Intelligent hot-dip plating production line

Abstract

The application relates to an intelligent hot-dip plating production line, which comprises a processing cabinet and a tinning mechanism arranged in the processing cabinet; the tinning mechanism comprises a driving assembly arranged on the processing cabinet and located above a tin liquid tank, a bearing assembly arranged on the driving assembly and located below the driving assembly, a sealing assembly arranged in a top cavity of the tin liquid tank, a limiting piece arranged on one side of the tin liquid tank, a flat scraping assembly arranged on the tin liquid tank and penetrating through the side wall of the tin liquid tank, and cooling assemblies arranged on both sides of the tin liquid tank and extending to the inside of the tin liquid tank; the tinning mechanism is arranged to realize the function of tinning workpieces in isolation from external air, and can drive the workpieces to disperse when tinning small workpieces, so that the problems of poor quality and performance of the plating layer and incomplete plating layer of small workpieces are solved.

Description

Technical Field

[0001] This invention relates to the field of intelligent hot-dip galvanizing technology, and more particularly to an intelligent hot-dip galvanizing production line. Background Technology

[0002] Hot-dip tin plating, as a surface treatment process, is mainly used to form a uniform tin coating on the surface of workpieces, thereby optimizing the workpieces' corrosion resistance, oxidation resistance, and improving welding performance. The introduction of intelligent automation technology into the existing production process has enabled the production line to automate the entire process from workpiece loading, galvanizing, cooling to unloading, reducing manual intervention and improving production efficiency and product quality.

[0003] Chinese patent CN1321788A discloses a method for hot-dip tin plating of workpieces. The method mainly involves continuously washing and pickling the workpiece to be plated using a semi-automatic or fully automatic process to remove dirt and rust spots from the surface. After immersion in flux to facilitate subsequent tin plating, the workpiece is then immersed in molten tin. Following this, a series of steps such as scattering, hammering, and rotating are performed to remove excess molten tin from the workpiece and to evenly distribute the molten tin on it. Finally, the workpiece is cooled and dried.

[0004] In existing tin plating processes, workpieces inevitably come into contact with the outside air for extended periods throughout the process. This prolonged exposure makes the plating layer on the workpiece surface prone to oxidation and adsorption of impurities from the air, thus affecting the quality and performance of the plating layer. Furthermore, for some small and asymmetrical workpieces, traditional clamping tools are difficult to hold effectively, and batch molten tin can easily cause workpieces to pile up, resulting in incomplete plating and further affecting the overall quality and consistency of the product. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing an intelligent hot-dip plating production line. By setting up a tin plating mechanism, the workpiece is isolated from the outside air during tin plating. At the same time, when tin plating smaller workpieces, the workpieces can be dispersed, thereby solving the problems of poor plating quality and performance, as well as the problem of incomplete plating on smaller workpieces.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an intelligent hot-dip plating production line, comprising a processing cabinet and a tin plating mechanism disposed inside the processing cabinet;

[0007] The tin plating mechanism includes a drive assembly mounted on the processing cabinet and located above the tin bath, a receiving assembly mounted on and located below the drive assembly, a sealing assembly mounted in the top cavity of the tin bath, a limiting member mounted on one side of the tin bath, a flat scraping assembly mounted on the tin bath and penetrating the side wall of the tin bath, and a cooling assembly mounted on both sides of the tin bath and extending into the interior of the tin bath.

[0008] When the workpiece begins tin plating, the drive assembly drives the receiving assembly and the workpiece downwards into the tin bath. The cooling assembly, in conjunction with the cooling assembly, removes the air from the receiving assembly. After the workpiece is immersed in the tin bath and the plating layer is formed, it is lifted and centrifuged. The cooling assembly then performs preliminary cooling on the workpiece. The receiving assembly then moves out of the tin bath and discharges the workpiece. Before and after the receiving assembly enters and exits the tin bath, the drive assembly, in conjunction with the flat scraper assembly and the limiting component, drives the sealing assembly to avoid obstacles.

[0009] Furthermore, the drive assembly includes a first drive cylinder mounted on the processing cabinet, a first motor connected to the output end of the first drive cylinder, an external threaded cover connected to the output end of the first motor, and multiple sets of support columns connected to the bottom of the molten solder tank.

[0010] Furthermore, the receiving component includes an internal threaded ring connected to the external threaded cover, a centrifugal frame connected to the internal threaded ring, multiple sets of clearance grooves opened at the bottom of the centrifugal frame for the support column to enter, two sets of ventilation openings opened on the internal threaded ring, a slot opened on the internal threaded ring, two sets of sealing covers fitted onto the outside of the centrifugal frame by means of locking blocks and locking slots, and a first fixing groove and a second fixing groove opened on the sealing covers.

[0011] Furthermore, the sealing assembly includes two sets of first partitions connected to the top cavity of the molten tin tank and used to seal the outlet of the molten tin tank, a second partition connected to the inside of the first partitions via a telescopic member, a first positioning plate and a second positioning plate respectively connected to the first partitions and the second partitions, a first gear connected to the molten tin tank, two sets of first racks respectively connected to the first positioning plate and the second positioning plate and meshing with the first gear, and a first spring connected between the first positioning plate and the molten tin tank.

[0012] Furthermore, the limiting component includes a limiting rod connected to the molten tin tank via a torsion spring, a limiting groove formed on the first positioning plate for positioning itself in conjunction with the limiting rod, a driving rod connected to the output end of the first driving cylinder, and a first protrusion and a second protrusion connected to the driving rod and arranged vertically.

[0013] Furthermore, the flat scraper assembly includes a second drive cylinder connected to one side of the molten solder tank, an extrusion plate connected to the output end of the second drive cylinder, a round rod connected to the extrusion plate and penetrating the molten solder tank, and a first scraper connected to the end of the round rod and located inside the molten solder tank.

[0014] Furthermore, the cooling assembly includes a gas supply pipe and an exhaust pipe that pass through both sides of the molten tin tank, two sets of L-shaped rods connected to the inner wall of the molten tin tank, a second gear and a third gear connected to the inner wall of the molten tin tank via a rotating shaft and arranged vertically, a second rack connected to the L-shaped rod and meshing with the second gear, and a third rack connected to the first scraper and meshing with the third gear.

[0015] Furthermore, it also includes a recycling mechanism, which includes a reflux assembly located in the middle of the molten tin tank for recycling the molten tin ejected by centrifugation, and a cleaning assembly located on one side of the molten tin tank for collecting impurities on the surface of the molten tin.

[0016] Furthermore, the reflow assembly includes multiple sets of protective plates connected to the inner wall of the molten solder tank, guide rods connected to the molten solder tank, a rectangular frame connected to the guide rods, a follower rack connected to the rectangular frame, a follower gear connected to the molten solder tank and meshing with the follower rack, a drive rack connected to the first scraper and meshing with the follower gear, multiple sets of guide rails connected to the inner wall of the molten solder tank, multiple trapezoidal blocks connected to the guide rails, an offset block connected to the rectangular frame and connected to the rectangular frame by a second spring, and a second scraper connected to the offset block by a mounting rod.

[0017] The cleaning assembly includes a transmission component connected to the molten solder tank and provided with multiple sets of steel wires, a collection box passing through one side of the molten solder tank, a transmission shaft passing through one side of the molten solder tank and connected to the transmission component, a ratchet gear connected to the transmission shaft, and an adjusting rack connected to the drive rod and meshing with the ratchet gear.

[0018] Furthermore, it also includes an upper assembly mechanism for driving multiple sets of receiving components to sequentially complete the loading and unloading of workpieces. The upper assembly mechanism includes a second motor connected to the processing cabinet, a disc connected to the output end of the second motor, multiple sets of rotating arms connected to the disc, a flipping gear connected to the rotating arms, and a semi-tooth ring connected to the processing cabinet and meshing with the flipping gear.

[0019] The beneficial effects of this invention are as follows:

[0020] (1) By setting up an upper assembly mechanism, a tin plating mechanism and a recycling mechanism, the present invention realizes the full-process automation of the workpiece tin plating process. The components of each mechanism work closely together and have clear division of labor, which greatly reduces manual intervention and significantly improves production efficiency. At the same time, with the help of intelligent temperature control technology, the temperature in the tin bath is precisely controlled to ensure that the plating thickness is uniform and meets the production standards, thereby effectively ensuring the high-quality output of the product.

[0021] (2) By setting a closed component in the tin plating mechanism, the present invention achieves complete isolation of the workpiece from the outside air when entering and leaving the tin bath. At the same time, the air inside the receiving component is completely discharged by the cooling component, and the workpiece is preliminarily cooled before leaving the tin bath. These measures effectively prevent the workpiece from adhering to dust, impurities or oxidizing due to contact with air during the tin plating process, ensuring the quality and stability of the plating layer. In addition, the design of the centrifugal frame is adopted. The centrifugal frame slowly rotates back and forth and floats up and down in the tin bath. With the support column, the problem of incomplete plating of small workpieces in the traditional process is further solved, which significantly improves the overall level of the tin plating process.

[0022] In summary, the present invention has the advantages of uniform and complete workpiece coating, and excellent electrical conductivity and oxidation resistance. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the upper assembly mechanism of the present invention;

[0025] Figure 3 This is a schematic diagram of the receiving component of the present invention;

[0026] Figure 4 This is a schematic diagram of the cooling assembly of the present invention;

[0027] Figure 5 This is a front cross-sectional view of the present invention;

[0028] Figure 6 This is a schematic diagram of the enclosed component of the present invention;

[0029] Figure 7 This is a schematic diagram of the sealing cover of the present invention in the open state;

[0030] Figure 8 This is a schematic diagram of the recirculation component of the present invention;

[0031] Figure 9 This is a schematic diagram of the working state of the second scraper of the present invention;

[0032] Figure 10 This is a schematic diagram of the process of the receiving component entering the molten solder tank according to the present invention;

[0033] Figure 11 This is a schematic diagram of the cleaning component of the present invention. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0036] Example 1

[0037] like Figures 1 to 6 As shown, this embodiment provides an intelligent hot-dip plating production line, including a processing cabinet 100 and a tin plating mechanism 1 disposed inside the processing cabinet 100;

[0038] The tin plating mechanism 1 includes a drive assembly 11 disposed on the processing cabinet 100 and above the tin bath 200, a receiving assembly 12 disposed on and below the drive assembly 11, a sealing assembly 13 disposed in the top cavity of the tin bath 200, a limiting member 14 disposed on one side of the tin bath 200, a flat scraping assembly 15 disposed on the tin bath 200 and penetrating the side wall of the tin bath 200, and a cooling assembly 16 disposed on both sides of the tin bath 200 and extending into the interior of the tin bath 200.

[0039] When the workpiece begins tin plating, the drive assembly 11 drives the receiving assembly 12 and the workpiece to move downwards into the tin bath 200. The cooling assembly 16 helps to expel the air from the receiving assembly 12. After the workpiece is immersed in the tin bath and the plating layer is formed, it is lifted and centrifuged. The cooling assembly 16 then performs preliminary cooling on the workpiece. The receiving assembly 12 is then removed from the tin bath 200, and the workpiece is discharged. Before and after the receiving assembly 12 enters and exits the tin bath 200, the drive assembly 11, in conjunction with the flat scraper assembly 15 and the limiting member 14, drives the sealing assembly 13 to avoid obstacles.

[0040] In this embodiment, the tin plating mechanism 1 is set up to achieve the function of tin plating the workpiece in the absence of external air. At the same time, when tin plating smaller workpieces, it can drive the workpieces to disperse, thereby solving the problems of poor plating quality and performance and the incomplete plating of smaller workpieces.

[0041] It should be noted that before entering the receiving component 12, the workpiece passes through the raw material cleaning tank and the flux tank in sequence to oxidize and clean the contaminants and rust on the surface of the workpiece, and to form a flux layer on the surface of the workpiece; the temperature inside the solder bath 200 and the temperature of the solder liquid are between 220°C and 300°C.

[0042] Furthermore, such as Figures 2 to 5 As shown, the drive assembly 11 includes a first drive cylinder 111 mounted on the processing cabinet 100, a first motor 112 connected to the output end of the first drive cylinder 111, an external threaded cover 113 connected to the output end of the first motor 112, and multiple sets of support columns 114 connected to the bottom of the molten solder tank 200.

[0043] In this embodiment, by setting the drive component 11 to drive the receiving component 12 to perform centrifugal work on the workpiece, the closing component 13, the limiting component 14, and the cleaning component 22 are simultaneously driven to work, so that multiple tasks are coordinated, which is conducive to the cooperation between the components to improve efficiency and save power resources.

[0044] In detail, when the receiving component 12 carries the workpiece to the bottom of the driving component 11 under the drive mechanism 3, the first driving cylinder 111 starts to work, and drives the first motor 112 and the external thread cover 113 to move downward through the output end. At the same time, the first motor 112 drives the external thread cover 113 to rotate slowly, so that the external thread cover 113 is connected to the receiving component 12.

[0045] Furthermore, such as Figure 3As shown, the receiving assembly 12 includes an internal threaded ring 121 connected to the external threaded cover 113, a centrifugal frame 122 connected to the internal threaded ring 121, multiple sets of clearance grooves 123 opened at the bottom of the centrifugal frame 122 for the support column 114 to enter, two sets of ventilation openings 124 opened on the internal threaded ring 121, a slot 125 opened on the internal threaded ring 121, two sets of sealing covers 127 fitted onto the outside of the centrifugal frame 122 by the cooperation of the slots 125 with the locking blocks 126, and a first fixing groove 128 and a second fixing groove 129 opened on the sealing cover 127.

[0046] In this embodiment, by setting the clearance groove 123 on the receiving component 12 and the support column 114 set at the bottom of the tin bath 200 by the drive component 11, the multiple support columns 114 can lift and disperse the workpieces that are piled up with each other while the workpiece is immersed in the tin bath. At the same time, the first motor 112 and the first drive cylinder 111 apply slow rotation and up and down floating, thereby helping multiple workpieces to contact the tin bath as much as possible while maintaining the overall stability of the tin bath, so as to achieve the purpose of complete plating.

[0047] In detail, as the first drive cylinder 111 drives the external threaded cover 113 to move downward and is driven to rotate by the first motor 112, the external threaded cover 113 gradually engages with the internal threaded ring 121 to form a whole. Then the first motor 112 stops working, and the first drive cylinder 111 drives the receiving component 12 to move downward into the molten solder tank 200.

[0048] It should be noted that the length of the clearance groove 123 is greater than the width of the support column 114, thus leaving space for the centrifuge frame 122 to rotate slowly, and the internal threaded ring 121 is integrally formed with the centrifuge frame 122.

[0049] Furthermore, such as Figures 1 to 2 and Figures 5 to 6 as well as Figure 9 As shown, the sealing assembly 13 includes two sets of first partitions 131 connected to the top cavity of the molten solder tank 200 and used to seal the outlet of the molten solder tank 200; a second partition 133 connected to the inside of the first partition 131 via a telescopic member 132; a first positioning plate 134 and a second positioning plate 135 respectively connected to the first partition 131 and the second partition 133; a first gear 136 connected to the molten solder tank 200; two sets of first racks 137 respectively connected to the first positioning plate 134 and the second positioning plate 135 and meshing with the first gear 136; and a first spring 138 connected between the first positioning plate 134 and the molten solder tank 200.

[0050] In this embodiment, by setting a sealing component 13 in conjunction with a receiving component 12, when the receiving component 12 closes the top opening of the tin bath 200, the sealing component 13 opens. At the same time as the receiving component 12 fully enters the tin bath 200, the sealing component 13 quickly closes. This method is followed during the process of the receiving component 12 entering and exiting the tin bath 200, ensuring that there is no airflow between the inside of the tin bath 200 and the outside air, thereby reducing the oxidation of the tin liquid surface inside the tin bath 200. It also ensures that the surface of the tin-plated workpiece is isolated from the outside before the plating layer stabilizes, thus ensuring stable plating performance.

[0051] In detail, when the receiving assembly 12 begins to move downward under the drive of the first driving cylinder 111, in the first state, the two sets of sealing covers 127 on the receiving assembly 12 first enter the top opening of the molten tin tank 200, at which point the opening is closed by the sealing covers 127. In the second state, the receiving assembly 12 continues to move downward a short distance, at which point the sealing covers 127 are about to contact the first partition 131. At the same time, the limiting member 14, driven by the first driving cylinder 111, releases the limiting on the sealing assembly 13, and the sealing assembly 13 opens under the contraction of the first spring 138. The opening process includes the first spring 138 driving the first partition 131 connected to it to move away, and at the same time, through the meshing transmission of the first positioning plate 134, the first rack 137 and the first gear 136, it drives... Another set of first partitions 131 and second positioning plates 135 are removed. In the third state, the receiving component 12 continues to move down past the closing component 13 until the top of the sealing cover 127 is flush with the inner wall of the top of the molten solder tank 200. After the air in the receiving component 12 is discharged by the cooling component 16, the flat scraping component 15 starts to work and drives the second positioning plate 135 to reset, thereby causing the closing component 13 to reset and close the top of the molten solder tank 200. In the closed state, the two sets of first partitions 131 surround the circumference of the output end of the first motor 112. The two sets of second partitions 133 retract into the first partition 131 under the squeezing action. After the receiving component 12 is removed from the molten solder tank 200, the second partitions 133 reset under the action of the telescopic component 132 and cooperate with the first partitions 131 to close the opening of the molten solder tank 200 again.

[0052] It should be noted that after working for a period of time, some nitrogen should be added to the molten tin tank 200 to prevent changes in internal air pressure and the infiltration of external air through the gaps.

[0053] Furthermore, such as Figure 6 As shown, the limiting member 14 includes a limiting rod 142 connected to the molten tin tank 200 via a torsion spring 141, a limiting groove 143 formed on the first positioning plate 134 for positioning itself in conjunction with the limiting rod 142, a driving rod 144 connected to the output end of the first driving cylinder 111, and a first protrusion 145 and a second protrusion 146 connected to the driving rod 144 and arranged vertically.

[0054] In this embodiment, the position of the sealing component 13 is fixed by setting the limiting component 14, and then the driving component 11 is used to realize the rapid opening of the top opening of the tin bath 200 during the process of the receiving component 12 entering the tin bath 200, and the closure of the opening is achieved by the sealing component 13 after the tin plating work is completed, so as to minimize the entry of air.

[0055] In detail, in the first state, the two sets of sealing covers 127 enter the top opening of the molten solder tank 200. At this time, the first protrusion 145 connected to the drive rod 144 begins to contact and squeeze the limiting rod 142. As the second state progresses, the limiting rod 142 moves upward from the limiting groove 143 on the first positioning plate 134 under the action of the first protrusion 145. At this time, the sealing assembly 13 opens. Then, the limiting rod 142 rests on the first positioning plate 134 under the action of the torsion spring 141. Then, in the third state, the sealing assembly 13 resets, and the limiting rod 142 also re-enters the limiting groove 143 after the first positioning plate 134 resets. In addition, when the top of the sealing cover 127 in the receiving assembly 12 is flush with the inner wall of the top of the molten solder tank 200, the second protrusion 146 also completes the action of passing over the limiting rod 142.

[0056] It should be noted that the first bump 145 functions when the receiving component 12 enters the solder bath 200, and the second bump 146 functions when the receiving component 12 leaves the solder bath 200.

[0057] Furthermore, such as Figures 2 to 8 As shown, the flat scraper assembly 15 includes a second drive cylinder 151 connected to one side of the molten solder tank 200, an extrusion plate 152 connected to the output end of the second drive cylinder 151, a round rod 153 connected to the extrusion plate 152 and passing through the molten solder tank 200, and a first scraper 154 connected to the end of the round rod 153 and located inside the molten solder tank 200.

[0058] In this embodiment, by setting the flat scraping component 15, impurities that may exist on the surface of the molten tin are pushed to one side before the receiving component 12 carries the workpiece into the molten tin, thereby ensuring that there are no impurities on the surface of the workpiece and ensuring the stability of the plating performance. At the same time, the flat scraping component 15 provides power for the reset of the sealing component 13, the opening of the sealing cover 127, and the operation of the return component 21, achieving multiple benefits and greatly improving work efficiency.

[0059] In detail, in the third state described above, when the receiving component 12 continues to move down past the sealing component 13 until the top of the sealing cover 127 is flush with the inner wall of the top of the molten solder tank 200, the cooling component 16 begins to quickly expel the air from the receiving component 12. Then, the flat scraping component 15 begins to work. First, the second drive cylinder 151 drives the extrusion plate 152, the round rod 153, and the first scraper 154 to move horizontally, pushing the impurities on the surface of the molten solder to one side. At the end of the pushing process, the extrusion plate 152 contacts and squeezes the second positioning plate 135, and then the limiting component 14 resets the sealing component 13.

[0060] Furthermore, such as Figures 2 to 7 and Figure 10 As shown, the cooling assembly 16 includes a gas supply pipe 161 and an exhaust pipe 162 that pass through both sides of the molten tin tank 200, two sets of L-shaped rods 163 connected to the inner wall of the molten tin tank 200, a second gear 165 and a third gear 166 connected to the inner wall of the molten tin tank 200 via a rotating shaft 164 and arranged vertically, a second rack 167 connected to the L-shaped rods 163 and meshing with the second gear 165, and a third rack 168 connected to the first scraper 154 and meshing with the third gear 166.

[0061] In this embodiment, by setting the cooling component 16 to exhaust all the air inside the receiving component 12 before tin plating, the workpiece plating layer is not oxidized by the oxygen brought in by the receiving component 12. At the same time, the nitrogen environment inside the tin bath 200 is maintained. Before the receiving component 12 is removed from the tin bath 200 after tin plating is completed, the workpiece is pre-cooled to ensure that the plating layer reaches a stable state before being exposed to the outside air.

[0062] In detail, in the third state described above, as the receiving component 12 continues to move downward past the sealing component 13 until the top of the sealing cover 127 is flush with the inner wall of the top of the molten tin tank 200, the first fixing groove 128 on the sealing cover 127 is aligned with the gas supply pipes 161 and the exhaust pipe 162 on both sides, and the second fixing groove 129 engages with the end of the L-shaped rod 163. At this time, the gas supply pipe 161 quickly fills the centrifuge frame 122 with nitrogen through the vent 124, and sends out the original air through the exhaust pipe 162. Then, when the flat scraping component 15 starts to work, the third rack 168 connected to the first scraper 154 drives the third gear 166 to rotate, and then through the meshing transmission of the rotating shaft 164, the second gear 165 and the second rack 167, the two sets of L-shaped rod 163 separates to both sides, and finally drives two sets of sealing covers 127 to move on the gas supply pipe 161 and exhaust pipe 162 and separate from the centrifuge frame 122. At this point, the work before tin plating is completed. The first drive cylinder 111 drives the centrifuge frame 122 to move downward until the centrifuge frame 122 is immersed in the tin liquid. At the same time, the support column 114 inside the tin liquid enters the centrifuge frame 122 through the clearance groove 123 and lifts up some workpieces. Then, in conjunction with the first motor 112 and the first drive cylinder 111, it slowly reciprocates and floats up and down, so that multiple workpieces can fully contact the tin liquid. When the workpiece temperature is the same as the tin liquid temperature, the centrifuge frame 122 is lifted up and leaves the tin liquid and begins centrifugation to separate the excess tin liquid.

[0063] After separation, the centrifuge frame 122 returns to the working position of the cooling assembly 16. At this time, the flat scraper assembly 15 begins to reset, the extrusion plate 152 releases its pressure on the second positioning plate 135, and simultaneously drives the L-shaped rod 163 to assemble the two sets of sealing covers 127. The locking block 126 on the sealing cover 127 engages again in the slot 125 on the internal thread ring 121, thereby closing the centrifuge frame 122 again. At this time, lower temperature nitrogen gas is supplied through the gas supply pipe 161 to initially cool the workpiece, making the coating tend to stabilize. After cooling is completed, the first drive cylinder... Driven by 111, the receiving component 12 begins to move upward away from the molten solder tank 200. In the initial stage of movement, the second protrusion 146 on the drive rod 144 immediately squeezes one end of the limiting rod 142, causing the end of the limiting rod 142 to move downward away from the limiting groove 143 on the first positioning plate 134. Then the sealing component 13 opens again. When the receiving component 12 is about to leave the opening of the molten solder tank 200, the flat scraping component 15 works again to perform a reciprocating movement. The squeezing plate 152 resets the sealing component 13 in conjunction with the limiting component 14, closing the molten solder tank 200.

[0064] It should be noted that one-way valves are installed in the gas supply pipe 161, the exhaust pipe 162, and the vent 124; the first fixing groove 128 is compatible with the external structure of the gas supply pipe 161 and the exhaust pipe 162.

[0065] Example 2

[0066] like Figures 2 to 9 and Figure 11 As shown, components that are the same as or corresponding to those in Embodiment 1 are referred to using the same reference numerals as in Embodiment 1. For simplicity, only the differences from Embodiment 1 are described below. The difference between Embodiment 2 and Embodiment 1 is as follows:

[0067] like Figures 2 to 9 and Figure 11 As shown, the system also includes a recycling mechanism 2, which includes a reflux assembly 21 located in the middle of the molten tin tank 200 for recycling the molten tin ejected by centrifugation, and a cleaning assembly 22 located on one side of the molten tin tank 200 for collecting impurities on the surface of the molten tin.

[0068] In this embodiment, by setting up the recycling mechanism 2, it is ensured that the tin liquid inside the tin bath 200 can be fully utilized and can be kept in the best condition each time it is used, so as to ensure that the plating layer of the workpiece is free of impurities and has excellent performance.

[0069] In detail, after the workpiece is centrifuged and separated, the reflux assembly 21 guides the ejected molten solder back into the molten solder below by scraping, while the cleaning assembly 22 collects the impurities gathered by the flat scraping assembly 15.

[0070] Furthermore, such as Figure 4 and Figures 8 to 9 as well as Figure 11 As shown, the recirculation assembly 21 includes multiple sets of protective plates 211 connected to the inner wall of the solder tank 200, guide rods 212 connected to the solder tank 200, rectangular frames 213 connected to the guide rods 212, follower racks 214 connected to the rectangular frames 213, follower gears 215 connected to the solder tank 200 and meshing with the follower racks 214, drive racks 216 connected to the first scraper 154 and meshing with the follower gears 215, multiple sets of guide rails 217 connected to the inner wall of the solder tank 200, multiple trapezoidal blocks 218 connected to the guide rails 217, offset blocks 2110 connected to the rectangular frames 213 and connected to the rectangular frames 213 by a second spring 219, and a second scraper 2112 connected to the offset blocks 2110 by a mounting rod 2111.

[0071] The cleaning assembly 22 includes a transmission component 222 connected to the molten solder tank 200 and provided with multiple sets of steel wires 221, a collection box 223 passing through one side of the molten solder tank 200, a transmission shaft 224 passing through one side of the molten solder tank 200 and connected to the transmission component 222, a ratchet gear 225 connected to the transmission shaft 224, and an adjusting rack 226 connected to the drive rod 144 and meshing with the ratchet gear 225.

[0072] In this embodiment, by setting multiple sets of mutually staggered protective plates 211, on the one hand, it is ensured that the molten solder thrown out by centrifugation can be confined within the space of the protective plate 211, and on the other hand, it is beneficial to set multiple sets of non-interfering second scrapers 2112 to recycle the thrown-out molten solder without dead angles, and to prevent the molten solder from remaining and accumulating on the protective plate 211.

[0073] In detail, when the flat scraper assembly 15 moves forward for the first time to push away impurities on the surface of the molten tin, the drive rack 216 connected to the first scraper 154 drives the follower gear 215 to rotate, thereby causing the rectangular frame 213 to move upward together with the follower rack 214 to above the protective plate 211. After centrifugation, the first scraper 154 begins to reset, thereby driving the rectangular frame 213 to reset downward. During this process, the mounting rod 2111 first presses against the top inclined surface of the guide rail 217, causing the second spring 219 to stretch. The mounting rod 2111 drives the offset block 2110 to move, thereby causing the second scraper 2112 to press tightly against the surface of the protective plate 211. As the rectangular frame 213 moves downward to the bottom, the second scraper 2112 pushes the protective plate 211... 1. The molten solder is scraped off, and the mounting rod 2111 separates from the guide rail 217. Under the action of the second spring 219, the second scraper 2112 separates from the protective plate 211. At this time, some molten solder still adheres to the second scraper 2112. When the flat scraper assembly 15 moves back and forth for the second time, driving the closing assembly 13 to close, the rectangular frame 213 completes the up and down movement again. During the upward movement, the mounting rod 2111 is squeezed against the bottom slope of the guide rail 217, causing the second spring 219 to be compressed. Under the guidance of multiple trapezoidal blocks 218, the second spring 219 continuously extends and retracts, thereby driving the second scraper 2112 to vibrate continuously when moving upward, shaking off the residual molten solder. When moving downward, it cleans the protective plate 211 again.

[0074] When the workpiece temperature matches that of the molten tin, it is lifted upward from the molten tin. The drive rod 144 drives the ratchet 225 to rotate by adjusting the rack 226, and then drives the transmission component 222 to rotate through the transmission shaft 224. At this time, the impurities collected by the first scraper 154 are adhered to by multiple steel wires 221 and collected in conjunction with the scraping groove on the collection box 223.

[0075] It should be noted that intelligent temperature control devices are installed on both sides of the solder bath 200 to accurately control the internal temperature of the solder bath 200 and the temperature of the solder; a damper is installed between the guide rod 212 and the rectangular frame 213 to position the rectangular frame 213.

[0076] Example 3

[0077] like Figure 2As shown, components that are the same as or corresponding to those in Embodiment 1 are referred to using the same reference numerals as in Embodiment 1. For simplicity, only the differences from Embodiment 1 are described below. The difference between Embodiment 3 and Embodiment 1 is as follows:

[0078] like Figure 2 As shown, the system also includes an upper assembly mechanism 3 for driving multiple sets of receiving components 12 to sequentially complete the loading and unloading of workpieces. The upper assembly mechanism 3 includes a second motor 31 connected to the processing cabinet 100, a disc 32 connected to the output end of the second motor 31, multiple sets of rotating arms 33 connected to the disc 32, a reversing gear 34 connected to the rotating arms 33, and a semi-tooth ring 35 connected to the processing cabinet 100 and meshing with the reversing gear 34.

[0079] In this embodiment, by setting the upper assembly mechanism 3, multiple sets of receiving components 12 work alternately, thereby improving work efficiency and automation. At the same time, it is beneficial to inspect the centrifuge frame 122 and facilitate replacement.

[0080] In detail, the second motor 31 drives the disc 32 to rotate, which in turn drives multiple sets of rotating arms 33 to rotate. At the workpiece loading position, the cleaned workpiece, which is soaked in flux, is loaded into the receiving component 12. At the tin plating position, the drive component 11 drives the corresponding receiving component 12 to separate from the rotating arm 33. After tin plating is completed, the receiving component 12 is re-engaged onto the corresponding rotating arm 33 and then transferred to the workpiece discharge position. The rotating arm 33 drives the receiving component 12 to rotate 180° through the flipping gear 34 and the half-tooth ring 35. The workpiece is output and collected. At the next set of ring teeth of the half-tooth ring 35, the rotating arm 33 and the receiving component 12 rotate 180° again to reset and are used to receive workpieces again.

[0081] It should be noted that the sealing cover 127 and the rotating arm 33 are fixed by compression and friction. When the external thread cover 113 and the internal thread ring 121 are assembled, the position of the receiving component 12 remains unchanged.

[0082] Work steps

[0083] Step 1: Workpiece processing. Before entering the receiving assembly 12, the workpiece passes through the raw material cleaning tank and the flux tank in sequence to oxidize and clean the contaminants and rust on the surface of the workpiece and form a flux layer on the surface of the workpiece. Then, the upper assembly 3 drives the receiving assembly 12 containing the workpiece to the tin plating work position.

[0084] Step 2: After isolating the air and positioning the workpiece, the drive assembly 11 starts working. The first drive cylinder 111 drives the first motor 112 and the external threaded cover 113 to move downward through the output end. At the same time, the first motor 112 drives the external threaded cover 113 to rotate slowly, so that the external threaded cover 113 and the internal threaded ring 121 on the receiving assembly 12 are screwed together to form a whole. When the receiving assembly 12 starts to move downward under the drive of the first drive cylinder 111, and the two sets of sealing covers 127 just enter the top opening of the molten solder tank 200, the limiting member 14 releases the limiting of the sealing assembly 13 under the drive of the first drive cylinder 111. The sealing assembly 13 then opens. The receiving assembly 12 continues to move downward past the sealing assembly 13 until the top of the sealing cover 127 is flush with the top inner wall of the molten solder tank 200 and stops. After the air in the receiving assembly 12 is discharged by the cooling assembly 16, the flat scraper assembly 15 starts working and drives the sealing assembly 13 to reset.

[0085] Step 3: Tin plating of the workpiece. After removing air, the sealing cover 127 of the receiving component 12 is separated from the centrifugal frame 122 under the action of the flat scraper component 15. At the same time, the flat scraper component 15 also cleans the surface of the molten tin. The first drive cylinder 111 drives the centrifugal frame 122 to move downward until the centrifugal frame 122 is immersed in the molten tin. Then, in conjunction with the first motor 112 and the first drive cylinder 111, it slowly reciprocates and floats up and down, and the support column 114 lifts and moves the workpiece to make the workpiece fully contact the molten tin. When the workpiece temperature is the same as the molten tin temperature, the centrifugal frame 122 is lifted upward to leave the molten tin and begins centrifugal operation to separate the excess molten tin.

[0086] Step 4: Cooling Output. After centrifugation, the centrifuge frame 122 returns to the working position of the cooling component 16. At this time, the flat scraper component 15 begins to reset, driving the sealing plate to re-clamp onto the centrifuge frame 122 to form a closed space. Then, the gas supply pipe 161 delivers lower temperature nitrogen gas to initially cool the workpiece, making the plating layer tend to stabilize. After cooling is completed, the receiving component 12 begins to move upward away from the tin bath tank 200 under the drive of the first drive cylinder 111. The sealing component 13, in conjunction with the flat scraper component 15, completes the opening and closing process again. At the same time, the return component 21 guides the tin liquid ejected by centrifugation back into the tin liquid below by scraping. The workpiece in the receiving component 12 is driven to the output position by the upper assembly mechanism 3, and the workpiece is discharged and collected by flipping.

[0087] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An intelligent hot-dip galvanizing production line, characterized in that, Includes a processing cabinet and a tin plating mechanism disposed inside the processing cabinet; The tin plating mechanism includes a drive assembly mounted on the processing cabinet and located above the tin bath, a receiving assembly mounted on and located below the drive assembly, a sealing assembly mounted in the top cavity of the tin bath, a limiting member mounted on one side of the tin bath, a flat scraping assembly mounted on the tin bath and penetrating the side wall of the tin bath, and a cooling assembly mounted on both sides of the tin bath and extending into the interior of the tin bath. When the workpiece begins tin plating, the drive assembly drives the receiving assembly and the workpiece downwards into the tin bath. The cooling assembly then removes the air from the receiving assembly. After the workpiece is immersed in the tin bath and the plating layer is formed, it is lifted and centrifuged. The cooling assembly then performs initial cooling on the workpiece. The receiving assembly then moves out of the tin bath and discharges the workpiece. Before and after the receiving assembly enters and exits the tin bath, the drive assembly, in conjunction with the flat scraper assembly and the limiting component, drives the sealing assembly to avoid obstacles. The receiving component includes an internal threaded ring connected to the external threaded cover of the drive component, a centrifugal frame connected to the internal threaded ring, multiple sets of clearance grooves opened at the bottom of the centrifugal frame for the support column to enter, two sets of ventilation openings opened on the internal threaded ring, a slot opened on the internal threaded ring, two sets of sealing covers fitted on the outside of the centrifugal frame by the cooperation of the slots with the locking blocks, and a first fixing groove and a second fixing groove opened on the sealing cover. The sealing assembly includes two sets of first partitions connected to the top cavity of the molten tin tank and used to seal the outlet of the molten tin tank; a second partition connected to the inside of the first partitions via a telescopic component; a first positioning plate and a second positioning plate respectively connected to the first partitions and the second partitions; a first gear connected to the molten tin tank; two sets of first racks respectively connected to the first positioning plate and the second positioning plate and meshing with the first gear; and a first spring connected between the first positioning plate and the molten tin tank. The cooling assembly includes a gas supply pipe and an exhaust pipe that pass through both sides of the molten tin tank, two sets of L-shaped rods connected to the inner wall of the molten tin tank, a second gear and a third gear connected to the inner wall of the molten tin tank via a rotating shaft and arranged vertically, a second rack connected to the L-shaped rod and meshing with the second gear, and a third rack meshing with the third gear.

2. The intelligent hot-dip galvanizing production line according to claim 1, characterized in that, The drive assembly includes a first drive cylinder mounted on the processing cabinet, a first motor connected to the output end of the first drive cylinder, an external threaded cover connected to the output end of the first motor, and multiple sets of support columns connected to the bottom of the molten solder tank.

3. The intelligent hot-dip galvanizing production line according to claim 2, characterized in that, The limiting component includes a limiting rod connected to the molten tin tank via a torsion spring, a limiting groove formed on the first positioning plate for positioning itself in conjunction with the limiting rod, a driving rod connected to the output end of the first driving cylinder, and a first protrusion and a second protrusion connected to the driving rod and arranged vertically.

4. The intelligent hot-dip galvanizing production line according to claim 3, characterized in that, The flat scraper assembly includes a second drive cylinder connected to one side of the molten solder tank, an extrusion plate connected to the output end of the second drive cylinder, a round rod connected to the extrusion plate and penetrating the molten solder tank, and a first scraper connected to the end of the round rod and located inside the molten solder tank.

5. The intelligent hot-dip galvanizing production line according to claim 4, characterized in that, The third rack is connected to the first scraper.

6. The intelligent hot-dip galvanizing production line according to claim 4, characterized in that, It also includes a recycling mechanism, which includes a reflux assembly located in the middle of the molten tin tank for recycling the molten tin ejected by centrifugation, and a cleaning assembly located on one side of the molten tin tank for collecting impurities on the surface of the molten tin.

7. The intelligent hot-dip galvanizing production line according to claim 6, characterized in that, The recirculation assembly includes multiple sets of protective plates connected to the inner wall of the molten solder tank, guide rods connected to the molten solder tank, a rectangular frame connected to the guide rods, a follower rack connected to the rectangular frame, a follower gear connected to the molten solder tank and meshing with the follower rack, a drive rack connected to the first scraper and meshing with the follower gear, multiple sets of guide rails connected to the inner wall of the molten solder tank, multiple trapezoidal blocks connected to the guide rails, an offset block connected to the rectangular frame and connected to the rectangular frame by a second spring, and a second scraper connected to the offset block by a mounting rod. The cleaning assembly includes a transmission component connected to the molten solder tank and provided with multiple sets of steel wires, a collection box passing through one side of the molten solder tank, a transmission shaft passing through one side of the molten solder tank and connected to the transmission component, a ratchet gear connected to the transmission shaft, and an adjusting rack connected to the drive rod and meshing with the ratchet gear.

8. The intelligent hot-dip galvanizing production line according to claim 1, characterized in that, It also includes an upper assembly mechanism for driving multiple sets of receiving components to complete the loading and unloading of workpieces in sequence. The upper assembly mechanism includes a second motor connected to the processing cabinet, a disc connected to the output end of the second motor, multiple sets of rotating arms connected to the disc, a flipping gear connected to the rotating arms, and a half-tooth ring connected to the processing cabinet and meshing with the flipping gear.

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