Display panel and display device

Abstract

This disclosure provides a display panel and a display device, belonging to the field of display technology. The display panel of this disclosure has a display area, a peripheral area surrounding the display area, and a bent area located on the side of the peripheral area away from the display area. The display panel includes a substrate, touch leads and signal lines disposed on the substrate. The touch leads overlap with the signal lines at least in the peripheral area. The signal lines cross the bent area and are configured to be electrically connected to a driver chip. The touch leads include a first sub-lead and a second sub-lead sequentially disposed and electrically connected along a direction away from the substrate. The signal lines are disposed on the side of the first sub-lead closer to the substrate, and a first end of the signal lines is electrically connected to the first sub-lead.

Description

Technical Field

[0001] This disclosure belongs to the field of display technology, specifically relating to a display panel and a display device. Background Technology

[0002] Flexible Multi-Layer On Cell (FMLOC) technology involves fabricating the touch functional layer after the display backplane packaging process is completed. Typically, the touch functional layer includes a touch buffer layer, a first touch layer, a touch insulating layer, and a second touch layer; the second touch layer usually contains touch electrodes. The touch electrodes are electrically connected to the metal traces (SD) in the display substrate via touch leads, typically through interconnects etched into the touch insulating layer and the touch buffer layer.

[0003] However, the inventors discovered at least the following problems in the prior art: the touch lead and SD adapter area are exposed to the upper film developer, which causes the touch lead to be corroded, affecting the product yield. Summary of the Invention

[0004] This disclosure aims to at least solve one of the technical problems existing in the prior art, and to provide a display panel and a display device.

[0005] In a first aspect, the technical solution adopted to solve the technical problem of this disclosure is a display panel having a display area, a peripheral area surrounding the display area, and a bent area located on the side of the peripheral area away from the display area;

[0006] The display panel includes a substrate, touch leads and signal lines disposed on the substrate; the touch leads overlap with the signal lines at least in the peripheral area; the signal lines cross the bending area and are configured to be electrically connected to a driver chip.

[0007] The touch lead includes a first sub-lead and a second sub-lead that are sequentially arranged and electrically connected along a direction away from the substrate; the signal line is arranged on the side of the first sub-lead close to the substrate, and the first end of the signal line is electrically connected to the first sub-lead.

[0008] In some embodiments, the display panel further includes a touch buffer layer disposed between the first sub-lead and the signal line;

[0009] The first sub-lead is electrically connected to the signal line through a first adapter hole that penetrates the touch buffer layer.

[0010] In some embodiments, the display panel further includes a black matrix layer disposed on the side of the second sub-lead away from the first sub-lead; the black matrix layer wraps around the second sub-lead.

[0011] In some embodiments, the display panel further includes a first light-collecting layer disposed on the side of the black matrix layer opposite to the second sub-lead, and a second light-collecting layer disposed on the side of the first light-collecting layer opposite to the black matrix layer;

[0012] The first light-collecting layer covers the edge portion of the black matrix layer away from the display area; the second light-collecting layer covers the first light-collecting layer.

[0013] In some embodiments, the display panel further includes a touch insulating layer disposed between the first sub-lead and the second sub-lead, and a touch buffer layer disposed between the first sub-lead and the signal line;

[0014] The touch lead also includes a connecting lead; the first sub-lead is electrically connected to the first end of the connecting lead through a second adapter hole penetrating the touch insulation layer, and the second end of the connecting lead is electrically connected to the signal line through a third adapter hole penetrating the touch insulation layer and the touch buffer layer in sequence.

[0015] In some embodiments, the connecting lead is on the same layer as the second sub-lead and is spaced apart.

[0016] In some embodiments, the display panel further includes a black matrix layer disposed on the side of the second sub-lead away from the first sub-lead; the black matrix layer encloses the second sub-lead and the connecting lead.

[0017] In some embodiments, the display panel further includes a first light-collecting layer disposed on the side of the black matrix layer opposite to the second sub-lead, and a second light-collecting layer disposed on the side of the first light-collecting layer opposite to the black matrix layer;

[0018] The first light-collecting layer surrounds the edge of the black matrix layer away from the display area; the second light-collecting layer surrounds the first light-collecting layer.

[0019] In some embodiments, the connecting lead and the second sub-lead are disposed on the same layer and are electrically connected;

[0020] The display panel also includes a black matrix layer disposed on the side of the second sub-lead away from the first sub-lead, the black matrix layer enclosing the first sub-lead and the connecting lead.

[0021] In some embodiments, the display panel further includes a first light-collecting layer disposed on the side of the black matrix layer opposite to the second sub-lead, and a second light-collecting layer disposed on the side of the first light-collecting layer opposite to the black matrix layer;

[0022] The first light-collecting layer surrounds the edge of the black matrix layer away from the display area; the second light-collecting layer surrounds the first light-collecting layer.

[0023] In some embodiments, the display panel further has a bonding area located on the side of the bending area opposite to the peripheral area;

[0024] The touch lead also includes a third sub-lead located at least in the bonding area; the third sub-lead is disposed on the same layer as the first sub-lead.

[0025] The first end of the third sub-lead is electrically connected to the second end of the signal line, and the second end of the third sub-lead is bonded to the driver chip.

[0026] In some embodiments, the display panel further includes a pixel defining layer and a plurality of light-emitting devices disposed on the side of the first sub-lead near the signal line, a black matrix layer disposed on the side of the second sub-lead away from the first sub-lead, a first light-collecting layer disposed on the side of the black matrix layer away from the second sub-lead, and a second light-collecting layer disposed on the side of the first light-collecting layer away from the black matrix layer.

[0027] The first light-collecting layer located in the display area includes multiple light-collecting units; the light-collecting units are correspondingly arranged with respect to the light-emitting device;

[0028] The black matrix layer located in the display area includes a plurality of black matrix openings, the black matrix openings being disposed corresponding to the light-emitting devices, and the light-collecting unit being disposed within the black matrix openings.

[0029] In some embodiments, the display panel further includes a plurality of color filters disposed on the side of the second light-collecting layer opposite to the first light-collecting layer, the color filters being disposed corresponding to the light-emitting device.

[0030] Secondly, embodiments of this disclosure also provide a display device, including a display panel as described in any one of the first aspects. Attached Figure Description

[0031] Figure 1a This is a cross-sectional view of the peripheral area of ​​the relevant display panel;

[0032] Figure 1b This is a cross-sectional view of a display area of ​​a related display panel;

[0033] Figure 1cThis is a cross-sectional view of another display area of ​​the related display panel;

[0034] Figure 2 A top view of a display panel provided in an embodiment of this disclosure;

[0035] Figure 3 for Figure 2 Cross-sectional view of the first example along the A-A' direction;

[0036] Figure 4 for Figure 2 Cross-sectional view of the second example in the A-A' direction;

[0037] Figure 5 for Figure 2 Cross-sectional view of the third example in the A-A' direction;

[0038] Figure 6 for Figure 2 Cross-sectional view of the fourth example in the A-A' direction;

[0039] Figure 7 for Figure 2 Cross-sectional view under the fifth example in the A-A' direction;

[0040] Figure 8 for Figure 2 Cross-sectional view under the sixth example in the A-A' direction;

[0041] Figure 9 for Figure 2 A cross-sectional view of the display area in the B-B' direction. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. The components of the embodiments of this disclosure described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this disclosure provided in the accompanying drawings is not intended to limit the scope of the claimed disclosure, but merely represents selected embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure.

[0043] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0044] In this disclosure, "multiple or several" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0045] In related technologies, such as Figure 1a As shown, the display panel includes touch leads 2 and signal lines 3. Touch leads 2 are disposed on the same layer as the touch electrodes and are electrically connected to signal lines 3 through adapter holes V. Due to limitations in process, materials, and structure, the coverage area of ​​the black matrix layer BM ends on the side of the blocking structure closest to the display area. During the preparation stage of the black matrix layer BM, touch leads 2 are easily broken due to the corrosive effect of the developing solution used in the preparation of the black matrix layer BM, thus affecting the product yield.

[0046] In view of this, embodiments of the present disclosure provide a display panel that substantially eliminates one or more of the problems caused by limitations and defects in related technologies.

[0047] Figure 2 This is a top view of the display panel provided in an embodiment of the present disclosure. Figure 3 for Figure 2 The cross-sectional view under the first example in the A-A' direction, as shown below. Figure 2 and Figure 3 As shown, the display panel has a display area AA, a peripheral area BB surrounding the display area AA, and a bent area CC located on the side of the peripheral area BB away from the display area AA.

[0048] The display panel includes a substrate 1, touch leads 2 and signal lines 3 disposed on the substrate 1; the touch leads 2 overlap with the signal lines 3 at least in the peripheral area BB; the signal lines 3 cross the bending area CC and are configured to be electrically connected to the driver chip 6. The touch leads 2 and signal lines 3 overlap in layers and are used together to transmit touch signals.

[0049] The touch lead 2 includes a first sub-lead 21 and a second sub-lead 22 that are sequentially arranged and electrically connected along a direction away from the substrate 1. An insulating layer is disposed between the first sub-lead 21 and the second sub-lead 22. The first sub-lead 21 and the second sub-lead 22 are electrically connected through a via S1.

[0050] For example, the display panel includes a touch functional layer disposed on the side of the signal line 3 facing away from the substrate 1. The touch functional layer includes a first touch layer TMA, a touch insulating layer TLD, and a second touch layer TMB disposed sequentially along the direction facing away from the substrate 1. The first touch layer TMA located in the peripheral area BB includes a first sub-lead 21, the second touch layer TMB located in the display area AA includes a plurality of touch electrodes (Tx / Rx), and the second touch layer TMB located in the peripheral area BB includes a second sub-lead 22. The touch electrodes (Tx / Rx) are correspondingly disposed with the touch leads 2 and are electrically connected.

[0051] The signal line 3 is disposed on the side of the first sub-lead 21 close to the substrate 1, and the first end 31 of the signal line 3 is electrically connected to the first sub-lead 21.

[0052] This embodiment utilizes the first sub-lead 21 to achieve electrical connection between the touch electrode (Tx / Rx) and the signal line 3, compared to Figure 1a The structure shown avoids corrosion of the area of ​​the second sub-lead 22 exposed to the developer of the upper film layer, thereby improving the yield.

[0053] In some embodiments, such as Figure 3 As shown, the display panel also includes a touch buffer layer TBL disposed between the first sub-lead 21 and the signal line 3; the first sub-lead 21 is electrically connected to the signal line 3 through a first adapter hole V1 penetrating the touch buffer layer TBL. Since there is an insulating layer (i.e., a touch insulating layer TLD) between the first sub-lead 21 and the second sub-lead 22, the developing solution in the upper film layer preparation process of the first sub-lead 21 will not corrode the first sub-lead 21, thus avoiding the corrosion of the touch lead 2 by the upper film layer developing solution.

[0054] Optionally, such as Figure 3 As shown, the peripheral area BB includes a package cutoff area BB1 surrounding the display area AA, and a transition area BB2 located on the side of the package cutoff area BB1 away from the display area AA; the second sub-lead 22 is located in the package cutoff area BB1.

[0055] Optionally, such as Figure 3 As shown, the first sub-lead 21 and the first end 31 of the signal line 3 overlap in the transition area BB2. Specifically, the first sub-lead 21 overlaps with the first end 31 of the signal line 3 through the first adapter hole V1 that penetrates the touch buffer layer TBL.

[0056] Optionally, such as Figure 3 As shown, the display panel also includes an encapsulation layer 4 disposed on the side of the first touch layer TMA near the substrate 1, and a first blocking structure Dam1 and a second blocking structure Dam2 disposed on the side of the signal line 3 away from the substrate 1. The encapsulation layer 4 extends from the display area AA to the encapsulation cutoff area BB1. The first blocking structure Dam1 and the second blocking structure Dam2 are both located in the transition area BB2 and are used to block the overflow of the encapsulation layer 4. The side of the first blocking structure Dam1 near the display area AA abuts against the encapsulation layer 4.

[0057] For example, the encapsulation layer 4 can be a single-layer structure or a multi-layer structure, which includes a stacked structure of inorganic and organic layers. For instance, the encapsulation layer 4 includes a first inorganic encapsulation layer (CVD1), an organic encapsulation layer (IJP), and a second inorganic encapsulation layer (CVD2) sequentially disposed along a direction away from the substrate 1.

[0058] In some embodiments, the display panel further includes a black matrix layer BM disposed on the side of the second sub-lead 22 opposite to the first sub-lead 21; the black matrix layer BM wraps around the second sub-lead 22.

[0059] It should be noted that the black matrix layer BM is limited by the structure of the underlying film, its own material, its own thickness (which is relatively small), and its own processing conditions. Under normal circumstances, it does not cross the transition region BB2. If it does cross the transition region BB2, it is likely to cause breakage. For example, the relatively thin black matrix layer BM may not easily cross the barrier structures with large step differences (such as the first barrier structure Dam1 and the second barrier structure Dam2), thus posing a risk of breakage. Therefore, if the second sub-lead 22 crosses the transition region BB2, it will not be protected by the black matrix layer BM and will be easily corroded by the multiple developing processes of the black matrix layer BM and its upper film layers, increasing the risk of breakage. Furthermore, based on the requirements of narrow bezel technology, after the bezel is narrowed, the black matrix layer BM needs to extend from the display area AA to the encapsulation cutoff area BB1, effectively overlapping with the black opaque film layer (such as MDL, CG ink) at the edge of the substrate 1 to avoid light leakage problems at large viewing angles.

[0060] Optionally, such as Figure 3 As shown, compared to Figure 1aAs shown in the embodiment, without changing the location of the black matrix layer BM, that is, the black matrix layer BM extends from the display area AA to the encapsulation cutoff area BB1, and the black matrix layer BM wraps the second sub-lead 22 located in the encapsulation cutoff area BB1; and the first sub-lead 21 is electrically connected to the signal line 3 to avoid the second sub-lead 22 being exposed to the black matrix layer BM and its upper film layer and other multiple developing processes, thereby avoiding the second sub-lead 22 being corroded and improving the yield.

[0061] Optionally, Figure 4 for Figure 2 The cross-sectional view under the second example in the A-A' direction, and Figure 3 The difference in the structure shown is that the black matrix layer BM extends from the display area AA to the transition area BB2. For explanations of other structures, please refer to [link / reference needed]. Figure 3 Detailed explanations of the structure are provided, with repeated parts omitted. For example... Figure 4 As shown, the black matrix layer BM extends from the display area AA to the transition area BB2 and wraps around the second sub-lead 22 located in the encapsulation cutoff area BB1, preventing corrosion of the second sub-lead 22 by the black matrix layer BM and its upper film layers through multiple developing processes. Furthermore, since the second sub-lead 22 is located in the encapsulation cutoff area BB1, even if the black matrix layer BM extends to the transition area BB2, the black matrix layer BM located in the transition area BB2 will not break and affect the second sub-lead 22.

[0062] In some embodiments, the display panel further includes a first light-collecting layer EES1 disposed on the side of the black matrix layer BM away from the second sub-lead 22, and a second light-collecting layer EES2 disposed on the side of the first light-collecting layer EES1 away from the black matrix layer BM; the first light-collecting layer EES1 covers the edge portion of the black matrix layer BM away from the display area AA; the second light-collecting layer EES2 covers the first light-collecting layer EES1.

[0063] Because the first light-harvesting layer EES1 has a large modulus, it is easy to generate a large tensile force during the cleaning process of the first light-harvesting layer EES1 after etching.

[0064] Optionally, such as Figure 3 As shown, the first light-harvesting layer EES1 extends from the display area AA to the encapsulation cutoff area BB1. The first light-harvesting layer EES1 located in the encapsulation cutoff area BB1 can completely wrap the edge of the black matrix layer BM located in the encapsulation cutoff area BB1, thereby avoiding the peeling of the edge of the black matrix layer BM caused by pulling the edge of the black matrix layer BM during the cleaning of the first light-harvesting layer EES1, thus avoiding appearance defects and affecting the yield.

[0065] Optionally, such as Figure 4As shown, the first light-harvesting layer EES1 extends from the display area AA to the transition area BB2. The first light-harvesting layer EES1 located in the transition area BB2 can completely wrap the edge of the black matrix layer BM located in the transition area BB2, thereby avoiding the peeling of the edge of the black matrix layer BM caused by pulling the edge of the black matrix layer BM during the cleaning of the first light-harvesting layer EES1, thus avoiding appearance defects and affecting the yield.

[0066] Optionally, such as Figure 3 or Figure 4 As shown, the distance L1 between the edge of the first light-collecting layer EES1 away from the display area AA and the edge of the black matrix layer BM away from the display area AA is greater than 5μm.

[0067] In some embodiments, Figure 5 for Figure 2 The cross-sectional view under the third example in the A-A' direction, and Figure 3 The difference in the structure shown is that the first sub-lead 21 is electrically connected to the signal line 3 via connecting lead 23. For explanations of other structures, please refer to [link / reference needed]. Figure 3 The detailed explanation of the structure will not be repeated here.

[0068] like Figure 5 As shown, the display panel also includes a touch insulating layer TLD disposed between the first sub-lead 21 and the second sub-lead 22, and a touch buffer layer TBL disposed between the first sub-lead 21 and the signal line 3; the touch lead 2 also includes a connecting lead 23; the first sub-lead 21 is electrically connected to the first end of the connecting lead 23 through a second adapter hole V2 penetrating the touch insulating layer TLD, and the second end of the connecting lead 23 is electrically connected to the signal line 3 through a third adapter hole V3 that sequentially penetrates the touch insulating layer TLD and the touch buffer layer TBL.

[0069] The display panel also includes a protective layer 5 disposed on the side of the second sub-lead 22 away from the first sub-lead 21. The protective layer 5 wraps the second sub-lead 22 and the connecting lead 23, thereby avoiding the influence of multiple developing solutions on the second sub-lead 22 and the connecting lead 23 in the upper film preparation process.

[0070] Optionally, such as Figure 5 As shown, the display panel also includes a black matrix layer BM disposed on the side of the second sub-lead 22 opposite to the first sub-lead 21, and the black matrix layer BM is reused as a protective layer 5.

[0071] Of course, the protective layer 5 can be other insulating layers, and this disclosure does not limit the embodiments.

[0072] In some embodiments, such as Figure 5As shown, the connecting lead 23 and the second sub-lead 22 are on the same layer and spaced apart. Optionally, the second sub-lead 22 is located in the package cutoff region BB1, with a transition region BB2 separating it from the connecting lead 23. Of course, the second sub-lead 22 can also extend from the package cutoff region BB1 to the transition region BB2 or other locations. This disclosure does not specifically limit this. However, since this embodiment does not use the second sub-lead 22 to connect the signal line 3, whether the second sub-lead 22 is corroded in the transition region BB2 has no impact on the product yield of this disclosure.

[0073] In some embodiments, the display panel further includes a black matrix layer BM disposed on the side of the second sub-lead 22 opposite to the first sub-lead 21; the black matrix layer BM wraps around the second sub-lead 22 and the connecting lead 23.

[0074] Optionally, such as Figure 5 As shown, the black matrix layer BM includes a first shielding portion BM1 extending from the display area AA to the encapsulation cutoff area BB1, and a second shielding portion BM2 located in the transition area BB2; the first shielding portion BM1 wraps the second sub-lead 22; the second shielding portion BM2 wraps the connecting lead 23, thereby avoiding corrosion of the second sub-lead 22 and the connecting lead 23 by multiple developing processes such as the black matrix layer BM and its upper film layer.

[0075] Optionally, Figure 6 for Figure 2 The cross-sectional view under the fourth example in the A-A' direction, and Figure 5 The difference in the structure shown is that the black matrix layer BM extends from the display area AA to the transition area BB2. For explanations of other structures, please refer to [link / reference needed]. Figure 5 Detailed explanations of the structure are provided, with repeated parts omitted. For example... Figure 6 As shown, the black matrix layer BM extends from the display area AA to the transition area BB2, and wraps around the second sub-lead 22 located in the encapsulation cutoff area BB1 and the connecting lead 23 located in the transition area BB2, thus preventing corrosion of the second sub-lead 22 and the connecting lead 23 by the multiple developing processes of the black matrix layer BM and its upper film layers. Furthermore, since the second sub-lead 22 is located in the encapsulation cutoff area BB1 with a small step difference, and the connecting lead 23 is also located in the transition area BB2 with a small step difference, even if the black matrix layer BM is located in the transition area BB2, the black matrix layer BM in the transition area BB2 will not affect the second sub-lead 22 and the connecting lead 23 due to breakage.

[0076] In some embodiments, the display panel further includes a first light-collecting layer EES1 disposed on the side of the black matrix layer BM away from the second sub-lead 22, and a second light-collecting layer EES2 disposed on the side of the first light-collecting layer EES1 away from the black matrix layer BM; the first light-collecting layer EES1 wraps around the edge of the black matrix layer BM away from the display area AA; the second light-collecting layer EES2 wraps around the first light-collecting layer EES1.

[0077] Because the first light-harvesting layer EES1 has a large modulus, it is easy to generate a large tensile force during the cleaning process of the first light-harvesting layer EES1 after etching.

[0078] Optionally, such as Figure 5 As shown, the first light-harvesting layer EES1 includes a first portion EES1a extending from the display area AA to the encapsulation cutoff area BB1, and a second portion EES1b located in the transition area BB2; the first portion EES1a wraps the edge of the first blocking portion BM1 located in the encapsulation cutoff area BB1; the second portion EES1b wraps the second blocking portion BM2; the second light-harvesting layer EES2 wraps the first portion EES1a and the second portion EES1b of the first light-harvesting layer EES1, thereby avoiding the peeling of the edge of the black matrix layer BM caused by pulling the edge of the black matrix layer BM during the cleaning of the first light-harvesting layer EES1, and thus avoiding appearance defects that affect the yield.

[0079] Optionally, such as Figure 6 As shown, the first light-harvesting layer EES1 extends from the display area AA to the transition area BB2. The first light-harvesting layer EES1 located in the transition area BB2 can completely wrap the edge of the black matrix layer BM located in the transition area BB2, thereby avoiding the peeling of the edge of the black matrix layer BM caused by pulling the edge of the black matrix layer BM during the cleaning of the first light-harvesting layer EES1, thus avoiding appearance defects and affecting the yield.

[0080] In some embodiments, Figure 7 for Figure 2 The cross-sectional view under the fifth example in the A-A' direction, and Figure 5 The difference in the structure shown is that the black matrix layer BM only includes the first occlusion part BM1, and does not include the second occlusion part BM2. For explanations of other structures, please refer to [link / reference needed]. Figure 5 Detailed explanations of the structure are provided, with repeated parts omitted. For example... Figure 7As shown, the display panel also includes a black matrix layer BM disposed on the side of the second sub-lead 22 away from the first sub-lead 21, a first light-collecting layer EES1 disposed on the side of the black matrix layer BM away from the second sub-lead 22, and a second light-collecting layer EES2 disposed on the side of the first light-collecting layer EES1 away from the black matrix layer BM; the black matrix layer BM extends from the display area AA to the encapsulation cutoff area BB1 and wraps around the second sub-lead 22; the first light-collecting layer EES1 includes a first portion EES1a extending from the display area AA to the encapsulation cutoff area BB1, and a second portion EES1b located in the transition area BB2; the first portion EES1a wraps around the edge of the black matrix layer BM located in the encapsulation cutoff area BB1 to prevent the black matrix layer BM and its upper film layers from being corroded by multiple developing processes on the second sub-lead 22; the second portion EES1b wraps around the connecting lead 23 to prevent the developing solution of the first light-collecting layer EES1 from corroding the connecting lead 23.

[0081] In some embodiments, Figure 8 for Figure 2 The cross-sectional view under the sixth example in the A-A' direction, and Figure 6 The difference in the structure shown is that the second sub-lead 22 is connected to the connecting lead 23. For explanations of other structures, please refer to [link / reference needed]. Figure 6 Detailed explanations of the structure are provided, with repeated parts omitted. For example... Figure 8 As shown, the connecting lead 23 and the second sub-lead 22 are arranged on the same layer and are electrically connected. This arrangement enables the first sub-lead 21 and the second sub-lead 22 to be connected in parallel, reducing the impedance of the touch lead 2 and improving signal transmission efficiency.

[0082] For example, the connecting lead 23 and the second sub-lead 22 are connected as a single structure.

[0083] like Figure 8 As shown, the display panel also includes a black matrix layer BM disposed on the side of the second sub-lead 22 away from the first sub-lead 21. The black matrix layer BM wraps the first sub-lead 21 and the connecting lead 23. By wrapping the electrically connected second sub-lead 22 and connecting lead 23 with the black matrix layer BM, the corrosion of the second sub-lead 22 and connecting lead 23 by the black matrix layer BM and its upper film layer and other multiple developing processes is avoided.

[0084] Optionally, such as Figure 8 As shown, the black matrix layer BM extends from the display area AA to the transition area BB2, and wraps the second sub-lead 22 located in the encapsulation cutoff area BB1 and the connecting lead 23 located in the transition area BB2.

[0085] Optionally, Figure 8 The material and thickness of the black matrix layer BM shown can be distinguished from... Figures 3-7 The material and thickness of the black matrix layer BM are shown. For example, Figure 8The thickness of the black matrix layer BM shown is greater than Figures 3-7 The thickness of the black matrix layer BM is shown to prevent the risk of breakage of the black matrix layer BM in the transition region BB2.

[0086] However, due to the limited thickness requirement of the black matrix layer BM in the display area AA (for example, a thicker layer would affect light output), the thickness of the black matrix layer BM in the display area AA can be reduced compared to the thickness of the black matrix layer BM in the peripheral area BB, so that the thickness of the black matrix layer BM in both the display area AA and the peripheral area BB meets the design requirements.

[0087] In some embodiments, such as Figure 8 As shown, the display panel also includes a first light-collecting layer EES1 disposed on the side of the black matrix layer BM away from the second sub-lead 22, and a second light-collecting layer EES2 disposed on the side of the first light-collecting layer EES1 away from the black matrix layer BM; the first light-collecting layer EES1 wraps around the edge of the black matrix layer BM away from the display area AA; the second light-collecting layer EES2 wraps around the first light-collecting layer EES1, thereby avoiding the peeling of the edge of the black matrix layer BM caused by pulling the edge of the black matrix layer BM during the cleaning of the first light-collecting layer EES1, and thus avoiding appearance defects that affect the yield.

[0088] Optionally, such as Figure 8 As shown, the first light-harvesting layer EES1 extends from the display area AA to the transition area BB2, wrapping the edge of the black matrix layer BM located in the transition area BB2. This avoids the peeling of the black matrix layer BM edge caused by pulling the edge of the black matrix layer BM during the cleaning of the first light-harvesting layer EES1, thereby avoiding appearance defects that affect the yield.

[0089] In some embodiments, such as Figure 2 As shown, the display panel also has a bonding area DD located on the side of the bending area CC away from the peripheral area BB; the touch lead 2 also includes a third sub-lead 24 located at least in the bonding area DD; the third sub-lead 24 is disposed on the same layer as the first sub-lead 21; the first end of the third sub-lead 24 is electrically connected to the second end 32 of the signal line 3, and the second end of the third sub-lead 24 is bonded to the driver chip 6.

[0090] like Figure 2 As shown, a touch insulating layer TLD is provided between the first sub-lead 21 and the second sub-lead 22. The touch insulating layer TLD is not only located in the display area AA and the peripheral area BB, but also extends at least across the bending area CC to the side close to the bonding area DD, in order to cover and protect the third sub-lead 24.

[0091] The third sub-lead 24 is set on the same layer as the first sub-lead 21. The third sub-lead 24 and the first sub-lead 21 can be connected into a single structure, thereby forming the first touch layer TMA using a mask process.

[0092] For example, the driver chip 6 can be a flexible printed circuit (FPC).

[0093] In this embodiment, a third sub-lead 24, which is on the same layer as the first sub-lead 21, is bonded to the driver chip. Compared with the conventional technology, which uses a lead (L) on the same layer as the second sub-lead 22 to bond to the driver chip, this disclosure can avoid the lead (L) being corroded in the area exposed to the upper film developer, thereby improving the yield.

[0094] In some embodiments, such as Figure 2 As shown, signal line 3 includes a first overlap portion (i.e., the first end 31 of signal line 3) that overlaps with the first sub-lead 21 (or connecting lead 23), a second overlap portion (i.e., the second end 32 of signal line 3) that overlaps with the third sub-lead 24, and a third overlap portion (not shown in the figure) that connects the first overlap portion and the second overlap portion. The first overlap portion is located in the transition area BB2, the second overlap portion is located on the side of the bending area CC near the bonding area DD, and the third overlap portion crosses the bending area CC and is connected to the first overlap portion and the second overlap portion respectively.

[0095] Optionally, the first overlap and the second overlap are arranged on the same layer.

[0096] Optionally, the first overlapping portion and the second overlapping portion are disposed in the same layer, and are disposed in a layer with the third overlapping portion. The third overlapping portion is located on the side of the first overlapping portion closer to the substrate.

[0097] In some embodiments, such as Figure 2 As shown, the driver chip 6 located in the bonding area DD can be bent to the back of the display panel (that is, the side away from the light-emitting side) through the bending area CC.

[0098] In some embodiments, the display panel includes an Efficiency Enhancement Structure (EES) to improve the light extraction efficiency of the light-emitting devices. The EES includes a first light-harvesting layer EES1 and a second light-harvesting layer EES2.

[0099] It should be noted that in related technologies, such as Figure 1b As shown, after the touch-sensitive FMLOC is fabricated, the light enhancement structure EES and the color filter layer (i.e., color on EN, COE) are sequentially fabricated along the direction away from the substrate 1; or, as... Figure 1cAs shown, after the touch-sensitive FMLOC is fabricated, the color filter layer and the light enhancement structure are sequentially fabricated along the direction away from the substrate 1. However, regardless of the above scheme, the distance between the black matrix layer BM and the light-emitting layer EL is relatively large, affecting the light emission angle.

[0100] In response, this disclosure adjusts the position of the black matrix layer BM to improve the light emission angle. Figure 9 for Figure 2 A cross-sectional view of the display area AA in the B-B' direction, as shown below. Figure 9 As shown, the display panel also includes a pixel limiting layer (PDL) and multiple light-emitting devices disposed on the side of the first sub-lead 21 near the signal line 3, a black matrix layer (BM) disposed on the side of the second sub-lead 22 away from the first sub-lead 21, a first light-harvesting layer (EES1) disposed on the side of the black matrix layer (BM) away from the second sub-lead 22, and a second light-harvesting layer (EES2) disposed on the side of the first light-harvesting layer (EES1) away from the black matrix layer (BM). The first light-harvesting layer (EES1) located in the display area AA includes multiple light-harvesting units (OC). The light-harvesting units (OC) are correspondingly disposed with the light-emitting devices. The black matrix layer (BM) located in the display area AA includes multiple black matrix openings, which are correspondingly disposed with the light-emitting devices, and the light-harvesting units (OC) are disposed within the black matrix openings. The light-emitting devices include an anode, a light-emitting layer (EL), and a cathode sequentially disposed along the direction away from the substrate 1. The light-emitting layer (EL) is disposed at least within the pixel opening.

[0101] Optionally, such as Figure 9 As shown, the orthogonal projection of the light-collecting unit OC on the substrate 1 covers the outline of the orthogonal projection of the pixel opening on the substrate 1.

[0102] Optionally, such as Figure 9 As shown, the outline of the orthogonal projection of the black matrix opening on the substrate 1 surrounds the orthogonal projection of the light-collecting unit OC on the substrate 1.

[0103] For example, the refractive index of the first light-collecting layer EES1 is greater than the refractive index of the second light-collecting layer EES2.

[0104] This embodiment improves the light emission angle by reducing the distance between the black matrix layer (BM) and the light-emitting layer (EL). Simultaneously, it reduces the planarization layer (TOC) by one layer, decreasing the display panel thickness and saving on manufacturing costs.

[0105] In some embodiments, such as Figure 9 As shown, the display panel also includes multiple color filters disposed on the side of the second light-collecting layer EES2 away from the first light-collecting layer EES1, and the color filters are disposed corresponding to the light-emitting devices.

[0106] For example, multiple light-emitting devices may include a red light-emitting device R, a green light-emitting device G, and a blue light-emitting device (not shown in the figure). Multiple color filters may include a red filter CF_R, a green filter CF_G, and a blue filter (not shown in the figure). The red filter CF_R is configured corresponding to the red light-emitting device R. The green filter CF_G is configured corresponding to the green light-emitting device G. The blue filter is configured corresponding to the blue light-emitting device.

[0107] For example, the light-emitting device can be an organic light-emitting diode (OLED).

[0108] The figure only shows two colors of light-emitting devices (i.e., red light-emitting device and green light-emitting device), but this does not constitute a limitation of this disclosure.

[0109] The light emitted by the light-emitting device is focused by the first light-collecting layer EES1, which has a high refractive index, and then diffused by the second light-collecting layer EES2, which has a low refractive index, before finally exiting through a color filter of the corresponding color. Because the black matrix layer BM and the color filter are arranged in layers and located on the side of the color filter closer to the light-emitting layer EL, the exit angle of the emitted light can be improved.

[0110] For example, such as Figure 9 As shown, the display panel also includes a pixel driving circuit located on the side of the light-emitting device closer to the substrate 1. The pixel driving circuit is used to drive the light-emitting device and includes multiple thin-film transistors (TFTs). A planarization layer (PLN) is disposed between the pixel driving circuit and the light-emitting device. The planarization layer (PLN) can be a single-layer structure or a multi-layer stacked structure (e.g., a first planarization layer (PLN1) and a second planarization layer (PLN2)) to improve planarity.

[0111] For example, such as Figure 9 As shown, signal line 3 can be disposed on the same layer as the source / drain electrode SD in the thin-film transistor TFT; or, signal line 3 can also be disposed on the same layer as the anode of the light-emitting device. Alternatively, the first and second overlapping portions of signal line 3 can be disposed on the same layer as the source / drain electrode SD in the thin-film transistor TFT, and the third overlapping portion can be disposed on the same layer as the anode of the light-emitting device.

[0112] In some embodiments, the display panel provided in this disclosure may be an OLED display panel.

[0113] This disclosure also provides a display device comprising the display substrate described in any of the above embodiments. The display device can be, for example, any product with a display function such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or in-vehicle device. Other essential components of this display device are readily understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting the scope of this disclosure.

[0114] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A display panel, having a display area, a peripheral area surrounding the display area, and a bending area located on a side of the peripheral area away from the display area; the peripheral area comprises a package stop area surrounding the display area, and a transition area located on a side of the package stop area away from the display area; the display panel comprises a substrate, a touch lead and a signal line disposed on the substrate, and a barrier structure; the barrier structure is located in the transition area; the signal line crosses the bending area and is configured to be electrically connected with a driving chip; the touch lead comprises a first sub-lead and a second sub-lead disposed in sequence and electrically connected in a direction away from the substrate; the display panel further comprises a black matrix layer disposed on a side of the second sub-lead away from the first sub-lead; the second sub-lead is located in the package stop area, and the black matrix layer wraps the second sub-lead; the first sub-lead extends from the package stop area to the transition area; a normal projection of the first sub-lead on the substrate in the transition area does not overlap with a normal projection of the second sub-lead on the substrate; the signal line is disposed on a side of the first sub-lead close to the substrate, and a first end of the signal line is electrically connected with the first sub-lead.

2. The display panel of claim 1, wherein, the display panel further comprises a touch buffer layer disposed between the first sub-lead and the signal line; the first sub-lead is electrically connected with the signal line through a first adapter hole penetrating the touch buffer layer.

3. The display panel of claim 2, wherein, the display panel further comprises a first light extraction layer disposed on a side of the black matrix layer away from the second sub-lead, and a second light extraction layer disposed on a side of the first light extraction layer away from the black matrix layer; the first light extraction layer wraps an edge portion of the black matrix layer away from the display area; and the second light extraction layer wraps the first light extraction layer.

4. The display panel of claim 1, wherein, the display panel further comprises a touch insulation layer disposed between the first sub-lead and the second sub-lead, and a touch buffer layer disposed between the first sub-lead and the signal line; the touch lead further comprises a connection lead; the first sub-lead is electrically connected with a first end of the connection lead through a second adapter hole penetrating the touch insulation layer, and a second end of the connection lead is electrically connected with the signal line through a third adapter hole penetrating the touch insulation layer and the touch buffer layer in sequence.

5. The display panel of claim 4, wherein, the connection lead is disposed in the same layer as the second sub-lead and is spaced apart.

6. The display panel of claim 4, wherein, the black matrix layer wraps the second sub-lead and the connection lead.

7. The display panel of claim 6, wherein, the display panel further comprises a first light extraction layer disposed on a side of the black matrix layer away from the second sub-lead, and a second light extraction layer disposed on a side of the first light extraction layer away from the black matrix layer; the first light extraction layer wraps an edge of the black matrix layer away from the display area; and the second light extraction layer wraps the first light extraction layer.

8. The display panel of claim 4, wherein, the connection lead is disposed in the same layer as the second sub-lead and is electrically connected; the display panel further comprises a black matrix layer disposed on a side of the second sub-lead away from the first sub-lead, and the black matrix layer wraps the first sub-lead and the connection lead.

9. The display panel of claim 8, wherein, The display panel further comprises a first light-taking layer arranged on a side of the black matrix layer away from the second sub-lead, and a second light-taking layer arranged on a side of the first light-taking layer away from the black matrix layer. The first light-taking layer wraps an edge of the black matrix layer away from the display area; and the second light-taking layer wraps the first light-taking layer.

10. The display panel of claim 1, wherein, The display panel further comprises a binding area on a side of the bending area away from the peripheral area. The touch lead further comprises a third sub-lead at least located in the binding area; the third sub-lead is arranged in the same layer as the first sub-lead. A first end of the third sub-lead is electrically connected to the second end of the signal line, and a second end of the third sub-lead is bindingly connected to the driving chip.

11. The display panel of any one of claims 1-10, wherein, The display panel further comprises a pixel definition layer and a plurality of light-emitting devices arranged on a side of the first sub-lead close to the signal line, a black matrix layer arranged on a side of the second sub-lead away from the first sub-lead, a first light-taking layer arranged on a side of the black matrix layer away from the second sub-lead, and a second light-taking layer arranged on a side of the first light-taking layer away from the black matrix layer. The first light-taking layer located in the display area comprises a plurality of light-taking units; the light-taking units are arranged correspondingly to the light-emitting devices. The black matrix layer located in the display area comprises a plurality of black matrix openings; the black matrix openings are arranged correspondingly to the light-emitting devices, and the light-taking units are arranged in the black matrix openings.

12. The display panel of claim 11, wherein, The display panel further comprises a plurality of color filters arranged on a side of the second light-taking layer away from the first light-taking layer; the color filters are arranged correspondingly to the light-emitting devices.

13. A display device comprising the display panel according to any one of claims 1-12.

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