An electronic grade polysilicon packaging bag and a production method thereof

Abstract

The application discloses an electronic-grade polysilicon packaging bag and a production method thereof. The electronic-grade polysilicon packaging bag comprises an upper film, a lower film symmetrically arranged below the upper film, an edge sealing part fixedly arranged at the side of the upper film and the lower film, a front cover arranged at the top of the upper film and the lower film, and a gas nozzle assembly fixedly arranged at the middle of the top of the front cover. The upper film and the lower film each comprise a base layer, a tensile wear-resistant layer symmetrically arranged at the two sides of the base layer, a glue layer arranged below the base layer, a flame-retardant layer, an insulating layer, an ultraviolet-proof film layer and an antibacterial layer arranged in sequence above the base layer. The electronic-grade polysilicon packaging bag composed of the upper film and the lower film realizes omnibearing coating of the electronic-grade polysilicon. The sealed cavity formed by the upper film, the lower film, the edge sealing part and the front cover is in a vacuum state by the gas nozzle assembly, thereby effectively improving the packaging effect of the electronic-grade polysilicon.

Description

Technical Field

[0001] This invention relates to the field of polycrystalline silicon technology, specifically to an electronic-grade polycrystalline silicon packaging bag and its production method. Background Technology

[0002] Electronic-grade polycrystalline silicon packaging protective film is a thin film used to protect the surface of electronic-grade polycrystalline silicon. Its purpose is to prevent the surface of electronic-grade polycrystalline silicon from being damaged or contaminated during transportation, assembly or processing.

[0003] For example, the electronic-grade polysilicon packaging bag and its production method, as described in application number CN202110450916.7, comprises an inner layer, a middle layer, and an outer layer. The inner layer comprises 100% LLDPE by weight, the middle layer comprises 68-72% metallocene PE and 32-28% LLDPE by weight, and the outer layer comprises 85% LLDPE and 15% auxiliary materials by weight. The beneficial effects of this invention are: the electronic-grade polysilicon packaging bag of this invention has high tensile strength, good puncture resistance, high surface smoothness, and low surface metal precipitation, meeting the design requirements of polysilicon packaging and suitable for wide application.

[0004] For example, a packaging method for polycrystalline silicon blocks, application number CN202211529171.4, includes: (1) performing a first vacuuming of the packaging bag containing the polycrystalline silicon blocks at a first rate; (2) performing a second vacuuming of the packaging bag after the first vacuuming at a second rate to complete the first shaping of the packaging bag; (3) filling the packaging bag after the first shaping with inert gas; and (4) performing a third vacuuming of the packaging bag after filling with inert gas at a third rate to complete the second shaping of the packaging bag and seal it; wherein the second rate is less than the first rate, and the third rate is less than the first rate. This significantly reduces the probability of the polycrystalline silicon block packaging bag being punctured, significantly reduces the number of collisions during the transportation of the polycrystalline silicon blocks, and significantly reduces the probability of the polycrystalline silicon blocks being oxidized or contaminated, thus achieving safe and effective packaging and transportation of polycrystalline silicon blocks.

[0005] The aforementioned and existing electronic-grade polycrystalline silicon packaging bags, when made from packaging film to package electronic-grade polycrystalline silicon, do not achieve complete coverage, resulting in poor protection. Furthermore, because the packaging bags are mostly made of film material, air can enter through gaps between the electronic-grade polycrystalline silicon and the film material, easily causing separation between the film material and the electronic-grade polycrystalline silicon, thus failing to meet the intended protection requirements. Therefore, there is an urgent need to design an electronic-grade polycrystalline silicon packaging bag and its manufacturing method to solve the above problems. Summary of the Invention

[0006] The purpose of this invention is to provide an electronic-grade polycrystalline silicon packaging bag and its manufacturing method to overcome the above-mentioned shortcomings in the prior art.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] An electronic-grade polycrystalline silicon packaging bag includes an upper film, a lower film symmetrically disposed below the upper film, sealing edges fixedly disposed on the sides of the upper and lower films, a front cover disposed at the top of the upper and lower films and movably mounted on the top of the upper and lower films, the front cover forming a movable sealing connection with the sealing edges, an air nozzle assembly fixedly disposed at the center of the top of the front cover, both the upper and lower films include a base layer, tensile and wear-resistant layers disposed on both sides of the base layer, the tensile and wear-resistant layers on both sides of the base layer being symmetrically distributed, an adhesive layer disposed below the tensile and wear-resistant layers on the lower side of the base layer, a flame-retardant layer, an insulating layer, an anti-UV film layer and an antibacterial layer disposed sequentially above the tensile and wear-resistant layers on the upper side of the base layer, a buffer layer disposed outside the antibacterial layer, a surface layer disposed outside the buffer layer, and a printed coating disposed on the surface layer.

[0009] Preferably, the sealing edge is located on three sides of the upper and lower films, and the sealing edge is arranged in a U-shaped structure.

[0010] Preferably, decorative nameplates are fixedly provided on one outer wall of both the upper and lower membranes, and the decorative nameplates are rectangular in structure.

[0011] Preferably, the sealing edge has a corrugated structure, and the stretching distance between the upper and lower films is 1-5 cm.

[0012] Preferably, the air nozzle assembly includes a fixing seat fixedly mounted on the surface of the front cover, an air tube fixedly disposed inside the top of the fixing seat, a threaded head being provided at the top of the air tube, and a cap being installed at the top of the air tube through the threaded head.

[0013] Preferably, the outer edge of the adhesive layer is provided with a raised edge, and the tilt angle of the raised edge is 30-45 degrees.

[0014] Preferably, the thickness ratio of the flame-retardant layer, the insulating layer, the UV-protective film layer, and the antibacterial layer is 1:1:1:1.

[0015] Preferably, the buffer layer has two cavities arranged vertically inside, with an airbag inside the upper cavity and porous microspheres inside the lower cavity.

[0016] Preferably, the tensile and wear-resistant layer is formed by any one or a combination of acrylonitrile-butadiene-styrene copolymer layer, polypropylene layer and polyethylene layer.

[0017] A method for producing electronic-grade polycrystalline silicon packaging bags includes the following steps:

[0018] Raw material preparation: Select one of LLDPE, HDPE and PE as the raw material for this packaging bag. Before production, the raw materials need to be screened, cleaned and dried to ensure the quality and purity of the raw materials.

[0019] Extruded blown film: Under the action of an extruder, the processed raw materials are heated and melted, then extruded through a die and blown into shape in a blow molding machine. The packaging film has 5, 7, 9 or 10-20 layers. The number of layers and thickness of the film are set according to specific requirements.

[0020] Printing and lamination: Various patterns, texts and logos related to electronic-grade polysilicon can be printed on the packaging film to meet the needs of different customers. In the lamination process, packaging films of different materials can be laminated together to improve the performance and function of the packaging film.

[0021] Packaging and Cutting: Using the packaging films described above to form the packaging bag, the operator first inserts the electronic-grade polysilicon into the U-shaped cavity formed by the upper and lower films and the sealing edge. Then, the upper and lower films are used to adhere to the upper and lower surfaces of the electronic-grade polysilicon. Due to the presence of the sealing edge, the sides of the upper and lower films are tightly connected. Finally, the front cover is fixed to the top of the upper and lower films. An excess material is cut off during the packaging of the electronic-grade polysilicon using a utility knife, thereby forming a sealed cavity between the upper and lower films. Finally, the operator uses a vacuum pump connected to the air nozzle assembly to completely extract the air from the cavity, achieving a vacuum state.

[0022] In the above technical solution, the present invention provides an electronic-grade polycrystalline silicon packaging bag and its production method. The packaging bag, composed of an upper film and a lower film, achieves all-round coverage of electronic-grade polycrystalline silicon. The sealed cavity formed by the upper film, lower film, sealing edge, and front cover is vacuumed by an air nozzle assembly, which effectively improves the packaging effect of electronic-grade polycrystalline silicon, enhances the stability of the contact between the film material and electronic-grade polycrystalline silicon, and avoids bulging. The corrugated sealing edge allows for lifting space between the upper and lower films, meeting the packaging needs of electronic-grade polycrystalline silicon of different specifications. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0024] Figure 1 This is a three-dimensional structural view of an embodiment of an electronic-grade polycrystalline silicon packaging bag and its production method according to the present invention.

[0025] Figure 2 This is a top view of the structure of an embodiment of an electronic-grade polycrystalline silicon packaging bag and its production method according to the present invention.

[0026] Figure 3 This is a main cross-sectional view of the sealing structure provided in an embodiment of an electronic-grade polycrystalline silicon packaging bag and its production method according to the present invention.

[0027] Figure 4 This is a schematic diagram of the air nozzle assembly structure provided in an embodiment of an electronic-grade polycrystalline silicon packaging bag and its production method according to the present invention.

[0028] Figure 5 This is a schematic diagram of the upper and lower film structures provided in an embodiment of an electronic-grade polycrystalline silicon packaging bag and its production method according to the present invention.

[0029] Figure 6 This is a flowchart illustrating the production method of an electronic-grade polycrystalline silicon packaging bag and its production method according to an embodiment of the present invention.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Upper film, 2. Lower film, 3. Edge sealing, 4. Decorative nameplate, 5. Air nozzle assembly, 6. Fixing base, 7. Air tube, 8. Threaded head, 9. Cap, 10. Base layer, 11. Tensile and wear-resistant layer, 12. Adhesive layer, 13. Curved edge, 14. Flame retardant layer, 15. Insulation layer, 16. UV-resistant film layer, 17. Antibacterial layer, 18. Buffer layer, 19. Surface layer, 20. Printed coating. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0033] like Figure 1-6As shown in the figure, an electronic-grade polycrystalline silicon packaging bag provided by an embodiment of the present invention includes an upper film 1, a lower film 2 symmetrically disposed below the upper film 1, sealing edges 3 fixedly disposed on the sides of the upper film 1 and the lower film 2, a front cover disposed at the top of the upper film 1 and the lower film 2, and the front cover is movably mounted on the top of the upper film 1 and the lower film 2, forming a movable sealing connection between the front cover and the sealing edges 3, an air nozzle assembly 5 fixedly disposed at the center of the top of the front cover, and both the upper film 1 and the lower film 2 include a base layer 10, wherein the base layer 10... Both sides are provided with tensile and wear-resistant layers 11, and the tensile and wear-resistant layers 11 on both sides of the base layer 10 are symmetrically distributed. An adhesive layer 12 is provided below the tensile and wear-resistant layer 11 on the lower side of the base layer 10. A flame-retardant layer 14, an insulating layer 15, an anti-ultraviolet film layer 16, and an antibacterial layer 17 are sequentially provided above the tensile and wear-resistant layer 11 on the upper side of the base layer 10. A buffer layer 18 is provided on the outside of the antibacterial layer 17, and a surface layer 19 is provided on the outside of the buffer layer 18. A printed coating 20 is provided on the surface layer 19.

[0034] Specifically, in this embodiment, an upper film 1 is included, and a lower film 2 symmetrical to the upper film 1 is disposed below the upper film 1. Sealing edges 3 are fixedly disposed on the sides of the upper film 1 and the lower film 2. A front cover is disposed at the top of the upper film 1 and the lower film 2, and the front cover is movably mounted on the top of the upper film 1 and the lower film 2. A movable sealing connection is formed between the front cover and the sealing edge 3. An air nozzle assembly 5 is fixedly disposed at the center of the top of the front cover. The upper film 1 and the lower film 2 are respectively adhered to the surface of the electronic-grade polysilicon, while the sealing edge 3 is in a non-contact state with the electronic-grade polysilicon. The upper film 1, the lower film 2, and the sealing edge 3 form a cavity for packaging the electronic-grade polysilicon. The air nozzle assembly 5 is connected to a vacuum pump, which can perform vacuum treatment inside the cavity, improving the protective effect of the packaging bag on the electronic-grade polysilicon. Both the upper film 1 and the lower film 2 include a base layer 10, and tensile strength is provided on both sides of the base layer 10. The wear-resistant layer 11 is symmetrically distributed on both sides of the base layer 10, which improves the tensile and wear-resistant performance of the membrane material. An adhesive layer 12 is provided below the tensile and wear-resistant layer 11 on the lower side of the base layer 10, which is used to bond and fix the membrane material to the electronic-grade polycrystalline silicon. A flame-retardant layer 14, an insulating layer 15, an anti-ultraviolet film layer 16, and an antibacterial layer 17 are sequentially provided above the tensile and wear-resistant layer 11 on the upper side of the base layer 10, which effectively improves the flame retardancy, insulation, anti-ultraviolet and antibacterial properties of the membrane material, making the membrane material more resistant and improving its service life. A buffer layer 18 is provided on the outside of the antibacterial layer 17 to provide buffer protection for the electronic-grade polycrystalline silicon from the packaging bag. A surface layer 19 is provided on the outside of the buffer layer 18, and a printed coating 20 is provided on the surface layer 19. The printed coating 20 is a decorative pattern to improve the aesthetics.

[0035] This invention provides an electronic-grade polycrystalline silicon packaging bag and its production method. The packaging bag, composed of an upper film 1 and a lower film 2, achieves all-round coverage of electronic-grade polycrystalline silicon. The sealed cavity formed by the upper film 1, the lower film 2, the sealing edge 3, and the front cover is vacuumed by the air nozzle assembly 5, which effectively improves the packaging effect of electronic-grade polycrystalline silicon and enhances the stability of the contact between the film material and the electronic-grade polycrystalline silicon.

[0036] In one embodiment of the present invention, the sealing edge 3 is located on three sides of the upper film 1 and the lower film 2, and the sealing edge 3 is arranged in a U-shape. The U-shaped structure composed of the upper film 1, the lower film 2 and the sealing edge 3 can be sleeved from the outside of the electronic-grade polysilicon. The upper film 1 and the lower film 2 are respectively bonded to the surface of the electronic-grade polysilicon, while the sealing edge 3 is in a non-contact state with the electronic-grade polysilicon. The upper film 1, the lower film 2 and the sealing edge 3 form a cavity for packaging the electronic-grade polysilicon.

[0037] In one embodiment of the present invention, decorative nameplates 4 are fixedly provided on one outer wall of both the upper film 1 and the lower film 2. The decorative nameplates 4 are rectangular in structure, and the information of the corresponding manufacturer is engraved on the decorative nameplates 4, which improves the recognizability of the packaging bag.

[0038] In another embodiment of the present invention, the sealing edge 3 is a corrugated structure, and the stretching distance between the upper film 1 and the lower film 2 is 1-5cm, so that the upper film 1 and the lower film 2 are combined with the stretchable sealing edge 3 to realize the packaging of various specifications of electronic grade polycrystalline silicon, thereby improving the practicality of the packaging bag.

[0039] In another embodiment of the present invention, the air nozzle assembly 5 includes a fixing seat 6 fixedly installed on the surface of the front cover. An air pipe 7 is fixedly disposed inside the top of the fixing seat 6. A threaded head 8 is provided at the top of the air pipe 7, and a cap 9 is installed at the top of the air pipe 7 through the threaded head 8. After the operator finishes packaging the electronic-grade polysilicon, the cap 9 can be unscrewed from the air pipe 7, and then a vacuum pump can be used to evacuate the inside of the packaging bag covering the electronic-grade polysilicon to a vacuum state, which is beneficial for better protection of the electronic-grade polysilicon.

[0040] In one embodiment of the present invention, a raised edge 13 is provided at the outer edge of the adhesive layer 12, and the tilt angle of the raised edge 13 is 30-45 degrees. The tilt angle of the raised edge 13 is preferably 30 degrees to avoid the corners of the film material from lifting up after the film material is bonded to the electronic grade polycrystalline silicon.

[0041] In another embodiment of the present invention, the thicknesses of the flame-retardant layer 14, the insulating layer 15, the UV-resistant film layer 16, and the antibacterial layer 17 are in a ratio of 1:1:1:1, which effectively improves the flame retardancy, insulation, UV protection, and antibacterial properties of the membrane material, making the membrane material more resistant and improving its service life.

[0042] In another embodiment of the present invention, the buffer layer 18 has two cavities arranged vertically inside. The upper cavity contains an air bladder, and the lower cavity contains porous microspheres. The buffer layer 18, composed of the air bladder and the porous microspheres, improves the protective effect of the membrane material and achieves better protection for electronic-grade polycrystalline silicon.

[0043] In another embodiment of the present invention, the tensile and wear-resistant layer 11 is formed by any one or a combination of acrylonitrile-butadiene-styrene copolymer layer, polypropylene layer and polyethylene layer. The tensile and wear-resistant layer 11 is made of acrylonitrile-butadiene-styrene copolymer layer, which improves the tensile and wear-resistant properties of the membrane material.

[0044] A method for producing electronic-grade polycrystalline silicon packaging bags includes the following steps:

[0045] Raw material preparation: Select one of LLDPE, HDPE and PE as the raw material for this packaging bag. Before production, the raw materials need to be screened, cleaned and dried to ensure the quality and purity of the raw materials.

[0046] Extruded blown film: Under the action of an extruder, the processed raw materials are heated and melted, then extruded through a die and blown into shape in a blow molding machine. The packaging film has 5, 7, 9 or 10-20 layers. The number of layers and thickness of the film are set according to specific requirements.

[0047] Printing and lamination: Various patterns, texts and logos related to electronic-grade polysilicon can be printed on the packaging film to meet the needs of different customers. In the lamination process, packaging films of different materials can be laminated together to improve the performance and function of the packaging film.

[0048] Cutting and Packaging: Using the packaging films described above to form the packaging bag, the operator can first insert the electronic-grade polysilicon into the U-shaped cavity formed by the upper film 1, the lower film 2, and the sealing edge 3. Then, the upper film 1 and the lower film 2 are used to adhere to the upper and lower surfaces of the electronic-grade polysilicon. Due to the presence of the sealing edge 3, the sides of the upper film 1 and the lower film 2 are tightly connected. Finally, the front cover is fixed to the top of the upper film 1 and the lower film 2. The excess material used in packaging the electronic-grade polysilicon is cut off with a utility knife, thereby forming a sealed cavity between the upper film 1 and the lower film 2. Finally, the operator uses a vacuum pump connected to the air nozzle assembly 5 to completely extract the air from the cavity, achieving a vacuum state.

[0049] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. An electronic grade polysilicon packaging bag comprising an upper film (1), characterized in that, The upper film (1) is provided below with a lower film (2) symmetrical to the upper film (1), the side edges of the upper film (1) and the lower film (2) are fixedly provided with sealing edges (3), the top ends of the upper film (1) and the lower film (2) are provided with a front cover, and the front cover is movably mounted on the top ends of the upper film (1) and the lower film (2), the front cover and the sealing edge (3) form a movable sealing connection, the top end of the front cover is fixedly provided with an air nozzle assembly (5), the upper film (1) and the lower film (2) each comprise a base layer (10), both sides of the base layer (10) are provided with a tensile wear-resistant layer (11), the tensile wear-resistant layers (11) on both sides of the base layer (10) are symmetrically distributed, the lower side of the tensile wear-resistant layer (11) of the base layer (10) is provided below with an adhesive layer (12), the upper side of the tensile wear-resistant layer (11) of the base layer (10) is sequentially provided above with a flame-retardant layer (14), an insulating layer (15), an ultraviolet-proof film layer (16) and an antibacterial layer (17), the outer side of the antibacterial layer (17) is provided with a buffer layer (18), the outer side of the buffer layer (18) is provided with a surface layer (19), and the surface layer (19) is provided with a printed coating (20).

2. The electronic grade polysilicon packaging bag according to claim 1, wherein, The sealing edge (3) is located on three sides of the upper film (1) and the lower film (2), and the sealing edge (3) is arranged in a U-shaped structure.

3. The electronic grade polysilicon packaging bag according to claim 1, wherein, The upper film (1) and the lower film (2) are each fixedly provided with a decorative nameplate (4) on one side of the outer wall, and the decorative nameplate (4) is in a rectangular structure.

4. The electronic grade polysilicon packaging bag according to claim 1, wherein, The sealing edge (3) is in a corrugated structure, and the stretching distance between the upper film (1) and the lower film (2) is 1-5 cm.

5. The electronic grade polysilicon packaging bag according to claim 1, wherein, The air nozzle assembly (5) comprises a fixed seat (6) fixedly mounted on the surface of the front cover, an air pipe (7) is fixedly arranged inside the top end of the fixed seat (6), a threaded head (8) is arranged at the top end of the air pipe (7), and a cap head (9) is mounted on the top end of the air pipe (7) through the threaded head (8).

6. The electronic grade polysilicon packaging bag according to claim 1, wherein, The outer edge of the adhesive layer (12) is provided with a curled edge (13), and the inclination angle of the curled edge (13) is 30-45 degrees.

7. The electronic grade polysilicon packaging bag according to claim 1, wherein, The thickness ratio of the flame-retardant layer (14), the insulating layer (15), the ultraviolet-proof film layer (16) and the antibacterial layer (17) is 1:1:1:

1.

8. The electronic grade polysilicon packaging bag according to claim 1, wherein, The buffer layer (18) is provided inside with two cavities distributed upward and downward, the upper cavity is provided inside with an air bag, and the lower cavity is provided inside with a porous microsphere.

9. The electronic grade polysilicon packaging bag according to claim 1, wherein, The tensile wear-resistant layer (11) is any one or a composite of an acrylonitrile-butadiene-styrene copolymer layer, a polypropylene layer and a polyethylene layer.

10. A method for producing an electronic grade polysilicon packaging bag, the electronic grade polysilicon packaging bag according to any one of claims 1 to 9, wherein The method comprises the following steps: Preparation of raw materials: select one of LLDPE, HDPE and PE as the raw material of the packaging bag, and before production, the raw material needs to be screened, washed and dried to ensure the quality and purity of the raw material; Extrusion blow molding film: under the action of the extruder, the treated raw material is heated and melted, then extruded through a die, and blow molded in a blow molding machine, the number of layers of the packaging film is 5, 7, 9 or 10-20, and the number of layers and the thickness of the film are set according to specific requirements; Printing and compounding: printing various patterns, words and marks related to electronic grade polysilicon on the packaging film to meet the needs of different customers, and compounding different materials of the packaging film together in the compounding process to improve the performance and function of the packaging film; Cutting packaging: using the above packaging film to form the style of the packaging bag, the operator first inserts the electronic grade polysilicon into the U-shaped cavity composed of the upper film (1) and the lower film (2) and the sealing edge (3), then uses the upper film (1) and the lower film (2) to realize the pasting on the upper and lower surfaces of the electronic grade polysilicon, due to the existence of the sealing edge (3), the side edges of the upper film (1) and the lower film (2) are tightly connected, finally the front cover is fixed on the top of the upper film (1) and the lower film (2), and the excess material during the packaging of the electronic grade polysilicon is cut by using the art knife, thereby forming a sealed cavity between the upper film (1) and the lower film (2), finally the operator connects the air pump with the air nozzle assembly (5) to completely exhaust the air in the cavity to achieve a vacuum state.

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