Spray device and atomic layer deposition equipment

Abstract

The present invention provides a spray device and an atomic layer deposition device. The spray device is provided with a process gas flow channel for introducing process gas. The process gas flow channel includes an air inlet, an air outlet and a process gas uniforming section. At least one process gas uniforming section is provided between an air outlet and an air inlet. The process gas uniforming section includes a process gas transverse cavity and a first hole group sequentially arranged along the flow path of the process gas. The air outlet and the process gas transverse cavity are both strip-shaped. The first hole group includes a plurality of first gas holes spaced apart and distributed along the length direction of the air outlet. The spray device disperses and rectifies the process gas through one or more layers of process gas uniforming sections, thereby improving the gas outlet uniformity of the process gas.

Description

Technical Field

[0001] The present invention relates to the technical field of atomic layer deposition, and in particular to a spray device and atomic layer deposition equipment. Background Art

[0002] Atomic layer deposition (ALD) technology is widely used in photovoltaic panel coating, semiconductor manufacturing, battery electrode coating, nanostructured aluminum oxide film manufacturing and other fields. The basic principle of the ALD process is to pass two different process gases to the substrate so that the atoms in the different process gases are deposited on the substrate through chemical reactions, thereby forming a thin film on the surface of the substrate.

[0003] In the ALD equipment, the process gas is sprayed from the gas outlet of the shower plate and sprayed toward the substrate. In the prior art, in order to allow the shower plate to discharge gas evenly, most of the gas outlets on the shower plate are set in a slit shape (or strip shape). However, the gas outlet uniformity of the process gas needs to be further improved. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a spray device, which is beneficial to improving the uniformity of the outlet gas of the process gas.

[0005] The present invention also provides an atomic layer deposition device comprising the above-mentioned spray device.

[0006] According to the first aspect of the present invention, the spray device of the embodiment includes: the spray device is provided with a process gas flow channel for introducing process gas, the process gas flow channel includes an air inlet, an air outlet and a process gas uniformizing section, at least one process gas uniformizing section is provided between one of the air outlets and one of the air inlets, the process gas uniformizing section includes a process gas transverse cavity and a first hole group arranged in sequence along the flow path of the process gas, the air outlet and the process gas transverse cavity are both strip-shaped, and the first hole group includes a plurality of first air holes spaced apart and distributed along the length direction of the air outlet.

[0007] The spray device according to the embodiment of the first aspect of the present invention has at least the following beneficial effects: some spray devices in the prior art have a gas path design that is roughly as follows: the bottom of the transverse cavity is directly connected to the strip-shaped (or slit-shaped) gas outlet. Since the transverse cavity is relatively long, the process gas is prone to uneven distribution after entering the transverse cavity. Since the transverse cavity is directly connected to the gas outlet, the distribution of the process gas at the gas outlet is similar to the distribution of the gas in the transverse cavity, resulting in uneven gas outlet effect at the gas outlet.

[0008] For the spray device of the present invention, a plurality of air holes are provided between the process gas transverse cavity and the gas outlet, and the process gas transverse cavity is not directly connected to the gas outlet. Compared with the prior art, the resistance of the process gas flowing out of the process gas transverse cavity is relatively large, and the residence time of the process gas in the process gas transverse cavity is relatively long. In this way, when the gas is discharged through the air holes, the process gas transverse cavity will be filled with more process gas, the distribution uniformity of the process gas in the process gas transverse cavity is relatively high, the difference between the flow rates of the process gas flowing out of different air holes is relatively small, and the distribution uniformity of the process gas flowing out of the gas outlet is relatively high.

[0009] According to some embodiments of the present invention, at least two process gas homogenizing sections connected in series are provided between one of the gas outlets and one of the gas inlets.

[0010] According to some embodiments of the present invention, for any two first hole groups connected in series between one of the gas outlets and one of the gas inlets, one of the first hole groups is an upstream hole group and the other of the first hole groups is a downstream hole group, the upstream hole group and the downstream hole group are arranged in sequence along the flow path of the process gas; the distribution density of the first gas holes of the downstream hole group is greater than the distribution density of the first gas holes of the upstream hole group.

[0011] According to some embodiments of the present invention, the spray device is used to introduce two different process gases, one of which is a first process gas and the other is a second process gas; the spray device is provided with at least two process gas flow channels separated from each other, a part of which is used to introduce the first process gas and another part of which is used to introduce the second process gas.

[0012] According to some embodiments of the present invention, the process gas flow channel for introducing the first process gas is a first flow channel, the process gas flow channel for introducing the second process gas is a second flow channel, the gas outlet of the first flow channel is a first gas outlet, the gas outlet of the second flow channel is a second gas outlet, the outer surface of the spray device includes a spray surface, and the first gas outlet and the second gas outlet are both arranged on the spray surface; the spray device is also provided with a purge gas flow channel and a waste gas flow channel, and any two of the first flow channel, the second flow channel, the purge gas flow channel and the waste gas flow channel are separated from each other; the purge gas flow channel is used to introduce purge gas, the purge gas flow channel includes a purge gas outlet, the purge gas outlet is arranged on the spray surface, the purge gas outlet surrounds the first gas outlet and the second gas outlet, and the purge gas outlet separates the first gas outlet and the second gas outlet; the waste gas flow channel includes a waste gas inlet, the waste gas inlet is arranged on the spray surface, and at least one of the waste gas inlet is arranged between adjacent first gas outlets and second gas outlets.

[0013] According to some embodiments of the present invention, at least one of the first air outlet and the second air outlet is provided in plurality, the first air outlet and the second air outlet are parallel to each other, and the first air outlet and the second air outlet are alternately distributed in the width direction of the first air outlet.

[0014] According to some embodiments of the present invention, the purge gas outlet includes: at least three transverse sections, which are in the shape of strips; longitudinal sections, which are in the shape of strips, and are perpendicular to the transverse sections. Two longitudinal sections are provided, and the two longitudinal sections are respectively connected to the two ends of the transverse section, and a plurality of transverse sections are spaced apart along the length direction of the longitudinal section; all the longitudinal sections and all the transverse sections enclose a plurality of accommodating areas, and any two of the accommodating areas are separated from each other, and each of the accommodating areas is provided with one of the first gas outlets or one of the second gas outlets.

[0015] According to some embodiments of the present invention, for any of the first air outlets, an exhaust gas inlet is provided on each side of the first air outlet; and / or, for any of the second air outlets, an exhaust gas inlet is provided on each side of the second air outlet; and / or, for any of the transverse sections, an exhaust gas inlet is provided on each side of the transverse section.

[0016] According to some embodiments of the present invention, the ratio of the length of the first air outlet to the width of the first air outlet is not less than 10; and / or, the ratio of the length of the second air outlet to the width of the second air outlet is not less than 10; and / or, the ratio of the length of the longitudinal segment to the width of the longitudinal segment is not less than 10; and / or, the ratio of the length of the transverse segment to the width of the transverse segment is not less than 10.

[0017] According to some embodiments of the present invention, the purge gas flow channel also includes at least one purge gas uniformizing section, the purge gas uniformizing section is located upstream of the purge gas outlet, the purge gas uniformizing section includes a purge gas distribution chamber and a second hole group arranged in sequence along the flow path of the purge gas, the second hole group includes a plurality of second air holes; the purge gas distribution chamber includes a plurality of strip-shaped purge gas transverse cavities, the purge gas transverse cavities are parallel to and correspond to the transverse sections, and in the same purge gas uniformizing section, a plurality of second air holes are provided between one purge gas transverse cavity and one transverse section; the purge gas distribution chamber includes a plurality of strip-shaped purge gas longitudinal cavities, the purge gas longitudinal cavities are parallel to and correspond to the longitudinal sections, and in the same purge gas uniformizing section, a plurality of second air holes are provided between one purge gas longitudinal cavity and one longitudinal section.

[0018] According to some embodiments of the present invention, the spray device includes a spray plate, a purge gas plate and a process gas plate which are stacked in sequence from bottom to top; the bottom surface of the spray plate is the spray surface, and in the vertical direction, the spray plate is provided with a purge gas uniformization section, a process gas uniformization section belonging to the first flow channel, and a process gas uniformization section belonging to the second flow channel; in the vertical direction, the purge gas plate is provided with a purge gas uniformization section, a process gas uniformization section belonging to the first flow channel, and a process gas uniformization section belonging to the second flow channel; in the vertical direction, the process gas plate is provided with a process gas uniformization section belonging to the first flow channel, and a process gas uniformization section belonging to the second flow channel.

[0019] According to some embodiments of the present invention, the exhaust gas flow duct also includes an exhaust gas outlet, a first avoidance hole and a second avoidance hole, and the exhaust gas inlet, the first avoidance hole, the second avoidance hole and the exhaust gas outlet are arranged in sequence along the flow path of the exhaust gas; the spray device also includes an exhaust plate, which is stacked above the process gas plate, and the exhaust gas outlet is provided on the top of the exhaust plate; the purge gas plate is provided with the first avoidance hole, and the process gas plate is provided with the second avoidance hole.

[0020] According to some embodiments of the present invention, the spray device also includes: a partition, the exhaust plate and the process gas plate jointly define a cavity, the partition is arranged in the cavity, the partition is also stacked above the process gas plate, and the partition is provided with a plurality of arc holes; a vacuum cylinder, the vacuum cylinder is arranged in the cavity, the outer peripheral surface of the vacuum cylinder is provided with a plurality of third air holes, the plurality of third air holes are distributed at intervals along the circumference of the vacuum cylinder, and the arc holes are arranged around the vacuum cylinder.

[0021] According to some embodiments of the present invention, the spray device comprises a heating element, at least a portion of which is sandwiched between the purge gas plate and the process gas plate, and the heating element is used to heat the purge gas plate and the process gas plate.

[0022] According to some embodiments of the present invention, the spray device also includes at least one diverter strip, and at least one of the process gas transverse cavities is provided with a diverter strip; the diverter strip itself has a first diverter port and a second diverter port, or the outer surface of the diverter strip and the wall surface of the process gas transverse cavity define the first diverter port and the second diverter port; the first diverter port and the second diverter port are spaced apart and distributed along the width direction of the gas outlet, and the process gas in the process gas transverse cavity can flow to the first gas hole downstream through the first diverter port and the second diverter port.

[0023] The atomic layer deposition equipment according to the second embodiment of the present invention includes the spray device as described in the first embodiment.

[0024] The atomic layer deposition equipment according to the embodiment of the second aspect of the present invention has at least the following beneficial effects: based on the gas path design of the spray device, the gas outlet uniformity of the process gas is better, and the atomic layer deposition effect of the substrate is better.

[0025] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0027] Figure 1 A bottom view of a spray device according to an embodiment of the present invention;

[0028] Figure 2 for Figure 1 Exploded diagram of the spray device;

[0029] Figure 3 is a schematic diagram of a process gas flow channel;

[0030] Figure 4 for Figure 2 A cross-sectional view of a process gas plate in FIG.

[0031] Figure 5 is a schematic diagram of a purge gas flow path;

[0032] Figure 6 for Figure 2 A bottom view of the spray plate in FIG.

[0033] Figure 7 for Figure 2 A cross-sectional view of a purge gas plate cut by a horizontal plane;

[0034] Figure 8 for Figure 2 A top view of a purge gas plate in FIG.

[0035] Fig. 9 for Figure 8 A cross-sectional view of the purge gas plate along the AA section;

[0036] Fig.10 is a schematic diagram of an exhaust gas flow passage;

[0037] Fig.11 A schematic diagram of the working principle of an atomic layer deposition device in one embodiment of the present invention;

[0038] Fig.12 A cross-sectional view of a purge gas plate according to another embodiment of the present invention;

[0039] Fig.13 for Fig.12 Enlarged view of area B;

[0040] Fig.14 for Fig.12 A three-dimensional image of the middle and upper diverter strip;

[0041] Fig.15 is a schematic diagram of the flow path of the process gas through the upper dividing strip;

[0042] Fig.16 for Fig.12 A three-dimensional view of the middle and lower diverter strip.

[0043] Reference numerals:

[0044] 100-spraying device, 101-spraying plate, 102-purge gas plate, 103-process gas plate, 104-exhaust plate, 105-partition plate, 106-exhaust cylinder, 107-heating element, 108-sealing ring, 109-air inlet joint, 110-spraying surface;

[0045] 201-process gas flow channel, 202-gas inlet, 203-gas outlet, 204-process gas uniforming section, 205-process gas transverse cavity, 206-first hole group, 207-first gas hole, 210-first gas outlet, 211-second gas outlet, 212-process gas longitudinal cavity;

[0046] 301 - purge gas flow channel, 302 - purge gas inlet, 303 - purge gas outlet, 304 - purge gas uniforming section, 306 - purge gas transverse cavity, 307 - purge gas longitudinal cavity, 308 - second air hole, 309 - longitudinal section, 310 - transverse section, 311 - second hole group;

[0047] 401 - exhaust gas flow channel, 402 - exhaust gas inlet, 403 - exhaust gas outlet, 404 - first avoidance hole, 405 - second avoidance hole, 406 - arc hole, 407 - third air hole, 408 - cavity;

[0048] 501-placing table, 502-substrate;

[0049] 601 - upper diverter bar, 602 - lower diverter bar, 603 - first diverter port, 604 - second diverter port, 605 - diverter bar, 606 - connecting hole. DETAILED DESCRIPTION

[0050] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0051] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0052] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0053] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution. Figure 1 FIG. 1 is a bottom view of a spray device 100 according to an embodiment of the present invention. Figure 2 for Figure 1 The spray device 100 of the present invention is provided with a process gas flow channel 201 for introducing process gas. Figure 3 The shape of the process gas flow channel 201 is shown. The process gas flow channel 201 includes an air inlet 202, an air outlet 203 and a process gas uniforming section 204. At least one process gas uniforming section 204 is provided between a gas outlet 203 and a gas inlet 202. The process gas uniforming section 204 includes a process gas transverse cavity 205 and a first hole group 206 arranged in sequence along the flow path of the process gas. The first hole group 206 includes a plurality of first gas holes 207 spaced apart and distributed along the length direction of the air outlet 203. The air outlet 203 is in a strip shape (such as Figure 1 As shown in FIG. 2 ), the process gas transverse cavity 205 is also strip-shaped (as shown in FIG. Figure 4 as shown).

[0054] Some spray devices in the prior art have a gas path design that is generally as follows: the bottom of the transverse cavity is directly connected to a strip-shaped (or slit-shaped) gas outlet. Since the transverse cavity is relatively long, the process gas is prone to uneven distribution after entering the transverse cavity. Since the transverse cavity is directly connected to the gas outlet, the distribution of the process gas at the gas outlet is similar to the distribution of the gas in the transverse cavity, resulting in uneven gas outlet effect at the gas outlet.

[0055] like Figure 3 As shown, for the spray device 100 of the present invention, a plurality of air holes are provided between the process gas transverse cavity 205 and the gas outlet 203, and the process gas transverse cavity 205 is not directly connected to the gas outlet 203. Compared with the prior art, the resistance of the process gas flowing out of the process gas transverse cavity 205 is relatively large, and the residence time of the process gas in the process gas transverse cavity 205 is relatively long. In this way, when the gas is discharged through the air holes, the process gas transverse cavity 205 will be filled with more process gas, the distribution uniformity of the process gas in the process gas transverse cavity 205 is relatively high, the difference between the flow rates of the process gas flowing out of different air holes is relatively small, and finally the distribution uniformity of the process gas flowing out of the gas outlet 203 is relatively high.

[0056] Preferably, in some embodiments, at least two process gas homogenization sections connected in series are provided between an air inlet and an air outlet. In this arrangement, the process gas will be dispersed and merged multiple times in the process of flowing from the air inlet to the air outlet, which is conducive to further improving the uniformity of the process gas outlet. For example, Figure 3 As shown, in this embodiment, three process gas uniformity sections 204 are provided between a gas inlet and a gas outlet, the three process gas uniformity sections 204 are distributed along the vertical direction, and the three process gas uniformity sections 204 are connected in series in sequence.

[0057] If at least two process gas homogenizing sections 204 are connected in series between a gas outlet 203 and a gas inlet 202, then for any two first hole groups 206 connected in series between a gas outlet 203 and a gas inlet 202: one of the first hole groups 206 is an upstream hole group, and the other first hole group 206 is a downstream hole group, and the upstream hole group and the downstream hole group are arranged in sequence along the flow path of the process gas; the distribution density of the first gas holes 207 of the downstream hole group is greater than the distribution density of the first gas holes 207 of the upstream hole group. That is, in Figure 3 In the embodiment, the distribution density of the first air holes 207 of the first hole group 206 which is farther from the air outlet 203 is smaller than the distribution density of the first air holes 207 of the first hole group 206 which is closer to the air outlet 203 .

[0058] The distribution density of the first through holes 207 of the first hole group 206 is the number of the first through holes 207 within a unit length. Figure 3 As shown, the smaller the spacing between adjacent first air holes 207, the greater the distribution density of the first air holes 207 in the first hole group 206. The higher the distribution density of the first air holes 207, the better the dispersion effect of the first hole group 206 on the process gas and the more uniform the process gas can be dispersed. The above arrangement allows the process gas to be gradually dispersed in the process of flowing through the multiple process gas uniformization sections 204, which is conducive to improving the uniformity of the gas outlet of the process gas.

[0059] In order to improve the uniformity of the gas outflow of the process gas, in the same first hole group 206, the first gas holes 207 can be evenly distributed in the length direction of the gas outlet 203. The length direction of the gas outlet 203 can correspond to Figure 3 In addition, for a process gas transverse cavity 205 and a plurality of first gas holes 207 that are interconnected, the diameter of a single first gas hole 207 is smaller than the width of the process gas transverse cavity 205; this can appropriately increase the resistance of the process gas leaving the process gas transverse cavity 205, which is conducive to the process gas evenly filling the process gas transverse cavity 205, thereby facilitating the improvement of the gas outlet uniformity of the process gas. In addition, in order to improve the dispersion effect of the process gas, such as Figure 3 As shown, for the topmost (i.e., closest to the gas inlet 202) process gas transverse cavity 205 and the topmost (closest to the gas inlet 202) row of first gas holes 207, the sum of the apertures of the row of first gas holes 207 is smaller than the width of the process gas transverse cavity 205. Figure 3 and Figure 4 , the width of the process gas transverse cavity 205 is the dimension of the process gas transverse cavity 205 in the front-to-rear direction, Figure 3 , the front-to-back direction is the direction perpendicular to the paper surface.

[0060] The process gas flow channel 201 may further include a process gas longitudinal cavity 212, which is connected to a layer of process gas transverse cavity 205 closest to the gas inlet 202. The process gas longitudinal cavity 212 is as shown in FIG. Figure 4 As shown, Figure 4 yes Figure 2 The cross-sectional view obtained after the process gas plate 103 in the figure is cut by a horizontal section. The process gas longitudinal cavity 212 is in a strip shape, and the process gas longitudinal cavity 212 and the process gas transverse cavity 205 are perpendicular to each other. The gas inlet 202, the process gas longitudinal cavity 212 and the layer of process gas transverse cavity 205 closest to the gas inlet 202 are connected in sequence. The two ends of the process gas longitudinal cavity 212 are respectively connected to the two gas inlets 202. After the process gas enters from the gas inlet 202, it is diverted to different process gas transverse cavities 205 through the process gas longitudinal cavity 212. One end of the process gas transverse cavity 205 extends to the edge of the process gas plate 103 to facilitate the processing of the process gas flow channel 201. However, the end of the process gas transverse cavity 205 extending to the edge of the process gas plate 103 will be blocked by a plug. The gas inlet 202 and the purge gas inlet 302 can be installed with a gas inlet connector 109 so that the spray device 100 can be connected to an external pipeline.

[0061] The spray device 100 may be provided with a plurality of process gas flow channels 201 separated from each other. Two flow channels separated from each other means that the two flow channels are not directly connected. For a spray device 100 provided with a plurality of process gas flow channels 201, the spray device 100 may be used to introduce only one process gas (the process gas introduced into all process gas flow channels 201 is the same).

[0062] Alternatively, the spray device 100 can also be used to introduce two different process gases, wherein a portion of the process gas flow channel 201 is used to introduce a first process gas, and another portion of the process gas flow channel 201 is used to introduce a second process gas. In this way, the spray device 100 has the function of introducing two different process gases, and the spray device 100 is suitable for use in a spatial ALD (spatial ALD) process or equipment. For the convenience of description, the process gas flow channel 201 for introducing the first process gas will be referred to as the first flow channel, the process gas flow channel 201 for introducing the second process gas will be referred to as the second flow channel, the gas outlet 203 of the first flow channel will be referred to as the first gas outlet 210, and the gas outlet 203 of the second flow channel will be referred to as the second gas outlet 211. Figure 1As shown, the outer surface of the spray device 100 includes a spray surface 110, which is located at the bottom of the spray device 100 and is used to face the substrate 502. The first gas outlet 210 and the second gas outlet 211 are both arranged on the spray surface 110.

[0063] Please refer to Figure 4 , the process gas longitudinal cavity 212 on the left and the process gas transverse cavity 205 connected thereto are part of the second flow channel. The process gas longitudinal cavity 212 on the right and the two process gas transverse cavities 205 connected thereto are part of the first flow channel. Among the three process gas transverse cavities 205, the process gas transverse cavity 205 located in the middle is arranged corresponding to the second gas outlet 211; the process gas transverse cavity 205 located on the front side is arranged corresponding to a first gas outlet 210, and the process gas transverse cavity 205 located on the rear side is arranged corresponding to another first gas outlet 210. In this way, the first flow channel and the second flow channel will be staggered and not connected to each other.

[0064] The composition of the first process gas and the second process gas depends on the material of the thin film to be deposited on the substrate 502. For example, if aluminum oxide (Al2O3) is to be deposited on the surface of the substrate 502, 2 O 3 ), then the first process gas can be an oxygen source gas (water vapor), and the second process gas can be an aluminum source gas (trimethylaluminum). The first flow channel and the second flow channel are separated from each other (i.e., the two flow channels are not connected) to prevent the first process gas and the second process gas from contacting and reacting in advance inside the spray device 100.

[0065] In order to make the spray device 100 suitable for the process or equipment of spatial ALD, the spray device 100 may also be provided with a purge gas flow channel 301 and an exhaust gas flow channel 401. Any two of the first flow channel, the second flow channel, the purge gas flow channel 301 and the exhaust gas flow channel 401 are separated from each other to prevent different gases from mixing and affecting the effect of atomic layer deposition.

[0066] The overall shape of the purge flow channel is as follows: Figure 5 As shown, the overall shape of the exhaust gas flow channel 401 is as follows Fig.10 As shown. The exhaust gas inlet 402 is as shown Figure 6 As shown, Figure 6 FIG. 3 is a bottom view of the shower plate 101. The purge gas flow channel 301 includes a purge gas outlet 303. The shape of the purge gas outlet 303 is as follows: Figure 1As shown, the purge gas outlet 303 is in the shape of a Chinese character "mu" (目). The purge gas flow channel 301 is used to introduce purge gas, and the purge gas forms an air curtain after spraying out from the spraying device 100. Before the first process gas and the second process gas contact the substrate 502, the air curtain of the purge gas is used to isolate the first process gas and the second process gas (as Fig.11 shown), so as to prevent the first process gas and the second process gas from contacting and reacting in advance. In addition, the purge gas can also blow away foreign matters such as dust on the surface of the substrate 502, thereby cleaning the surface of the substrate 502. The purge gas can be nitrogen or other inert gases that do not react with the process gas.

[0067] As Figure 1 shown, the purge gas outlet 303 is arranged on the spraying surface 110. The purge gas outlet 303 surrounds the first gas outlet 210 and the second gas outlet 211, thereby separating the first gas outlet 210 and the second gas outlet 211. In this way, the air curtain formed by the purge gas can separate the first process gas and the second process gas. The inlet and other parts of the purge gas flow channel 301 will be specifically introduced below.

[0068] As Figure 6 shown, the purge gas outlet 303 includes a horizontal section 310 and a vertical section 309. Among them, there are four horizontal sections 310 and two vertical sections 309. Both the horizontal section 310 and the vertical section 309 are strip-shaped, the horizontal section 310 and the vertical section 309 are perpendicular to each other, and the two vertical sections 309 are respectively connected to both ends of the horizontal section 310. The four horizontal sections 310 are distributed at intervals along the length direction of the vertical section 309. In this way, all the vertical sections 309 and all the horizontal sections 310 enclose three accommodation areas, any two accommodation areas are separated from each other, and one first gas outlet 210 or one second gas outlet 211 is arranged in one accommodation area.

[0069] As Figure 6 shown, the horizontal section 310, the first gas outlet 210 and the second gas outlet 211 are all parallel to each other. The purge gas outlet 303 is in the shape of a Chinese character "mu" (目), thereby separating the first gas outlet 210 and the second gas outlet 211. Since the vertical section 309 and the horizontal section 310 are perpendicular to each other and both are strip-shaped, the processing difficulty of the purge gas outlet 303 in the shape of a Chinese character "mu" (目) is relatively low, which is beneficial to reducing the processing difficulty and processing cost of the spraying device 100. And, the purge gas outlet 303 in the shape of a Chinese character "mu" (目) will surround each first gas outlet 210 and each second gas outlet 211, which is beneficial to reducing the risk of premature mixing of the first process gas and the second process gas before contacting the substrate 502.

[0070] In other embodiments not shown in the figure, if only one first air outlet 210 and one second air outlet 211 are provided, only three transverse sections 310 are required; Figure 6 In the illustrated embodiment, the number of transverse segments 310 may be greater than four.

[0071] like Figure 5 As shown, in order to improve the uniformity of the purge gas outlet, the purge gas flow channel 301 also includes at least one purge gas uniform section 304. The purge gas uniform section 304 is located upstream of the purge gas outlet 303, and the purge gas uniform section 304 includes a purge gas distribution cavity and a second hole group 311 arranged in sequence along the flow path of the purge gas. The second hole group 311 includes a plurality of second gas holes 308. Figure 6 and Figure 7 The purge gas distribution chamber includes a plurality of strip-shaped purge gas transverse chambers 306, which are parallel to and corresponding to the transverse sections 310. A plurality of second gas holes 308 are provided between a purge gas transverse chamber 306 and a transverse section 310 (the second gas holes 308 are located at Figure 6 and Figure 7 The purge gas distribution chamber further includes a plurality of strip-shaped purge gas longitudinal cavities 307, which are arranged in parallel with the longitudinal sections 309 and correspond to each other. A plurality of second gas holes 308 are arranged between a purge gas longitudinal cavity 307 and a longitudinal section 309 (the second gas holes 308 are arranged at Figure 6 and Figure 7 not shown).

[0072] The principle of improving the uniformity of the purge gas outlet by the purge gas homogenizing section 304 is similar to the principle of improving the uniformity of the process gas outlet by the process gas homogenizing section 204, and will not be repeated here. In addition, in order to further improve the uniformity of the purge gas outlet, multiple purge gas homogenizing sections 304 can be connected in series upstream of the purge gas.

[0073] like Figure 6 As shown, the waste gas flow channel 401 includes a waste gas inlet 402, and the waste gas inlet 402 is arranged on the spray surface 110. At least one waste gas inlet 402 is arranged between an adjacent first gas outlet 210 and a second gas outlet 211. The outlet and other parts of the waste gas flow channel 401 will be described below. The spray device 100 can be connected to an exhaust device (the exhaust device is not shown), and the exhaust device extracts the waste gas near the substrate 502 through the waste gas flow channel 401 to prevent the waste gas from affecting the atomic layer deposition effect on the surface of the substrate 502. The waste gas mainly contains unreacted first process gas, unreacted second process gas, purge gas, side reaction products, dust, etc.

[0074] In some embodiments, at least one of the first gas outlet 210 and the second gas outlet 211 is provided in plurality, the first gas outlet 210 and the second gas outlet 211 are parallel to each other, and the first gas outlet 210 and the second gas outlet 211 are alternately distributed in the width direction of the first gas outlet 210. The alternating distribution of the first gas outlet 210 and the second gas outlet 211 is mainly to allow multiple layers of material to be deposited when the substrate 502 passes over the spray surface 110 once. The specific role and principle of the alternating distribution of the first gas outlet 210 and the second gas outlet 211 will be described in the introduction of the atomic layer deposition device below.

[0075] like Figure 6 As shown, in order to improve the extraction efficiency of the excess first process gas, for any first gas outlet 210, a waste gas inlet 402 is provided on both sides of the first gas outlet 210. Similarly, in order to improve the extraction efficiency of the excess second process gas, for any second gas outlet 211, a waste gas inlet 402 is provided on both sides of the second gas outlet 211. In order to improve the extraction efficiency of the excess purge gas, a waste gas inlet 402 is provided on both sides of any transverse section 310.

[0076] In order to make the first air outlet 210 in a strip shape, the ratio of the length of the first air outlet 210 to the width of the first air outlet 210 (length divided by width) is not less than 10. More specifically, in some embodiments, the ratio of the length of the first air outlet 210 to the width of the first air outlet 210 can be set to 10, 50, 100, 200, 300, etc. Similarly, for the second air outlet 211 in a strip shape, the ratio of the length of the second air outlet 211 to the width of the second air outlet 211 is not less than 10; for the longitudinal section 309 in a strip shape, the ratio of the length of the longitudinal section 309 to the width of the longitudinal section 309 is not less than 10; for the transverse section 310 in a strip shape, the ratio of the length of the transverse section 310 to the width of the transverse section 310 is not less than 10.

[0077] The basic shapes or directions of the various flow channels are introduced above, and the following describes in which components of the spray device 100 these flow channels are formed. Figure 2 1 is an exploded view of the spray device 100, which includes a spray plate 101, a purge gas plate 102, a process gas plate 103 and an exhaust plate 104 stacked in sequence from bottom to top. These stacked plates can be fixed by screws.

[0078] The bottom surface of the spray plate 101 is the spray surface 110. Therefore, the first gas outlet 210, the second gas outlet 211, the purge gas outlet 303 and the exhaust gas inlet 402 are all arranged on the bottom surface of the spray plate 101 (eg Figure 1As shown). In the vertical direction, the shower plate 101 is provided with a purge gas homogenizing section 304, a process gas homogenizing section 204 belonging to the first flow channel, and a process gas homogenizing section 204 belonging to the second flow channel. For example, Figure 3 The lowest layer of process gas homogenization section 204 is arranged on the shower plate 101. Figure 5 The bottommost purge gas homogenizing section 304 is disposed on the shower plate 101 .

[0079] It should be noted that, in the horizontal direction, the purge gas uniformization section 304, the process gas uniformization section 204 belonging to the first flow channel, and the process gas uniformization section 204 belonging to the second flow channel may be provided with only one or more, depending on the number of the first gas outlets 210 and the second gas outlets 211. That is, a layer of process gas uniformization section 204 may include multiple process gas uniformization sections 204 distributed in the horizontal direction, and a layer of purge gas uniformization section 304 may include multiple purge gas uniformization sections 304 distributed in the horizontal direction.

[0080] In the vertical direction, the purge gas plate 102 is provided with a purge gas homogenizing section 304, a process gas homogenizing section 204 belonging to the first flow channel, and a process gas homogenizing section 204 belonging to the second flow channel. Figure 3 The middle layer of process gas homogenization section 204 is arranged on the shower plate 101. Figure 5 The uppermost purge gas homogenizing section 304 is disposed on the purge gas plate 102 .

[0081] It should be noted that, in the horizontal direction, there may be only one or more purge gas homogenizing section 304 arranged on purge gas plate 102, process gas homogenizing section 204 belonging to the first flow channel, and process gas homogenizing section 204 belonging to the second flow channel.

[0082] In the vertical direction, the process gas plate 103 is provided with a process gas homogenizing section 204 belonging to the first flow channel and a process gas homogenizing section 204 belonging to the second flow channel. Figure 3 The uppermost process gas homogenizing section 204 is arranged on the process gas plate 103 .

[0083] It should be noted that, in the horizontal direction, there may be only one or more process gas homogenizing sections 204 belonging to the first flow channel and process gas homogenizing sections 204 belonging to the second flow channel disposed on the process gas plate 103 .

[0084] After the shower plate 101, the purge gas plate 102 and the process gas plate 103 are stacked on top of each other, the process gas flows through the three-layer process gas homogenization section 204 (eg, Figure 3 As shown in FIG. 1 ), the purge gas will flow through two layers of purge gas homogenization sections 304 (as shown in FIG. Figure 5 As shown). Therefore, the gas outlet uniformity of the process gas is relatively high, and the gas outlet uniformity of the purge gas is relatively high. Moreover, the present embodiment chooses to set only one layer of process gas uniformizing section 204 and / or purge gas uniformizing section 304 on a single plate, and forms a plurality of mutually stacked uniformizing sections by stacking a plurality of plates, which helps to reduce the processing difficulty of a single plate. In addition, since the gas outlet uniformity of the process gas has a greater influence on the atomic layer deposition effect of the substrate 502 (relative to the gas outlet uniformity of the purge gas), the present embodiment chooses to stack the process gas plate 103 on top of the purge gas plate 102, so that the spray device 100 has three layers of process gas uniformizing section 204, thereby improving the gas outlet uniformity of the process gas.

[0085] Figure 7 for Figure 2 sectional view of the purge gas plate 102 in FIG. Figure 7 As shown, the purge gas flow channel 301 also includes two purge gas inlets 302, which are respectively connected to two different purge gas transverse cavities 306. The two purge gas inlets 302 are respectively located at the front edge and the rear edge of the shower plate 101, and the purge gas inlet 302 is connected to the center of the purge gas transverse cavity 306. After the purge gas enters from the purge gas inlet 302, it will be diverted to the left and right sides to different purge gas longitudinal cavities 307, and then flow into the two middle purge gas transverse cavities 306. The purge gas flow channel 301 is axisymmetric, which is conducive to improving the uniformity of the purge gas outlet. It should be noted that the ends of the purge gas longitudinal cavity 307 and the ends of the purge gas transverse cavity 306 extend to the edge of the spray plate 101 to facilitate the processing of the purge gas flow channel 301. The ends of the purge gas transverse cavity 306 and the ends of the purge gas longitudinal cavity 307 are blocked by plugs (the plugs are not shown) to prevent leakage of the purge gas.

[0086] like Figure 8 and Fig. 9 As shown, the spray device 100 further includes a sealing ring 108, at least a portion of which is embedded in the purge gas plate 102, and the sealing ring 108 surrounds the process gas homogenizing section 204. The sealing ring 108 is used to prevent the process gas from leaking, for example, the sealing ring 108 can prevent the first process gas from leaking into the second process gas flow channel 201, the purge gas flow channel 301 or the exhaust gas flow channel 401.

[0087] Fig.10 FIG. 1 is a cross-sectional view obtained by cutting the spray device 100 along a vertical section. Fig.10As shown, the exhaust gas flow channel 401 also includes an exhaust gas outlet 403, a first avoidance hole 404 and a second avoidance hole 405. The first avoidance hole 404, the second avoidance hole 405 and the exhaust gas outlet 403 are arranged in sequence along the flow path of the exhaust gas. The exhaust gas outlet 403 is arranged at the top of the exhaust plate 104. The first avoidance hole 404 is arranged on the purge gas plate 102, and the second avoidance hole 405 is arranged on the process gas plate 103. In this way, the purge gas plate 102 and the process gas plate 103 will not hinder the exhaust gas from flowing to the exhaust gas outlet 403. The number of the second avoidance holes 405 is less than the number of the first avoidance holes 404, and one second avoidance hole 405 is connected to two first avoidance holes 404 respectively; the advantage of this arrangement is that the exhaust gas will gradually gather in the process of the exhaust gas flowing upward.

[0088] like Fig.10 As shown, the spray device 100 also includes a partition 105 and an air pump 106. The air pump plate 104 and the process gas plate 103 jointly define a cavity 408, and the partition 105 is arranged in the cavity 408. The partition 105 is also stacked above the process gas plate 103, and the partition 105 is provided with a plurality of arc holes 406. The air pump 106 is arranged in the cavity 408, the top of the air pump 106 is open and connected to the exhaust gas outlet 403, and the outer circumferential surface of the air pump 106 is provided with a plurality of fifth air holes, and the plurality of fifth air holes are distributed at intervals along the circumference of the air pump 106, and the arc holes 406 are arranged around the air pump 106. After the exhaust gas passes through the arc holes 406, the exhaust gas is distributed more evenly in the circumferential direction of the air pump 106, and then the exhaust gas can flow evenly to the air pump 106 and finally be discharged outside the air pump plate 104. As a result, the exhaust effect of the spray device 100 on each area near the substrate 502 is more consistent.

[0089] like Figure 2 As shown, the spray device 100 also includes a heating element 107, at least a portion of which is sandwiched between the purge gas plate 102 and the process gas plate 103. The heating element 107 can be an electric heating wire or some pipes that can pass high-temperature fluid. The heating element can be serpentine so as to avoid the holes or slits on the process gas plate 103 and the purge gas plate 102. Since the heating element 107 is sandwiched between the purge gas plate 102 and the process gas plate 103, when the heating element 107 is heated, the heating element 107 can heat the purge gas plate 102 and the process gas plate 103 at the same time, thereby heating the purge gas and the two process gases to the required temperature, thereby improving the effect or efficiency of atomic layer deposition.

[0090] In some embodiments, a receiving groove (not shown) may be provided on the bottom surface of the process gas plate 103, and the heating element 107 is disposed in the receiving groove. In this way, the bottom surface of the process gas plate 103 can be closely attached to the top surface of the purge gas plate 102, and the thickness of the entire spray device 100 is relatively small. In addition, the gap between the process gas plate 103 and the purge gas plate 102 is relatively small, which helps to reduce the risk of gas leakage from the gap between the process gas plate 103 and the purge gas plate 102.

[0091] In some embodiments, the spray device 100 may further include at least one diverter strip, and at least one diverter strip 605 is provided in at least one process gas transverse cavity 205. The diverter strip 605 itself has a first diverter opening 603 and a second diverter opening 604; or, the outer surface of the diverter strip 605 and the wall surface of the process gas transverse cavity 205 define the first diverter opening 603 and the second diverter opening 604. The first diverter opening 603 and the second diverter opening 604 are spaced apart and distributed along the width direction of the gas outlet 203.

[0092] For example, Fig.12 and Fig.13 As shown, in another embodiment, the purge gas plate 102 is provided with two layers of process gas transverse cavities 205, and the first through holes 207 for connecting the upper and lower layers of process gas transverse cavities 205 are not Fig.13 As shown in Fig.13 As shown, a diverter strip 605 (upper diverter strip 601) is provided in the upper process gas transverse cavity 205, and another diverter strip 605 (lower diverter strip 602) is provided in the lower process gas transverse cavity 205. The shape of the upper diverter strip 601 is as follows: Fig.13 and 14 As shown, the cross section of the upper diverter strip 601 is roughly T-shaped, and the upper diverter strip 601 itself has a first diverter opening 603 and a second diverter opening 604 spaced apart along the width direction (front-to-back direction) of the air outlet. Fig.16 As shown, the lower diverter bar 602 is flat and has a plurality of connection holes for mounting screws. The lower diverter bar 602 is connected to the purge gas plate 102 by screws. There is a gap between the outer surface of the lower diverter bar 602 and the wall surface of the process gas transverse cavity 205, thereby forming a first diverter port 603 and a second diverter port 604 (as shown in FIG. Fig.13 as shown).

[0093] like Fig.15As shown, when the process gas flows through the upper diverter strip 601, the process gas will be dispersed by the upper diverter strip 601, a part of the process gas will flow out from the first diverter port 603, and the other part of the process gas will flow out from the second diverter port 604; these two parts of the process gas will converge together later and continue to flow downward. The function of the lower diverter strip 602 is similar to that of the upper diverter strip 601. Both can allow the process gas to flow out from both sides of the diverter strip, which can make the gas flow of the process gas more uniform and stable. The present invention also provides an atomic layer deposition device, the atomic layer deposition device includes the spray device 100 in any of the above embodiments.

[0094] Fig.11 An atomic layer deposition device in one embodiment of the present invention is shown, and the atomic layer deposition device uses a spatial ALD process. The atomic layer deposition device also includes a reaction chamber, a placement table 501 and a driving mechanism. The reaction chamber and the driving mechanism are not shown in the figure, and the spray device 100 and the placement table 501 are both located in the reaction chamber. The placement table 501 is located below the spray device 100, and the substrate 502 can be placed on the placement table 501. If the arrangement direction of the first gas outlet 210 and the second gas outlet 211 is called the reference direction, then the driving mechanism is used to drive the placement table 501 to move along the reference direction, and can drive the substrate 502 on the placement table 501 to cross the spray surface 110 at least once in the reference direction. Fig.11 The reference direction is the front-to-back direction.

[0095] The coating process of the atomic layer deposition device is as follows. The first process gas, the second process gas and the purge gas are continuously sprayed from the spray surface 110, and while the above gases are sprayed, the exhaust device coordinated with the spray device 100 keeps running, and the exhaust gas continuously enters the exhaust gas flow channel 401 from the exhaust gas inlet 402, and the exhaust gas is continuously discharged outside the reaction chamber. The driving mechanism drives the placement table 501 to move from front to back, so that the substrate 502 passes over the spray surface 110 from front to back. In the process of the substrate 502 passing over the spray surface 110, the substrate 502 contacts with different process gases one after another (the contact between the substrate 502 and the purge gas is not considered here), and the rear end of the substrate 502 contacts the process gas before the front end of the substrate 502. The first process gas first deposited on the rear end of the substrate 502 and the second process gas later deposited on the rear end of the substrate 502 will combine and react with each other to form a material layer that needs to be plated on the surface of the substrate 502.

[0096] If it is necessary to deposit multiple layers of material (for example, deposit multiple layers of aluminum oxide) on the surface of the substrate 502, or it is necessary to form a thicker material layer (a thicker aluminum oxide layer) on the surface of the substrate 502, then the drive mechanism can be configured to drive the placement table 501 to reciprocate, so that the substrate 502 can pass over the spray surface 110 multiple times; alternatively, the number of the first gas outlet 210 and the second gas outlet 211 is set to be greater (the exhaust gas inlet 402 and the purge gas outlet 303 also need to be adjusted accordingly), and in the process of the substrate 502 passing over the spray surface 110 once, the substrate 502 will come into contact with the first process gas and the second process gas multiple times.

[0097] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A spraying device, characterized in that: The spray device is provided with a process gas flow channel for introducing process gas, the process gas flow channel includes a gas inlet, a gas outlet and a process gas uniformization section, and at least one process gas uniformization section is provided between one of the gas outlets and one of the gas inlets; The process gas homogenizing section comprises a process gas transverse cavity and a first hole group sequentially arranged along the flow path of the process gas, the gas outlet and the process gas transverse cavity are both strip-shaped, and the first hole group comprises a plurality of first gas holes spaced apart and distributed along the length direction of the gas outlet; The spray device further comprises at least one diverter strip, and at least one of the process gas transverse chambers is provided with the diverter strip; the diverter strip itself has a first diverter opening and a second diverter opening, or the outer surface of the diverter strip and the wall surface of the process gas transverse chamber define the first diverter opening and the second diverter opening; the first diverter opening and the second diverter opening are spaced apart and distributed along the width direction of the gas outlet, and when the process gas flows through the diverter strip, the process gas is dispersed by the diverter strip and flows out from both sides of the diverter strip; The spray device is used to introduce two different process gases, one of which is a first process gas and the other is a second process gas; the spray device is provided with at least two process gas flow channels separated from each other, one part of which is used to introduce the first process gas and the other part of which is used to introduce the second process gas; The process gas flow channel for introducing the first process gas is a first flow channel, the process gas flow channel for introducing the second process gas is a second flow channel, the gas outlet of the first flow channel is a first gas outlet, the gas outlet of the second flow channel is a second gas outlet, the outer surface of the spray device includes a spray surface, and the first gas outlet and the second gas outlet are both arranged on the spray surface; The spray device is further provided with a purge gas flow channel and a waste gas flow channel, and any two of the first flow channel, the second flow channel, the purge gas flow channel and the waste gas flow channel are separated from each other; The purge gas flow channel is used to introduce purge gas, the purge gas flow channel comprises a purge gas outlet, the purge gas outlet is arranged on the spray surface, the purge gas outlet surrounds the first gas outlet and the second gas outlet, and the purge gas outlet separates the first gas outlet and the second gas outlet; The exhaust gas flow channel includes an exhaust gas inlet, which is arranged on the spray surface, and at least one exhaust gas inlet is arranged between adjacent first gas outlets and adjacent second gas outlets.

2. The spray device according to claim 1, characterized in that: At least two process gas homogenizing sections connected in series are arranged between one of the gas outlets and one of the gas inlets.

3. The spray device according to claim 2, characterized in that: For any two first hole groups connected in series between one of the gas outlets and one of the gas inlets, one of the first hole groups is an upstream hole group, and the other of the first hole groups is a downstream hole group, and the upstream hole group and the downstream hole group are sequentially arranged along the flow path of the process gas; The distribution density of the first air holes in the downstream hole group is greater than the distribution density of the first air holes in the upstream hole group.

4. The spray device according to claim 1, characterized in that: At least one of the first air outlet and the second air outlet is provided in plurality, the first air outlet and the second air outlet are parallel to each other, and in a width direction of the first air outlet, the first air outlet and the second air outlet are alternately distributed.

5. The spray device according to claim 1, characterized in that: The purge gas outlet comprises: At least three transverse sections are provided, and the transverse sections are in a strip shape; A longitudinal section, the longitudinal section is in a strip shape, the longitudinal section is perpendicular to the transverse section, two longitudinal sections are provided, the two longitudinal sections are respectively connected to two ends of the transverse section, and the plurality of transverse sections are spaced apart and distributed along the length direction of the longitudinal section; All the longitudinal sections and all the transverse sections enclose a plurality of accommodating areas, any two of the accommodating areas are separated from each other, and each of the accommodating areas is provided with one first air outlet or one second air outlet.

6. The spray device according to claim 5, characterized in that: For any of the first air outlets, an exhaust gas inlet is respectively provided on both sides of the first air outlet; and / or, for any of the second air outlets, one exhaust gas inlet is respectively provided on both sides of the second air outlet; And / or, for any of the transverse sections, one exhaust gas inlet is respectively provided on both sides of the transverse section.

7. The spray device according to claim 5, characterized in that: The ratio of the length of the first air outlet to the width of the first air outlet is not less than 10; and / or, a ratio of the length of the second air outlet to the width of the second air outlet is not less than 10; and / or, the ratio of the length of the longitudinal segment to the width of the longitudinal segment is not less than 10; And / or, the ratio of the length of the transverse segment to the width of the transverse segment is not less than 10.

8. The spray device according to claim 5, characterized in that: The purge gas flow channel further includes at least one purge gas uniformization section, the purge gas uniformization section is located upstream of the purge gas outlet, the purge gas uniformization section includes a purge gas distribution cavity and a second hole group sequentially arranged along the flow path of the purge gas, and the second hole group includes a plurality of second gas holes; The purge gas distribution chamber comprises a plurality of strip-shaped purge gas transverse chambers, the purge gas transverse chambers are parallel to the transverse sections and correspond one to one, and in the same purge gas uniformization section, a plurality of the second gas holes are arranged between one purge gas transverse chamber and one transverse section; The purge gas distribution chamber includes a plurality of strip-shaped longitudinal purge gas chambers, which are parallel to and correspond to the longitudinal sections. In the same purge gas uniformization section, a plurality of the second air holes are provided between one of the longitudinal purge gas chambers and one of the longitudinal sections.

9. The spray device according to claim 8, characterized in that: The spray device comprises a spray plate, a purge gas plate and a process gas plate which are stacked in sequence from bottom to top; The bottom surface of the shower plate is the shower surface. In the vertical direction, the shower plate is provided with a purge gas homogenizing section, a process gas homogenizing section belonging to the first flow channel, and a process gas homogenizing section belonging to the second flow channel; In the vertical direction, the purge gas plate is provided with a purge gas homogenizing section, a process gas homogenizing section belonging to the first flow channel, and a process gas homogenizing section belonging to the second flow channel; In the vertical direction, the process gas plate is provided with a process gas homogenizing section belonging to the first flow channel and a process gas homogenizing section belonging to the second flow channel.

10. The spray device according to claim 9, characterized in that: The exhaust gas flow passage further includes an exhaust gas outlet, a first avoidance hole and a second avoidance hole, and the exhaust gas inlet, the first avoidance hole, the second avoidance hole and the exhaust gas outlet are sequentially arranged along the flow path of the exhaust gas; The spray device further comprises an exhaust plate, which is stacked above the process gas plate, and the exhaust gas outlet is provided at the top of the exhaust plate; The purge gas plate is provided with the first avoidance hole, and the process gas plate is provided with the second avoidance hole.

11. The spray device according to claim 10, characterized in that: The spraying device also includes: A partition, the pumping plate and the process gas plate together define a cavity, the partition is arranged in the cavity, the partition is also stacked above the process gas plate, and the partition is provided with a plurality of arc-shaped holes; The vacuum cylinder is arranged in the cavity, and a plurality of third air holes are arranged on the outer circumferential surface of the vacuum cylinder. The plurality of third air holes are distributed at intervals along the circumference of the vacuum cylinder, and the arc-shaped hole is arranged around the vacuum cylinder.

12. The spray device according to claim 9, characterized in that: The spray device comprises a heating element, at least a portion of which is sandwiched between the purge gas plate and the process gas plate, and the heating element is used to heat the purge gas plate and the process gas plate.

13. Atomic layer deposition equipment, characterized in that The method comprises the spraying device as claimed in any one of claims 1 to 12.

Images