wires to directly connect the anode driving chip 330 and the anode energy storage element 132, and between the anode energy storage element 132 and the light-emitting chip 310, so as to shorten the line length from the anode driving circuit 131 to the anode energy storage element 132 and from the anode energy storage element 132 to the common anode terminal 311a, reduce the link impedance, and further reduce the energy loss on the line, thereby improving the light-emitting power and light-emitting efficiency.

[0065] like Figures 3 to 14 As shown, in the implementation provided by this embodiment, the anode drive chip 330, the m anode energy storage elements 131 and the cathode drive chip 340 are all assembled on the first board surface 351 of the emission substrate 350. The top surface 411 of the light emitting chip 310 has a first side edge 4113a, a second side edge 4113b, a third side edge 4113c and a fourth side edge 4113d. The first side edge 4113a and the second side edge 4113b are located on both sides of the light emitting chip 310 along the row direction AA. The third side edge 4113c and the fourth side edge 4113d are located on both sides of the light emitting chip 310 along the column direction BB.

[0066] like Figure 3 and Figure 6 As shown, in some specific embodiments, the first side edge 4113a is provided with m common anode terminal bonding points 411a. The anode driver chip 330 is provided on the side of the light emitting chip 310 close to the first side edge 4113a. The m anode energy storage elements 132 are provided between the anode driver chip 330 and the first side edge 4113a, and are bonded and connected to the m anode drive bonding points 331a on the anode driver chip 330 through m first bonding wires 151, so as to realize one-to-one electrical connection with the m anode drive circuits 131. The m anode energy storage elements 132 are bonded and connected to the m common anode terminal bonding points 411a on the light emitting chip 310 through m second bonding wires 152, so as to realize one-to-one electrical connection with the m common anode terminals 311a. The third side edge 4113c is provided with n common cathode end bonding points 411b; the cathode driver chip 340 is arranged on the side of the light-emitting chip 310 close to the third side edge 4113c, and is bonded to the n common cathode end bonding points 411b through n third bonding wires to realize one-to-one electrical connection between the n cathode driver circuits 140 and the n common cathode ends 311b.

[0067] like Figure 3 and Figure 6As shown, the number of anode driver chips 330 is one, and one anode driver chip 330 is arranged on the side of the light emitting chip 310 close to the first side edge 4113a. In other optional embodiments, the number of anode driver chips 330 is multiple (multiple means two or more, the same below), and the sum of the number of anode driver circuits 131 integrated in the multiple anode driver chips 330 is equal to m. Multiple anode driver chips 330 are arranged on the side of the light emitting chip 310 close to the first side edge 4113a. The number of cathode driver chips 340 is one, and one cathode driver chip 340 is arranged on the side of the light emitting chip 310 close to the third side edge 4113c. In other optional embodiments, the number of cathode driver chips 340 is multiple, and the sum of the number of cathode driver circuits 140 integrated in the multiple cathode driver chips 340 is equal to n. Multiple cathode driver chips 340 are arranged on the side of the light emitting chip 310 close to the third side edge 4113c.

[0068] like Fig. 9 and Fig.12 As shown, in another optional embodiment, the first side edge 4113a is provided with m1 common anode terminal bonding points 411a, and the second side edge 4113b is provided with m2 common anode terminal bonding points 411a, m1 and m2 are both positive integers, and m1+m2=m, m1≥1, and m2≥1. The anode driver chip 330 includes a first anode driver chip 331 and a second anode driver chip 332, the first anode driver chip 331 is provided on a side of the light emitting chip 310 close to the first side edge 4113a, and the first anode driver chip 331 has m1 anode driver circuits 131 integrated therein, and the top surface 4311 of the first anode driver chip 331 is provided with m1 anode driver bonding points 331a, and the m1 anode driver bonding points 331a are electrically connected to the m1 anode driver circuits 131 integrated therein in a one-to-one correspondence. The second anode driver chip 332 is arranged on a side of the light-emitting chip 310 close to the second side edge 4113b, and the second anode driver chip 332 has m2 anode driver circuits 132 integrated therein, and the top surface 3321 of the second anode driver chip 332 is provided with m2 anode driver bonding points 331a, and the m2 anode driver bonding points 331a are electrically connected one-to-one with the m2 anode driver circuits 131 integrated therein.

[0069] The m1 anode energy storage elements 132 corresponding to the first anode driver chip 331 are arranged between the first anode driver chip 331 and the first side edge 4113a, and are bonded to the m1 anode drive bonding points 331a on the first anode driver chip 331 through m1 first bonding wires 151, so as to realize the one-to-one electrical connection between the m1 anode energy storage elements 132 and the m1 anode drive circuits 131. The m1 anode energy storage elements 132 corresponding to the first anode driver chip 331 are also bonded to the m1 common anode terminal bonding points 411a arranged on the first side edge 4113a through m1 second bonding wires 152, so as to realize the one-to-one electrical connection between the m1 anode energy storage elements 132 and the m1 anode drive circuits 131. The m2 anode energy storage elements 132 corresponding to the second anode driver chip 332 are arranged between the second anode driver chip 332 and the second side edge 4113b, and are bonded to the m2 anode drive bonding points 331a on the second anode driver chip 332 through m2 first bonding wires 151, so as to realize the one-to-one electrical connection between the m2 anode energy storage elements 132 and the m2 anode drive circuits 131. The m2 anode energy storage elements 132 corresponding to the second anode driver chip 332 are also bonded to the m2 common anode terminal bonding points 411a located at the second side edge 4113b of the light-emitting chip 310 through m2 second bonding wires 152, so as to realize the one-to-one electrical connection between the m2 anode energy storage elements 132 and the m2 anode drive circuits 131.

[0070] Furthermore, the first anode driver chip 331 and the second anode driver chip 332 are symmetrically mounted on both sides of the light emitting chip 310 along the row direction AA. In a preferred embodiment, m1=m2=m / 2, which is convenient for mass production of the anode driver chip 330 and assembly of the laser emission module 300.

[0071] like Figures 9 to 12As shown, the third side edge 4113c is provided with n1 common cathode end bonding points 411b, and the fourth side edge 4113d is provided with n2 common cathode end bonding points 411b, n1 and n2 are both positive integers, and n1+n2=n, n1≥1, and n2≥1. The cathode driver chip 340 includes a first cathode driver chip 341 and a second cathode driver chip 342, the first cathode driver chip 341 is provided on a side of the light emitting chip 310 close to the third side edge 4113c, and n1 cathode driver circuits 140 are integrated inside the first cathode driver chip 341, and n1 cathode driver bonding points 341a are provided on the top surface 4411 of the first cathode driver chip 341, and the n1 cathode driver bonding points 341a are electrically connected to the n1 cathode driver circuits 140 integrated inside the first cathode driver chip 341 in a one-to-one correspondence. The second cathode driver chip 342 is arranged on a side of the light-emitting chip 310 close to the fourth side edge 4113d, and the second cathode driver chip 342 has n2 cathode driver circuits 140 integrated therein, and the top surface 3421 of the second cathode driver chip 342 is provided with n2 cathode driver bonding points 341a, and the n2 cathode driver bonding points 341a are electrically connected one-to-one with the n2 cathode driver circuits 140 integrated therein.

[0072] The n1 cathode driving bonding points 341a provided on the surface 3411 of the first cathode driving chip 341 are bonded to the n1 common cathode terminal bonding points 411b located at the third side edge 4133c through n1 third bonding wires 153, so as to realize the one-to-one electrical connection between the n1 cathode driving circuits 140 and the n1 common cathode terminals 311b. The n2 cathode driving bonding points 341a provided on the surface 3421 of the second cathode driving chip 342 are bonded to the n2 common cathode terminal bonding points 411b located at the fourth side edge 4133d through n2 third bonding wires 153, so as to realize the one-to-one electrical connection between the n2 cathode driving circuits 140 and the n2 common cathode terminals 311b.

[0073] Furthermore, the first cathode driver chip 341 and the second cathode driver chip 342 are symmetrically arranged on both sides of the light emitting chip 310 along the column direction BB. Preferably, n1=n2=n / 2, which is convenient for mass production of the cathode driver chip 340 and assembly of the laser emission module 300.

[0074] In this embodiment, the laser emission module 100 integrates m anode drive circuits by using the independently arranged first anode drive chip 331 and the second anode drive chip 332, thereby avoiding integrating all anode drive circuits 131 into the same chip, which will increase the processing difficulty and increase the cost. On the other hand, it will also cause the emission substrate 350 to have a larger size in the layout direction of the anode drive chips, such as the column direction BB, thereby increasing the size of the emission substrate 350. At the same time, when the anode driving chip with a larger size is arranged on the side of the light-emitting chip 310, not only will the line between each anode driving bonding point 331a and the corresponding common anode terminal bonding point 4122a be longer, but it will also easily cause the distance between the anode driving bonding point 331a near the edge position and the corresponding common anode terminal bonding point 411a to be much greater than the distance between the anode driving bonding point 331a located in the middle position and the corresponding common anode terminal bonding point 411a, thereby causing a large difference in the line length between the anode driving bonding points 331a at different positions and the corresponding common anode terminal 311a, and the line from the anode driving bonding point 331a at the edge position to the corresponding common anode terminal 311a is longer. On the one hand, the line is longer, and the link impedance corresponding to the line will also be larger. Accordingly, the energy loss when the current is transmitted on the line will also increase, which will lead to a decrease in the light-emitting power of the laser 311 corresponding to the common anode terminal bonding point 411a connected to the anode drive bonding point 331a located at the edge position. On the other hand, the line is longer, and the time for the current to be transmitted on the line will also be correspondingly longer, which will lead to a slower response speed of the laser 311 corresponding to the common anode terminal bonding point 411a connected to the anode drive bonding point 331a located at the edge position.

[0075] At the same time, the laser emission module 100 integrates n anode drive circuits by using the independently arranged first cathode drive chip 341 and the second cathode drive chip 342, thereby avoiding integrating all cathode drive circuits 140 into the same chip, which will increase the processing difficulty and increase the cost. On the other hand, it will also cause the emission substrate 350 to have a larger size in the direction of the cathode drive chip layout, such as the row direction AA, thereby increasing the size of the emission substrate 350. At the same time, when a cathode driving chip with a larger size is arranged on the side of the light-emitting chip 310, not only will the line between each cathode driving bonding point 341a and the corresponding common cathode end bonding point 411b be longer, but it will also easily cause the distance between the cathode driving bonding point 341a near the edge position and the corresponding common cathode end bonding point 411b to be much greater than the distance between the cathode driving bonding point 341a located in the middle position and the corresponding common cathode end bonding point 411b, thereby causing a large difference in the line length between the cathode driving bonding points 341a at different positions and the corresponding common cathode end bonding point 411b. The line from the cathode driving bonding point 341a located at the edge position to the corresponding common cathode end bonding point 411b is longer, and accordingly, the link impedance is larger, which in turn causes an increase in energy loss on the line, thereby reducing the luminous power and luminous efficiency of the laser 311.

[0076] It is understandable that the difference in line length between the anode drive bonding points 331a located at different positions and the corresponding common anode terminal bonding points 411a is relatively large, which will lead to inconsistent light emitting power and response speed between the lasers 311 corresponding to the common anode terminal bonding points 411a connected to the anode drive bonding points 331a at different positions, affecting the light emitting uniformity of the laser emission module 300, and further affecting the ranging performance of the laser ranging device.

[0077] like Fig. 9 and Fig.12As shown, in a specific embodiment, the number of the first anode driver chip 331 is one, and one first anode driver chip 331 is arranged on the side of the light emitting chip 310 close to the first side edge 4113a. In other optional embodiments, the number of the first anode driver chips 331 is multiple, and the sum of the number of anode driver circuits 131 integrated in the multiple first anode driver chips 331 is equal to m1. The multiple first anode driver chips 331 are arranged on the side of the light emitting chip 310 close to the first side edge 4113a. In a specific embodiment, the number of the second anode driver chips 332 is one, and one second anode driver chip 332 is arranged on the side of the light emitting chip 310 close to the second side edge 4113b. In other optional embodiments, the number of the second anode driver chips 332 is multiple, and the sum of the number of anode driver circuits 131 integrated in the multiple second anode driver chips 332 is equal to m2. The multiple second anode driver chips 332 are arranged on the side of the light emitting chip 310 close to the second side edge 4113b.

[0078] like Fig. 9 and Fig.12 As shown, in a specific embodiment, the number of the first cathode driver chip 341 is one, and one first cathode driver chip 341 is arranged on the side of the light emitting chip 310 close to the third side edge 4113c. In other optional embodiments, the number of the first cathode driver chip 341 is multiple, and the sum of the number of cathode driver circuits 140 integrated in the multiple first cathode driver chips 341 is equal to n1. Multiple first cathode driver chips 341 are arranged on the side of the light emitting chip 310 close to the third side edge 4113c. In a specific embodiment, the number of the second cathode driver chip 342 is one, and one second cathode driver chip 342 is arranged on the side of the light emitting chip 310 close to the fourth side edge 4113d. In other optional embodiments, the number of the second cathode driver chip 342 is multiple, and the sum of the number of cathode driver circuits 140 integrated in the multiple second cathode driver chips 342 is equal to n2. Multiple second cathode driver chips 342 are arranged on the side of the light emitting chip 310 close to the fourth side edge 4113d.

[0079] like Figure 4 and Fig.10As shown, in some optional embodiments, each anode driving bonding point 331a is provided with a first pad 331b; m first anode energy storage element pads 1321 are provided on the emission substrate 350, and the m first anode energy storage element pads 1321 are electrically connected to the m anode energy storage elements 132 in a one-to-one correspondence; each common anode terminal bonding point 411a is provided with a fourth pad 411c; the m first anode energy storage element pads 1321 are connected to the m first pads 331c through m first bonding wires 151. 31b is welded and connected to realize bonding connection with m anode driving bonding points 331a, thereby realizing one-to-one electrical connection between m anode energy storage elements 132 and m anode driving circuits 131; the m first anode energy storage element pads 1321 are also welded and connected to m fourth pads 411c through m second bonding wires 152, so as to realize bonding connection with m common anode terminal bonding points 411a, thereby realizing one-to-one electrical connection between m first anode energy storage elements 132 and m common anode terminals 311a.

[0080] Furthermore, if Figure 4 and 9 As shown, the first anode energy storage element pads 1321 include a second pad 132a and a third pad 132b; the second pad 132a and the third pad 132b are respectively located on both sides of the corresponding anode energy storage element 132, and are electrically connected to the anode energy storage element 132; the second pad 132a is welded to the first pad 331b through the first bonding wire 151 to realize the bonding connection between the anode energy storage element 132 and the anode drive bonding point 311a, thereby realizing the electrical connection between the anode energy storage element 132 and the anode drive circuit 131; the third pad 132b is welded to the fourth pad 411c through the second bonding wire 152 to realize the bonding connection between the anode energy storage element 132 and the common anode terminal bonding point 411a, thereby realizing the electrical connection between the anode energy storage element 132 and the common anode terminal 311a.

[0081] Furthermore, the second pad 132a and the third pad 132b corresponding to each anode energy storage element 132, the first pad 331b corresponding to the anode driving bonding point 331a, and the fourth pad 411c corresponding to the common anode terminal bonding point 411a are arranged along the row direction AA.

[0082] Specifically, the anode energy storage element 132 is an energy storage capacitor. In a preferred embodiment, the anode energy storage element 132 is a ceramic capacitor.

[0083] like Figure 7 and Fig.13As shown, in other optional embodiments, a first pad 331b is provided on each anode drive bonding point 331a; a second anode energy storage element pad 1322 is provided on the surface of each anode energy storage element 132; a fourth pad 411c is provided on each common anode terminal bonding point 411a; m second anode energy storage element pads 1322 are welded and connected to the m first pads 331b through m first bonding wires 151 to achieve bonding connection with the m anode drive bonding points 331a, thereby achieving one-to-one electrical connection between the m anode energy storage elements 132 and the m anode drive circuits 131; the m second anode energy storage element pads 1322 are also welded and connected to the m fourth pads 411c through m second bonding wires 152 to achieve bonding connection with the m common anode terminal bonding points 411a, thereby achieving one-to-one electrical connection between the m first anode energy storage elements 132 and the m common anode terminals 311a.

[0084] Furthermore, the second anode energy storage element pad 1322 corresponding to each anode energy storage element 132 , the first pad 331 b corresponding to the anode driving bonding point 331 a , and the fourth pad 411 c corresponding to the common anode terminal bonding point 411 a are arranged along the row direction AA.

[0085] Specifically, the anode energy storage element 132 uses an energy storage capacitor. In another preferred embodiment, the anode energy storage element 132 uses a silicon capacitor.

[0086] The laser emission module 300 provided in this embodiment uses the second anode energy storage element pad 1322 on the anode energy storage element 132 to directly bond and connect with the anode drive chip 330 and the light-emitting chip 310. There is no need to set the first anode energy storage element pad on the emission substrate 350 to perform electrical connection between the anode energy storage element 132 and the anode drive chip 330 and between the anode energy storage element 132 and the light-emitting chip 310. The solder joints on the emission substrate 350 can be further reduced, and the area of ​​the emission substrate 350 can be reduced, thereby further reducing the assembly size of the laser emission module 300.

[0087] Furthermore, the sum of the lengths of the first bonding wire 151 and the second bonding wire 152 connected to the m anode energy storage elements 132 is equal. Specifically, the sum of the lengths of the first bonding wire 151 and the second bonding wire 152 connected to the first anode energy storage element 132 is equal to the sum of the lengths of the first bonding wire 151 and the second bonding wire 152 connected to the second anode energy storage element 132, until the sum of the lengths of the first bonding wire 151 and the second bonding wire 152 connected to the mth anode energy storage element 132 is equal, which is convenient for controlling the line lengths between each anode drive circuit 131 and the common anode terminal 311a to be consistent, and correspondingly, the link impedance is consistent, which is conducive to ensuring the light emission uniformity of the m*n lasers 311.

[0088] like Figure 3 and 6 As shown, the m anode driving bonding points 331a arranged on the surface 331 of the anode driving chip 330 are arranged at equal intervals along the direction parallel to the column direction BB; the m second anode energy storage element pads 1322 corresponding to the m anode energy storage elements 132 are arranged at equal intervals along the direction parallel to the column direction BB; the m common anode terminal bonding points 411a are arranged at equal intervals along the direction parallel to the column direction BB; Fig. 9 and 12 As shown, the m1 anode driving bonding points 331a arranged on the surface 3311 of the first anode driving chip 331 are arranged at equal intervals along the direction parallel to the column direction BB; the m1 second anode energy storage element pads 1322 corresponding to the m1 anode energy storage elements 132 are arranged at equal intervals along the direction parallel to the column direction BB; the m2 anode driving bonding points 331a arranged on the surface 3312 of the second anode driving chip 332 are arranged at equal intervals along the direction parallel to the column direction BB; the m2 anode energy storage elements 132 corresponding to the m2 second anode energy storage element pads 1322 are arranged at equal intervals along the direction parallel to the column direction BB. The second anode energy storage element pads 1322 are arranged at equal intervals along a direction parallel to the column direction BB; the m2 common anode terminal bonding points 411a are arranged at equal intervals along a direction parallel to the column direction BB; such a design facilitates the realization that the lengths of the first bonding wires 151 connected to the m anode energy storage elements 132 are equal, and the lengths of the second bonding wires 152 connected to the m anode energy storage elements 132 are equal, thereby achieving that the sum of the lead lengths of the first bonding wires 151 and the second bonding wires 152 connected to the m anode energy storage elements 132 are equal.

[0089] like Figure 4 , Fig.10 , Figure 7 and Fig.13 As shown, a sixth pad 341b is provided on each cathode driving bonding point 341a, and a seventh pad 411d is provided on each common cathode terminal bonding point 411b. The sixth pad 341b on each cathode driving bonding point 341a is welded and connected to the seventh pad 411d on the corresponding common cathode terminal bonding point 411b through the third bonding wire 153, so as to realize the bonding connection between the cathode driving bonding point 341a and the corresponding common cathode terminal bonding point 411b, thereby realizing the electrical connection between the cathode driving circuit 140 and the corresponding common cathode terminal 311b.

[0090] Furthermore, the lengths of the third bonding wires 153 connected between the n cathode driving bonding points 341 a and the n common cathode terminal bonding points 411 b are equal. Specifically, the lead length of the third bonding lead 151 between the sixth pad 341b on the first cathode driving bonding point 341a and the seventh pad 411d set between the first common cathode end bonding point 411b is equal to the lead length of the third bonding lead 151 between the sixth pad 341b on the second cathode driving bonding point 341a and the seventh pad 411d set between the second common cathode end bonding point 411b, until the lead length of the third bonding lead 151 between the sixth pad 341b on the mth cathode driving bonding point 341a and the seventh pad 411d set between the mth common cathode end bonding point 411b is equal, which is convenient for controlling the line length between each cathode driving circuit 140 and the common cathode end 311b to be consistent, and accordingly, the link impedance is consistent, which is beneficial to ensure the uniformity of light emission of m*n lasers 311.

[0091] like Figure 3 and Figure 6 As shown, n cathode driving bonding points 341a arranged on the surface 341 of the cathode driving chip 340 are arranged at equal intervals along a direction parallel to the row direction AA; n common cathode terminal bonding points 411b are arranged at equal intervals along a direction parallel to the row direction AA; Fig. 9 and Fig.12 As shown, n1 cathode driving bonding points 341a arranged on the surface 3411 of the first cathode driving chip 341 are arranged at equal intervals along a direction parallel to the row direction AA; n1 common cathode end bonding points 411b are arranged at equal intervals along a direction parallel to the row direction AA. n2 cathode driving bonding points 341a arranged on the surface 3411 of the second cathode driving chip 342 are arranged at equal intervals along a direction parallel to the row direction AA; n2 common cathode end bonding points 411b are arranged at equal intervals along a direction parallel to the row direction AA; such a design facilitates the realization of equal lengths of the n third bonding wires 153 connected between the n cathode driving bonding points 341a and the n common cathode end bonding points 411b.

[0092] like Figure 4 , Figure 5 , Figure 7 , Figure 8 , Fig.10 , Fig.11 , Fig.13 and Fig.14As shown, the laser emission module 300 also includes a packaging protective cover 360 and a light-transmitting cover plate 370. The packaging protective cover 360 is disposed on the first board surface 351 of the emission substrate 350, and forms a receiving space 316 with the first board surface 415, which is used to receive the components assembled on the emission substrate 350, including the light-emitting chip 310, the anode driving chip 330, the anode energy storage element 132, and the cathode driving chip 340. The packaging protective cover 360 is provided with a light-transmitting opening (not shown) corresponding to the light-emitting area 3111 of the light-emitting chip 310, and the light-transmitting cover plate 370 is covered on the light-transmitting opening, so as to allow the light emitted by the light-emitting chip 310 to emit out of the laser emission module 100.

[0093] The laser emission module 300 provided in the present application encapsulates the devices assembled on the emission substrate 350 through the packaging protection cover 360, and seals the light-transmitting opening through the light-transmitting cover 370, which can reduce the impact of external water vapor, volatile substances, dust, liquids, solder particles, etc. on the light-emitting chip 310, the anode driving chip 330, the anode energy storage element 132 and the cathode driving chip 340.

[0094] In a specific embodiment, the laser emission module 100 adopts a ball grid array packaging technology (BGA) (such as Figure 4 , Figure 5 , Figure 7 , Figure 8 , Fig.10 , Fig.11 , Fig.13 and Fig.14 In another specific embodiment, the laser emission module 100 adopts a grid array packaging technology (LGA) (such as Fig.15 In other specific embodiments, the laser emission module 100 is packaged using a quad flat no-lead package technology (QFN) (as shown in FIG. Fig.16 As shown); the laser emission module 100 provided in the present application can be packaged into a whole by any one of the three packaging technologies mentioned above.

[0095] Specifically, Figure 4 , Figure 5 , Figure 7 , Figure 8 , Fig.10 , Fig.11 , Fig.13 , Fig.14 , Fig.15 and Fig.16As shown, after the laser emission module 100 is packaged, the emission substrate 350 still retains an exposed external solder pad 353, and the external solder pad 353 is used to realize the laser emission module 100 and an external circuit, such as mounting with other circuit boards in a laser ranging device, and realize electrical connection with the mounted circuit board. The emission substrate 350 can receive an external control signal sent by the circuit board through the external solder pad 353, and the external control signal is transmitted to the emission substrate 350 through the external solder pad, and then transmitted to the anode drive chip 330 and the cathode drive chip 340 on the emission substrate 350 through the emission substrate 350, thereby controlling the anode drive chip 330 and the cathode drive chip 340.

[0096] Specifically, the transmitting substrate 350 adopts a printed circuit board, which is used to provide electrical connection, protection, support, heat dissipation, assembly and other functions for the chip, so as to achieve the purpose of multi-pin, reducing the size of the packaged product, reducing the product size, improving electrical performance and heat dissipation, ultra-high density or multi-chip modularization.

[0097] Furthermore, the emitting substrate 350 uses a thermally conductive substrate, which is convenient for dissipating heat from the devices mounted on the emitting substrate 350 and avoiding heat accumulation. The "thermal conductive substrate" can be understood as a plate with a good thermal conductivity. The present application does not limit the specific preparation material of the thermally conductive substrate, and the designer can reasonably select the preparation material of the thermally conductive substrate according to actual needs. Specifically, the thermally conductive substrate uses a ceramic substrate.

[0098] Furthermore, in order to facilitate chip integration of the anode drive circuit 131 and the cathode drive circuit 140, the devices included in the anode drive circuit 131 are all silicon-based devices, and the devices included in the cathode drive circuit 140 are all silicon-based devices.

[0099] like Fig.17 As shown, each anode driving circuit 131 includes an anode addressing switch element Q1, an anode unidirectional conduction element Q2 and an anode reverse bias switch element Q3; the anode addressing switch element Q1, the anode unidirectional conduction element Q2 and the anode reverse bias switch element Q3 are all silicon-based devices; one end of the anode unidirectional conduction element Q2 is connected to the anode addressing switch element Q1 and the anode reverse bias switch element Q3, and the other end is electrically connected to the corresponding common anode terminal 311a; the states of the anode addressing switch element Q1 and the anode reverse bias switch element Q3 are opposite, and the anode unidirectional conduction element Q2 can be controlled to be in a forward conduction state or a reverse biased state; when the anode addressing switch element Q1 is turned on, the anode unidirectional conduction element Q2 is in a conduction state; when the anode reverse bias switch element Q3 is turned on, the anode unidirectional conduction element Q2 is in a reverse biased state.

[0100] like Fig.17As shown, the m anode addressing switch elements Q1 included in the m anode driving circuits 131 are electrically connected to the cathode of a germanium-based diode D; the anode of the germanium-based diode D is used to receive the current IL to charge the m anode energy storage elements 132 .

[0101] Specifically, when the laser 311 at the position (x, y) needs to emit light, in the x-th anode drive circuit 131 corresponding to the laser 311 at the position (x, y), the anode site selection switch element Q1 is turned on, the anode reverse bias switch element Q3 is turned off, and the anode unidirectional conduction element Q2 is in a forward conduction state; the current IL charges the anode energy storage element 132 through the anode site selection switch element Q1 and the anode unidirectional conduction element Q2; at this time, the y-th cathode drive circuit 140 corresponding to the laser 311 at the position (x, y) is turned on, and the anode energy storage element 132-laser 311-cathode drive circuit 140 forms an energy release loop, and the electric energy stored in the anode energy storage element 132 is used to drive the laser 311 at the position (x, y) to emit light. When the laser 311 at the position (x, y) no longer needs to emit light, in the x-th anode drive circuit 131 corresponding to the laser 311 at the position (x, y), the anode addressing switch element Q1 is turned off, the anode reverse bias switch element Q3 is turned on, and the anode unidirectional conduction element Q2 is in a reverse bias state; the current IL stops charging the anode energy storage element 132. At this time, the anode unidirectional conduction element Q2 is in a reverse bias state, so that the laser 311 that no longer needs to emit light will not be crosstalked by the electrical signals of other lasers, thereby improving the isolation between the anode drive circuits 131.

[0102] Specifically, taking the xth anode drive circuit 131 as an example, the anode addressing switch element Q1 includes a first NMOS tube; the anode unidirectional conduction element Q2 includes a second NMOS tube; and the anode reverse bias switch element Q3 includes a third NMOS tube. The source of the second NMOS tube is connected to the source of the first NMOS tube and the drain of the third NMOS tube. The drain of the second NMOS tube is connected to one end of the anode energy storage element 132. The source of the third NMOS tube is grounded GND. The gate of the first NMOS tube is connected to the gate of the second NMOS tube, and receives the anode addressing signal TX_HS_EN_x. The gate of the third NMOS tube receives the inverted anode addressing signal TX_HS_EN__L_x, that is, TX_HS_EN__L_x is opposite in phase to TX_HS_EN_x.

[0103] Specifically, when TX_HS_EN_x is at a high level, the first NMOS tube and the second NMOS tube are turned on, and the current IL charges the anode energy storage element 132 through the turned-on first NMOS tube and the second NMOS tube; when TX_HS_EN_x is at a low level, TX_HS_EN__L_x is at a high level, the third NMOS tube is turned on and the second NMOS tube is in a reverse bias state.

[0104] Specifically, taking the yth cathode driving circuit 140 as an example, the cathode addressing driving circuit 140 includes a cathode addressing switch element Q4; the cathode addressing switch element Q4 includes a fourth NMOS tube; the drain of the fourth NMOS tube is electrically connected to the corresponding common cathode terminal 311b, the source of the fourth NMOS tube is grounded, and the gate of the fourth NMOS tube receives the cathode addressing signal TX_LS_EN_1.

[0105] In a specific implementation, when the anode addressing signal TX_HS_EN_x becomes high and the cathode addressing signal TX_LS_EN_y becomes high, the laser 311 at the position (x, y) emits light.

[0106] The anode addressing switch element Q1, the anode unidirectional conduction element Q2, and the anode reverse bias switch element Q3 are all silicon-based devices, so that the m-way anode drive circuit 131 can be integrated into a chip on a silicon substrate to obtain an anode drive chip 330. The cathode addressing switch element Q4 is a silicon-based device, so that the m-way anode drive circuit 131 can be integrated into a chip on a silicon substrate to obtain a cathode drive chip 340.

[0107] Furthermore, since the current IL is a high-frequency and high-power current, in order to meet the unidirectional conduction fast response to the high-frequency and high-power current IL, as Fig.17 As shown, the m anode selection switch elements Q1 included in the m anode drive circuits 131 receive the current IL through the germanium-based diode D, and utilize the characteristic that the germanium-based diode starts to have current at 0.1V in the forward direction to achieve a rapid response to the high-frequency and high-power current IL in a unidirectional manner.

[0108] In a second aspect, the present application further provides a laser ranging device, which includes the laser emitting module 100 in any of the above-mentioned embodiments, and emits an outgoing laser through the above-mentioned laser emitting module 100.

[0109] Embodiment 2

[0110] The difference between this embodiment and the first embodiment is that the anode drive chip 330 is a chip that has been packaged; the cathode drive chip 340 is a chip that has been packaged. The laser emission module 100 provided in this embodiment can further protect the anode drive chip 330 and the cathode drive chip 340 by packaging the anode drive chip 330 and the cathode drive chip 340.

[0111] In an optional embodiment, the anode driver chip 330 is packaged using a ball grid array packaging technology (BGA), and the bottom surface of the anode driver chip 330 is provided with m anode driver solder joints (not shown); the m anode driver solder joints are electrically connected to the m anode driver circuits 131 integrated in the anode driver chip 330 in a one-to-one correspondence; the m anode driver solder joints are welded on the emission substrate 350, and are electrically connected to the m anode driver pads 354 provided on the emission substrate 350 in a one-to-one correspondence (such as Fig.18 , Fig.19 , Fig.21 , Fig. 22 , Fig.23 and Fig.25 as shown); Fig.18 , Fig.19 , Fig. 22 and Fig.23 As shown, m first anode energy storage element pads 1321 are also provided on the emission substrate 350, and the m first anode energy storage element pads 1321 are electrically connected to the m anode energy storage elements 132 in a one-to-one correspondence; a fourth pad 411c is provided on each common anode terminal bonding point 411a; the m first anode energy storage element pads 1321 are welded and connected to the m anode drive pads 354 through m first printed circuits 161 provided on the emission substrate 350, so as to realize bonding connection with the m anode drive welding points, thereby realizing one-to-one electrical connection between the m anode energy storage elements 132 and the m anode drive circuits 131; the m first anode energy storage element pads 1321 are also welded and connected to the m fourth pads 411c through m second bonding wires 152, so as to realize bonding connection with the m common anode terminal bonding points 411a, thereby realizing one-to-one electrical connection between the m first anode energy storage elements 132 and the m common anode terminals 311a. The first printed circuit is an electronic circuit disposed on the emission substrate 350 by using a printing technology.

[0112] Furthermore, if Fig.19 and Fig.23As shown, the first anode energy storage element pads 1321 include a second pad 132a and a third pad 132b; the second pad 132a and the third pad 132b are respectively located on both sides of the corresponding anode energy storage element 132, and are electrically connected to the anode energy storage element 132; the second pad 132a is welded to the first pad 331b through the first bonding wire 151 to realize the bonding connection between the anode energy storage element 132 and the anode drive bonding point 311a, thereby realizing the electrical connection between the anode energy storage element 132 and the anode drive circuit 131; the third pad 132b is welded to the fourth pad 411c through the second bonding wire 152 to realize the bonding connection between the anode energy storage element 132 and the common anode terminal bonding point 411a, thereby realizing the electrical connection between the anode energy storage element 132 and the common anode terminal 311a.

[0113] like Fig.21 and Fig.25 As shown, in another optional embodiment, a second anode energy storage element pad 1322 is provided on the surface of each anode energy storage element 132; the m second anode energy storage element pads 1322 are welded and connected to the m anode drive pads 354 through m first bonding wires 151 to achieve bonding connection with the m anode drive welding points, thereby achieving a one-to-one electrical connection between the m anode energy storage elements 132 and the m anode drive circuits 131.

[0114] In an optional embodiment, the cathode driver chip 340 is packaged using a ball grid array packaging technology (BGA), and n cathode driver solder joints (not shown) are provided on the bottom surface of the cathode driver chip 340; the n cathode driver solder joints are electrically connected to the n cathode driver circuits 140 integrated in the cathode driver chip 340 in a one-to-one correspondence; the n cathode driver solder joints are welded on the emission substrate 350, and are electrically connected to the n cathode driver pads 355 provided on the emission substrate 350 in a one-to-one correspondence (such as Fig.18 , Fig. 20 , Fig. 22 and Fig.24 As shown); a seventh pad 411d is provided on each common cathode terminal bonding point 411b. The n cathode driving pads 355 are welded and connected to the n seventh pads 411d through n third bonding wires 153, so as to realize bonding connection with the n common cathode terminal bonding points 411b, thereby realizing one-to-one electrical connection between the n cathode driving circuits 140 and the n common cathode terminals 311b.

[0115] In a preferred embodiment, the anode driver chip 330 and the cathode driver chip 340 are packaged using ball grid array packaging technology (BGA). At this time, m anode driver solder joints are located on the bottom surface of the anode driver chip 330; n cathode driver solder joints are located on the bottom surface of the cathode driver chip 340. In other optional embodiments, the anode driver chip 330 and the cathode driver chip 340 can be packaged using land grid array packaging technology (LGA) or quad flat no-lead packaging technology (QFN), and the present application does not limit the packaging method of the anode driver chip 330 and the cathode driver chip 340.

[0116] When the anode driver chip 330 and the cathode driver chip 340 are packaged using the quad flat no-lead package technology (QFN), the m anode driver solder joints are located on the bottom surface of the anode driver chip 330; and the n cathode driver solder joints are located on the bottom surface of the cathode driver chip 340. When the anode driver chip 330 and the cathode driver chip 340 are packaged using the land grid array package technology (LGA), the m anode driver solder joints are located on the side surface of the anode driver chip 330, and the n cathode driver solder joints are located on the side surface of the cathode driver chip 340.

[0117] Embodiment 3

[0118] like Figures 26 to 29 As shown, the difference between this embodiment and the first or second embodiment is that: the emission substrate 350 also includes a second board surface 352 opposite to the first board surface 351; the anode drive chip 330 includes a third anode drive chip 333 and a fourth anode drive chip 334; the third anode drive chip 333 is mounted on the first board surface 351, and the fourth anode drive chip 334 is mounted on the second board surface 352 opposite to the first board surface 351. The cathode drive chip 340 includes a third cathode drive chip 343 and a fourth cathode drive chip 344; the third cathode drive chip 343 is mounted on the first board surface 351, and the fourth cathode drive chip 344 is mounted on the second board surface 352 opposite to the first board surface 351.

[0119] In an optional embodiment, the third anode driver chip 333 and the fourth anode driver chip 334 are both bare chips; the third anode driver chip 333 integrates m3 anode driver circuits, and the surface of the third anode driver chip 333 is provided with m3 anode driver bonding points (not shown), and the m3 anode driver bonding points are electrically connected to the m3 anode driver circuits in a one-to-one correspondence; the m3 anode energy storage elements 132 corresponding to the third anode driver chip 333 are assembled on the first board surface 351, and are bonded to the m3 anode driver bonding points on the third anode driver chip 333 through m3 first bonding wires (not shown), thereby realizing a one-to-one electrical connection with the m3 anode driver circuits; the m3 anode energy storage elements 132 corresponding to the third anode driver chip 333 are also bonded to the m3 common anode terminal bonding points through m3 second bonding wires, so as to realize a one-to-one electrical connection with the m3 common anode terminals. The fourth anode drive chip 334 has m4 anode drive circuits integrated inside, and the surface of the fourth anode drive chip 334 is provided with m4 anode drive bonding points (not shown), and the m4 anode drive bonding points are electrically connected to the m4 anode drive circuits one by one; the m4 anode energy storage elements 132 corresponding to the fourth anode drive chip 334 are assembled on the second board 352, and are bonded to the m4 anode drive bonding points on the fourth anode drive chip 334 through m4 first bonding wires (not shown), thereby realizing one-to-one electrical connection with the m4 anode drive circuits; the m4 anode energy storage elements 132 corresponding to the fourth anode drive chip 334 are also bonded to the m4 common anode terminal bonding points through m4 second bonding wires, so as to realize one-to-one electrical connection with the m4 common anode terminals. Wherein, m3 and m4 are both positive integers, and m3+m4=m, m3≥1, m4≥1.

[0120] The third cathode driver chip 343 has n3 cathode driver circuits integrated inside, and the surface of the third cathode driver chip 343 is provided with n3 cathode driver bonding points (not shown), and the n3 cathode driver bonding points are electrically connected to the n3 cathode driver circuits in a one-to-one correspondence; the n3 cathode driver bonding points are bonded to the n3 common cathode terminal bonding points through n3 third bonding wires, thereby realizing the one-to-one correspondence between the n3 cathode driver circuits and the n3 common cathode terminals 311b. The fourth cathode driver chip 344 has n4 cathode driver circuits integrated inside, and the surface of the fourth cathode driver chip 344 is provided with n4 cathode driver bonding points (not shown), and the n4 cathode driver bonding points are electrically connected to the n4 cathode driver circuits in a one-to-one correspondence; the n4 cathode driver bonding points are bonded to the n4 common cathode terminal bonding points through n4 fourth bonding wires, thereby realizing the one-to-one correspondence between the n4 cathode driver circuits and the n4 common cathode terminals. Among them, n3 and n4 are both positive integers, and n3+n4=n, n3≥1, n4≥1.

[0121] In this embodiment, the second bonding leads include single-sided second bonding leads and double-sided second bonding leads, wherein the number of single-sided second bonding leads is m3; the m3 single-sided second bonding leads are located on the side of the emission substrate 350 close to the first board surface 351, and are used to realize the bonding connection between the m3 anode energy storage elements 132 corresponding to the third anode driver chip 333 arranged on the first board surface 351 and the m3 common anode terminal bonding points; the number of double-sided second bonding leads is m4, and one end of the m4 double-sided second bonding leads is bonded to the m4 anode energy storage elements 132 corresponding to the fourth anode driver chip 334 arranged on the second board surface 352, and the other end passes through the emission substrate 350 and is bonded to the m3 common anode terminal bonding points.

[0122] Specifically, the double-sided second bonding lead includes a first sub-bonding lead and a second sub-bonding lead; one end of the first sub-bonding lead is bonded to the corresponding anode energy storage element, and the other end is bound to the first welding point (not shown) of the second board surface 352 of the emission substrate 350; one end of the second sub-bonding lead is bonded to the corresponding common anode terminal bonding point, and the other end is bound to the second welding point (not shown) of the first board surface 351 of the emission substrate 350, and the first welding point and the second welding point are electrically connected through the circuit inside the emission substrate 350 to realize the electrical connection between the first sub-bonding lead and the second sub-bonding lead, thereby realizing the electrical connection between the anode energy storage element 132 corresponding to the fourth anode driver chip 334 and the corresponding common anode terminal bonding point.

[0123] In this embodiment, the third bonding leads include single-sided third bonding leads and double-sided third bonding leads, wherein the number of single-sided third bonding leads is n3; the n3 single-sided third bonding leads are located on one side of the emission substrate 350 close to the first board surface 351, and are used to realize the bonding connection of n3 cathode driving bonding points corresponding to the third cathode driving chip 343 arranged on the first board surface 351 and the n3 common cathode end bonding points; the number of double-sided third bonding leads is n4, and one end of the n4 double-sided third bonding leads is bonded to the n4 cathode driving bonding points corresponding to the fourth cathode driving chip 334 arranged on the second board surface 352, and the other end passes through the emission substrate 350 and is bonded to the n4 common cathode end bonding points.

[0124] Specifically, the double-sided third bonding lead includes a third sub-bonding lead and a fourth sub-bonding lead; one end of the third sub-bonding lead is bonded to the corresponding cathode drive bonding point, and the other end is bound to the third welding point (not shown) of the second board surface 352 of the emission substrate 350; one end of the fourth sub-bonding lead is bonded to the corresponding common cathode end bonding point, and the other end is bound to the fourth welding point (not shown) of the first board surface 351 of the emission substrate 350, and the third welding point and the fourth welding point are electrically connected through the circuit inside the emission substrate 350 to realize the electrical connection between the third sub-bonding lead and the fourth sub-bonding lead, thereby realizing the electrical connection between the cathode drive bonding point on the fourth cathode drive chip 344 and the corresponding common cathode end bonding point.

[0125] The laser emission module 100 provided in the embodiment of the present application avoids integrating all anode drive circuits 131 into one anode drive chip and all cathode drive circuits 140 into one cathode drive chip by respectively arranging the third anode drive chip 333 and the fourth anode drive chip 334 on the first board surface 351 and the second board surface 352 of the emission substrate 350, and respectively assembling the third cathode drive chip 343 and the fourth cathode drive chip 344 on the first board surface 351 and the second board surface 352, which will increase the processing difficulty and increase the cost. On the other hand, it will also cause the emission substrate 350 to have a larger size in the layout direction of the anode drive chip, such as the column direction BB, thereby increasing the size of the emission substrate 350.

[0126] In a specific implementation, the light emitting chip 310 is provided with m common anode terminal bonding points on one side along the row direction AA; and the light emitting chip 310 is provided with n common cathode terminal bonding points on one side along the column direction BB. Fig.26 As shown, the third anode driver chip 333 is mounted along the row direction AA on the side where m common anode terminal bonding points are arranged near the light emitting chip 310. m3 anode energy storage elements 132 corresponding to the third anode driver chip 333 are arranged between the third anode driver chip 333 and the light emitting chip 310. The fourth anode driver chip 333 is mounted along the row direction AA on the side where m common anode terminal bonding points are arranged near the light emitting chip 310.

[0127] In another specific implementation, the light emitting chip 310 is provided with m1 common anode terminal bonding points and m2 common anode terminal bonding points on both sides along the row direction AA. Fig.28As shown, the third anode driver chip 333 includes a first sub-anode driver chip 3331 and a second sub-anode driver chip 3332, the first sub-anode driver chip 3331 has m31 anode driver circuits integrated therein, and the second sub-anode driver chip 3332 has m32 anode driver circuits integrated therein. The surface of the first sub-anode driver chip 3331 is provided with m31 anode driver bonding points, and the surface of the second sub-anode driver chip 3332 is provided with m32 anode driver bonding points. The fourth anode driver chip 334 includes a third sub-anode driver chip 3341 and a fourth sub-anode driver chip 3342, the third sub-anode driver chip 3341 has m41 anode driver circuits integrated therein, and the surface of the third sub-anode driver chip 3341 has m41 anode driver bonding points. The fourth sub-anode driver chip 3342 has m42 anode driver circuits integrated therein, and the surface of the fourth sub-anode driver chip 3342 has m42 anode driver bonding points. Among them, m31, m32, m41, and m42 are all positive integers, m31≥1, m32≥1, m41≥1, and m31+m32=m3, m41+m42=m4, m31+m41=m1, and m32+m42=m2.

[0128] like Fig.28 As shown, the first sub-anode driver chip 3331 and the second sub-anode driver chip 3332 are both mounted on the first panel 351. The first sub-anode driver chip 3331 is mounted along the row direction AA on the side of the light-emitting chip 310 where m1 common anode terminal bonding points are provided, and m31 anode energy storage elements 132 corresponding to the first sub-anode driver chip 3331 are arranged between the first sub-anode driver chip 3331 and the light-emitting chip 310. The second sub-anode driver chip 3332 is mounted along the row direction AA on the side of the light-emitting chip 310 where m2 common anode terminal bonding points are provided, and m32 anode energy storage elements 132 corresponding to the second sub-anode driver chip 3332 are arranged between the second sub-anode driver chip 3331 and the light-emitting chip 310.

[0129] like Fig.28 As shown, the third sub-anode driver chip 3341 and the fourth sub-anode driver chip 3342 are both mounted on the second panel 352. The third sub-anode driver chip 3341 is mounted along the row direction AA on the side of the light-emitting chip 310 where m1 common anode terminal bonding points are provided, and m41 anode energy storage elements 132 corresponding to the third sub-anode driver chip 3341 are arranged between the third sub-anode driver chip 3341 and the light-emitting chip 310. The fourth sub-anode driver chip 3342 is mounted along the row direction AA on the side where m2 common anode terminals are provided close to the light-emitting chip 310, and m42 anode energy storage elements 132 corresponding to the fourth sub-anode driver chip 3343 are arranged between the fourth sub-anode driver chip 3342 and the light-emitting chip 310.

[0130] Furthermore, the first sub-anode driver chip 3331 and the second sub-anode driver chip 3332 are symmetrically mounted on both sides of the light emitting chip 310 along the row direction AA. The third sub-anode driver chip 3341 and the fourth sub-anode driver chip 3342 are symmetrically mounted on both sides of the light emitting chip 310 along the row direction AA.

[0131] Preferably, m31=m32=m3 / 2, m41=m42=m4 / 2, which is convenient for mass production of the anode drive chip 330 and also convenient for assembly of the laser emission module 300.

[0132] Furthermore, n1 common cathode terminal bonding points and n2 common cathode terminal bonding points are respectively arranged on both sides of the light emitting chip 310 along the column direction AA. Fig.29 As shown, the third cathode driver chip 343 includes a first sub-cathode driver chip 3431 and a second sub-cathode driver chip 3432, wherein n31 cathode driver circuits are integrated inside the first sub-cathode driver chip 3431, and n32 anode driver circuits are integrated inside the second sub-cathode driver chip 3432. The surface of the first sub-cathode driver chip 3431 is provided with n31 cathode driver bonding points, and the surface of the second sub-cathode driver chip 3432 is provided with n32 anode driver bonding points. The fourth cathode driver chip 344 includes a third sub-cathode driver chip 3441 and a fourth sub-cathode driver chip 3442, wherein n41 cathode driver circuits are integrated inside the third sub-cathode driver chip 3441, and n41 cathode driver bonding points are provided on the surface of the third sub-cathode driver chip 3441. The fourth sub-cathode driver chip 3442 is integrated with n42 cathode driver circuits, and n42 cathode driver bonding points are provided on the surface of the fourth sub-cathode driver chip 3442. Among them, n31, n32, n41, and n42 are all positive integers, n31≥1, n32≥1, n41≥1, and n31+n32=m3, n41+n42=m4, n31+n41=m1, and n32+n42=m2.

[0133] like Fig.29As shown, the first sub-cathode driver chip 3431 and the second sub-cathode driver chip 3432 are both mounted on the first board surface 351. The first sub-cathode driver chip 3431 is mounted along the column direction BB on the side of the light-emitting chip 310 where n1 common cathode terminal bonding points are provided. The second sub-cathode driver chip 3432 is mounted along the column direction BB on the side of the light-emitting chip 310 where n2 common cathode terminal bonding points are provided. The third sub-cathode driver chip 3441 and the fourth sub-cathode driver chip 3442 are both mounted on the second board surface 352. The third sub-cathode driver chip 3441 is mounted along the column direction BB on the side of the light-emitting chip 310 where n1 common cathode terminal bonding points are provided. The fourth sub-cathode driver chip 3442 is mounted along the column direction BB on the side of the light-emitting chip 310 where n2 common cathode terminal bonding points are provided.

[0134] Furthermore, the first sub-cathode driver chip 3431 and the second sub-cathode driver chip 3432 are symmetrically mounted on both sides of the light emitting chip 310 along the row direction AA. The third sub-cathode driver chip 3441 and the fourth sub-cathode driver chip 3442 are symmetrically mounted on both sides of the light emitting chip 310 along the row direction AA.

[0135] Preferably, n31=n32=n3 / 2, n41=n42=n4 / 2, which is convenient for mass production of the anode drive chip 330 and also convenient for assembly of the laser emission module 300.

[0136] Embodiment 4

[0137] The difference between this embodiment and the third embodiment is that the third anode driving chip 333 and the fourth anode driving chip 334 are both packaged chips.

[0138] Specifically, the third anode driver chip 333 is packaged using ball grid array packaging technology (BGA), and the bottom surface of the third anode driver chip 333 is provided with m3 anode driver solder joints; the m3 anode driver solder joints are electrically connected to the m3 anode driver circuits integrated inside the third anode driver chip 333 in a one-to-one correspondence; the m3 anode driver solder joints are welded on the first board surface 351 of the emission substrate 350, and are electrically connected to the m3 anode driver pads provided on the emission substrate 350 in a one-to-one correspondence (not shown); the emission substrate 350 is also provided with m3 first anode energy storage element solder pads (not shown), and the m3 first anode energy storage element solder pads are electrically connected to the m3 anode energy storage elements 132 in a one-to-one correspondence; A fourth pad (not shown) is provided on each common anode terminal bonding point; the m3 first anode energy storage element pads are welded and connected to the m3 anode drive pads through the m3 first printed circuits (not shown) provided on the first board surface 351 of the emission substrate 350, so as to realize the bonding connection with the m anode drive welding points, thereby realizing the one-to-one electrical connection between the m3 anode energy storage elements 132 and the m3 anode drive circuits 131; the m3 first anode energy storage element pads are also welded and connected to the m3 fourth pads 411c through the m3 single-sided second bonding leads, so as to realize the bonding connection with the m3 common anode terminal bonding points, thereby realizing the one-to-one electrical connection between the m3 first anode energy storage elements 132 and the m3 common anode terminals 311a.

[0139] In another optional embodiment, a second anode energy storage element pad (not shown) is provided on the surface of each anode energy storage element 132; the m3 second anode energy storage element pads are welded and connected to the m anode drive pads 354 through m3 first bonding wires to achieve bonding connection with the m anode drive welding points, thereby achieving a one-to-one electrical connection between the m3 anode energy storage elements 132 and the m3 anode drive circuits 131.

[0140] Specifically, the fourth anode driver chip 334 is packaged using ball grid array packaging technology (BGA), and the bottom surface of the fourth anode driver chip 334 is provided with m4 anode driver solder joints; the m4 anode driver solder joints are electrically connected to the m4 anode driver circuits integrated in the fourth anode driver chip 334 in a one-to-one correspondence; the m4 anode driver solder joints are welded on the second board surface 352 of the emission substrate 350, and are electrically connected to the m4 anode driver pads provided on the emission substrate 350 in a one-to-one correspondence (not shown); the emission substrate 350 is also provided with m4 first anode energy storage element solder pads (not shown), and the m4 first anode energy storage element solder pads are electrically connected to the m4 anode energy storage elements 132 in a one-to-one correspondence. ; A fourth pad (not shown) is provided on each common anode terminal bonding point; the m4 first anode energy storage element pads are welded and connected to the m3 anode drive pads through the m4 first printed circuits (not shown) provided on the second board surface 352 on the emission substrate 350, so as to realize the bonding connection with the m4 anode drive welding points, thereby realizing the one-to-one electrical connection between the m4 anode energy storage elements 132 and the m4 anode drive circuits; the m4 first anode energy storage element pads are also welded and connected to the m4 fourth pads 411c through the m4 double-sided second bonding leads, so as to realize the bonding connection with the m4 common anode terminal bonding points, thereby realizing the one-to-one electrical connection between the m4 first anode energy storage elements 132 and the m4 common anode terminals 311a.

[0141] In another optional embodiment, the surfaces of the m4 anode energy storage elements 132 are each provided with a second anode energy storage element pad (not shown); the m4 second anode energy storage element pads are welded and connected to the m4 anode drive pads 354 through m4 first bonding wires to achieve bonding connection with the m4 anode drive welding points, thereby achieving a one-to-one electrical connection between the m4 anode energy storage elements 132 and the m4 anode drive circuits 131.

[0142] Specifically, the third cathode driver chip 343 is packaged using ball grid array packaging technology (BGA), and the bottom surface of the third cathode driver chip 343 is provided with n3 cathode driver solder joints (not shown); the n3 cathode driver solder joints are electrically connected one-to-one with the n3 cathode driver circuits integrated in the third cathode driver chip 343; the n3 cathode driver solder joints are welded on the first board surface 351 of the emission substrate 350, and are electrically connected one-to-one with the n3 cathode driver pads arranged on the first board surface 351 of the emission substrate 350 (not shown); a seventh pad is arranged on each common cathode terminal bonding point. The n cathode driver pads are welded and connected to the n3 seventh pads through n3 single-sided third bonding wires, so as to realize bonding connection with the n3 common cathode terminal bonding points, thereby realizing electrical connection of the n3 cathode driver circuits to the n3 common cathode terminals one-to-one.

[0143] Specifically, the fourth cathode driver chip 344 is packaged using ball grid array packaging technology (BGA), and the bottom surface of the fourth cathode driver chip 344 is provided with n4 cathode driver soldering points (not shown); the n4 cathode driver soldering points are electrically connected to the n4 cathode driver circuits integrated in the fourth cathode driver chip 344 in a one-to-one correspondence; the n4 cathode driver soldering points are welded on the second board surface 352 of the emission substrate 350, and are electrically connected to the n4 cathode driver pads arranged on the second board surface 352 of the emission substrate 350 in a one-to-one correspondence (not shown); a seventh soldering pad is arranged on each common cathode terminal bonding point. The n4 cathode driver pads are welded and connected to the n4 seventh soldering pads through n4 double-sided third bonding wires, so as to realize bonding connection with the n4 common cathode terminal bonding points, thereby realizing electrical connection of the n4 cathode driver circuits to the n4 common cathode terminals in a one-to-one correspondence.

[0144] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification. The above embodiments only express several implementation methods of the present application, and their descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present application, several deformations and improvements can be made, which all belong to the scope of protection of the present application. Therefore, the scope of protection of the patent application of this application shall be based on the attached claims.

Claims

1. A laser emission module, characterized in that: include: The emitting substrate comprises a first panel surface; A light-emitting chip, mounted on the first panel, with a laser array integrated therein; the laser array includes m*n lasers, m and n are respectively the number of rows and columns of the lasers included in the laser array, m and n are both positive integers, and at least one of m and n is greater than 1; in the laser array, the anodes of the lasers located in the same row are electrically connected and lead to a common anode terminal, and the cathodes of the lasers located in the same column are electrically connected and lead to a common cathode terminal; At least one anode driving chip is mounted on the emitting substrate and has m anode driving circuits integrated therein; the m anode driving circuits are electrically connected to the m common anode terminals one by one respectively; At least one cathode driving chip is mounted on the emitting substrate and has n cathode driving circuits integrated therein; the n cathode driving circuits are electrically connected to the n common cathode terminals in a one-to-one correspondence; m anode energy storage elements; the m anode energy storage elements are mounted on the emission substrate, one end of which is electrically connected to the m anode drive circuits one-to-one, and is also electrically connected to the m common anode terminals one-to-one; the other end of the m anode energy storage elements is grounded.

2. The laser emission module according to claim 1, characterized in that: The surface of the light-emitting chip is provided with m common anode terminal bonding points, and the m common anode terminal bonding points are electrically connected to the m common anode terminals in a one-to-one correspondence; the anode driving chip is a bare chip, and the surface of the anode driving chip is provided with m anode driving bonding points; The m anode drive bonding points are electrically connected to the m anode drive circuits in a one-to-one correspondence; The m anode energy storage elements are bonded to the m anode drive bonding points through m first bonding wires to achieve one-to-one electrical connection with the m anode drive circuits; the m anode energy storage circuits are also bonded to the m common anode terminal bonding points through m second bonding wires to achieve one-to-one electrical connection with the m common anode terminals.

3. The laser emission module according to claim 2, characterized in that: The emitting substrate is provided with m first anode energy storage element pads, and the m first anode energy storage element pads are electrically connected to the m anode energy storage elements in a one-to-one correspondence; the m first anode energy storage element pads are bonded to the m anode drive bonding points through m first bonding wires to achieve a one-to-one electrical connection between the m anode energy storage elements and the m anode drive circuits; the m first anode energy storage element pads are also bonded to the m common anode terminal bonding points through m second bonding wires to achieve a one-to-one electrical connection between the m anode energy storage elements and the m common anode terminals.

4. The laser emission module according to claim 3, characterized in that: The first anode energy storage element pads include a second pad and a third pad; the second pad and the third pad are respectively located on both sides of the corresponding anode energy storage element and are electrically connected to the anode energy storage element; the second pad is bonded to the anode drive bonding point through the first bonding wire; the third pad is bonded to the common anode terminal bonding point through the second bonding wire.

5. The laser emission module according to claim 4, characterized in that: A second anode energy storage element pad is provided on the surface of each of the anode energy storage elements, and the second anode energy storage element pad is used to realize the electrical connection between the anode energy storage element and the external circuit; the m second anode energy storage element pads are bonded to the m anode drive bonding points through the m first bonding wires to realize the one-to-one electrical connection between the m anode energy storage elements and the m anode drive circuits; the m second anode energy storage element pads are also bonded to the m common anode terminal bonding points through the m second bonding wires to realize the one-to-one electrical connection between the m anode energy storage elements and the m common anode terminals.

6. The laser emission module according to claim 2, characterized in that: The surface of the light-emitting chip is provided with m common anode terminal bonding points, and the m common anode terminal bonding points are electrically connected to the m common anode terminals in a one-to-one correspondence; the anode driving chip is a chip that has been packaged, and its surface is provided with m anode driving soldering points; the m anode driving soldering points are electrically connected to the m anode driving circuits in a one-to-one correspondence; the m anode driving soldering points are welded on the emission substrate, and are electrically connected to the m anode driving pads arranged on the emission substrate in a one-to-one correspondence; The m anode drive pads are electrically connected to the m anode energy storage elements through m first printed circuits arranged on the emitting substrate, or are bonded to the m anode energy storage elements through m first bonding wires, so as to realize a one-to-one electrical connection between the m anode energy storage elements and the m anode drive circuits; the m anode energy storage circuits are also bonded to the m common anode terminal bonding points through m second bonding wires, so as to realize a one-to-one electrical connection with the m common anode terminals.

7. The laser emission module according to claim 6, characterized in that: The emitting substrate is provided with m first anode energy storage element pads, and the m first anode energy storage element pads are electrically connected to the m anode energy storage elements in a one-to-one correspondence; the m first anode energy storage element pads are electrically connected to the m anode drive pads through m first printed circuits to achieve a one-to-one electrical connection between the m anode energy storage elements and the m anode drive circuits; the m first anode energy storage element pads are also bonded to the m common anode terminal bonding points through m second bonding wires to achieve a one-to-one electrical connection between the m anode energy storage elements and the m common anode terminals.

8. The laser emission module according to claim 7, characterized in that: The first anode energy storage element pads include a second pad and a third pad; the second pad and the third pad are respectively located on both sides of the corresponding anode energy storage elements, and are electrically connected to the corresponding anode energy storage elements; the second pad is electrically connected to the anode drive pad through the first printed circuit; the third pad is bonded to the common anode terminal bonding point through the second bonding wire.

9. The laser emission module according to claim 7, characterized in that: A second anode energy storage element pad is provided on the surface of each of the anode energy storage elements, and the second anode energy storage element pad is used to realize the electrical connection between the anode energy storage element and the external circuit; the m second anode energy storage element pads are connected to the m anode drive welding points through the m first bonding wires to realize the one-to-one electrical connection between the m anode energy storage elements and the m anode drive circuits; the m second anode energy storage element pads are also bonded to the m common anode terminal bonding points through the m second bonding wires to realize the one-to-one electrical connection between the m anode energy storage elements and the m common anode terminals.

10. The laser emission module according to claim 1, characterized in that: The surface of the light-emitting chip is provided with n common cathode terminal bonding points, and the n common cathode terminal bonding points are electrically connected to the n common cathode terminals in a one-to-one correspondence; The cathode drive chip is a bare chip, and n cathode drive bonding points are arranged on its surface; The n cathode driving bonding points are electrically connected to the n cathode driving circuits in a one-to-one correspondence; the n cathode driving bonding points are bonded to the n cathode driving bonding points through n third bonding wires, so as to realize the one-to-one correspondence electrical connection between the n cathode driving circuits and the n common cathode terminals; Or, the cathode drive chip is a packaged chip, and n cathode drive solder joints are arranged on its surface; the n cathode drive solder joints are electrically connected to the n cathode drive circuits in a one-to-one correspondence; the n cathode drive solder joints are welded on the emission substrate, and are electrically connected to the n cathode drive pads arranged on the emission substrate in a one-to-one correspondence; The n cathode driving pads are bonded to the n cathode driving bonding points through n third bonding wires, so as to realize one-to-one electrical connection between the n cathode driving circuits and the n common cathode terminals.

11. The laser emission module according to claim 2 or 6, characterized in that: The anode drive chip and the m anode energy storage elements are all mounted on the first board surface, or, The anode driving chip includes at least one third anode driving chip and at least one fourth anode driving chip; The third anode driving chip is mounted on the first board surface, and has m3 anode driving circuits integrated therein; The fourth anode driving chip is mounted on a second board surface opposite to the first board surface, and has m4 anode driving circuits integrated therein; m3 anode energy storage elements are mounted on the first board surface, and m4 anode energy storage elements are mounted on the second board surface; wherein m3 and m4 are both positive integers, and m3+m4=m, m3≥1, m4≥1.

12. The laser emission module according to claim 1, characterized in that: The cathode driver chip is mounted on the first board surface, or the cathode driver chip includes at least one third cathode driver chip and at least one fourth cathode driver chip; the third cathode driver chip is mounted on the first board surface, and n3 cathode driver circuits are integrated inside; the fourth cathode driver chip is mounted on the second board surface, and n4 cathode driver circuits are integrated inside; wherein n3 and n4 are both positive integers, and n3+n4=n, n3≥1, n4≥1.

13. The laser emission module according to claim 1, characterized in that: The devices included in the anode drive circuit and the devices included in the cathode drive circuit are both silicon-based devices.

14. The laser emission module according to claim 13, characterized in that: The anode drive circuit comprises an anode address switch element, an anode unidirectional conduction element and an anode reverse bias switch element; one end of the anode unidirectional conduction element is connected to the anode address switch element and the anode reverse bias switch element, and the other end is electrically connected to the corresponding common anode terminal; the anode address switch element and the anode reverse bias switch element are in opposite states; when the anode address switch element is turned on, the anode unidirectional conduction element is in a conducting state; When the anode reverse bias switch element is turned on, the anode unidirectional conducting element is in a reverse bias state; the anode site selection switch element, the anode unidirectional conducting element and the anode reverse bias switch element are all silicon-based devices; the m anode site selection switch elements included in the m anode drive circuits are electrically connected to the cathode of a germanium-based diode; the anode of the germanium-based diode is used to receive current to charge the m anode energy storage elements.

15. The laser emission module according to claim 1, characterized in that: Also includes a packaging protection cover and a light-transmitting cover plate; The package protection cover is disposed on the emitting substrate to form a receiving space with the emitting substrate, and the receiving space is used to receive the device mounted on the emitting substrate; The packaging protection cover is provided with a light-transmitting opening corresponding to the light-emitting chip, and the light-transmitting cover plate covers the light-transmitting opening to allow the outgoing laser emitted by the light-emitting chip to emit out of the laser emitting module.

16. The laser emission module according to claim 15, characterized in that: The laser emission module is packaged using ball grid array (BGA) packaging technology, land grid array (LGA) packaging technology, or quad flat no-lead (QFN) packaging technology.

17. A laser distance measuring device, characterized in that: A laser emission module comprising any one of claims 1-16.

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