Wafer clamping mechanism for a rotary head die bonder

Abstract

The application discloses a wafer clamping mechanism for a turret type die bonding device, which comprises a base plate (40), a lifting assembly (60) and a supporting ring (80). The lifting assembly (60) comprises a lifting ring (61) and a second motor (62), the second motor (62) is fixedly arranged at one end of the base plate (40), the lifting ring (61) of the lifting assembly (60) is arranged on the front surface of the base plate (40), and the lifting ring (61) can move up and down relative to the base plate (40) under the drive of the second motor (62). The supporting ring (80) is in the shape of a cylinder as a whole. The supporting ring (80) is located on the inner side of the lifting ring (61) along the radial direction. The supporting ring (80) is connected with the base plate (40), and the supporting ring (80) cannot move up and down relative to the base plate (40). The wafer clamping mechanism can realize the up-and-down movement and rotation of the wafer, and can firmly fix the flexible wafer by clamping along the edge and expanding the wafer.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip processing and packaging, and more particularly to a wafer clamping mechanism for a turret-type die bonding device. Background Technology

[0002] A die bonder, also known as a chip mounter, is the most critical and essential piece of equipment in the die attach stage of the chip packaging and testing process. The die bonder picks the chip from the diced wafer and places it on the corresponding die flag on the lead frame, then uses epoxy resin to bond the chip to the lead frame. The quality of the die bonder directly affects the yield and cost of chip packaging and testing, and consequently, subsequent processes such as wire bonding. In practical applications, the higher the required unit per hour (UPH) throughput for chip testing, the higher the requirements for the accuracy and speed of the die bonder in chip attaching. Therefore, the die bonder needs to meet both the accuracy and speed requirements of chip attaching to meet market demands.

[0003] For turret-type die bonders, a clamping mechanism is needed to hold the wafer in place so that the bonding head can quickly and accurately pick up the chip from the wafer. During the chip picking process, to ensure the bonding head and the chip are aligned correctly for each gripping action, the wafer's position cannot be fixed; on the contrary, the wafer's position needs to be constantly adjusted. This requires the clamping mechanism to be able to adjust the wafer's position. However, existing wafer clamping structures for turret-type die bonders fix the wafer horizontally, making it difficult to adjust the wafer's position during chip picking. Furthermore, the wafer carrying the chip has a certain degree of flexibility, which means the chip's position on the wafer is not fixed and is prone to change, further hindering the bonding head from quickly and accurately picking up the chip from the wafer.

[0004] For the reasons mentioned above, how to design and improve the wafer clamping mechanism for turret-type die bonding devices to achieve firm fixation and position adjustment of flexible wafers has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a wafer clamping mechanism for a turret-type die bonding device, which can realize the lifting, moving and rotating of the wafer, and can firmly fix the flexible wafer by expanding the wafer.

[0006] To solve the above-mentioned technical problems, the invention adopts the following technical solution:

[0007] A wafer clamping mechanism for a turret-type die bonding device is provided. The wafer clamping mechanism includes a substrate and a lifting assembly. The lifting assembly includes a lifting ring and a second motor. The second motor is fixedly disposed at one end of the substrate. The lifting ring of the lifting assembly is disposed on the front side of the substrate, and the lifting ring can move up and down relative to the substrate under the drive of the second motor.

[0008] Preferably, the lifting ring is circular in shape and includes a main ring body, several shoulders, several ears, and several second V-shaped rollers. All the shoulders are fixedly disposed on the outer circumferential surface of the main ring body, and all the shoulders protrude outward in the radial direction relative to the main ring body. Each shoulder has a fixed ear on its outer surface, and all the ears protrude outward relative to the shoulder. Each shoulder has a U-shaped groove on its end face away from the substrate, and a second V-shaped roller is disposed in each U-shaped groove. Each second V-shaped roller has a second V-shaped groove surrounding the roller body on its side.

[0009] More preferably, the lifting assembly further includes a second drive wheel, a fourth transmission wheel, a fifth transmission wheel, several guide wheels, two third guide rollers, a third annular belt, a fourth annular belt, and several lead screws; the number of guide wheels and lead screws are the same.

[0010] More preferably, the output shaft of the second motor is fixedly connected to the second drive wheel; the fourth transmission wheel is disposed on the front side of the substrate, and the fifth transmission wheel is disposed on the back side of the substrate. The fourth and fifth transmission wheels are respectively fixedly disposed at both ends of the same central axis, so that the fourth and fifth transmission wheels and their central axis can rotate synchronously relative to the substrate; the common central axis of the fourth and fifth transmission wheels is perpendicularly disposed on the substrate; all guide wheels and the two third guide rollers are disposed on the back side of the substrate, and the central axes of all guide wheels and the two third guide rollers are fixedly disposed on the substrate, and the extending direction of the central axes of all guide wheels and the two third guide rollers is perpendicular to the substrate; all guide wheels and the two third guide rollers can each rotate around their own central axis.

[0011] More preferably, the inner surface of the third annular belt is provided with teeth; the outer circumferential surfaces of the wheel bodies of the second drive wheel and the fourth transmission wheel are also provided with teeth; the inner surface of the third annular belt surrounds part of the outer circumferential surfaces of the second drive wheel and the fourth transmission wheel, and the teeth on the outer circumferential surfaces of the second drive wheel and the fourth transmission wheel can mesh with the teeth on the inner surface of the third annular belt. The third annular belt is tightened by the second drive wheel and the fourth transmission wheel, so that the output shaft of the second motor can drive the second drive wheel to rotate, and the second drive wheel drives the fourth transmission wheel to rotate by means of the third annular belt.

[0012] More preferably, the inner surface of the fourth annular belt is provided with teeth; the outer circumferential surfaces of the fifth drive wheel and all guide wheels are provided with teeth; the inner surface of the fourth annular belt surrounds a portion of the outer circumferential surfaces of the fifth drive wheel and all guide wheels, and the teeth on the outer circumferential surfaces of the fifth drive wheel and all guide wheels can mesh with the teeth on the inner surface of the fourth annular belt, so that the fifth drive wheel can drive all guide wheels to rotate by means of the fourth annular belt; the outer surface of the fourth annular belt surrounds a portion of the outer circumferential surfaces of the two third guide rollers, and the section of the fourth annular belt that wraps into each third guide roller is perpendicular to the section that wraps out of the third guide roller, so as to achieve a right-angle turn of the fourth annular belt at the third guide roller; the fourth annular belt is taut by the fifth drive wheel, all guide wheels, and the two third guide rollers.

[0013] More preferably, each lug is provided with a circular threaded hole; each guide wheel is fixedly connected to one end of a lead screw, and the other end of the lead screw passes through the front of the substrate; each lead screw passes into the threaded hole of a lug of the lifting ring, and the lead screw is threadedly connected to the lug.

[0014] More preferably, each lug of the lifting ring is provided with a circular through hole, and a ball nut is fixedly installed in each through hole; the lead screw is a ball screw; each lead screw passes into the through hole of one lug of the lifting ring, and the lead screw is threadedly connected to the ball nut.

[0015] More preferably, each of the convex shoulders is symmetrically arranged along the outer circumference of the main ring body and is evenly distributed; the lifting assembly includes four guide wheels and four lead screws; the lifting ring includes four convex shoulders, four convex ears, and four second V-shaped rollers; the center point of the fifth transmission wheel and the center points of the two third guide rollers form an isosceles triangle; the center points of the four guide wheels form a rectangle.

[0016] More preferably, the wafer clamping mechanism further includes a support ring, which is cylindrical in shape; the support ring is located inside the lifting ring in the radial direction; the support ring is connected to the substrate, and the support ring cannot move up or down relative to the substrate.

[0017] More preferably, the wafer clamping mechanism further includes a clamping assembly, which includes a bottom ring, a bushing, and two identical semi-rings; both the bottom ring and the bushing are circular; both semi-rings are fixedly connected to the bottom ring and are symmetrically arranged; a clamping gap is provided between the two semi-rings and the bottom ring along the thickness direction of the bottom ring, the size of the clamping gap matches the size of the bushing, and the bushing can be inserted into or pulled out of the clamping gap; the outer edge of the bottom ring is wedge-shaped and engages with the second V-shaped groove of the second V-shaped roller of the lifting ring.

[0018] More preferably, each semi-ring includes a semi-ring body portion, a first reinforcing rib portion, and a second reinforcing rib portion. The first reinforcing rib portion is located in the middle of the semi-ring body portion, and the second reinforcing rib portion is located at one end of the semi-ring body portion. Both the first and second reinforcing rib portions are fixedly connected to the semi-ring body portion and form a stacked structure. The inner edges of both the first and second reinforcing rib portions are straight, so that a straight thickness step is formed at the inner edges of each of the first and second reinforcing rib portions. The first and second reinforcing rib portions of each semi-ring are fixedly connected to the bottom ring body, and the two semi-rings are symmetrically arranged such that the inner edges of the first reinforcing rib portions of the two semi-rings are parallel to each other, and the inner edges of the second reinforcing rib portions of the two semi-rings are along the same straight line. A clamping gap is formed between the two semi-rings and the bottom ring body along the thickness direction.

[0019] More preferably, the edge of the bushing is provided with a first straight edge, a second straight edge, a third straight edge, and a fourth straight edge. The first straight edge and the second straight edge are symmetrically arranged and parallel to each other, the third straight edge and the fourth straight edge are symmetrically arranged and parallel to each other, and the first straight edge and the third straight edge are perpendicular to each other.

[0020] More preferably, the bushing is inserted into the clamping gap between the two semi-rings and the bottom ring. The first and second straight edges of the bushing abut against the inner edges of the first reinforcing ribs of the two semi-rings, respectively, and the third straight edge of the bushing abuts against the inner edges of the second reinforcing ribs of the two semi-rings. The fourth straight edge is used to receive the force applied to the bushing by the robot arm, which causes the bushing to be inserted into the clamping gap between the two semi-rings and the bottom ring. The bushing of the clamping assembly is used to attach the wafer.

[0021] More preferably, two grooves are symmetrically arranged on the bottom ring body, and two semi-ring bodies are respectively located on both sides of the two grooves. The grooves are used for the robot arm to pass through and grasp the bushing. An inclined surface is provided along the outer circumferential edge of the bottom ring body and on both sides of the opening of each groove. The inclined surface guides the robot arm used to grasp the bushing.

[0022] More preferably, the wafer clamping mechanism further includes a rotating assembly; the rotating assembly includes a rotating disk and a first motor; the first motor is fixedly disposed at one end of the substrate; the rotating disk is movably disposed on the front side of the substrate, and the rotating disk can rotate relative to the substrate under the drive of the first motor; the rotating disk is generally in the shape of a ring, and the rotating disk includes a ring body, a circumferential wall, and a flange; the ring body is in the shape of a ring; the circumferential wall is fixedly disposed at the outer edge of the ring body, the circumferential wall is perpendicular to the ring body, and teeth are fixedly disposed on the outer circumferential surface of the circumferential wall, and the extension direction of the teeth on the outer circumferential surface of the circumferential wall is perpendicular to the ring body; a flange is fixedly disposed on the inner circumferential surface of the circumferential wall, the flange protrudes inward relative to the circumferential wall, and the inner edge of the flange is wedge-shaped.

[0023] More preferably, a plurality of first V-shaped rollers are fixedly disposed on the front side of the substrate; each first V-shaped roller includes a roller body and a roller shaft; one end of the roller shaft of each first V-shaped roller is fixedly disposed on the substrate, and the extension direction of the roller shaft is perpendicular to the substrate; the roller body of each first V-shaped roller is sleeved on the roller shaft, so that the roller body of each first V-shaped roller can rotate around its own roller shaft; a first V-shaped groove is provided on the side of the roller body of each first V-shaped roller; all the first V-shaped rollers are evenly distributed along the flange of the rotating disk, and the inner edge of the flange engages in the first V-shaped groove of the roller body of each first V-shaped roller, so that the flange of the rotating disk can rotate relative to the first V-shaped roller in the first V-shaped groove of the roller body of each first V-shaped roller.

[0024] More preferably, the rotating assembly further includes a first drive wheel, a first transmission wheel, a second transmission wheel, a third transmission wheel, a first guide roller, a second guide roller, a first annular belt, and a second annular belt; the output shaft of the first motor is fixedly connected to the first drive wheel; the first transmission wheel, the second transmission wheel, the third transmission wheel, the first guide roller, and the second guide roller are all disposed on the front side of the substrate; the first transmission wheel and the second transmission wheel are respectively fixedly disposed at both ends of the same central axis, so that the first transmission wheel and the second transmission wheel and their central axis can rotate synchronously relative to the substrate; the central axis of the first transmission wheel is disposed on the substrate, and the extension direction of the central axis of the first transmission wheel is perpendicular to the substrate; the central axes of the third transmission wheel, the first guide roller, and the second guide roller are all fixedly disposed on the substrate, and the extension directions of the central axes of the third transmission wheel, the first guide roller, and the second guide roller are all perpendicular to the substrate; the third transmission wheel, the first guide roller, and the second guide roller can each rotate around their own central axis.

[0025] More preferably, the inner surface of the first annular belt is provided with teeth; the outer circumferential surfaces of the wheel bodies of the second and third transmission wheels are also provided with teeth; the inner surface of the first annular belt surrounds most of the outer circumferential surface of the circumferential wall of the rotating disk, and the teeth on the inner surface of the first annular belt can mesh with the teeth on the outer circumferential surface of the circumferential wall of the rotating disk; the inner surface of the first annular belt also surrounds a portion of the outer circumferential surfaces of the second and third transmission wheels, and the teeth on the outer circumferential surfaces of the second and third transmission wheels can mesh with the teeth on the inner surface of the first annular belt; the outer surface of the first annular belt surrounds a portion of the outer circumferential surface of the second guide roller, and the section of the first annular belt that wraps into the second guide roller forms an angle with the section that wraps out of the second guide roller, so as to realize the turning of the first annular belt at the second guide roller; the outer surface of the first annular belt is externally tangent to the first guide roller, and the first guide roller plays a limiting role for the first annular belt; the first annular belt is tensioned by the rotating disk, the second transmission wheel, the third transmission wheel, the first guide roller, and the second guide roller.

[0026] More preferably, the inner surface of the second annular belt is provided with teeth; the outer circumferential surfaces of the wheel bodies of the first drive wheel and the first transmission wheel are also provided with teeth; the inner surface of the second annular belt surrounds part of the outer circumferential surfaces of the first drive wheel and the first transmission wheel, and the teeth on the inner surface of the second annular belt can mesh with the teeth on the outer circumferential surfaces of the first drive wheel and the first transmission wheel. The second annular belt is tightened by the first drive wheel and the first transmission wheel, so that the output shaft of the first motor can drive the first drive wheel to rotate, and the first drive wheel drives the first transmission wheel to rotate by means of the second annular belt.

[0027] More preferably, the section of the first annular belt that wraps into the second drive wheel is perpendicular to the section that wraps out of the second drive wheel, so as to achieve a right-angle turn of the first annular belt at the second drive wheel; the section of the first annular belt that wraps into the third drive wheel is perpendicular to the section that wraps out of the third drive wheel, so as to achieve a right-angle turn of the first annular belt at the third drive wheel.

[0028] More preferably, the support ring includes a main ring body and a convex ring. The main ring body is cylindrical, open at both ends, and hollow inside. The convex ring is fixedly disposed on the outer circumferential surface of the main ring body, and the two form a stacked structure. The edge connecting the convex ring and the main ring body forms a first step and a second step. The support ring is disposed in the central hole of the rotating disk, and the second step of the support ring engages with the edge of the central hole of the rotating disk, so that the support ring cannot move up or down relative to the substrate. The first step of the support ring is used to provide space for the clamping assembly, so that the inner edge of the clamping assembly in the radial direction is as close as possible to the main ring body of the support ring.

[0029] Unless otherwise specified, all raw materials used in this invention can be obtained commercially, and the equipment used in this invention can be conventional equipment in the relevant field or refer to existing technology in the relevant field.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] (1) The wafer clamping mechanism for a turret-type die bonding device provided by the present invention can realize the lifting, moving and rotating of the wafer, and can firmly fix the flexible wafer by clamping along the edge and expanding the wafer.

[0032] (2) The wafer clamping mechanism for a turret-type die bonding device provided by the present invention includes a substrate and a lifting assembly; the lifting assembly includes a lifting ring and a second motor, the second motor being fixedly disposed at one end of the substrate, the lifting ring of the lifting assembly being disposed on the front side of the substrate, and the lifting ring being able to move up and down relative to the substrate under the drive of the second motor. Therefore, the wafer clamping mechanism can realize the lifting and moving of the wafer.

[0033] (3) The wafer clamping mechanism for a turret-type die bonding device provided by the present invention includes a substrate, a lifting assembly, and a support ring. The lifting assembly includes a lifting ring and a second motor. The second motor is fixedly disposed at one end of the substrate. The lifting ring of the lifting assembly is disposed on the front side of the substrate. The support ring is cylindrical in shape. The support ring is located inside the lifting ring in the radial direction. The support ring is connected to the substrate and cannot move up or down relative to the substrate. The substrate, the lifting assembly, and the support ring actually constitute a wafer expansion unit. When the lifting ring of the lifting assembly moves up or down and approaches the substrate, the support ring can abut against the flexible wafer carried by the lifting ring, thereby expanding the wafer and ultimately achieving a firm fixation of the wafer.

[0034] (4) The wafer clamping mechanism for a turret-type die bonding device provided by the present invention includes a clamping assembly, which includes a bottom ring, a bushing, and two identical semi-rings; both the bottom ring and the bushing are circular rings; both semi-rings are fixedly connected to the bottom ring and are symmetrically arranged; a clamping gap is provided between the two semi-rings and the bottom ring along the thickness direction of the bottom ring, the size of the clamping gap matches the size of the bushing, and the bushing can be inserted into or removed from the clamping gap; the wafer is attached to the bushing. The clamping assembly achieves firm fixation of the wafer by clamping along the edge of the wafer.

[0035] (5) The wafer clamping mechanism for a turret-type die bonding device provided by the present invention includes a substrate and a rotating component; the rotating component includes a rotating disk and a first motor; the first motor is fixedly disposed at one end of the substrate; the rotating disk is movably disposed on the front side of the substrate, and the rotating disk can rotate relative to the substrate under the drive of the first motor; therefore, the wafer clamping mechanism can realize the rotation of the wafer, that is, it can realize the adjustment of the wafer angle. Attached Figure Description

[0036] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0037] Figure 1 This is a three-dimensional schematic diagram of the rotating disk portion of the wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention.

[0038] Figure 2 A partial perspective view of the first motor portion of the wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention;

[0039] Figure 3 This is a three-dimensional schematic diagram of the rotating disk of the wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention;

[0040] Figure 4 A cross-sectional schematic diagram of the rotating disk of the wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention;

[0041] Figure 5 A partial perspective view of the connection between the rotating disk and the first V-shaped roller in the wafer clamping mechanism of the turret-type die bonding device provided in an embodiment of the present invention.

[0042] Figure 6 This is a three-dimensional schematic diagram of the connection relationship between the substrate and the first V-shaped roller in the wafer clamping mechanism of the turret-type die bonding device provided in an embodiment of the present invention.

[0043] Figure 7 This is one of the perspective views of the connection relationship between the substrate and the lifting assembly of the wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention.

[0044] Figure 8 This is a second perspective view of the connection relationship between the substrate and the lifting assembly of the wafer clamping mechanism for the turret-type die bonding device provided in an embodiment of the present invention.

[0045] Figure 9 An exploded view of the connection relationship between the substrate and the lifting ring of the wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention.

[0046] Figure 10This is a three-dimensional schematic diagram of the lifting ring of the wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention;

[0047] Figure 11 A partial perspective view of the lifting ring of the wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention;

[0048] Figure 12 This is an exploded view of the wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention;

[0049] Figure 13 An exploded view of the clamping assembly of the wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention;

[0050] Figure 14 A three-dimensional schematic diagram of two semi-rings of a wafer clamping assembly for a turret-type die bonding device provided in an embodiment of the present invention.

[0051] Figure 15 This is a three-dimensional schematic diagram showing the connection relationship between the clamping assembly and the lifting ring of the wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention.

[0052] Figure 16 This is a three-dimensional schematic diagram of the support ring of the wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention.

[0053] Figure 17 A partially enlarged perspective view of the support ring of the wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention;

[0054] Figure 18 This is a cross-sectional schematic diagram of a wafer clamping mechanism for a turret-type die bonding device provided in an embodiment of the present invention. Detailed Implementation

[0055] To more clearly illustrate the present invention, the following description, in conjunction with preferred embodiments, further clarifies the invention. Those skilled in the art should understand that the specific descriptions below are illustrative rather than restrictive, and should not be construed as limiting the scope of protection of the present invention.

[0056] like Figure 1 and Figure 2 As shown, the wafer clamping mechanism for the turret-type die bonding device provided in this embodiment includes a substrate 40 and a rotating assembly 50.

[0057] like Figure 1 and Figure 2As shown, the rotating assembly 50 includes a rotating disk 51, a first motor 52, a first drive wheel 52-1, a first transmission wheel 53-1, a second transmission wheel 53-2, a third transmission wheel 54, a first guide roller 55, a second guide roller 56, a first annular belt 57, and a second annular belt 58.

[0058] like Figure 1 and Figure 2 As shown, the rotating disk 51 is movably disposed on the front side of the substrate 40, and the rotating disk 51 can rotate relative to the substrate 40 under the drive of the first motor 52.

[0059] like Figure 3 , Figure 4 and Figure 5 As shown, the rotating disk 51 is generally annular in shape, and includes an annular portion 51-1, a circumferential wall portion 51-2, and a flange portion 51-3. The annular portion 51-1 is annular in shape; the circumferential wall portion 51-2 is fixedly disposed at the outer edge of the annular portion 51-1, and the circumferential wall portion 51-2 is perpendicular to the annular portion 51-1. Teeth are fixedly disposed on the outer circumferential surface of the circumferential wall portion 51-2, and the teeth cover the outer circumferential surface of the circumferential wall portion 51-2. The extending direction of the teeth on the outer circumferential surface of the circumferential wall portion 51-2 is perpendicular to the annular portion 51-1; the flange portion 51-3 is fixedly disposed on the inner circumferential surface of the circumferential wall portion 51-2. The flange portion 51-3 protrudes inward relative to the circumferential wall portion 51-2, and the inner edge of the flange portion 51-3 is wedge-shaped.

[0060] like Figure 5 and Figure 6 As shown, a plurality of first V-shaped rollers 59 are fixedly disposed on the front side of the substrate 40; each first V-shaped roller 59 includes a roller body portion 59-1 and a roller shaft 59-2; one end of the roller shaft 59-2 of each first V-shaped roller 59 is fixedly disposed on the substrate 40, and the extending direction of the roller shaft 59-2 is perpendicular to the substrate 40; the roller body portion 59-1 of each first V-shaped roller 59 is sleeved on the roller shaft 59-2 (that is, the roller shaft 59-2 passes through the central hole of the roller body portion 59-1), so that the roller body portion 59-1 of each first V-shaped roller 59 can rotate around its own roller shaft 59-2. 2. Rotation; Each first V-shaped roller 59 has a first V-shaped groove 59-3 that surrounds the roller body portion 59-1 on its side; all the first V-shaped rollers 59 are evenly distributed along the flange portion 51-3 of the rotating disk 51, and the inner edge of the flange portion 51-3 engages with the first V-shaped groove 59-3 of the roller body portion 59-1 of each first V-shaped roller 59, so that the flange portion 51-3 of the rotating disk 51 can rotate relative to the first V-shaped roller 59 within the first V-shaped groove 59-3 of the roller body portion 59-1 of each first V-shaped roller 59.

[0061] like Figure 1and Figure 2 As shown, a first motor 52 is fixedly mounted on one end of a substrate 40; the output shaft of the first motor 52 is fixedly connected to a first drive wheel 52-1; a first transmission wheel 53-1, a second transmission wheel 53-2, a third transmission wheel 54, a first guide roller 55, and a second guide roller 56 are all disposed on the front side of the substrate 40. The first transmission wheel 53-1 and the second transmission wheel 53-2 are respectively fixedly mounted on opposite ends of the same central axis, allowing the first transmission wheel 53-1, the second transmission wheel 53-2, and their central axis to rotate synchronously relative to the substrate 40. The central axis of the first transmission wheel 53-1 (or the second transmission wheel 53-2) is disposed on the substrate 40, and the extending direction of the central axis of the first transmission wheel 53-1 (or the second transmission wheel 53-2) is perpendicular to the substrate 40. The central axes of the third drive wheel 54, the first guide roller 55, and the second guide roller 56 are all fixedly mounted on the base plate 40, and the extension directions of the central axes of the third drive wheel 54, the first guide roller 55, and the second guide roller 56 are all perpendicular to the base plate 40; each of the three drives wheel 54, the first guide roller 55, and the second guide roller 56 can rotate around its own central axis.

[0062] The inner surfaces of the first annular belt 57 and the second annular belt 58 are provided with teeth, and the teeth cover the inner surfaces of the first annular belt 57 and the second annular belt 58; the outer circumferential surfaces of the wheel bodies of the first drive wheel 52-1, the first transmission wheel 53-1, the second transmission wheel 53-2 and the third transmission wheel 54 are provided with teeth.

[0063] The inner side of the first annular belt 57 surrounds most of the outer circumferential surface of the circumferential wall portion 51-2 of the rotating disk 51, and the teeth on the inner side of the first annular belt 57 can mesh with the teeth on the outer circumferential surface of the circumferential wall portion 51-2 of the rotating disk 51. The inner side of the first annular belt 57 also surrounds a portion of the outer circumferential surface of the second transmission wheel 53-2 and the third transmission wheel 54, and the teeth on the outer circumferential surfaces of both the second transmission wheel 53-2 and the third transmission wheel 54 can mesh with the teeth on the inner side of the first annular belt 57. In a preferred embodiment of this embodiment, the section of the first annular belt 57 that wraps into the second transmission wheel 53-2 is perpendicular to the section that wraps out of the second transmission wheel 53-2, so as to achieve a right-angle turn of the first annular belt 57 at the second transmission wheel 53-2. Similarly, the section of the first annular belt 57 that wraps into the third transmission wheel 54 is perpendicular to the section that wraps out of the third transmission wheel 54, so as to achieve a right-angle turn of the first annular belt 57 at the third transmission wheel 54.

[0064] The outer side of the first annular belt 57 surrounds a portion of the outer circumference of the second guide roller 56. The section of the first annular belt 57 that wraps into the second guide roller 56 forms an angle with the section that wraps out of the second guide roller 56, thereby enabling the first annular belt 57 to turn at the second guide roller 56. The outer side of the first annular belt 57 is externally tangent to the first guide roller 55, and the first guide roller 55 serves to limit the movement of the first annular belt 57.

[0065] The first annular belt 57 is tensioned by the rotating disc 51, the second transmission wheel 53-2, the third transmission wheel 54, the first guide roller 55, and the second guide roller 56.

[0066] The inner side of the second annular belt 58 surrounds part of the outer circumference of the first drive wheel 52-1 and the first transmission wheel 53-1. The teeth on the inner side of the second annular belt 58 can mesh with the teeth on the outer circumference of the first drive wheel 52-1 and the first transmission wheel 53-1. The second annular belt 58 is tightened by the first drive wheel 52-1 and the first transmission wheel 53-1, so that the output shaft of the first motor 52 can drive the first drive wheel 52-1 to rotate. The first drive wheel 52-1 drives the first transmission wheel 53-1 to rotate by means of the second annular belt 58.

[0067] In use, the output shaft of the first motor 52 drives the first drive wheel 52-1 to rotate. The first drive wheel 52-1 drives the first transmission wheel 53-1 to rotate via the second annular belt 58. The first transmission wheel 53-1 then drives the second transmission wheel 53-2 to rotate. The second transmission wheel 53-2 then drives the first annular belt 57 to rotate. The first annular belt 57 then drives the rotating disk 51 to rotate. The flange portion 51-3 of the rotating disk 51 rotates relative to the first V-shaped roller 59 within the first V-shaped groove 59-3 of the roller body portion 59-1 of each first V-shaped roller 59.

[0068] like Figure 7 and Figure 8 As shown, the clamping mechanism further includes a lifting assembly 60, which includes a lifting ring 61, a second motor 62, a second drive wheel 62-1, a fourth transmission wheel 63, a fifth transmission wheel 64, several guide wheels 65, two third guide rollers 66, a third annular belt 67, a fourth annular belt 68, and several lead screws 69. The number of guide wheels 65 and lead screws 69 is the same. In this embodiment, the lifting assembly 60 includes, for example, four guide wheels 65 and four lead screws 69.

[0069] The lifting ring 61 of the lifting assembly 60 is disposed on the front side of the substrate 40 (the lifting ring 61 and the rotating disk 51 are located on the same side of the substrate 40), and the lifting ring 61 can move up and down relative to the substrate 40 under the drive of the second motor 62 (that is, the lifting ring 61 can move linearly closer to or further away from the substrate 40).

[0070] like Figure 9 , Figure 10 and Figure 11 As shown, the lifting ring 61 is generally circular in shape, and includes a main ring body 61-1, several protruding shoulders 61-2, several protruding ears 61-3, and several second V-shaped rollers 61-4. All the protruding shoulders 61-2 are fixedly disposed on the outer circumferential surface of the main ring body 61-1, and all the protruding shoulders 61-2 protrude outwards radially relative to the main ring body 61-1. Preferably, each protruding shoulder 61-2 is symmetrically disposed along the outer circumferential surface of the main ring body 61-1 and is evenly distributed. Each protruding shoulder 61-2 has a protruding ear 61-3 fixedly disposed on its outer surface, and all the protruding ears 61-3 protrude outwards relative to the protruding shoulder 61-2. Each shoulder 61-2 has a U-shaped groove 61-5 on its end face away from the substrate 40, and a second V-shaped roller 61-4 is disposed within each U-shaped groove 61-5; a second V-shaped groove surrounding the roller body portion is disposed on the side of each second V-shaped roller 61-4. Each lug 61-3 has a circular, for example, threaded hole 61-6. In this embodiment, the lifting ring 61 includes, for example, four shoulders 61-2, four lugs 61-3, and four second V-shaped rollers 61-4.

[0071] like Figure 7 , Figure 8 and Figure 9 and Figure 10 As shown, the second motor 62 is fixedly disposed at one end of the substrate 40, and the second motor 62 and the first motor 52 are preferably disposed at the same end of the substrate 40; the output shaft of the second motor 62 is fixedly connected to the second drive wheel 62-1; the fourth transmission wheel 63 is disposed on the front side of the substrate 40, and the fifth transmission wheel 64 is disposed on the back side of the substrate 40. The fourth transmission wheel 63 and the fifth transmission wheel 64 are respectively fixedly disposed at both ends of the same central axis, so that the fourth transmission wheel 63 and the fifth transmission wheel 64 and their central axis can rotate synchronously relative to the substrate 40; the common central axis of the fourth transmission wheel 63 and the fifth transmission wheel 64 is disposed on the substrate 40, and the extension direction of the common central axis of the fourth transmission wheel 63 and the fifth transmission wheel 64 is perpendicular to the substrate 40.

[0072] All guide wheels 65 and two third guide rollers 66 are disposed on the back side of the substrate 40. The central axes of all guide wheels 65 and two third guide rollers 66 are fixedly disposed on the substrate 40, and the extending direction of the central axes of all guide wheels 65 and two third guide rollers 66 is perpendicular to the substrate 40. Each guide wheel 65 and each third guide roller 66 is capable of rotating around its own central axis. In this embodiment, the number of guide wheels 65 is, for example, four.

[0073] The inner surfaces of the third annular belt 67 and the fourth annular belt 68 are provided with teeth; the outer circumferential surfaces of the wheel bodies of the fourth drive wheel 63, the fifth drive wheel 64, and all (e.g., four) guide wheels 65 are provided with teeth. The inner surface of the third annular belt 67 surrounds part of the outer circumferential surfaces of the second drive wheel 62-1 and the fourth drive wheel 63. The teeth on the outer circumferential surfaces of the second drive wheel 62-1 and the fourth drive wheel 63 can mesh with the teeth on the inner surface of the third annular belt 67. The third annular belt 67 is tightened by the second drive wheel 62-1 and the fourth drive wheel 63, so that the output shaft of the second motor 62 can drive the second drive wheel 62-1 to rotate. The second drive wheel 62-1 then drives the fourth drive wheel 63 to rotate via the third annular belt 67.

[0074] The inner surface of the fourth annular belt 68 surrounds a portion of the outer circumferential surface of the fifth drive wheel 64 and all (e.g., four) guide wheels 65. The teeth on the outer circumferential surfaces of the fifth drive wheel 64 and all guide wheels 65 can mesh with the teeth on the inner surface of the fourth annular belt 68, allowing the fifth drive wheel 64 to drive all guide wheels 65 to rotate via the fourth annular belt 68. The outer surface of the fourth annular belt 68 surrounds a portion of the outer circumferential surface of the two third guide rollers 66. The section of the fourth annular belt 68 that wraps around each third guide roller 66 is perpendicular to the section that wraps out of that third guide roller 66, achieving a right-angle turn of the fourth annular belt 68 at that third guide roller 66. The fourth annular belt 68 is taut by the fifth drive wheel 64, all guide wheels 65, and the two third guide rollers 66. In a preferred embodiment of this example, the center point of the fifth drive wheel 64 and the center points of the two third guide rollers 66 form an isosceles triangle. In another preferred embodiment of this example, the center points of the four guide wheels 65 form a rectangle.

[0075] Each guide wheel 65 is fixedly connected to one end of a lead screw 69, and the other end of the lead screw 69 protrudes from the front of the base plate 40. Each lead screw 69 passes into a threaded hole 61-6 of a lug 61-3 of the lifting ring 61, and the lead screw 69 is threadedly connected to the lug 61-3. In a preferred embodiment of this embodiment, each lug 61-3 of the lifting ring 61 is provided with a circular through hole 61-6, and a ball nut 61-7 is fixedly provided in each through hole 61-6; the lead screw 69 is a ball screw; each lead screw 69 passes into the through hole 61-6 of a lug 61-3 of the lifting ring 61, and the lead screw 69 is threadedly connected to the ball nut 61-7.

[0076] like Figure 12 , Figure 13 , Figure 14 and Figure 15As shown, in a preferred embodiment of this example, the wafer clamping mechanism further includes a clamping assembly 70, which includes a bottom ring 71, a bushing 72, and two identical semi-rings 73. Both the bottom ring 71 and the bushing 72 are annular in shape. The two semi-rings 73 are fixedly connected to the bottom ring 71 and are symmetrically arranged. A clamping gap is provided between the two semi-rings 73 and the bottom ring 71 along the thickness direction of the bottom ring 71. The size of the clamping gap matches the size of the bushing 72, and the bushing 72 can be inserted into or removed from the clamping gap. The outer edge of the bottom ring 71 is wedge-shaped and engages with the second V-shaped groove of the second V-shaped roller 61-4 of the lifting ring 61. In a preferred embodiment of this invention, two grooves 71-1 are symmetrically arranged on the bottom ring body 71, and two semi-ring bodies 73 are respectively located on both sides of the two grooves 71-1. The grooves 71-1 are used for a robotic arm (not shown in the figure) to pass through and grasp the bushing 72; along the outer circumferential edge of the bottom ring body 71 and on both sides of the opening of each groove 71-1, inclined surfaces 71-2 are respectively provided, such as... Figure 13 As shown, the inclined plane 71-2 serves as a guide for the robotic arm used to grasp the bushing 72.

[0077] Specifically, such as Figure 14 As shown, each semi-ring 73 includes a semi-ring body portion 73-1, a first reinforcing rib portion 73-2, and a second reinforcing rib portion 73-3. The first reinforcing rib portion 73-2 is located in the middle of the semi-ring body portion 73-1, and the second reinforcing rib portion 73-3 is located at one end of the semi-ring body portion 73-1. Both the first reinforcing rib portion 73-2 and the second reinforcing rib portion 73-3 are fixedly connected to the semi-ring body portion 73-1 and form a stacked structure. The inner edges of the first reinforcing rib portion 73-2 and the second reinforcing rib portion 73-3 are both straight, so that a straight thickness step is formed at the inner edges of the first reinforcing rib portion 73-2 and the second reinforcing rib portion 73-3.

[0078] The first reinforcing rib 73-2 and the second reinforcing rib 73-3 of each semi-ring 73 are fixedly connected to the bottom ring 71, and the two semi-rings 73 are symmetrically arranged such that the inner edges of the first reinforcing rib 73-2 of the two semi-rings 73 are parallel to each other, and the inner edges of the second reinforcing rib 73-3 of the two semi-rings 73 are along the same straight line. A clamping gap is formed between the two semi-rings 73 and the bottom ring 71 along the thickness direction.

[0079] The edge of the bushing 72 is provided with a first straight edge 72-1, a second straight edge 72-2, a third straight edge 72-3, and a fourth straight edge 72-4. The first straight edge 72-1 and the second straight edge 72-2 are symmetrically arranged and parallel to each other. The third straight edge 72-3 and the fourth straight edge 72-4 are symmetrically arranged and parallel to each other. The first straight edge 72-1 (or the second straight edge 72-2) and the third straight edge 72-3 (or the fourth straight edge 72-4) are perpendicular to each other.

[0080] The wafer is attached to the bushing 72 of the clamping assembly 70. The bushing 72 is inserted into the clamping gap between the two semi-rings 73 and the bottom ring 71. The first straight edge 72-1 and the second straight edge 72-2 of the bushing 72 abut against the inner edges of the first reinforcing ribs 73-2 of the two semi-rings 73, respectively. The third straight edge 72-3 of the bushing 72 abuts against the inner edges of the second reinforcing ribs 73-3 of the two semi-rings 73. The fourth straight edge 72-4 is used to receive the force applied to the bushing 72 by a robot (not shown in the figure), which causes the bushing 72 to be inserted into the clamping gap between the two semi-rings 73 and the bottom ring 71. The output shaft of the second motor 62 drives the fourth transmission wheel 63 to rotate, which in turn drives the fifth transmission wheel 64 to rotate. The fifth transmission wheel 64 then drives the four guide wheels 65 to rotate via the fourth annular belt 68. The four guide wheels 65 then drive the four lead screws 69 to rotate within the threaded holes 61-6 of the lugs 61-3 of the lifting ring 61, thereby realizing the lifting ring 61 moving up and down relative to the substrate 40. The lifting ring 61 drives the clamping assembly 70 to move up and down relative to the substrate 40 via the second V-shaped roller 61-4.

[0081] like Figure 12 , Figure 16 , Figure 17 and Figure 18As shown, in another preferred embodiment of this example, the wafer clamping mechanism further includes a support ring 80, which is cylindrical in shape. The support ring 80 is located inside the lifting ring 61 along the radial direction. The support ring 80 is connected to the substrate 40, and the support ring 80 cannot move up or down relative to the substrate 40. Specifically, the support ring 80 includes a main ring body 80-1 and a convex ring 80-2. The main ring body 80-1 is cylindrical, open at both ends, and hollow inside. The convex ring 80-2 is fixedly disposed on the outer circumferential surface of the main ring body 80-1, and the two form a stacked structure. The edge connecting the convex ring 80-2 and the main ring body 80-1 forms a first step 80-3 and a second step 80-4. The support ring 80 is disposed in the central hole of the rotating disk 51, and the second step 80-4 of the support ring 80 engages with the edge of the central hole of the rotating disk 51, preventing the support ring 80 from moving up or down relative to the substrate 40. The first step 80-3 of the support ring 80 is used to provide space for the clamping assembly 70, so that the inner edge of the clamping assembly 70 in the radial direction is as close as possible to the main ring body 80-1 of the support ring 80.

[0082] In use, when the lifting ring 61 drives the clamping component 70 to move up and down relative to the substrate 40 and both the lifting ring 61 and the clamping component 70 are close to the substrate 40, the end of the support ring 80 away from the substrate 40 will gradually approach until it abuts the wafer attached to the bushing 72 of the clamping component 70. Then, as the clamping component 70 continues to approach the substrate 40, the end of the support ring 80 away from the substrate 40 will apply a force to the wafer attached to the bushing 72 of the clamping component 70, so that the flexible wafer is tightened and stretched.

[0083] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is impossible to exhaustively list all embodiments here. All obvious variations or modifications derived from the technical solutions of the present invention are still within the protection scope of the present invention.

Claims

1. A wafer clamping mechanism for a turret-type die bonding device, characterized in that, The wafer clamping mechanism includes a substrate (40) and a lifting assembly (60); the lifting assembly (60) includes a lifting ring (61) and a second motor (62), the second motor (62) is fixedly disposed at one end of the substrate (40), the lifting ring (61) of the lifting assembly (60) is disposed on the front side of the substrate (40), and the lifting ring (61) can move up and down relative to the substrate (40) under the drive of the second motor (62); The lifting ring (61) is generally circular in shape. The lifting ring (61) includes a main ring body (61-1), several protruding shoulders (61-2), several protruding ears (61-3), and several second V-shaped rollers (61-4). All the protruding shoulders (61-2) are fixedly disposed on the outer circumferential surface of the main ring body (61-1), and all the protruding shoulders (61-2) protrude outward in the radial direction relative to the main ring body (61-1). The outer surface of each protruding shoulder (61-2) A lug (61-3) is fixedly provided on the side, and all lugs (61-3) protrude outward relative to the shoulder (61-2); a U-shaped groove (61-5) is provided on the end face of each shoulder (61-2) away from the substrate (40), and a second V-shaped roller (61-4) is provided in each U-shaped groove (61-5); a second V-shaped groove is provided on the side of the roller body of each second V-shaped roller (61-4) around the roller body.

2. The wafer clamping mechanism for a turret-type die bonding device according to claim 1, characterized in that, The lifting assembly (60) also includes a second drive wheel (62-1), a fourth transmission wheel (63), a fifth transmission wheel (64), several guide wheels (65), two third guide rollers (66), a third annular belt (67), a fourth annular belt (68), and several lead screws (69); the number of guide wheels (65) is the same as the number of lead screws (69).

3. The wafer clamping mechanism for a turret-type die bonding device according to claim 2, characterized in that, The output shaft of the second motor (62) is fixedly connected to the second drive wheel (62-1); the fourth transmission wheel (63) is disposed on the front side of the substrate (40), and the fifth transmission wheel (64) is disposed on the back side of the substrate (40). The fourth transmission wheel (63) and the fifth transmission wheel (64) are respectively fixedly disposed at both ends of the same central axis, so that the fourth transmission wheel (63) and the fifth transmission wheel (64) and their central axis can rotate synchronously relative to the substrate (40); the common central axis of the fourth transmission wheel (63) and the fifth transmission wheel (64) is vertically disposed on the substrate (40). All guide wheels (65) and two third guide rollers (66) are disposed on the back side of the substrate (40). The central axes of all guide wheels (65) and two third guide rollers (66) are fixedly disposed on the substrate (40), and the extension direction of the central axes of all guide wheels (65) and two third guide rollers (66) is perpendicular to the substrate (40). Each guide wheel (65) and two third guide rollers (66) can rotate around its own central axis.

4. The wafer clamping mechanism for a turret-type die bonding device according to claim 3, characterized in that, The inner side of the third annular belt (67) is provided with teeth; the outer circumferential surfaces of the wheel bodies of the second drive wheel (62-1) and the fourth transmission wheel (63) are also provided with teeth; the inner side of the third annular belt (67) surrounds part of the outer circumferential surfaces of the second drive wheel (62-1) and the fourth transmission wheel (63), and the teeth on the outer circumferential surfaces of the second drive wheel (62-1) and the fourth transmission wheel (63) can mesh with the teeth on the inner side of the third annular belt (67). The third annular belt (67) is tightened by the second drive wheel (62-1) and the fourth transmission wheel (63), so that the output shaft of the second motor (62) can drive the second drive wheel (62-1) to rotate, and the second drive wheel (62-1) drives the fourth transmission wheel (63) to rotate by means of the third annular belt (67).

5. The wafer clamping mechanism for a turret-type die bonding device according to claim 4, characterized in that, The inner surface of the fourth annular belt (68) is provided with teeth; the outer circumferential surfaces of the wheel bodies of the fifth drive wheel (64) and all guide wheels (65) are also provided with teeth; the inner surface of the fourth annular belt (68) surrounds part of the outer circumferential surfaces of the wheel bodies of the fifth drive wheel (64) and all guide wheels (65), and the teeth on the outer circumferential surfaces of the wheel bodies of the fifth drive wheel (64) and all guide wheels (65) can mesh with the teeth on the inner surface of the fourth annular belt (68), so that the fifth drive wheel (64) can be driven by the fourth An annular belt (68) drives all guide wheels (65) to rotate; the outer side of the fourth annular belt (68) surrounds part of the outer circumference of the two third guide rollers (66), and the section of the fourth annular belt (68) that wraps into each third guide roller (66) is perpendicular to the section that wraps out of the third guide roller (66) to achieve a right-angle turn of the fourth annular belt (68) at the third guide roller (66); the fourth annular belt (68) is tensioned by the fifth drive wheel (64), all guide wheels (65), and the two third guide rollers (66).

6. The wafer clamping mechanism for a turret-type die bonding device according to claim 5, characterized in that, Each lug (61-3) is provided with a circular threaded hole (61-6); each guide wheel (65) is fixedly connected to one end of a lead screw (69), and the other end of the lead screw (69) passes through the front of the base plate (40); each lead screw (69) passes into the threaded hole (61-6) of a lug (61-3) of the lifting ring (61), and the lead screw (69) is threadedly connected to the lug (61-3).

7. The wafer clamping mechanism for a turret-type die bonding device according to claim 5, characterized in that, Each lug (61-3) of the lifting ring (61) is provided with a circular through hole, and a ball nut (61-7) is fixedly installed in each through hole; the lead screw (69) is a ball screw; each lead screw (69) passes into the through hole of one lug (61-3) of the lifting ring (61), and the lead screw (69) is threadedly connected to the ball nut (61-7).

8. The wafer clamping mechanism for a turret-type die bonding device according to claim 6 or 7, characterized in that, Each shoulder (61-2) is symmetrically arranged along the outer circumference of the main ring body (61-1) and evenly distributed; the lifting assembly (60) includes four guide wheels (65) and four lead screws (69); the lifting ring (61) includes four shoulders (61-2), four lugs (61-3), and four second V-shaped rollers (61-4); the center point of the fifth transmission wheel (64) and the center points of the two third guide rollers (66) form an isosceles triangle; the center points of the four guide wheels (65) form a rectangle.

9. The wafer clamping mechanism for a turret-type die bonding device according to claim 6 or 7, characterized in that, The wafer clamping mechanism also includes a support ring (80), which is cylindrical in shape. The support ring (80) is located inside the lifting ring (61) along the radial direction. The support ring (80) is connected to the substrate (40), and the support ring (80) cannot move up or down relative to the substrate (40).

10. The wafer clamping mechanism for a turret-type die bonding device according to claim 9, characterized in that, The wafer clamping mechanism further includes a clamping assembly (70), which includes a bottom ring (71), a bushing (72), and two identical semi-rings (73). The bottom ring (71) and the bushing (72) are both ring-shaped. The two semi-rings (73) are fixedly connected to the bottom ring (71) and are symmetrically arranged. A clamping gap is provided between the two semi-rings (73) and the bottom ring (71) along the thickness direction of the bottom ring (71). The size of the clamping gap matches the size of the bushing (72), and the bushing (72) can be inserted into or pulled out of the clamping gap. The outer edge of the bottom ring (71) is wedge-shaped and engages with the second V-shaped groove of the second V-shaped roller (61-4) of the lifting ring (61).

11. The wafer clamping mechanism for a turret-type die bonding device according to claim 10, characterized in that, Each semi-ring (73) includes a semi-ring body (73-1), a first reinforcing rib (73-2), and a second reinforcing rib (73-3). The first reinforcing rib (73-2) is located in the middle of the semi-ring body (73-1), and the second reinforcing rib (73-3) is located at one end of the semi-ring body (73-1). The first reinforcing rib (73-2) and the second reinforcing rib (73-3) are both fixedly connected to the semi-ring body (73-1) and form a stacked structure. The inner edges of the first reinforcing rib (73-2) and the second reinforcing rib (73-3) are both straight, so that a straight thickness step is formed at the inner edges of the first reinforcing rib (73-2) and the second reinforcing rib (73-3). The first reinforcing rib (73-2) and the second reinforcing rib (73-3) of each semi-ring (73) are fixedly connected to the bottom ring (71), and the two semi-rings (73) are symmetrically arranged such that the inner edges of the first reinforcing rib (73-2) of the two semi-rings (73) are parallel to each other, and the inner edges of the second reinforcing rib (73-3) of the two semi-rings (73) are along the same straight line. A clamping gap is formed between the two semi-rings (73) and the bottom ring (71) along the thickness direction.

12. The wafer clamping mechanism for a turret-type die bonding device according to claim 11, characterized in that, The edge of the bushing (72) is provided with a first straight edge (72-1), a second straight edge (72-2), a third straight edge (72-3), and a fourth straight edge (72-4). The first straight edge (72-1) and the second straight edge (72-2) are symmetrically arranged and parallel to each other. The third straight edge (72-3) and the fourth straight edge (72-4) are symmetrically arranged and parallel to each other. The first straight edge (72-1) and the third straight edge (72-3) are perpendicular to each other.

13. The wafer clamping mechanism for a turret-type die bonding device according to claim 12, characterized in that, The bushing (72) is inserted into the clamping gap between the two semi-ring bodies (73) and the bottom ring body (71). The first straight edge (72-1) and the second straight edge (72-2) of the bushing (72) abut against the inner edge of the first reinforcing rib (73-2) of the two semi-ring bodies (73), respectively. The third straight edge (72-3) of the bushing (72) abuts against the inner edge of the second reinforcing rib (73-3) of the two semi-ring bodies (73). The fourth straight edge (72-4) is used to receive the force applied to the bushing (72) by the robot arm, which causes the bushing (72) to be inserted into the clamping gap between the two semi-ring bodies (73) and the bottom ring body (71). The bushing (72) of the clamping assembly (70) is used to attach the wafer.

14. The wafer clamping mechanism for a turret-type die bonding device according to claim 13, characterized in that, Two grooves (71-1) are symmetrically arranged on the bottom ring body (71), and two semi-ring bodies (73) are located on both sides of the two grooves (71-1). The grooves (71-1) are used for the robot arm to pass through to grasp the bushing (72). Along the outer circumference edge of the bottom ring body (71) and on both sides of the opening of each groove (71-1), there are inclined surfaces (71-2). The inclined surfaces (71-2) guide the robot arm used to grasp the bushing (72).

15. The wafer clamping mechanism for a turret-type die bonding device according to claim 14, characterized in that, The wafer clamping mechanism further includes a rotating assembly (50); the rotating assembly (50) includes a rotating disk (51) and a first motor (52); The first motor (52) is fixedly disposed at one end of the substrate (40); the rotating disk (51) is movably disposed on the front side of the substrate (40), and the rotating disk (51) can rotate relative to the substrate (40) under the drive of the first motor (52). The rotating disk (51) is generally in the shape of a ring. The rotating disk (51) includes a ring body (51-1), a circumferential wall (51-2), and a flange (51-3). The ring body (51-1) is in the shape of a ring. The circumferential wall (51-2) is fixedly disposed at the outer edge of the ring body (51-1). The circumferential wall (51-2) is perpendicular to the ring body (51-1). Teeth are fixedly disposed on the outer circumferential surface of the circumferential wall (51-2), and the extension direction of the teeth on the outer circumferential surface of the circumferential wall (51-2) is perpendicular to the ring body (51-1). The flange (51-3) is fixedly disposed on the inner circumferential surface of the circumferential wall (51-2). The flange (51-3) protrudes inward relative to the circumferential wall (51-2), and the inner edge of the flange (51-3) is wedge-shaped.

16. The wafer clamping mechanism for a turret-type die bonding device according to claim 15, characterized in that, A plurality of first V-shaped rollers (59) are fixedly disposed on the front side of the substrate (40); each first V-shaped roller (59) includes a roller body (59-1) and a roller shaft (59-2); one end of the roller shaft (59-2) of each first V-shaped roller (59) is fixedly disposed on the substrate (40), and the extending direction of the roller shaft (59-2) is perpendicular to the substrate (40); the roller body (59-1) of each first V-shaped roller (59) is sleeved on the roller shaft (59-2), so that the roller body (59-1) of each first V-shaped roller (59) can rotate around its own roller shaft (59-2); each first V-shaped roller (59-1) is fixedly disposed on the front side of the substrate (40 ... The side of the roller body portion (59-1) of 9) is provided with a first V-shaped groove (59-3) that surrounds the roller body portion (59-1); all the first V-shaped rollers (59) are evenly distributed along the flange portion (51-3) of the rotating disk (51), and the inner edge of the flange portion (51-3) engages in the first V-shaped groove (59-3) of the roller body portion (59-1) of each first V-shaped roller (59), so that the flange portion (51-3) of the rotating disk (51) can rotate relative to the first V-shaped roller (59) in the first V-shaped groove (59-3) of the roller body portion (59-1) of each first V-shaped roller (59).

17. The wafer clamping mechanism for a turret-type die bonding device according to claim 16, characterized in that, The rotating assembly (50) also includes a first drive wheel (52-1), a first transmission wheel (53-1), a second transmission wheel (53-2), a third transmission wheel (54), a first guide roller (55), a second guide roller (56), a first annular belt (57), and a second annular belt (58); The output shaft of the first motor (52) is fixedly connected to the first drive wheel (52-1); the first transmission wheel (53-1), the second transmission wheel (53-2), the third transmission wheel (54), the first guide roller (55), and the second guide roller (56) are all disposed on the front side of the substrate (40); the first transmission wheel (53-1) and the second transmission wheel (53-2) are respectively fixedly disposed at both ends of the same central shaft, so that the first transmission wheel (53-1), the second transmission wheel (53-2), and their central shaft can rotate synchronously relative to the substrate (40); the first transmission wheel (53-1) The central axis is set on the substrate (40), and the extension direction of the central axis of the first transmission wheel (53-1) is perpendicular to the substrate (40); the central axes of the third transmission wheel (54), the first guide roller (55) and the second guide roller (56) are all fixedly set on the substrate (40), and the extension direction of the central axes of the third transmission wheel (54), the first guide roller (55) and the second guide roller (56) is perpendicular to the substrate (40); the third transmission wheel (54), the first guide roller (55) and the second guide roller (56) can each rotate around their own central axis.

18. The wafer clamping mechanism for a turret-type die bonding device according to claim 17, characterized in that, The inner side of the first annular belt (57) is provided with teeth; the outer circumferential surfaces of the wheel body of the second transmission wheel (53-2) and the third transmission wheel (54) are also provided with teeth. The inner side of the first annular belt (57) surrounds most of the outer circumferential surface of the circumferential wall portion (51-2) of the rotating disk (51), and the teeth on the inner side of the first annular belt (57) can mesh with the teeth on the outer circumferential surface of the circumferential wall portion (51-2) of the rotating disk (51); the inner side of the first annular belt (57) also surrounds part of the outer circumferential surface of the second transmission wheel (53-2) and the third transmission wheel (54), and the teeth on the outer circumferential surfaces of the second transmission wheel (53-2) and the third transmission wheel (54) can mesh with the teeth on the inner side of the first annular belt (57); The outer side of the first annular belt (57) surrounds part of the outer circumference of the second guide roller (56). The section of the first annular belt (57) that wraps into the second guide roller (56) forms an angle with the section that wraps out of the second guide roller (56) to achieve the turning of the first annular belt (57) at the second guide roller (56). The outer side of the first annular belt (57) is externally tangent to the first guide roller (55), and the first guide roller (55) plays a limiting role on the first annular belt (57). The first annular belt (57) is tensioned by the rotating disc (51), the second drive wheel (53-2), the third drive wheel (54), the first guide roller (55), and the second guide roller (56).

19. The wafer clamping mechanism for a turret-type die bonding device according to claim 18, characterized in that, The inner side of the second annular belt (58) is provided with teeth; the outer circumferential surface of the wheel body of the first drive wheel (52-1) and the first transmission wheel (53-1) is provided with teeth. The inner side of the second annular belt (58) surrounds part of the outer circumference of the first drive wheel (52-1) and the first transmission wheel (53-1). The teeth on the inner side of the second annular belt (58) can mesh with the teeth on the outer circumference of the first drive wheel (52-1) and the first transmission wheel (53-1). The second annular belt (58) is tightened by the first drive wheel (52-1) and the first transmission wheel (53-1), so that the output shaft of the first motor (52) can drive the first drive wheel (52-1) to rotate. The first drive wheel (52-1) drives the first transmission wheel (53-1) to rotate by means of the second annular belt (58).

20. The wafer clamping mechanism for a turret-type die bonding device according to claim 19, characterized in that, The first annular belt (57) is perpendicular to the section that wraps around the second transmission wheel (53-2) and the section that wraps around the second transmission wheel (53-2) so as to achieve a right-angle turn of the first annular belt (57) at the second transmission wheel (53-2); the first annular belt (57) is perpendicular to the section that wraps around the third transmission wheel (54) so ​​as to achieve a right-angle turn of the first annular belt (57) at the third transmission wheel (54).

21. The wafer clamping mechanism for a turret-type die bonding device according to any one of claims 15-20, characterized in that, The support ring (80) includes a main ring body (80-1) and a convex ring (80-2). The main ring body (80-1) is cylindrical, open at both ends, and hollow inside. The convex ring (80-2) is fixedly disposed on the outer circumferential surface of the main ring body (80-1), and the two form a stacked structure. The edge connecting the convex ring (80-2) and the main ring body (80-1) forms a first step (80-3) and a second step (80-4). (80) is disposed in the center hole of the rotating disk (51). The second step (80-4) of the support ring (80) is engaged at the edge of the center hole of the rotating disk (51), so that the support ring (80) cannot move up or down relative to the substrate (40). The first step (80-3) of the support ring (80) is used to provide space for the clamping assembly (70), so that the inner edge of the clamping assembly (70) in the radial direction is as close as possible to the main ring body (80-1) of the support ring (80).

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