An intelligent and adaptive wafer debonding and stripping machine

Abstract

The present invention discloses a wafer debonding and stripping machine with intelligent adaptive adjustment, and the present invention relates to the field of wafer debonding technology, including a shell, a No. 1 support, a laser stripping head and a temperature intelligent adjustment module, wherein the inner wall of the shell is installed with the No. 1 support, the inner wall of the shell is installed with the laser stripping head, the inner wall of the No. 1 support is installed with the temperature intelligent adjustment module, the top of the No. 1 support is provided with a cleaning chamber, the inner wall of the No. 1 support is installed with a drying component, and the drying component is used for rapid drying of wafers. The present invention is installed with a heating ring controlled by a processor to maintain the current power, and when the processor detects that the temperature is in a normal state, the power of the heating ring controlled by the processor is maintained, and at the same time, the temperature sensor continuously detects the built-in temperature data, and the processor makes a judgment, and the processor detects that the real-time temperature data is in an over-temperature state or an over-temperature state, thereby realizing intelligent adaptive adjustment.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer debonding, and in particular to an intelligent and adaptively adjustable wafer debonding and stripping machine. Background Art

[0002] Wafer debonding and stripping machine is a type of semiconductor process equipment, mainly used for debonding and stripping operations in the wafer manufacturing process. Wafer debonding and stripping machine is one of the important equipment in the semiconductor manufacturing process, which covers multiple fields such as semiconductor technology, material science, mechanical engineering, etc. Wafer debonding and stripping machine plays an important role in the semiconductor manufacturing industry, but the existing wafer debonding and stripping machine cannot intelligently and adaptively adjust the drying temperature of the wafer by the wafer debonding and stripping machine to reduce energy utilization.

[0003] The defects of the existing wafer debonding and stripping machines are:

[0004] 1. Patent document CN117059553B discloses a laser debonding fixing mechanism, a product stripping device and a product fixing method, "aiming to solve the technical problem in the related art that the corresponding mechanical arms and separation bases need to be switched when operating different types of products. The laser debonding fixing mechanism meets the operating requirements of both frame-level products and wafer-level products, and there is no need to replace the mechanical arms when transferring products. The mechanical arms are all of the bottom-bearing vacuum adsorption type, thereby saving the trouble of replacing the mechanical arms and separation bases when operating different products and improving the operating efficiency." However, the existing wafer debonding and stripping machine cannot intelligently and adaptively adjust the drying temperature of the wafer by the wafer debonding and stripping machine to reduce energy utilization;

[0005] 2. Patent document CN113838778A discloses a laser debonding device. "The laser debonding device includes a stage for holding the to-be-debonded part thereon, and the to-be-debonded part includes a first layer structure and a second layer structure bonded by a bonding layer. It also includes a suction cup and a laser system. The suction cup is adsorbed on the surface of the second layer structure. The laser system is used to generate a laser beam that passes through the suction cup and the second layer structure in sequence and focuses on the bonding layer, and controls the focus of the laser beam to scan the bonding layer to debond the bonding layer. It also includes a stretching mechanism connected to the suction cup, which is used to pull the suction cup upward after the laser beam scans a partial area of ​​the bonding layer, so that the first layer structure and the second layer structure are separated at a position overlapping with the partial area. The peeling method of separating by pulling the suction cup while laser debonding is adopted to prevent the two layer structures from adhering again due to the cooling and solidification of the bonding material in the molten state between the two layer structures, thereby reducing the difficulty of peeling." However, the existing wafer debonding and peeling machine cannot quickly dry the wafer surface after cleaning, and the work efficiency is not high;

[0006] 3. Patent document CN116995002A discloses a wafer and glass stripping device, stripping and cleaning integrated equipment and stripping method, "aimed at alleviating the technical problems of secondary pollution and long process time in the process of glass stripping and recycling in related technologies. The wafer and glass stripping device sets the base directly below the laser emitting mechanism, reducing the working path of the base, thereby improving the separation efficiency of the glass plate; driving the glass plate to flip 180°, so that the robot arm can directly transfer the glass plate to the front-opening wafer transfer box, eliminating the step of stacking and placing it in the cake box, and also avoiding secondary pollution, reducing the relevant process time, and saving manpower and material resources", but the cleaning liquid of the existing wafer debonding and stripping machine cannot be recycled, increasing waste;

[0007] 4. Patent document CN105047589B discloses a wafer debonding device, "which includes: a table for placing bonded wafers and carriers; and a tool with an air outlet, the tool is arranged near the table by an adjustable device, and the tool is controlled by the adjustable device to move away from or close to the table, the tool is provided with a tool head for piercing a notch in the film or glue at the junction of the bonded wafer and the carrier, the air outlet is arranged on the tool head, and the tool is also provided with an air inlet, the air inlet is connected to the air outlet, and the air inlet is connected to a gas generating device for blowing air to the junction of the bonded wafer and the carrier on the table. The above-mentioned wafer debonding device has a high degree of automation and is easier to operate", but the existing wafer debonding and stripping machines cannot prevent the wafer from shaking during debonding and stripping, resulting in low stripping accuracy. Summary of the invention

[0008] The purpose of the present invention is to provide an intelligent and adaptively adjustable wafer debonding and stripping machine to solve the technical problem raised in the above background technology that the existing wafer debonding and stripping machine cannot intelligently and adaptively adjust the drying temperature of the wafer to reduce energy utilization.

[0009] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an intelligent self-adjusting wafer debonding and stripping machine, comprising a shell, a No. 1 support, a laser stripping head and a temperature intelligent adjustment module, wherein the No. 1 support is installed on the inner wall of the shell, the laser stripping head is installed on the inner wall of the shell, the temperature intelligent adjustment module is installed on the inner wall of the No. 1 support, a cleaning chamber is provided on the top of the No. 1 support, and a drying component is installed on the inner wall of the No. 1 support, and the drying component is used for rapid drying of wafers;

[0010] The intelligent temperature adjustment module includes a heating ring, a processor, and a temperature sensor. The processor is located on the inner wall of support platform No. 1, and the temperature sensor is located on the inner wall of the cleaning chamber. A fan is installed on the inner wall of support platform No. 1, and an air duct is installed on the output end of the fan. The heating ring is located on the outer wall of the air duct. The heating ring is electrically connected to the processor, and the temperature sensor is electrically connected to the processor. The processor has built-in temperature data, and the temperature sensor is used to detect real-time temperature data of hot air.

[0011] Preferably, the real-time temperature data is transmitted to the processor, which compares the real-time temperature data with the built-in temperature data. If the comparison result of the real-time temperature data with the built-in temperature data is greater than the built-in temperature data, it is set to an over-temperature state; if the comparison result of the real-time temperature data with the built-in temperature data is less than the built-in temperature data, it is set to an over-temperature state; if the comparison result of the real-time temperature data with the built-in temperature data is within the range of the built-in temperature data, it is set to a normal temperature state.

[0012] Preferably, the drying component includes an air collecting head, a nozzle, a No. 2 port, a filter, and an L-shaped frame. The air collecting head is located at the input end of the fan, the nozzle passes through the outer wall of the air duct, the No. 2 port is opened on the outer wall of the No. 1 support, the L-shaped frame is located on the inner wall of the No. 1 support, the outer wall of the L-shaped frame is equipped with a No. 1 magnetic head, the filter is located on the inner wall of the No. 2 port, and the outer wall of the filter is equipped with a handle.

[0013] Preferably, the filter is made of iron, the outer wall of the filter is connected to the outer wall of the No. 1 magnetic head, the nozzle is located on one side of the temperature sensor, and the filter moves through the No. 2 port.

[0014] Preferably, a vacuum suction cup is installed on the inner wall of the shell, a suction groove is provided on the top of the vacuum suction cup, a wafer fixing assembly is installed on the inner wall of the vacuum suction cup, the wafer fixing assembly is used for stable fixation of the wafer, and a recovery assembly is installed on the inner wall of the shell, the recovery assembly is used for collecting cleaning liquid.

[0015] Preferably, the recycling component includes a collecting box, a water pump, a No. 5 water pipe, a water spray head, a dust filter, and a pull ring. The collecting box is located on the inner wall of the shell, the water pump passes through the outer wall of the collecting box, one end of the No. 5 water pipe is connected to the output end of the water pump, the water spray head passes through the outer wall of the No. 5 water pipe, a cleaning chamber is provided on the top of the No. 1 support, the inner wall of the cleaning chamber is installed with a support, the inner wall of the cleaning chamber is installed with a guide block, the outer wall of the cleaning chamber is penetrated and installed with a No. 6 water pipe, and one end of the No. 6 water pipe passes through the inner wall of the collecting box, the dust filter passes through the inner wall of the collecting box, the pull ring is located on the outer wall of the dust filter, the outer wall of the collecting box is provided with a groove, the outer wall of the pull ring is provided with a card slot, and the inner wall of the groove is installed with a No. 6 magnetic block.

[0016] Preferably, the sixth magnetic block extends to the inner wall of the card slot, the pull ring can pull the dust filter out of the collection box, and the water spray head is located above the cleaning chamber.

[0017] Preferably, the wafer fixing assembly includes a cylinder, a support rod, a sleeve, a spring, a No. 7 port, and a clamp, the cylinder is located on the inner wall of the vacuum suction cup, the support rod is located on the inner wall of the vacuum suction cup, the sleeve is located on the outer wall of the support rod, a support rod is installed on the outer wall of the sleeve, the spring is located on the outer wall of the support rod, the output end of the cylinder and the outer wall of the support rod, the No. 7 port is opened at the top of the vacuum suction cup, and one end of the support rod extends to the top of the vacuum suction cup through the No. 7 port, and a clamp is installed on the outer wall of the support rod.

[0018] Preferably, a guide box is installed on the inner wall of the shell, and a No. 9 opening is provided on the outer wall of the guide box, a connecting block is installed through the inner wall of the No. 9 opening, a moving rod is installed on the inner wall of the guide box, and the output end of the moving rod is connected to the outer wall of the connecting block, a servo motor is installed through the inner wall of the connecting block, a suction head is installed on the output end of the servo motor, and a machine door is installed on the outer wall of the shell.

[0019] Preferably, the working steps of the stripping machine are as follows:

[0020] S1. When the processor detects that the temperature is too high, the processor controls the power of the heating ring to be reduced. At the same time, the temperature sensor continuously detects the built-in temperature data for the processor to judge. When the processor detects that the real-time temperature data is in a normal temperature state, the processor controls the heating ring to maintain the current power. When the processor detects that the temperature is too low, the processor controls the power of the heating ring to be increased. At the same time, the temperature sensor continuously detects the built-in temperature data for the processor to judge. When the processor detects that the real-time temperature data is in a normal temperature state, the processor controls the heating ring to maintain the current power. When the processor detects that the temperature is normal, the processor controls the power of the heating ring to be maintained. At the same time, the temperature sensor continuously detects the built-in temperature data for the processor to judge. When the processor detects that the real-time temperature data is in an over-temperature state or a too-low temperature state, the function of intelligently and adaptively adjusting the drying temperature of the wafer by the wafer debonding and stripping machine to improve energy utilization is realized;

[0021] S2. The function of the L-shaped frame is to provide support for the No. 1 magnetic head. When the fan is started, the wind is filtered through the filter and then enters the wind receiving head. The wind is transported to the nozzle by the air duct. At the same time, the heating ring is started to heat the wind. After the wind is heated, it is sprayed to the surface of the cleaned wafer through the nozzle to make it dry quickly. The handle is pulled to move the filter, and the filter moves to move away from the No. 1 magnetic head. At this time, the filter pulls out the No. 1 support to facilitate cleaning, realizing the function of quickly drying the surface of the cleaned wafer by the wafer debonding and stripping machine to improve work efficiency.

[0022] S3. The inner wall of the collection box is provided with cleaning liquid. After the wafer is debonded, it is placed in the cleaning chamber and supported and adsorbed by pillars. The pillars are vacuum adsorption pillars. At this time, the water pump is started to suck the cleaning liquid into the No. 5 water pipe, and the water spray head is sprayed on the surface of the wafer to quickly clean it. The cleaning liquid after cleaning enters the No. 6 water pipe through the diversion effect of the guide block, and the cleaning liquid enters the collection box through the No. 6 water pipe. The cleaning liquid after cleaning passes through the dust filter net to filter the impurities in it. The filtered cleaning liquid falls to the bottom of the collection box for recycling. Pull the pull ring to make its slot remove the No. 6 magnetic block. The slot is made of iron. At this time, the movement of the pull ring drives the movement of the dust filter net. The movement of the dust filter net makes it move out of the collection box to facilitate the cleaning of stains, thereby realizing the function of recycling the cleaning liquid of the wafer debonding and stripping machine and reducing waste;

[0023] S4. The support rod moves through port No. 7. After the wafer is placed on the top of the vacuum suction cup, the cylinder starts to drive the support rod to move. The movement of the support rod drives the sliding sleeve to move through the support of the support rod. The movement of the sliding sleeve causes the support rod to drive the spring to move. The movement of the spring causes the support rod to drive the clamping head to move. The movement of the clamping head clamps the wafer, thereby preventing the wafer from shaking during debonding and peeling and improving the peeling accuracy.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] 1. The present invention is installed with a processor, when the processor detects that the temperature is too high, the processor controls the power of the heating ring to be reduced, and the temperature sensor continuously detects the built-in temperature data for the processor to make a judgment, when the processor detects that the real-time temperature data is in a normal temperature state, the processor controls the heating ring to maintain the current power, when the processor detects that the temperature is too low, the processor controls the power of the heating ring to be increased, and the temperature sensor continuously detects the built-in temperature data for the processor to make a judgment, when the processor detects that the real-time temperature data is in a normal temperature state, the processor controls the heating ring to maintain the current power, when the processor detects that the temperature is normal, the processor controls the power of the heating ring to be maintained, and the temperature sensor continuously detects the built-in temperature data for the processor to make a judgment, when the processor detects that the real-time temperature data is in an over-temperature state or an over-temperature state, the function of intelligently and adaptively adjusting the drying temperature of the wafer debonding and stripping machine to improve energy utilization is realized;

[0026] 2. The present invention provides support for the No. 1 magnetic head by installing an L-shaped frame. When the fan is started, the wind is filtered through the filter and then enters the wind receiving head. The wind is transported to the nozzle by the air duct. At the same time, the heating ring is started to heat the wind. After the wind is heated, it is sprayed to the surface of the cleaned wafer through the nozzle to make it dry quickly. The handle is pulled to drive the filter to move. The filter moves to move away from the No. 1 magnetic head. At this time, the filter pulls out the No. 1 support to facilitate cleaning, thereby realizing the function of quickly drying the surface of the cleaned wafer by the wafer debonding and stripping machine to improve work efficiency.

[0027] 3. The present invention is provided with a cleaning liquid on the inner wall of a collection box, and the wafer is placed in a cleaning chamber after debonding, and supported and adsorbed by a pillar, which is a vacuum adsorption column. At this time, the water pump is started to suck the cleaning liquid into the No. 5 water pipe, and the water spray head is sprayed on the surface of the wafer to quickly clean it. The cleaning liquid after cleaning enters the No. 6 water pipe through the diversion effect of the guide block, and the cleaning liquid enters the collection box through the No. 6 water pipe. The cleaning liquid after cleaning is filtered through the dust filter net. The filtered cleaning liquid falls into the bottom of the collection box for recycling. The pull ring is pulled to make its slot move away from the No. 6 magnetic block. The slot is made of iron. At this time, the pull ring moves to drive the dust filter net to move, and the dust filter net moves to move out of the collection box to facilitate the cleaning of stains, thereby realizing the function of recycling the cleaning liquid of the wafer debonding and stripping machine and reducing waste;

[0028] 4. The present invention is equipped with a support rod which is moved through the No. 7 port. After the wafer is placed on the top of the vacuum suction cup, the cylinder is started to drive the support rod to move. The movement of the support rod drives the sliding sleeve to move through the support of the support rod. The movement of the sliding sleeve causes the support rod to drive the spring to move. The movement of the spring causes the support rod to drive the clamping head to move. The movement of the clamping head clamps the wafer, thereby preventing the wafer from shaking during debonding and peeling and improving the peeling accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a front view structural schematic diagram of the present invention;

[0030] Figure 2 It is a front structural schematic diagram of the present invention;

[0031] Figure 3 For the present invention Figure 2 Schematic diagram of the B structure;

[0032] Figure 4 It is a schematic diagram of the structure of the nozzle of the present invention;

[0033] Figure 5 For the present invention Figure 4 Schematic diagram of the C structure;

[0034] Figure 6 It is a schematic diagram of the temperature control process of the present invention;

[0035] Figure 7 It is a front view structural schematic diagram of the present invention;

[0036] Figure 8 It is a schematic diagram of the structure of the clamp head of the present invention;

[0037] Fig. 9 For the present invention Figure 8 Schematic diagram of the A structure.

[0038] In the figure: 1, shell; 3, machine door; 4, vacuum suction cup; 5, suction groove; 7, laser stripping head; 9, guide box; 10, moving rod; 11, No. 9 mouth; 12, connecting block; 13, servo motor; 14, suction head; 15, cylinder; 16, support rod; 17, sliding sleeve; 18, No. 7 mouth; 19, support rod; 20, spring; 21, clamp; 25, No. 1 support platform; 26, cleaning chamber; 27, pillar; 28, guide block ; 29. ​​Collection box; 30. Water pump; 31. Water pipe No. 5; 32. Sprinkler head; 33. Water pipe No. 6; 34. Pull ring; 35. Card slot; 36. Magnetic block No. 6; 37. Groove; 38. Temperature sensor; 39. Fan; 40. Air duct; 41. Heating ring; 42. Sprinkler head; 43. Air collecting head; 44. Filter; 45. Handle; 46. L-shaped frame; 47. Magnetic head No. 1; 48. Port No. 2; 49. Processor. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] Example 1: Please refer to Figure 1 , Figure 2 , Figure 4 , Figure 6 and Figure 7An embodiment of the present invention is as follows: an intelligent self-adjusting wafer debonding and stripping machine comprises a shell 1, a first support 25, a laser stripping head 7 and a temperature intelligent adjustment module. The inner wall of the shell 1 is provided with a first support 25, the inner wall of the shell 1 is provided with a laser stripping head 7, the inner wall of the first support 25 is provided with a temperature intelligent adjustment module, a cleaning chamber 26 is provided on the top of the first support 25, a drying component is provided on the inner wall of the first support 25, and the drying component is used for rapid drying of wafers. A vacuum suction cup 4 is provided on the inner wall of the shell 1, a suction groove 5 is provided on the top of the vacuum suction cup 4, a wafer fixing component is provided on the inner wall of the vacuum suction cup 4, and the wafer fixing component is used for stable fixation of wafers. A recovery component is provided on the inner wall of the shell 1, and the recovery component is used for For collecting the cleaning liquid, a guide box 9 is installed on the inner wall of the shell 1, and a No. 9 port 11 is provided on the outer wall of the guide box 9. A connecting block 12 is installed through the inner wall of the No. 9 port 11, and a moving rod 10 is installed on the inner wall of the guide box 9, and the output end of the moving rod 10 is connected to the outer wall of the connecting block 12, and a servo motor 13 is installed through the inner wall of the connecting block 12, and a suction head 14 is installed on the output end of the servo motor 13. An organic door 3 is installed on the outer wall of the shell 1, and the wafer to be debonded is placed on the surface of the vacuum suction cup 4, and the laser stripping head 7 is started to remove the bonding material. At this time, the moving rod 10 moves to drive the connecting block 12 to move, and the movement of the connecting block 12 drives the servo motor 13 to move, and the movement of the servo motor 13 drives the suction head 14 to move to a suitable position, and at this time, the servo motor 13 rotates After the suction head 14 is driven to rotate to a suitable position, the moving rod 10 is pressed down to adsorb the top of the wafer through the suction head 14, and the wafer cover is sucked out to complete the wafer debonding. The temperature intelligent adjustment module includes a heating ring 41, a processor 49, and a temperature sensor 38. The processor 49 is located on the inner wall of the No. 1 support 25, and the temperature sensor 38 is located on the inner wall of the cleaning chamber 26. A fan 39 is installed on the inner wall of the No. 1 support 25, and an air duct 40 is installed on the output end of the fan 39. The heating ring 41 is located on the outer wall of the air duct 40. The heating ring 41 is electrically connected to the processor 49, and the temperature sensor 38 is electrically connected to the processor 49. The processor 49 has built-in temperature data. The temperature sensor 38 is used to detect real-time temperature data of hot air, and the real-time temperature data is transmitted to the processor 49. The processor 49 compares the real-time temperature data with the built-in temperature data. If the comparison result of the real-time temperature data with the built-in temperature data is greater than the built-in temperature data, it is set to be in an over-temperature state. If the comparison result of the real-time temperature data with the built-in temperature data is less than the built-in temperature data, it is set to be in an over-temperature state. If the comparison result of the real-time temperature data with the built-in temperature data is within the range of the built-in temperature data, it is set to be in a normal temperature state. When the processor 49 detects that the temperature is in an over-temperature state, the processor 49 controls the power of the heating ring 41 to reduce. At the same time, the temperature sensor 38 continuously detects the built-in temperature data and the processor 49 makes a judgment. When the processor 49 detects that the real-time temperature data is in a normal temperature state, the processor 49 controls the heating ring 41 to maintain the current power.When the processor 49 detects that the temperature is too low, the processor 49 controls the power of the heating ring 41 to increase. At the same time, the temperature sensor 38 continuously detects the built-in temperature data and the processor 49 makes a judgment. When the processor 49 detects that the real-time temperature data is in a normal temperature state, the processor 49 controls the heating ring 41 to maintain the current power. When the processor 49 detects that the temperature is normal, the processor 49 controls the power of the heating ring 41 to maintain. At the same time, the temperature sensor 38 continuously detects the built-in temperature data and the processor 49 makes a judgment. When the processor 49 detects that the real-time temperature data is in an over-temperature state or a too-low temperature state, the function of intelligently and adaptively adjusting the drying temperature of the wafer debonding and stripping machine to improve the energy utilization filter is realized.

[0043] Example 2: Please refer to Figure 1 , Figure 2 and Figure 3 , an embodiment provided by the present invention: a drying component includes an air collecting head 43, a nozzle 42, a No. 2 port 48, a filter 44, and an L-shaped frame 46. The air collecting head 43 is located at the input end of the fan 39, the nozzle 42 penetrates the outer wall of the air duct 40, the No. 2 port 48 is opened on the outer wall of the No. 1 support 25, the L-shaped frame 46 is located on the inner wall of the No. 1 support 25, the outer wall of the L-shaped frame 46 is installed with a No. 1 magnetic head 47, the filter 44 is located on the inner wall of the No. 2 port 48, the outer wall of the filter 44 is installed with a pull handle 45, the filter 44 is made of iron, the outer wall of the filter 44 is connected to the outer wall of the No. 1 magnetic head 47, the nozzle 42 is located on one side of the temperature sensor 38, and the filter The net 44 moves through the No. 2 opening 48, and the function of the L-shaped frame 46 is to provide support for the No. 1 magnetic head 47. The fan 39 is started to filter the wind through the filter 44 and then enter the wind collecting head 43. The wind is transported to the nozzle 42 by the air duct 40. At the same time, the heating ring 41 is started to heat the wind. After the wind is heated, it is sprayed onto the surface of the cleaned wafer through the nozzle 42 to make it dry quickly. The handle 45 is pulled to drive the filter 44 to move, and the filter 44 moves to remove the No. 1 magnetic head 47. At this time, the filter 44 pulls out the No. 1 support 25 to facilitate cleaning, thereby realizing the function of quickly drying the surface of the wafer after cleaning by the wafer debonding and stripping machine to improve work efficiency.

[0044] Example 3: Please refer to Figure 1 , Figure 4 and Figure 5The present invention provides an embodiment: the recycling assembly includes a collection box 29, a water pump 30, a No. 5 water pipe 31, a water spray head 32, a dust filter, and a pull ring 34. The collection box 29 is located on the inner wall of the shell 1, the water pump 30 runs through the outer wall of the collection box 29, one end of the No. 5 water pipe 31 is connected to the output end of the water pump 30, the water spray head 32 runs through the outer wall of the No. 5 water pipe 31, and the top of the No. 1 support 25 is provided with a cleaning chamber 26, and the inner wall of the cleaning chamber 26 is installed with a support 27. A guide block 28 is installed on the inner wall of the cleaning chamber 26, a No. 6 water pipe 33 is installed through the outer wall of the cleaning chamber 26, and one end of the No. 6 water pipe 33 penetrates the inner wall of the collecting box 29, the dust filter penetrates the inner wall of the collecting box 29, the pull ring 34 is located on the outer wall of the dust filter, the outer wall of the collecting box 29 is provided with a groove 37, the outer wall of the pull ring 34 is provided with a card slot 35, the inner wall of the groove 37 is installed with a No. 6 magnetic block 36, the No. 6 magnetic block 36 extends to the inner wall of the card slot 35, and the pull ring 34 can pull the dust filter The collection box 29 is moved out, and the water spray head 32 is located above the cleaning chamber 26. The inner wall of the collection box 29 is provided with cleaning liquid. After the wafer is debonded, it is placed in the cleaning chamber 26 and supported and adsorbed by the pillar 27. The pillar 27 is a vacuum adsorption column. At this time, the water pump 30 is started to suck the cleaning liquid into the No. 5 water pipe 31, and the water spray head 32 is sprayed on the surface of the wafer to quickly clean it. The cleaning liquid after cleaning enters the No. 6 water pipe 33 through the diversion effect of the guide block 28, and the cleaning liquid enters the collection box 29 through the No. 6 water pipe 33. The cleaning liquid after cleaning passes through the dust filter net to filter the impurities therein, and the filtered cleaning liquid falls into the bottom of the collection box 29 for recycling. Pull the pull ring 34 to make its card slot 35 move away the No. 6 magnetic block 36. The card slot 35 is made of iron. At this time, the pull ring 34 moves to drive the dust filter net to move, and the dust filter net moves to move it out of the collection box 29 for easy cleaning of stains, thereby realizing the function of recycling the cleaning liquid of the wafer debonding and stripping machine to reduce waste.

[0045] Example 4: Please refer to Figure 1 , Figure 7 , Figure 8 and Fig. 9The present invention provides an embodiment: a wafer fixing assembly includes a cylinder 15, a support rod 16, a sleeve 17, a spring 20, a No. 7 port 18, and a clamp 21. The cylinder 15 is located on the inner wall of the vacuum suction cup 4, the support rod 16 is located on the inner wall of the vacuum suction cup 4, the sleeve 17 is located on the outer wall of the support rod 16, a support rod 19 is installed on the outer wall of the sleeve 17, the spring 20 is located on the outer wall of the support rod 19, the output end of the cylinder 15 and the outer wall of the support rod 19, the No. 7 port 18 is opened at the top of the vacuum suction cup 4, and one end of the support rod 19 passes through the No. 7 port 18. It extends to the top of the vacuum suction cup 4, and a clamping head 21 is installed on the outer wall of the support rod 19. The support rod 19 moves through the No. 7 port 18. After the wafer is placed on the top of the vacuum suction cup 4, the cylinder 15 is started to drive the support rod 19 to move. The movement of the support rod 19 drives the sliding sleeve 17 to move through the support of the support rod 16. The movement of the sliding sleeve 17 causes the support rod 19 to drive the spring 20 to move. The movement of the spring 20 causes the support rod 19 to drive the clamping head 21 to move. The movement of the clamping head 21 clamps the wafer, thereby preventing the wafer from shaking during debonding and peeling and improving the peeling accuracy.

[0046] The working steps of the stripping machine are as follows:

[0047] S1. When the processor 49 detects that the temperature is too high, the processor 49 controls the power of the heating ring 41 to be reduced. At the same time, the temperature sensor 38 continuously detects the built-in temperature data and the processor 49 makes a judgment. When the processor 49 detects that the real-time temperature data is in a normal temperature state, the processor 49 controls the heating ring 41 to maintain the current power. When the processor 49 detects that the temperature is too low, the processor 49 controls the power of the heating ring 41 to be increased. At the same time, the temperature sensor 38 continuously detects the built-in temperature data and the processor 49 makes a judgment. When the processor 49 detects that the real-time temperature data is in a normal temperature state, the processor 49 controls the heating ring 41 to maintain the current power. When the processor 49 detects that the temperature is normal, the processor 49 controls the power of the heating ring 41 to be maintained. At the same time, the temperature sensor 38 continuously detects the built-in temperature data and the processor 49 makes a judgment. When the processor 49 detects that the real-time temperature data is in an over-temperature state or a too-low temperature state, the function of intelligently and adaptively adjusting the drying temperature of the wafer by the wafer debonding and stripping machine to improve energy utilization is realized.

[0048] S2, the L-shaped frame 46 is used to provide support for the No. 1 magnetic head 47. The fan 39 is started to filter the wind through the filter 44 and then enter the wind receiving head 43. The wind is transported to the nozzle 42 by the air duct 40. At the same time, the heating ring 41 is started to heat the wind. After the wind is heated, it is sprayed to the surface of the cleaned wafer through the nozzle 42 to make it dry quickly. The handle 45 is pulled to move the filter 44. The filter 44 moves to remove the No. 1 magnetic head 47. At this time, the filter 44 pulls out the No. 1 support 25 to facilitate cleaning, realizing the function of quickly drying the surface of the cleaned wafer by the wafer debonding and stripping machine to improve work efficiency.

[0049] S3. The inner wall of the collection box 29 is provided with cleaning liquid. After the wafer is debonded, it is placed in the cleaning chamber 26 and supported and adsorbed by the pillar 27. The pillar 27 is a vacuum adsorption column. At this time, the water pump 30 is started to suck the cleaning liquid into the No. 5 water pipe 31, and the water spray head 32 is sprayed on the surface of the wafer to quickly clean it. The cleaning liquid after cleaning enters the No. 6 water pipe 33 through the diversion effect of the guide block 28, and the cleaning liquid enters the collection box 29 through the No. 6 water pipe 33. The cleaning liquid after cleaning is filtered through the dust filter net. The filtered cleaning liquid falls into the bottom of the collection box 29 for recycling. Pull the pull ring 34 to make its card slot 35 move away the No. 6 magnetic block 36. The card slot 35 is made of iron. At this time, the pull ring 34 moves to drive the dust filter net to move. The dust filter net moves to move out of the collection box 29 to facilitate the cleaning of stains, thereby realizing the function of recycling the cleaning liquid of the wafer debonding and stripping machine and reducing waste.

[0050] S4, the support rod 19 moves through the No. 7 port 18. After the wafer is placed on the top of the vacuum suction cup 4, the cylinder 15 starts to drive the support rod 19 to move. The movement of the support rod 19 drives the sliding sleeve 17 to move through the support of the support rod 16. The movement of the sliding sleeve 17 causes the support rod 19 to drive the spring 20 to move. The movement of the spring 20 causes the support rod 19 to drive the clamping head 21 to move. The clamping head 21 moves to clamp the wafer, thereby preventing the wafer from shaking during debonding and peeling and improving the peeling accuracy.

[0051] Working principle: Place the wafer to be debonded on the surface of the vacuum suction cup 4, and start the laser stripping head 7 to remove the bonding material. At this time, the moving rod 10 moves to drive the connecting block 12 to move, and the movement of the connecting block 12 drives the servo motor 13 to move, and the movement of the servo motor 13 drives the suction head 14 to move to a suitable position. At this time, the servo motor 13 rotates to drive the suction head 14 to rotate to a suitable position, and then the moving rod 10 is pressed down to adsorb the top of the wafer through the suction head 14, and the wafer cover is sucked out to complete the wafer debonding. When the processor 49 detects that the temperature is too high, the processor 49 controls the power of the heating ring 41 to reduce, and at the same time, the temperature sensor 38 continuously detects the built-in temperature data and the processor 49 judges it. When the processor 49 detects that the real-time temperature data is in a normal temperature state , the processor 49 controls the heating ring 41 to maintain the current power. When the processor 49 detects that the temperature is too low, the processor 49 controls the power of the heating ring 41 to increase. At the same time, the temperature sensor 38 continuously detects the built-in temperature data for the processor 49 to judge. When the processor 49 detects that the real-time temperature data is in a normal temperature state, the processor 49 controls the heating ring 41 to maintain the current power. When the processor 49 detects that the temperature is normal, the processor 49 controls the power of the heating ring 41 to maintain. At the same time, the temperature sensor 38 continuously detects the built-in temperature data for the processor 49 to judge. When the processor 49 detects that the real-time temperature data is in an over-temperature state or an over-temperature state, the intelligent adaptive adjustment of the wafer debonding and stripping machine to the wafer is realized. The drying temperature improves the energy utilization filtering function. The function of the L-shaped frame 46 is to provide support for the No. 1 magnetic head 47. The fan 39 is started to filter the wind through the filter 44 and then enter the wind collecting head 43. The wind is transported to the nozzle 42 by the air duct 40. At the same time, the heating ring 41 is started to heat the wind. After the wind is heated, it is sprayed to the surface of the cleaned wafer through the nozzle 42 to make it dry quickly. The handle 45 is pulled to drive the filter 44 to move. The filter 44 moves to remove the No. 1 magnetic head 47. At this time, the filter 44 pulls out the No. 1 support 25 to facilitate cleaning, realizing the function of quickly drying the surface of the wafer after cleaning by the wafer debonding stripping machine to improve work efficiency. The inner wall of the collection box 29 is provided with cleaning liquid. The wafer is placed in the cleaning chamber 26 after debonding, and is cleaned by the support 27 Support adsorption, support column 27 is a vacuum adsorption column, at this time, the water pump 30 is started to suck the cleaning liquid into the No. 5 water pipe 31, and the water spray head 32 is sprayed on the surface of the wafer to make it clean quickly, and the cleaning liquid after cleaning enters the No. 6 water pipe 33 through the diversion effect of the guide block 28, and the cleaning liquid enters the collection box 29 through the No. 6 water pipe 33, and the cleaning liquid after cleaning is filtered through the dust filter net. The filtered cleaning liquid falls into the bottom of the collection box 29 for recycling, and the pull ring 34 is pulled to make its slot 35 move away from the No. 6 magnetic block 36, and the slot 35 is made of iron. At this time, the movement of the pull ring 34 drives the movement of the dust filter net, and the movement of the dust filter net makes it move out of the collection box 29 to facilitate the cleaning of stains, thereby realizing the function of recycling the cleaning liquid of the wafer debonding and stripping machine to reduce waste.The support rod 19 moves through the No. 7 opening 18. After the wafer is placed on the top of the vacuum suction cup 4, the cylinder 15 starts to drive the support rod 19 to move. The movement of the support rod 19 drives the sliding sleeve 17 to move through the support of the support rod 16. The movement of the sliding sleeve 17 causes the support rod 19 to drive the spring 20 to move. The movement of the spring 20 causes the support rod 19 to drive the clamping head 21 to move. The clamping head 21 moves to clamp the wafer, thereby preventing the wafer from shaking during debonding and peeling and improving the peeling accuracy.

[0052] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. An intelligent self-adjusting wafer debonding and stripping machine, comprising a housing (1), a first support (25), a laser stripping head (7) and a temperature intelligent adjustment module, characterized in that: A first support platform (25) is installed on the inner wall of the shell (1), a laser stripping head (7) is installed on the inner wall of the shell (1), a temperature intelligent adjustment module is installed on the inner wall of the first support platform (25), a cleaning chamber (26) is provided on the top of the first support platform (25), and a drying component is installed on the inner wall of the first support platform (25), and the drying component is used for rapid drying of wafers; The temperature intelligent adjustment module comprises a heating ring (41), a processor (49), and a temperature sensor (38); the processor (49) is located on the inner wall of the No. 1 support (25); the temperature sensor (38) is located on the inner wall of the cleaning chamber (26); a fan (39) is installed on the inner wall of the No. 1 support (25); an air duct (40) is installed at the output end of the fan (39); the heating ring (41) is located on the outer wall of the air duct (40); the heating ring (41) is electrically connected to the processor (49); the temperature sensor (38) is electrically connected to the processor (49); the processor (49) has built-in temperature data; and the temperature sensor (38) is used to detect real-time temperature data of hot air; When the processor (49) detects that the temperature is too high, the processor (49) controls the power of the heating ring (41) to be reduced, and the temperature sensor (38) continuously detects the built-in temperature data, and the processor (49) makes a judgment; when the processor (49) detects that the real-time temperature data is in a normal temperature state, the processor (49) controls the heating ring to maintain the current power; when the processor (49) detects that the temperature is too low, the processor (49) controls the power of the heating ring (41) to be increased, and the temperature sensor (38) continuously detects the built-in temperature data, and the processor (49) makes a judgment Judgment; when the processor (49) detects that the real-time temperature data is in a normal temperature state, the processor (49) controls the heating ring (41) to maintain the current power; when the processor (49) detects that the temperature is in a normal temperature state, the processor (49) controls the power of the heating ring (41) to maintain, and at the same time the temperature sensor (38) continuously detects the built-in temperature data for the processor (49) to make a judgment; when the processor (49) detects that the real-time temperature data is in an over-temperature state or an over-temperature state, the function of intelligently and adaptively adjusting the drying temperature of the wafer by the wafer debonding and stripping machine to improve energy utilization is realized.

2. The intelligent self-adjusting wafer debonding and stripping machine according to claim 1, characterized in that: The real-time temperature data is transmitted to the processor (49), and the processor (49) compares the real-time temperature data with the built-in temperature data. If the result of the comparison between the real-time temperature data and the built-in temperature data is greater than the built-in temperature data, the temperature is set to be too high. If the result of the comparison between the real-time temperature data and the built-in temperature data is less than the built-in temperature data, the temperature is set to be too low. If the result of the comparison between the real-time temperature data and the built-in temperature data is within the range of the built-in temperature data, the temperature is set to be normal.

3. The intelligent self-adjusting wafer debonding and stripping machine according to claim 1, characterized in that: The drying component comprises an air collecting head (43), a nozzle (42), a No. 2 port (48), a filter (44), and an L-shaped frame (46). The air collecting head (43) is located at the input end of the fan (39), the nozzle (42) penetrates the outer wall of the air duct (40), the No. 2 port (48) is opened on the outer wall of the No. 1 support (25), the L-shaped frame (46) is located on the inner wall of the No. 1 support (25), the outer wall of the L-shaped frame (46) is equipped with a No. 1 magnetic head (47), the filter (44) is located on the inner wall of the No. 2 port (48), and the outer wall of the filter (44) is equipped with a handle (45).

4. The intelligent self-adjusting wafer debonding and stripping machine according to claim 3, characterized in that: The filter screen (44) is made of iron, and the outer wall of the filter screen (44) is connected to the outer wall of the first magnetic head (47). The nozzle (42) is located on one side of the temperature sensor (38), and the filter screen (44) moves through the second port (48).

5. The intelligent self-adjusting wafer debonding and stripping machine according to claim 1, characterized in that: A vacuum suction cup (4) is installed on the inner wall of the shell (1), a suction groove (5) is provided on the top of the vacuum suction cup (4), a wafer fixing component is installed on the inner wall of the vacuum suction cup (4), the wafer fixing component is used for stably fixing the wafer, and a recovery component is installed on the inner wall of the shell (1), the recovery component is used for collecting cleaning liquid.

6. The intelligent self-adjusting wafer debonding and stripping machine according to claim 5, characterized in that: The recycling assembly comprises a collection box (29), a water pump (30), a No. 5 water pipe (31), a water spray head (32), a dust filter, and a pull ring (34); the collection box (29) is located on the inner wall of the housing (1); the water pump (30) penetrates the outer wall of the collection box (29); one end of the No. 5 water pipe (31) is connected to the output end of the water pump (30); the water spray head (32) penetrates the outer wall of the No. 5 water pipe (31); a cleaning chamber (26) is provided on the top of the No. 1 support (25); and a dust filter is installed on the inner wall of the cleaning chamber (26). A support (27) is provided, a guide block (28) is installed on the inner wall of the cleaning chamber (26), a No. 6 water pipe (33) is installed through the outer wall of the cleaning chamber (26), and one end of the No. 6 water pipe (33) is penetrated to the inner wall of the collection box (29), the dust filter is penetrated through the inner wall of the collection box (29), the pull ring (34) is located on the outer wall of the dust filter, the outer wall of the collection box (29) is provided with a groove (37), the outer wall of the pull ring (34) is provided with a card slot (35), and the inner wall of the groove (37) is installed with a No. 6 magnetic block (36).

7. The intelligent self-adjusting wafer debonding and stripping machine according to claim 6, characterized in that: The sixth magnetic block (36) extends to the inner wall of the slot (35); the pull ring (34) can pull the dust filter out of the collection box (29); and the water spray head (32) is located above the cleaning chamber (26).

8. The intelligent self-adjusting wafer debonding and stripping machine according to claim 5, characterized in that: The wafer fixing assembly comprises a cylinder (15), a support rod (16), a sliding sleeve (17), a spring (20), a No. 7 port (18), and a clamp (21); the cylinder (15) is located on the inner wall of the vacuum suction cup (4); the support rod (16) is located on the inner wall of the vacuum suction cup (4); the sliding sleeve (17) is located on the outer wall of the support rod (16); a support rod (19) is installed on the outer wall of the sliding sleeve (17); the spring (20) is located on the outer wall of the support rod (19); the output end of the cylinder (15) and the outer wall of the support rod (19); the No. 7 port (18) is opened at the top of the vacuum suction cup (4); one end of the support rod (19) extends to the top of the vacuum suction cup (4) through the No. 7 port (18); and the clamp (21) is installed on the outer wall of the support rod (19).

9. The intelligent self-adjusting wafer debonding and stripping machine according to claim 1, characterized in that: A guide box (9) is installed on the inner wall of the shell (1), a No. 9 opening (11) is provided on the outer wall of the guide box (9), a connecting block (12) is installed through the inner wall of the No. 9 opening (11), a moving rod (10) is installed on the inner wall of the guide box (9), and the output end of the moving rod (10) is connected to the outer wall of the connecting block (12), a servo motor (13) is installed through the inner wall of the connecting block (12), a suction head (14) is installed on the output end of the servo motor (13), and a machine door (3) is installed on the outer wall of the shell (1).

10. A method for using an intelligent self-adjusting wafer debonding and stripping machine according to any one of claims 1 to 9, characterized in that: The working steps of the stripping machine are as follows: S1. When the processor (49) detects that the temperature is too high, the processor (49) controls the power of the heating ring (41) to be reduced, and the temperature sensor (38) continuously detects the built-in temperature data for the processor (49) to make a judgment; when the processor (49) detects that the real-time temperature data is in a normal temperature state, the processor (49) controls the heating ring (41) to maintain the current power; when the processor (49) detects that the temperature is too low, the processor (49) controls the power of the heating ring (41) to be increased, and the temperature sensor (38) continuously detects the built-in temperature data for the processor (49) to make a judgment; ) for judgment; when the processor (49) detects that the real-time temperature data is in a normal temperature state, the processor (49) controls the heating ring (41) to maintain the current power; when the processor (49) detects that the temperature is in a normal temperature state, the processor (49) controls the power of the heating ring (41) to maintain, and at the same time the temperature sensor (38) continuously detects the built-in temperature data for judgment by the processor (49); when the processor (49) detects that the real-time temperature data is in an over-high temperature state or an over-low temperature state, the function of intelligently and adaptively adjusting the drying temperature of the wafer by the wafer debonding and stripping machine to improve energy utilization is realized; S2, the L-shaped frame (46) is used to provide support for the No. 1 magnetic head (47). The fan (39) is started to filter the wind through the filter (44) and then enter the wind receiving head (43). The wind is then transported to the nozzle (42) by the air duct (40). At the same time, the heating ring (41) is started to heat the wind. After the wind is heated, it is sprayed onto the surface of the cleaned wafer through the nozzle (42) to quickly dry it. The handle (45) is pulled to drive the filter (44) to move. The filter (44) moves to remove the No. 1 magnetic head (47). At this time, the filter (44) pulls out the No. 1 support (25) to facilitate cleaning, thereby realizing the function of quickly drying the surface of the cleaned wafer by the wafer debonding and stripping machine to improve work efficiency. S3. The inner wall of the collection box (29) is provided with cleaning liquid. After the wafer is debonded, it is placed in the cleaning chamber (26) and supported and adsorbed by the support (27). The support (27) is a vacuum adsorption column. At this time, the water pump (30) is started to suck the cleaning liquid into the No. 5 water pipe (31). The water spray head (32) sprays it on the surface of the wafer to quickly clean it. The cleaning liquid after cleaning enters the No. 6 water pipe (33) through the diversion effect of the guide block (28). The cleaning liquid enters the No. 6 water pipe (33) through the No. 6 water pipe (33). The cleaning liquid is filtered through a dust filter net to filter impurities therein, and the filtered cleaning liquid falls into the bottom of the collection box (29) for recycling. The pull ring (34) is pulled to remove the sixth magnetic block (36) through the card slot (35), and the card slot (35) is made of iron. At this time, the pull ring (34) moves to drive the dust filter net to move, and the dust filter net moves to move out of the collection box (29) to facilitate the cleaning of stains, thereby realizing the function of recycling the cleaning liquid of the wafer debonding and stripping machine and reducing waste. S4, the support rod (19) moves through the seventh opening (18), and after the wafer is placed on the top of the vacuum suction cup (4), the cylinder (15) is started to drive the support rod (19) to move, and the movement of the support rod (19) drives the sliding sleeve (17) to move through the support of the support rod (16), and the movement of the sliding sleeve (17) causes the support rod (19) to drive the spring (20) to move, and the movement of the spring (20) causes the support rod (19) to drive the clamping head (21) to move, and the clamping head (21) moves to clamp the wafer, thereby preventing the wafer from shaking during debonding and peeling, and improving the peeling accuracy.

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