A bio-based low dielectric resistance soldering ink and its preparation method and application

Abstract

The present invention discloses a bio-based low dielectric solder resist ink, its preparation method and application. The raw materials of the above solder resist ink include the following components: bio-based alkali-soluble resin; epoxy resin, and at least containing diallyl-type epoxy acrylate resin; curing agent; photoinitiator; filler; auxiliary agent; The structural formula of the bio-based alkali-soluble resin is: wherein, x, y, z and m > 0; The structural formula of the diallyl-type epoxy acrylate resin is: In the matrix resin used in the solder resist ink of the present invention, the alkali-soluble resin uses biomass raw materials as the main starting material, and the diallyl-type epoxy acrylate resin contains a structure that can reduce the dielectric property. The solder resist ink of the present invention has good comprehensive performance, such as good adhesion, heat resistance, dielectric property, etc.

Description

Technical Field

[0001] The present invention relates to the technical field of solder resist inks, and in particular to a bio-based low dielectric resistance solder resist ink and its preparation method and application. Background Art

[0002] Solder resist inks are mainly used to coat a solder resist coating on a circuit board to avoid short circuits caused by soldering, thereby saving solder, improving soldering efficiency, and playing a role in preventing the circuit from being oxidized due to the invasion of moisture and electrolytes, avoiding mechanical wear and damage to the circuit, and achieving insulation protection. To meet the requirements of PCB manufacturing processes, solder resist inks need to have excellent photosensitivity, developability, resolution, heat resistance, and low dielectric constant.

[0003] Solder resist inks usually consist of matrix resins, reactive diluents, initiators, curing agents, pigments, fillers, additives, etc. The matrix resin has the highest proportion in the formula and is also the most important component, and its structure directly determines the performance of the solder resist ink. However, currently, some traditional solder resist inks generally have the problem of too high dielectric constant, which limits their application scope in high-demand technical fields such as 5G communication technology.

[0004] To reduce the dielectric constant of solder resist inks, there are usually two methods: one is to prepare a new type of matrix resin with a low dielectric constant, and the other is to select fillers with a low dielectric constant to reduce the dielectric constant of the formula system. Although the existing solder resist inks meet the requirements of the manufacturing process to a certain extent, the traditional products generally have the problem of too high dielectric constant, which limits their application in emerging technical fields. To solve this problem, it is necessary to develop new types of low dielectric resistance solder resist inks to improve the performance and application scope of solder resist inks. Summary of the Invention

[0005] The first technical problem to be solved by the present invention is:

[0006] To provide a solder resist ink.

[0007] The second technical problem to be solved by the present invention is:

[0008] To provide a preparation method of the solder resist ink.

[0009] To solve the first technical problem, the technical solution adopted by the present invention is:

[0010] A solder resist ink, the raw materials of the solder resist ink comprising the following components:

[0011] Bio-based alkali-soluble resin;

[0012] Epoxy resin, and at least containing diallyl-type epoxy acrylate resin;

[0013] Curing agent;

[0014] Photoinitiator;

[0015] Filler;

[0016] Additive;

[0017] The structural formula of the bio-based alkali-soluble resin is:

[0018]

[0019] Wherein, x, y, z and m > 0;

[0020] The structural formula of the diallyl-type epoxy acrylate resin is:

[0021]

[0022] According to an embodiment of the present invention, at least one of the following advantages or beneficial effects is provided by one of the technical solutions in the technical solutions:

[0023] In the solder mask ink of the present invention, the alkali-soluble resin in the matrix resin uses biomass raw materials as the main starting material, and the diallyl-type epoxy acrylate resin contains a structure that can reduce the dielectric property. The solder mask ink of the present invention has good comprehensive performance, excellent adhesion, heat resistance, dielectric property, etc.

[0024] The present invention uses a bio-based alkali-soluble resin with a furan structure and a novel diallyl-type epoxy acrylate resin, and prepares a solder mask ink with these two as the matrix resin. The solder mask ink has good comprehensive performance, excellent adhesion, heat resistance, and dielectric properties.

[0025] The novel diallyl-type epoxy acrylate resin adopted by the present invention has a conjugated allyl structure in its structure, which can provide good electron conductivity and has a certain reactivity, and can endow the resin with photocuring activity together with the acrylate double bond; the furan heterocycle in the bio-based alkali-soluble resin has the characteristics of good stability and physical and chemical properties, and the epoxy group has thermosetting activity and can participate in post-curing together with the epoxy resin in the ink formulation. The resulting epoxy cross-linked network and the double bond cross-linked network will form an interpenetrating structure, improving the physical and chemical properties of the cured product.

[0026] According to an embodiment of the present invention, the raw materials of the solder mask ink include the following components in parts by weight:

[0027] Bio-based alkali-soluble resin, 10 - 40 parts;

[0028] Epoxy resin, 15 - 60 parts; at least 10 - 40 parts of diallyl-type epoxy acrylate resin is contained in the epoxy resin;

[0029] Curing agent, 2 - 6 parts;

[0030] Photoinitiator, 3 - 10 parts;

[0031] Filler, 5 - 15 parts;

[0032] Auxiliary agent, 7 - 31.

[0033] According to an embodiment of the present invention, the epoxy resin further includes at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, diallyl bisphenol A epoxy resin, and phenolic epoxy resin.

[0034] According to an embodiment of the present invention, the photoinitiator includes at least one of 2 - methyl - 1 - [4 - (methylthio)phenyl] - 2 - morpholinyl - 1 - acetone, benzoyl dimethyl ether, 2 - benzyl - 2 - dimethylamino - 1 - (4 - morpholinophenyl)butanone, benzophenone, and 2,4 - diethylthioxanthone.

[0035] According to an embodiment of the present invention, the curing agent includes at least one of dicyandiamide, 4,4'-diaminodiphenylmethane, phenylguanidine, and methylated melamine.

[0036] According to an embodiment of the present invention, the filler includes at least one of talc powder, barium sulfate, calcium carbonate, and silicon dioxide.

[0037] According to an embodiment of the present invention, the auxiliary agent includes at least one of reactive diluent, pigment, dispersant, leveling agent, and defoaming agent.

[0038] According to an embodiment of the present invention, the weight parts of the reactive diluent in the raw materials of the solder resist ink are 5 - 20 parts.

[0039] According to an embodiment of the present invention, the reactive diluent includes at least one of isobornyl acrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, and dipentaerythritol hexaacrylate.

[0040] According to an embodiment of the present invention, the weight parts of the pigment in the raw materials of the solder resist ink are 5 - 15 parts.

[0041] According to an embodiment of the present invention, the pigment includes at least one of phthalocyanine green, phthalocyanine blue, permanent violet, benzidine yellow, and titanium dioxide.

[0042] According to an embodiment of the present invention, the weight parts of the dispersant in the raw materials of the solder resist ink are 0.1 - 1 part.

[0043] According to an embodiment of the present invention, the dispersant includes at least one of Disperbyk 1010, 630, 650, 671, and 685.

[0044] According to an embodiment of the present invention, the leveling agent is 0.1 - 1 part by weight in the raw materials of the solder resist ink.

[0045] According to an embodiment of the present invention, the leveling agent includes at least one of Tegomer 360, 604, 607, 960, and 980.

[0046] According to an embodiment of the present invention, the defoaming agent is 0.1 - 1 part by weight in the raw materials of the solder resist ink.

[0047] According to an embodiment of the present invention, the defoaming agent includes at least one of Tegomer 910, 921, 944, 963, and 971.

[0048] According to an embodiment of the present invention, the preparation method of the bio - based alkali - soluble resin includes the following steps:

[0049] S1 Mix furfuryl glycidyl ether, acrylic acid, a catalyst, and an inhibitor, raise the temperature for reaction and then cool down to obtain acrylic - esterified furfuryl glycidyl ether.

[0050] S2 In a reaction vessel, introduce a protective atmosphere, raise the temperature, add propylene glycol methyl ether, the acrylic - esterified furfuryl glycidyl ether obtained in step S1, glycidyl methacrylate, styrene, acrylic acid, a chain transfer agent, and an initiator. After adding, keep the temperature constant and carry out a polymerization reaction to obtain a mixture.

[0051] S3 After the polymerization reaction in step S2 ends, raise the temperature of the mixture for reaction to obtain the bio - based alkali - soluble resin.

[0052] In the preparation method of the bio - based alkali - soluble resin, furfuryl glycidyl ether is used as a raw material. Furfuryl glycidyl ether is derived from biomass, has a wide source, low cost, and is green and environmentally friendly, so that the bio - based alkali - soluble resin of the present invention has good economic benefits and application prospects.

[0053] In the preparation method of the bio - based alkali - soluble resin, a protective atmosphere is introduced in step S2 to remove the residual oxygen in the reaction system, ensure the reaction direction, and avoid the influence of residual oxygen on the product structure.

[0054] In the preparation method of the bio - based alkali - soluble resin, the amount of the protective atmosphere introduced in step S3 is increased.

[0055] According to an embodiment of the present invention, in step S1, the protective atmosphere includes N2.

[0056] According to an embodiment of the present invention, in the step S1, the temperature after heating is 110 - 120 °C, and after heating, a heat preservation reaction is carried out for 6 - 8 h.

[0057] According to an embodiment of the present invention, in the step S1, the inhibitor includes p-methoxyphenol.

[0058] According to an embodiment of the present invention, in the step S1, the catalyst includes tetrabutylammonium bromide.

[0059] According to an embodiment of the present invention, in the step S2, the ratio of the temperature after heating to the temperature after heating in the step S3 is 70 - 80 °C: 90 - 100 °C.

[0060] According to an embodiment of the present invention, in the step S2, the chain transfer agent includes mercaptopropanol.

[0061] According to an embodiment of the present invention, in the step S2, the initiator includes 2,2'-azobis(2-methylbutyronitrile).

[0062] According to an embodiment of the present invention, the preparation method of the bio-based alkali-soluble resin includes the following steps:

[0063] S1 Mix furfuryl glycidyl ether, acrylic acid, the catalyst tetrabutylammonium bromide, the inhibitor p-methoxyphenol, stir, heat up to 110 - 120 °C, carry out a heat preservation reaction for 6 - 8 h, and cool down to obtain acrylated furfuryl glycidyl ether;

[0064] S2 In a reaction vessel, add propylene glycol methyl ether, stir, and introduce N2. After at least 1 h, heat up to 70 - 80 °C, and dropwise add a mixture of propylene glycol methyl ether, the acrylated furfuryl glycidyl ether obtained in step S1, glycidyl methacrylate, styrene, acrylic acid, the chain transfer agent mercaptopropanol, and the initiator 2,2'-azobis(2-methylbutyronitrile). The dropping time is controlled within 2 - 3 h. After the dropping is completed, keep warm and carry out a polymerization reaction for 3 - 4 h to obtain a mixture;

[0065] S3 After the polymerization reaction in step S2 is completed, increase the amount of N2 introduced, and heat up the mixture to 90 - 100 °C and continue the reaction for 2 - 3 h to obtain the bio-based alkali-soluble resin.

[0066] In step S2, by introducing N2 for at least 1 h, it is to ensure the efficiency and effect of deoxidation. If the time is too short, the deoxygenation effect is not good, and if it is too long, the efficiency becomes poor.

[0067] In step S3, increasing the amount of N2 introduced is to further improve the reaction degree. If the amount of N2 introduced is not increased, it will affect the degree of polymerization and / or the reaction degree of the reaction.

[0068] According to an embodiment of the present invention, in step S3, the introduction amount of N2 is increased by 100-120%.

[0069] According to an embodiment of the present invention, the preparation method of the bio-based alkali-soluble resin comprises the following steps:

[0070] S1 Mix 154-160 parts of furfuryl methyl glycidyl ether, 72-80 parts of acrylic acid, 0.1-1 part of catalyst tetrabutylammonium bromide, 0.01-0.05 part of inhibitor p-hydroxyanisole, stir, heat up to 110-120 °C, keep warm and react for 6-8 h, and cool down to obtain acrylic acid esterified furfuryl methyl glycidyl ether;

[0071] S2 In a reaction vessel, add 30-100 parts of propylene glycol methyl ether, stir, introduce N2, after at least 1 h, heat up to 70 °C, and dropwise add a mixture of 50-200 parts of propylene glycol methyl ether, 30-50 parts of the acrylic acid esterified furfuryl methyl glycidyl ether obtained in step S1, 10-25 parts of glycidyl methacrylate, 10-30 parts of styrene, 15-35 parts of acrylic acid, 0.1-1 part of chain transfer agent mercaptopropanol, 0.5-2 parts of initiator azobisisoheptonitrile, control the dropping time within 2-3 h, keep warm after the dropping is completed, and carry out a polymerization reaction for 3-4 h to obtain a mixture;

[0072] S3 After the polymerization reaction in step S2 is completed, increase the introduction amount of N2, and heat up the mixture to 90-100 °C and continue to react for 2-3 h to obtain the bio-based alkali-soluble resin. Wherein, each raw material is in parts by weight.

[0073] According to an embodiment of the present invention, the preparation method of the diallyl-type epoxy acrylate resin comprises the following steps:

[0074] A1 Mix diallyl-type bisphenol A epoxy resin, inhibitor p-hydroxyanisole, and catalyst triphenylphosphine, and heat up to react to obtain a mixture;

[0075] A2 Control the temperature of the reaction system not to exceed 115 °C, add acrylic acid to the mixture, and then heat up to react to obtain the diallyl-type epoxy acrylate resin.

[0076] According to an embodiment of the present invention, the preparation method of the diallyl-type epoxy acrylate resin comprises the following steps:

[0077] A1 Mix 420-450 parts of diallyl-type bisphenol A epoxy resin, 0.05-0.15 part of inhibitor p-hydroxyanisole, 2-5.5 parts of catalyst triphenylphosphine, stir, and heat up to 100-110 °C to obtain a mixture;

[0078] Add 130 - 145 parts of acrylic acid dropwise to A2. During the dropwise addition process, control the temperature of the reaction system not to exceed 115°C. After the dropwise addition is completed, raise the temperature to 110 - 120°C and keep it warm for reaction for 4 - 5 hours. After cooling, the diallyl - type epoxy acrylate resin is obtained.

[0079] To solve the second technical problem, the technical solution adopted in the present invention is as follows:

[0080] A method for preparing the solder resist ink includes the following steps:

[0081] B1 Mix the bio - based alkali - soluble resin, epoxy resin, and filler in a container, heat and stir to obtain a mixture;

[0082] B2 Add a photoinitiator and a curing agent to the mixture to obtain the solder resist ink.

[0083] According to an embodiment of the present invention, in step B1, the temperature of heating and stirring is 50 - 60°C.

[0084] According to an embodiment of the present invention, in step B1, the time of heating and stirring is 0.5 - 0.6 h.

[0085] According to an embodiment of the present invention, in step B1, the stirring speed of heating and stirring is 3000 - 3200 r / min.

[0086] According to an embodiment of the present invention, in step B1, after obtaining the mixture, an operation of grinding the mixture is further included.

[0087] According to an embodiment of the present invention, the grinding pressure is 3.5 - 3.8 MPa, and the grinding time is 10 - 15 min.

[0088] According to an embodiment of the present invention, in step B2, the following steps are further included: within 20 - 24 h before using the solder resist ink, add a photoinitiator and a curing agent to the mixture to obtain the solder resist ink.

[0089] Other features and advantages of the present invention will be described in the subsequent description, and, in part, will be obvious from the description or will be understood by implementing the present invention. Detailed embodiments

[0090] In the description of the present invention, if the first, second, etc. are described, it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence of the indicated technical features.

[0091] The terms "preferably", "more preferably", etc. in the present invention refer to embodiments of the present invention that can provide certain beneficial effects under certain circumstances. However, in the same or other circumstances, other embodiments may also be preferred. In addition, the description of one or more preferred embodiments does not imply that other embodiments are not available, nor is it intended to exclude other embodiments from the scope of the present invention.

[0092] When a numerical range is disclosed herein, the above range is considered continuous and includes the minimum and maximum values of the range, as well as every value therebetween. Further, when the range refers to integers, every integer between the minimum and maximum values of the range is included. In addition, when multiple ranges are provided to describe features or characteristics, the ranges may be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all sub-ranges subsumed therein.

[0093] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of the present invention.

[0094] The reagents, methods, and equipment used in the present invention, unless otherwise specified, are all conventional reagents, methods, and equipment in the technical field.

[0095] Example 1

[0096] A solder resist ink, the raw materials of the solder resist ink comprising the following components:

[0097] Bio-based alkali-soluble resin, 28 parts;

[0098] Diallyl-type epoxy acrylate resin, 28 parts;

[0099] Diallyl bisphenol A epoxy resin, 14 parts;

[0100] Reactive diluent, 9.5 parts;

[0101] Curing agent, 2 parts;

[0102] Photoinitiator, 5.6 parts;

[0103] Pigment, 5.6 parts;

[0104] Filler, 6.5 parts;

[0105] Dispersant, 0.3 part;

[0106] Leveling agent, 0.2 part;

[0107] Defoamer, 0.3 parts.

[0108] The above active diluent is tripropylene glycol diacrylate;

[0109] The above pigment is phthalocyanine green;

[0110] The above filler is silica;

[0111] The above dispersant is Disperbyk 1010;

[0112] The above leveling agent is Disperbyk 360;

[0113] The above defoamer is Disperbyk 910;

[0114] The above photoinitiator is 2-methyl-1-[4-(methylthio)phenyl]-2-morpholin-1-one and benzil dimethyl ketal;

[0115] The above curing agent is dicyandiamide.

[0116] The preparation method of the above bio-based alkali-soluble resin includes the following steps:

[0117] S1 Add 154 parts of furfuryl glycidyl ether, 72 parts of acrylic acid, 0.2 parts of catalyst tetrabutylammonium bromide, and 0.01 part of inhibitor p-hydroxyanisole to the reaction vessel, start stirring, heat up to 110 °C, keep the temperature for reaction for 8 h, and cool down to obtain acrylated furfuryl glycidyl ether;

[0118] S2 Take 78 parts of propylene glycol methyl ether, start stirring, introduce N2, after the N2 introduction time exceeds 1 h, heat up to 70 °C, then dropwise add a mixture of 156 parts of propylene glycol methyl ether, 45 parts of acrylated furfuryl glycidyl ether obtained in step S1, 10 parts of glycidyl methacrylate, 20 parts of styrene, 25 parts of acrylic acid, 0.8 part of chain transfer agent mercaptopropanol, and 0.7 part of initiator 2,2'-azobis(2-methylheptanenitrile), control the dropping time within 2 h, and keep the temperature after dropping for 4 h for polymerization reaction to obtain a mixture;

[0119] S3 After the polymerization reaction is completed, increase the N2 introduction amount and heat up the mixture to 90 °C for continuous reaction for 2 h to obtain the bio-based alkali-soluble resin; after testing, its number average molecular weight is 28300, the molecular weight distribution is 2.46, and the acid value is 194 mgKOH / g.

[0120] The preparation method of the above diallyl-type epoxy acrylate resin includes the following steps:

[0121] Add 420 parts of diallyl bisphenol A epoxy resin, 0.14 part of inhibitor p-hydroxyanisole, and 5 parts of catalyst triphenylphosphine to a reaction vessel. Start stirring and heat up to 100 °C to obtain a mixture;

[0122] Dropwise add 144 parts of acrylic acid to the above mixture, and control the temperature of the reaction system not to exceed 115 °C during the dropping process; after the dropping is completed, heat up to 110 °C and keep the temperature for 4 h for reaction;

[0123] After cooling, obtain the above diallyl epoxy acrylate resin.

[0124] The method for preparing the above solder resist ink includes the following steps:

[0125] Add 28 parts of bio-based alkali-soluble resin, 28 parts of diallyl epoxy acrylate resin, 14 parts of diallyl bisphenol A epoxy resin, 9.5 parts of reactive diluent tripropylene glycol diacrylate, 5.6 parts of pigment phthalocyanine green, 6.5 parts of filler silica, 0.3 part of dispersant Disperbyk 1010, 0.2 part of leveling agent Disperbyk 360, and 0.3 part of defoaming agent Disperbyk 910 to a dispersion container, start high-speed mechanical stirring to obtain a mixture. During the stirring process, the temperature is 50 °C, the stirring rate is 3000 r / min, and the stirring time is 0.5 h;

[0126] Grind the mixture obtained in B1 on a grinder, with a grinding pressure of 3.5 MPa and a grinding time of 10 min to obtain a ground product;

[0127] Within 20 h before use, add 3.7 parts of photoinitiator 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropanone, 1.9 parts of photoinitiator benzoyl dimethyl ether, and 2.0 parts of curing agent dicyandiamide to the ground product, and continue stirring for 30 min until dissolved uniformly to obtain the solder resist ink.

[0128] Example 2

[0129] A solder resist ink, the raw materials of the above solder resist ink include the following components:

[0130] Bio-based alkali-soluble resin, 30 parts;

[0131] Diallyl epoxy acrylate resin, 21 parts;

[0132] Diallyl bisphenol A epoxy resin, 17 parts;

[0133] Reactive diluent, 8.5 parts;

[0134] Curing agent, 3.4 parts;

[0135] Photoinitiator, 4.3 parts;

[0136] Pigment, 4.6 parts;

[0137] Filler, 10 parts;

[0138] Dispersant, 0.6 part;

[0139] Leveling agent, 0.3 part;

[0140] Defoaming agent, 0.3 part.

[0141] The above active diluent is trimethylolpropane triacrylate;

[0142] The above pigment is phthalocyanine blue;

[0143] The above filler is silica;

[0144] The above dispersant is Disperbyk 1010;

[0145] The above leveling agent is Disperbyk 607;

[0146] The above defoaming agent is Disperbyk 921;

[0147] The above photoinitiator is 2-methyl-1-[4-(methylthio)phenyl]-2-morpholin-1-one and 2,4-diethylthioxanthone;

[0148] The above curing agent is methylated melamine.

[0149] The preparation method of the above bio-based alkali-soluble resin comprises the following steps:

[0150] S1 154 parts of furfuryl glycidyl ether, 72 parts of acrylic acid, 0.4 part of catalyst tetrabutylammonium bromide, and 0.03 part of inhibitor p-hydroxyanisole are added to a reaction vessel, stirring is started, the temperature is raised to 110 °C, and the reaction is carried out for 7 h while maintaining the temperature, and then the temperature is lowered to obtain acrylated furfuryl glycidyl ether;

[0151] S2 Take 63 parts of propylene glycol methyl ether, start stirring, introduce N2, after the N2 introduction time exceeds 1 h, raise the temperature to 70 °C, and then dropwise add a mixture of 126 parts of propylene glycol methyl ether, 40 parts of acrylated furfuryl glycidyl ether obtained in step S1, 15 parts of glycidyl methacrylate, 20 parts of styrene, 25 parts of acrylic acid, 1 part of chain transfer agent mercaptopropanol, and 1 part of initiator 2,2'-azobis(2-methylbutyronitrile), the dropping time is controlled within 2 h, and after the dropping is completed, keep the temperature and carry out a polymerization reaction for 4 h to obtain a mixture;

[0152] S3 After the polymerization reaction is completed, increase the N2 flow rate and raise the temperature of the mixture to 90 °C and continue the reaction for 2 h to obtain a bio-based alkali-soluble resin; after testing, its number average molecular weight is 26100, the molecular weight distribution is 2.32, and the acid value is 194.4 mgKOH / g.

[0153] The preparation method of the above diallyl epoxy acrylate resin comprises the following steps:

[0154] A1 Add 420 parts of diallyl bisphenol A epoxy resin, 0.12 part of inhibitor p-hydroxyanisole, and 4.4 parts of catalyst triphenylphosphine into a reaction vessel, start stirring, and heat up to 100 °C to obtain a mixture;

[0155] A2 Dropwise add 144 parts of acrylic acid into the above mixture, and control the temperature of the reaction system not to exceed 115 °C during the dropping process; after the dropping is completed, heat up to 110 °C and keep the temperature for reaction for 4 h;

[0156] A3 After cooling, obtain the above diallyl epoxy acrylate resin.

[0157] The method for preparing the above solder resist ink comprises the following steps:

[0158] B1 Add 30 parts of bio-based alkali-soluble resin, 21 parts of diallyl epoxy acrylate resin, 17 parts of diallyl bisphenol A epoxy resin, 8.5 parts of reactive diluent trimethylolpropane triacrylate, 4.6 parts of pigment phthalocyanine blue, 10 parts of filler silica, 0.6 part of dispersant Disperbyk 1010, 0.3 part of leveling agent Disperbyk 607, and 0.3 part of defoamer Disperbyk 921 into a dispersion container, start high-speed mechanical stirring to obtain a mixture. During the stirring process, the temperature is 50 °C, the stirring rate is 3000 r / min, and the stirring time is 0.5 h;

[0159] B2 Grind the mixture obtained in B1 on a grinder, with a grinding pressure of 3.5 MPa and a grinding time of 10 min to obtain a ground product;

[0160] B3 Within 20 h before use, add 1.7 parts of photoinitiator 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2.6 parts of photoinitiator 2,4-diethylthioxanthone, and 3.4 parts of curing agent methylated melamine into the ground product, and continue stirring for 30 min until dissolved uniformly to obtain the solder resist ink.

[0161] Example 3

[0162] A solder resist ink, the raw materials of the above solder resist ink include the following components:

[0163] Bio-based alkali-soluble resin, 34 parts;

[0164] Diallyl epoxy acrylate resin, 28 parts;

[0165] Bisphenol A epoxy resin, 9 parts;

[0166] Reactive diluent, 5 parts;

[0167] Curing agent, 4.7 parts;

[0168] Photoinitiator, 5.7 parts;

[0169] Pigment, 3 parts;

[0170] Filler, 9.5 parts;

[0171] Dispersant, 0.4 part;

[0172] Leveling agent, 0.3 part;

[0173] Defoaming agent, 0.4 part.

[0174] The above active diluent is trimethylolpropane triacrylate;

[0175] The above pigment is phthalocyanine green;

[0176] The above filler is silica;

[0177] The above dispersant is Disperbyk 650;

[0178] The above leveling agent is Disperbyk 360;

[0179] The above defoaming agent is Disperbyk 944;

[0180] The above photoinitiator is 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone and benzil dimethyl ketal;

[0181] The above curing agent is methylated melamine.

[0182] The preparation method of the above bio-based alkali-soluble resin includes the following steps:

[0183] S1 Add 154 parts of furfuryl glycidyl ether, 72 parts of acrylic acid, 0.6 part of catalyst tetrabutylammonium bromide, and 0.02 part of inhibitor p-hydroxyanisole to a reaction vessel, start stirring, heat up to 110 °C, keep the temperature for reaction for 6 h, and cool down to obtain acrylated furfuryl glycidyl ether;

[0184] S2 Take 63 parts of propylene glycol methyl ether, start stirring, introduce N2, after the N2 introduction time exceeds 1 h, heat up to 70 °C, then dropwise add a mixture of 126 parts of propylene glycol methyl ether, 35 parts of acrylated furfuryl glycidyl ether obtained in step S1, 20 parts of glycidyl methacrylate, 15 parts of styrene, 30 parts of acrylic acid, 0.6 part of chain transfer agent mercaptopropanol, and 1.3 parts of initiator 2,2'-azobis(2-methylbutyronitrile), control the dropping time within 2 h, and keep the temperature for polymerization reaction for 4 h after the dropping is completed to obtain a mixture;

[0185] After the S3 polymerization reaction is completed, increase the amount of N2 introduced and raise the temperature of the mixture to 90 °C and continue the reaction for 2 h to obtain a bio-based alkali-soluble resin; after testing, its number average molecular weight is 24,300, the molecular weight distribution is 2.68, and the acid value is 233.3 mg KOH / g.

[0186] The preparation method of the above diallyl-type epoxy acrylate resin includes the following steps:

[0187] A1 Add 420 parts of diallyl-type bisphenol A epoxy resin, 0.07 part of inhibitor p-methoxy phenol, and 2.3 parts of catalyst triphenylphosphine to the reaction vessel, start stirring, and raise the temperature to 110 °C to obtain a mixture;

[0188] A2 Dropwise add 135 parts of acrylic acid to the above mixture, and control the temperature of the reaction system not to exceed 115 °C during the dropping process; after the dropping is completed, raise the temperature to 115 °C and keep the temperature for 4 h;

[0189] A3 After cooling, obtain the above diallyl-type epoxy acrylate resin.

[0190] The method for preparing the above solder resist ink includes the following steps:

[0191] B1 Add 34 parts of bio-based alkali-soluble resin, 28 parts of diallyl-type epoxy acrylate resin, 9 parts of bisphenol A epoxy resin, 5 parts of active diluent trimethylolpropane triacrylate, 3 parts of pigment phthalocyanine green, 9.5 parts of filler silica, 0.4 part of dispersant Disperbyk 650, 0.3 part of leveling agent Disperbyk 360, and 0.4 part of defoamer Disperbyk 944 to the dispersion container, start high-speed mechanical stirring to obtain a mixture. During the stirring process, the temperature is 50 °C, the stirring rate is 3000 r / min, and the stirring time is 0.5 h;

[0192] B2 Grind the mixture obtained in B1 on a grinder, the grinding pressure is 3.5 MPa, and the grinding time is 10 min to obtain a ground product;

[0193] B3 Within 20 h before use, add 3.8 parts of photoinitiator 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone, 1.9 parts of photoinitiator benzil dimethyl ketal, and 4.7 parts of curing agent methylated melamine to the ground product, and continue stirring for 30 min until dissolved uniformly to obtain the solder resist ink.

[0194] Example 4

[0195] A solder resist ink, the raw materials of the above solder resist ink include the following components:

[0196] Bio-based alkali-soluble resin, 20 parts;

[0197] Diallyl-type epoxy acrylate resin, 33 parts;

[0198] Phenolic epoxy resin, 9 parts;

[0199] Reactive diluent, 14 parts;

[0200] Curing agent, 4.7 parts;

[0201] Photoinitiator, 6.6 parts;

[0202] Pigment, 3.9 parts;

[0203] Filler, 8 parts;

[0204] Dispersant, 0.3 part;

[0205] Leveling agent, 0.3 part;

[0206] Defoamer, 0.2 part.

[0207] The above reactive diluent is trimethylolpropane triacrylate;

[0208] The above pigment is benzidine yellow;

[0209] The above filler is talc powder;

[0210] The above dispersant is Disperbyk 671;

[0211] The above leveling agent is Disperbyk 960;

[0212] The above defoamer is Disperbyk 963;

[0213] The above photoinitiator is 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone and 2,4-diethylthioxanthone;

[0214] The above curing agent is dicyandiamide.

[0215] The preparation method of the above bio-based alkali-soluble resin comprises the following steps:

[0216] S1 Add 154 parts of furfuryl glycidyl ether, 72 parts of acrylic acid, 0.4 part of catalyst tetrabutylammonium bromide, and 0.04 part of inhibitor p-methoxy phenol to a reaction vessel, start stirring, heat up to 110 °C, keep the temperature for reaction for 8 h, and cool down to obtain acrylated furfuryl glycidyl ether;

[0217] Take 51 parts of propylene glycol methyl ether in S2, start stirring, and introduce N2. After the N2 introduction time exceeds 1 h, raise the temperature to 70 °C, and then dropwise add a mixture of 102 parts of propylene glycol methyl ether, 45 parts of the acrylated furfuryl glycidyl ether obtained in step S1, 10 parts of glycidyl methacrylate, 25 parts of styrene, 20 parts of acrylic acid, 0.2 part of the chain transfer agent mercaptopropanol, and 1.5 parts of the initiator azodiisooctanenitrile. The dropping time is controlled within 3 h. After the dropping is completed, keep the temperature for the polymerization reaction for 3 h to obtain a mixture;

[0218] After the polymerization reaction in S3 is completed, increase the N2 introduction amount and raise the temperature of the mixture to 90 °C and continue the reaction for 2 h to obtain a bio-based alkali-soluble resin; after testing, its number average molecular weight is 22,500, the molecular weight distribution is 2.91, and the acid value is 155 mgKOH / g.

[0219] The preparation method of the above diallyl-type epoxy acrylate resin includes the following steps:

[0220] Add 420 parts of diallyl-type bisphenol A epoxy resin, 0.09 part of the inhibitor p-hydroxyanisole, and 3.5 parts of the catalyst triphenylphosphine to the reaction vessel, start stirring, and raise the temperature to 100 °C to obtain a mixture;

[0221] Dropwise add 1138 parts of acrylic acid to the above mixture, and control the temperature of the reaction system not to exceed 115 °C during the dropping process; after the dropping is completed, raise the temperature to 110 °C and keep the temperature for the reaction for 4 h;

[0222] After cooling, obtain the above diallyl-type epoxy acrylate resin.

[0223] The method for preparing the above solder resist ink includes the following steps:

[0224] Add 20 parts of bio-based alkali-soluble resin, 33 parts of diallyl-type epoxy acrylate resin, 9 parts of phenolic epoxy resin, 14 parts of the reactive diluent trimethylolpropane triacrylate, 3.9 parts of the pigment benzidine yellow, 8 parts of the filler talc powder, 0.3 part of the dispersant Disperbyk 671, 0.3 part of the leveling agent Disperbyk 960, and 0.2 part of the defoaming agent Disperbyk 963 to the dispersion container, start high-speed mechanical stirring to obtain a mixture. During the stirring process, the temperature is 50 °C, the stirring rate is 3000 r / min, and the stirring time is 0.5 h;

[0225] Grind the mixture obtained in B1 on a grinder, with a grinding pressure of 3.5 MPa and a grinding time of 10 min to obtain a ground product;

[0226] Within 20 hours before the use of B3, 3.8 parts of photoinitiator 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone, 2.8 parts of photoinitiator 2,4-diethylthioxanthone, and 4.7 parts of curing agent dicyandiamide were added to the abrasive, and stirring was continued for 30 minutes until dissolved uniformly to obtain the solder resist ink.

[0227] Example 5

[0228] A solder resist ink, the raw materials of the solder resist ink include the following components:

[0229] Bio-based alkali-soluble resin, 27 parts;

[0230] Diallyl type epoxy acrylate resin, 30 parts;

[0231] Diallyl bisphenol A epoxy resin, 10 parts;

[0232] Reactive diluent, 7 parts;

[0233] Curing agent, 4.4 parts;

[0234] Photoinitiator, 6 parts;

[0235] Pigment, 5.3 parts;

[0236] Filler, 9.2 parts;

[0237] Dispersant, 0.5 part;

[0238] Leveling agent, 0.2 part;

[0239] Defoaming agent, 0.4 part.

[0240] The above reactive diluent is dipentaerythritol hexaacrylate;

[0241] The above pigment is permanent violet;

[0242] The above filler is barium sulfate;

[0243] The above dispersant is Disperbyk 681;

[0244] The above leveling agent is Disperbyk 980;

[0245] The above defoaming agent is Disperbyk 971;

[0246] The above photoinitiator is 2-methyl-1-[4-(methylthio)phenyl]-2-morpholin-1-one and benzophenone;

[0247] The above curing agent is benzoguanamine.

[0248] The preparation method of the above bio-based alkali-soluble resin includes the following steps:

[0249] S1 Add 154 parts of furfuryl glycidyl ether, 72 parts of acrylic acid, 0.5 part of catalyst tetrabutylammonium bromide, and 0.03 part of inhibitor p-hydroxyanisole into a reaction vessel. Start stirring, heat up to 110 °C, keep the temperature for reaction for 7 h, and then cool down to obtain furfuryl glycidyl ether acrylate.

[0250] S2 Take 51 parts of propylene glycol methyl ether, start stirring, and introduce N2. After the N2 introduction time exceeds 1 h, heat up to 70 °C, and then dropwise add a mixture of 102 parts of propylene glycol methyl ether, 40 parts of furfuryl glycidyl ether acrylate obtained in step S1, 20 parts of glycidyl methacrylate, 15 parts of styrene, 25 parts of acrylic acid, 0.5 part of chain transfer agent mercaptopropanol, and 1.2 parts of initiator 2,2'-azobis(2,4-dimethylvaleronitrile). The dropping time is controlled within 2 h. After the dropping is completed, keep the temperature for polymerization reaction for 4 h to obtain a mixture.

[0251] S3 After the polymerization reaction is completed, increase the N2 introduction amount, and heat up the mixture to 90 °C and continue the reaction for 2 h to obtain a bio-based alkali-soluble resin. After testing, its number average molecular weight is 24,800, the molecular weight distribution is 2.77, and the acid value is 194.2 mg KOH / g.

[0252] The preparation method of the above diallyl-type epoxy acrylate resin includes the following steps:

[0253] A1 Add 420 parts of diallyl-type bisphenol A epoxy resin, 0.09 part of inhibitor p-hydroxyanisole, and 3 parts of catalyst triphenylphosphine into a reaction vessel. Start stirring and heat up to 100 °C to obtain a mixture.

[0254] A2 Dropwise add 138 parts of acrylic acid to the above mixture, and control the reaction system temperature not to exceed 115 °C during the dropping process; after the dropping is completed, heat up to 115 °C and keep the temperature for reaction for 4 h.

[0255] A3 After cooling down, obtain the above diallyl-type epoxy acrylate resin.

[0256] The method for preparing the above solder resist ink includes the following steps:

[0257] B1 Add 27 parts of bio-based alkali-soluble resin, 30 parts of diallyl-type epoxy acrylate resin, 10 parts of diallyl bisphenol A epoxy resin, 7 parts of reactive diluent dipentaerythritol hexaacrylate, 5.3 parts of pigment permanent violet, 9.2 parts of filler barium sulfate, 0.5 part of dispersant Disperbyk 681, 0.2 part of leveling agent Disperbyk 980, and 0.4 part of defoamer Disperbyk 971 into a dispersion container, and start high-speed mechanical stirring to obtain a mixture. During the stirring process, the temperature is 50 °C, the stirring rate is 3000 r / min, and the stirring time is 0.5 h.

[0258] The mixture obtained in B1 is ground on a grinder at a grinding pressure of 3.5 MPa for 10 min to obtain a ground product;

[0259] Within 20 h before use, 4 parts of photoinitiator 2-methyl-1-[4-(methylthio)phenyl]-2-morpholin-1-one, 2 parts of photoinitiator benzophenone, and 4.4 parts of curing agent benzoguanamine are added to the ground product, and stirring is continued for 30 min until uniformly dissolved to obtain a solder resist ink.

[0260] Comparative Example 1

[0261] The formulation of Comparative Example 1 does not add the diallyl-type epoxy acrylate resin prepared in the invention.

[0262] A solder resist ink, the raw materials of the above solder resist ink include the following components:

[0263] Bio-based alkali-soluble resin, 37 parts;

[0264] Diallyl bisphenol A epoxy resin, 23 parts;

[0265] Reactive diluent, 19.5 parts;

[0266] Curing agent, 2 parts;

[0267] Photoinitiator, 5.6 parts;

[0268] Pigment, 6.5 parts;

[0269] Filler, 6.5 parts;

[0270] Dispersant, 0.3 part;

[0271] Leveling agent, 0.2 part;

[0272] Defoaming agent, 0.3 part.

[0273] The above reactive diluent is tripropylene glycol diacrylate;

[0274] The above pigment is phthalocyanine green;

[0275] The above filler is silica;

[0276] The above dispersant is Disperbyk 1010;

[0277] The above leveling agent is Disperbyk 360;

[0278] The above defoaming agent is Disperbyk 910;

[0279] The above photoinitiator is 2-methyl-1-[4-(methylthio)phenyl]-2-morpholin-1-one and benzoyl dimethyl ether;

[0280] The above curing agent is dicyandiamide.

[0281] The preparation method of the above bio-based alkali-soluble resin comprises the following steps:

[0282] S1 Add 154 parts of furfuryl glycidyl ether, 72 parts of acrylic acid, 0.2 part of catalyst tetrabutylammonium bromide, and 0.01 part of inhibitor p-hydroxyanisole to a reaction vessel, start stirring, heat up to 110 °C, keep the temperature for reaction for 8 h, and cool down to obtain acrylated furfuryl glycidyl ether;

[0283] S2 Take 78 parts of propylene glycol methyl ether, start stirring, introduce N2, after the N2 introduction time exceeds 1 h, heat up to 70 °C, then dropwise add a mixture of 156 parts of propylene glycol methyl ether, 45 parts of acrylated furfuryl glycidyl ether obtained in step S1, 10 parts of glycidyl methacrylate, 20 parts of styrene, 25 parts of acrylic acid, 0.8 part of chain transfer agent mercaptopropanol, and 0.7 part of initiator 2,2'-azobis(2-methylheptanenitrile). The dropping time is controlled within 2 h. After the dropping is completed, keep the temperature for polymerization reaction for 4 h to obtain a mixture;

[0284] S3 After the polymerization reaction is completed, increase the N2 introduction amount, and heat up the mixture to 90 °C and continue the reaction for 2 h to obtain a bio-based alkali-soluble resin; after testing, its number average molecular weight is 28300, the molecular weight distribution is 2.46, and the acid value is 194 mgKOH / g.

[0285] The method for preparing the above solder resist ink comprises the following steps:

[0286] B1 Add 37 parts of bio-based alkali-soluble resin, 23 parts of diallylbisphenol A epoxy resin, 19.5 parts of reactive diluent tripropylene glycol diacrylate, 5.6 parts of pigment phthalocyanine green, 6.5 parts of filler silica, 0.3 part of dispersant Disperbyk 1010, 0.2 part of leveling agent Disperbyk 360, and 0.3 part of defoamer Disperbyk 910 to a dispersion container, start high-speed mechanical stirring, and the stirring time is 0.5 h;

[0287] B2 Grind the mixture obtained in B1 on a grinder, the grinding pressure is 3.5 MPa, and the grinding time is 10 min to obtain a ground product;

[0288] B3 Within 20 h before use, add 3.7 parts of photoinitiator 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 1.9 parts of photoinitiator benzil dimethyl ketal, and 2.0 parts of curing agent dicyandiamide to the ground product, and continue stirring for 30 min until dissolved uniformly to obtain a solder resist ink.

[0289] Comparative Example 2

[0290] The formulation of Comparative Example 2 does not add the bio-based alkali-soluble resin prepared in the invention.

[0291] A solder mask ink, the raw materials of the solder mask ink include the following components:

[0292] Diallyl type epoxy acrylate resin, 37 parts;

[0293] Diallyl bisphenol A epoxy resin, 23 parts;

[0294] Reactive diluent, 19.5 parts;

[0295] Curing agent, 2 parts;

[0296] Photoinitiator, 5.6 parts;

[0297] Pigment, 5.6 parts;

[0298] Filler, 6.5 parts;

[0299] Dispersant, 0.3 part;

[0300] Leveling agent, 0.2 part;

[0301] Defoaming agent, 0.3 part.

[0302] The above reactive diluent is tripropylene glycol diacrylate;

[0303] The above pigment is phthalocyanine green;

[0304] The above filler is silica;

[0305] The above dispersant is Disperbyk 1010;

[0306] The above leveling agent is Disperbyk 360;

[0307] The above defoaming agent is Disperbyk 910;

[0308] The above photoinitiator is 2-methyl-1-[4-(methylthio)phenyl]-2-morpholin-1-one and benzoyl dimethyl ether;

[0309] The above curing agent is dicyandiamide.

[0310] The preparation method of the above diallyl type epoxy acrylate resin includes the following steps:

[0311] A1 Add 420 parts of diallyl type bisphenol A epoxy resin, 0.14 part of inhibitor p-hydroxyanisole, and 5 parts of catalyst triphenylphosphine into a reaction vessel, start stirring, and heat up to 100 °C to obtain a mixture;

[0312] A2 Dropwise add 144 parts of acrylic acid into the above mixture, and control the temperature of the reaction system not to exceed 115 °C during the dropping process; after the dropping is completed, heat up to 110 °C and keep the temperature for reaction for 4 h;

[0313] After cooling A3, the above-mentioned diallyl epoxy acrylate resin is obtained.

[0314] The method for preparing the above-mentioned solder resist ink includes the following steps:

[0315] B1 Add 37 parts of diallyl epoxy acrylate resin, 23 parts of diallyl bisphenol A epoxy resin, 19.5 parts of active diluent tripropylene glycol diacrylate, 5.6 parts of pigment phthalocyanine green, 6.5 parts of filler silica, 0.3 part of dispersant Disperbyk 1010, 0.2 part of leveling agent Disperbyk 360, and 0.3 part of defoamer Disperbyk 910 into a dispersion container, and start high-speed mechanical stirring to obtain a mixture. During the stirring process, the temperature is 50 °C, the stirring rate is 3000 r / min, and the stirring time is 0.5 h;

[0316] B2 Grind the mixture obtained in B1 on a grinder with a grinding pressure of 3.5 MPa and a grinding time of 10 min to obtain a ground product;

[0317] B3 Within 20 h before use, add 3.7 parts of photoinitiator 2-methyl-1-[4-(methylthio)phenyl]-2-morpholin-1-propanone, 1.9 parts of photoinitiator benzoyl dimethyl ether, and 2.0 parts of curing agent dicyandiamide to the ground product, and continue stirring for 30 min until dissolved evenly to obtain the solder resist ink.

[0318] Performance test:

[0319] Screen-print the solder resist inks obtained in Examples 1-5 and Comparative Examples 1-2 with a 120-mesh screen, and successively pass through pre-baking (70 - 75 °C / 30 - 50 min), exposure (600 - 750 mj / cm 2 ), development (1 wt% Na2CO3 aqueous solution, 30 ± 2 °C, 1.0 - 3.0 kg / cm 2 spray pressure, 50 - 80 s), post-curing (145 - 155 °C / 50 - 70 min) and other process steps. The adhesion test is carried out in accordance with ASTM D3359, the hardness test is carried out in accordance with ASTM D3363, and the dielectric properties are carried out in accordance with IPC TM-650 5.5.3.7-1998 in the electronic interconnection industry standard (Printed Circuit Industry Association of the United States). The main performance test results are shown in Table 1.

[0320] Table 1

[0321]

[0322] It can be seen from Table 1 that: compared with the examples, the diallyl epoxy acrylate resin prepared in the invention is not added in the formulation of Comparative Example 1, and the crosslinking degree after the solder resist ink is cured decreases, resulting in significantly worse heat resistance, resolution and dielectric properties of the cured film; compared with the examples, the bio-based alkali-soluble resin prepared in the invention is not added in the formulation of Comparative Example 2, and the alkali water-soluble structure of the solder resist ink system is missing, resulting in ineffective development of the cured film; the performance shown in Example 1 is the best overall.

[0323] In summary, the bio-based low-dielectric solder resist ink prepared with the bio-based alkali-soluble resin and diallyl epoxy acrylate resin prepared in the present invention as the matrix resins has excellent adhesion and heat resistance, and both the dielectric constant and loss factor are relatively low, showing broad application and market prospects.

[0324] The above are only the embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent transformation made by using the content of the specification of the present invention, or directly or indirectly applied in the relevant technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A solder mask ink, characterized in that: The raw materials of the solder mask ink include the following components in parts by weight: Bio-based alkali-soluble resin, 10-40 parts; Epoxy resin, 15-60 parts, and at least 10-40 parts of diallyl-type epoxy acrylate resin is contained in the epoxy resin; Curing agent, 2-6 parts; Photoinitiator, 3-10 parts; Filler, 5-15 parts; Auxiliary agent, 7-31; The structural formula of the bio-based alkali-soluble resin is: ； Wherein, x, y, z and m > 0; The structural formula of the diallyl-type epoxy acrylate resin is: 。 2. The solder resist ink according to claim 1, characterized in that: The epoxy resin also includes at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, diallyl bisphenol A epoxy resin, and phenolic epoxy resin.

3. A solder resist ink according to claim 1, characterized in that: The photoinitiator includes at least one of 2-methyl-1-[4-(methylthio)phenyl]-2-morpholin-1-propanone, benzil dimethyl ketal, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone, benzophenone, and 2,4-diethylthioxanthone.

4. The solder resist ink according to claim 1, wherein: The preparation method of the bio-based alkali-soluble resin includes the following steps: S1 Mix furfuryl glycidyl ether, acrylic acid, catalyst, inhibitor, heat up for reaction and then cool down to obtain acrylated furfuryl glycidyl ether; S2 In a reaction vessel, introduce a protective atmosphere, heat up, add propylene glycol monomethyl ether, the acrylated furfuryl glycidyl ether obtained in step S1, glycidyl methacrylate, styrene, acrylic acid, chain transfer agent, initiator, keep warm after adding, and carry out a polymerization reaction to obtain a mixture; S3 After the polymerization reaction in step S2 ends, heat up the mixture for reaction to obtain the bio-based alkali-soluble resin.

5. The solder resist ink according to claim 4, wherein: In step S1, the catalyst includes tetrabutylammonium bromide.

6. The solder resist ink according to claim 4, wherein: In step S1, the inhibitor includes p-methoxyphenol.

7. A solder resist ink according to claim 4, characterized in that: The ratio of the temperature after heating up in step S2 to the temperature after heating up in step S3 is 70-80°C: 90-100°C.

8. A solder resist ink according to claim 1, characterized in that: The preparation method of the diallyl-type epoxy acrylate resin includes the following steps: A1 Mix diallyl-type bisphenol A epoxy resin, inhibitor p-methoxyphenol, catalyst triphenylphosphine, heat up for reaction to obtain a mixture; A2 Control the temperature of the reaction system not to exceed 115°C, add acrylic acid to the mixture, and then heat up for reaction to obtain the diallyl-type epoxy acrylate resin.

9. A method for preparing a solder resist ink as described in any one of claims 1 to 8, characterized in that: Include the following steps: B1 Mix the bio-based alkali-soluble resin, epoxy resin, and filler in a container, heat and stir to obtain a mixture; B2 Add a photoinitiator and a curing agent to the mixture to obtain the solder mask ink.

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