A method and device for diagnosing SMT first-piece defects based on artificial intelligence

Abstract

A method and device for diagnosing SMT first-piece defects based on artificial intelligence, relating to the field of electronic component detection; wherein the method comprises: obtaining a preset positioning point and an actual positioning image of a PCB board to be tested, the actual positioning image being an actual photographed image of the preset positioning point; obtaining a standard positioning image and image similarity corresponding to the preset positioning point, the image similarity being a similarity value between the standard positioning image and the actual positioning image; judging whether the image similarity is greater than or equal to a preset similarity threshold; if the image similarity is greater than or equal to the preset similarity threshold, determining that the PCB board to be tested is correctly placed, obtaining test data of the electronic component to be tested; judging whether the test data is within the preset standard range of the electronic component to be tested; if the test data is not within the preset standard range, displaying a prompt message to the user. Implementing the technical solution provided by the present application can solve the problem of low efficiency of SMT first-piece defect detection.

Description

Technical Field

[0001] The present application relates to the field of electronic component detection, and specifically to a method and device for diagnosing SMT first-piece defects based on artificial intelligence. Background Art

[0002] Surface Mount Technology (SMT) is an assembly technology that directly mounts electronic components on the surface of a printed circuit board (PCB). It has the advantages of high assembly density, small size and light weight of electronic products.

[0003] In the SMT production process, in order to make the subsequent PCB boards meet the actual requirements and discover possible errors as early as possible, the first PCB board or the first few PCB boards after assembling electronic components need to be inspected and confirmed to be correct after production change, line stoppage or shift change before mass production can begin. This inspection process can also be called SMT first-piece defect inspection. At present, manual inspection is widely used. The staff needs to first find the position of the electronic component on the PCB board, and then retrieve the electronic component corresponding to the position on the PCB board according to the position, and then perform data inspection on the electronic component and judge the inspection results by themselves. At this time, another staff member is also required to record the inspection results. PCB boards generally have a large number of electronic components. In this case, the efficiency of the staff in SMT first-piece defect inspection is low.

[0004] Therefore, there is an urgent need for a method and device for diagnosing SMT first-piece defects based on artificial intelligence. Summary of the invention

[0005] The present application provides a method and device for diagnosing SMT first-article defects based on artificial intelligence, which can solve the problem of low efficiency of SMT first-article defect detection.

[0006] In a first aspect, the present application provides a method for diagnosing SMT first-piece defects based on artificial intelligence, the method comprising: obtaining preset positioning points and actual positioning images of a PCB board to be tested, the actual positioning image being an actual captured image of the preset positioning points; obtaining a standard positioning image and image similarity corresponding to the preset positioning points, the image similarity being a similarity value between the standard positioning image and the actual positioning image; judging whether the image similarity is greater than or equal to a preset similarity threshold; if the image similarity is greater than or equal to the preset similarity threshold, determining that the PCB board to be tested is placed correctly, and obtaining test data of the electronic component to be tested; judging whether the test data is within a preset standard range of the electronic component to be tested; if the test data is not within the preset standard range, displaying a prompt message to a user to prompt that the electronic component to be tested has a defect.

[0007] By adopting the above technical solution, the server first obtains the preset positioning point and the actual positioning image corresponding to the preset positioning point, compares the actual positioning image with the standard positioning image to determine whether the current placement of the PCB board is correct, that is, the server can automatically identify whether the PCB board is placed correctly and perform subsequent steps when the placement is correct. Determining that the placement is correct also ensures that the electronic components can be correctly positioned subsequently; after the PCB board is placed correctly, the server can automatically obtain the test data of each electronic component and automatically determine whether these test data meet the preset requirements. When there are electronic components whose test data do not meet the requirements, the prompt information that the electronic component has defects can be displayed to the user in time. The whole process does not require the user to find the position of the electronic components one by one, nor does it require the user to use the test equipment to measure the test results one by one, and judge the test results. These processes are all controlled by the server, that is, the technical solution can improve the efficiency of SMT first-piece defect detection.

[0008] Optionally, obtaining a standard positioning image and image similarity corresponding to a preset positioning point specifically includes: obtaining a positioning feature in an actual positioning image according to a preset feature recognition algorithm; intercepting the actual positioning image according to the positioning feature to obtain a positioning feature image, wherein the positioning feature image includes the preset positioning point; comparing the positioning feature image with a first standard feature image and a second standard feature image, respectively, to obtain a first similarity and a second similarity, wherein the first standard feature image and the second standard feature image are any two different images in a preset feature image library, the first similarity is the similarity between the positioning feature image and the first standard feature image, and the second similarity is the similarity between the positioning feature image and the second standard feature image; comparing the first similarity and the second similarity; if the first similarity is greater than the second similarity, taking the first standard feature image as the standard positioning image and taking the first similarity as the image similarity.

[0009] By adopting the above technical solution, the server can obtain the positioning features and positioning feature images in the actual positioning image through a preset feature recognition algorithm trained in advance, and retrieve the standard feature image that is most similar to the actual positioning image by comparing it with the image in the preset feature image library. The standard feature image is used as the standard positioning image, thereby improving the accuracy of identifying the positioning features, and thus being able to correctly judge whether the PCB board is placed correctly.

[0010] Optionally, obtaining test data of the electronic component to be tested specifically includes: obtaining position information of the electronic component to be tested on the PCB board to be tested; transmitting the position information to a preset test device, so that the preset test device locates the electronic component to be tested according to the position information and obtains test data of the electronic component to be tested; obtaining test data transmitted by the preset test device.

[0011] By adopting the above technical solution, the server first obtains the position of each electronic component to be tested on the PCB board, that is, determines the position of the electronic component, and transmits the position information to the pre-assembled test equipment, so that the test equipment can locate the electronic component according to the position of the electronic component and obtain the test data of the electronic component.

[0012] Optionally, if the test data is not within the preset standard range, after displaying the prompt information to the user, the method also includes: obtaining information of the PCB board to be tested, the information of the PCB board to be tested including an actual positioning image, a standard positioning image, a list of electronic components, a wiring diagram, numbering information, position information and test data of the PCB board to be tested; establishing a correspondence between the information of the PCB board to be tested and the numbering information; storing the information of the PCB board to be tested, the numbering information and the correspondence in a preset test log to construct a preset test log.

[0013] By adopting the above technical solution, after the server detects the electronic components on the PCB board, it can store the relevant information of this detection, such as the actual positioning image, the standard positioning image, the electronic component list, etc., into a pre-constructed test log so that the user can check it later.

[0014] Optionally, after storing the information of the PCB board to be tested, the numbering information and the corresponding relationship in a preset test log, the method further includes: in response to the user's operation of querying the information of the PCB board to be tested, obtaining a query field input by the user; matching the numbering information in the preset test log according to the query field; obtaining the information of the PCB board to be tested corresponding to the numbering information in the preset test log according to the corresponding relationship; and displaying the information of the PCB board to be tested to the user.

[0015] By adopting the above technical solution, the server can respond to the user's operation of querying PCB board information, obtain the query field entered by the user, match and search the field with the information in the preset test log, find the PCB board information corresponding to the query field, and display it to the user, thereby improving the efficiency of the user in searching for electronic components or PCB board information.

[0016] Optionally, if the test data is not within the preset standard range, after displaying the prompt information to the user, the method also includes: in response to the user's query operation on the electronic component qualification rate, obtaining first test data of the first electronic component and second test data of the second electronic component, the first electronic component and the second electronic component are any two different electronic components on the PCB board to be tested; obtaining the electronic component qualification rate according to the first test data, the second test data, the first standard range and the second standard range, the first standard range being the preset data range of the first electronic component, and the second standard range being the preset data range of the second electronic component; displaying the electronic component qualification rate to the user, and storing the electronic component qualification rate in the information of the PCB board to be tested.

[0017] By adopting the above technical solution, the server can respond to the user's query operation on the qualified rate of electronic components on the PCB board. After the server obtains the test data of all electronic components on the PCB board and automatically determines whether these electronic components are qualified, the qualified rate of these electronic components is counted, the qualified rate of the electronic components is displayed to the user and the qualified rate of the electronic components is stored in the information of the PCB board for subsequent reference and retrieval.

[0018] Optionally, after determining whether the image similarity is greater than or equal to a preset similarity threshold, the method further includes: if the image similarity is less than the preset similarity threshold, displaying a prompt message to the user that the PCB board to be tested is not currently placed correctly.

[0019] By adopting the above technical solution, when the server detects that the PCB board to be tested is not placed correctly, it can promptly prompt the user to handle it and straighten the PCB board in time.

[0020] In a second aspect, the present application provides a device for diagnosing SMT first-piece defects based on artificial intelligence, the device comprising an acquisition unit and a processing unit;

[0021] The acquisition unit is used to acquire the preset positioning points and the actual positioning image of the PCB board to be tested, where the actual positioning image is the actual captured image of the preset positioning points; it is also used to acquire the standard positioning image and image similarity corresponding to the preset positioning points, where the image similarity is the similarity value between the standard positioning image and the actual positioning image; it is also used to determine that the PCB board to be tested is correctly placed if the image similarity is greater than or equal to a preset similarity threshold, and to obtain the test data of the electronic component to be tested.

[0022] The processing unit is used to determine whether the image similarity is greater than or equal to a preset similarity threshold; it is also used to determine whether the test data is within the preset standard range of the electronic component to be tested; it is also used to display a prompt message to the user if the test data is not within the preset standard range to prompt that the electronic component to be tested has a defect.

[0023] Optionally, the acquisition unit is used to acquire the positioning features in the actual positioning image according to a preset feature recognition algorithm; the processing unit is used to intercept the actual positioning image according to the positioning features to obtain a positioning feature image, wherein the positioning feature image includes a preset positioning point; the positioning feature image is compared with the first standard feature image and the second standard feature image respectively to obtain a first similarity and a second similarity, wherein the first standard feature image and the second standard feature image are any two different images in a preset feature image library, the first similarity is the similarity between the positioning feature image and the first standard feature image, and the second similarity is the similarity between the positioning feature image and the second standard feature image; the first similarity and the second similarity are compared; if the first similarity is greater than the second similarity, the first standard feature image is used as the standard positioning image, and the first similarity is used as the image similarity.

[0024] Optionally, the acquisition unit is used to obtain position information of the electronic component to be tested on the PCB board to be tested; obtain test data transmitted by a preset test device; the processing unit is used to transmit the position information to the preset test device, so that the preset test device locates the electronic component to be tested according to the position information, and obtains the test data of the electronic component to be tested.

[0025] Optionally, the acquisition unit is used to acquire information of the PCB board to be tested, the information of the PCB board to be tested including an actual positioning image, a standard positioning image, a list of electronic components, a wiring diagram, numbering information of the PCB board to be tested, position information and test data; the processing unit is used to construct a correspondence between the information of the PCB board to be tested and the numbering information; the information of the PCB board to be tested, the numbering information and the correspondence are stored in a preset test log to construct a preset test log.

[0026] Optionally, the acquisition unit is used to respond to the user's operation of querying the information of the PCB board to be tested, and obtain the query field input by the user; according to the corresponding relationship, obtain the information of the PCB board to be tested corresponding to the numbering information in the preset test log; the processing unit is used to match the numbering information in the preset test log according to the query field; and display the information of the PCB board to be tested to the user.

[0027] Optionally, the acquisition unit is used to respond to a user's query operation on the electronic component qualification rate, obtain first test data of a first electronic component and second test data of a second electronic component, the first electronic component and the second electronic component being any two different electronic components on the PCB board to be tested; the electronic component qualification rate is obtained according to the first test data, the second test data, the first standard range and the second standard range, the first standard range being a preset data range of the first electronic component, and the second standard range being a preset data range of the second electronic component; the processing unit is used to display the electronic component qualification rate to the user, and store the electronic component qualification rate in the information of the PCB board to be tested.

[0028] Optionally, the processing unit is used to display a prompt message to the user indicating that the PCB board to be tested is not currently placed correctly if the image similarity is less than a preset similarity threshold.

[0029] In a third aspect, the present application provides an electronic device, including a processor, a memory, a user interface and a network interface, the memory being used to store instructions, the user interface and the network interface being used to communicate with other devices, and the processor being used to execute instructions stored in the memory so that the electronic device executes the first aspect above or any possible implementation method of the first aspect.

[0030] In a fourth aspect, the present application provides a computer-readable storage medium, which stores a computer program. The computer program is executed by a processor as in the first aspect or any possible implementation method of the first aspect.

[0031] In summary, one or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0032] 1. The server first obtains the preset positioning point and the actual positioning image corresponding to the preset positioning point, and compares the actual positioning image with the standard positioning image to determine whether the current placement of the PCB board is correct, that is, the server can automatically identify whether the PCB board is placed correctly and perform subsequent steps if it is placed correctly. Determining that the placement is correct also ensures that the electronic components can be correctly positioned later; after the PCB board is placed correctly, the server can automatically obtain the test data of each electronic component and automatically determine whether these test data meet the preset requirements. When there are electronic components whose test data do not meet the requirements, the prompt information that the electronic components have defects can be displayed to the user in time. The whole process does not require the user to find the position of the electronic components one by one, nor does it require the user to use the test equipment to measure the test results one by one, and judge the test results. These processes are all controlled by the server, that is, this technical solution can improve the efficiency of SMT first-piece defect detection.

[0033] 2. The server can obtain the positioning features and positioning feature images in the actual positioning image through the preset feature recognition algorithm trained in advance, and retrieve the standard feature image that is most similar to the actual positioning image by comparing it with the image in the preset feature image library. The standard feature image is used as the standard positioning image to improve the accuracy of identifying the positioning features, and then it can correctly judge whether the PCB board is placed correctly.

[0034] 3. In response to the user's operation of querying the PCB board information, the server can obtain the query field entered by the user, match and search the field with the information in the preset test log, find the PCB board information corresponding to the query field, and display it to the user, thereby improving the efficiency of the user in searching for electronic components or PCB board information. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a flow chart of a method for diagnosing SMT first-piece defects based on artificial intelligence provided in an embodiment of the present application.

[0036] Figure 2 This is a module schematic diagram of a device for diagnosing SMT first-piece defects based on artificial intelligence provided in an embodiment of the present application.

[0037] Figure 3 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0038] Explanation of the reference numerals: 201, acquisition unit; 202, processing unit; 300, electronic device; 301, processor; 302, communication bus; 303, user interface; 304, network interface; 305, memory. DETAILED DESCRIPTION

[0039] In order to enable technicians in this field to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.

[0040] In the description of the embodiments of the present application, words such as "for example" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "for example" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "for example" or "for example" is intended to present related concepts in a specific way.

[0041] In the description of the embodiments of the present application, the meaning of the term "multiple" refers to two or more. For example, multiple systems refer to two or more systems, and multiple screen terminals refer to two or more screen terminals. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. The terms "include", "comprise", "have" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0042] At present, manual inspection is generally adopted. The staff needs to first find the position of the electronic component on the PCB board, and then retrieve the electronic component corresponding to the position on the PCB board according to the position, and then perform data detection on the electronic component and judge the detection result by themselves. At this time, another staff is also required to record the detection result. The PCB board generally has a large number of electronic components. In this case, the efficiency of the staff in performing SMT first-piece defect detection is low. Therefore, this embodiment provides a method and device for diagnosing SMT first-piece defects based on artificial intelligence.

[0043] The method for diagnosing SMT first-piece defects based on artificial intelligence provided in this application can be referred to Figure 1 , Figure 1 The present invention provides a method for diagnosing SMT first-piece defects based on artificial intelligence, which is applied to a server. The method includes steps S101 to S106.

[0044] S101, obtaining preset positioning points and actual positioning images of a PCB board to be tested, where the actual positioning image is an actual captured image of the preset positioning points.

[0045] In the above steps, the server obtains the preset positioning point of the PCB board to be tested. The preset positioning point can be a special mark made on the PCB board by a laser device before the test to judge the placement of the PCB board. It can also be marked in other ways according to the needs of the staff. Obtaining the preset positioning point here means obtaining the position of the preset positioning point on the PCB board to be tested; then, according to the position, the actual shooting image of the preset positioning point is obtained by shooting with a camera device.

[0046] S102: Obtain a standard positioning image and image similarity corresponding to a preset positioning point, where the image similarity is a similarity value between the standard positioning image and the actual positioning image.

[0047] In the above steps, the server obtains a standard positioning image for identifying a preset positioning point, and then obtains image similarity by calculating the similarity between the actual captured image and the standard positioning image.

[0048] In a possible implementation, obtaining a standard positioning image and image similarity corresponding to a preset positioning point specifically includes: obtaining a positioning feature in an actual positioning image according to a preset feature recognition algorithm; intercepting the actual positioning image according to the positioning feature to obtain a positioning feature image, wherein the positioning feature image includes the preset positioning point; comparing the positioning feature image with a first standard feature image and a second standard feature image, respectively, to obtain a first similarity and a second similarity, wherein the first standard feature image and the second standard feature image are any two different images in a preset feature image library, the first similarity is the similarity between the positioning feature image and the first standard feature image, and the second similarity is the similarity between the positioning feature image and the second standard feature image; comparing the first similarity and the second similarity; if the first similarity is greater than the second similarity, taking the first standard feature image as the standard positioning image and taking the first similarity as the image similarity.

[0049] Specifically, the server extracts the positioning features in the actual positioning image according to a preset feature recognition algorithm trained in advance, and intercepts the actual positioning image according to the positioning features to obtain a positioning feature image that only includes the preset positioning points; then the positioning feature image and the image in the preset feature image library are subjected to similarity calculation to obtain multiple similarity values, and the standard feature image with the highest similarity is taken, and the standard feature image is used as the standard positioning image, and the highest similarity value is used as the image similarity, so as to improve the accuracy of identifying the positioning features in the subsequent steps.

[0050] S103: Determine whether the image similarity is greater than or equal to a preset similarity threshold.

[0051] In the above steps, the server determines whether the image similarity is greater than or equal to a preset similarity threshold, and the preset similarity threshold can be set according to the needs of the staff.

[0052] In a possible implementation, after determining whether the image similarity is greater than or equal to a preset similarity threshold, the method further includes: if the image similarity is less than the preset similarity threshold, displaying a prompt message to the user that the PCB board to be tested is not currently placed correctly.

[0053] Specifically, when the image similarity is less than a preset similarity threshold, the server determines that the currently identified positioning feature does not match the preset positioning feature, and then determines that the PCB board to be tested is not currently placed correctly, and displays a prompt message indicating that it is not placed correctly to the user, so as to prompt the user to make adjustments in time.

[0054] S104: If the image similarity is greater than or equal to a preset similarity threshold, it is determined that the PCB to be tested is placed correctly, and test data of the electronic component to be tested is obtained.

[0055] In the above steps, when the image similarity is greater than or equal to the preset similarity threshold, the server determines that the PCB board to be tested is placed correctly and obtains the test data of the electronic component to be tested. The electronic components to be tested here can be multiple or of different types. For the sake of convenience, this embodiment is described with one electronic component to be tested. In actual applications, the electronic component to be tested can be selected according to the needs of the staff.

[0056] In a possible implementation, obtaining test data of an electronic component to be tested specifically includes: obtaining position information of the electronic component to be tested on a PCB board to be tested; transmitting the position information to a preset test device, so that the preset test device locates the electronic component to be tested according to the position information and obtains test data of the electronic component to be tested; and obtaining test data transmitted by the preset test device.

[0057] Specifically, the server first obtains the position information of the electronic component to be tested on the PCB board to be tested. Specifically, the position information can be entered in advance by the staff, or the position information of the electronic component to be tested can be obtained by obtaining the electronic component distribution map. The position information can be stored and used in the form of coordinates; after obtaining the position information, the position information is transmitted to a test device that has been set up in advance. Different types of electronic components may need to transmit the position information to different test devices to successfully obtain the corresponding test data; the test data transmitted by the test device is obtained.

[0058] S105: Determine whether the test data is within a preset standard range of the electronic component to be tested.

[0059] In the above steps, the server determines whether the test data is within the preset standard range of the electronic component to be tested. It should be noted that electronic components of different types or for different purposes may have different standard value ranges. The preset standard range here corresponds to the electronic component to be tested or other electronic components that are also subject to the preset standard range.

[0060] S106: If the test data is not within the preset standard range, a prompt message is displayed to the user to prompt that the electronic component to be tested has a defect.

[0061] In the above steps, when the test data is not within the preset standard range, the server determines that the electronic component currently being tested does not meet the standard and displays a prompt message to the user. The specific display method can be through an indicator light or directly displayed on a display device. The specific display method can be set according to the needs of the staff and is not illustratively limited here.

[0062] In a possible implementation, after displaying a prompt message to the user if the test data is not within a preset standard range, the method further includes: obtaining information of the PCB board to be tested, the information of the PCB board to be tested including an actual positioning image, a standard positioning image, a list of electronic components, a wiring diagram, numbering information of the PCB board to be tested, location information and test data; establishing a correspondence between the information of the PCB board to be tested and the numbering information; and storing the information of the PCB board to be tested, the numbering information and the correspondence in a preset test log to construct a preset test log.

[0063] Specifically, after detecting the electronic components, the server can store the acquired information in a preset test log constructed in advance. The information includes the actual positioning image, the standard positioning image, the electronic component list, the wiring diagram, the numbering information of the PCB board to be tested, the location information and the test data. The information can be consulted by the staff, and the types of information can be added or deleted according to the needs of the staff. In order to facilitate the subsequent search steps, a correspondence between the information of the PCB board to be tested and the numbering information is constructed, so that the information of the PCB board or the information of the electronic component can be retrieved according to the corresponding relationship.

[0064] In a possible implementation, after storing the information of the PCB board to be tested, the numbering information and the corresponding relationship in a preset test log, the method further includes: in response to the user's operation of querying the information of the PCB board to be tested, obtaining the query field input by the user; matching the numbering information in the preset test log according to the query field; obtaining the information of the PCB board to be tested corresponding to the numbering information in the preset test log according to the corresponding relationship; and displaying the information of the PCB board to be tested to the user.

[0065] Specifically, the server can respond to the user's operation of querying the information of the PCB board, obtain the query field input by the user, and match the similar fields in the preset test log according to the query field, obtain the numbering information corresponding to the PCB board where the similar field is located, and obtain the information of the PCB board corresponding to the numbering information according to the corresponding relationship, and display the information of the PCB board to the user. The information of the PCB board to be tested can also be filtered according to the user's conditional filtering settings and then displayed to the user.

[0066] In a possible implementation, after displaying a prompt message to the user if the test data is not within a preset standard range, the method further includes: in response to a user's query operation on the electronic component qualification rate, obtaining first test data of a first electronic component and second test data of a second electronic component, the first electronic component and the second electronic component being any two different electronic components on a PCB board to be tested; obtaining the electronic component qualification rate according to the first test data, the second test data, a first standard range and a second standard range, the first standard range being a preset data range of the first electronic component, and the second standard range being a preset data range of the second electronic component; displaying the electronic component qualification rate to the user, and storing the electronic component qualification rate in the information of the PCB board to be tested.

[0067] Specifically, in response to the user's query operation on the qualification rate of electronic components, the server obtains the test data of all electronic components on the queried PCB board, and automatically determines whether each electronic component is qualified, counts the number of qualified components, and further obtains the qualification rate of the electronic components based on the total number of electronic components. The qualification rate of the electronic components is displayed to the user, and the qualification rate of the electronic components is stored in the information of the PCB board to be tested to meet the user's subsequent query needs.

[0068] The present application also provides a device for diagnosing SMT first-piece defects based on artificial intelligence, referring to Figure 2 The device is a server, and the server includes an acquisition unit 201 and a processing unit 202.

[0069] The acquisition unit 201 is used to acquire the preset positioning points and the actual positioning image of the PCB board to be tested, where the actual positioning image is the actual captured image of the preset positioning points; it is also used to acquire the standard positioning image and image similarity corresponding to the preset positioning points, where the image similarity is the similarity value between the standard positioning image and the actual positioning image; it is also used to determine that the PCB board to be tested is correctly placed if the image similarity is greater than or equal to a preset similarity threshold, and to obtain the test data of the electronic component to be tested.

[0070] The processing unit 202 is used to determine whether the image similarity is greater than or equal to a preset similarity threshold; it is also used to determine whether the test data is within the preset standard range of the electronic component to be tested; it is also used to display a prompt message to the user if the test data is not within the preset standard range to prompt that the electronic component to be tested has a defect.

[0071] In a possible implementation, the acquisition unit 201 is used to acquire the positioning features in the actual positioning image according to a preset feature recognition algorithm; the processing unit 202 is used to intercept the actual positioning image according to the positioning features to obtain a positioning feature image, where the positioning feature image includes a preset positioning point; the positioning feature image is compared with the first standard feature image and the second standard feature image respectively to obtain a first similarity and a second similarity, where the first standard feature image and the second standard feature image are any two different images in a preset feature image library, the first similarity is the similarity between the positioning feature image and the first standard feature image, and the second similarity is the similarity between the positioning feature image and the second standard feature image; the first similarity and the second similarity are compared; if the first similarity is greater than the second similarity, the first standard feature image is used as the standard positioning image, and the first similarity is used as the image similarity.

[0072] In a possible implementation, the acquisition unit 201 is used to obtain position information of the electronic component to be tested on the PCB board to be tested; obtain test data transmitted by a preset test device; the processing unit 202 is used to transmit the position information to the preset test device, so that the preset test device locates the electronic component to be tested according to the position information, and obtains the test data of the electronic component to be tested.

[0073] In a possible implementation, the acquisition unit 201 is used to acquire information of the PCB board to be tested, where the information of the PCB board to be tested includes an actual positioning image, a standard positioning image, a list of electronic components, a wiring diagram, numbering information of the PCB board to be tested, location information, and test data; the processing unit 202 is used to establish a correspondence between the information of the PCB board to be tested and the numbering information; and the information of the PCB board to be tested, the numbering information, and the correspondence are stored in a preset test log to construct a preset test log.

[0074] In a possible implementation, the acquisition unit 201 is used to respond to the user's operation of querying the information of the PCB board to be tested, and obtain the query field input by the user; according to the corresponding relationship, obtain the information of the PCB board to be tested corresponding to the numbering information in the preset test log; the processing unit 202 is used to match the numbering information in the preset test log according to the query field; and display the information of the PCB board to be tested to the user.

[0075] In a possible implementation, the acquisition unit 201 is used to respond to a user's query operation on the electronic component qualification rate, obtain first test data of a first electronic component and second test data of a second electronic component, the first electronic component and the second electronic component being any two different electronic components on the PCB board to be tested; the electronic component qualification rate is obtained according to the first test data, the second test data, the first standard range and the second standard range, the first standard range being a preset data range of the first electronic component, and the second standard range being a preset data range of the second electronic component; the processing unit 202 is used to display the electronic component qualification rate to the user, and store the electronic component qualification rate in the information of the PCB board to be tested.

[0076] In a possible implementation, the processing unit 202 is configured to display a prompt message to the user indicating that the PCB board to be tested is not currently placed correctly if the image similarity is less than a preset similarity threshold.

[0077] It should be noted that: when the device provided in the above embodiment realizes its function, only the division of the above functional modules is used as an example. In actual application, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. In addition, the device and method embodiments provided in the above embodiment belong to the same concept, and the specific implementation process is detailed in the method embodiment, which will not be repeated here.

[0078] The present application also provides an electronic device. Figure 3 , Figure 3 The electronic device 300 may include: at least one processor 301 , at least one communication bus 302 , at least one user interface 303 , a network interface 304 , and a memory 305 .

[0079] The communication bus 302 is used to realize the connection and communication between these components.

[0080] The user interface 303 may include a display screen (Display) and a camera (Camera). Optionally, the user interface 303 may also include a standard wired interface and a wireless interface.

[0081] The network interface 304 may include a standard wired interface or a wireless interface (such as a WI-FI interface).

[0082] Among them, the processor 301 may include one or more processing cores. The processor 301 uses various interfaces and lines to connect various parts in the entire server, and executes various functions of the server and processes data by running or executing instructions, programs, code sets or instruction sets stored in the memory 305, and calling data stored in the memory 305. Optionally, the processor 301 can be implemented in at least one hardware form of digital signal processing (Digital Signal Processing, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA). The processor 301 can integrate one or a combination of a central processing unit (Central Processing Unit, CPU), a graphics processing unit (Graphics Processing Unit, GPU) and a modem. Among them, the CPU mainly processes the operating system, user interface and application programs; the GPU is responsible for rendering and drawing the content to be displayed on the display screen; the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 301, and it can be implemented separately through a chip.

[0083] The memory 305 may include a random access memory (RAM) or a read-only memory (Read-Only Memory). Optionally, the memory 305 includes a non-transitory computer-readable storage medium. The memory 305 may be used to store instructions, programs, codes, code sets or instruction sets. The memory 305 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area may store data involved in the above-mentioned various method embodiments, etc. The memory 305 may also be at least one storage device located away from the aforementioned processor 301. Refer to Figure 3 , the memory 305 as a computer storage medium may include an operating system, a network communication module, a user interface module, and an application for diagnosing SMT first-article defects.

[0084] exist Figure 3In the electronic device 300 shown, the user interface 303 is mainly used to provide an input interface for the user and obtain the data input by the user; and the processor 301 can be used to call the application for diagnosing SMT first-piece defects stored in the memory 305. When executed by one or more processors 301, the electronic device 300 executes one or more methods in the above-mentioned embodiments. It should be noted that for the aforementioned method embodiments, for the sake of simple description, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited to the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required for the present application.

[0085] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0086] The present application also provides a computer-readable storage medium, which stores instructions. When executed by one or more processors, the electronic device executes one or more of the methods described in the above embodiments.

[0087] In the several embodiments provided in this application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some service interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0088] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0089] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0090] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a memory and includes several instructions for a computer device (which can be a personal computer, server or network device, etc.) to execute all or part of the steps of the various embodiments of the present application. The aforementioned memory includes: various media that can store program codes, such as USB flash drives, mobile hard drives, magnetic disks or optical disks.

[0091] The above is only an exemplary embodiment of the present disclosure and cannot be used to limit the scope of the present disclosure. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the disclosure of the specification and the truth of practice, those skilled in the art will easily think of other embodiments of the present disclosure.

[0092] This application is intended to cover any variation, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the art not described in the present disclosure. The description and examples are to be regarded as exemplary only, and the scope and spirit of the present disclosure are defined by the claims.

Claims

1. A method for diagnosing SMT first-piece defects based on artificial intelligence, characterized in that: The method comprises: obtaining a preset positioning point and an actual positioning image of a PCB board to be tested, wherein the actual positioning image is an actual photographed image of the preset positioning point; Obtaining a standard positioning image and image similarity corresponding to the preset positioning point, wherein the image similarity is a similarity value between the standard positioning image and the actual positioning image; the obtaining of the standard positioning image and image similarity corresponding to the preset positioning point specifically includes: obtaining positioning features in the actual positioning image according to a preset feature recognition algorithm; intercepting the actual positioning image according to the positioning features to obtain a positioning feature image, wherein the positioning feature image includes the preset positioning point; comparing the positioning feature image with a first standard feature image and a second standard feature image respectively to obtain a first similarity and a second similarity, wherein the first standard feature image and the second standard feature image are any two different images in a preset feature image library, wherein the first similarity is a similarity between the positioning feature image and the first standard feature image, and the second similarity is a similarity between the positioning feature image and the second standard feature image; comparing the first similarity and the second similarity; if the first similarity is greater than the second similarity, taking the first standard feature image as the standard positioning image and taking the first similarity as the image similarity; Determining whether the image similarity is greater than or equal to a preset similarity threshold; If the image similarity is greater than or equal to the preset similarity threshold, it is determined that the PCB board to be tested is placed correctly, and the test data of the electronic component to be tested is obtained; Determining whether the test data is within a preset standard range of the electronic component to be tested; If the test data is not within the preset standard range, a prompt message is displayed to the user to prompt that the electronic component to be tested has a defect.

2. The method according to claim 1, characterized in that The obtaining of test data of the electronic component to be tested specifically includes: Acquire the position information of the electronic component to be tested on the PCB board to be tested; Transmitting the position information to a preset test device, so that the preset test device locates the electronic component to be tested according to the position information and obtains test data of the electronic component to be tested; Acquire the test data transmitted by the preset test device.

3. The method according to claim 2, characterized in that After displaying the prompt information to the user if the test data is not within the preset standard range, the method further includes: Acquire information of the PCB board to be tested, wherein the information of the PCB board to be tested includes the actual positioning image, the standard positioning image, an electronic component list, a wiring diagram, numbering information of the PCB board to be tested, the location information, and the test data; Constructing a correspondence between the information of the PCB board to be tested and the numbering information; The information of the PCB board to be tested, the numbering information and the corresponding relationship are stored in a preset test log to construct the preset test log.

4. The method according to claim 3, characterized in that After storing the information of the PCB board to be tested, the numbering information and the corresponding relationship in a preset test log, the method further includes: in response to the user's operation of querying the information of the PCB board to be tested, obtaining a query field input by the user; matching the number information in the preset test log according to the query field; According to the corresponding relationship, obtaining information of the PCB board to be tested corresponding to the numbering information in the preset test log; The information of the PCB board to be tested is displayed to the user.

5. The method according to claim 3, characterized in that: After displaying the prompt information to the user if the test data is not within the preset standard range, the method further includes: In response to the user's query operation on the qualified rate of electronic components, first test data of a first electronic component and second test data of a second electronic component are acquired, wherein the first electronic component and the second electronic component are any two different electronic components on the PCB to be tested; Obtaining the electronic component qualification rate according to the first test data, the second test data, a first standard range, and a second standard range, wherein the first standard range is a preset data range of the first electronic component, and the second standard range is a preset data range of the second electronic component; The electronic component qualification rate is displayed to the user, and the electronic component qualification rate is stored in the information of the PCB board to be tested.

6. The method according to claim 1, characterized in that After determining whether the image similarity is greater than or equal to a preset similarity threshold, the method further includes: If the image similarity is less than the preset similarity threshold, a prompt message indicating that the PCB board to be tested is not currently placed correctly is displayed to the user.

7. A device for diagnosing SMT first-piece defects based on artificial intelligence, characterized in that: The device comprises an acquisition unit (201) and a processing unit (202): The acquisition unit (201) is used to acquire a preset positioning point and an actual positioning image of the PCB board to be tested, wherein the actual positioning image is an actual captured image of the preset positioning point; The acquisition unit (201) is further used to acquire a standard positioning image and an image similarity corresponding to the preset positioning point, wherein the image similarity is a similarity value between the standard positioning image and the actual positioning image; the acquisition of the standard positioning image and the image similarity corresponding to the preset positioning point specifically comprises: acquiring positioning features in the actual positioning image according to a preset feature recognition algorithm; intercepting the actual positioning image according to the positioning features to obtain a positioning feature image, wherein the positioning feature image includes the preset positioning point; comparing the positioning feature image with a first standard feature image and a second standard feature image respectively to obtain a first similarity and a second similarity, wherein the first standard feature image and the second standard feature image are any two different images in a preset feature image library, wherein the first similarity is a similarity between the positioning feature image and the first standard feature image, and the second similarity is a similarity between the positioning feature image and the second standard feature image; comparing the first similarity and the second similarity; if the first similarity is greater than the second similarity, taking the first standard feature image as the standard positioning image and taking the first similarity as the image similarity; The processing unit (202) is used to determine whether the image similarity is greater than or equal to a preset similarity threshold; The acquisition unit (201) is further configured to determine that the PCB to be tested is correctly placed if the image similarity is greater than or equal to the preset similarity threshold, and to acquire test data of the electronic component to be tested; The processing unit (202) is further used to determine whether the test data is within a preset standard range of the electronic component to be tested; The processing unit (202) is further configured to display a prompt message to a user if the test data is not within the preset standard range, so as to prompt the user that the electronic component to be tested has a defect.

8. An electronic device, characterized in that: The electronic device (300) comprises a processor (301), a memory (305), a user interface (303) and a network interface (304), wherein the memory (305) is used to store instructions, the user interface (303) and the network interface (304) are used to communicate with other devices, and the processor (301) is used to execute the instructions stored in the memory (305) so that the electronic device (300) executes the method according to any one of claims 1 to 6.

9. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method described in any one of claims 1 to 6 is implemented.

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