A mechanism for vacuuming a semiconductor chip packaging mold

Abstract

The application discloses a kind of mechanisms suitable for semiconductor chip packaging mold vacuumizing device, it is related to semiconductor chip packaging vacuum equipment technical field, including vacuum pump and first docking assembly, second docking assembly, vacuum regulating valve, normally closed vacuum electromagnetic valve.The first component of the present application, second component can be realized by being arranged vacuum pump and the pipeline convenient installation and disassembly of semiconductor chip packaging mold, and by self-locking unit automatic reset, the locking of conical plug is realized, the preliminary locking of first docking assembly and second docking assembly can be realized, by the tightening of reinforcing nut, secondary reinforcement can be realized, and when the normally closed vacuum electromagnetic valve is opened when vacuum pump runs and generates negative pressure, the suction force of negative pressure will be generated to the blocking ball, the extrusion force of N type locking block is given when blocking ball moves, so that N type locking block moves and is mutually clamped with clamping ring groove, so effectively improve the security when using device.

Description

Technical Field

[0001] This invention relates to the field of vacuum equipment technology for semiconductor chip packaging, specifically a vacuum pumping device mechanism suitable for semiconductor chip packaging molds. Background Technology

[0002] Semiconductor chips are semiconductor devices that can perform a certain function by etching and wiring on semiconductor wafers. Semiconductor chip packaging is a process that uses (film technology) and (microfabrication technology) to arrange, attach, fix and connect the chip and other elements on a frame or substrate, bring out the terminals and fix them through a plastic insulating medium to form an overall structure.

[0003] Semiconductor chip packaging molds use sealing rings of different specifications and types to construct the mold frame packaging part into a sealed container. Then, a vacuum hole is introduced to achieve vacuuming of the mold frame, reducing the porosity and air bubbles in the product and ensuring the packaging quality of semiconductor chip products.

[0004] The vacuum suction device for semiconductor chip packaging molds generates a vacuum negative pressure through the operation of a vacuum pump. The vacuum negative pressure is transmitted from the inside of the packaging mold through pipelines to perform a vacuuming operation. In addition, by switching and adjusting the vacuum pressure valve and normally closed high vacuum solenoid valve, the output vacuum level can be controlled to meet the requirements of semiconductor chip packaging products.

[0005] Traditionally, the output of a vacuum suction device is connected to a semiconductor chip packaging mold via two stainless steel pipes. The connection between the two pipes is usually secured by flanges. Although the connection is secure, the flanges have a large number of bolts. When disassembling and repairing the vacuum suction device, a significant amount of time is required to disassemble the connection between the vacuum suction device and the semiconductor chip packaging mold. This not only affects the maintenance efficiency of the vacuum suction device but also the connection efficiency between the standby vacuum suction device and the semiconductor chip packaging mold, thus impacting the continuous and stable production of the entire semiconductor chip packaging production line. Summary of the Invention

[0006] The purpose of this invention is to provide a vacuum pumping device mechanism suitable for semiconductor chip packaging molds in order to solve the problem.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a vacuum pumping device mechanism for semiconductor chip packaging molds, comprising a vacuum pump installed inside a housing, a first docking assembly, and a second docking assembly. The vacuum pump is sequentially connected to a vacuum regulating valve and a normally closed vacuum solenoid valve via a vacuum pipeline. A vacuum pressure gauge is connected to one port of the vacuum regulating valve. A vacuum pipeline connected to one end of the normally closed vacuum solenoid valve extends to the outer wall of the housing and connects to the first docking assembly. The second docking assembly is connected to the inner cavity of the semiconductor chip packaging mold via a pipeline. The first docking assembly and the second docking assembly enable convenient installation and disassembly of the pipelines connecting the vacuum pump and the semiconductor chip packaging mold.

[0008] The first docking assembly includes a first connecting pipe, a tapered plug, a cylindrical plug, a telescopic groove, a compression spring, a sealing ball, an L-shaped movable groove, and an N-shaped locking block;

[0009] The first connecting pipe, the tapered connector, and the cylindrical connector are arranged and fixed in sequence along the horizontal direction. The first connecting pipe is fixedly connected to the vacuum pipe. The expansion groove is opened inside the tapered connector and the cylindrical connector. The compression spring and the sealing ball are arranged in sequence along the horizontal direction inside the expansion groove, and one end of the sealing ball protrudes to the outside of the cylindrical connector for sealing the port of the expansion groove.

[0010] The L-shaped movable groove is opened at one end of the cylindrical connector and extends through to the inside of the telescopic groove. The N-shaped locking block is slidably connected to the inside of the L-shaped movable groove, and the two ends of the N-shaped locking block extend to the inside of the telescopic groove and the outside of the cylindrical connector, respectively. The end of the N-shaped locking block inside the telescopic groove is in contact with the surface of the sealing ball.

[0011] The second docking assembly includes a second connecting tube, a docking socket, a snap-fit ​​ring groove, and a self-locking unit;

[0012] The second connecting pipe and the docking socket are horizontally distributed and fixed. The second connecting pipe is connected to the inner cavity of the semiconductor chip packaging mold through a pipe. The inner cavity of the docking socket matches the outer wall trajectory of the tapered plug and the cylindrical plug. The first connecting pipe and the second connecting pipe are docked by inserting the tapered plug and the cylindrical plug into the inner side of the docking socket.

[0013] The snap-fit ​​groove is formed inside the inner cavity channel of the mating socket, and the N-type locking block is located at one end outside the cylindrical connector and is snapped into the inside of the snap-fit ​​groove to realize the connection and locking of the tapered connector, the cylindrical connector and the mating socket.

[0014] The self-locking unit is located on the outside of the second connecting tube and is used to achieve initial locking of the tapered connector.

[0015] As a further embodiment of the present invention: the first docking assembly further includes a first sealing ring groove, the first sealing ring groove being formed at one end of the cylindrical plug, and the first sealing ring groove being distributed on the outside of the L-shaped movable groove;

[0016] The second docking assembly further includes a second sealing ring groove and a sealing ring. The second sealing ring groove is formed at one end of the inner wall of the snap-fit ​​ring groove. The sealing ring is installed inside the second sealing ring groove and protrudes outside the second sealing ring groove and snaps into the inner side of the first sealing ring groove, so as to achieve a seal between the cylindrical plug and the snap-fit ​​ring groove.

[0017] As a further embodiment of the present invention: the self-locking unit includes a movable ring seat, a fixed cross arm, a guide slider, a lifting seat, an inclined guide groove, and a self-locking block;

[0018] The movable ring seat is slidably sleeved on the outside of the second connecting pipe and fits against one end of the outer wall of the docking socket. The fixed cross arm is fixed to the outer wall of the movable ring seat near the docking socket. The lifting seat is slidably connected to the inner side of the fixed cross arm and fits against the outer wall of the docking socket.

[0019] The inclined guide groove is opened inside the lifting seat and passes through both sides of the outer wall of the lifting seat. The guide slider is slidably connected to the inner side of the inclined guide groove, and the two sides protrude to the outer side of the inclined guide groove and are fixedly connected to the fixed cross arm.

[0020] The self-locking block is attached to and fixed to the outer wall of the docking socket away from the moving ring seat. When the conical plug is inserted into the docking socket, the self-locking block is attached to one end of the outer wall of the conical plug to lock the position of the conical plug.

[0021] As a further embodiment of the present invention: the fixed cross arm, lifting seat, guide slider, and self-locking block are provided in multiple quantities and distributed in a ring. The self-locking block has a fan-shaped structure. Multiple self-locking blocks are combined to form a closed ring structure. The inner ring diameter of the ring structure formed by multiple self-locking blocks matches the outer wall diameter of the first connecting pipe and is larger than the outer diameter of the cylindrical plug.

[0022] As a further embodiment of the present invention: the inner side of the end of the plurality of self-locking blocks away from the docking socket has an arc-shaped structure, and the inner side of the plurality of self-locking blocks is fixedly connected with a dustproof film, and the plurality of dustproof films are combined with each other to form a circular structure for sealing the space of the docking socket.

[0023] As a further aspect of the present invention: the self-locking block has a storage groove at one end near the docking socket, and the storage groove is used to provide folding storage space for the dustproof film.

[0024] As a further embodiment of the present invention: the self-locking unit further includes a return spring, the outer wall of the second connecting tube is integrally formed with a fixed threaded ring, the return spring is sleeved on the outer wall of the second connecting tube and located between the movable ring seat and the return spring, the outer side of the fixed threaded ring is threaded with a reinforcing nut, and the reinforcing nut moves to a state of fitting with the outer wall of the movable ring seat to lock the position of the movable ring seat.

[0025] As a further aspect of the present invention: the number of N-type locking blocks is set to a plurality and arranged in a ring. The cross-section of the end of the N-type locking block located outside the cylindrical plug and the snap ring groove is trapezoidal. The end of the N-type locking block near the cylindrical plug and the end face of the snap ring groove facing the opening of the mating socket are both inclined.

[0026] As a further embodiment of the present invention: an enlarged annular hole is provided at the center of one end of the inner wall of the docking socket. The enlarged annular hole is used for the sealing ball and the N-type locking block to enter, so that the N-type locking block can enter the snap ring groove area.

[0027] Compared with the prior art, the beneficial effects of the present invention are:

[0028] By setting the first and second components, convenient installation and disassembly of the pipeline between the vacuum pump and the semiconductor chip packaging mold can be achieved. The self-locking unit automatically resets and locks the tapered connector, achieving initial locking of the first and second docking components. The tightening of the reinforcing nut can achieve secondary reinforcement. At the same time, when the vacuum pump generates negative pressure and the normally closed vacuum solenoid valve opens, the negative pressure will generate suction on the sealing ball. The movement of the sealing ball will exert pressure on the N-type locking block, causing the N-type locking block to move and engage with the locking ring groove, thus effectively improving the safety of the device during use. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of the present invention;

[0030] Figure 2 This is a schematic diagram of the structure of the first docking component and the second docking component of the present invention;

[0031] Figure 3 This is a cross-sectional view of the structure of the first docking assembly of the present invention;

[0032] Figure 4 This is a structural cross-sectional view of the second docking assembly of the present invention;

[0033] Figure 5 This is an exploded cross-sectional view of the second docking assembly of the present invention;

[0034] Figure 6 For the present invention Figure 5 Enlarged view of point A in the middle;

[0035] Figure 7 This is an exploded view of the sealing ring and the second sealing ring groove of the present invention;

[0036] Figure 8 This is a schematic diagram of the self-locking unit of the present invention.

[0037] In the diagram: 1. Vacuum pump; 2. Vacuum pipeline; 3. Vacuum regulating valve; 4. Vacuum pressure gauge; 5. Normally closed vacuum solenoid valve; 6. Housing; 7. First docking assembly; 701. First connecting pipe; 702. Tapered connector; 703. Cylindrical connector; 704. Telescopic groove; 705. Compression spring; 706. Sealing ball; 707. L-shaped movable groove; 708. N-shaped locking block; 709. First sealing ring groove; 8. Second docking assembly; 801. Second connecting pipe; 802. Connecting socket; 803. Snap-fit ​​ring groove; 804. Second sealing ring groove; 805. Sealing ring; 806. Self-locking unit; 8061. Moving ring seat; 8062. Fixed cross arm; 8063. Guide slider; 8064. Lifting seat; 8065. Inclined guide groove; 8066. Self-locking block; 8067. Dustproof film; 8068. Storage groove; 8069. Return spring; 807. Fixed threaded ring; 808. Reinforcing nut; 809. Enlarged ring hole. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this invention, it should be noted that unless otherwise explicitly specified and limited, the terms "installed," "connected," "linked," and "set up" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The following describes embodiments of the invention based on its overall structure.

[0040] Please see Figures 1 to 8 In this embodiment of the invention, a vacuum pump mechanism suitable for semiconductor chip packaging molds includes a vacuum pump 1 installed inside a housing 6, a first docking component 7, and a second docking component 8. The vacuum pump 1 is connected in sequence to a vacuum regulating valve 3 and a normally closed vacuum solenoid valve 5 via a vacuum pipe 2. A vacuum pressure gauge 4 is connected to one port of the vacuum regulating valve 3. The vacuum pipe 2 connected to one end of the normally closed vacuum solenoid valve 5 extends to the outer wall of the housing 6 and is connected to the first docking component 7. The second docking component 8 is connected to the inner cavity of the semiconductor chip packaging mold via a pipe. The first docking component 7 and the second docking component 8 enable convenient installation and disassembly of the pipeline between the vacuum pump 1 and the semiconductor chip packaging mold.

[0041] The first docking assembly 7 includes a first connecting pipe 701, a tapered plug 702, a cylindrical plug 703, a telescopic groove 704, a compression spring 705, a sealing ball 706, an L-shaped movable groove 707, and an N-shaped locking block 708.

[0042] The first connecting pipe 701, the tapered plug 702, and the cylindrical plug 703 are arranged and fixed in sequence along the horizontal direction. The first connecting pipe 701 is fixedly connected to the vacuum pipe 2. The expansion groove 704 is opened inside the tapered plug 702 and the cylindrical plug 703. The compression spring 705 and the sealing ball 706 are arranged in sequence along the horizontal direction inside the expansion groove 704, and one end of the sealing ball 706 protrudes to the outside of the cylindrical plug 703 to seal the port of the expansion groove 704.

[0043] L-shaped movable groove 707 is opened at one end of cylindrical plug 703 and extends through to the inside of telescopic groove 704. N-shaped locking block 708 is slidably connected to the inside of L-shaped movable groove 707 and the two ends of N-shaped locking block 708 extend to the inside of telescopic groove 704 and the outside of cylindrical plug 703, respectively. The end of N-shaped locking block 708 inside telescopic groove 704 is in contact with the surface of sealing ball 706.

[0044] The second docking assembly 8 includes a second connecting pipe 801, a docking socket 802, a snap ring groove 803, and a self-locking unit 806;

[0045] The second connecting pipe 801 and the docking socket 802 are horizontally distributed and fixed. The second connecting pipe 801 is connected to the inner cavity of the semiconductor chip packaging mold through a pipe. The inner cavity of the docking socket 802 matches the outer wall trajectory of the tapered connector 702 and the cylindrical connector 703. The first connecting pipe 701 and the second connecting pipe 801 are docked by inserting the tapered connector 702 and the cylindrical connector 703 into the inner side of the docking socket 802.

[0046] The snap ring groove 803 is opened inside the inner cavity channel of the mating socket 802. The N-type locking block 708 is located at one end outside the cylindrical plug 703 and is inserted into the snap ring groove 803 to realize the connection and locking of the tapered plug 702, the cylindrical plug 703 and the mating socket 802.

[0047] The self-locking unit 806 is located on the outside of the second connecting pipe 801 and is used to achieve initial locking of the tapered connector 702.

[0048] The first docking assembly 7 also includes a first sealing ring groove 709, which is formed at one end of the cylindrical plug 703 and is distributed on the outside of the L-shaped movable groove 707.

[0049] The second docking assembly 8 also includes a second sealing ring groove 804 and a sealing ring 805. The second sealing ring groove 804 is formed at one end of the inner wall of the snap-fit ​​ring groove 803. The sealing ring 805 is installed inside the second sealing ring groove 804 and protrudes to the outside of the second sealing ring groove 804 and snaps into the inside of the first sealing ring groove 709, so as to achieve a seal between the cylindrical plug 703 and the snap-fit ​​ring groove 803.

[0050] An enlarged annular hole 809 is provided at the center of one end of the inner wall of the mating socket 802. The enlarged annular hole 809 is used to allow the sealing ball 706 and the N-type locking block 708 to enter, so that the N-type locking block 708 can enter the area of ​​the snap ring groove 803.

[0051] In this embodiment, it should be noted that the bottom of the housing 6 is equipped with casters for easy movement of the vacuum suction device. The first docking component 7 and the second docking component 8 are pre-connected to the vacuum pipe 2 and the pipeline of the semiconductor chip packaging mold, respectively.

[0052] When it is necessary to connect the vacuum pump 1 to the pipeline of the semiconductor chip packaging mold, simply push the entire vacuum suction device close to the second docking component 8, so that the cylindrical connector 703 and the conical connector 702 on the first docking component 7 are inserted into the docking socket 802. Through the mutual compression of the conical connector 702 and the conical cavity inside the docking socket 802, the cylindrical connector 703 and the docking socket 802 can be automatically aligned. Finally, the sealing ball 706 and the N-type locking block 708 located outside the cylindrical connector 703 enter the enlarged ring hole 809, and the end of the N-type locking block 708 is aligned with the snap ring groove 803.

[0053] During this process, the tapered connector 702 will compress the self-locking unit 806 to deform. When the tapered connector 702 is fully inserted into the docking socket 802, the self-locking unit 806 automatically resets to lock the tapered connector 702, thus completing the convenient docking and self-locking of the first docking component 7 and the second docking component 8.

[0054] When the vacuum pump 1 generates negative pressure and the normally closed vacuum solenoid valve 5 opens, the negative pressure will generate suction on the sealing ball 706. This suction will draw the sealing ball 706 into the telescopic groove 704. The sealing ball 706 will further compress the compression spring 705, and at the same time, make the end of the telescopic groove 704 open (it should be noted that the inner diameter of the telescopic groove 704 is slightly larger than the outer diameter of the sealing ball 706, thus ensuring the air passage is open). At the same time, the movement of the sealing ball 706 will give the N-type locking block 708 a compressive force, causing the N-type locking block 708 to expand outward along the trajectory of the L-type movable groove 707. The end of the N-type locking block 708 that is aligned with the snap ring groove 803 will be inserted into the snap ring groove 803. The N-type locking block 708 and the snap ring groove 803 snap together, so that the first docking assembly 7 and the second docking assembly 8 cannot be separated in this state, thereby effectively improving the safety of the device during use.

[0055] When the normally closed vacuum solenoid valve 5 is closed, the negative pressure adsorbed by the sealing ball 706 disappears. At this time, the sealing ball 706 is reset under the pushing force of the compression spring 705, thus releasing the pressure on the N-type locking block 708. At this time, it is only necessary to pull the first docking component 7 to separate it from the second docking component 8, making the separation operation of the first docking component 7 and the second docking component 8 simple and convenient.

[0056] It should also be noted that when the first docking component 7 and the second docking component 8 are docked, the sealing ring 805 is engaged inside the first sealing ring groove 709 and the second sealing ring groove 804, which can ensure good sealing between the first docking component 7 and the second docking component 8.

[0057] Please refer to this carefully. Figures 2 to 8 The self-locking unit 806 includes a movable ring seat 8061, a fixed cross arm 8062, a guide slider 8063, a lifting seat 8064, an inclined guide groove 8065, and a self-locking block 8066.

[0058] The movable ring seat 8061 is slidably sleeved on the outside of the second connecting pipe 801 and fits against one end of the outer wall of the docking socket 802. The fixed cross arm 8062 is fixed to the outer wall of the movable ring seat 8061 near the docking socket 802. The lifting seat 8064 is slidably connected to the inner side of the fixed cross arm 8062 and fits against the outer wall of the docking socket 802.

[0059] An inclined guide groove 8065 is formed inside the lifting seat 8064 and extends through both sides of the outer wall of the lifting seat 8064. A guide slider 8063 is slidably connected to the inner side of the inclined guide groove 8065, and both sides of the guide slider 8063 protrude to the outer side of the inclined guide groove 8065 and are fixedly connected to the fixed cross arm 8062.

[0060] The self-locking block 8066 is attached to the outer wall of the end of the docking socket 802 away from the moving ring seat 8061 and fixed to the lifting seat 8064. When the conical plug 702 is inserted into the docking socket 802, the self-locking block 8066 is attached to the outer wall of the conical plug 702 to lock the position of the conical plug 702.

[0061] The fixed cross arm 8062, lifting seat 8064, guide slider 8063, and self-locking block 8066 are arranged in multiple ways and distributed in a ring. The self-locking block 8066 has a fan-shaped structure. Multiple self-locking blocks 8066 are combined to form a closed ring structure. The inner diameter of the ring structure formed by multiple self-locking blocks 8066 matches the outer diameter of the first connecting pipe 701 and is larger than the outer diameter of the cylindrical plug 703.

[0062] The self-locking unit 806 also includes a return spring 8069. The outer wall of the second connecting tube 801 is integrally formed with a fixed threaded ring 807. The return spring 8069 is sleeved on the outer wall of the second connecting tube 801 and is located between the moving ring seat 8061 and the return spring 8069. The outer side of the fixed threaded ring 807 is threaded with a reinforcing nut 808. The reinforcing nut 808 moves to a state of contact with the outer wall of the moving ring seat 8061 to lock the position of the moving ring seat 8061.

[0063] In this embodiment: when the first docking component 7 and the second docking component 8 are docking, when the tapered plug 702 contacts the self-locking block 8066, it will give the self-locking block 8066 a pushing force. This pushing force causes multiple self-locking blocks 8066 to move outward, so that the tapered plug 702 can continue to move towards the docking socket 802. At the same time, the movement of the self-locking block 8066 pushes the lifting seat 8064 to move. The lifting seat 8064 can push the fixed cross arm 8062 and the moving ring seat 8061 to move horizontally through the cooperation of the inclined guide groove 8065 and the guide slider 8063. The moving ring seat 8061 moves away from the docking socket 802 and squeezes the return spring 8069 to retract.

[0064] When the conical connector 702 is fully inserted into the docking socket 802, the conical connector 702 is not in contact with the self-locking block 8066. At this time, the self-locking block 8066 loses its compression, and the elastic force of the return spring 8069 will push the moving ring seat 8061 and the fixed cross arm 8062 to reset. The multiple self-locking blocks 8066 will reset and retract inward. Finally, the multiple self-locking blocks 8066 will wrap around the outside of the first connecting tube 701 and fit against the end face of the conical connector 702. In this way, the conical connector 702 is fixed inside the docking socket 802, realizing the initial locking of the first docking component 7 and the second docking component 8.

[0065] Then rotate the reinforcing nut 808 to move it toward the moving ring seat 8061. Finally, the reinforcing nut 808 is pressed onto one end of the moving ring seat 8061, thus fixing the position of the moving ring seat 8061 and thus reinforcing the connection between the first docking component 7 and the second docking component 8.

[0066] To disassemble the first docking assembly 7 and the second docking assembly 8, simply loosen the reinforcing nut 808 to separate it from the movable ring seat 8061, then pull the movable ring seat 8061. This will cause the multiple self-locking blocks 8066 to expand outward and release the restriction on the conical connector 702. Finally, pull the first docking assembly 7 away from the second docking assembly 8. The operation is simple and convenient.

[0067] Please refer to this carefully. Figures 2 to 5 as well as Figure 8 Multiple self-locking blocks 8066 have an arc-shaped inner side at the end away from the docking socket 802, and a dustproof film 8067 is fixedly connected to the inner side of the multiple self-locking blocks 8066. The multiple dustproof films 8067 are combined to form a circular structure, which is used to seal the space of the docking socket 802.

[0068] The self-locking latch 8066 has a storage groove 8068 at one end near the docking socket 802. The storage groove 8068 is used to provide folding storage space for the dustproof film 8067.

[0069] In this embodiment: when the first docking component 7 and the second docking component 8 are not docked, their multiple self-locking blocks 8066 and dustproof film 8067 are combined to form a closed disc structure, which can seal the opening end of the docking socket 802, so that external dust cannot enter the interior of the docking socket 802, thus achieving dustproof operation.

[0070] When the first docking component 7 docks with the second docking component 8, its cylindrical connector 703 will contact the dustproof film 8067, causing the dustproof film 8067 to deform and bend, thus not obstructing the insertion of the cylindrical connector 703. When the self-locking block 8066 resets and moves down to limit the conical connector 702, its dustproof film 8067 will be further bent and stored inside the storage groove 8068, so that the dustproof film 8067 will not affect the limiting operation of the self-locking block 8066 on the conical connector 702.

[0071] Please refer to this carefully. Figures 2 to 7 The number of N-type locking blocks 708 is set in a ring and distributed in a ring. The end of the N-type locking block 708 located outside the cylindrical plug 703 and the cross-section of the snap ring groove 803 are both trapezoidal. The end of the N-type locking block 708 near the cylindrical plug 703 and the end face of the snap ring groove 803 facing the opening of the mating socket 802 are both inclined.

[0072] In this embodiment: the inclined structure of the end of the N-type locking block 708 and the snap ring groove 803 makes it possible that when the first docking component 7 and the second docking component 8 are pulled apart, the two inclined surfaces squeeze each other, so that the N-type locking block 708 is compressed by force and does not affect the separation of the first docking component 7 and the second docking component 8.

[0073] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A vacuum pump mechanism for semiconductor chip packaging molds, comprising a vacuum pump (1) installed inside a housing (6), a first docking assembly (7), and a second docking assembly (8), wherein the vacuum pump (1) is sequentially connected to a vacuum regulating valve (3) and a normally closed vacuum solenoid valve (5) via a vacuum pipe (2), and a vacuum pressure gauge (4) is connected to one port of the vacuum regulating valve (3); the vacuum pipe (2) connected to one end of the normally closed vacuum solenoid valve (5) extends to the outer wall of the housing (6) and is connected to the first docking assembly (7); the second docking assembly (8) is connected to the inner cavity of the semiconductor chip packaging mold via a pipe, characterized in that, The first docking component (7) and the second docking component (8) enable convenient installation and disassembly of the pipeline between the vacuum pump (1) and the semiconductor chip packaging mold; The first docking assembly (7) includes a first connecting pipe (701), a tapered plug (702), a cylindrical plug (703), a telescopic groove (704), a compression spring (705), a sealing ball (706), an L-shaped movable groove (707), and an N-shaped locking block (708). The first connecting pipe (701), the tapered connector (702), and the cylindrical connector (703) are arranged and fixed in sequence along the horizontal direction. The first connecting pipe (701) is fixedly connected to the vacuum pipe (2). The expansion groove (704) is opened inside the tapered connector (702) and the cylindrical connector (703). The compression spring (705) and the sealing ball (706) are arranged in sequence along the horizontal direction inside the expansion groove (704). One end of the sealing ball (706) protrudes to the outside of the cylindrical connector (703) to seal the port of the expansion groove (704). The L-shaped movable groove (707) is opened at one end of the cylindrical plug (703) and extends through to the inside of the telescopic groove (704). The N-shaped locking block (708) is slidably connected to the inside of the L-shaped movable groove (707), and the two ends of the N-shaped locking block (708) extend to the inside of the telescopic groove (704) and the outside of the cylindrical plug (703), respectively. The end of the N-shaped locking block (708) located inside the telescopic groove (704) is in contact with the surface of the sealing ball (706). The second docking assembly (8) includes a second connecting pipe (801), a docking socket (802), a snap ring groove (803), and a self-locking unit (806); The second connecting tube (801) and the docking socket (802) are horizontally distributed and fixed. The second connecting tube (801) is connected to the inner cavity of the semiconductor chip packaging mold through a pipe. The inner cavity of the docking socket (802) matches the outer wall trajectory of the tapered connector (702) and the cylindrical connector (703). The first connecting tube (701) and the second connecting tube (801) are docked by inserting the tapered connector (702) and the cylindrical connector (703) into the inner side of the docking socket (802). The snap-fit ​​groove (803) is opened inside the inner cavity channel of the docking socket (802), and the N-type locking block (708) is located outside the cylindrical plug (703) and its end is inserted into the snap-fit ​​groove (803) to realize the connection and locking of the tapered plug (702), the cylindrical plug (703) and the docking socket (802); The self-locking unit (806) is located on the outside of the second connecting tube (801) and is used to achieve initial locking of the tapered connector (702).

2. The vacuum pumping mechanism for semiconductor chip packaging molds according to claim 1, characterized in that, The first docking assembly (7) further includes a first sealing ring groove (709), which is opened at one end of the cylindrical plug (703) and is distributed on the outside of the L-shaped movable groove (707). The second docking assembly (8) further includes a second sealing ring groove (804) and a sealing ring (805). The second sealing ring groove (804) is opened at one end of the inner wall of the snap-fit ​​ring groove (803). The sealing ring (805) is installed inside the second sealing ring groove (804). The sealing ring (805) protrudes to the outside of the second sealing ring groove (804) and snaps into the inside of the first sealing ring groove (709) to achieve a seal between the cylindrical plug (703) and the snap-fit ​​ring groove (803).

3. The vacuum pumping mechanism for semiconductor chip packaging molds according to claim 1, characterized in that, The self-locking unit (806) includes a movable ring seat (8061), a fixed cross arm (8062), a guide slider (8063), a lifting seat (8064), an inclined guide groove (8065), and a self-locking block (8066). The movable ring seat (8061) is slidably sleeved on the outside of the second connecting pipe (801) and fits against one end of the outer wall of the docking socket (802). The fixed cross arm (8062) is fixed to the outer wall of the movable ring seat (8061) near the docking socket (802). The lifting seat (8064) is slidably connected to the inner side of the fixed cross arm (8062) and fits against the outer wall of the docking socket (802). The inclined guide groove (8065) ​​is opened inside the lifting seat (8064) and passes through both sides of the outer wall of the lifting seat (8064). The guide slider (8063) is slidably connected to the inside of the inclined guide groove (8065), and the two sides of the guide slider (8063) protrude to the outside of the inclined guide groove (8065) ​​and are fixedly connected to the fixed cross arm (8062). The self-locking block (8066) is attached to the outer wall of the end of the docking socket (802) away from the moving ring seat (8061) and fixed to the lifting seat (8064). When the conical plug (702) is inserted into the docking socket (802), the self-locking block (8066) is attached to the outer wall of the conical plug (702) to lock the position of the conical plug (702).

4. The vacuum pumping mechanism for semiconductor chip packaging molds according to claim 3, characterized in that, The fixed cross arm (8062), lifting seat (8064), guide slider (8063), and self-locking block (8066) are provided in multiple quantities and distributed in a ring. The self-locking block (8066) has a fan-shaped structure. Multiple self-locking blocks (8066) are combined to form a closed ring structure. The inner ring diameter of the ring structure formed by multiple self-locking blocks (8066) matches the outer wall diameter of the first connecting pipe (701) and is larger than the outer diameter of the cylindrical plug (703).

5. The vacuum pumping mechanism for semiconductor chip packaging molds according to claim 4, characterized in that, The inner side of the end of the multiple self-locking blocks (8066) away from the docking socket (802) has an arc-shaped structure, and the inner side of the multiple self-locking blocks (8066) is fixedly connected with a dustproof film (8067). The multiple dustproof films (8067) are combined to form a circular structure, which is used to seal the space of the docking socket (802).

6. The vacuum pumping mechanism for semiconductor chip packaging molds according to claim 5, characterized in that, The self-locking block (8066) has a storage groove (8068) at one end near the docking socket (802), which is used to provide folding storage space for the dustproof film (8067).

7. The vacuum pumping mechanism for semiconductor chip packaging molds according to claim 3, characterized in that, The self-locking unit (806) also includes a return spring (8069). The outer wall of the second connecting tube (801) is integrally formed with a fixed threaded ring (807). The return spring (8069) is sleeved on the outer wall of the second connecting tube (801) and located between the movable ring seat (8061) and the return spring (8069). The outer side of the fixed threaded ring (807) is threaded with a reinforcing nut (808). The reinforcing nut (808) moves to a state of contact with the outer wall of the movable ring seat (8061) to lock the position of the movable ring seat (8061).

8. The vacuum pumping mechanism for semiconductor chip packaging molds according to claim 1, characterized in that, The number of N-type locking blocks (708) is set to a plurality and arranged in a ring. The ends of the N-type locking blocks (708) located outside the cylindrical plug (703) and the cross-section of the snap ring groove (803) are both trapezoidal. The end of the N-type locking block (708) near the cylindrical plug (703) and the end face of the snap ring groove (803) facing the opening of the mating socket (802) are both inclined.

9. The vacuum pumping mechanism for semiconductor chip packaging molds according to claim 1, characterized in that, An enlarged annular hole (809) is provided at the center of one end of the inner wall of the docking socket (802). The enlarged annular hole (809) is used to allow the sealing ball (706) and the N-type locking block (708) to enter, so that the N-type locking block (708) can enter the snap ring groove (803) area.

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