A bonding machine with positioning function for semiconductor processing
Patent Information
- Application Number
- CN202410390409.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2044-04-02
AI Technical Summary
The connection between the lead and the circuit board is not firm, causing the lead to be disconnected from the circuit board, affecting the quality and progress of semiconductor chip processing.
A bonding machine with positioning function for semiconductor processing is designed. The first micro motor is used to drive the rotor to rotate, causing the lever to bend the lead and expand the squeezing amount of the riving knife; the friction wheel and friction parts are used to rotate the riving knife , ensure that the lead is cut off; use the wire to energize to form an electromagnet to attract the piston plate, absorb the exhaust gas and accelerate the solidification of the lead through the blower.
It improves the fixation effect between the lead and the circuit board, ensures the normal connection between the chip and the circuit board, and improves the bonding quality and stability.
Smart Images
Figure CN118248595A8_ABST
Abstract
Description
Technical Field
[0001] The invention discloses a bonding machine with a positioning function for semiconductor processing, and relates to the technical field of bonding machines. Background Art
[0002] A wire bonder is a special device used for automated wire bonding technology. It is used to accurately connect tiny wires to the pins of chips and circuit boards. The working method of the wire bonder is mainly to heat-press the wires through the splitter on it, melt the wires and stick them to the pins of the chip and circuit board, thereby realizing the connection between the chip and the circuit board.
[0003] During the process of wire bonding between chips and circuit boards by the wire bonding machine, since the wires are relatively thin, when the chopper breaks the wires, the connection area between the wires and the circuit board is small, and there is a connection risk between the wires and the circuit board, that is, the connection between the wires and the circuit board may not be firm, resulting in disconnection between the wires and the circuit board, causing the chip and the circuit board to be unable to be used normally, thereby affecting the quality and progress of semiconductor chip processing. Summary of the invention
[0004] The invention provides a bonding machine with a positioning function for semiconductor processing, aiming at overcoming the disadvantage that the lead wire is not firmly connected to the circuit board, resulting in the disconnection of the lead wire and the circuit board.
[0005] The technical solution is: a bonding machine with a positioning function for semiconductor processing, comprising a support base, the support base is fixedly connected to a workbench, the support base is installed with a driving device, the driving device is fixedly connected to a mounting shell on a side close to the workbench, the mounting shell is fixedly connected to a first electric slide rail, the first electric slide rail is slidably connected to a sliding block, the sliding block is fixedly connected to an electric push rod on a side away from the first electric slide rail, the telescopic end of the electric push rod is fixedly connected to a second electric slide rail, the second electric slide rail is slidably connected to an electric slider, the electric slider of the second electric slide rail is fixedly connected to a first micro motor, the output shaft of the first micro motor is fixedly connected to a rotating piece, the rotating piece is fixedly connected to a symmetrically arranged lever, the mounting shell is rotatably connected to a chopper, a heating wire is installed inside the chopper, and symmetrically arranged electric clamps are arranged inside the mounting shell, the driving device is provided with a lead, the chopper and the symmetrically arranged electric clamps are both matched with the lead, the driving device is provided with a laser transmitter for positioning, and the mounting shell is provided with a rotating component for rotating the chopper and an air intake component for absorbing exhaust gas.
[0006] A further preferred solution is that the axis of the output shaft of the first micromotor is colinear with the axis of the adjacent lever, and the axes of the symmetrically arranged levers do not intersect with the axis of the chopper, so that the symmetrically arranged levers bend the lead wires.
[0007] A further preferred solution is that the rotating assembly includes a second micromotor, the second micromotor is fixed to the mounting shell, the output shaft of the second micromotor is fixed to a friction wheel, and a friction member cooperating with the friction wheel is fixed to a side of the chopper close to the mounting shell.
[0008] A further preferred scheme is that the air suction component includes symmetrically arranged gas collecting bottles, the symmetrically arranged gas collecting bottles are all fixed to the mounting shell, the side of the gas collecting bottle close to the splitting knife is connected with a guide pipe, a one-way valve is arranged inside the guide pipe, the guide pipe passes through the mounting shell, the interior of the splitting knife is rotatably connected with an air suction pipe connected with the symmetrically arranged guide pipe, the air suction pipe is provided with evenly arranged air suction holes, the air suction pipe is fixed to one end of the symmetrically arranged guide pipe away from the gas collecting bottle, the interior of the gas collecting bottle is slidably connected with a piston plate, a tension spring is fixed between the piston plate and the adjacent gas collecting bottle, and the interior of the gas collecting bottle is provided with a traction assembly for moving the piston plate.
[0009] A further preferred solution is that the air intake pipe is in a circular shape, and the lead wire passes through the air intake pipe, so that the air intake pipe can fully absorb the exhaust gas.
[0010] A further preferred scheme is that a connecting pipe is connected to the side of the gas collecting bottle close to the splitting knife, a one-way valve is arranged inside the connecting pipe, a purification bottle is fixedly connected to the connecting pipe, the connecting pipe is connected to the adjacent purification bottle, the purification bottle is connected to a blowing pipe on the side away from the adjacent connecting pipe, activated carbon is arranged inside the blowing pipe, and a blowing piece is fixedly connected to one end of the blowing pipe away from the adjacent purification bottle, and the blowing piece is provided with evenly arranged blowing holes.
[0011] A further preferred solution is that the blowing holes evenly arranged on the blowing member are inclined in different directions to increase the blowing area of the blowing member.
[0012] A further preferred solution is that the traction assembly includes an iron block, which is fixed to a side of the adjacent gas collecting bottle away from the splitting knife, and a matching wire is wound around the iron block, and both ends of the wire are electrically connected to the driving device and the heating wire respectively, and the iron block matches the adjacent piston plate.
[0013] A further preferred scheme is that it also includes a pressing component for pressing the lead, the pressing component is arranged on the chopping knife, the pressing component includes a fixing frame, the fixing frame is fixed between the symmetrically arranged air blowing tubes, the fixing frame is slidably connected to the chopping knife, the fixing frame is slidably connected to a symmetrically arranged guide rod, a spring is fixed between the guide rod and the fixing frame, a connecting plate is fixed at one end of the guide rod away from the mounting shell, a pressing ring is fixed between the symmetrically arranged connecting plates, and the pressing ring cooperates with the lead.
[0014] A further preferred solution is that a side of the pressing ring close to the fixing frame is provided with circumferentially arranged protrusions, the riving knife is fixedly connected with circumferentially arranged push rods, and the protrusions of the pressing ring cooperate with the adjacent push rods.
[0015] The beneficial effects are as follows: 1. The present invention drives the rotating piece to rotate through the output shaft of the first micro-motor, so that the rotating piece drives the symmetrically arranged levers to rotate, and the symmetrically arranged levers bend the leads, thereby increasing the amount of compression of the leads by the chopping knife, and expanding the extension range of the leads on the circuit board after being compressed by the chopping knife, thereby improving the fixing effect between the leads and the circuit board; 2. The friction wheel drives the friction part to rotate, and the friction part drives the splitting knife to rotate, so that when part of the lower end of the splitting knife is damaged, the rotating splitting knife can cut off the lead, thereby ensuring the normal connection between the lead and the chip and the circuit board, and ensuring the bonding quality and bonding effect of the chip; 3. Electricity is passed through the wire, so that the wire and the adjacent iron block form an electromagnet and attract the adjacent piston plate. The gas collecting bottle stores the waste gas generated by the melting of the lead, and then the blower is used to blow out the purified gas, so that the purified gas cools the lead, accelerates the solidification speed of the lead, and improves the stability of the lead. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the positional relationship between the mounting housing and the first electric slide rail and other parts of the present invention; Figure 3 It is a schematic diagram of the positional relationship of the rotating plate, the lever and other parts of the present invention; Figure 4 It is a schematic diagram of the positional relationship of the components such as the splitting knife and the friction member of the present invention; Figure 5 It is a schematic diagram of the lead bending process of the present invention; Figure 6 It is a schematic diagram of the positional relationship of the gas collecting bottle, the flow guide pipe and other parts of the present invention; Figure 7 It is a three-dimensional structural schematic diagram of the piston plate, iron block and other parts of the present invention; Figure 8 It is a schematic diagram of the positional relationship of the guide pipe, the air intake pipe and other parts of the present invention; Fig. 9 It is a schematic diagram of the positional relationship between the blowing pipe and the blowing member of the present invention; Fig.10 It is a schematic diagram of the three-dimensional structure of parts such as the pressing ring and the ejector rod of the present invention.
[0017] Figure numerals: 101, support base, 102, workbench, 103, driving device, 104, mounting shell, 105, first electric slide rail, 106, sliding block, 107, electric push rod, 108, second electric slide rail, 109, first micro motor, 110, rotating piece, 111, lever, 112, chopper, 113, heating wire, 114, electric clamp, 115, lead wire, 201, second Micro motor, 202, friction wheel, 203, friction part, 301, gas collecting bottle, 302, guide pipe, 303, suction pipe, 304, piston plate, 305, connecting pipe, 306, purification bottle, 307, blowing pipe, 308, blowing part, 401, iron block, 402, wire, 501, fixing frame, 502, guide rod, 503, connecting plate, 504, pressing ring, 505, push rod. DETAILED DESCRIPTION
[0018] Reference to an embodiment herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0019] Embodiment 1: A bonding machine with positioning function for semiconductor processing, such as Figure 1-Figure 5As shown, it includes a support base 101, the support base 101 is fixedly connected to a workbench 102 for placing circuit boards and semiconductor chips, the support base 101 is installed with a driving device 103, the driving device 103 is an existing device, the driving device 103 drives the mounting shell 104 to move freely in three dimensions, the lower side of the driving device 103 is fixedly connected to the mounting shell 104, the upper part of the mounting shell 104 is fixedly connected to a first annular electric slide rail 105, the first electric slide rail 105 is slidably connected to a sliding block 106, the lower side of the sliding block 106 is fixedly connected to an electric push rod 107, and the electric The telescopic end of the push rod 107 faces downward, the telescopic end of the electric push rod 107 is fixedly connected to the second electric slide rail 108, the second electric slide rail 108 is slidably connected to the electric slider, the electric slider of the second electric slide rail 108 is fixedly connected to the first micro motor 109, the output shaft axis of the first micro motor 109 is perpendicular to the axis of the mounting shell 104 but does not intersect, the output shaft of the first micro motor 109 is fixedly connected to a rotating plate 110, the axis of the output shaft of the first micro motor 109 is located above the center point of the rotating plate 110, and the rotating plate 110 is fixedly connected to two levers 111 arranged symmetrically up and down. The axis of the upper lever 111 coincides with the axis of the output shaft of the first micro-motor 109, and the axes of the two symmetrically arranged levers 111 do not intersect with the axis of the chopper 112, so that the symmetrically arranged levers 111 are used to bend the lead wire 115. The chopper 112 is rotatably connected to the lower end of the mounting shell 104, and a heating wire 113 for heating the chopper 112 is installed inside the chopper 112. The heated chopper 112 performs heat pressing on the lead wire 115 to melt the lead wire 115. Two symmetrically arranged electric clamps 114 are provided at the lower part of the mounting shell 104. The driving device 103 is provided with a lead 115, the lower end of the lead 115 is heated into a spherical shape by the heating wire 113 in the splitting knife 112, the splitting knife 112 and the symmetrically arranged electric clamps 114 are both matched with the lead 115, the two electric clamps 114 clamp the lead 115, the splitting knife 112 performs hot pressing on the lead 115 to deform and disconnect the lead 115, the driving device 103 is provided with a laser transmitter for locating the welding point, and the mounting shell 104 is provided with a rotating component for rotating the splitting knife 112 and an air suction component for absorbing the exhaust gas generated when the lead 115 melts.
[0020] like Figure 3 and Figure 4 As shown, the rotating assembly includes a second micro motor 201, which is fixed to the lower part of the mounting shell 104, with the output shaft of the second micro motor 201 facing downward, and the output shaft of the second micro motor 201 is fixedly connected to a friction wheel 202, and the lower part of the chopping knife 112 is fixedly connected to a friction member 203 that cooperates with the friction wheel 202, and the friction wheel 202 drives the friction member 203 to rotate.
[0021] like Figure 2 , Figure 3 and Figure 6-Figure 9As shown, the air intake assembly includes two symmetrically arranged gas collecting bottles 301, the two gas collecting bottles 301 are fixedly connected to the middle and lower part of the mounting shell 104, the lower sides of the two gas collecting bottles 301 are connected with a guide pipe 302, and a one-way valve is arranged inside the guide pipe 302. The one-way valve of the guide pipe 302 is a micro one-way valve. The micro one-way valve is an existing device and is not further explained. The micro one-way valve of the guide pipe 302 allows the exhaust gas to enter the adjacent gas collecting bottle 301 through the guide pipe 302. The guide pipe 302 runs through the mounting shell 104, and the lower part of the chopper 112 is rotatably connected to the two guide pipes. The suction pipe 303 is connected to the flow pipe 302, and the lower side of the suction pipe 303 is provided with evenly arranged suction holes. The suction holes of the suction pipe 303 are used to suck away the waste gas generated when the lead wire 115 is melted. The upper side of the suction pipe 303 is fixedly connected to the lower ends of the two guide pipes 302. The suction pipe 303 is annular, so that the suction holes of the suction pipe 303 are evenly arranged above the sphere of the lead wire 115. The lead wire 115 passes through the suction pipe 303, which is used to make the suction pipe 303 fully absorb the waste gas. The lower part of the gas collecting bottle 301 is sealed and slidably connected with a piston plate 304, and the piston plate 304 is connected to the corresponding A tension spring for resetting the piston plate 304 is fixedly connected between adjacent gas collecting bottles 301, a connecting pipe 305 is connected to the lower side of the gas collecting bottle 301, a one-way valve is arranged inside the connecting pipe 305, and the one-way valve of the connecting pipe 305 is a micro one-way valve. The micro one-way valve of the connecting pipe 305 allows the gas in the gas collecting bottle 301 to enter the adjacent purification bottle 306 through the connecting pipe 305, a purification bottle 306 is fixedly connected to the lower end of the connecting pipe 305, the connecting pipe 305 is connected to the adjacent purification bottle 306, and the lower side of the purification bottle 306 is connected to the blowing pipe 307, and the blowing pipe 307 is arranged inside Activated carbon for purifying exhaust gas is provided, and a blowing piece 308 is fixedly connected to the lower end of the blowing pipe 307. The blowing piece 308 is provided with evenly arranged blowing holes. The blowing holes of the blowing piece 308 are toward the lower end of the lead 115. The evenly arranged blowing holes on the blowing piece 308 are inclined in different directions for increasing the blowing area of the blowing piece 308. No matter where the lead 115 is, the wind blown by the blowing piece 308 can cool the lead 115 to increase the cooling speed of the lead 115. A traction assembly for moving the piston plate 304 is provided inside the gas collecting bottle 301.
[0022] like Figure 6 and Figure 7As shown, the traction assembly includes an iron block 401, which is fixed to the upper side of the adjacent gas collecting bottle 301. The iron block 401 is wound with a wire 402 that matches it. The wire 402 has a margin for allowing the splitting knife 112 and the mounting shell 104 to rotate normally. When the wire 402 is energized, the wire 402 and the adjacent iron block 401 form an electromagnet and generate magnetic force. The two ends of the wire 402 are electrically connected to the driving device 103 and the heating wire 113 respectively. The current passing through the wire 402 enters the heating wire 113 and the heating wire 113 starts to heat up. The iron block 401 matches with the adjacent piston plate 304. When the wire 402 is energized and the adjacent iron block 401 generates magnetic force, the iron block 401 attracts the adjacent piston plate 304 to move the piston plate 304 upward.
[0023] When it is necessary to bond the lead 115 of the semiconductor chip, the operator places the circuit board and the chip on the workbench 102, and then the operator turns on the driving device 103. The laser transmitter on the driving device 103 turns on and positions the first welding point of the chip. After the positioning is completed, the driving device 103 drives the mounting shell 104 to move downward, and the mounting shell 104 drives the lead 115 to move downward and close to the chip through two electric clamps 114. The mounting shell 104 drives the splitting knife 112 to move downward and close to the chip. At this time, the wire 402 is energized and transmits current to the heating wire 113, so that the heating wire 113 hits the bottom of the splitting knife 112. The lead 115 is heated at the bottom. When the lead 115 contacts the first welding point of the chip, the lead 115 is blocked by the chip and stops moving downward. At this time, the heated chopper 112 squeezes the sphere at the lower end of the lead 115, causing the sphere at the lower end of the lead 115 to be deformed by the simultaneous effects of squeezing and heating. When the lower end of the lead 115 is fixed on the chip, the two electric clamps 114 release the lead 115, and the driving device 103 drives the mounting shell 104 to move upward. At this time, the wire 402 is powered off, the heating wire 113 stops heating, and the mounting shell 104 drives the chopper 112 to move upward, and the chopper 112 is separated from the lower end of the lead 115.
[0024] When the wire 402 is energized, the iron block 401 and the adjacent wire 402 form an electromagnet and generate magnetic force to attract the adjacent piston plate 304, so that the piston plate 304 moves upward and approaches the adjacent iron block 401. The tension spring on the piston plate 304 is stretched. When the piston plate 304 moves upward, the suction pipe 303 draws away the exhaust gas generated by the heating of the sphere at the lower end of the lead 115 through the suction hole thereon to prevent the exhaust gas from polluting the external environment. The exhaust gas is drawn into the guide pipe 302 and enters the adjacent gas collecting bottle 301. When the wire 402 is energized, the piston plate 304 moves upward but does not contact the adjacent iron block 401. When the wire 402 is de-energized, the iron block 401 and the adjacent wire 40 2 no longer forms an electromagnet, and at this time, the piston plate 304 is no longer attracted by the magnetic force. Under the action of the tension force of the tension spring on the piston plate 304, the piston plate 304 moves downward and presses the waste gas in the adjacent gas collecting bottle 301 into the adjacent purification bottle 306 through the adjacent connecting pipe 305. The activated carbon in the purification bottle 306 purifies the waste gas, and the purified gas enters the adjacent blowing pipe 307. The gas in the blowing pipe 307 is blown out from the blowing hole of the adjacent blowing member 308. The wind blown by the blowing member 308 cools the lower end of the heating wire 113, so that the lower end of the lead 115 is quickly solidified, thereby improving the fixing effect between the lead 115 and the chip. When the guide tube 302 is reset, the blowing member 308 stops blowing.
[0025] When the driving device 103 drives the mounting shell 104 to move upward to the position where the lead 115 needs to be bent, the two electric clamps 114 clamp the lead 115, and the driving device 103 drives the mounting shell 104 to move horizontally, so that the lead 115 is bent. At this time, the first electric slide rail 105, the electric push rod 107 and the second electric slide rail 108 are started, and the sliding block 106 drives the electric push rod 107 to move along the first electric slide rail 105. When the axis of the lever 111 is perpendicular to the vertical plane of the horizontal movement of the mounting shell 104 , the first electric slide rail 105 is closed, the sliding block 106 stops moving, the telescopic end of the electric push rod 107 drives the second electric slide rail 108 to move downward, and when the lead wire 115 is located between the axes of the two levers 111, the electric push rod 107 is closed, and the second electric slide rail 108 drives the first micro motor 109 to approach the lead wire 115 through the electric slider thereon. When the output shaft of the first micro motor 109 drives the two levers 111 to approach the lead wire 115 through the rotating piece 110, when the two levers 111 move the lead wire 115 When the laser emitter is in the middle, the second electric slide rail 108 is closed, the first micro motor 109 is turned on, and the output shaft of the first micro motor 109 drives the rotating plate 110 to rotate, so that the rotating plate 110 drives the lower lever 111 to move upward, and the lower lever 111 bends the lead 115. When the output shaft of the first micro motor 109 drives the rotating plate 110 to rotate 180 degrees, the first micro motor 109 is turned off. When the laser emitter is positioned at the second welding point on the circuit board, the driving device 103 no longer drives the mounting plate 110. The shell 104 moves laterally, the driving device 103 drives the mounting shell 104 to move downward, and the two electric clamps 114 drive the lead 115 to move downward and close to the second welding point of the circuit board. At this time, the second electric slide rail 108 is started, and the second electric slide rail 108 drives the first micro motor 109 away from the lead 115 through the electric slider thereon, so that the two levers 111 are away from the lead 115 and no longer clamp the lead 115 in the middle, and the electric slider of the second electric slide rail 108 drives the first micro motor 109 to reset.
[0026] After the electric slider of the second electric slide rail 108 drives the first micro motor 109 to reset, the wire 402 is energized to make the heating wire 113 energized and heated, the gas collecting bottle 301 starts to pump gas, and the heating wire 113 heats the bottom of the splitting knife 112. When the lead 115 contacts the second welding point, the heated splitting knife 112 squeezes the lead 115, causing the lead 115 to deform under the dual effects of pressure and heating. The waste gas generated by the heating and melting of the lead 115 is sucked away by the gas collecting bottle 301, and the lead 115 is attached to the vicinity of the second welding point of the circuit board. The lead 115 is bent by the above-mentioned lever 111, so that the amount of squeezing of the lead 115 by the splitting knife 112 increases, and the diffusion area of the lead 115 on the circuit board when being squeezed by the splitting knife 112 increases. When the splitting knife 112 contacts the circuit board, the splitting knife 112 breaks the lead 115, and the driving device 103 no longer drives the splitting knife 112 to move downward, and then the second welding point of the circuit board is opened. The second micro motor 201 is started, and the output shaft of the second micro motor 201 drives the friction wheel 202 to rotate, and the friction wheel 202 drives the friction member 203 to rotate, and the friction member 203 drives the chopper 112 to rotate 10°. Since the wire 402 has a margin, the wire 402 does not hinder the rotation of the chopper 112 at this time. Then the output shaft of the second micro motor 201 is reversed and reset to reset the friction member 203. During the rotation of the chopper 112, the chopper 112 cuts the lead 115 to prevent the lead 115 from not being broken by the chopper 112 and causing the lead 115 to be unable to adhere to the circuit board. After the output shaft of the second micro motor 201 is reset, the driving device 103 drives the chopper 112 to move upward. At this time, the wire 402 is powered off, and the blowing member 308 blows air to the lead 115 on the circuit board to make the lead 115 solidify quickly to prevent the lead 115 from being separated from the circuit board, thereby causing the semiconductor chip to fail to bond.
[0027] When the driving device 103 drives the splitting knife 112 to move upward to the set position, the wire 402 is energized again. At this time, the heating wire 113 heats the splitting knife 112 again. The heated splitting knife 112 transfers heat to the lower end of the lead 115, so that the lower end of the lead 115 melts and forms a sphere. In this process, the exhaust gas generated by the lead 115 is stored in the gas collecting bottle 301. Then the wire 402 is powered off, and the blowing member 308 blows air and cools the sphere at the lower end of the lead 115 to make it solidify quickly, thereby ensuring the stability of the sphere at the lower end of the lead 115. All the above operations are repeated to continuously bond the semiconductor chips. When all the semiconductor chips are bonded, the operator turns off the driving device 103, the first electric slide 105, the electric push rod 107, the second electric slide 108, the first micro motor 109, the electric clamp 114 and the second micro motor 201.
[0028] Embodiment 2: Based on embodiment 1, Figure 6 , Figure 8 and Fig.10As shown, a pressing assembly for pressing the lead 115 is also included, the pressing assembly is arranged at the lower part of the riving knife 112, and the pressing assembly includes a fixing frame 501, the fixing frame 501 is fixed between the two symmetrically arranged air blowing pipes 307, the fixing frame 501 is slidably connected to the lower part of the riving knife 112, the fixing frame 501 is slidably connected to two symmetrically arranged guide rods 502, a spring for resetting the fixing frame 501 is fixed between the guide rods 502 and the fixing frame 501, the lower ends of the two guide rods 502 are fixedly connected to connecting plates 503, and a pressing ring is fixedly connected between the two symmetrically arranged connecting plates 503. 504, the pressing ring 504 is located at the lower end of the chopping knife 112, the pressing ring 504 cooperates with the lead 115, the pressing ring 504 squeezes the lead 115, deforms the lead 115, increases the contact area between the lead 115 and the circuit board, and thus improves the fixing effect between the lead 115 and the circuit board. The upper side of the pressing ring 504 is provided with circumferentially arranged protrusions, and the lower part of the chopping knife 112 is fixedly connected with circumferentially arranged ejector pins 505. The protrusions of the pressing ring 504 cooperate with the adjacent ejector pins 505. When the ejector pins 505 squeeze the adjacent protrusions on the pressing ring 504, the pressing ring 504 moves downward and squeezes the lead 115.
[0029] In the process that the friction wheel 202 drives the friction member 203 to rotate, the friction member 203 drives the chopping knife 112 to rotate, and the chopping knife 112 drives the circumferentially arranged push rods 505 to rotate. When the push rods 505 contact the adjacent protrusions on the pressing ring 504, the push rods 505 squeeze the adjacent protrusions on the pressing ring 504, so that the pressing ring 504 moves downward, and the pressing ring 504 drives the symmetrically arranged connecting plates 503 to move downward, so that the connecting plates 503 drive the adjacent guide rods 502 to move downward, and the springs on the guide rods 502 are compressed, and the pressing ring 504 approaches the leads 115 on the circuit board. When the pressing ring 504 contacts the circuit board When the friction wheel 202 contacts the lead 115 on the circuit board, the lead 115 on the circuit board is squeezed and further deformed by the pressing ring 504, so that the diffusion range of the lead 115 on the circuit board becomes larger, and the contact area between the lead 115 and the circuit board is increased, thereby improving the fixing effect of the lead 115 and the circuit board, improving the stability of the lead 115 on the circuit board, and ensuring the bonding quality and production quality of the semiconductor chip. When the friction wheel 202 is reversed and reset, under the action of the spring force on the guide rod 502, the guide rod 502 drives the pressing ring 504 to move upward and reset through the connecting plate 503, and the pressing ring 504 loses contact with the lead 115.
[0030] Although the present disclosure has been shown and described with reference to specific exemplary embodiments of the present disclosure, it should be understood by those skilled in the art that various changes in form and details may be made to the present disclosure without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents. Therefore, the scope of the present disclosure should not be limited to the above-mentioned embodiments, but should be determined not only by the appended claims, but also by the equivalents of the appended claims.
Claims
1. A bonding machine with a positioning function for semiconductor processing, characterized in that: The invention comprises a support base (101), the support base (101) being fixedly connected to a workbench (102), the support base (101) being installed with a driving device (103), the driving device (103) being fixedly connected to a mounting shell (104) on a side close to the workbench (102), the mounting shell (104) being fixedly connected to a first electric slide rail (105), the first electric slide rail (105) being slidably connected to a sliding block (106), the sliding block (106) being fixedly connected to an electric push rod (107) on a side away from the first electric slide rail (105), the telescopic end of the electric push rod (107) being fixedly connected to a second electric slide rail (108), the second electric slide rail (108) being slidably connected to an electric slider, the electric slider of the second electric slide rail (108) being fixedly connected to a first micro-electric The invention relates to a micro-motor (109), wherein the output shaft of the first micro-motor (109) is fixedly connected to a rotating plate (110), the rotating plate (110) is fixedly connected to a symmetrically arranged shifting rod (111), the mounting shell (104) is rotatably connected to a splitting knife (112), a heating wire (113) is installed inside the splitting knife (112), and a symmetrically arranged electric clamp (114) is arranged inside the mounting shell (104), the driving device (103) is provided with a lead wire (115), the splitting knife (112) and the symmetrically arranged electric clamp (114) are both matched with the lead wire (115), the driving device (103) is provided with a laser transmitter for positioning, and the mounting shell (104) is provided with a rotating component for rotating the splitting knife (112) and an air suction component for absorbing exhaust gas.
2. A bonding machine with positioning function for semiconductor processing according to claim 1, characterized in that: The axis of the output shaft of the first micromotor (109) is colinear with the axis of the adjacent lever (111), and the axes of the symmetrically arranged levers (111) do not intersect with the axis of the chopper (112), so that the symmetrically arranged levers (111) can bend the lead wire (115).
3. A bonding machine with positioning function for semiconductor processing according to claim 1, characterized in that: The rotating assembly comprises a second micro motor (201), the second micro motor (201) is fixedly connected to the mounting shell (104), the output shaft of the second micro motor (201) is fixedly connected to a friction wheel (202), and a friction member (203) cooperating with the friction wheel (202) is fixedly connected to a side of the chopper (112) close to the mounting shell (104).
4. A bonding machine with positioning function for semiconductor processing according to claim 3, characterized in that: The air intake assembly comprises symmetrically arranged gas collecting bottles (301), the symmetrically arranged gas collecting bottles (301) are all fixedly connected to the mounting shell (104), a side of the gas collecting bottle (301) close to the splitting knife (112) is connected to a flow guide pipe (302), a one-way valve is arranged inside the flow guide pipe (302), the flow guide pipe (302) passes through the mounting shell (104), and the inside of the splitting knife (112) is rotatably connected to an air intake pipe connected to the symmetrically arranged flow guide pipe (302). (303), the air intake pipe (303) is provided with evenly arranged air intake holes, the air intake pipe (303) is fixedly connected to one end of the symmetrically arranged flow guide pipe (302) away from the gas collecting bottle (301), the interior of the gas collecting bottle (301) is slidably connected with a piston plate (304), a tension spring is fixedly connected between the piston plate (304) and the adjacent gas collecting bottle (301), and a traction component for moving the piston plate (304) is provided inside the gas collecting bottle (301).
5. A bonding machine with positioning function for semiconductor processing according to claim 4, characterized in that: The air intake pipe (303) is in the shape of a ring, and the lead wire (115) passes through the air intake pipe (303) so as to enable the air intake pipe (303) to fully absorb the exhaust gas.
6. A bonding machine with positioning function for semiconductor processing according to claim 4, characterized in that: A connecting pipe (305) is connected to the side of the gas collecting bottle (301) close to the splitting knife (112), a one-way valve is arranged inside the connecting pipe (305), a purification bottle (306) is fixedly connected to the connecting pipe (305), the connecting pipe (305) is connected to an adjacent purification bottle (306), a side of the purification bottle (306) away from the adjacent connecting pipe (305) is connected to an air blowing pipe (307), activated carbon is arranged inside the air blowing pipe (307), and an end of the air blowing pipe (307) away from the adjacent purification bottle (306) is fixedly connected to a blowing member (308), the blowing member (308) is provided with evenly arranged blowing holes.
7. A bonding machine with positioning function for semiconductor processing according to claim 6, characterized in that: The evenly arranged blowing holes on the blowing member (308) are inclined in different directions, so as to increase the blowing area of the blowing member (308).
8. A bonding machine with positioning function for semiconductor processing according to claim 6, characterized in that: The traction assembly comprises an iron block (401), the iron block (401) being fixedly connected to a side of the adjacent gas collecting bottle (301) away from the splitting knife (112), the iron block (401) being wound with a matching wire (402), the two ends of the wire (402) being electrically connected to the driving device (103) and the heating wire (113) respectively, and the iron block (401) being matched with the adjacent piston plate (304).
9. A bonding machine with positioning function for semiconductor processing according to claim 6, characterized in that: The invention also comprises a pressing assembly for pressing the lead wire (115), the pressing assembly being arranged on the splitting knife (112), the pressing assembly comprising a fixing frame (501), the fixing frame (501) being fixedly connected between the symmetrically arranged air blowing pipes (307), the fixing frame (501) being slidably connected to the splitting knife (112), the fixing frame (501) being slidably connected to a symmetrically arranged guide rod (502), a spring being fixedly connected between the guide rod (502) and the fixing frame (501), a connecting plate (503) being fixedly connected to one end of the guide rod (502) away from the mounting shell (104), a pressing ring (504) being fixedly connected between the symmetrically arranged connecting plates (503), the pressing ring (504) being matched with the lead wire (115).
10. A bonding machine with positioning function for semiconductor processing according to claim 9, characterized in that: The pressing ring (504) is provided with circumferentially arranged protrusions on one side close to the fixing frame (501), the riving knife (112) is fixedly connected with circumferentially arranged push rods (505), and the protrusions of the pressing ring (504) cooperate with the adjacent push rods (505).