Liquid crystal display panel and manufacturing method thereof

Abstract

The application provides a liquid crystal display panel and a preparation method thereof. The liquid crystal display panel has a display area and a non-display area surrounding the display area. The non-display area includes a sealing area and a welding area surrounding the sealing area. The preparation method of the liquid crystal display panel includes arranging a first substrate and a second substrate, the sealing area between the first substrate and the second substrate has a sealing layer, and a plurality of spaced connection structures are formed in the welding area between the first substrate and the second substrate to connect the first substrate and the second substrate. By arranging the welding area surrounding the sealing area in the non-display area of the liquid crystal display panel, welding is performed in the welding area to form a plurality of connection structures spaced along the circumference of the display area. The width of the sealing layer of the sealing area can be reduced, the effect of a narrow frame panel is achieved, the connection structures can enhance the bonding strength between the first substrate and the second substrate, and the physical properties of the narrow frame panel are further enhanced.

Description

TECHNICAL FIELD

[0001] The present application relates to the display technical field, in particular to a liquid crystal display panel and a preparation method thereof. BACKGROUND

[0002] At present, in order to compete with the light emitting diode (LED) large screen direct display industry, the liquid crystal display (LCD) industry begins to innovate and make a lot of narrow frame products. The narrower frame requires extreme design changes to the previous panel structure. Since the width of the frame glue is sacrificed to achieve a narrow frame, the adhesion is reduced when the upper and lower glass substrates are assembled, and the panel body is weakened. The glass panel breakage risk is greatly increased. Although the adhesion can be increased by improving the viscosity of the glue material, it is particularly important to improve the adhesion of the narrow frame product from the design. SUMMARY

[0003] The technical problem solved by the present application is to provide a liquid crystal display panel and a preparation method thereof, which solves the problem of reduced adhesion of the narrow frame panel in the prior art.

[0004] To solve the above technical problems, the first technical solution adopted by the present application is to provide a preparation method of a liquid crystal display panel, the liquid crystal display panel having a display area and a non-display area surrounding the display area, the non-display area including a sealing area and a welding area surrounding the sealing area; the preparation of the liquid crystal display panel includes:

[0005] positioning the first substrate and the second substrate, the sealing area between the first substrate and the second substrate having a sealing layer;

[0006] forming a plurality of spaced connection structures in the welding area between the first substrate and the second substrate to connect the first substrate and the second substrate.

[0007] Among them, positioning the first substrate and the second substrate, the sealing area between the first substrate and the second substrate having a sealing layer includes: dropping liquid crystal molecules in the display area of the first substrate or the second substrate; coating a negative photosensitive material in the part of the sealing area of the first substrate or the second substrate adjacent to the display area; aligning the first substrate and the second substrate, so that the liquid crystal molecules form a liquid crystal layer between the first substrate and the second substrate in the display area, and the negative photosensitive material contacts the first substrate and the second substrate in the sealing area; and performing exposure treatment on the negative photosensitive material to solidify the negative photosensitive material to form a sealing layer.

[0008] The step of forming the plurality of spaced connection structures in the welding area between the first substrate and the second substrate further comprises: roughening the surface of the first substrate corresponding to the welding area and / or the surface of the second substrate corresponding to the welding area.

[0009] The roughening treatment is performed on the surface of the first substrate corresponding to the welding area and / or the surface of the second substrate corresponding to the welding area, and the depth of the surface gap after the roughening treatment ranges from 0.5 microns to 3 microns.

[0010] The step of forming the plurality of spaced connection structures in the welding area between the first substrate and the second substrate to connect the first substrate and the second substrate comprises: filling the welding area between the first substrate and the second substrate with solder; and welding the first substrate and the second substrate by irradiating the solder with a welding laser.

[0011] The step of forming the plurality of spaced connection structures in the welding area between the first substrate and the second substrate to connect the first substrate and the second substrate comprises: welding the part of the welding area between the first substrate and the second substrate that is misaligned with the conductive structure of the sealing area to form a welding structure, and the welding structure is misaligned with the conductive structure.

[0012] The first substrate comprises a first substrate and a first functional layer disposed on the first substrate close to the second substrate; the second substrate comprises a second substrate and a second functional layer disposed on the second substrate close to the first substrate; part of the periphery of the first functional layer is located in the non-display area; part of the periphery of the second functional layer is located in the non-display area.

[0013] The sealing area between the first substrate and the second substrate has a sealing layer, and the sealing layer is arranged in the gap between the first functional layer and the second functional layer located in the non-display area.

[0014] The step of forming the plurality of spaced connection structures in the welding area between the first substrate and the second substrate to connect the first substrate and the second substrate comprises: welding the gap between the first substrate and the second substrate corresponding to the welding area.

[0015] The width of the sealing layer ranges from 100 microns to 500 microns, and the width of the to-be-connected area is not less than 150 microns.

[0016] To solve the above technical problems, the second technical solution adopted by the present application is to provide a liquid crystal display panel, which has a display area and a non-display area surrounding the display area, and the non-display area comprises a sealing area and a welding area surrounding the sealing area; the liquid crystal display panel comprises:

[0017] The first substrate and the second substrate are oppositely arranged.

[0018] A liquid crystal layer is arranged between the first substrate and the second substrate and located in the display region.

[0019] A sealing layer is arranged between the first substrate and the second substrate and located in the sealing region.

[0020] A plurality of spaced connection structures are located in the welding region and connect the first substrate and the second substrate.

[0021] The material of the sealing layer is a negative photosensitive material, the sealing region further comprises a conductive structure, and the connection structure is arranged in a staggered manner with the conductive structure.

[0022] The liquid crystal display panel provided by the application has a display region and a non-display region surrounding the display region, the non-display region comprises a sealing region and a welding region surrounding the sealing region, and the preparation method of the liquid crystal display panel comprises arranging the first substrate and the second substrate in a pair, the sealing layer is arranged in the sealing region between the first substrate and the second substrate, and the plurality of spaced connection structures are formed in the welding region between the first substrate and the second substrate to connect the first substrate and the second substrate. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0024] Figure 1 is a structural schematic diagram of the liquid crystal display panel provided by the application;

[0025] Figure 2 is a flowchart of the preparation method of the liquid crystal display panel provided by the application;

[0026] Figure 3 is Figure 2 is a flowchart of step S1 of the preparation method of the liquid crystal display panel provided by the application;

[0027] Fig. 4 (a)~Fig. 4 (d) are Figure 2 is a structural schematic diagram of step S1 of the preparation method of the liquid crystal display panel provided by the application;

[0028] Figure 5 is Figure 2 The structural schematic diagram of step S2 of the preparation method of the liquid crystal display panel provided by the application is shown in the figure.

[0029] Figure 6 is Figure 2 The structural schematic diagram of step S2 of the preparation method of the liquid crystal display panel provided by the application is shown in the figure.

[0030] Reference signs:

[0031] Liquid crystal display panel 100, display area 101, non-display area 102, sealing area 103, welding area 104, welding position 105, first substrate 1, first substrate 11, first functional layer 12, pixel electrode layer 121, first alignment layer 122, second substrate 2, second substrate 21, second functional layer 22, black matrix 221, color resistance layer 222, common electrode layer 223, second alignment layer 224, liquid crystal layer 3, sealing layer 4, conductive structure 41, connection structure 5. DETAILED DESCRIPTION

[0032] The scheme of the embodiments of the application will be described in detail below in combination with the drawings of the specification.

[0033] In the following description, specific details are set forth in order to provide a thorough understanding of the application. However, persons having ordinary skill in the art will realize that the application can be practiced without some or all of these details. For the purpose of explanation, specific details are presented in the description of the application.

[0034] The term "and / or", merely describes an association relationship of associated objects, and indicates that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are a "or" relationship. In addition, "multiple" in this paper means two or more than two.

[0035] In order to enable those skilled in the art to better understand the technical scheme of the application, the liquid crystal display panel and the preparation method thereof provided by the application will be described in further detail below in combination with the drawings and specific embodiments.

[0036] Please refer to Figure 1 , Figure 1 The structural schematic diagram of the liquid crystal display panel provided by the application is shown in the figure.

[0037] Please refer to Figure 1 The liquid crystal display panel 100 provided by the embodiment has a display area 101 and a non-display area 102 surrounding the display area 101. The non-display area 102 includes a sealing area 103 and a welding area 104 surrounding the sealing area 103, and the welding area 104 is arranged on the side of the sealing area 103 away from the display area 101.

[0038] The liquid crystal display panel 100 comprises a first substrate 1, a second substrate 2, and a liquid crystal layer 3 disposed between the first substrate 1 and the second substrate 2. The first substrate 1 and the second substrate 2 each have a display area 101 and a non-display area 102 surrounding the display area 101. The liquid crystal layer 3 is disposed in the display area 101 between the first substrate 1 and the second substrate 2. The non-display area 102 between the first substrate 1 and the second substrate 2 comprises a sealing area 103 and a soldering area 104. A sealing layer 4 is disposed in the sealing area 103, and the sealing layer 4 is disposed along the circumference of the display area 101 to seal the liquid crystal layer 3. The soldering area 104 is provided with a plurality of connection structures 5, which can be soldering structures formed by directly soldering or formed by filling prefabricated fixing pieces in the soldering area 104 and then soldering. Specifically, the plurality of connection structures 5 are disposed along the circumference of the display area 101 at intervals.

[0039] In an embodiment, the first substrate 1 can be a color film substrate, and the second substrate 2 can be an array substrate. In another embodiment, the first substrate 1 can be an array substrate, and the second substrate 2 can be a color film substrate.

[0040] In the following embodiments, the first substrate 1 is taken as an array substrate, and the second substrate 2 is taken as a color film substrate.

[0041] In this embodiment, the first substrate 1 comprises a first substrate 11 and a first functional layer 12 disposed on the first substrate 11 close to the second substrate 2. The first functional layer 12 is disposed in the display area 101 and the sealing area 103 of the first substrate 11. Specifically, the first functional layer 12 comprises a pixel electrode layer 121 and a first alignment layer 122 which are sequentially stacked on the first substrate 11. The pixel electrode layer 121 is disposed in the display area 101 and the sealing area 103 of the first substrate 1; the first alignment layer 122 is disposed in the display area 101 of the first substrate 1. The material of the pixel electrode layer 121 is indium tin oxide (ITO), indium zinc oxide (IZO), etc.; the material of the first alignment layer 122 is polyimide (PI).

[0042] In the embodiment, the second substrate 2 comprises a second substrate 21 and a second functional layer 22 disposed on the second substrate 21 close to the first substrate 1. The second functional layer 22 is disposed on the display area 101 and the sealing area 103 of the second substrate 21. Specifically, the second functional layer 22 comprises a black matrix 221, a color resist layer 222, a common electrode layer 223 and a second alignment layer 224. The color resist layer 222 comprises a first color resist, a second color resist and a third color resist. The black matrix 221 is arrayed in the display area 101 of the second substrate 21, and the black matrix 221 defines a plurality of sub-pixel areas, each of which is provided with one of the first color resist, the second color resist and the third color resist. Specifically, the first color resist is red, the second color resist is blue, and the third color resist is green.

[0043] The common electrode layer 223 is disposed on the side of the color resist layer 222 and the black matrix 221 away from the second substrate 21, and the common electrode is disposed on the display area 101 and the sealing area 103 of the second substrate 2. The second alignment layer 224 is disposed on the side of the common electrode layer 223 away from the second substrate 21, and the second alignment layer 224 is disposed on the display area 101 of the second substrate 2. The material of the common electrode layer 223 is indium tin oxide (ITO), indium zinc oxide (IZO) or the like; and the material of the second alignment layer 224 is polyimide (PI).

[0044] In an embodiment, the liquid crystal layer 3 is disposed between the display area 101 of the opposite first substrate 1 and the display area 101 of the second substrate 2. Specifically, the first functional layer 12 or the second functional layer 22 in the display area 101 is dripped with liquid crystal molecules, and the first substrate 1 and the second substrate 2 are aligned so that the liquid crystal molecules are formed between the first substrate 1 and the second substrate 2 in the display area 101 to form the liquid crystal layer 3.

[0045] In the embodiment, the width of the sealing area 103 can be greater than the width of the welding area 104.

[0046] In an embodiment, the sealing layer 4 is disposed between the first substrate 1 and the second substrate 2, and is located in the sealing area 103 in the non-display area 102. The sealing layer 4 is disposed along the periphery of the display area 101 to seal the liquid crystal layer 3. Specifically, the sealing layer 4 is disposed between the pixel electrode layer 121 and the common electrode layer 223 in the sealing area 103, so that the end of the first alignment layer 122 and the end of the second alignment layer 224 are in close contact with the sealing layer 4, and the first alignment layer 122, the second alignment layer 224 and the sealing layer 4 cooperate to seal the liquid crystal layer 3. The material of the sealing layer 4 can be a negative photosensitive material. For example, the material of the sealing layer 4 is a negative photoresist. The width of the sealing layer 4 ranges from 100 microns to 500 microns. Specifically, the width of the sealing layer 4 can be 100 microns, 150 microns, 200 microns, 250 microns, 300 microns, 350 microns, 400 microns, 450 microns, or 500 microns.

[0047] In an embodiment, the conductive structure 41 is disposed in the sealing layer 4, and the conductive structure 41 is used to conduct the pixel electrode layer 121 on the first substrate 1 and the common electrode layer 223 on the second substrate 2. For example, the conductive structure 412 can be a conductive gold ball.

[0048] The plurality of spaced-apart connection structures 5 connecting the first substrate 1 and the second substrate 2 are disposed in the welding area 104. Specifically, the plurality of spaced-apart connection structures 5 along the display area 101 are disposed between the first substrate 11 and the second substrate 21 in the welding area 104, so that the first substrate 11 and the second substrate 21 are connected by the plurality of connection structures 5. The spacing between the first substrate 11 and the second substrate 21 can be 1.5 microns, 2.0 microns, 2.5 microns, etc. The materials of the first substrate 11 and the second substrate 21 are glass. The width of the welding area 104 is not less than 150 microns. Specifically, the width of the welding area 104 can be not less than 200 microns. Specifically, in order to protect the conductive structure 41 from being damaged, the connection structure 5 is disposed in a staggered manner with the conductive structure 41.

[0049] Since the plurality of connection structures 5 disposed in a staggered manner with the conductive structure 41 can improve the connection firmness between the first substrate 1 and the second substrate 2, greatly improve the physical quality of the liquid crystal display panel 100, and thus the width of the sealing layer 4 can be further reduced, and a liquid crystal display panel 100 with a narrower frame can be made.

[0050] The liquid crystal display panel provided by the embodiment has a display area and a non-display area surrounding the display area, and the non-display area includes a sealing area and a welding area surrounding the sealing area; the liquid crystal display panel includes a first substrate and a second substrate arranged oppositely; a liquid crystal layer is arranged between the first substrate and the second substrate and located in the display area; a sealing layer is arranged between the first substrate and the second substrate and located in the sealing area; a plurality of connection structures spaced along the circumference of the display area are located in the welding area and connect the first substrate and the second substrate. In the application, the liquid crystal is sealed by the sealing layer, the welding area surrounding the sealing area is arranged in the non-display area, and the welding in the welding area forms a plurality of connection structures spaced along the circumference of the display area, which not only reduces the width of the sealing layer in the sealing area and realizes the effect of a narrow-frame panel, but also enhances the adhesion of the narrow-frame panel and the physical quality of the narrow-frame panel through the connection structures.

[0051] Referring to Figure 2 , Figure 2 is a flowchart of a preparation method of a liquid crystal display panel 100 provided by the embodiment.

[0052] The embodiment provides a preparation method of a liquid crystal display panel 100, the liquid crystal display panel 100 has a display area 101 and a non-display area 102 surrounding the display area 101, the non-display area 102 includes a sealing area 103 and a welding area 104 surrounding the sealing area 103, and the preparation method of the liquid crystal display panel 100 includes the following steps.

[0053] Referring to Figure 3 and FIGS. 4(a)-4(d), Figure 3 is Figure 2 a flowchart of step S1 of the preparation method of the liquid crystal display panel 100 provided by the embodiment, and FIGS. 4(a)-4(d) are structural schematic diagrams of step S1 of the preparation method of the liquid crystal display panel 100 provided by the embodiment. Figure 2

[0054] S1: arranging a first substrate and a second substrate, and arranging a sealing layer in a sealing area between the first substrate and the second substrate.

[0055] Specifically, forming the sealing layer 4 in the sealing area 103 between the first substrate 1 and the second substrate 2 specifically includes the following steps.

[0056] In the embodiment, the first substrate 1 is taken as an array substrate, and the second substrate 2 is taken as a color film substrate.

[0057] S11: dropping liquid crystal molecules in the display area of the first substrate or the second substrate.

[0058] ​Referring to FIG. 4(a), specifically, the first substrate 1 and the second substrate 2 each have a display area 101 and a non-display area 102 surrounding the display area 101. The non-display area 102 of the first substrate 1 and the second substrate 2 each has a sealing area 103 and a solder area 104. The width of the sealing area 103 is greater than the width of the solder area 104.

[0059] In this embodiment, the first substrate 1 includes a first substrate 11 and a first functional layer 12 disposed on the first substrate 11 close to the second substrate 2. The first functional layer 12 is disposed on the display area 101 and the sealing area 103 of the first substrate 11. Specifically, the first functional layer 12 includes a pixel electrode layer 121 and a first alignment layer 122 disposed on the first substrate 11 in sequence. The pixel electrode layer 121 is disposed on the display area 101 and the sealing area 103 of the first substrate 1; the first alignment layer 122 is disposed on the display area 101 of the first substrate 1. The material of the pixel electrode layer 121 is indium tin oxide (ITO), indium zinc oxide (IZO), etc.; the material of the first alignment layer 122 is polyimide (PI).

[0060] In this embodiment, the second substrate 2 includes a second substrate 21 and a second functional layer 22 disposed on the second substrate 21 close to the first substrate 1. The second functional layer 22 is disposed on the display area 101 and the sealing area 103 of the second substrate 21. Specifically, the second functional layer 22 includes a black matrix 221, a color resistance layer 222, a common electrode layer 223, and a second alignment layer 224. The color resistance layer 222 includes a first color resistance, a second color resistance, and a third color resistance. The black matrix 221 is arrayed in the display area 101 of the second substrate 21, and the black matrix 221 defines a plurality of sub-pixel regions, each of which is provided with one of the first color resistance, the second color resistance, and the third color resistance. Specifically, the first color resistance is red, the second color resistance is blue, and the third color resistance is green.

[0061] The common electrode layer 223 is disposed on the side of the color resistance layer 222 and the black matrix 221 away from the second substrate 21, and the common electrode is disposed on the display area 101 and the sealing area 103 of the second substrate 2. The second alignment layer 224 is disposed on the side of the common electrode layer 223 away from the second substrate 21, and the second alignment layer 224 is disposed on the display area 101 of the second substrate 2. The material of the common electrode layer 223 is indium tin oxide (ITO), indium zinc oxide (IZO), etc.; the material of the second alignment layer 224 is polyimide (PI).

[0062] In one embodiment, the liquid crystal molecules are dropped on the surface of the first functional layer 12 in the display area 101 away from the first substrate 11, or the second functional layer 22 in the display area 101 away from the second substrate 21. Please refer to Fig. 4(b), in this embodiment, the liquid crystal molecules are dropped on the surface of the first functional layer 12 in the display area 101 away from the first substrate 11.

[0063] S12: Apply the negative photosensitive material on the part of the sealing area of the first substrate or the second substrate adjacent to the display area.

[0064] Specifically, the negative photosensitive material is applied on the surface of the pixel electrode layer 121 in the non-display area 102 away from the first substrate 11, and the negative photosensitive material on the pixel electrode layer 121 surrounds the display area 101 on the first substrate 1. The negative photosensitive material on the pixel electrode layer 121 away from the surface of the first substrate 11 is not lower than the surface of the second alignment layer 122 away from the second substrate 21, or the negative photosensitive material is applied on the surface of the common electrode layer 223 in the non-display area 102 away from the second substrate 21, and the negative photosensitive material on the common electrode layer 223 surrounds the display area 101 on the second substrate 2. The negative photosensitive material on the common electrode layer 223 away from the surface of the second substrate 21 is not lower than the surface of the second alignment layer 224 away from the second substrate 21. Please refer to Fig. 4(c), in this embodiment, the negative photosensitive material is applied on the surface of the common electrode layer 223 in the non-display area 102 away from the second substrate 21, and the negative photosensitive material on the common electrode layer 223 surrounds the display area 101 on the second substrate 2.

[0065] In this embodiment, the negative photosensitive material is a negative photoresist.

[0066] S13: Align the first substrate with the second substrate, so that the liquid crystal molecules form a liquid crystal layer between the first substrate and the second substrate in the display area, and the negative photosensitive material contacts the first substrate and the second substrate in the sealing area.

[0067] Specifically, please refer to Fig. 4(d), the first substrate 1 is aligned with the second substrate 2, i.e. the first alignment layer 122 of the first substrate 1 corresponding to the display area 101 is aligned with the second alignment layer 224 of the second substrate 2, and the pixel electrode layer 121 of the first substrate 1 corresponding to the non-display area is aligned with the common electrode layer 223 of the second substrate 2. The liquid crystal molecules form a liquid crystal layer 3 between the first alignment layer 122 of the first substrate 1 and the second alignment layer 224 of the second substrate 2, and the negative photosensitive material contacts the pixel electrode layer 121 of the first substrate 1 and the common electrode layer 223 of the second substrate 2.

[0068] S14: exposing the negative photosensitive material to light to solidify the negative photosensitive material to form a sealing layer.

[0069] Specifically, referring to FIG. 4(d), the negative photosensitive material in the first substrate 1 and the second substrate 2 obtained by the alignment in the step S13 is exposed to light to solidify the negative photosensitive material in the gap between the first substrate 1 and the second substrate 2 to form a sealing layer 4. The sealing layer 4 is formed in the sealing area 103 between the first substrate 1 and the second substrate 2 to cooperate with the gasket layer to seal the liquid crystal layer 3 of the display area 101. The conductive structure 41 is also arranged in the sealing layer 4, and the pixel electrode layer 121 in the first substrate 1 is connected to the common electrode layer 223 in the second substrate 2 through the conductive structure 41.

[0070] The width of the sealing layer 4 ranges from 300 microns to 500 microns. For example, the width of the sealing layer 4 can be 300 microns, 350 microns, 400 microns, 450 microns, or 500 microns, etc.

[0071] Referring to Figure 5 and Figure 6 , Figure 5 is Figure 2 a structure diagram of the step S2 of the preparation method of the liquid crystal display panel 100 provided by the present application, Figure 6 is Figure 2 a top view structure diagram of the step S2 of the preparation method of the liquid crystal display panel 100 provided by the present application.

[0072] S2: forming a plurality of spaced connection structures in the welding area between the first substrate and the second substrate to connect the first substrate and the second substrate.

[0073] Specifically, the gap between the first substrate 11 and the second substrate 21 corresponding to the welding area 104 of the non-display area 102 is welded to enhance the connection strength between the first substrate 1 and the second substrate 2.

[0074] Referring to Figure 5 , the welding area 104 between the first substrate 1 and the second substrate 2 determines the welding position 105 to be welded to facilitate the formation of the welding structure by laser welding at the welding position 105 to be welded to connect the first substrate 1 and the second substrate 2.

[0075] In order to protect the conductive structure 41 in the sealing layer 4, the welding position 105 to be welded is arranged in a staggered manner with the conductive structure 41 to avoid damaging the conductive structure 41 in the process of laser welding.

[0076] Referring to Figure 6In an embodiment, a plurality of spaced apart welding locations 105 are defined on the welding area 104 of the first substrate 11 and the second substrate 21 along the circumference of the sealing layer 4, and the welding locations 105 are arranged in a staggered manner with the conductive structure 41 in the sealing layer 4. The spacing between the first substrate 11 and the second substrate 21 can be 1.5 microns, 2.0 microns, 2.5 microns, etc. The materials of the first substrate 11 and the second substrate 21 are glass. The width of the welding area 104 is not less than 150 microns. Specifically, the width of the welding area 104 can be not less than 150 microns. In some embodiments, the width of the welding area 104 is not less than 200 microns.

[0077] In an embodiment, the first substrate 11 and the second substrate 21 at each welding location 105 can be melted by laser welding to form a molten pool, and the molten pool is cooled and solidified to form a connecting structure 5. The first substrate 11 and the second substrate 21 are connected by the connecting structure 5, and the first substrate 1 and the second substrate 2 are connected by a plurality of connecting structures 5 arranged along the circumference of the display area 101. The connecting structure 5 of the welding area 104 is arranged in a staggered manner with the conductive structure 41 of the sealing area 103 of the non-display area 102, which can effectively prevent the conductive structure 41 in the liquid crystal display panel 100 from being damaged. The width of the connecting structure 5 can be 150 microns, 180 microns, 200 microns, or 250 microns, etc.

[0078] Since the plurality of connecting structures 5 arranged in a staggered manner with the conductive structure 41 can improve the connection strength between the first substrate 1 and the second substrate 2, and greatly improve the physical properties of the liquid crystal display panel 100, the width of the sealing layer 4 can be further reduced, i.e., the width of the sealing layer 4 of the liquid crystal display panel 100 can be in the range of 100 microns to 300 microns, for example, the width of the sealing layer 4 can be 100 microns, 150 microns, 200 microns, 250 microns, etc., and a liquid crystal display panel 100 with a narrower frame can be manufactured.

[0079] In another embodiment, the solder is filled in the to-be-soldered position 105 of the soldering area 104 between the first substrate 1 and the second substrate 2; the first substrate 1 and the second substrate 2 are soldered by using the soldering laser to irradiate the solder, so as to form the connecting structure 5 at the to-be-soldered position 105 between the first substrate 1 and the second substrate 2 and away from the conductive structure 41 of the sealing area 103, and the connecting structure 5 is arranged away from the conductive structure 41. Specifically, the solder is opaque pigment or glass fiber, and the solder is filled in the to-be-soldered position 105 between the corresponding first substrate 11 and second substrate 21 of the soldering area 104, so that the absorption rate of the laser can be increased, the solder can be melted and connected with the first substrate 11 and the second substrate 21 after being irradiated by the laser, and the process parameters can be adjusted by using the focusing mirror, the automatic focal length compensation and the precise motion control system, so that the gap between the first substrate 11 and the second substrate 21 is not less than 1.50 microns. By adding the soldering auxiliary material at the soldering position of the soldering area 104, the soldering laser is focused on the soldering auxiliary material, the soldering auxiliary material is first melted and then solidified, and the adhesion between the first substrate 1 and the second substrate 2 is further increased, so that the display panel is strengthened.

[0080] In an embodiment, after step S1, the method further comprises: roughening the surface of the first substrate 1 corresponding to the soldering area 104 and / or the surface of the second substrate 2 corresponding to the soldering area 104, and the depth of the surface gap after the roughening treatment ranges from 0.5 microns to 3 microns.

[0081] The roughening treatment can be performed only on the surface of the first substrate 11 of the soldering area 104 close to the second substrate 21, or only on the surface of the second substrate 21 of the soldering area 104 close to the second substrate 21, or on the surfaces of the first substrate 11 and the second substrate 21 of the soldering area 104 close to each other. Specifically, the roughening treatment can be performed only on the to-be-soldered position 105 in the soldering area 104, for example, by using the drop corrosion method for local corrosion.

[0082] In the embodiment, the acid pickling etching process is used for roughening treatment. Specifically, the acid etching liquid is used to chemically react with dirt and oxides on the surface of the first substrate 11 and / or the second substrate 21, so that the surface is corroded or dissolved. The acid etching liquid can be selected from organic acid, inorganic acid, hydrofluoric acid, etc. In the embodiment, the acid pickling etching is used to increase the roughness of the substrate surface, and the connection strength between the connecting structure 5 and the first substrate 11 and the second substrate 21 can be further improved.

[0083] The depth of the surface gap after the roughening treatment ranges from 0.5 microns to 3 microns, that is, the acid pickling etching depth ranges from 0.5 microns to 3 microns. For example, the acid pickling etching depth can be 0.5 microns, 1 micron, 1.5 microns, 2 microns, 2.5 microns, 3 microns, etc.

[0084] The preparation method of the liquid crystal display panel provided by the embodiment has a display area and a non-display area surrounding the display area, the non-display area includes a sealing area and a welding area surrounding the sealing area; the preparation method of the liquid crystal display panel includes arranging a first substrate and a second substrate, the sealing area between the first substrate and the second substrate has a sealing layer; welding the welding area between the first substrate and the second substrate to form a plurality of connection structures spaced along the circumference of the display area, so as to connect the first substrate and the second substrate. By arranging the welding area surrounding the sealing area in the non-display area of the liquid crystal display panel, and welding the welding area to form a plurality of connection structures spaced along the circumference of the display area, the width of the sealing layer of the sealing area can be reduced, the effect of a narrow-frame panel can be achieved, the bonding strength between the first substrate and the second substrate can be enhanced through the connection structures, and the physical quality of the narrow-frame panel can be further enhanced.

[0085] The above is only an embodiment of the application, and does not limit the patent protection scope of the application. Any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields based on the content of the specification and drawings, is also included in the patent protection scope of the application.

Claims

1. A method for manufacturing a liquid crystal display panel, the liquid crystal display panel having a display area and a non-display area surrounding the display area, the non-display area including a sealing area and a welding area surrounding the sealing area; characterized in that, The preparation method comprises: The first substrate and the second substrate are arranged, and the sealing area between the first substrate and the second substrate has a sealing layer; A plurality of spaced connection structures are formed in the welding area between the first substrate and the second substrate to connect the first substrate and the second substrate; Wherein, the sealing area further comprises a conductive structure, The step of forming a plurality of spaced connection structures in the welding area between the first substrate and the second substrate to connect the first substrate and the second substrate comprises: Welding is performed on the part of the welding area between the first substrate and the second substrate which is misaligned with the conductive structure of the sealing area, to form a welding structure which is misaligned with the conductive structure.

2. The preparation method according to claim 1, wherein The first substrate and the second substrate are arranged, and the sealing area between the first substrate and the second substrate has a sealing layer comprises: Liquid crystal molecules are dropped on the display area of the first substrate or the second substrate; A negative photosensitive material is coated on the part of the sealing area of the first substrate or the second substrate adjacent to the display area; The first substrate and the second substrate are aligned so that the liquid crystal molecules form a liquid crystal layer between the first substrate and the second substrate in the display area, and the negative photosensitive material contacts the first substrate and the second substrate in the sealing area; The negative photosensitive material is exposed to form the sealing layer.

3. The preparation method according to claim 1, wherein Before the step of forming a plurality of spaced connection structures in the welding area between the first substrate and the second substrate, the method further comprises: The surface of the first substrate corresponding to the welding area and / or the surface of the second substrate corresponding to the welding area is roughened.

4. The production method according to claim 3, characterized by, The surface roughening treatment is performed on the surface of the first substrate corresponding to the welding area and / or the surface of the second substrate corresponding to the welding area, and the depth of the surface gap after the roughening treatment ranges from 0.5 microns to 3 microns.

5. The preparation method according to claim 1, wherein The step of forming a plurality of spaced connection structures in the welding area between the first substrate and the second substrate to connect the first substrate and the second substrate comprises: The welding area between the first substrate and the second substrate is filled with solder at intervals; The first substrate and the second substrate are welded by irradiating the solder with a welding laser.

6. The method of claim 1, wherein, The first substrate comprises a first substrate and a first functional layer arranged on the first substrate close to the second substrate; the second substrate comprises a second substrate and a second functional layer arranged on the second substrate close to the first substrate; part of the periphery of the first functional layer is located in the non-display area; part of the periphery of the second functional layer is located in the non-display area; The sealing area between the first substrate and the second substrate has a sealing layer, which comprises: The sealing layer is arranged in a gap between the first functional layer and the second functional layer in the non-display area; The welding area between the first substrate and the second substrate forms a plurality of spaced connection structures to connect the first substrate and the second substrate, comprising: The gap between the first substrate and the second substrate corresponding to the welding area is welded.

7. The preparation method according to claim 1, characterized in that, The width of the sealing layer ranges from 100 microns to 500 microns, and the width of the welding area is not less than 150 microns.

8. A liquid crystal display panel, the liquid crystal display panel having a display area and a non-display area surrounding the display area, the non-display area comprising a sealing area and a welding area surrounding the sealing area; the liquid crystal display panel comprising: Oppositely arranged first substrate and second substrate; A liquid crystal layer arranged between the first substrate and the second substrate and located in the display area; A sealing layer arranged between the first substrate and the second substrate and located in the sealing area; Further comprising: A plurality of spaced connection structures in the welding area connecting the first substrate and the second substrate; The sealing area further comprises a conductive structure, and the connection structure is arranged in a staggered manner with the conductive structure.

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