Display module and display device

Abstract

A display module and a display device. The display module comprises a display panel, a first circuit board and a shielding tape arranged in sequence in a first direction, the first direction being perpendicular to the display panel; a projection of the first circuit board on a first plane is arranged to at least partially not overlap with a projection of the display panel on the first plane, and a projection of the shielding tape on the first plane at least partially overlaps with the projection of the first circuit board on the first plane, the first plane being parallel to the display panel. The display device comprises the above display module. According to the present disclosure, the first circuit board is extended out of the range of the display panel, and the shielding tape is combined, so that the first circuit board and the shielding tape are partially externalized relative to the display panel, the ESD resistance, the EMI resistance and the heat dissipation capacity are improved, and the safety performance of the display module is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to, but is not limited to, the field of display devices, and in particular, to a display module and a display device. BACKGROUND

[0002] Organic Light Emitting Diode (OLED) and Quantum-dot Light Emitting Diodes (QLED) are active light-emitting display devices, which have the advantages of self-emission, wide viewing angle, high contrast, low power consumption, extremely high response speed, thinness, flexibility, and low cost. With the continuous development of display technology, flexible display devices using OLED or QLED as light-emitting devices and controlled by Thin Film Transistors (TFT) have become the mainstream products in the current display field. OLED display devices are increasingly popular in many intelligent cabin entertainment displays, such as aviation, high-speed rail, cruise ships, and vehicle-mounted fields.

[0003] Intelligent cabins have increasingly high requirements for safety performance, such as FFA (Free Fatty Acids Collision Test) collision, flame retardation, heat dissipation, and EMI (Electromagnetic Interference Test) testing. Current OLED display devices are difficult to perfectly cope with these requirements, and intelligent cabins also have high space limitations for OLED display devices. SUMMARY

[0004] The following is a summary of the subject matter of the detailed description herein. This summary is not intended to limit the scope of the claims.

[0005] The technical problem to be solved by the present disclosure is to provide a display module and a display device, which can improve the safety performance of the display module by partially externalizing the first circuit board and the shielding tape relative to the display panel.

[0006] At least one embodiment of the present disclosure provides a display module, comprising a display panel, a first circuit board, and a shielding tape arranged in sequence in a first direction, wherein the first direction is perpendicular to the display panel.

[0007] A projection of the first circuit board on a first plane is arranged to be at least partially non-overlapping with a projection of the display panel on the first plane, and a projection of the shielding tape on the first plane at least partially overlaps with the projection of the first circuit board on the first plane, wherein the first plane is parallel to the display panel.

[0008] In some example embodiments, the display panel comprises a display part, a bending part and a binding part, one end of the bending part is connected to one end of the display part in a second direction, the second direction is arranged parallel to one direction in the first plane, the other end of the bending part is folded to the backlight side of the display part and connected to the binding part;

[0009] The first circuit board comprises an integral main board part and an extension part, the main board part is located on the backlight side of the display part, the orthographic projection of the main board part on the first plane is located within the orthographic projection of the display part on the first plane;

[0010] One end of the extension part is connected to the edge of the main board part, the other end of the extension part extends to the side with the binding part, the orthographic projection of the extension part on the first plane is arranged to at least partially not overlap with the orthographic projection of the display part on the first plane, and the orthographic projection of the extension part on the first plane at least partially overlaps with the orthographic projection of the shielding tape on the first plane.

[0011] In some example embodiments, the extension part is provided with a first device, the orthographic projection of the first device on the first plane does not overlap with the orthographic projection of the display panel on the first plane.

[0012] In some example embodiments, the extension part extends along the second direction, one end of the extension part is connected to the edge of the main board part close to the binding part in the second direction;

[0013] The orthographic projection of the first circuit board on the first plane is arranged not to overlap with the orthographic projection of the binding part on the first plane.

[0014] In some example embodiments, the shielding tape comprises a first shielding part, the orthographic projection of the first circuit board on the first plane is located within the orthographic projection of the first shielding part on the first plane, the outer contour of the first shielding part is arranged to match the outer contour of the first circuit board, and the first shielding part wraps the edge of the first circuit board;

[0015] The area of the orthographic projection of the first shielding part on the first plane is S1, and the area of the orthographic projection of the first circuit board on the first plane is S2, wherein S1≥105%×S2.

[0016] In some example embodiments, the extension part is provided with a first copper leakage area on the side end face facing away from the display part, the orthographic projection of the first copper leakage area on the first plane does not overlap with the orthographic projection of the display panel on the first plane;

[0017] The shielding tape is provided with a first through hole penetrating the shielding tape in the first direction and filled with a heat-conducting silicone grease for heat dissipation, and a first copper-leaking area whose orthogonal projection on the first plane is located within the orthogonal projection on the first plane of the first through hole.

[0018] In some example embodiments, the extension part is provided with a second copper-leaking area on a side end surface facing the display part, the orthogonal projection on the first plane of the second copper-leaking area does not overlap with the orthogonal projection on the first plane of the display panel, and the second copper-leaking area is covered with a first heat-conducting glue for heat dissipation.

[0019] In some example embodiments, the extension part is provided with a first copper-leaking area on a side end surface facing away from the display part, the orthogonal projection on the first plane of the first copper-leaking area does not overlap with the orthogonal projection on the first plane of the display panel, and the shielding tape is arranged to cover the first copper-leaking area.

[0020] The extension part is provided with a first heat-conducting glue on a side end surface facing the display part, and the first heat-conducting glue is arranged corresponding to the first copper-leaking area in the first direction.

[0021] The material of the first heat-conducting glue comprises a composite glue material, the thickness of the first heat-conducting glue is not less than 1 mm, and the first heat-conducting glue is arranged in a hollow structure.

[0022] In some example embodiments, a support layer and a flexible circuit board are further included, the support layer is located between the display part and the first circuit board, and the flexible circuit board is arranged to be bound with the binding part and the main board part, respectively.

[0023] The orthogonal projection on the first plane of the flexible circuit board and the binding part are both located within the orthogonal projection on the first plane of the shielding tape.

[0024] In some example embodiments, a first glue layer is further included, and the first circuit board is arranged to be bonded with the support layer through the first glue layer.

[0025] The first glue layer comprises a double-sided foam adhesive tape, the thickness of the double-sided foam adhesive tape is not less than 0.2 mm, or the material of the first glue layer comprises graphite.

[0026] In some example embodiments, a second device is arranged on the main board part, a second through hole is arranged on the double-sided foam adhesive tape, and the orthogonal projection on the first plane of the second device is located within the orthogonal projection on the first plane of the second through hole.

[0027] In some exemplary embodiments, a second adhesive layer is also included, through which the shielding tape is bonded to the support layer, and the second adhesive layer is located in the gap between the first circuit board and the bonding portion.

[0028] At least one embodiment of this disclosure provides a display device including the display module described above.

[0029] In some exemplary embodiments, a housing is also included, on which the display module is mounted;

[0030] The extension has a first copper leakage area on the side face away from the display part. The orthographic projection of the first copper leakage area on the first plane does not overlap with the orthographic projection of the display panel on the first plane. The first copper leakage area is bonded to the housing by thermal grease.

[0031] And / or, the extension has a second copper leakage area on the side facing the display unit, the orthographic projection of the second copper leakage area on the first plane does not overlap with the orthographic projection of the display panel on the first plane, and the second copper leakage area is bonded to the housing by a first thermally conductive adhesive.

[0032] Other features and advantages of this application will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the application. Other advantages of this application can be realized and obtained by means of the solutions described in the description and the accompanying drawings. Attached Figure Description

[0033] The accompanying drawings are used to provide an understanding of the technical solutions of this application and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application.

[0034] Figure 1 This is a schematic diagram of a display module according to an exemplary embodiment of the present invention;

[0035] Figure 2 for Figure 1 First mounting diagram of the first circuit board in the middle;

[0036] Figure 3 for Figure 1 A schematic diagram of the cross-section of the display module in the image;

[0037] Figure 4 for Figure 1 A second mounting diagram of the first circuit board in the diagram;

[0038] Figure 5 for Figure 4 A schematic diagram of the first circuit board in the diagram;

[0039] Figure 6 is a projection view of the first circuit board in Figure 4 ;

[0040] Figure 7 is a third mounting view of the first circuit board in Figure 1 ;

[0041] Figure 8 is a shielding tape in Figure 1 ;

[0042] Figure 9 is a shielding tape and the first circuit board in Figure 1 ;

[0043] Figure 10 is an orthographic projection view of the shielding tape in Figure 8 ;

[0044] Figure 11 is an A-A cross-sectional view in Figure 1 ;

[0045] Figure 12 is another display module cross-sectional view of the present exemplary embodiment;

[0046] Figure 13 is a fourth mounting view of the first circuit board in Figure 1 ;

[0047] Figure 14 is yet another display module cross-sectional view of the present exemplary embodiment;

[0048] Figure 15 is another display module cross-sectional view of the present exemplary embodiment;

[0049] Figure 16 is another display module cross-sectional view of the present exemplary embodiment;

[0050] Figure 17 is a fifth mounting view of the first circuit board in Figure 1 ;

[0051] Figure 18 is a sixth mounting view of the first circuit board in Figure 1 ;

[0052] Figure 19 is a B-B cross-sectional view in Figure 1 ;

[0053] Figure 20 is another display module cross-sectional view of the present exemplary embodiment;

[0054] Figure 21FIG. 1 is a schematic view of a display device according to an exemplary embodiment of the present disclosure.

[0055] BRIEF DESCRIPTION OF DRAWINGS

[0056] 1 - composite layer; 2 - display panel; 3 - support layer;

[0057] 4 - first circuit board; 5 - flexible circuit board; 6 - shielding tape;

[0058] 7 - first plane; 8 - display part; 9 - bending part;

[0059] 10 - binding part; 11 - main board part; 12 - extension part;

[0060] 13 - cover plate; 14 - first transparent adhesive layer; 15 - touch layer;

[0061] 16 - second transparent adhesive layer; 17 - polarizing layer; 18 - back film layer;

[0062] 19 - adhesive layer; 20 - gasket; 21 - third device;

[0063] 22 - first projection; 23 - light-out side; 24 - back light side;

[0064] 25 - first device; 26 - first shielding part; 27 - second shielding part;

[0065] 28 - first through hole; 29 - heat-conductive silicone grease; 30 - flange;

[0066] 31 - first copper layer; 32 - first heat-conductive adhesive; 34 - first gap;

[0067] 35 - third through hole; 36 - hollow structure; 37 - first adhesive layer;

[0068] 38 - second device; 39 - second through hole; 40 - second adhesive layer;

[0069] 41 - chip on film; 42 - housing; 43 - second projection;

[0070] 44 - third projection. DETAILED DESCRIPTION

[0071] In order to make the objects, technical solutions and advantages of the present disclosure clearer, the following will be used to specifically explain the embodiments of the present disclosure with reference to the drawings. It should be noted that the embodiments can be implemented in a variety of different forms. Those skilled in the art can easily understand that the modes and contents can be changed into various forms without departing from the spirit and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. The embodiments in the present disclosure and the features in the embodiments can be combined with each other arbitrarily without conflict.

[0072] The proportions of the drawings in the present disclosure can be used as a reference in the actual process, but are not limited thereto. For example, the width-length ratio of the channel, the thickness and spacing of each film layer, and the width and spacing of each signal line can be adjusted according to actual needs. The number of pixels in the display module and the number of sub-pixels in each pixel are also not limited to the number shown in the drawings. The drawings described in the present disclosure are only schematic structural diagrams, and one embodiment of the present disclosure is not limited to the shapes or values shown in the drawings.

[0073] In the present specification, ordinal numbers such as "first", "second", "third", and the like are provided to avoid confusion of components, and are not intended to be limited in terms of quantity.

[0074] In the present specification, for the convenience of explanation, words indicating the orientation or positional relationship such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like are used to explain the positional relationship of the components with reference to the drawings, and are only for the convenience of describing the present specification and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure. The positional relationship of the components is appropriately changed according to the direction of describing each component. Therefore, it is not limited to the words described in the specification, and can be appropriately changed according to the situation.

[0075] In the present specification, unless specifically defined and limited otherwise, the terms "mount", "connected", "connection" should be interpreted broadly. For example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate piece, or the communication inside two elements. Those skilled in the art can understand the specific meaning of the above terms in the present disclosure according to the specific circumstances.

[0076] In this specification, a transistor means an element including at least three terminals of a gate electrode, a drain electrode, and a source electrode. The transistor has a channel region between the drain electrode (a drain electrode terminal, a drain region, or a drain electrode) and the source electrode (a source electrode terminal, a source region, or a source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that, in this specification, the channel region means a region where current flows mainly.

[0077] In this specification, the first terminal can be a drain electrode and the second terminal can be a source electrode, or the first terminal can be a source electrode and the second terminal can be a drain electrode. In the case of using a transistor having opposite polarity or in the case where the direction of current flow is changed in circuit operation, the functions of the "source electrode" and the "drain electrode" are sometimes interchanged with each other. Thus, in this specification, the "source electrode" and the "drain electrode" can be interchanged with each other, and the "source terminal" and the "drain terminal" can be interchanged with each other.

[0078] In this specification, "electrically connected" includes the case where components are connected through an element having some function of electricity. The element having some function of electricity is not particularly limited as long as electric signals can be transmitted and received between components to be connected. Examples of the element having some function of electricity include not only an electrode and a wiring but also a switching element such as a transistor, a resistor, an inductor, a capacitor, and another element having some function.

[0079] In this specification, "parallel" means a state where the angle formed between two straight lines is greater than or equal to -10° and less than or equal to 10°, and thus a state where the angle is greater than or equal to -5° and less than or equal to 5° is also included. In addition, "perpendicular" means a state where the angle formed between two straight lines is greater than or equal to 80° and less than or equal to 100°, and thus a state where the angle is greater than or equal to 85° and less than or equal to 95° is also included.

[0080] In this specification, a "film" and a "layer" can be interchanged with each other. For example, a "conductive layer" can be replaced with a "conductive film". Similarly, an "insulating film" can be replaced with an "insulating layer".

[0081] In this specification, a triangle, a rectangle, a trapezoid, a pentagon, or a hexagon is not strictly a triangle, a rectangle, a trapezoid, a pentagon, or a hexagon, and can be an approximately triangle, a rectangle, a trapezoid, a pentagon, or a hexagon. There can be some small deformation due to a tolerance, a rounded corner, a rounded side, or deformation.

[0082] In this specification, "about" means that a value is not strictly limited to a certain limit, and a value within a range of a process and measurement error is allowed.

[0083] Currently, flexible OLED displays are used in various smart cockpit entertainment displays, such as in aviation, high-speed rail, cruise ships, and automobiles. However, at present, flexible OLED displays cannot meet the safety requirements of smart cockpits, specifically meeting FFA (Fall Facing Away) tests, flame retardancy tests, heat dissipation tests, EMI (Electro-Static Discharge) tests, and ESD (Electro-Static Discharge) tests. Furthermore, smart cockpits impose significant space constraints on flexible OLED displays.

[0084] Figure 1 This is a schematic diagram of a display module according to an exemplary embodiment. Figure 2 for Figure 1 A first mounting diagram of the first circuit board in the diagram. Figure 3 for Figure 1 The schematic diagram of the cross-section of the display module in this disclosure shows that an embodiment of the display module is provided, such as... Figures 1 to 3 As shown, the display module may include a display panel 2, a first circuit board 4, and a shielding strip 6 arranged sequentially in a first direction, perpendicular to the display panel 2. At least a portion of the orthographic projection of the first circuit board 4 onto a first plane 7 does not overlap with the orthographic projection of the display panel 2 onto the first plane 7. The orthographic projection of the shielding strip 6 onto the first plane 7 at least partially overlaps with the orthographic projection of the first circuit board 4 onto the first plane 7. The first plane 7 is parallel to the display panel 2. Therefore, by extending the first circuit board 4 beyond the range of the display panel 2 and combining it with the shielding strip 6, the display module of this example achieves partial externalization of the first circuit board 4 and the shielding strip 6 relative to the display panel 2, thereby improving ESD resistance, EMI resistance, and heat dissipation, thus enhancing the safety performance of the display module.

[0085] In some exemplary embodiments, such as Figure 2 and Figure 3As shown, the display panel 2 can include a display part 8, a bending part 9 and a binding part 10 connected in sequence, wherein the display part 8, the bending part 9 and the binding part 10 can be an integral piece, the display part 8 can be flat, the display part 8 can have a light-emitting side 23 and a backlight side 24, and after the display part 8 is lighted, the light-emitting side 23 emits light to display text or images. One end of the bending part 9 is connected to one end of the display part 8 in a second direction parallel to one direction in the first plane 7, the bending part 9 can be of flexible material, the bending part 9 can be bent, and the bending part 9 can have metal traces and the like thereon. The bending part 9 can be laid flat on a production device during production, and the bending part 9 can be folded to the backlight side 24 of the display part 8 during installation, so that the bending part 9 is in a curved state and remains in the curved state, and in the curved state, the bending part 9 forms a nearly semicircular shape. The binding part 10 is on the backlight side 24 of the display part 8, the binding part 10 is parallel to the display part 8, and the binding part 10 has a chip-on-panel (COP) area and a driver integrated circuit (D-IC) area.

[0086] In some example embodiments, as shown in Figure 2 and Figure 3 The binding part 10 and the display part 8 are spaced apart in a first direction, and the binding part 10 is parallel to the display part 8. The backlight side 24 of the display part 8 further has a back film layer 18, an adhesive layer 19 and a support layer 3 stacked in sequence in the first direction, the back film layer 18 can be bonded to the display part 8, the adhesive layer 19 is on a side of the back film layer 18 away from the display part 8, the adhesive layer 19 can be a heat-conducting adhesive, the support layer 3 is on a side of the adhesive layer 19 away from the back film layer 18, and the back film layer 18, the adhesive layer 19 and the support layer 3 fill the space between the binding part 10 and the display part 8. The binding part 10 is on a side of the support layer 3 away from the display part 8, and the binding part 10 and the support layer 3 are provided with spacers 20.

[0087] In some example embodiments, as shown in Figure 2 and Figure 3 The display module further includes a flexible printed circuit (FPC) 5, and the FPC 5 is arranged to be bound to the binding part 10 and the first circuit board 4, respectively. The FPC 5 can be provided in a plurality, and the plurality of FPCs 5 are arranged to be spaced apart in a third direction, the third direction is parallel to another direction in the first plane and perpendicular to the second direction and the first direction.

[0088] In some example embodiments, as shown in Figure 2 and Figure 3As shown, the display module further includes a composite layer 1, which can be located on the light-emitting side 23 of the display part 8. The composite layer 1 includes, in sequence from top to bottom in the first direction, a polarizing layer 17, a second transparent adhesive layer 16, a touch layer 15, a first transparent adhesive layer 14, and a cover plate 13. The composite layer 1 can transmit light emitted by the display part 8. The polarizing layer 17 is located on the side of the display part 8 away from the back film layer 18 and is bonded to the display part 8. The polarizing layer 17 can reduce the influence of external light emission on the image display of the display part 8. The touch layer 15 is located on the side of the polarizing layer 17 away from the display part 8 and is bonded through the second transparent adhesive layer 16 and the polarizing layer 17. The touch layer 15 can detect touch information of the display module. The cover plate 13 is located on the side of the touch layer 15 away from the polarizing layer 17 and is bonded through the first transparent adhesive layer 14 and the touch layer 15. The cover plate 13 can protect the display part 8.

[0089] Figure 4 For Figure 1 a second mounting schematic view of the first circuit board in FIG. 1, Figure 5 For Figure 4 a schematic view of the first circuit board in FIG. 1, Figure 6 For Figure 4 a projection schematic view of the first circuit board in FIG. 1. In some example embodiments, as shown in FIGS. 1 and 2, Figure 2 , Figures 4 to 6 the first circuit board 4 can be a hard printed circuit board (PCB). The first circuit board 4 can be parallel to the first plane 7 and parallel to the display part 8. The area of the orthographic projection of the first circuit board 4 on the first plane 7 is S2. The first circuit board 4 includes an integral main board part 11 and an extension part 12. The main board part 11 can be a rectangular plate and is located on the backlight side 24 of the display part 8. The orthographic projection of the main board part 11 on the first plane 7 can be located within the orthographic projection of the display part 8 on the first plane 7. Thus, the edge of the main board part 11 in the second direction does not protrude beyond the edge of the display part 8 in the second direction, and the edge of the main board part 11 in the third direction does not protrude beyond the edge of the display part 8 in the third direction. This avoids the first circuit board 4 extending laterally beyond the display panel 2 and meets the high demand of the intelligent cockpit for lateral bezel space.

[0090] In some example embodiments, as shown in FIGS. 1 and 2, Figures 4 to 6As shown, the extension part 12 is also plate-shaped, one end of the extension part 12 is connected to the edge of the main plate part 11, and the other end extends to the side with the binding part 10, so that the first circuit board 4 is in a right angle shape, wherein the extension part 12 extends in the second direction, one end of the extension part 12 is connected to the edge of the main plate part 11 close to the binding part 10 in the second direction, and the other end extends to the lower edge of the display module, making full use of the space of the lower edge of the intelligent cockpit. The orthographic projection of the extension part 12 on the first plane 7 is at least partially not overlapped with the orthographic projection of the display part 8 on the first plane 7, that is, the orthographic projection of the extension part 12 on the first plane 7 is partially not within the orthographic projection of the display part 8 on the first plane 7, so that the end of the extension part 12 away from the main plate part 11 protrudes the edge of the display panel 2 in the second direction, so that the first circuit board 4 forms a part of the externalization relative to the display panel 2. Therefore, the extension part 12 partially protrudes the edge of the display panel 2 in the second direction, and the part is far away from the display panel 2, and the heat generated by the part does not directly affect the display panel 2, so that the part of the first circuit board 4 externalization relative to the display panel 2 can improve the heat dissipation effect. The extension part 12 is located on one side of the binding part 10 in the third direction, and the extension part 12 is formed to avoid the binding part 10, the orthographic projection of the first circuit board 4 on the first plane 7 is the second projection 43, the orthographic projection of the binding part 10 on the first plane 7 is the third projection 44, and the second projection 43 and the third projection 44 are not overlapped.

[0091] Figure 7 For Figure 1 the third mounting diagram of the first circuit board in some example embodiments, as shown in Figure 7 , the first device 25 is arranged on the extension part 12, and the first device 25 is on the side of the extension part 12 away from the composite layer 1. The first device 25 can be a high-heat device that generates a large amount of heat during operation. The orthographic projection of the first device 25 on the first plane 7 is not overlapped with the orthographic projection of the display panel 2 on the first plane 7, so that the first device 25 is away from the display panel 2, thereby preventing the heat generated by the first device 25 from affecting the display effect of the display panel 2, improving heat dissipation, and ensuring the display effect.

[0092] Figure 8 For Figure 1 the shielding band diagram in some example embodiments, as shown in Figure 9 , the shielding band and the first circuit board are split, Figure 1 , the shielding band diagram and the first circuit board split diagram in some example embodiments, as shown in Figure 10 , the orthographic projection diagram of the shielding band in some example embodiments, as shown in Figure 8 , the A-A cross-sectional view in some example embodiments, as shown in Figure 11 , the A-A cross-sectional view in some example embodiments, as shown in Figure 1 , the A-A cross-sectional view in some example embodiments, as shown in Figure 1 , Figure 6 , Figures 8 to 11As shown, the shielding tape 6 can be a conductive adhesive tape, i.e., Shield Tape, a product with high-conductive adhesive backing specially used for electromagnetic shielding. The shielding tape 6 is usually composed of a metal foil or conductive cloth and a conductive adhesive backing, which together form a complete conductive body that can be connected to a metal surface by adhesion to realize electrical bonding and gap sealing, thereby achieving the effect of electromagnetic shielding. The shielding tape 6 includes an integral first shielding portion 26 and a second shielding portion 27. The first shielding portion 26 has the same outer contour shape as the first circuit board 4, and the outer contour size of the first shielding portion 26 is slightly larger than that of the first circuit board 4, forming an outer contour matching between the first shielding portion 26 and the first circuit board 4. The orthographic projection of the first circuit board 4 on the first plane 7 is located within the orthographic projection of the first shielding portion 26 on the first plane 7. The orthographic projection of the first shielding portion 26 on the first plane 7 is a first projection 22, and the area of the first projection 22 is S1. The area of the orthographic projection (43) of the first circuit board 4 on the first plane 7 is S2, wherein S1≥ 105% × S2. The second shielding portion 27 is rectangular, and the second shielding portion 27 is located on one side of the first shielding portion 26 in the second direction. The second shielding portion 27 covers the flexible circuit board 5 and the binding portion 10 that are not covered by the first shielding portion 26, so that the first circuit board 4, the flexible circuit board 5, and the binding portion 10 are all covered by the shielding tape 6, which can improve the shielding effect.

[0093] In some example embodiments, as shown in Figures 8 to 11 The edge of the first shielding portion 26 corresponding to the edge of the first circuit board 4 is provided with a folded edge 30 bent to the side of the first circuit board 4, forming the edge of the first circuit board 4 wrapped by the first shielding portion 26.

[0094] In some example embodiments, as shown in Figure 4 , Figures 8 to 11 The orthographic projection of the extension portion 12 on the first plane 7 is located within the orthographic projection of the first shielding portion 26 on the first plane 7, so that the part of the extension portion 12 extending into the lower frame is also covered by the first shielding portion 26. The side end face of the extension portion 12 facing the shielding tape 6 in the first direction is provided with a first copper-exposed area 12a having a bare first copper layer 31. The orthographic projection of the first copper-exposed area 12a on the first plane 7 does not overlap with the orthographic projection of the display panel 2 on the first plane 7. The shielding tape 6 is provided with a first through hole 28 penetrating the shielding tape 6 in the first direction and filled with a heat-conducting silicone grease 29 for heat dissipation. The orthographic projection of the first copper-exposed area 12a on the first plane 7 is located within the orthographic projection of the first through hole 28 on the first plane 7, and the orthographic projection of the first through hole 28 on the first plane 7 is located within the orthographic projection of the extension portion 12 on the first plane 7. The side end face of the extension portion 12 away from the shielding tape 6 is provided with a first heat-conducting adhesive 32 corresponding to the first copper-exposed area 12a in the first direction.

[0095] Figure 12 Fig. 6 is another cross-sectional view of a display module according to an example embodiment, Figure 13 Fig. 7 is a fourth mounting view of the first circuit board in Fig. 1, in some example embodiments, Figure 1 Fig. 8 is a fifth mounting view of the first circuit board in Fig. 1, in some example embodiments, Figure 12 Fig. 9 is a sixth mounting view of the first circuit board in Fig. 1, in some example embodiments, Figure 13 As shown in Figs. 6 and 7, the extension 12 is provided with a first copper-exposed area 12a facing a side end surface of the shielding tape 6 in the first direction, the first copper-exposed area 12a having the first copper layer 31 exposed. The shielding tape 6 is provided with a first through hole 28 penetrating the shielding tape 6 in the first direction and filled with a heat-conductive silicone grease 29 for heat dissipation, the first copper-exposed area 12a has a footprint on the first plane 7 that is within a footprint of the first through hole 28 on the first plane 7, and the footprint of the first through hole 28 on the first plane 7 is within a footprint of the extension 12 on the first plane 7. The extension 12 is provided with a second copper-exposed area 12b facing away from the side end surface of the shielding tape 6 in the first direction, the second copper-exposed area 12b having the second copper layer 33 exposed. The second copper-exposed area 12b has a footprint on the first plane 7 that does not overlap with a footprint of the display panel 2 on the first plane 7, and the second copper-exposed area 12b is covered with a first heat-conductive adhesive 32 for heat dissipation. Figure 14 Fig. 8 is another cross-sectional view of a display module according to an example embodiment, Figure 13 Fig. 9 is a fourth mounting view of the first circuit board in Fig. 1, in some example embodiments, Figure 14 As shown in Figs. 6 and 7, the extension 12 is provided with a first copper-exposed area 12a facing a side end surface of the shielding tape 6 in the first direction, the first copper-exposed area 12a having the first copper layer 31 exposed. The shielding tape 6 is provided with a first through hole 28 penetrating the shielding tape 6 in the first direction and filled with a heat-conductive silicone grease 29 for heat dissipation, the first copper-exposed area 12a has a footprint on the first plane 7 that is within a footprint of the first through hole 28 on the first plane 7, and the footprint of the first through hole 28 on the first plane 7 is within a footprint of the extension 12 on the first plane 7. The extension 12 is provided with a second copper-exposed area 12b facing away from the side end surface of the shielding tape 6 in the first direction, the second copper-exposed area 12b having the second copper layer 33 exposed. The second copper-exposed area 12b has a footprint on the first plane 7 that does not overlap with a footprint of the display panel 2 on the first plane 7, and the second copper-exposed area 12b is covered with a first heat-conductive adhesive 32 for heat dissipation.

[0096] Figure 15 Fig. 8 is another cross-sectional view of a display module according to an example embodiment, Figure 15As shown, the extension 12 has an exposed first copper layer 31 on its end face facing the shielding strip 6 in the first direction. The shielding strip 6 does not have a first through-hole 28 or thermal grease 29; instead, it directly covers the first copper layer 31. The extension 12 does not have a second copper layer 33 on its end face facing away from the shielding strip 6 in the first direction, and is covered with a first thermally conductive adhesive 32 for heat dissipation. The material of the first thermally conductive adhesive 32 includes a composite adhesive, and the thickness of the first thermally conductive adhesive 32 is H1, where H1 is not less than 1 mm. The thickness of the first thermally conductive adhesive 32 is its dimension in the first direction. In this example, H1 = 3 mm, but it is not limited to this; for example, H1 = 2 mm, H1 = 1.5 mm, H1 = 1 mm, and H1 = 5 mm. The first thermally conductive adhesive 32 is configured with a hollow structure 36. The first thermally conductive adhesive 32 and the flange 30 are arranged at intervals to form a first gap 34. The size of the first gap 34 is not less than 0.5mm. In this example, the size of the first gap 34 is 0.5mm, but it is not limited to this. For example, the size of the first gap 34 can be 1mm, 0.7mm, 1.5mm, or 0.8mm. The first thermally conductive adhesive 32 is provided with a plurality of third through holes 35. The third through holes 35 penetrate the first thermally conductive adhesive 32 in a first direction. In this example, the third through holes 35 can be circular holes. The diameter of the third through holes 35 is not less than 0.5mm. In this example, the diameter of the third through holes 35 is 0.8mm, but it is not limited to this. For example, the diameter of the third through holes 35 can be 1mm, 0.7mm, 1.5mm, or 0.5mm. The arrangement of the first gap 34 and the third through holes 35 makes the first thermally conductive adhesive 32 form a hollow structure. The hollow structure 36 can increase the internal air circulation.

[0097] Figure 16 This is another schematic cross-sectional view of a display module in this exemplary embodiment. In some exemplary embodiments, such as Figure 16As shown, the extending part 12 is covered by the shielding tape 6 on the side end face facing the shielding tape 6 in the first direction. The side end face of the extending part 12 facing away from the shielding tape 6 in the first direction is not provided with the second copper layer 33, but is covered by the first heat-conducting glue 32 for conducting heat. The material of the first heat-conducting glue 32 comprises composite glue material, and the thickness H1 of the first heat-conducting glue 32 is not less than 1 mm, where the thickness of the first heat-conducting glue 32 is the size of the first heat-conducting glue 32 in the first direction. In the example, H1 = 3 mm, but is not limited thereto, for example, H1 = 2 mm, for example, H1 = 1.5 mm, for example, H1 = 1 mm, for example, H1 = 5 mm. The first heat-conducting glue 32 is provided in a hollow structure 36, and the first heat-conducting glue 32 and the flange 30 are arranged in a spaced manner to form a first gap 34, where the size of the first gap 34 is not less than 0.5 mm. In the example, the size of the first gap 34 is 0.5 mm, but is not limited thereto, for example, the size of the first gap 34 can be 1 mm, or 0.7 mm, or 1.5 mm, or 0.8 mm. A plurality of third through holes 35 are formed in the first heat-conducting glue 32, and the third through holes 35 penetrate the first heat-conducting glue 32 in the first direction. In the example, the third through holes 35 can be circular holes, and the diameter of the third through holes 35 is not less than 0.5 mm. In the example, the diameter of the third through holes 35 is 0.8 mm, but is not limited thereto, for example, the diameter of the third through holes 35 can be 1 mm, or 0.7 mm, or 1.5 mm, or 0.5 mm. The first gap 34 and the third through holes 35 are arranged to form a hollow structure in the first heat-conducting glue 32, and the hollow structure 36 can increase the internal air circulation.

[0098] Figure 17 For Figure 1 the fifth mounting schematic diagram of the first circuit board in FIG. 4B, in some example embodiments, as shown in FIG. 4C, the first circuit board 4 can be bonded to the support layer 3 through a first glue layer 37, and the material of the first glue layer 37 comprises graphite. Figure 17

[0099] Figure 18 For Figure 1 the sixth mounting schematic diagram of the first circuit board in FIG. 4B, in some example embodiments, as shown in FIG. 4D, the first circuit board 4 can be bonded to the support layer 3 through a first glue layer 37, and the material of the first glue layer 37 comprises graphite. Figure 18 ​As shown, the first circuit board 4 can be bonded with the support layer 3 through the first adhesive layer 37, the first adhesive layer 37 can include a double-sided foam tape, the thickness of the double-sided foam tape can be H2, wherein H2 is not less than 0.2mm, the thickness of the double-sided foam tape is the size of the double-sided foam tape in the first direction, in the example, H2 = 0.5mm, but not limited to this, for example, H2 = 1mm, for example, H2 = 1.2mm, for example, H2 = 0.8mm, for example, H2 = 0.3mm. The main board part 11 is provided with a second device 38 on the side away from the support layer 3, the second device 38 is a high heat generating device, which emits a lot of heat during operation. Among them, the double-sided foam tape is provided with a second through hole 39, the orthographic projection of the second device 38 on the first plane is located in the orthographic projection of the second through hole 39 on the first plane, so that the double-sided foam tape forms a hollow corresponding to the second device 38, which can increase air circulation and take away part of the heat, improving the heat dissipation effect.

[0100] Figure 19 For Figure 1 B-B cross-sectional view, as shown in Figure 19 , there is a space between the shielding tape 6 and the support layer 3 which is not occupied by the first circuit board 4 and other devices, which can be provided with a second adhesive layer 40, the shielding tape 6 is bonded with the support layer 3 through the second adhesive layer 40, combined with Figure 1 and Figure 4 , the second adhesive layer 40 can be located in the gap between the main board part 11 and the binding part 10 of the first circuit board 4.

[0101] As shown in Figure 1 , Figure 2 and Figure 11 , in some example embodiments, a preparation method is applied to the display module of Figure 1 , the steps are as follows: display panel incoming, polarizing plate and display panel bonding, display panel binding area glue coating, binding area contour cutting, display panel and polarizing layer contour cutting, display panel and flexible circuit board binding, display panel and flexible circuit board binding area front / back adhesive coating, first circuit board and flexible circuit board binding, first circuit board and flexible circuit board binding area front / back adhesive coating, bonding first transparent adhesive layer, touch layer, second transparent adhesive layer and cover plate, support layer bonding, bending of the bending part of the display panel, bonding of the heat-conducting silicone grease and the first heat-conducting adhesive on the first circuit board, bonding of the shielding tape.

[0102] Figure 20 is another cross-sectional view of a display module of the present example embodiment, in some example embodiments, as shown in Figure 20As shown, the display panel 2 may include a separate display unit 8 and a flip-chip film 41. The flip-chip film 41 includes an integral bending portion 9 and a bonding portion 10. A third device 21 is bonded to the flip-chip film 41. The display unit 8 may be flat and may have a light-emitting side 23 and a backlight side 24. When the display unit 8 is lit, the light-emitting side 23 emits light to display text or images. One end of the flip-chip film 41 is bonded to one end of the display unit 8 in a second direction. The bending portion 9 may be made of a flexible material and can be bent. One end of the bending portion 9 is connected to the display unit 8, and the bending portion 9 is folded to the backlight side 24 of the display unit 8, forming an almost semi-circular shape. The bonding portion 10 is located on the backlight side 24 of the display unit 8, and the third device 21 is provided on the side of the bonding portion 10 facing away from the display unit 8.

[0103] In some exemplary embodiments, a display device includes the display module described above, and the display device may be an OLED display device. The display device provided in this disclosure can be applied to electronic devices, such as aviation, high-speed rail, cruise ship, and vehicle displays.

[0104] Figure 21 This is a schematic diagram of a display device for an exemplary embodiment. In some exemplary embodiments, such as Figure 21 As shown, the display device also includes a metal housing 42, on which the display module is mounted. The extension 12 has a first copper leakage area 12a on one end face in the first direction, which is bonded to the housing 42 by thermally conductive grease 29. The extension 12 has a first thermally conductive adhesive 32 on the other side in the first direction, and is bonded to the housing 42 by the first thermally conductive adhesive 32. Thus, the extension 12 can transfer heat to the housing 42 through the thermally conductive grease 29 and the first thermally conductive adhesive 32, thereby achieving heat dissipation.

[0105] In combination with the above embodiments, the display module of the present example, by extending the first circuit board 4 out of the range of the display panel 2, and in combination with the shielding tape 6, the first circuit board 4 and the shielding tape 6 are partially externalized relative to the display panel 2, which can improve the ESD resistance, EMI resistance and heat dissipation capacity, and thus improve the safety performance of the display module. The lower frame of the intelligent cockpit has a relatively large space, and the extension part 12 of the first circuit board 4 can extend into the lower frame position, fully utilizing the structural space. The first circuit board 4 can be bonded to the support layer 3 through the first adhesive layer 37, and the first adhesive layer 37 is formed with a hollow structure, which corresponds to the second device that generates a lot of heat, so that the heat dissipation effect is optimized. The extension part 12 can transfer heat to the housing 42 through the heat-conducting silicone grease 29 and the first heat-conducting adhesive 32, thereby achieving heat dissipation. The first device 25 on the extension part 12 has a non-overlapping orthographic projection on the first plane 7 with the orthographic projection of the display panel 2 on the first plane 7, so that the first device 25 is away from the display panel 2, and thus the heat emitted by the first device 25 will not affect the display effect of the display panel 2, improving the heat dissipation. The first heat-conducting adhesive 32 is located on one side of the extension part 12 and forms a hollow structure, and the hollow structure 36 can increase the internal air circulation.

[0106] Those of ordinary skill in the art will understand that all or some of the steps in the above-disclosed methods, functions modules / units in the systems, devices can be implemented as software, firmware, hardware, or a combination thereof. In hardware implementation, the division between the functional modules / units referred to in the above description does not necessarily correspond to the division of physical components; for example, one physical component can have multiple functions, or one function or step can be performed by several physical components in cooperation. Some or all of the components can be implemented as software executed by a processor, such as a digital signal processor or a microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transitory media). As known to those of ordinary skill in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, as known to those of ordinary skill in the art, communication media typically includes computer readable instructions, data structures, program modules or other data in modulated data signals such as carrier waves or other transport mechanisms, and can include any information delivery medium.

Claims

1. A display module, characterized by The display panel, the first circuit board and the shielding tape are sequentially arranged in a first direction, and the first direction is perpendicular to the display panel; A normal projection of the first circuit board on a first plane is arranged at least partially not to overlap with a normal projection of the display panel on the first plane, and a normal projection of the shielding tape on the first plane at least partially overlaps with the normal projection of the first circuit board on the first plane, and the first plane is parallel to the display panel; The display panel comprises a display part, a bending part and a binding part, one end of the bending part is connected to one end of the display part in a second direction, the other end is folded to the backlight side of the display part and connected to the binding part, and the second direction is arranged to be parallel to one direction in the first plane; The first circuit board comprises an integral main board part and an extension part, the main board part is located on the backlight side of the display part, and a normal projection of the main board part on the first plane is located in a normal projection of the display part on the first plane; One end of the extension part is connected to an edge of the main board part, and the other end extends to one side with the binding part, a normal projection of the extension part on the first plane is arranged at least partially not to overlap with a normal projection of the display part on the first plane, and a normal projection of the extension part on the first plane at least partially overlaps with a normal projection of the shielding tape on the first plane; The extension part is located on one side of the binding part in a third direction to avoid the binding part, the normal projection of the first circuit board on the first plane is a second projection, the normal projection of the binding part on the first plane is a third projection, the second projection and the third projection do not overlap, and the third direction is parallel to another direction in the first plane and perpendicular to the second direction and the first direction.

2. The display module of claim 1, wherein, A first device is arranged on the extension part, and a normal projection of the first device on the first plane does not overlap with a normal projection of the display panel on the first plane.

3. The display module of claim 1, wherein, The extension part extends along the second direction, and one end of the extension part is connected to an edge of the main board part close to the binding part in the second direction.

4. The display module of claim 1, wherein, The shielding tape comprises a first shielding part, a normal projection of the first circuit board on the first plane is located in a normal projection of the first shielding part on the first plane, an outer contour of the first shielding part is arranged to match an outer contour of the first circuit board, and the first shielding part wraps an edge of the first circuit board; An area of a normal projection of the first shielding part on the first plane is S1, and an area of a normal projection of the first circuit board on the first plane is S2, wherein S1 is greater than or equal to 105% of S2.

5. The display module of claim 1, wherein, A first copper leakage area is arranged on a side end surface of the extension part facing away from the display part, and a normal projection of the first copper leakage area on the first plane does not overlap with a normal projection of the display panel on the first plane; The shielding tape is provided with a first through hole, the first through hole penetrates the shielding tape in the first direction and is filled with a heat-conducting silicone grease for heat dissipation, and a normal projection of the first copper leakage area on the first plane is located in a normal projection of the first through hole on the first plane.

6. The display module of claim 1 or 5, wherein, The extension part is provided with a second copper leakage area on a side end face facing the display part, a normal projection of the second copper leakage area on the first plane does not overlap with a normal projection of the display panel on the first plane, and the second copper leakage area is covered with a first heat-conducting glue for conducting heat.

7. The display module of claim 1, wherein, The extension part is provided with a first copper leakage area on a side end face facing away from the display part, a normal projection of the first copper leakage area on the first plane does not overlap with a normal projection of the display panel on the first plane, and the shielding strip is arranged to cover the first copper leakage area. The extension part is provided with a first heat-conducting glue on a side end face facing the display part, and the first heat-conducting glue is arranged to correspond to the first copper leakage area in the first direction. The material of the first heat-conducting glue comprises a composite glue material, the thickness of the first heat-conducting glue is not less than 1 mm, and the first heat-conducting glue is arranged in a hollow structure.

8. The display module of claim 1, wherein, Further comprising a support layer and a flexible circuit board, the support layer is located between the display part and the first circuit board, and the flexible circuit board is arranged to be bound with the binding part and the main board part respectively. The normal projection of the flexible circuit board and the binding part on the first plane is located within the normal projection of the shielding strip on the first plane.

9. The display module of claim 8, wherein, Further comprising a first glue layer, the first circuit board is arranged to be bonded with the support layer through the first glue layer. The first glue layer comprises a double-sided foam adhesive tape, the thickness of the double-sided foam adhesive tape is not less than 0.2 mm, or the material of the first glue layer comprises graphite.

10. The display module of claim 9, wherein, The main board part is provided with a second device, the double-sided foam adhesive tape is provided with a second through hole, and a normal projection of the second device on the first plane is located within a normal projection of the second through hole on the first plane.

11. The display module of claim 8, wherein, Further comprising a second glue layer, the shielding strip is bonded with the support layer through the second glue layer, and the second glue layer is located within a gap between the first circuit board and the binding part.

12. A display device, characterized by comprising: The display module comprises the display module as claimed in claim 1.

13. The display device of claim 12, wherein, Further comprising a housing, the display module is mounted on the housing. The extension part is provided with a first copper leakage area on a side end face facing away from the display part, a normal projection of the first copper leakage area on the first plane does not overlap with a normal projection of the display panel on the first plane, and the first copper leakage area is bonded with the housing through heat-conducting silicone grease. And / or, the extension part is provided with a second copper leakage area on a side end face facing the display part, a normal projection of the second copper leakage area on the first plane does not overlap with a normal projection of the display panel on the first plane, and the second copper leakage area is bonded with the housing through a first heat-conducting glue.

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