A semiconductor packaging device

Abstract

The present invention discloses a semiconductor packaging device, belonging to the technical field of semiconductor packaging equipment. It includes a base, on which an arc-shaped fixing plate is fixedly installed. There are two symmetrically arranged welding grooves on the arc-shaped fixing plate. A welding mechanism and a detection mechanism are also arranged on the base. The welding mechanism includes two symmetrically arranged welding torches, which are used for welding the semiconductor. The detection mechanism includes two symmetrically arranged power connection posts, which are slidably installed on the arc-shaped fixing plate and are used for detecting the semiconductor placed in the arc-shaped fixing plate. The present invention automatically completes the packaging of the semiconductor through the welding mechanism and the detection mechanism, with a simple structure and convenient operation.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging equipment, and particularly relates to a semiconductor packaging device. Background Art

[0002] Semiconductor packaging technology is one of the important processes for protecting and connecting semiconductor chips. With the development of semiconductor technology, packaging technology is also constantly evolving. The traditional packaging method is dual-lead packaging, and with the development of technology, the common packaging methods now have become more complex and high-density packaging forms, such as ball grid array and lead-free packaging. However, although the existing semiconductor packaging technology has made great progress, there are still some limitations. For example, existing packaging devices often can only complete a part of the packaging process, such as soldering or encapsulation, and cannot simultaneously complete the detection and soldering of semiconductor devices. This leads to a reduction in production efficiency and an increase in costs.

[0003] A Chinese invention patent with the publication number CN113725129B discloses a semiconductor packaging device, including a device main body, a processing frame, a feeding rack, and a packaging device. A control panel is fixedly connected to the top of the front surface of the processing frame, and detection light curtains are fixedly connected to both sides of the bottom of the front surface of the processing frame. Although this patent can complete the packaging of semiconductors, it cannot perform pre-detection on semiconductors, thus easily packaging incorrectly installed semiconductors, resulting in waste. In view of the above problems, the present invention provides a semiconductor packaging device. Summary of the Invention

[0004] In view of the above technical problems, the technical solution adopted by the present invention is: a semiconductor packaging device, including a base, an arc-shaped fixing plate is fixedly installed on the base, two symmetrically arranged welding grooves are provided on the arc-shaped fixing plate, and a welding mechanism and a detection mechanism are also provided on the base.

[0005] The welding mechanism includes two symmetrically arranged welding torches, and the welding torches are used for welding semiconductors.

[0006] The detection mechanism includes two symmetrically arranged power connection posts, the power connection posts are slidably installed on the arc-shaped fixing plate, and the power connection posts are used for detecting the semiconductors placed in the arc-shaped fixing plate.

[0007] Further, the welding mechanism includes two symmetrically arranged sleeves which are rotatably mounted on the base. One end of the sleeve is coaxially and fixedly connected to one end of the rotating shaft, the other end of the rotating shaft is fixedly connected to one end of the second connecting rod, the other end of the second connecting rod is rotatably connected to one end of the first connecting rod, the other end of the first connecting rod is rotatably mounted on the rotating disk, the rotating disk is coaxially and fixedly connected to the large gear, the large gear and the rotating disk are rotatably mounted on the arc-shaped fixing plate, and the large gear is connected to the driving mechanism.

[0008] Further, the welding torch is slidably mounted on the mounting head and is in sliding fit with the sleeve. The mounting head is fixedly mounted on the sleeve, one end of the return spring is fixedly mounted on the mounting head, and the other end of the return spring is fixedly mounted on the welding torch; a collecting cylinder is fixedly mounted on the mounting head. The collecting cylinder is of a hollow structure, and a scraping plate is fixedly mounted at one end of the collecting cylinder away from the mounting head.

[0009] Further, a counterweight is fixedly mounted on the large gear.

[0010] Further, the detection mechanism further includes two symmetrically arranged connecting heads which are respectively fixedly connected to two power connection posts. One end of a pull rod is rotatably connected to the connecting head, the other end of the pull rod is rotatably connected to a horizontal rod, the horizontal rod is fixedly connected to a sliding rod, the sliding rod is in sliding fit with the first sliding groove on the base, and the first sliding groove is connected to the driving mechanism.

[0011] Further, the driving mechanism includes a cam which is fixedly connected to a rotating shaft. The rotating shaft is rotatably mounted on the base. The output shaft of a first motor is fixedly connected to the cam, the first motor is fixedly mounted on the base, and the cam is in sliding fit with the sliding rod.

[0012] Further, the driving mechanism further includes a first connecting plate which is rotatably connected to the sliding rod. The first connecting plate is in sliding fit with an intermediate plate. The intermediate plate is rotatably mounted on the base. One end of the intermediate plate away from the first connecting plate is in sliding fit with a second connecting plate. The second connecting plate is rotatably connected to a moving frame. The moving frame is in sliding fit with the second sliding groove on the base. A clamping plate is fixedly mounted on the moving frame. Two symmetrically arranged second motors are fixedly mounted on the clamping plate. The output shaft of the second motor is fixedly connected to a long shaft. An incomplete gear is fixedly mounted on the long shaft. The incomplete gear is in meshing fit with the large gear. Return springs are arranged between the second connecting plate and the intermediate plate and between the first connecting plate and the intermediate plate.

[0013] Further, the driving mechanism further includes two friction wheels which are fixedly mounted on the long shaft.

[0014] Furthermore, a contact switch is fixedly installed on the base, and the contact switch is located below the moving frame.

[0015] The beneficial effects of the present invention compared with the prior art are as follows: (1) The present invention automatically completes the encapsulation of semiconductors through the welding mechanism and the detection mechanism, with a simple structure and convenient operation; (2) The present invention can detect during the process of semiconductor encapsulation, thereby improving the encapsulation efficiency, avoiding the generation of defective products, and improving the work efficiency. Description of the Drawings

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0017] Figure 2 It is a cross-sectional view of the overall structure of the present invention.

[0018] Figure 3 It is Figure 1 a schematic diagram of the structure from another angle Figure 1 .

[0019] Figure 4 It is Figure 1 a schematic diagram of the structure from another angle Figure 2 .

[0020] Figure 5 It is Figure 4 a schematic diagram of the partial enlarged structure at A in

[0021] Figure 6 a schematic diagram of a part of the structure of the present invention Figure 1 .

[0022] Figure 7 It is Figure 6 a schematic diagram of the partial enlarged structure at B in

[0023] Figure 8 a schematic diagram of a part of the structure of the present invention Figure 2 .

[0024] Reference numerals in the drawings: 1 - base; 2 - first motor; 3 - cam; 4 - rotating shaft; 5 - sliding rod; 6 - horizontal rod; 7 - pull rod; 8 - connecting head; 9 - power connection post; 10 - welding groove; 11 - arc-shaped fixing plate; 12 - semiconductor; 13 - first connecting plate; 14 - intermediate plate; 15 - second connecting plate; 16 - moving frame; 17 - clamping plate; 18 - second motor; 19 - long shaft; 20 - friction wheel; 21 - incomplete gear; 22 - large gear; 23 - counterweight; 24 - rotating disc; 25 - first connecting rod; 26 - second connecting rod; 27 - rotating shaft; 28 - sleeve; 29 - welding torch; 30 - return spring; 31 - mounting head; 32 - collecting barrel; 33 - scraper; 34 - first sliding groove; 35 - second sliding groove; 36 - contact switch. Detailed implementation mode

[0025] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation modes.

[0026] Example: As Figure 1 — Figure 8 shown, a semiconductor packaging device includes a base 1, an arc-shaped fixing plate 11 is fixedly installed on the base 1, two symmetrically arranged welding grooves 10 are provided on the arc-shaped fixing plate 11, and a welding mechanism and a detection mechanism are also provided on the base 1.

[0027] The welding mechanism includes two symmetrically arranged welding torches 29, and the welding torches 29 are used for welding the semiconductor 12.

[0028] The detection mechanism includes two symmetrically arranged power connection posts 9, the power connection posts 9 are slidably installed on the arc-shaped fixing plate 11, and the power connection posts 9 are used for detecting the semiconductor 12 placed in the arc-shaped fixing plate 11.

[0029] The welding mechanism includes two symmetrically arranged sleeves 28, the sleeves 28 are rotatably installed on the base 1, the sleeves 28 are coaxially and fixedly connected to one end of a rotating shaft 27, the other end of the rotating shaft 27 is fixedly connected to one end of a connecting rod two 26, the other end of the connecting rod two 26 is rotatably connected to one end of a connecting rod one 25, the other end of the connecting rod one 25 is rotatably installed on a rotating disk 24, the rotating disk 24 is coaxially and fixedly connected to a large gear 22, the large gear 22 and the rotating disk 24 are rotatably installed on the arc-shaped fixing plate 11, and the large gear 22 is connected to a driving mechanism.

[0030] The welding torch 29 is slidably installed on a mounting head 31, and the welding torch 29 is slidably matched with the sleeve 28. The mounting head 31 is fixedly installed on the sleeve 28. One end of a return spring 30 is fixedly installed on the mounting head 31, and the other end of the return spring 30 is fixedly installed on the welding torch 29; a collecting cylinder 32 is fixedly installed on the mounting head 31. The collecting cylinder 32 is of a hollow structure, and a scraping plate 33 is fixedly installed at the end of the collecting cylinder 32 far from the mounting head 31.

[0031] A counterweight 23 is fixedly installed on the large gear 22.

[0032] The detection mechanism further includes two symmetrically arranged connecting heads 8. The two connecting heads 8 are respectively fixedly connected to the two power connection posts 9. One end of a pull rod 7 is rotatably connected to the connecting head 8. The other end of the pull rod 7 is rotatably connected to a horizontal rod 6. The horizontal rod 6 is fixedly connected to a sliding rod 5. The sliding rod 5 is slidably matched with a first sliding groove 34 on the base 1. The first sliding groove 34 is connected to the driving mechanism.

[0033] The driving mechanism includes a cam 3, the cam 3 is fixedly connected to a rotating shaft 4, the rotating shaft 4 is rotatably installed on the base 1, the output shaft of a first motor 2 is fixedly connected to the cam 3, the first motor 2 is fixedly installed on the base 1, and the cam 3 is in sliding fit with a sliding rod 5.

[0034] The driving mechanism further includes a first connecting plate 13, the first connecting plate 13 is rotatably connected to the sliding rod 5, the first connecting plate 13 is in sliding fit with an intermediate plate 14, the intermediate plate 14 is rotatably installed on the base 1, one end of the intermediate plate 14 away from the first connecting plate 13 is in sliding fit with a second connecting plate 15, the second connecting plate 15 is rotatably connected to a moving frame 16, the moving frame 16 is in sliding fit with a second chute 35 on the base 1, a clamping plate 17 is fixedly installed on the moving frame 16, two symmetrically arranged second motors 18 are fixedly installed on the clamping plate 17, the output shaft of the second motor 18 is fixedly connected to a long shaft 19, an incomplete gear 21 is fixedly installed on the long shaft 19, the incomplete gear 21 is in meshing fit with a large gear 22, and a return spring is provided between the second connecting plate 15 and the intermediate plate 14 and between the first connecting plate 13 and the intermediate plate 14.

[0035] The driving mechanism further includes two friction wheels 20, and the friction wheels 20 are fixedly installed on the long shaft 19.

[0036] A contact switch 36 is also fixedly installed on the base 1, and the contact switch 36 is located below the moving frame 16.

[0037] Working principle: First, place the semiconductor 12 to be encapsulated into the arc-shaped fixing plate 11. In order to better limit the position of the semiconductor 12, two bosses can be symmetrically arranged in the arc-shaped fixing plate 11, so that the semiconductor 12 is located in the middle of the arc-shaped fixing plate 11. This belongs to the prior art and can be achieved by those skilled in the art.

[0038] After placing the semiconductor 12 into the arc-shaped fixing plate 11, start the first motor 2, and the cam 3 fixedly connected to the output shaft of the first motor 2 will rotate together with the output shaft of the first motor 2. During the rotation of the cam 3, since there are protruding parts on the cam 3, the sliding rod 5 in sliding contact with the cam 3 will reciprocate up and down along the first chute 34 under the action of the cam 3.

[0039] During the downward sliding of the sliding rod 5, the horizontal rod 6 connected to the sliding rod 5 will be driven downward by the sliding rod 5. In this way, the pull rods 7 on both sides of the horizontal rod 6 will be pulled by the horizontal rod 6, and the pull rods 7 will pull the connecting heads 8. At this time, the two connecting heads 8 will move towards each other (taking Figure 1From the perspective of [perspective], since the connector 8 and the electrical contact post 9 are fixedly connected, the two electrical contact posts 9 will also move towards each other, so that the electrical contact post 9 contacts the semiconductor 12 located in the arc-shaped fixing plate 11. When the electrical contact post 9 contacts the semiconductor 12, it is possible to detect whether the circuit of the semiconductor 12 is connected. Of course, if the sliding rod 5 slides upward for a certain time, the two electrical contact posts 9 will move away from each other, that is, the two electrical contact posts 9 complete the detection of the semiconductor 12.

[0040] During the process of the sliding rod 5 sliding upward along the first chute 34, as the horizontal rod 6 rises, the first connecting plate 13 will also rise. In this way, the middle plate 14 slidably connected to the first connecting plate 13 will rotate counterclockwise (from the perspective of [perspective]), so that the second connecting plate 15 drives the moving frame 16 to slide downward along the second chute 35. Figure 1 From the perspective of [perspective], so that the second connecting plate 15 drives the moving frame 16 to slide downward along the second chute 35.

[0041] During the process of the moving frame 16 sliding downward, the clamping plate 17 fixedly connected to the moving frame 16 will move downward. At the same time, the moving frame 16 will also touch the contact switch 36 fixedly installed on the second chute 35. When the moving frame 16 contacts the contact switch 36, the second motor 18 will be started. The output shaft of the second motor 18 drives the long shaft 19 to rotate. In this way, the friction wheel 20 and the incomplete gear 21 on the long shaft 19 will rotate.

[0042] When the friction wheel 20 rotates, since the friction wheel 20 descends with the clamping plate 17 and the second motor 18 to the height in contact with the semiconductor 12, and the surface of the friction wheel 20 is rough, the rotating long shaft 19 can, during the rotation process, dial the semiconductor 12 to rotate in the arc-shaped fixing plate 11. The purpose of this is to flip the semiconductor 12 and adjust the welding position of the welding torch 29; when the incomplete gear 21 rotates, when the toothed part of the incomplete gear 21 rotates to mesh with the large gear 22, the large gear 22 will be dialed by the incomplete gear 21. Thus, the large gear 22 drives the rotating disk 24 to rotate together. When the rotating disk 24 rotates, the first connecting rod 25 connected to the rotation of the rotating disk 24 will be driven. The first connecting rod 25 pulls the second connecting rod 26, so that the second connecting rod 26 drives the rotating shaft 27 fixedly connected to the second connecting rod 26 to rotate. The rotating shaft 27 is fixedly connected to the sleeve 28, so the sleeve 28 will rotate on the base 1.

[0043] During the rotation of the sleeve 28, the mounting head 31 fixedly connected to the sleeve 28 will drive the welding torch 29 and the collection cylinder 32 to rotate. When the welding torch 29 rotates to the position directly facing the welding groove 10, the welding torch 29 will weld the semiconductor 12. Along with the rotation of the rotating shaft 27 and the sleeve 28, the welded welding torch 29 will leave the semiconductor 12 located at the welding groove 10. At the same time, the scraper 33 rotates to directly below the welding groove 10, so that the scraper 33 can clean the welded position and collect the excess solder scraped off into the collection cylinder 32. Since a return spring 30 is provided between the welding torch 29 and the mounting head 31, when the welding torch 29 leaves directly below the semiconductor 12, the return spring 30 can reset the welding torch 29. The purpose of this is to ensure that the welding torch 29 will not be interfered with when it rotates to directly below the semiconductor 12 located at the welding groove 10. When the toothed part of the incomplete gear 21 leaves the large gear 22 and no longer meshes with the large gear 22, the large gear 22 will no longer be driven by the incomplete gear 21. At this time, the counterweight 23 fixedly connected to the large gear 22 will drive the large gear 22 to rotate under the action of gravity, so that the large gear 22 rotates, which can reset the welding torch 29 and the connecting rod 25. Through the reciprocating motion of the welding torch 29, the welding of the semiconductor 12 is completed. After the welding and detection of the semiconductor 12 are completed, the staff can remove the semiconductor 12 from the arc-shaped fixing plate 11.

Claims

1. A semiconductor packaging device, comprising a base (1), wherein an arc-shaped fixing plate (11) is fixedly mounted on the base (1), and wherein the arc-shaped fixing plate (11) is provided with two symmetrically arranged welding grooves (10), characterized in that: The base (1) is also provided with a welding mechanism and a detection mechanism; The welding mechanism comprises two symmetrically arranged welding guns (29), and the welding guns (29) are used to weld the semiconductor (12); The detection mechanism comprises two symmetrically arranged power connection posts (9), wherein the power connection posts (9) are slidably mounted on an arc-shaped fixing plate (11), and the power connection posts (9) are used to detect a semiconductor (12) placed in the arc-shaped fixing plate (11); The welding mechanism comprises two symmetrically arranged sleeves (28), wherein the sleeves (28) are rotatably mounted on the base (1), the sleeves (28) are coaxially fixedly connected to one end of a rotating shaft (27), the other end of the rotating shaft (27) is fixedly connected to one end of a second connecting rod (26), the other end of the second connecting rod (26) is rotatably connected to one end of a first connecting rod (25), the other end of the first connecting rod (25) is rotatably mounted on a rotating disk (24), the rotating disk (24) is coaxially fixedly connected to a large gear (22), the large gear (22) and the rotating disk (24) are rotatably mounted on an arc-shaped fixed plate (11), and the large gear (22) is connected to a driving mechanism.

2. A semiconductor packaging device as claimed in claim 1, characterized in that: The welding gun (29) is slidably mounted on the mounting head (31), and the welding gun (29) and the sleeve (28) are slidably matched. The mounting head (31) is fixedly mounted on the sleeve (28). One end of a return spring (30) is fixedly mounted on the mounting head (31), and the other end of the return spring (30) is fixedly mounted on the welding gun (29). A collecting tube (32) is fixedly mounted on the mounting head (31), and the collecting tube (32) is a hollow structure. A scraper (33) is fixedly mounted on the end of the collecting tube (32) away from the mounting head (31).

3. A semiconductor packaging device as claimed in claim 2, characterized in that: A counterweight (23) is fixedly mounted on the large gear (22).

4. A semiconductor packaging device as claimed in claim 3, characterized in that: The detection mechanism also includes two symmetrically arranged connecting heads (8), the two connecting heads (8) are fixedly connected to two power poles (9) respectively, one end of a pull rod (7) is rotatably connected to the connecting head (8), the other end of the pull rod (7) is rotatably connected to a horizontal rod (6), the horizontal rod (6) is fixedly connected to a sliding rod (5), the sliding rod (5) is slidably matched with a first sliding groove (34) on the base (1), and the first sliding groove (34) is connected to a driving mechanism.

5. A semiconductor packaging device as claimed in claim 4, characterized in that: The driving mechanism comprises a cam (3), the cam (3) is fixedly connected to a rotating shaft (4), the rotating shaft (4) is rotatably mounted on a base (1), the cam (3) is fixedly connected to an output shaft of a motor (2), the motor (2) is fixedly mounted on the base (1), and the cam (3) is slidably matched with a sliding rod (5).

6. A semiconductor packaging device as claimed in claim 5, characterized in that: The driving mechanism further comprises a connecting plate 1 (13), wherein the connecting plate 1 (13) is rotatably connected to the sliding rod (5), the connecting plate 1 (13) is slidably matched with the intermediate plate (14), the intermediate plate (14) is rotatably mounted on the base (1), an end of the intermediate plate (14) away from the connecting plate 1 (13) is slidably matched with the connecting plate 2 (15), the connecting plate 2 (15) is rotatably connected to the moving frame (16), the moving frame (16) is slidably matched with the second sliding groove (35) on the base (1), and the A clamping plate (17) is fixedly mounted on the movable frame (16), and two symmetrically arranged motors (18) are fixedly mounted on the clamping plate (17). The output shaft of the motor (18) is fixedly connected to the long shaft (19), and an incomplete gear (21) is fixedly mounted on the long shaft (19). The incomplete gear (21) is meshed with the large gear (22), and return springs are arranged between the connecting plate (15) and the intermediate plate (14), and between the connecting plate (13) and the intermediate plate (14).

7. A semiconductor packaging device as claimed in claim 6, characterized in that: The driving mechanism further comprises two friction wheels (20), wherein the friction wheels (20) are fixedly mounted on the long shaft (19).

8. A semiconductor packaging device as claimed in claim 7, characterized in that: A contact switch (36) is also fixedly mounted on the base (1), and the contact switch (36) is located below the movable frame (16).

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