A multi-color light-emitting chip type lamp bead structure and a production method thereof

Abstract

The application discloses a multi-color light-emitting chip type lamp bead structure and a production method, relates to the technical field of LED lamp beads, and comprises an LED lamp bead, a support, a first electrode sheet, a second electrode sheet, LED chips, and electrical connection, etc., wherein the support provides physical support and an electrical conduction basis for the whole LED lamp bead; the top surface of the support is fixedly connected with the first electrode sheet on one side; the top surface of the support is fixedly connected with the second electrode sheet on the other side; the first electrode sheet and the second electrode sheet are arranged in a nested mode; the first electrode sheet and the second electrode sheet are fixedly connected with the LED chips; and the first electrode sheet and the second electrode sheet are electrically connected with the LED chips. In the application, the layout and electrode design of the LED chips are improved, so that multiple LED chips in parallel connection can be integrated in one chip type lamp bead, each chip can independently emit light and control different colors, the limitation of traditional single-color or double-color LED lamp beads is broken, and the innovative design enables the same lamp bead to realize free mixing of multiple colors.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED lamp beads, in particular to a multi-color light-emitting chip type lamp bead structure and a production method thereof. BACKGROUND

[0002] With the deepening of science and technology and environmental protection concepts, LED lamp beads have become the mainstream choice of the global lighting and display industry due to their unparalleled advantages. LED lamp beads perform well in energy saving, with much lower energy consumption than traditional lighting sources. Their long service life and short response time make them widely used in many scenarios, from ordinary lighting in homes and commercial places to advanced lighting solutions for car interiors and exteriors, from high-definition display of large display screens to precise control of traffic signal indication systems, and from delicate performance of consumer electronics backlighting to key roles played by LED lamp beads.

[0003] Currently, when encapsulating LED chips, the encapsulating glue used for encapsulation cannot flow to the two side electrode sheets of the LED lamp bead support due to factors such as encapsulation effect, current transmission, and the smoothness of the pin hole, but only flows in a direction perpendicular to the two side electrode sheets. This ensures that the encapsulating glue covers the surface of the LED chip to form an effective protective layer, while avoiding affecting the smoothness of current transmission and the pin hole.

[0004] Since the electrode sheets of the LED lamp bead support are distributed in half, the single or multiple LED chips mounted on the electrode sheets can only adopt a unified encapsulation method when point encapsulation is performed. If multiple LED chips are encapsulated separately, the gold wire used for welding the LED chips and the electrode sheets will be exposed outside the encapsulating material, which can easily cause damage. This means that no matter how many LED chips are mounted on the electrode sheets, they will be covered by the same encapsulating material, which cannot achieve individual encapsulation. The same encapsulating material can only use one color, which means that one LED lamp bead can only emit one color of light and cannot emit multiple colors of light.

[0005] The purpose of the present application is to solve the problem that the current chip type lamp bead support can only emit one color, and if two colors are needed, the chip is used for light emission and the encapsulating material cannot be adjusted. SUMMARY

[0006] In order to solve the problem that the current chip type lamp bead support can only emit one color, and if two colors are needed, the chip is used for light emission and the encapsulating material cannot be adjusted, the present application adopts the following technical solutions:

[0007] The application discloses a multi-color light-emitting chip type lamp bead structure and a production method thereof.

[0008] Preferably, the overall shape of the first electrode sheet and the second electrode sheet is L-shaped, one end of the first electrode sheet is towards one side of the second electrode sheet, the other side of the second electrode sheet is towards the other end of the first electrode sheet, and the first electrode sheet and the second electrode sheet are enclosed to form a mouth-shaped type.

[0009] Preferably, the packaging material is transparent epoxy resin, and the packaging material is mixed with colored fluorescent powder.

[0010] Preferably, the production method of the multi-color light-emitting chip type lamp bead comprises the following steps.

[0011] The first step is die bonding, that is, fixing a chip to a support plate.

[0012] The second step is wire bonding, that is, linking positive and negative poles of the chip to the support.

[0013] The third step is molding, that is, using epoxy resin to package the material after die bonding and wire bonding, different light-emitting colors can be realized by different fluorescent powder collocations.

[0014] The fourth step is cutting, that is, cutting the formed material into single materials according to size requirements.

[0015] The fifth step is light splitting, that is, splitting the cut material according to customer requirements.

[0016] The sixth step is to code and package the goods.

[0017] Preferably, the first step further comprises the following steps.

[0018] By using the PR identification technology, it can be ensured that the special mark, that is, the green oil point, on the support plate can be accurately identified in the die bonding process, and it can be ensured that the first LED chip is fixed in the direction of the predetermined position, that is, the green oil point.

[0019] Preferably, the third process further comprises the following steps:

[0020] The operator receives the rubber cake formed by the packaging material, and places it in the mold hole on the pre-prepared mold top mold. Before the mold top operation, the upper and lower molds of the machine are uniformly sprayed with film release agent to ensure that the packaging material does not adhere when it comes into contact with the mold, facilitating subsequent separation. During the mold top operation, the support is placed upside down on the lower mold of the mold top mold, and the upper and lower molds are pressed and heated to melt the rubber cake and form a glue mixture. The glue flows to and covers the LED chip. When the mold temperature drops and the glue solidifies, the mold can be opened to remove the material.

[0021] Preferably, the mold top mold comprises a lower mold, the lower mold comprises a first mold top area and a second mold top area, the second mold top area is identical in structure to each part of the first mold top area, and the first mold top area comprises a first support plate placement area and a second support plate placement area.

[0022] Preferably, the first mold top area comprises a first rubber cake hole and a second rubber cake hole, the first rubber cake hole and the second rubber cake hole are opened on the top surface of the lower mold, the first rubber cake hole is used to place a first color rubber cake, and the second rubber cake hole is used to place a second color rubber cake. The positions of the first rubber cake hole and the second rubber cake hole are between the first support plate placement area and the second support plate placement area. The lower mold is provided with a first main glue channel at positions on both sides of the first rubber cake hole. The lower mold is provided with a plurality of first auxiliary glue channels on one side of the main glue channel, and the main glue channel and the first auxiliary glue channel are in communication. The lower mold is provided with a second main glue channel at positions on both sides of the second rubber cake hole. The lower mold is provided with a plurality of second auxiliary glue channels on one side of the second main glue channel, and the second main glue channel and the second auxiliary glue channel are in communication.

[0023] Preferably, the lower mold is provided with an exhaust hole at one end of the first auxiliary glue channel and the second auxiliary glue channel.

[0024] Preferably, the support plate is provided with a positioning hole at each of the four corners, the positioning hole is placed on the mold top mold to prevent the support from shifting, and the hole positions on both sides of the support plate are asymmetric to prevent the support plate from being placed upside down.

[0025] Compared with the prior art, the present application has the following advantages:

[0026] 1. In the present application, the present application makes a chip type lamp bead inside can integrate and parallel multiple LED chips by improving the layout and electrode design of LED chip, each chip can independently emit light and independently package, each independent packaged LED chip can emit different color light according to the color of the packaging material, which breaks the limitation of traditional single color lamp bead. This innovative design enables the same lamp bead to realize free mixing of multiple colors, greatly expanding the application range of LED lamp beads in lighting and decoration fields, especially in occasions requiring multi-color light effect and dynamic change;

[0027] 2. In the present application, the multi-color light emitting chip type lamp bead integrates multiple LED chips of different colors in a single lamp bead, and connects them in parallel, so that only one lamp bead needs to be installed on a lamp string to realize two or more color light emitting effect. This innovative design greatly improves production efficiency, reduces the number of lamp bead installation, and directly reduces the material cost of the lamp string. At the same time, due to the reduction of the number of lamp beads, the welding points and potential failure points are also halved, which not only simplifies the production process, but also significantly improves the overall yield and reliability of the lamp string;

[0028] 3. In the present application, the packaging method of LED lamp bead also makes full use of the existing packaging technology. By adjusting the spacing between the packaging flow channels of the mold top mold, the packaging of LED chips with different spacing can be realized without major improvement or upgrading of the existing packaging technology. This not only reduces the production cost, but also improves the production efficiency, making this new type of LED lamp bead structure more competitive in practical application.

[0029] In summary, the present application solves the problem that the chip type lamp bead holder can only mold one color, and if two colors are needed, the chip light emitting cannot be used. BRIEF DESCRIPTION OF DRAWINGS

[0030] The drawings described herein are used to provide further understanding of the present application, and form a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application, and do not constitute an improper limitation on the present application. In the drawings:

[0031] Figure 1 A chip type lamp bead structure and production method of a multi-color light emitting chip type lamp bead structure of the present application;

[0032] Figure 2 A chip type lamp bead structure and production method of a multi-color light emitting chip type lamp bead structure of the present application;

[0033] Figure 3 A structure schematic diagram of a support plate of a multi-color light emitting chip type lamp bead structure and production method of the present application;

[0034] Figure 4 This is a schematic diagram of the lower mold structure of a chip-type lamp bead capable of emitting multicolor light according to the present invention and its production method;

[0035] Figure 5 for Figure 4 A magnified structural diagram of point A in the middle;

[0036] Figure 6 for Figure 4 A magnified structural diagram of point B in the middle;

[0037] Figure 7 This is the original chip-type bracket package diagram;

[0038] Figure 8 This is a structural schematic diagram of the original chip-type bracket.

[0039] Figure 9 It is a traditional mold top mold. Detailed Implementation

[0040] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0041] Example: This example provides a multi-color light-emitting chip-type lamp bead structure and manufacturing method. See [link to documentation]. Figures 1-2 The system includes an LED bead 1, which includes a bracket 101. The bracket 101 provides physical support and electrical conductivity for the entire LED bead 1. A first electrode plate 102 is fixedly connected to one side of the top surface of the bracket 101, and a second electrode plate 103 is fixedly connected to the other side of the top surface of the bracket 101. The first electrode plate 102 and the second electrode plate 103 are arranged in a crisscross pattern. LED chips 104 are fixedly connected to both the first electrode plate 102 and the second electrode plate 103. The first electrode plate 102 and the second electrode plate 103 are electrically connected to the LED chips 104. Several LED chips 104 are connected in parallel. An encapsulation material 105 is fixedly connected above the LED chips 104. The encapsulation material 105 is fixedly connected to the bracket 101 and is used to cover and protect the LED chips 104.

[0042] The first electrode plate 102 and the second electrode plate 103 are L-shaped. One end of the first electrode plate 102 faces one side of the second electrode plate 103, and the other side of the second electrode plate 103 faces the other end of the first electrode plate 102. The first electrode plate 102 and the second electrode plate 103 form a square shape.

[0043] The encapsulation material 105 is a transparent epoxy resin, and colored phosphor is mixed inside the encapsulation material 105.

[0044] In the specific implementation process, such as Figures 1 to 9 As shown, when the external power supply is turned on, current enters the bracket 101 through the pins or connecting wires of the LED bead. The bracket 101 not only provides physical support for the entire bead structure, but also serves as the basis for electrical conduction, distributing the current evenly to the first electrode plate 102 and the second electrode plate 103.

[0045] The first electrode plate 102 and the second electrode plate 103 are respectively connected to multiple LED chips 104. These chips are connected in series in parallel and can independently draw current from the electrode plates and emit light of a specific color according to their own characteristics. The advantage of this parallel structure design is that even if a single LED chip fails, it will not affect the normal operation of other chips, thereby improving the reliability and flexibility of the overall system. If the multiple LED chips 104 are connected in series, gold wire is needed to connect the multiple LED chips 104 together when the LED chips 104 are mounted upright. Since there are gold wires between the LED chips 104, it is impossible to achieve independent packaging of a single LED chip 104. When the LED chips 104 are flip-chip mounted, that is, the electrodes of the LED chips 104 are in direct contact with the electrode plates, the multiple LED chips 104 cannot be connected in series.

[0046] The electrode layout design breaks through the limitations of the traditional half-and-half distribution of electrode sheets in LED lamp bead brackets. The first electrode sheet 102 and the second electrode sheet 103 are not simply distributed on both sides of the bracket 101, but rather arranged in a nested and staggered manner. This layout design not only optimizes space utilization, allowing multiple LED chips 104 to be installed within the limited area of ​​the bracket 101, but also makes it possible to individually package each LED chip 104. Each LED chip 104 can be independently connected to its adjacent electrode sheet portion, and after individual packaging, the gold wires used for electrode soldering will not be exposed outside the packaging material 105. This individual packaging method also fully utilizes existing packaging technology. By adjusting the spacing between the packaging channels of the mold top die, LED chips 104 with different spacings can be packaged without major improvements or upgrades to existing packaging technology. This not only reduces production costs but also improves production efficiency, making this new LED lamp bead structure more competitive in practical applications.

[0047] When the LED chip 104 emits light, the emitted light passes upward through the encapsulating material 105. The encapsulating material 105 is usually made of transparent epoxy resin mixed with color fluorescent powder. The fluorescent powder can absorb part of the light emitted by the LED chip and emit light of another color. Therefore, in the encapsulating material 105, the original light of the LED chip and the light converted by the fluorescent powder are superimposed and mixed to form a more colorful and soft color effect. Since the electrode sheet is provided with a plurality of individually encapsulated LED chips 104, the LED lamp bead with the new lamp bead structure can emit light of different colors.

[0048] After mixing and diffusion of the encapsulating material 105, the multi-color light passes through the transparent part of the encapsulating material and is emitted from the LED lamp bead to form a visible multi-color light effect. Such multi-color light can be used for various lighting and indication applications to provide a colorful atmosphere and visual effect for the environment.

[0049] The color of the light emitted by the LED chip 104 and the type and proportion of the fluorescent powder in the encapsulating material can be adjusted according to specific requirements to achieve different multi-color light effects.

[0050] In addition, as Figures 3-6 shown, the application also provides a production method of a multi-color light emitting chip type lamp bead, comprising the following steps:

[0051] The first step is die bonding, that is, fixing the chip on the support plate.

[0052] Step S1: The support plate is subjected to a dehumidification process, which is a process for ensuring that the support plate is dry and free of moisture in advance to prevent moisture from affecting the subsequent die bonding effect. In this step, the support plate is subjected to dehumidification at a high temperature of 170°C for 1 hour to sufficiently remove the internal and surface moisture,

[0053] Step S2: The dehumidified support plate is loaded into a special box and then sent to the production line for die bonding operation. During this period, the production equipment is provided with an anti-fault mechanism to prevent product quality problems caused by operation errors. At the same time, through PR recognition technology, it is ensured that the special marks such as "green oil points" on the support plate can be accurately recognized during the die bonding process, and the first LED chip is fixed in the direction of the green oil point according to the predetermined position. This is because the green oil point usually represents the best die bonding position, which is beneficial to improve the light emitting efficiency and stability of the lamp bead. The support plate is the raw material of the support 101, and after cutting, a plurality of supports 101 are formed.

[0054] Step S3, in the process of die bonding, in order to avoid confusion and ensure product quality, the same or similar appearance but different parameters of LED chips will be arranged in different operation areas. Once the die bonding is completed, the material will be dehumidified again, because a small amount of moisture may be introduced during the die bonding process. After dehumidification, the material is transferred to the next process-wire bonding operation to ensure reliable connection of the chip and the electrode of the support plate to form a complete circuit path.

[0055] Second process, wire bonding, linking the positive and negative electrodes of the chip to the support.

[0056] Step S1, before wire bonding, the relevant parameters of wire bonding need to be carefully confirmed, including the welding time: 1-6 milliseconds, the power required for welding: 40-70 watts, and the pressure applied during welding: 15-25 megapascals. The accurate setting of these parameters is crucial for the quality of wire bonding and the performance of the lamp bead.

[0057] Step S2, after ensuring that all materials are correct, the wire bonding operation begins. The completed wire bonding material will be placed in a moisture-proof cabinet for storage, waiting for the next process. This is done to prevent moisture from affecting the completed wire bonding lamp beads, ensuring their electrical performance and reliability.

[0058] Step S3, to ensure the quality of wire bonding, the factory will regularly test the wafer foolproof function of the wire bonding station. A comprehensive test is performed once a week by the night shift staff. Without affecting normal operation, a piece of support plate will be selected as a test sample. By reversing the wire bonding starting unit on this support plate, all wire bonding machines on the production line will be tested for foolproofness. For some models that only contain single electrodes, no such foolproof test is required. However, regardless of the situation, any operation involving machine debugging, changing product models or wafer types must be verified by the machine foolproof test before starting operation, to prevent errors to the greatest extent and ensure smooth production process and stable product quality.

[0059] Third process, mold top, using epoxy resin to package the die-bonded and wire-bonded material, different fluorescent powder combinations can achieve different light colors.

[0060] Step S1, the technician will adjust the ratio of fluorescent powder according to the required light color effect to ensure the correct color during packaging. After adjusting the fluorescent powder, the packaging material is made into a jelly cake shape, and then transferred to the operator for the next step.

[0061] Step S2, after the operator receives the prepared glue cake, it is placed in the mold hole on the pre-prepared mold top mold. Before the mold top operation, the upper and lower molds of the machine are uniformly sprayed with film release agent to ensure that the packaging material does not adhere when it comes into contact with the mold, facilitating subsequent separation. During the mold top operation, the support is placed upside down on the lower mold 2 of the mold top mold, and the upper and lower molds are pressed and heated to melt the glue cake and form a glue mixture. The glue flows to and covers the LED chip. After the mold temperature drops slightly, the glue solidifies, and the mold can be opened to take out the material. During the mold top operation, the mold top mold pressure is set to 70-150 kg / cm2 to ensure that the packaging material can fully penetrate and wrap the LED chip. The speed is set in the range of 50-100 seconds to ensure that the packaging material solidifies within the appropriate time. The temperature is controlled at 120-170 degrees Celsius to ensure that the packaging material melts and solidifies at the appropriate temperature to form good optical and mechanical properties. Through the above rigorous operation and fine parameter control, the mold top process of the LED lamp bead is finally completed.

[0062] The mold top mold includes a lower mold 2, which includes a first mold top area 201 and a second mold top area 202. The second mold top area 202 has the same structure as the first mold top area 201. The first mold top area 201 includes a first support plate placement area 203 and a second support plate placement area 204.

[0063] The first mold top area 201 includes a first glue cake hole 205 and a second glue cake hole 206. The first glue cake hole 205 is used to place the first color glue cake, and the second glue cake hole 206 is used to place the second color glue cake. The first glue cake hole 205 and the second glue cake hole 206 are opened on the top surface of the lower mold 2. The positions of the first glue cake hole 205 and the second glue cake hole 206 are between the first support plate placement area 203 and the second support plate placement area 204. The lower mold 2 is provided with a first main glue channel 207 at the positions on both sides of the first glue cake hole 205. The lower mold 2 is provided with a plurality of first auxiliary glue channels 208 on one side of the main glue channel 207. The main glue channel 207 and the first auxiliary glue channel 208 are in communication. The lower mold 2 is provided with a second main glue channel 209 at the positions on both sides of the second glue cake hole 206. The lower mold 2 is provided with a plurality of second auxiliary glue channels 210 on one side of the second main glue channel 209. The second main glue channel 209 and the second auxiliary glue channel 210 are in communication. The lower mold 2 is provided with an exhaust hole 211 at one end of the first auxiliary glue channel 208 and the second auxiliary glue channel 210.

[0064] The support plate is provided with a positioning hole at each of the four corners to prevent the support from shifting when placed on the mold top mold. The hole positions on both sides of the support plate are asymmetric to prevent the support plate from being placed upside down.

[0065] The fourth process is cutting. The formed material is cut into single materials according to the size requirements.

[0066] Step S1, the operator will choose the material that has completed the mold top process, and paste high-temperature adhesive tape on the back of the material to facilitate fixation and subsequent cutting. Place the material with high-temperature adhesive tape on the back on the fixture with the back facing up, and ensure that the hole positions on the material and the fixture are aligned, so that accurate size and shape can be obtained during cutting.

[0067] Step S2, prepare a bottom film in advance and place it between the material with aligned hole positions and the fixture, ensuring that the bottom film is tightly combined with the material and the high-temperature adhesive tape, and use cloth to wipe the air and uneven parts between the bottom film and the material to enhance the bonding effect.

[0068] Step S3, accurately cut the material fixed on the fixture with high-temperature adhesive tape. After cutting, use an air gun to quickly blow off any moisture that may be present on the surface of the material, and peel off the excess corners.

[0069] Step S4, separate the cut material from the high-temperature adhesive tape with the help of the fixture, and put the material into a sieve shaker to further remove residual corners, to ensure the neatness and uniformity of the product.

[0070] Step S5, after completing the above steps, the screened material will enter the polishing process, and the surface will be finished by a polishing machine to ensure smoothness. After polishing, the material will be cleaned to remove impurities such as grinding dust, and after cleaning, the material will be placed in an oven for dehumidification treatment to ensure that the internal moisture of the material is effectively removed. Finally, the dehumidified material will be properly stored in a moisture-proof cabinet for subsequent processes.

[0071] Fifth process, light separation, cut the material according to customer requirements

[0072] Step S1, arrange the LED lamp bead material that has been cut, polished and cleaned to ensure that it is clean and dust-free. The sorting machine needs to be cleaned before starting work to remove residual debris or fragments of the previous batch of products inside the machine, and the surface of the machine should be carefully cleaned to prevent mixing of different batches or different specifications of products, affecting the accuracy of the light separation result.

[0073] Step S2, then, according to the specific requirements and standards of the customer, set the parameters of the light separation machine, such as spectral range, brightness level, color consistency, etc., to ensure accurate differentiation and selection of LED lamp beads that meet the specifications. When the material is sorted, put the qualified LED lamp beads into the electrostatic bag one by one for packaging. The electrostatic bag can effectively prevent damage to the LED lamp beads caused by static electricity and help maintain their dry state. The packaged lamp beads should be quickly stored in a moisture-proof cabinet to prevent moisture from affecting product quality. After the light separation process is completed, this batch of lamp beads can be transferred to the next process for further processing or packed out of the warehouse.

[0074] Sixth process: braiding / packaging delivery

[0075] Step S1, transfer the LED lamp bead material meeting the specifications after spectrophotometry to the standby area for classification and standby. Put the lamp beads of the same parameter into the same box for easy management and subsequent automatic operation. Load the sorted standby material to the braiding machine.

[0076] Step S2, before the braiding operation, clean the braiding machine thoroughly to ensure that there is no impurity and dust inside the equipment to prevent affecting the quality of the lamp beads and the braiding effect. Then, pour the standby LED lamp bead material into the circular vibration tray and arrange it uniformly by vibration to start the braiding operation. Fix the lamp beads in order on the carrier tape. After braiding, the material is attached to the corresponding product label on the reel, indicating the product model, parameter, quantity and other important information.

[0077] Step S3, when the braiding machine completes the braiding of a roll of material, scan and standby to ensure the data is accurate. Then, load the full roll of braided LED lamp bead reel into a special aluminum foil bag to further strengthen the moisture and static protection. Finally, put the packaged aluminum foil bag into a carton for warehousing operation. At this point, the LED lamp bead has completed the whole process from production to packaging and can be prepared for delivery to the customer.

[0078] Comparative Example 1, as shown in Figures 7 to 8 The traditional LED lamp bead usually adopts a half design electrode structure, that is, one anode and one cathode are located on the opposite sides of the support 101. The LED chip 104 is installed on one side of the electrode sheet when it is mounted. In order to make the LED chip 104 electrified, the electrode of the LED chip 104 must be connected to the corresponding electrode sheet by using a gold wire. At this time, one end of the gold wire is connected to the electrode sheet on the other side across the insulating belt. When the LED chip 104 is encapsulated, the gold wire also needs to be encapsulated. Therefore, no matter how many LED chips 104 are installed on the electrode sheet or the LED chip 104 is installed on which side of the electrode sheet, the encapsulation material must cover both sides of the electrode sheet when encapsulating. When the LED chip 104 is inverted, it is not necessary to use a gold wire to weld the LED chip 104 and the electrode sheet. However, the positive and negative electrodes of the LED chip 104 need to be in contact with the electrode sheets on both sides. Therefore, when the inverted LED chip 104 is encapsulated, no matter how many LED chips 104 are installed on the support 101, they will be covered by the same encapsulation material. In summary, the traditional electrode sheet design often makes a single LED lamp bead 1 only encapsulate and activate one color of phosphor, so that each chip emits light of a single color.

[0079] The multi-color light-emitting chip-type lamp bead of this application does not have a simple half-and-half layout of the first electrode plate 102 and the second electrode plate 103, but are nested on both sides of the bracket 101. Each electrode plate can be fixed and connected with multiple individually packaged LED chips 104. Each individually packaged LED chip 104 can emit different light according to the different colors of the packaging material 105. The LED chips 104 are connected in parallel, which means that each chip 104 can be independently controlled and lit, thereby realizing the emission of different colors of light within the same lamp bead or producing more color effects through mixing.

[0080] Comparative Example 2, such as Figure 9 As shown, traditional packaging molds have four glue cake placement areas, which are divided into two pairs. The main glue channels of the same pair of glue cake placement areas are connected, which does not allow for the simultaneous operation of two colors of glue powder.

[0081] The mold top mold slab placement areas of this application are different from each other, which can realize the simultaneous operation of two colors of adhesive powder.

[0082] Based on the embodiments and comparative examples, the present invention solves the problem that current chip-type LED bead brackets can only mold one color. If two colors are required, chip-based light emission is still used, and packaging materials cannot be used for debugging.

[0083] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A multi-color light-emitting chip type lamp bead structure comprising a LED lamp bead (1), characterized in that: The LED lamp bead (1) includes a support (101), which provides physical support and electrical conduction for the entire LED lamp bead (1), one side of the top surface of the support (101) is fixedly connected with a first electrode sheet (102), the other side of the top surface of the support (101) is fixedly connected with a second electrode sheet (103), the first electrode sheet (102) and the second electrode sheet (103) are arranged in a nested manner, the first electrode sheet (102) and the second electrode sheet (103) are fixedly connected with an LED chip (104), the first electrode sheet (102) and the second electrode sheet (103) are electrically connected with the LED chip (104), the LED chip (104) is fixedly connected with an encapsulating material (105) above, the encapsulating material (105) is fixedly connected with the support (101), and the encapsulating material (105) is used for covering and protecting the LED chip (104). The first electrode sheet (102) and the second electrode sheet (103) are L-shaped as a whole, one end of the first electrode sheet (102) faces one side of the second electrode sheet (103), the other side of the second electrode sheet (103) faces the other end of the first electrode sheet (102), and the first electrode sheet (102) and the second electrode sheet (103) are enclosed to form a square shape.

2. The multi-color light-emitting chip-on-carrier structure of claim 1, wherein: The encapsulating material (105) is transparent epoxy resin, and the encapsulating material (105) is mixed with fluorescent powder with color.

3. The production method of the multi-color light-releasable chip-type lamp bead according to any one of claims 1-2, characterized in that: The method comprises the following steps: A first step of fixing a chip to a support plate; A second step of welding a wire to link the positive and negative electrodes of the chip to the support; A third step of molding, using epoxy resin to encapsulate the material after the chip is fixed and the wire is welded, different light colors can be realized by different combinations of fluorescent powder; A fourth step of cutting, cutting the formed material into single materials according to the size requirements; A fifth step of light splitting, splitting the cut materials according to customer requirements; A sixth step of banding / packaging for delivery.

4. The production method of the multi-color light-releasable chip-type lamp bead according to claim 3, characterized in that: The first step further comprises the following steps: Through PR recognition technology, it is ensured that the special marks, green oil points, on the support plate can be accurately recognized during the process of fixing the chip, and it is ensured that the first LED chip is fixed in the direction of the predetermined position, i.e., the green oil point, the support plate is the raw material of the support (101), and the support plate is cut to form a plurality of supports (101).

5. The production method of the multi-color light-releasable chip-type lamp bead according to claim 3, characterized in that: The third step further comprises the following steps: After the operator receives the formed jelly cake, the jelly cake is placed in the mold hole of the pre-prepared molding mold, before the molding operation, the upper and lower molds of the machine are uniformly sprayed with a film separating agent to ensure that the encapsulating material does not adhere when it comes into contact with the mold, facilitating subsequent separation, during the molding operation, the support is placed on the lower mold (2) of the molding mold, the upper and lower molds are pressed and heated, the jelly cake is melted to form a glue mixture, the glue flows and covers the LED chip (104), after the temperature of the mold decreases and the glue solidifies, the mold can be opened to take out the material.

6. The production method of the multi-color light-releasable chip-type lamp bead according to claim 5, characterized in that: The mold top mold comprises a lower mold (2), the lower mold (2) comprises a first mold top area (201) and a second mold top area (202), the second mold top area (202) is same as each structure of the first mold top area (201), the first mold top area (201) comprises a first support plate placement area (203) and a second support plate placement area (204).

7. The production method of the multi-color light-releasable chip-type lamp bead according to claim 6, characterized in that: The first mold top area (201) comprises a first rubber cake hole (205) and a second rubber cake hole (206), the first rubber cake hole (205) and the second rubber cake hole (206) are opened in the top surface of the lower mold (2), the first rubber cake hole (205) is used for placing the first color rubber cake, the second rubber cake hole (206) is used for placing the second color rubber cake, the position of the first rubber cake hole (205) and the second rubber cake hole (206) is between the first support plate placement area (203) and the second support plate placement area (204), the lower mold (2) is provided with a first main glue channel (207) at the position of both sides of the first rubber cake hole (205), the lower mold (2) is provided with a plurality of first auxiliary glue channels (208) at one side of the main glue channel (207), the main glue channel (207) is communicated with the first auxiliary glue channel (208), the lower mold (2) is provided with a second main glue channel (209) at the position of both sides of the second rubber cake hole (206), the lower mold (2) is provided with a plurality of second auxiliary glue channels (210) at one side of the second main glue channel (209), the second main glue channel (209) is communicated with the second auxiliary glue channel (210).

8. The production method of the multi-color light-releasable chip-type lamp bead according to claim 7, characterized in that: The lower mold (2) is provided with an exhaust hole (211) at one end of the first auxiliary glue channel (208) and the second auxiliary glue channel (210).

9. The production method of the multi-color light-releasable chip-type lamp bead according to claim 4, characterized in that: The support plate is provided with positioning holes in four corners, the positioning holes are placed on the mold top mold, used for preventing the support from deviating, the hole positions of both sides of the support plate are asymmetric, used for preventing the support plate from being placed reversely.

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