Electronic device and manufacturing method thereof

Abstract

The embodiments of the present application provide an electronic device and a manufacturing method thereof, which relate to the field of display technology and can realize a display panel design with a narrower bezel. The electronic device includes a display panel, which includes: a light-emitting device array; a redistribution layer, the light-emitting device array being mounted on one side surface of the redistribution layer; a printed circuit board, the printed circuit board being mounted on a side surface of the redistribution layer away from the light-emitting device array, the size of the printed circuit board being smaller than the size of the redistribution layer, and the edge of the redistribution layer extending beyond the edge of the printed circuit board in a direction perpendicular to the plane of the printed circuit board; and a driver chip, the driver chip being mounted on a side surface of the printed circuit board away from the redistribution layer, the light-emitting device array being electrically connected to the driver chip via wiring in the redistribution layer and wiring in the printed circuit board.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an electronic device and a manufacturing method thereof. Background Art

[0002] With the development of display technology, users are constantly pursuing the ultimate display experience. For example, for screens in electronic devices such as mobile phones, tablets, and wearable devices, narrow-border designs are becoming increasingly popular, enabling the presentation of larger visual images in a small size. For another example, large-size display screens are becoming increasingly popular for immersive viewing, with the emergence of 98-inch and 110-inch TVs. However, such large sizes are difficult to transport and install in homes, leading to the emergence of modular spliced ​​large-size TVs. Individual modules are small in size, making them easy to transport, install, and maintain, and are then spliced ​​together to form a large-size TV. However, spliced ​​screens have the problem of large splicing gaps, which are caused by the wide border size of the display panel.

[0003] Therefore, for current electronic devices, how to achieve a display panel design with a narrower border has become a problem to be solved. Summary of the Invention

[0004] The technical solution of the present application provides an electronic device and a manufacturing method thereof, which can realize a display panel design with a narrower frame.

[0005] In a first aspect, an electronic device is provided, comprising a display panel, the display panel comprising: a light-emitting device array; a redistribution layer, the light-emitting device array being mounted on one side surface of the redistribution layer; a printed circuit board, the printed circuit board being mounted on a side surface of the redistribution layer away from the light-emitting device array, the size of the printed circuit board being smaller than the size of the redistribution layer, and an edge of the redistribution layer extending beyond an edge of the printed circuit board in a direction perpendicular to the plane of the printed circuit board; a driver chip, the driver chip being mounted on a side surface of the printed circuit board away from the redistribution layer, the light-emitting device array being electrically connected to the driver chip via wiring in the redistribution layer and wiring in the printed circuit board.

[0006] In a possible implementation, the electronic device includes a plurality of display panels, and any two adjacent display panels are spliced ​​together based on an edge of a redistribution layer.

[0007] In a possible implementation, the display panel further includes related components, which are mounted on a surface of the printed circuit board that is away from the redistribution layer.

[0008] In a possible implementation, the relevant devices include at least one or any combination of the following: an application processor, a power management chip, a memory, and a sensor.

[0009] In a possible implementation, the light emitting device array is a light emitting diode array; the light emitting diode array includes red light emitting diodes, blue light emitting diodes, and green light emitting diodes.

[0010] In a second aspect, a method for manufacturing an electronic device is provided, comprising: manufacturing a redistribution layer based on a photolithography process on one side of a light-emitting device array; mounting a printed circuit board on a side of the redistribution layer away from the light-emitting device array, wherein the size of the printed circuit board is smaller than the size of the redistribution layer, and an edge of the redistribution layer exceeds an edge of the printed circuit board in a direction perpendicular to the plane of the printed circuit board; mounting a driver chip on a side of the printed circuit board away from the redistribution layer, wherein the light-emitting device array is electrically connected to the driver chip through wiring in the redistribution layer and wiring in the printed circuit board.

[0011] In a possible embodiment, before producing a redistribution layer based on a photolithography process on one side of the light-emitting device array, the method further includes: transferring the light-emitting device array to a temporary carrier; producing a redistribution layer based on a photolithography process on one side of the light-emitting device array includes: producing a redistribution layer based on a photolithography process on a side of the light-emitting device array away from the temporary carrier; before mounting a driver chip on a side of the printed circuit board away from the redistribution layer, and after mounting a printed circuit board on a side of the redistribution layer away from the light-emitting device array, the method further includes: removing the temporary carrier on the light-emitting device array.

[0012] In a possible implementation, mounting the driver chip on the side of the printed circuit board away from the redistribution layer includes: mounting the driver chip on the side of the printed circuit board away from the redistribution layer using a surface mount technology process.

[0013] In a possible implementation, mounting a printed circuit board on a side of the redistribution layer away from the light emitting device array includes mounting the printed circuit board on the side of the redistribution layer away from the light emitting device array by surface mounting technology or bonding technology.

[0014] In one possible embodiment, after mounting a driver chip on a side of a printed circuit board away from a redistribution layer, a display panel including a light-emitting device array, a redistribution layer, a printed circuit board, and a driver chip is obtained; after obtaining multiple display panels, the method further includes: splicing the multiple display panels together based on the edges of the redistribution layer.

[0015] In the electronic device and its manufacturing method in the embodiment of the present application, since the redistribution layer is a high-precision process, the redistribution layer is manufactured directly on the light-emitting device array by photolithography based on the photolithography process. On the one hand, the dense arrangement of the light-emitting device array can be guaranteed, that is, the display resolution is high. On the other hand, the distance between the boundary of the light-emitting device array and the boundary of the redistribution layer is small. After the redistribution layer is completed, the larger redistribution layer is bonded to the smaller printed circuit board. Even if the reserved distance of the printed circuit board boundary is large, it will not affect the boundary distance between the light-emitting device array and the redistribution layer. Finally, the boundary distance between the light-emitting device array and the redistribution layer is used as the border width of the display panel, that is, a narrower display panel border is achieved, and the distance between the boundary of the light-emitting device array and the boundary of the redistribution layer is small. In addition, the traditional mature PCB on-board technology is used to realize complex electrical interconnection. The entire architectural process flow is simple, the yield is high and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural diagram of an electronic device in the related art;

[0017] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along the AA' direction;

[0018] Figure 3 is a schematic cross-sectional structural diagram of another electronic device in the related art;

[0019] Figure 4 This is a schematic cross-sectional view of an electronic device according to an embodiment of the present application;

[0020] Figure 5 This is a schematic diagram of the front structure of an electronic device according to an embodiment of the present application;

[0021] Figure 6 This is a schematic diagram of the structure of an electronic device after multiple display panels are spliced ​​together in an embodiment of the present application;

[0022] Figure 7 is a schematic cross-sectional view of another electronic device according to an embodiment of the present application;

[0023] Figure 8 This is a flow chart of a method for manufacturing an electronic device in an embodiment of the present application. DETAILED DESCRIPTION

[0024] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0025] Before describing the embodiments of the present application, the related technologies and their technical problems are first introduced.

[0026] like Figure 1 and Figure 2 As shown, in a related technology, a glass substrate is used as the backplane of the light-emitting diode (LED). A driver chip is provided on the other side of the backplane. The driver chip is electrically connected to the LED through a metal signal line on the edge of the glass substrate. There are two problems with this solution. First, due to the bonding process used between the glass substrate and the LED, the tolerance of the process itself causes a large distance between the LED and the edge of the glass substrate, generally greater than 400μm, which results in a significant splicing gap between the two display panels after splicing. Second, due to the difficulty of sidewall deposition and etching, the metal wiring needs to be deposited on the side of the glass substrate to route the wiring. This results in a low product yield.

[0027] like Figure 3 As shown, in another related technology, to reduce the problem of low product yield caused by sidewall wiring, a through-glass via (TGV) solution is proposed to achieve electrical connection between the LED on the front of the glass substrate and the driver chip on the back of the glass substrate. This solution has a high product yield. However, this solution still cannot solve the problem of wide display panel borders. The reason is that due to the difference in thermal expansion coefficients, the TGVs cannot be densely arranged, which limits the wiring layout and the placement of the LEDs, making it impossible to achieve higher resolution. If higher resolution is to be achieved, more space must be occupied in the display panel border area, resulting in a wider display panel border.

[0028] In order to solve the above problems, a technical solution of an embodiment of the present application is provided, and the technical solution of an embodiment of the present application is described below.

[0029] like Figure 4 and Figure 5 As shown, an embodiment of the present application provides an electronic device, including a display panel, the display panel including: a light-emitting device array 1; a redistribution layout (RDL) 2, the light-emitting device array 1 is mounted on one side surface of the redistribution layer 2; a printed circuit board (PCB) 3, the printed circuit board 3 is mounted on a side surface of the redistribution layer 2 away from the light-emitting device array 1, the size of the printed circuit board 3 is smaller than the size of the redistribution layer 2, and in a direction perpendicular to the plane of the printed circuit board 3, the edge of the redistribution layer 2 exceeds the edge of the printed circuit board 3, Figure 5The dotted box in the middle is the edge of the printed circuit board 3. In other words, one function of the redistribution layer 2 is fan-in, that is, the terminals on one side of the surface used to electrically connect to the light-emitting device array 1 are converted into terminals with a smaller overall area through wiring and then provided on the other side of the surface, so that a smaller-sized printed circuit board 3 can achieve circuit interconnection with the redistribution layer 2; the driver chip 4 is installed on the side of the printed circuit board 3 away from the redistribution layer 2. The light-emitting device array 1 is electrically connected to the driver chip 4 through the wiring in the redistribution layer 2 and the wiring in the printed circuit board 3. It should be noted that Figure 4 and Figure 5 The size ratios between different parts are not necessarily consistent.

[0030] Specifically, the printed circuit board is a coarse-precision process. If the printed circuit board and the light-emitting device array are to be bonded and installed, a certain reserved distance, such as 0.5 mm, must be ensured between the boundary of the printed circuit board and the boundary of the light-emitting device array to ensure successful bonding. This will result in a larger width of the display panel frame. The redistribution layer 2 is a high-precision process. The redistribution layer 2 is produced directly on the light-emitting device array 1 through photolithography based on a photolithography process. On the one hand, it can ensure the dense arrangement of the light-emitting device array 1, that is, the display resolution is high. On the other hand, the distance between the boundary of the light-emitting device array 1 and the boundary of the redistribution layer 2 is small. After the redistribution layer 2 is completed, the fan-in effect of the redistribution layer 2 is utilized to make the larger redistribution layer 2 fit with the smaller printed circuit board 3. Even if the reserved distance between the boundary of the printed circuit board 3 is large, it will not affect the boundary distance between the light-emitting device array 1 and the redistribution layer 2. Ultimately, the boundary distance between the light-emitting device array 1 and the redistribution layer 2 is used as the border width of the display panel, that is, a narrower display panel border is achieved. The distance between the boundary of the light-emitting device array 1 and the boundary of the redistribution layer 2 can be reduced to tens of μm. For example, the distance between the boundary of the light-emitting device array 1 and the boundary of the redistribution layer 2 is less than or equal to 0.3 mm. In addition, the use of traditional and mature PCB on-board technology to achieve complex electrical interconnections makes the entire architectural process simple, with a high yield and low cost.

[0031] In one possible implementation, Figure 6As shown, the electronic device includes a plurality of display panels, and any two adjacent display panels are spliced ​​together based on the edge of the redistribution layer 2. For electronic devices with spliced ​​displays, since the splicing gap is determined by the border width of adjacent display panels, that is, the splicing gap is the distance between the boundaries of the light-emitting device arrays 1 in adjacent display panels, and in the embodiment of the present application, due to the high-precision process characteristics of the redistribution layer 2, the distance between the redistribution layer 2 and the boundary of the light-emitting device array 1 is small, and finally they are spliced ​​together based on the edge of the redistribution layer 2, so the splicing gap is small. For example, the size of each individual small-sized display panel is about 22 inches, and the overall display panel size of the electronic device after splicing can be greater than 100 inches, that is, small-sized display panels can be made first, and then seamlessly spliced, thereby realizing an electronic device with a large-screen display. The overall architecture and assembly process are simple, and can support large-screen home use.

[0032] In one possible implementation, Figure 7 As shown, the display panel also includes related devices, which are installed on the side surface of the printed circuit board 3 away from the redistribution layer 2. The related devices can be non-display related devices, that is, further integration is performed based on the printed circuit board 3, and the printed circuit board 3 is reused as the main board of the overall electronic device. The related devices are integrated on the printed circuit board 3, thereby realizing two-in-one multiplexing between the display carrier board and the main board.

[0033] In one possible implementation, the related devices include at least one or any combination of the following: an application processor (AP), a power management IC (PMIC), a memory, and a sensor. The embodiment of the present application does not limit the type and quantity of the sensor. It should be noted that, Figure 7 The driver chip is omitted.

[0034] In one possible implementation, Figure 5 As shown, the light emitting device array 1 is a light emitting diode (LED) array; the light emitting diode array includes a red light emitting diode 11, a blue light emitting diode 12 and a green light emitting diode 13 to realize the display of color images.

[0035] like Figure 8 As shown, the embodiment of the present application further provides a method for manufacturing an electronic device, comprising:

[0036] Step 101. A redistribution layer 2 is produced on one side of the light-emitting device array 1 based on a photolithography process. Taking two layers of redistribution layers 2 as an example, the first redistribution layer 21 is produced first, and then the second redistribution layer 22 is produced. This realizes the production of the redistribution layer 2. The number of layers of the redistribution layer 2 can be set according to needs. Two layers are just an example here.

[0037] Step 102: Mount a printed circuit board 3 on the side of the redistribution layer 2 away from the light-emitting device array 1. The size of the printed circuit board 3 is smaller than that of the redistribution layer 2. In the direction perpendicular to the plane of the printed circuit board 3, the edge of the redistribution layer 2 exceeds the edge of the printed circuit board 3.

[0038] Step 103 : Mount the driver chip 4 on the side of the printed circuit board 3 away from the redistribution layer 2 , and the light-emitting device array 1 is electrically connected to the driver chip 4 through the wiring in the redistribution layer 2 and the wiring in the printed circuit board 3 .

[0039] The electronic device manufactured by this manufacturing method is the same as the electronic device in the above embodiment, so the specific structure and principle of the electronic device are not described in detail.

[0040] Among them, since the redistribution layer 2 is produced by a photolithography process, which is a high-precision process, the redistribution layer 2 is produced directly on the light-emitting device array 1 by photolithography based on the photolithography process. On the one hand, it can ensure the dense arrangement of the light-emitting device array 1, that is, the display resolution is high. On the other hand, the distance between the boundary of the light-emitting device array 1 and the boundary of the redistribution layer 2 is small. After the redistribution layer 2 is completed, the fan-in effect of the redistribution layer 2 is utilized to make the larger redistribution layer 2 fit with the smaller printed circuit board 3. Even if the reserved distance of the printed circuit board 3 boundary is large, it will not affect the boundary distance between the light-emitting device array 1 and the redistribution layer 2. Finally, the boundary distance between the light-emitting device array 1 and the redistribution layer 2 is used as the border width of the display panel, that is, a narrower display panel border is achieved. In addition, the use of traditional and mature PCB on-board technology to achieve complex electrical interconnections makes the entire architectural process simple, with a high yield and low cost.

[0041] In a possible embodiment, before step 101, forming the redistribution layer 2 on one side of the light emitting device array 1 based on a photolithography process, the method further includes: step 100, transferring the light emitting device array 1 to a temporary carrier 10;

[0042] Step 101, forming a redistribution layer 2 on one side of the light emitting device array 1 based on a photolithography process, includes: forming a redistribution layer 2 on a side of the light emitting device array 1 away from the temporary carrier 10 based on a photolithography process;

[0043] Step 103, before mounting the driver chip 4 on the side of the printed circuit board 3 away from the redistribution layer 2, and after step 102, after mounting the printed circuit board 3 on the side of the redistribution layer 2 away from the light-emitting device array 1, further comprising:

[0044] Step 104 : removing the temporary carrier 10 on the light emitting device array 1 .

[0045] In a possible implementation, step 103 , mounting the driver chip 4 on the side of the printed circuit board 3 away from the redistribution layer 2 , includes: mounting the driver chip 4 on the side of the printed circuit board 3 away from the redistribution layer 2 using a surface mount technology (SMT) process.

[0046] In one possible embodiment, step 102, mounting the printed circuit board 3 on the side of the redistribution layer 2 away from the light-emitting device array 1, includes: mounting the printed circuit board 3 on the side of the redistribution layer 2 away from the light-emitting device array 1 through a surface mount technology (SMT) process or a bonding technology.

[0047] In one possible embodiment, step 103, after mounting the driver chip 4 on the side of the printed circuit board 3 away from the redistribution layer 2, a display panel including the light-emitting device array 1, the redistribution layer 2, the printed circuit board 3 and the driver chip 4 is obtained; after obtaining multiple display panels, the method may further include: splicing the multiple display panels together based on the edges of the redistribution layer 2. Figure 6 The spliced ​​display panel structure shown.

[0048] The electronic device in the embodiments of the present application can be any electronic device with a display function, such as a wearable watch, a tablet computer, or a television. It can be an electronic device with a display composed of multiple display panels, or an electronic device with a non-spliced ​​display having only one display panel. For electronic devices with non-spliced ​​displays, the embodiments of the present application can achieve a narrow bezel design to increase the screen-to-body ratio and provide a larger viewing area while occupying a smaller space. For electronic devices with spliced ​​displays, in addition to achieving a narrow bezel design, the splicing gap can also be reduced to improve the overall display effect after splicing.

[0049] In the embodiments of the present application, "at least one" refers to one or more, and "more" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent the existence of A alone, the existence of A and B at the same time, and the existence of B alone. Among them, A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following" and similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b and c can be represented by: a, b, c, ab, ac, bc, or abc, where a, b, c can be single or multiple.

[0050] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. An electronic device, characterized in that: A display panel is included, wherein the display panel includes: light emitting device array; a redistribution layer, wherein the light-emitting device array is mounted on one side surface of the redistribution layer, and the redistribution layer is used to convert terminals on one side surface used for electrically connecting the light-emitting device array into terminals with a smaller overall area after wiring, and then provide terminals on the other side surface, wherein the redistribution layer is a film layer structure having a thickness; a printed circuit board, the printed circuit board being mounted on a surface of the redistribution layer away from the light-emitting device array, the printed circuit board being smaller than the redistribution layer, and an edge of the redistribution layer extending beyond an edge of the printed circuit board in a direction perpendicular to the plane of the printed circuit board; In a direction perpendicular to the plane where the printed circuit board is located, the printed circuit board and the light-emitting device array are both located within the range of the redistribution layer; In a direction perpendicular to the plane of the printed circuit board, some of the light-emitting devices in the light-emitting device array are located within the range of the printed circuit board, and another part of the light-emitting devices in the light-emitting device array are located outside the range of the printed circuit board; A driver chip is mounted on a surface of the printed circuit board away from the redistribution layer, and the light-emitting device array is electrically connected to the driver chip via wiring in the redistribution layer and wiring in the printed circuit board; The light emitting device array, the redistribution layer, the printed circuit board and the driving chip are stacked in sequence in a direction perpendicular to the plane where the printed circuit board is located.

2. The electronic device according to claim 1, wherein It comprises a plurality of the display panels, and any two adjacent display panels are spliced ​​together based on the edge of the redistribution layer.

3. The electronic device according to claim 1, wherein The display panel further includes related components, which are mounted on a surface of the printed circuit board on a side away from the redistribution layer.

4. The electronic device according to claim 3, wherein: The related devices include at least one or any combination of the following: Application processors, power management chips, memory and sensors.

5. The electronic device according to any one of claims 1 to 4, characterized in that: The light emitting device array is a light emitting diode array; The light emitting diode array includes red light emitting diodes, blue light emitting diodes and green light emitting diodes.

6. A method for manufacturing an electronic device, characterized in that: include: A redistribution layer is fabricated on one side of the light-emitting device array based on a photolithography process. The redistribution layer is used to convert terminals on one side of the surface for electrically connecting the light-emitting device array into terminals with a smaller overall area after wiring, and then provided on the other side of the surface. The redistribution layer is a film structure with a thickness. A printed circuit board is mounted on a side of the redistribution layer away from the light-emitting device array, wherein the size of the printed circuit board is smaller than the size of the redistribution layer, and an edge of the redistribution layer exceeds an edge of the printed circuit board in a direction perpendicular to the plane of the printed circuit board; In a direction perpendicular to the plane where the printed circuit board is located, the printed circuit board and the light-emitting device array are both located within the range of the redistribution layer; In a direction perpendicular to the plane of the printed circuit board, some of the light-emitting devices in the light-emitting device array are located within the range of the printed circuit board, and another part of the light-emitting devices in the light-emitting device array are located outside the range of the printed circuit board; Mounting a driver chip on a side of the printed circuit board away from the redistribution layer, wherein the light emitting device array is electrically connected to the driver chip via wiring in the redistribution layer and wiring in the printed circuit board; The light emitting device array, the redistribution layer, the printed circuit board and the driving chip are stacked in sequence in a direction perpendicular to the plane where the printed circuit board is located.

7. The method according to claim 6, characterized in that Before forming a redistribution layer on one side of the light emitting device array based on a photolithography process, the method further includes: transferring the light emitting device array to a temporary carrier; The method of manufacturing a redistribution layer on one side of the light emitting device array based on a photolithography process includes: Fabricating a redistribution layer on a side of the light emitting device array away from the temporary carrier based on a photolithography process; Before mounting a driver chip on a side of the printed circuit board away from the redistribution layer and after mounting a printed circuit board on a side of the redistribution layer away from the light emitting device array, the method further comprises: The temporary carrier on the light-emitting device array is removed.

8. The method according to claim 6, characterized in that Mounting a driver chip on a side of the printed circuit board away from the redistribution layer includes: A driving chip is mounted on a side of the printed circuit board away from the redistribution layer using a surface mounting technology process.

9. The method according to claim 6, characterized in that Mounting a printed circuit board on a side of the redistribution layer away from the light emitting device array includes: A printed circuit board is mounted on a side of the redistribution layer away from the light emitting device array by using a surface mounting technology or a binding bonding technology.

10. The method according to any one of claims 6 to 9, characterized in that After mounting a driver chip on a side of the printed circuit board away from the redistribution layer, a display panel including the light-emitting device array, the redistribution layer, the printed circuit board and the driver chip is obtained; After obtaining a plurality of the display panels, the method further includes: The plurality of display panels are spliced ​​together based on the edges of the redistribution layer.

Images