Heat exchange device and thermal management system

Abstract

The application discloses a heat exchange device, which comprises a gas supplementing and enthalpy increasing part, a supercooling part and a shunt part. The gas supplementing and enthalpy increasing part comprises a first part of a top plate, first parts of at least two first plates and first parts of at least two second plates. The supercooling part comprises a second part of the top plate, a second part of the first plate and a second part of the second plate. The gas supplementing and enthalpy increasing part is provided with a first hole channel, a second hole channel, a first plate interchannel, a third hole channel, a fourth hole channel and a second plate interchannel. The supercooling part is provided with a fifth hole channel, a sixth hole channel, a third plate interchannel, a seventh hole channel, an eighth hole channel and a fourth plate interchannel. The third plate interchannel and the fourth plate interchannel are isolated from each other. The shunt part is provided with a first opening, a second opening and a third opening. The first opening, the second opening and the third opening are communicated with an inner cavity of the shunt part respectively. The shunt part controls the on-off of the first opening, the second opening and the third opening. The first opening is communicated with the sixth hole channel, the second opening is communicated with the first hole channel and the third opening is communicated with the third hole channel. The shunt part is connected with the top plate. In the application, the gas supplementing and enthalpy increasing part and the supercooling part are arranged close to the top plate. The shunt part is sealingly connected with the top plate. The first opening is communicated with the sixth hole channel, the second opening is communicated with the first hole channel and the third opening is communicated with the third hole channel. The connecting path of the gas supplementing and enthalpy increasing part and the supercooling part is reduced. The structure is compact. The space occupied by the connection between the gas supplementing and enthalpy increasing device and the supercooling device can be reduced. The application further discloses a heat management system with less occupied space.

Description

Technical Field

[0001] The present application relates to the field of heat exchange technology, and in particular to a heat exchange device and a thermal management system. Background Art

[0002] In the related technology, the heat exchange device includes an air-supplementing reheat increaser, a subcooler and a diverter. The air-supplementing reheat increaser and the subcooler are connected and communicated through a diverter and a pipeline. The air-supplementing reheat increaser can be used to increase the temperature and pressure of the refrigerant, and the subcooler can be used to adjust the cooling capacity of the refrigerant. The air-supplementing reheat increaser is arranged close to the top plate, and the subcooler is arranged away from the top plate. The connection path between the air-supplementing reheat increaser and the subcooler is longer, so that the space occupied by the connection between the air-supplementing reheat increaser and the subcooler is larger. Summary of the Invention

[0003] The purpose of this application is to provide a heat exchange device and a thermal management system that reduce occupied space.

[0004] In order to achieve the above objectives, this application adopts the following technical solutions:

[0005] In a first aspect, a heat exchange device comprises: an air-supplying and enthalpy-increasing part, a supercooling part and a diversion part, the air-supplying and enthalpy-increasing part comprises a first part of a top plate, the first parts of at least two first plates and the first parts of at least two second plates, the supercooling part comprises the second part of the top plate, the second part of the first plate and the second part of the second plate, the top plate, the first plate and the second plate are stacked, the first plate and the second plate are stacked alternately, and the first plate and the second plate are located on the same side of the top plate; the air-supplying and enthalpy-increasing part comprises a first channel, a second channel, a first inter-plate channel, a third channel, a fourth channel and a second inter-plate channel, the first inter-plate channel is located between the front side of the first part of the second plate and the reverse side of the first part of the adjacent first plate, the second inter-plate channel is located between the reverse side of the first part of the second plate and the front side of the first part of the adjacent first plate, the first channel and the second channel are respectively connected to both sides of the first inter-plate channel, and the third channel and the fourth channel are respectively connected to the second inter-plate channel The two sides of the channel are connected; the supercooling part has a fifth channel, a sixth channel, a third inter-plate channel, a seventh channel, an eighth channel and a fourth inter-plate channel, the third inter-plate channel is located between the front side of the second part of the second plate and the reverse side of the second part of the adjacent first plate, the fourth inter-plate channel is located between the reverse side of the second part of the second plate and the front side of the second part of the adjacent first plate, the fifth channel and the sixth channel are respectively connected to the two sides of the third inter-plate channel, the seventh channel and the eighth channel are respectively connected to the two sides of the fourth inter-plate channel, and the third inter-plate channel and the fourth inter-plate channel are isolated from each other; the diverter part has a first opening, a second opening and a third opening, the first opening, the second opening and the third opening are respectively connected to the inner cavity of the diverter part, and the diverter part controls the on and off of the first opening, the second opening and the third opening; the first opening is connected to the sixth channel, the second opening is connected to the first channel, the third opening is connected to the third channel, and the diverter part is connected to the top plate.

[0006] In the present application, by arranging the air-supplementing enthalpy-increasing part and the supercooling part close to the top plate, the diversion part is sealed and connected to the top plate, the first opening is connected to the sixth channel, the second opening is connected to the first channel, and the third opening is connected to the third channel, the communication path between the air-supplementing enthalpy-increasing part and the supercooling part is reduced, the structure is compact, and the space occupied by the connection between the air-supplementing enthalpy-increasing device and the supercooling device can be reduced.

[0007] In a second aspect, a thermal management system includes a compressor and the above-mentioned heat exchange device. When the thermal management system is in operation, the air supplement and enthalpy increase inlet of the compressor can be connected to the fourth channel.

[0008] In the present application, by arranging the air-supply enthalpy-increasing part and the supercooling part close to the top plate, the diversion part is sealed and connected to the top plate, the first opening is connected to the sixth channel, the second opening is connected to the first channel, the third opening is connected to the third channel, the air-supply enthalpy-increasing inlet of the compressor is connected to the fourth channel, and the connection between the air-supply enthalpy-increasing device and the supercooler occupies less space, thereby making the thermal management system occupy less space. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a cross-sectional schematic diagram of an embodiment of a heat exchange device of the present application;

[0010] Figure 2 This is a schematic structural diagram of an embodiment of a heat exchange device of the present application;

[0011] Figure 3 This is an exploded schematic diagram of an embodiment of a heat exchange device of the present application;

[0012] Figure 4 is an exploded schematic diagram of an embodiment of the heat exchange device of the present application from another angle;

[0013] Figure 5 is a cross-sectional schematic diagram of an embodiment of the heat exchange device of the present application from another perspective;

[0014] Figure 6 is a cross-sectional schematic diagram of another perspective of an embodiment of the heat exchange device of the present application;

[0015] Figure 7 is a cross-sectional schematic diagram of another perspective of an embodiment of the heat exchange device of the present application;

[0016] Figure 8 is a cross-sectional schematic diagram of another perspective of an embodiment of the heat exchange device of the present application;

[0017] Figure 9 This is a connection diagram of an embodiment of a thermal management system of the present application;

[0018] Figure 10 This is a connection diagram of another embodiment of the thermal management system of the present application. DETAILED DESCRIPTION

[0019] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0020] The terms used in this application are for the purpose of describing particular embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0021] It should be understood that the words “first”, “second” and similar terms used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as “a” or “an” do not indicate a quantity limitation, but rather indicate the presence of at least one; “plurality” indicates a quantity of two or more. Unless otherwise indicated, words such as “front”, “rear”, “lower” and / or “upper” are for ease of description only and are not limited to one position or one spatial orientation. Words such as “include” or “comprising” and similar terms mean that the elements or objects appearing before “include” or “comprising” cover the elements or objects listed after “include” or “comprising” and their equivalents, and do not exclude other elements or objects.

[0022] The heat exchange device of the exemplary embodiment of the present application is described in detail below with reference to the accompanying drawings. In the absence of conflict, the features of the following embodiments and implementations can complement or be combined with each other.

[0023] According to a specific embodiment of the heat exchange device 7 of the present application, as Figures 1 to 10 As shown, the heat exchanger 7 includes a plurality of plates stacked along the thickness direction of the heat exchanger 7. Each plate is generally sheet-shaped and rectangular. The heat exchanger 7 may be a plate heat exchanger. Optionally, the projected outlines of all plates on a plane perpendicular to the thickness direction of the heat exchanger 7 coincide, that is, the outer dimensions of all plates are the same. After all plates are stacked according to preset rules, welding can be completed in one go, simplifying the process and achieving a neat appearance. The length direction of the heat exchanger 7 is perpendicular to the stacking direction of the plates, which corresponds to the thickness direction of the heat exchanger 7.

[0024] In this embodiment, the heat exchanger 7 includes a reheating section 8 and a subcooling section 9. These sections are arranged along the length of the heat exchanger 7 and are positioned adjacent to each other. The reheating section 8 has a first flow channel S7 and a second flow channel S8, both of which are used to circulate refrigerant. Within the reheating section 8, the refrigerant in the first flow channel S7 exchanges heat with the refrigerant in the second flow channel S8.

[0025] The first flow channel S7 includes a first channel 81, a second channel 82 and multiple first inter-plate channels (not marked in the figure), and the second flow channel S8 includes a third channel 83, a fourth channel 84 and multiple second inter-plate channels (not marked in the figure). The first channel 81 and the second channel 82 are respectively connected to the two sides of the first inter-plate channel, and the third channel 83 and the fourth channel 84 are respectively connected to the two sides of the second inter-plate channel, and the first inter-plate channel and the second inter-plate channel are isolated from each other.

[0026] The subcooling section 9 has a ninth flow channel S9 and a tenth flow channel S10, which are isolated from each other. The ninth flow channel S9 is used to circulate refrigerant, and the tenth flow channel S10 is used to circulate coolant. In the subcooling section 9, the refrigerant in the ninth flow channel S9 exchanges heat with the coolant in the tenth flow channel S10. The outlet of the ninth flow channel S9 can communicate with the inlet of the first flow channel S7, and the outlet of the ninth flow channel S9 can communicate with the inlet of the second flow channel S8. The ninth flow channel S9 includes a fifth hole 91, a sixth hole 92, and multiple third inter-plate channels (not shown). The tenth flow channel S10 includes a seventh hole 93, an eighth hole 94, and multiple fourth inter-plate channels (not shown). The fifth hole 91 and the sixth hole 92 are respectively connected to the two sides of the third inter-plate channel, and the seventh hole 93 and the eighth hole 94 are respectively connected to the two sides of the fourth inter-plate channel. The third and fourth inter-plate channels are isolated from each other.

[0027] The heat exchange device 7 also includes an evaporator 3, which has a fifth flow channel S3 and a sixth flow channel S4, which are isolated from each other. The fifth flow channel S3 is used to circulate refrigerant, and the sixth flow channel S4 is used to circulate coolant. In the evaporator 3, the refrigerant can exchange heat with the coolant, and the refrigerant absorbs heat from the coolant. The outlet of the first flow channel S7 can communicate with the inlet of the fifth flow channel S3, and the outlet of the fifth flow channel S3 can communicate with the external space of the heat exchange device 7.

[0028] The fifth flow channel S3 includes a ninth channel 31, a tenth channel 32 and multiple fifth inter-plate channels (not marked in the figure), and the sixth flow channel S4 includes an eleventh channel 33, a twelfth channel 34 and multiple sixth inter-plate channels (not marked in the figure). The ninth channel 31 and the tenth channel 32 are respectively connected to the two sides of the fifth inter-plate channel, the eleventh channel 33 and the twelfth channel 34 are respectively connected to the two sides of the sixth inter-plate channel, and the fifth inter-plate channel and the sixth inter-plate channel are isolated from each other.

[0029] The air-supplying and enthalpy-increasing portion, the evaporation portion and the supercooling portion are arranged along the length direction of the multiple plates. The heat exchange device 7 also includes a first convex rib T1 and a second convex rib T2. The first convex rib T1 is located between the evaporation portion and the air-supplying and enthalpy-increasing portion, and the second convex rib T2 is located between the supercooling portion and the air-supplying and enthalpy-increasing portion.

[0030] Heat exchange device 7 also includes a condenser 1 having a seventh flow channel S1 and an eighth flow channel S2, which are isolated from each other. Refrigerant flows through seventh flow channel S1, while coolant flows through eighth flow channel S2. In condenser 1, the refrigerant exchanges heat with the coolant, heating the coolant.

[0031] The seventh flow channel S1 includes the nineteenth channel 11 and multiple seventh inter-plate channels (not marked in the figure), the eighth flow channel S2 includes the thirteenth channel 12, the fourteenth channel 13 and multiple eighth inter-plate channels (not marked in the figure), the nineteenth channel 11 and the liquid storage chamber 21 are respectively connected to the two sides of the seventh inter-plate channel, the thirteenth channel 12 and the fourteenth channel 13 are respectively connected to the two sides of the eighth inter-plate channel, and the seventh inter-plate channel and the eighth inter-plate channel are isolated from each other.

[0032] The heat exchange device 7 also includes a liquid storage portion 2 having a liquid storage chamber 21 for storing refrigerant. The liquid storage chamber 21 is communicable with the inlet of the ninth flow channel S9. The outlet of the seventh flow channel S1 is communicated with the liquid storage chamber 21. The eighth flow channel S2 is isolated from the liquid storage chamber 21. The liquid storage chamber 21 is used to circulate the refrigerant.

[0033] In some embodiments, reference Figures 1 to 10 The heat exchange device 7 includes a diverter 5, which has a diverting function and is used to divert the refrigerant. The diverter 5 has a first opening 51, a second opening 52, and a third opening 53. The first opening 51, the second opening 52, and the third opening 53 are respectively connected to the inner cavity of the diverter 5. The first opening 51 is the inlet of the diverter 5, and the second opening 52 and the third opening 53 are the outlets of the diverter 5. The diverter 5 controls the opening and closing of the first opening 51, the second opening 52, and the third opening 53. The outlet of the ninth flow channel S9 can be connected to the first opening 51, the inlet of the first flow channel S7 can be connected to the second opening 52, and the inlet of the second flow channel S8 can be connected to the third opening 53. The first opening 51, the second opening 52 and the third opening 53 are located on the same side of the heat exchange device 7, which is conducive to miniaturization of the heat exchange device 7 and reduction of heat loss of the refrigerant. Correspondingly, the outlet of the ninth flow channel S9, the inlet of the first flow channel S7 and the inlet of the second flow channel S8 are also located on the same side of the heat exchange device 7, making the heat exchange device 7 compact, which is conducive to miniaturization of the heat exchange device 7 and reduction of heat loss of the refrigerant.

[0034] The heat exchange device 7 also includes a first throttle portion 14 having a fourth opening 141 and a fifth opening 142, each of which communicates with the inner cavity of the first throttle portion 14. The first throttle portion 14 has a throttling capability. The third opening 53 communicates with the fourth opening 141, and the inlet of the second flow channel S8 communicates with the fifth opening 142. The fourth opening 141 and the fifth opening 142 are located on the same side of the heat exchange device 7 as the first opening 51, the second opening 52, and the third opening 53.

[0035] The first channel 81 is adjacent to the sixth channel 92, and the sixth channel 92, the third channel 83 and the first channel 81 are located on the same side of the top plate E. The orthographic projection of the first opening 51 on the top plate E overlaps with the sixth channel 92, the orthographic projection of the second opening 52 on the top plate E overlaps with the first channel 81, and the orthographic projection of the third opening 53 on the top plate E overlaps with the third channel 83.

[0036] The heat exchange device 7 further includes an intermediate heat exchange portion 4, a condensation portion 1, a liquid storage portion 2, a supercooling portion 9, an air supply enthalpy increasing portion 8 and an evaporation portion 3 located on the same side of the thickness direction of the intermediate heat exchange portion 4. Figures 1 to 5 The intermediate heat exchange section 4 has a third flow channel S5 and a fourth flow channel S6. The third flow channel S5 and the fourth flow channel S6 are isolated from each other in the intermediate heat exchange section 4. The outlet of the first flow channel S7 is connected to the inlet of the third flow channel S5, the outlet of the third flow channel S5 is connected to the inlet of the fifth flow channel S3, the outlet of the fifth flow channel S3 is connected to the inlet of the fourth flow channel S6, and the outlet of the fourth flow channel S6 is connected to the external space of the heat exchange device 7. The third flow channel S5 and the fourth flow channel S6 are both used to circulate refrigerant. The refrigerant in the third flow channel S5 and the refrigerant in the fourth flow channel S6 are refrigerants flowing in different sections of the same circuit. In the intermediate heat exchange section 4, the refrigerant in the third flow channel S5 can exchange heat with the refrigerant in the fourth flow channel S6.

[0037] The third flow channel S5 includes the twentieth channel 41, the fifteenth channel 42 and multiple ninth inter-plate channels (not marked in the figure), and the fourth flow channel S6 includes the seventeenth channel 43, the eighteenth channel 44 and multiple tenth inter-plate channels (not marked in the figure). The twentieth channel 41 and the fifteenth channel 42 are respectively connected to the two sides of the ninth inter-plate channel, the seventeenth channel 43 and the eighteenth channel 44 are respectively connected to the two sides of the tenth inter-plate channel, and the ninth inter-plate channel and the tenth inter-plate channel are isolated from each other in the intermediate heat exchange section 4.

[0038] The diverter 5 also has a sixth opening 54, which is connected to the inner cavity of the diverter 5. The diverter 5 controls the opening and closing of the sixth opening 54. The inlet of the third flow channel S5 is connected to the sixth opening 54. The sixth opening 54 is located on the same side of the first opening 51, the second opening 52 and the third opening 53.

[0039] The heat exchange device 7 also includes a second throttling portion 15, which has a seventh opening 151 and an eighth opening 152. The seventh opening 151 and the eighth opening 152 are respectively connected to the inner cavity of the second throttling portion 15, and the second throttling portion 15 has throttling capability; the outlet of the third flow channel S5 is connected to the seventh opening 151, and the inlet of the fifth flow channel S3 is connected to the eighth opening 152.

[0040] The multiple plates of the heat exchange device 7 include a top plate E, multiple first plates A, multiple second plates B, a first middle plate F, a second middle plate M, multiple third plates C, multiple fourth plates D, a third middle plate N, multiple fifth plates I, multiple sixth plates J and a bottom plate G. Along the stacking direction of the plates, the first plate A and the second plate B are stacked alternately, the third plate C and the fourth plate D are stacked alternately, and the fifth plate I and the sixth plate J are stacked alternately. The first plate A, the second plate B and the top plate E are located on one side of the first middle plate F, the first middle plate F is adjacent to the second middle plate M, the second middle plate M, the third plate C, the fourth plate D and the third middle plate N are located on the other side of the first middle plate F, the third plate C and the fourth plate D are located between the second middle plate M and the third middle plate N, the first plate A, the second plate B and the first middle plate F are located on the same side of the top plate E, the second middle plate M, the third plate C and the fourth plate D are located on one side of the third middle plate N, the fifth plate I, the sixth plate J and the bottom plate G are located on the other side of the third middle plate N, and the fifth plate I and the sixth plate J are located between the third middle plate N and the bottom plate G. The top plate E, multiple first plates A, multiple second plates B, first intermediate plates F and second intermediate plates M are stacked to include a supercooling part 9, the second intermediate plate M, multiple third plates C, multiple fourth plates D and third intermediate plates N are stacked to include a condensation part 1 and a liquid storage part 2, the top plate E, multiple first plates A, multiple second plates B, first intermediate plates F, second intermediate plates M, multiple third plates C, multiple fourth plates D and third intermediate plates N are stacked to include an air replenishment and enthalpy increase part 8 and an evaporation part 3, and the bottom plate G, multiple fifth plates I, multiple sixth plates J and third intermediate plates N are stacked to include an intermediate heat exchange part 4.

[0041] Optionally, along the stacking direction of the plates, the projected contours of the top plate E, the first plate A, the second plate B, the first middle plate F, the second middle plate M, the third plate C, the fourth plate D, the third middle plate N, the fifth plate I, the sixth plate J and the bottom plate G coincide.

[0042] Reference Figures 3 to 5, the third plate C and the fourth plate D both have a twelfth orifice H1, a fifth orifice H2, a sixth orifice H3, a fifteenth orifice H4, a thirteenth orifice H5, a fourteenth orifice H6, a seventh orifice H7, a hollow hole H8, a first orifice H10, a second orifice H11, a third orifice H12 and a fourth orifice H13, the twelfth orifice H1 of the third plate C and the twelfth orifice H1 of the fourth plate D are stacked into a nineteenth orifice 11, the fifth orifice H2 of the third plate C and the fifth orifice H2 of the fourth plate D are stacked into a thirteenth orifice 12, the sixth orifice H3 of the third plate C and the sixth orifice H3 of the fourth plate D are stacked into a fourteenth orifice 13, the fifteenth orifice H4 of the third plate C and the fifteenth orifice H4 of the fourth plate D are stacked into a ninth orifice 31, the thirteenth orifice H5 of the third plate C and the thirteenth orifice H5 of the fourth plate D are stacked The tenth channel 32, the fourteenth orifice H6 of the third plate C and the fourteenth orifice H6 of the fourth plate D are stacked into the eleventh channel 33, the seventh orifice H7 of the third plate C and the seventh orifice H7 of the fourth plate D are stacked into the twelfth channel 34, the hollow hole H8 passes through the plate along the thickness direction of the heat exchange device 7, the hollow hole H8 of the third plate C and the hollow hole H8 of the fourth plate D are stacked into the liquid storage chamber 21, the first orifice H10 of the third plate C and the first orifice H10 of the fourth plate D are stacked into the first channel 81, the second orifice H11 of the third plate C and the second orifice H11 of the fourth plate D are stacked into the second channel 82, the third orifice H12 of the third plate C and the third orifice H12 of the fourth plate D are stacked into the third channel 83, and the fourth orifice H13 of the third plate C and the fourth orifice H13 of the fourth plate D are stacked into the fourth channel 84. The nineteenth channel 11 , the thirteenth channel 12 , the fourteenth channel 13 , the ninth channel 31 , the tenth channel 32 , the eleventh channel 33 , the twelfth channel 34 , the first channel 81 , the second channel 82 , the third channel 83 and the fourth channel 84 all extend along the thickness direction of the heat exchange device 7 .

[0043] Depending on the design of the heat exchange device 7, the outlet of the liquid storage portion 2 can be located in the area of ​​the third intermediate plate N corresponding to the hollow hole H8, or in the area of ​​the second intermediate plate M corresponding to the hollow hole H. Specifically, the area of ​​the second intermediate plate M corresponding to the hollow hole H8 is a solid plate, and the area of ​​the third intermediate plate N corresponding to the hollow hole H8 is a solid plate. Except for the outlet of the liquid storage portion 2, the second intermediate plate M blocks one side of the liquid storage cavity 21, and the third intermediate plate N blocks the other side of the liquid storage cavity 21.

[0044] The liquid storage portion 2 and the supercooling portion 9 are located on the same side of the gas-compensating and enthalpy-increasing portion 8 in the thickness direction, and the liquid storage portion 2 and the supercooling portion 9 are arranged along the thickness direction of the gas-compensating and enthalpy-increasing portion 8 .

[0045] The front surface of each third plate C is disposed opposite the rear surface of an adjacent fourth plate D, and the rear surface of the same third plate C is disposed opposite the front surface of another adjacent fourth plate D. The seventh inter-plate channel, the fifth inter-plate channel, and the first inter-plate channel are located between the front surface of the fourth plate D and the rear surface of the adjacent third plate C. The eighth inter-plate channel, the sixth inter-plate channel, and the second inter-plate channel are located between the rear surface of the fourth plate D and the front surface of another adjacent third plate C.

[0046] Depending on the design of the heat exchanger 7, if the plate adjacent to the second intermediate plate M is the third plate C, the eighth inter-plate channel, the sixth inter-plate channel, and the second inter-plate channel are formed between the back surface of the second intermediate plate M and the front surface of the third plate C. If the plate adjacent to the second intermediate plate M is the fourth plate D, the seventh inter-plate channel, the fifth inter-plate channel, and the first inter-plate channel are formed between the back surface of the second intermediate plate M and the front surface of the fourth plate D. Similarly, depending on the design of the heat exchanger 7, the plate adjacent to the third intermediate plate N can be the third plate C or the fourth plate D. The first plate A, second plate B, fifth plate I, and sixth plate J are similar to the third plate C and fourth plate D and will not be further described here.

[0047] The first middle plate F, the second middle plate M, the third plate C, the fourth plate D, and the third middle plate N all include a first plate portion P1. The first middle plate F, the second middle plate M, and the third middle plate N all include a second plate portion P2. The top plate E, the first plate A, the second plate B, the first middle plate F, the second middle plate M, the third plate C, the fourth plate D, and the third middle plate N all include a third plate portion P3 and a fourth plate portion P4. The top plate E, the first plate A, and the second plate B all include a sixth plate portion P6. The first plate portion P1 of the first middle plate F, the first plate portion P1 of the second middle plate M, the first plate portion P1 of the third plate C, the first plate portion P1 of the fourth plate D, and the first plate portion P1 of the third middle plate N are stacked to form a condensation section 1. The second plate portion P2 of the first middle plate F, the second plate portion P2 of the second middle plate M, the hollow hole H8 of the third plate C, the hollow hole H8 of the fourth plate D, and the second plate portion P2 of the third middle plate N are stacked to form a liquid storage section 2. The third plate portion P3 of the top plate E, the third plate portion P3 of the first plate A, the third plate portion P3 of the second plate B, the third plate portion P3 of the first intermediate plate F, the third plate portion P3 of the second intermediate plate M, the third plate portion P3 of the third plate C, the third plate portion P3 of the fourth plate D, and the third plate portion P3 of the third intermediate plate N are stacked to form the evaporation section 3. The fourth plate portion P4 of the top plate E, the fourth plate portion P4 of the first plate A, the fourth plate portion P4 of the second plate B, the fourth plate portion P4 of the first intermediate plate F, the fourth plate portion P4 of the second intermediate plate M, the fourth plate portion P4 of the third plate C, the fourth plate portion P4 of the fourth plate D, and the fourth plate portion P4 of the third intermediate plate N are stacked to form the air-compensating enthalpy-increasing section 8. The sixth plate portion P6 of the top plate E, the sixth plate portion P6 of the first plate A, and the sixth plate portion P6 of the second plate B are stacked to form the supercooling section 9.

[0048] The top plate E, first plate A, second plate B, first intermediate plate F, second intermediate plate M, third plate C, fourth plate D, and third intermediate plate N all include a first rib T1, located between the evaporator 3 and the air-compensating and enthalpy-increasing section 8. The top plate E, first plate A, and second plate B all include a second rib T2, located between the subcooling section 9 and the air-compensating and enthalpy-increasing section 8. The first intermediate plate F, second intermediate plate M, third plate C, fourth plate D, and third intermediate plate N all include a third rib T3 and a fourth rib T4, located between the condenser 1 and the liquid storage section 2. The fourth rib T4 is located between the liquid storage section 2 and the air-compensating and enthalpy-increasing section 8. The top plate E, first plate A, second plate B, first intermediate plate F, second intermediate plate M, third plate C, fourth plate D, and third intermediate plate N are connected by a first rib T1 between the third plate section P3 and the fourth plate section P4. The top panel E, first panel A, and second panel B connect the sixth panel P6 and fourth panel P4 via a second rib T2. In the first, second, and third middle panels F, M, and N, the first panel P1 and second panel P2 are connected via a third rib T3, and the second panel P2 and fourth panel P4 are connected via a fourth rib T4. In the third and fourth panels C and D, a hollow hole H8 is located between the third and fourth ribs T3 and T4. The side of the third rib T3 facing away from the fourth rib T4 connects to the first panel P1, while the side of the fourth rib T4 facing away from the third rib T3 connects to the fourth panel P4. A seventh inter-panel channel is formed between the front surface of the first panel P1 of the fourth panel D and the back surface of the first panel P1 of the third panel C. An eighth inter-panel channel is formed between the back surface of the first panel P1 of the same fourth panel D and the front surface of the first panel P1 of another third panel C. A fifth inter-plate passage is formed between the front surface of the third plate portion P3 of the second plate B and the rear surface of the third plate portion P3 of the first plate A, and a sixth inter-plate passage is formed between the rear surface of the third plate portion P3 of the same second plate B and the front surface of the third plate portion P3 of another first plate A. A fifth inter-plate passage is formed between the front surface of the third plate portion P3 of the fourth plate D and the rear surface of the third plate portion P3 of the third plate C, and a sixth inter-plate passage is formed between the rear surface of the third plate portion P3 of the same fourth plate D and the front surface of the third plate portion P3 of another third plate C. A first inter-plate passage is formed between the front surface of the fourth plate portion P4 of the second plate B and the rear surface of the fourth plate portion P4 of the first plate A, and a second inter-plate passage is formed between the rear surface of the fourth plate portion P4 of the same second plate B and the front surface of the fourth plate portion P4 of another first plate A. A first inter-board channel is formed between the front surface of the fourth plate portion P4 of the fourth plate D and the rear surface of the fourth plate portion P4 of the third plate C. A second inter-board channel is formed between the rear surface of the fourth plate portion P4 of the same fourth plate D and the front surface of the fourth plate portion P4 of another third plate C. A third inter-board channel is formed between the front surface of the sixth plate portion P6 of the second plate B and the rear surface of the sixth plate portion P6 of the first plate A. A fourth inter-board channel is formed between the rear surface of the sixth plate portion P6 of the same second plate B and the front surface of the sixth plate portion P6 of another first plate A.The front surface of each fifth plate I is positioned opposite the rear surface of the adjacent sixth plate J, and the rear surface of the same fifth plate I is positioned opposite the front surface of another adjacent sixth plate J. The ninth inter-plate passage is located between the front surface of the sixth plate J and the rear surface of the adjacent fifth plate I, and the tenth inter-plate passage is located between the rear surface of the sixth plate J and the front surface of another adjacent fifth plate I. Depending on the design of the heat exchange device 7, the plate adjacent to the third intermediate plate N can be either the fifth plate I or the sixth plate J; and the plate adjacent to the bottom plate G can be either the fifth plate I or the sixth plate J.

[0049] The extension direction of the second rib T2 is perpendicular to the plane of the first plate A or the second plate B, and the extension direction of the fourth rib T4 is perpendicular to the plane of the first middle plate F, the second middle plate M, the third plate C, the fourth plate D or the third middle plate N.

[0050] The fifth plate I and the sixth plate J both include an eighth orifice K1, a ninth orifice K2, a tenth orifice K3, and an eleventh orifice K4. The eighth orifice K1 of the fifth plate I and the eighth orifice K1 of the sixth plate J are stacked to form a twentieth orifice 41. The ninth orifice K2 of the fifth plate I and the ninth orifice K2 of the sixth plate J are stacked to form a fifteenth orifice 42. The tenth orifice K3 of the fifth plate I and the tenth orifice K3 of the sixth plate J are stacked to form a seventeenth orifice 43. The eleventh orifice K4 of the fifth plate I and the eleventh orifice K4 of the sixth plate J are stacked to form an eighteenth orifice 44. The twentieth orifice 41, the fifteenth orifice 42, the seventeenth orifice 43, and the eighteenth orifice 44 extend along the thickness direction of the heat exchange device 7.

[0051] In this embodiment, the liquid storage chamber 21 is connected to the ninth flow channel S9 via the first and second intermediate plates F and M. The first and third flow channels S7 and S5, as well as the fourth and fifth flow channels S6 and S3, are connected via the third intermediate plate N. The orifice distribution of the third and fourth plates C and D is also present on the second intermediate plate M, with the difference being that the second intermediate plate M also includes a first through-hole M1, which extends through the thickness of the second intermediate plate M. The first through-hole M1 and the fifth channel 91 of the second intermediate plate M are correspondingly arranged along the thickness of the heat exchange device 7, connecting the liquid storage chamber 21 and the fifth channel 91. The orifice distribution of the second intermediate plate M is also present on the first intermediate plate F, with the difference being that the first intermediate plate F also includes a second through-hole F1, which extends through the thickness of the first intermediate plate F. The second through-hole F1, first opening 51, and sixth channel 92 of the first intermediate plate F are correspondingly arranged along the thickness direction of the heat exchange device 7. The opening distribution of the first intermediate plate F is also present on the first plate A and the second plate B, except that the first intermediate plate F also has a third rib T3, which is located between the condensation portion 1 and the liquid storage portion 2. The opening distribution of the eighth, tenth, and eleventh openings K1, K3, and K4 is also present on the third intermediate plate N, except that the third intermediate plate N blocks the ninth opening K2 and further includes a third through-hole N1, which extends through the third intermediate plate N along its thickness direction.

[0052] That is, the first plate A, the second plate B, the first middle plate F and the second middle plate M all have the fifteenth orifice H4, the thirteenth orifice H5, the fourteenth orifice H6, the seventh orifice H7, the first orifice H10, the second orifice H11, the third orifice H12 and the fourth orifice H13. The fifteenth orifice H4 of the first plate A, the fifteenth orifice H4 of the second plate B, the fifteenth orifice H4 of the first middle plate F, the fifteenth orifice H4 of the second middle plate M, the fifteenth orifice H4 of the third plate C and the fifteenth orifice H4 of the fourth plate D are connected to form the ninth orifice 31. The thirteenth orifice H5 of the first plate A, the thirteenth orifice H5 of the second plate B, the thirteenth orifice H5 of the first middle plate F, the second middle plate M, the fifteenth orifice H4 of the third plate C and the fifteenth orifice H4 of the fourth plate D are connected to form the ninth orifice 31. The thirteenth hole H5 of M, the thirteenth hole H5 of the third plate C and the thirteenth hole H5 of the fourth plate D are connected to form the tenth hole 32, the fourteenth hole H6 of the first plate A, the fourteenth hole H6 of the second plate B, the fourteenth hole H6 of the first middle plate F, the fourteenth hole H6 of the second middle plate M, the fourteenth hole H6 of the third plate C and the fourteenth hole H6 of the fourth plate D are connected to form the eleventh hole 33, the seventh hole H7 of the first plate A, the seventh hole H7 of the second plate B, the seventh hole H7 of the first middle plate F, the seventh hole H7 of the second middle plate M, the seventh hole H7 of the third plate C and the seventh hole H7 of the fourth plate D are connected to form the twelfth hole 34, the seventh hole H7 of the first plate A The first orifice H10, the first orifice H10 of the second plate B, the first orifice H10 of the first middle plate F, the first orifice H10 of the second middle plate M, the first orifice H10 of the third plate C and the first orifice H10 of the fourth plate D are connected to form a first channel 81, the second orifice H11 of the first plate A, the second orifice H11 of the second plate B, the second orifice H11 of the first middle plate F, the second orifice H11 of the second middle plate M, the second orifice H11 of the third plate C and the second orifice H11 of the fourth plate D are connected to form a second channel 82, the third orifice H12 of the first plate A, the third orifice H12 of the second plate B, the third orifice H12 of the first middle plate F, the third orifice H12 of the second middle plate M The opening H12, the third opening H12 of the third plate C and the third opening H12 of the fourth plate D are connected to form a third channel 83, the fourth opening H13 of the first plate A, the fourth opening H13 of the second plate B, the fourth opening H13 of the first middle plate F, the fourth opening H13 of the second middle plate M, the fourth opening H13 of the third plate C and the fourth opening H13 of the fourth plate D are connected to form a fourth channel 84, the sixteenth opening H14 of the first plate A, the sixteenth opening H14 of the second plate B, the sixteenth opening H14 of the first middle plate F, the sixteenth opening H14 of the second middle plate M, the sixteenth opening H14 of the third plate C and the sixteenth opening H14 of the fourth plate D are connected to form a sixteenth channel 85.

[0053] The first plate A, the second plate B, the first middle plate F and the second middle plate M all have a twelfth orifice H1, a fifth orifice H2 and a sixth orifice H3. The twelfth orifice H1 of the first plate A, the twelfth orifice H1 of the second plate B, the twelfth orifice H1 of the first middle plate F, the twelfth orifice H1 of the second middle plate M, the twelfth orifice H1 of the third plate C and the twelfth orifice H1 of the fourth plate D are connected to form a nineteenth orifice 11. The fifth orifice H2 of the first plate A and the fifth orifice H2 of the second plate B are connected to form a nineteenth orifice 11. The seventh channel 93 is connected, and the sixth orifice H3 of the first plate A and the sixth orifice H3 of the second plate B are connected to the eighth channel 94; the nineteenth channel 11, the ninth flow channel S9 and the tenth flow channel S10 are isolated from each other in the supercooling part 9, and the back of the second plate B and the front of the other first plate A are the fourth inter-plate channel. The tenth flow channel S10 includes the seventh channel 93, the eighth channel 94 and multiple fourth inter-plate channels, and the seventh channel 93 and the eighth channel 94 are respectively connected to the two sides of the fourth inter-plate channel.

[0054] The first plate A, the second plate B, the first intermediate plate F and the second intermediate plate M also include a first through hole M1. The first through hole M1 of the first plate A, the first through hole M1 of the second plate B and the first through hole M1 of the first intermediate plate F are connected to form a fifth channel 91. The first through hole M1 of the second intermediate plate M connects the liquid storage chamber 21 and the fifth channel 91.

[0055] The first plate A, the second plate B and the first intermediate plate F also include a second through hole F1. The second through hole F1 of the first plate A, the second through hole F1 of the second plate B and the second through hole F1 of the first intermediate plate F are connected to form a sixth channel 92, and the second intermediate plate M blocks the sixth channel 92. A third inter-plate channel is formed between the front side of the second plate B and the back side of the first plate A. The ninth flow channel S9 includes a fifth channel 91, a sixth channel 92 and multiple third inter-plate channels. The fifth channel 91 and the sixth channel 92 are respectively connected to the two sides of the third inter-plate channel.

[0056] The third intermediate plate N has an eighth hole K1, a tenth hole K3, and an eleventh hole K4. The eighth hole K1 connects to the twentieth hole 41 and the second hole 82. The tenth hole K3 connects to the seventeenth hole 43 and the tenth hole 32. The eleventh hole K4 connects to the eighteenth hole 44 and the second connecting hole 22. The third intermediate plate N blocks the fifteenth hole 42. The third intermediate plate N also has a third through hole N1, which passes through the third intermediate plate N along its thickness and connects the sixteenth hole 85 and the twentieth hole 41.

[0057] On the same plate, the first hole H10 and the second hole H11 are arranged diagonally, the third hole H12 and the fourth hole H13 are arranged diagonally, and the first through hole M1 and the sixth hole H3 are arranged diagonally.

[0058] The first intermediate plate F and the second intermediate plate M are used to form the air-supplying and enthalpy-increasing section 8, the supercooling section 9 and the evaporation section 3, and are also used to form the condensation section 1 and the liquid storage section 2, and can also realize the connection between the two spaces. The third intermediate plate N is used to form the air-supplying and enthalpy-increasing section 8, the condensation section 1, the liquid storage section 2 and the evaporation section 3, and is also used to form the intermediate heat exchange section 4, and can also realize the connection between the two spaces. The number of components is reduced as much as possible, the structure is simplified, and the heat exchange device 7 has a compact structure, which is conducive to miniaturization.

[0059] The bottom plate G, the fifth plate I and the sixth plate J all include a fifth plate portion P5. The fifth plate portion P5 of the fifth plate I, the fifth plate portion P5 of the sixth plate J, the fifth plate portion P5 of the bottom plate G and the third intermediate plate N are connected to form an intermediate heat exchange portion 4.

[0060] A ninth inter-board channel is formed between the front surface of the fifth plate portion P5 of the sixth plate J and the back surface of the fifth plate portion P5 of the fifth plate I, and a tenth inter-board channel is formed between the back surface of the fifth plate portion P5 of the same sixth plate J and the front surface of the fifth plate portion P5 of another fifth plate I.

[0061] The diverter 5 is sealed with the top plate E and is located on a side of the top plate E away from other plates. The diverter 5 may be a diverter valve.

[0062] The first opening 51 connects the sixth channel 92 and the inner cavity of the diverter 5 , the second opening 52 connects the first channel 81 and the inner cavity of the diverter 5 , the third opening 53 connects the third channel 83 and the inner cavity of the diverter 5 , and the diverter 5 is sealed with the top plate E.

[0063] The air-compensating and enthalpy-increasing portion 8 also has a sixteenth channel 85. Both the third plate C and the fourth plate D include a sixteenth orifice H14. The sixteenth orifice H14 of the third plate C and the sixteenth orifice H14 of the fourth plate D are stacked to form the sixteenth channel 85. The sixth opening 54 connects the sixteenth channel 85 with the inner cavity of the diverter portion 5. The sixteenth channel 85 is connected to the third flow channel S5 of the intermediate heat exchange portion 4.

[0064] In this embodiment, the subcooling portion 9 and the air-supplying enthalpy-increasing portion 8 can be connected via the diversion portion 5 , thereby shortening the connection path and facilitating miniaturization.

[0065] The intermediate heat exchange section 4 has a first communication channel 45 that extends along the thickness of the heat exchange device 7 and penetrates both sides of the intermediate heat exchange section 4 in this direction. The first communication channel 45 has openings in both the third intermediate plate N and the bottom plate G. The first communication channel 45, the third flow channel S5, and the fourth flow channel S6 are isolated from each other within the intermediate heat exchange section 4. The first communication channel 45 connects the fifth opening 142 with the inlet of the fifth flow channel S3. The first throttle section 14 is sealed to the top plate E and the diverter section 5. The first throttle section 14 can be a throttle valve or an expansion valve, such as an electronic expansion valve.

[0066] The second throttling portion 15 is sealed and connected to the bottom plate G. The second throttling portion 15 may be a throttling valve or an expansion valve, such as an electronic expansion valve.

[0067] The third intermediate plate N, the fifth plate I, and the sixth plate J all include a first communication opening K5. The first communication opening K5 of the fifth plate I and the first communication opening K5 of the sixth plate J are stacked to form a first communication channel 45. The first communication opening K5 of the third intermediate plate N penetrates the third intermediate plate N along its thickness. The bottom plate G has a seventh through-hole G1 and an eighth through-hole G2, each of which penetrates the bottom plate G along its thickness. The ninth opening K2 of the fifth plate I, the ninth opening K2 of the sixth plate J, the seventh through-hole G1, and the seventh opening 151 are correspondingly arranged along the thickness of the heat exchange device 7. The seventh through-hole G1 connects the fifteenth channel 42 and the seventh opening 151. The first communication opening K5 of the fifth plate I, the first communication opening K5 of the sixth plate J, the fifteenth opening H4 of the third plate C, the fifteenth opening H4 of the fourth plate D, the first communication opening K5, the eighth through hole G2, and the eighth opening 152 are correspondingly arranged along the thickness direction of the heat exchanger 7. The first communication opening K5 of the third intermediate plate N connects the first communication channel 45 and the ninth channel 31. To facilitate installation of the heat exchanger 7 and connection between the heat exchanger 7 and other components, the side of the heat exchanger 7 near the bottom plate G has no channel openings. All external interfaces of the heat exchanger 7 are located on the top plate E. External piping connected to the heat exchanger 7 is located near the top plate E, while the bottom plate G facilitates installation of the heat exchanger 7. To extend the outlet of the fourth flow channel S6 to the top plate E, the liquid reservoir 2 has a second communication channel 22. This second communication channel 22 extends along the thickness of the heat exchange device 7 and penetrates both sides of the liquid reservoir 2. The second communication channel 22 has openings in the first intermediate plate F, the second intermediate plate M, the third intermediate plate N, and the top plate E. The second communication channel 22 is isolated from the liquid reservoir chamber 21 within the liquid reservoir 2 and communicates with the eighteenth channel 44. The first plate A, the second plate B, the first intermediate plate F, the second intermediate plate M, the third plate C, and the fourth plate D all include a second communication port H9. The second communication port H9 of the first plate A, the second plate B, the first intermediate plate F, the second intermediate plate M, the third plate C, and the fourth plate D are stacked to form the second communication channel 22. The third intermediate plate N connects the second connecting channel 22 and the eighteenth channel 44. The heat exchange device 7 of the present application includes eleven plates. The eleven plates are first stamped out according to the design requirements, and then the plates are stacked according to a preset rule. The heat exchange device 7 can be manufactured through a single welding process, which has high production efficiency and low production cost.

[0068] The liquid storage portion 2 also includes the seventh plate portion P7 of the third plate C and the seventh plate portion P7 of the fourth plate D. The seventh plate portion P7 divides the hollow hole H8 into a first sub-hollow hole H81 and a second sub-hollow hole H15. The liquid storage portion 2 has an eleventh inter-plate channel and a twelfth inter-plate channel. The eleventh inter-plate channel is located between the front surface of the seventh plate portion P7 of the third plate C and the back surface of the seventh plate portion P7 of the adjacent fourth plate D, between the back surface of the seventh plate portion P7 of the third plate C and the front surface of the seventh plate portion P7 of the fourth plate D, between the front surface of the seventh plate portion P7 of the fourth plate D and the second plate portion P2 of the second intermediate plate M, or between the seventh plate portion P7 of the third plate C and the second plate portion P2 of the second intermediate plate M. Between the back surface of the seventh plate portion P7 and the front surface of the second plate portion P2 of the third middle plate N, the first sub-hollow hole H81 is connected to the eleventh inter-plate channel and the twelfth inter-plate channel, and the second sub-hollow hole H15 is connected to the eleventh inter-plate channel and the twelfth inter-plate channel; the seventh plate portion P7 has a second connecting hole H9, and the second connecting hole H9 of the seventh plate portion P7 of the third plate C and the second connecting hole H9 of the seventh plate portion P7 of the fourth plate D are connected to form a second connecting channel 22. The second connecting channel 22 is isolated from the eleventh inter-plate channel and the twelfth inter-plate channel, and the second connecting channel 22 is connected to the eighteenth channel 44.

[0069] The orthographic projection of the fifth channel 91 on the third plate C or the fourth plate D is located in the first sub-hollow hole H81, and the orthographic projection of the sixth channel 92 on the third plate C or the fourth plate D is located in the second sub-hollow hole H15.

[0070] In this embodiment, the first plate portion P1, the second plate portion P2, the third plate portion P3, the fourth plate portion P4, the fifth plate portion P5, the sixth plate portion P6, and the seventh plate portion P7 are all flat plates except for the portions where the orifices are provided. Optionally, during the stamping step, structures such as raised dots or herringbone waves can be formed on the plates, or ribs for U-shaped flow can be stamped to enhance the heat exchange effect.

[0071] According to one embodiment of the thermal management system of the present application, Figures 9 and 10 The thermal management system is primarily used to manage cooling and heating to meet vehicle-wide cooling and heating needs, such as cabin cooling / heating, motor cooling, and battery heating / cooling. Some cooling / heat is supplied through methods such as operating a refrigerant circulation loop, activating a heater, or using the coolant's own cooling capacity. Some heat is recovered through methods such as recycling cooling / heat from other components. Integrating some components of the thermal management system creates a heat exchange device 7.

[0072] The various components of the thermal management system are connected by piping to form two separate systems: the refrigerant system and the coolant system. The refrigerant system circulates refrigerant, while the coolant system circulates coolant. The refrigerant can be R134A, carbon dioxide, or another heat exchange medium, while the coolant can be a mixture of ethanol and water or another cooling medium.

[0073] In the present application, the thermal management system includes a compressor 6 and a heat exchange device 7 of any of the above-mentioned embodiments. The structure of the heat exchange device 7 can be adjusted according to actual needs. For the convenience of description, this embodiment is described as an example in which the heat exchange device 7 includes a diversion part 5, a first throttling part 14 and a second throttling part 15.

[0074] The condensing section 1 and the evaporating section 3 are used to realize heat exchange between the refrigerant and the coolant respectively, and the intermediate heat exchange section 4 is used to realize heat exchange between two refrigerants in the same circuit. The air replenishment and enthalpy increase section 8 is used to realize heat exchange between two refrigerants in the same circuit. The supercooling section 9 is used to cool the refrigerant to a state below its saturation temperature. The first flow channel S7, the second flow channel S8, the seventh flow channel S1, the fifth flow channel S3, the third flow channel S5, the fourth flow channel S6 and the ninth flow channel S9 are connected to the refrigerant system, and the eighth flow channel S2, the sixth flow channel S4 and the tenth flow channel S10 are connected to the coolant system. The outlet of the compressor 6 is connected to the nineteenth channel 11 of the heat exchange device 7, the inlet of the compressor 6 is connected to the second connecting channel 22 of the heat exchange device 7, and the air replenishment and enthalpy increase inlet of the compressor 6 is connected to the fourth channel 84 of the heat exchange device 7. The thermal management system of the present application is a full-circuit system. Depending on whether the air replenishment and enthalpy increase function is turned on, the flow path of the refrigerant is divided into two situations.

[0075] like Figure 9 As shown, when the air replenishment and enthalpy increase function of the heat exchange device 7 is turned on, the flow path of the refrigerant is as follows: it flows out from the outlet of the compressor 6, passes through the seventh flow channel S1 of the condensing part 1, the liquid storage chamber 21 of the liquid storage part 2, the ninth flow channel S9 of the supercooling part 9, the first opening 51 of the diverter part 5, and the inner cavity of the diverter part 5. Thereafter, the flow path of the refrigerant is divided into two paths, one of which flows out from the second opening 52 of the diverter part 5, passes through the first flow channel S7 of the air replenishment and enthalpy increase part 8, the third flow channel S5 of the intermediate heat exchange part 4, and the second throttling part 6. The other way flows out from the third opening 53 of the diverter part 5, passes through the fourth opening 141 of the first throttling part 14, the inner cavity of the first throttling part 14, the fifth opening 142 of the first throttling part 14, the second flow channel S8 of the air replenishment and enthalpy increase part 8, and enters the air replenishment and enthalpy increase inlet of the compressor 6.

[0076] like Figure 10As shown, when the air replenishment and enthalpy increase function of the heat exchange device 7 is turned off, the flow path of the refrigerant is as follows: flowing out from the outlet of the compressor 6, through the seventh flow channel S1 of the condensation part 1, the liquid storage chamber 21 of the liquid storage part 2, the ninth flow channel S9 of the supercooling part 9, the first opening 51 of the diverter part 5, the inner cavity of the diverter part 5, the sixth opening 54 of the diverter part 5, the third flow channel S5 of the intermediate heat exchange part 4, the seventh opening 151 of the second throttling part 15, the inner cavity of the second throttling part 15, the eighth opening 152 of the second throttling part 15, the fifth flow channel S3 of the evaporation part 3, the fourth flow channel S6 of the intermediate heat exchange part 4, and enters the inlet of the compressor 6.

[0077] The condensing section 1 serves as a water-cooled condenser for heating the coolant. The evaporating section 3 serves as a water-cooled evaporator for reducing the coolant temperature. The intermediate heat exchange section 4 serves as an intermediate heat exchanger for exchanging heat between a higher-temperature refrigerant and a lower-temperature refrigerant. The liquid storage section 2 serves as a liquid reservoir for storing refrigerant. The subcooling section 9 serves as a subcooler for cooling the refrigerant to a temperature below its saturation temperature. The coolant system can be designed as required and is not limited by this application.

[0078] The thermal management system of the present application is a full-circuit system, which can reduce the refrigerant charge, lower the leakage rate, and is more conducive to the integration of the refrigerant system. The use of a highly integrated heat exchange device 7 makes the thermal management system occupy less space.

[0079] In this application, the term "connection" between two components can be a direct connection or a connection via a pipeline. The two components can be connected by only a pipeline or by a valve device or other components in addition to the pipeline. Similarly, the term "communication" between two components can be a direct connection or a connection via a pipeline. The two components can be connected by only a pipeline or by a valve device or other components in addition to the pipeline.

[0080] The above description is merely a preferred embodiment of the present application and does not constitute any form of limitation to the present application. Although the present application has been disclosed as above with preferred embodiments, it is not intended to limit the present application. Any technician familiar with this profession can make slight changes or modifications to equivalent embodiments with equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A heat exchange device, characterized in that: include: an air-supplementing and enthalpy-increasing portion, a subcooling portion, and a diversion portion, wherein the air-supplementing and enthalpy-increasing portion comprises a first portion of a top plate, first portions of at least two first plates, and first portions of at least two second plates; the subcooling portion comprises a second portion of the top plate, a second portion of the first plate, and a second portion of the second plate; the top plate, the first plates, and the second plates are stacked, the first plates and the second plates are alternately stacked, and the first plates and the second plates are located on the same side of the top plate; The air-supplementing and enthalpy-increasing portion comprises a first hole, a second hole, a first inter-plate channel, a third hole, a fourth hole, and a second inter-plate channel, wherein the first inter-plate channel is located between the front surface of the first portion of the second plate and the rear surface of the first portion of the adjacent first plate, and the second inter-plate channel is located between the rear surface of the first portion of the second plate and the front surface of the first portion of the adjacent first plate, the first hole and the second hole are respectively communicated with both sides of the first inter-plate channel, and the third hole and the fourth hole are respectively communicated with both sides of the second inter-plate channel; The supercooling portion comprises a fifth channel, a sixth channel, a third inter-plate channel, a seventh channel, an eighth channel and a fourth inter-plate channel, the third inter-plate channel being located between the front surface of the second portion of the second plate and the rear surface of the second portion of the adjacent first plate, the fourth inter-plate channel being located between the rear surface of the second portion of the second plate and the front surface of the second portion of the adjacent first plate, the fifth channel and the sixth channel being communicated with both sides of the third inter-plate channel respectively, the seventh channel and the eighth channel being communicated with both sides of the fourth inter-plate channel respectively, and the third inter-plate channel and the fourth inter-plate channel being isolated from each other; The diverter has a first opening, a second opening, and a third opening, wherein the first opening, the second opening, and the third opening are respectively connected to the inner cavity of the diverter, and the diverter controls the opening and closing of the first opening, the second opening, and the third opening; The first opening is communicated with the sixth channel, the second opening is communicated with the first channel, the third opening is communicated with the third channel, and the diverter is connected to the top plate.

2. The heat exchange device according to claim 1, characterized in that: The first channel is adjacent to the sixth channel, the sixth channel, the third channel and the first channel are located on the same side of the top plate, the orthographic projection of the first opening on the top plate overlaps with the sixth channel, the orthographic projection of the second opening on the top plate overlaps with the first channel, and the orthographic projection of the third opening on the top plate overlaps with the third channel.

3. The heat exchange device according to claim 1, characterized in that: The top plate blocks one side of the second channel and one side of the fifth channel, and the openings of the first channel, the third channel, the fourth channel, the sixth channel, the seventh channel and the eighth channel are located on the top plate.

4. The heat exchange device according to any one of claims 1 to 3, characterized in that: The first part of the first plate and the first part of the second plate include a first orifice, a second orifice, a third orifice and a fourth orifice, the second part of the first plate and the second part of the second plate include a first through hole, a second through hole, a fifth orifice and a sixth orifice, the first orifice of the first plate and the first orifice of the second plate are connected to form the first channel, the second orifice of the first plate and the second orifice of the second plate are connected to form the second channel, the third orifice of the first plate and the third orifice of the second plate are connected to form the third channel, the fourth orifice of the first plate and the fourth orifice of the second plate are connected to form the fourth channel, the first through hole of the first plate and the first through hole of the second plate are connected to form the fifth channel, the second through hole of the first plate and the second through hole of the second plate are connected to form the sixth channel, the fifth orifice of the first plate and the fifth orifice of the second plate are connected to form the seventh channel, and the sixth orifice of the first plate and the sixth orifice of the second plate are connected to form the eighth channel.

5. The heat exchange device according to claim 4, characterized in that: On the same plate, the first orifice and the second orifice are arranged diagonally, the third orifice and the fourth orifice are arranged diagonally, and the first through hole and the sixth orifice are arranged diagonally.

6. The heat exchange device according to any one of claims 1 to 3, characterized in that: The heat exchange device further includes a first throttling portion, the first throttling portion having a fourth opening and a fifth opening, the fourth opening and the fifth opening being respectively communicated with the inner cavity of the first throttling portion; The third opening is communicated with the fourth opening, and the third channel is communicated with the fifth opening.

7. The heat exchange device according to any one of claims 1 to 3, characterized in that: Also included is an evaporation portion, the evaporation portion including a third portion of the top plate, a third portion of the first plate, and a third portion of the second plate; The evaporation portion comprises a ninth channel, a tenth channel, a fifth inter-plate channel, an eleventh channel, a twelfth channel, and a sixth inter-plate channel, wherein the fifth inter-plate channel is located between the front surface of the second plate and the rear surface of the adjacent first plate, and the sixth inter-plate channel is located between the rear surface of the second plate and the front surface of the adjacent first plate, the ninth channel and the tenth channel are respectively connected to both sides of the fifth inter-plate channel, the eleventh channel is respectively connected to both sides of the sixth inter-plate channel, and the fifth inter-plate channel and the sixth inter-plate channel are isolated from each other; The first part, the second part and the third part of the top plate are arranged along the length direction of the top plate, the first part, the second part and the third part of the first plate are arranged along the length direction of the first plate, and the first part, the second part and the third part of the second plate are arranged along the length direction of the second plate.

8. The heat exchange device according to claim 7, characterized in that: The top plate blocks one side of the ninth channel and one side of the tenth channel, and the openings of the eleventh channel and the twelfth channel are located on the top plate.

9. The heat exchange device according to any one of claims 1 to 3, characterized in that: The diverter portion further has a sixth opening, the sixth opening being in communication with the inner cavity of the diverter portion, and the diverter portion controls the opening and closing of the sixth opening; The air-supplementing and enthalpy-increasing portion has a sixteenth channel, which is separated from the first inter-plate channel and the second inter-plate channel. The first part of the first plate and the first part of the second plate have a sixteenth orifice. The sixteenth orifice of the first plate and the sixteenth orifice of the second plate are connected to form the sixteenth channel, and the sixteenth channel is connected to the sixth opening.

10. A thermal management system, characterized in that: It comprises a compressor and the heat exchange device according to any one of claims 1 to 9, and when the thermal management system is in operation, the air supplement and enthalpy increase inlet of the compressor can be connected to the fourth channel.

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