Surface protectant for tin-plated copper strip and method of making same

Abstract

The application discloses a tinned copper strip surface protecting agent and a preparation method thereof. Components of the protecting agent include, in mass parts, 1.1-5.9 parts of a composite film forming agent, 0.01-0.06 parts of a surfactant, 80-95 parts of an organic solvent and 1-18 parts of D series solvent oil. The composite film forming agent is compounded by liquid paraffin, polydimethylsiloxane, tridecafluoro octyl triethoxysilane and heptadecafluorodecyl trimethoxysilane. The application uses n-heptane as a main solvent, adds a small amount of liquid paraffin, polydimethylsiloxane and tridecafluoro octyl triethoxysilane, and under the auxiliary action of a surfactant acetylene glycol polyoxyethylene ether, can form a uniform and dense waterproof and antifouling protective layer on the surface of the tinned copper strip. The tinned copper strip coated by the protecting agent can be stored for a long time without causing surface oxidation, and can still keep smooth even in a storage or transportation environment with relatively high humidity. The formula process is simple, and the service life and reliability of the tinned copper strip are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of tin-plated copper strip production, in particular to a tin-plated copper strip surface protective agent and a preparation method thereof. BACKGROUND

[0002] As a main accessory for assembling in the solar photovoltaic industry, the quality and reliability of the tin-plated layer of the tin-plated copper strip, including the aging speed after the main accessory is assembled, directly affect the service life of the photovoltaic solar product after assembly.

[0003] At present, the domestic tin-plated copper strip industry does not perform surface treatment after tin-plating of the copper strip, and directly delivers the tin-plated copper strip to downstream manufacturers for assembly and welding. Since an organic acid-based flux is used in the tin-plating process, if the flux is not fully decomposed, residues will remain on the surface of the tin-plated copper strip. When the residues are exposed to a high-temperature and high-humidity environment or a corrosive environment, active ingredients in the residues will cause black spots or point corrosion on the surface of the tin-plated copper strip, thereby affecting secondary welding with the photovoltaic panel and the junction box. SUMMARY

[0004] In order to overcome the above-mentioned defects, the present application provides a tin-plated copper strip surface protective agent and a preparation method thereof, which effectively improve the service life of the tin-plated copper strip and the reliability during secondary welding.

[0005] One technical solution adopted by the present application to solve the technical problem is to provide a tin-plated copper strip surface protective agent, the components of the protective agent include, by mass fraction: 1.1-5.9 parts of a composite film-forming agent, 0.01-0.06 parts of a surfactant, 80-95 parts of an organic solvent, and 1-18 parts of a D series solvent oil.

[0006] The composite film-forming agent is compounded from liquid paraffin, polydimethylsiloxane, tridecafluorooctyltriethoxysilane, and heptadecafluorodecyltrimethoxysilane.

[0007] As a further improvement of the present application, the components of the composite film-forming agent include, by mass fraction: 0.3-1.5 parts of liquid paraffin, 0.2-3.0 parts of polydimethylsiloxane, 0.1-0.5 parts of tridecafluorooctyltriethoxysilane, and 0.5-0.9 parts of heptadecafluorodecyltrimethoxysilane.

[0008] As a further improvement of the present application, the surfactant is any one of acetylenic glycol polyoxyethylene ether, alkylphenol polyoxyethylene ether, and rosin amine polyoxyethylene ether.

[0009] As a further improvement of the present application, the organic solvent is any one of n-heptane, n-hexane, and isopropyl alcohol.

[0010] As a further improvement of the present invention, the D-series solvent oil is any one of D40 solvent oil, D60 solvent oil, D80 solvent oil, and D110 solvent oil.

[0011] As a further improvement of the present invention, the protective agent comprises, by weight, 81-82 parts of organic solvent, 14.57-15.57 parts of D-series solvent oil, 1.2-1.5 parts of liquid paraffin, 1.4-2.0 parts of polydimethylsiloxane, 0.25-0.4 parts of tridecafluorooctyltriethoxysilane, 0.55-0.65 parts of heptadecafluorodecyltrimethoxysilane, and 0.03 parts of surfactant.

[0012] As a further improvement of the present invention, the protective agent comprises, by weight, 84-86 parts of organic solvent, 11.38-12.38 parts of D-series solvent oil, 0.4-0.6 parts of liquid paraffin, 0.8-1.2 parts of polydimethylsiloxane, 0.15-0.2 parts of tridecafluorooctyltriethoxysilane, 0.7-0.9 parts of heptadecafluorodecyltrimethoxysilane, and 0.02 parts of surfactant.

[0013] As a further improvement of the present invention, the protective agent comprises, by weight, 90 parts of organic solvent, 7.49 parts of D-series solvent oil, 1.0 part of liquid paraffin, 0.8 parts of polydimethylsiloxane, 0.4 parts of tridecafluorooctyltriethoxysilane, 0.3 parts of heptadecafluorodecyltrimethoxysilane, and 0.01 parts of surfactant.

[0014] Another technical solution adopted by the present invention to solve its technical problem is to provide a method for preparing a surface protectant for tin-plated copper strip, comprising the following steps:

[0015] Step 1: Mix the organic solvent and the D-series solvent oil and stir until fully miscible to obtain the first mixed solution;

[0016] Step 2: Add the surfactant to the first mixed solution and stir until fully miscible to obtain the second mixed solution;

[0017] Step 3: Liquid paraffin, polydimethylsiloxane, tridecafluorooctyltriethoxysilane, and heptadecafluorodecyltrimethoxysilane are added sequentially to the second mixed solution and stirred until fully miscible to obtain a tin-plated copper strip surface protectant.

[0018] The beneficial effects of this invention are:

[0019] 1. By compounding organic solvents, D-series solvent oils, surfactants and composite film-forming agents in a certain proportion and in a certain order of addition, the film-forming agents work together under specific ratios to achieve good film-forming barrier properties and good diffusion properties.

[0020] 2. The compound film forming agent prepared by compounding liquid paraffin, polydimethylsiloxane, tridecafluoro octyl triethoxy silane and heptadecafluorodecyl trimethoxy silane in specific proportions, so that the solution system of the protective agent has moderate viscosity and diffusivity, and is easy to apply; and after film forming, has good heat resistance, cold resistance and chemical corrosion resistance;

[0021] 3. The formula of the present application is simple in process. When the tinned copper strip coated with the present application is used for secondary welding of components, it can be fully dissolved or decomposed after immersion (coating) in photovoltaic component flux and high temperature (300-360 DEG C) environment during welding, which is more conducive to secondary welding. DETAILED DESCRIPTION

[0022] The tinned copper strip surface protective agent provided by the present application is described below in combination with examples.

[0023] Example

[0024] Example 1

[0025] A tinned copper strip surface protective agent is prepared by compounding the following components: 80Kg of n-heptane, 15.57Kg of D40 solvent oil, 1.5Kg of liquid paraffin, 2.0Kg of polydimethylsiloxane, 0.3Kg of tridecafluoro octyl triethoxy silane, 0.6Kg of heptadecafluorodecyl trimethoxy silane and 0.03Kg of acetylenic diol polyoxyethylene ether.

[0026] The specific preparation steps are as follows:

[0027] Step 1, mix 80Kg of n-heptane and 15.57Kg of D40 solvent oil, and stir until fully miscible to obtain a first mixed solution;

[0028] Step 2, add 0.03Kg of acetylenic diol polyoxyethylene ether to the first mixed solution, and stir until fully miscible to obtain a second mixed solution;

[0029] Step 3, add 1.5Kg of liquid paraffin, 2.0Kg of polydimethylsiloxane, 0.3Kg of tridecafluoro octyl triethoxy silane and 0.6Kg of heptadecafluorodecyl trimethoxy silane to the second mixed solution in sequence, and stir until fully miscible to obtain a tinned copper strip surface protective agent.

[0030] Example 2

[0031] A tinned copper strip surface protective agent is prepared by compounding the following components: 85Kg of n-heptane, 12.38Kg of D60 solvent oil, 0.5Kg of liquid paraffin, 1.0Kg of polydimethylsiloxane, 0.2Kg of tridecafluoro octyl triethoxy silane, 0.9Kg of heptadecafluorodecyl trimethoxy silane and 0.02Kg of acetylenic diol polyoxyethylene ether.

[0032] The specific preparation steps are as follows:

[0033] Step 1, mix 85Kg of n-heptane and 12.38Kg of D60 solvent oil, stir until fully miscible, to obtain a first mixed solution;

[0034] Step 2, add 0.02Kg of acetylene glycol polyoxyethylene ether to the first mixed solution, stir until fully miscible, to obtain a second mixed solution;

[0035] Step 3, add 0.5Kg of liquid paraffin, 1.0Kg of polydimethylsiloxane, 0.2Kg of tridecafluorooctyl triethoxysilane, and 0.9Kg of heptadecafluorodecyl trimethoxysilane to the second mixed solution in turn, stir until fully miscible, to obtain a tin-plated copper strip surface protective agent.

[0036] Example 3

[0037] A tin-plated copper strip surface protective agent is compounded from the following components: n-heptane 90Kg, D40 solvent oil 7.49Kg, liquid paraffin 1.0Kg, polydimethylsiloxane 0.8Kg, tridecafluorooctyl triethoxysilane 0.4Kg, heptadecafluorodecyl trimethoxysilane 0.3Kg, and acetylene glycol polyoxyethylene ether 0.01Kg.

[0038] The specific preparation steps are as follows:

[0039] Step 1, mix 90Kg of n-heptane and 7.49Kg of D40 solvent oil, stir until fully miscible, to obtain a first mixed solution;

[0040] Step 2, add 0.01Kg of acetylene glycol polyoxyethylene ether to the first mixed solution, stir until fully miscible, to obtain a second mixed solution;

[0041] Step 3, add 1.0Kg of liquid paraffin, 0.8Kg of polydimethylsiloxane, 0.4Kg of tridecafluorooctyl triethoxysilane, and 0.3Kg of heptadecafluorodecyl trimethoxysilane to the second mixed solution in turn, stir until fully miscible, to obtain a tin-plated copper strip surface protective agent.

[0042] Example 4

[0043] A tin-plated copper strip surface protective agent is compounded from the following components: n-heptane 95Kg, D40 solvent oil 1.09Kg, liquid paraffin 0.3Kg, polydimethylsiloxane 3.0Kg, tridecafluorooctyl triethoxysilane 0.1Kg, heptadecafluorodecyl trimethoxysilane 0.5Kg, and acetylene glycol polyoxyethylene ether 0.01Kg.

[0044] The specific preparation steps are as follows:

[0045] Step 1, mix 95 Kg of n-heptane and 1.09 Kg of D40 solvent oil, stir until fully miscible to obtain a first mixed solution;

[0046] Step 2, add 0.01 Kg of acetylene glycol polyoxyethylene ether to the first mixed solution, stir until fully miscible to obtain a second mixed solution;

[0047] Step 3, add 0.3 Kg of liquid paraffin, 3.0 Kg of polydimethylsiloxane, 0.1 Kg of tridecafluorooctyltriethoxysilane, and 0.5 Kg of heptadecafluorodecyltrimethoxysilane to the second mixed solution in sequence, stir until fully miscible to obtain a surface protective agent for tin-plated copper strip.

[0048] Performance test

[0049] According to GB / T9491 standard, the dryness and aging performance of the tin-plated copper strip using the protective agents of Examples 1-4 and not using the comparative example of the present application were tested under standard test conditions.

[0050] Specifically, the protective agents obtained in Examples 1-4 were respectively applied to the tin-plated copper strip, and baked at a temperature of 140-150℃ for 3-5 min, so that the protective agents formed a uniform and dense protective layer on the tin-plated copper strip.

[0051] The comparative example was tin-plated copper strip without applying the protective agent of the present application.

[0052] The specific data of the performance test of Examples 1-4 and the comparative example are shown in Table 1.

[0053] The dryness refers to the residue on the surface after welding should be sticky, or the chalk powder on the surface should be easily removed; the aging performance refers to the observation of whether there are obvious black spots on the surface of the sample after aging treatment for 196 hours under the condition of 85℃ and humidity of 85%.

[0054] Table 1

[0055]

[0056]

[0057] According to the performance test data of Examples 1-4 and the comparative example in Table 1, the protective agents prepared in Examples 1-4 of the present application can form a uniform and dense protective layer on the surface of the tin-plated copper strip, and the surface of the tin-plated copper strip is not sticky after coating and drying, and there are no obvious black spots on the surface of the tin-plated copper strip after aging performance test, while the comparative example has a few black spots.

[0058] By comparing the performance detection data of examples 1-4 and comparative examples, in this application, the organic solvent, D series solvent oil, surfactant and composite film forming agent are compounded and used according to a certain proportion and a certain adding order. Under a certain ratio, the film forming agent has good film forming and blocking properties and good diffusion property. By placing the tin plated copper strip in the protective agent of this application and baking at a temperature of 140-150℃ for 3-5min, a uniform and dense protective layer with hydrophobic and antifouling properties can be formed on the surface of the tin plated copper strip, achieving the effects of waterproofing and anti-sticking. When the tin plated copper strip using the protective agent of this application is placed in the flux, the protective agent is activated at high temperature, the n-heptane volatilizes, the paraffin, polydimethylsiloxane and heptadecafluorooctyltrimethoxysilane are fully decomposed and diffused under the assistance of the wetting ability of the tridecafluorooctyltriethoxysilane and the surfactant, which is beneficial to secondary welding.

[0059] The solution system of the protective agent formed by compounding the components according to a certain ratio has moderate viscosity and diffusion property, and is easy to apply and process. In addition, by the joint action of the components in the composite film forming agent under a certain ratio, the film forming agent is more easily adhered to the surface of the tin plated copper strip, and after film forming, it has good hydrophobic, antifouling, anti-sticking, heat resistance, cold resistance and chemical corrosion resistance.

[0060] In summary, the tin plated copper strip surface protective agent provided by this application uses n-heptane as the main solvent, adds a small amount of liquid paraffin, polydimethylsiloxane and tridecafluorooctyltriethoxysilane, and under the assistance of the surfactant alkyne glycol polyoxyethylene ether, a uniform and dense waterproof and antifouling protective layer can be formed on the surface of the tin plated copper strip. The tin plated copper strip coated with the tin plated copper strip surface protective agent of this application can be stored for a long time without causing surface oxidation, and even in a storage or transportation environment with relatively high humidity, it can still maintain a smooth surface. The formula process is simple, and the service life and reliability of the tin plated copper strip are improved.

[0061] In the above description, many specific details are set forth in order to provide a thorough understanding of the present application. However, the above description is only a preferred embodiment of the present application, and the present application can be implemented in many other ways different from those described herein, so the present application is not limited to the specific implementations disclosed above. Meanwhile, any person skilled in the art can make many possible changes and modifications to the technical solutions of the present application, or modify them as equivalent embodiments, without departing from the scope of the technical solutions of the present application, by using the methods and technical contents disclosed above. Any simple modification, equivalent change and modification made to the above examples according to the technical essence of the present application, without departing from the technical solutions of the present application, shall still fall within the scope of protection of the technical solutions of the present application.

Claims

1. A surface protectant for tin-plated copper strip, characterized in that, The components of the protective agent include, in mass parts: 1.1-5.9 parts of a composite film forming agent, 0.01-0.06 parts of a surfactant, 80-95 parts of an organic solvent, and 1-18 parts of a D series solvent oil; The components of the composite film forming agent include, in mass parts: 0.3-1.5 parts of liquid paraffin, 0.2-3.0 parts of polydimethylsiloxane, 0.1-0.5 parts of tridecafluoro octyl triethoxysilane, and 0.5-0.9 parts of heptadecafluorodecyl trimethoxysilane; the surfactant is any one of acetylenic diol polyoxyethylene ether, alkyl phenol polyoxyethylene ether, and rosin amine polyoxyethylene ether; and the organic solvent is any one of n-heptane, n-hexane, and isopropyl alcohol. By placing the tin-plated copper strip in the protective agent and baking at a temperature of 140-150 DEG C for 3-5 minutes, a uniform and dense protective layer with hydrophobic and antifouling properties can be formed on the surface of the tin-plated copper strip; when the tin-plated copper strip treated with the protective agent is placed in a flux, the protective agent is activated at high temperature, the organic solvent is volatilized, the liquid paraffin, polydimethylsiloxane, and heptadecafluorodecyl trimethoxysilane are fully decomposed and diffused with the assistance of the tridecafluoro octyl triethoxysilane and the surfactant, which is beneficial to secondary welding.

2. The surface protectant for tin mill copper strip according to claim 1, characterized in that: The D series solvent oil is any one of D40 solvent oil, D60 solvent oil, D80 solvent oil, and D110 solvent oil.

3. The surface protectant for tin mill copper strip according to claim 2, characterized in that, The components of the protective agent include, in mass parts: 81-82 parts of an organic solvent, 14.57-15.57 parts of a D series solvent oil, 1.2-1.5 parts of liquid paraffin, 1.4-2.0 parts of polydimethylsiloxane, 0.25-0.4 parts of tridecafluoro octyl triethoxysilane, 0.55-0.65 parts of heptadecafluorodecyl trimethoxysilane, and 0.03 parts of a surfactant.

4. The surface protecting agent for tin-free copper strip according to claim 2, characterized by, The components of the protective agent include, in mass parts: 84-86 parts of an organic solvent, 11.38-12.38 parts of a D series solvent oil, 0.4-0.6 parts of liquid paraffin, 0.8-1.2 parts of polydimethylsiloxane, 0.15-0.2 parts of tridecafluoro octyl triethoxysilane, 0.7-0.9 parts of heptadecafluorodecyl trimethoxysilane, and 0.02 parts of a surfactant.

5. The method of producing a surface protectant for a tinned copper strip according to any one of claims 1 to 4, characterized in that: The method comprises the following steps: Step 1: mixing the organic solvent and the D series solvent oil, and stirring until they are fully miscible to obtain a first mixed solution; Step 2: adding the surfactant to the first mixed solution, and stirring until they are fully miscible to obtain a second mixed solution; Step 3: sequentially adding the liquid paraffin, the polydimethylsiloxane, the tridecafluoro octyl triethoxysilane, and the heptadecafluorodecyl trimethoxysilane to the second mixed solution, and stirring until they are fully miscible to obtain a protective agent for the surface of the tin-plated copper strip.

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