A data information processor device

By designing a data processor device that contains temperature -pass, sensors, regulators, motors, lift blocks, telescopic hoods, and cooling frames, it solves the problem of overheating caused by the single -sided heat dissipation of the processor chip, and achieves more efficient heat dissipation. And longer service life.

CN118331408BActive Publication Date: 2025-01-24ZHONGCHENG ELECTRICAL EQUIPMENT (SHANDONG) CO LTD
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Patent Information

Application Number
CN202410580870.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-05-11
Publication Date
2025-01-24
Estimated Expiration
2044-05-11

AI Technical Summary

Technical Problem

Existing processor chips are prone to heat in working states, and single-sided heat dissipation leads to overheating damage. The existing technology mostly uses silicon grease to contact with the cooling fan or water-cooled circulation-type heat dissipation, but there is still a problem of single-sided heat dissipation.

Method used

A data information processor device is designed, including a circuit board, a radiator, a temperature transfer component, a sensor, a regulator, a motor, a lifting block, a telescopic cover and a cooling frame. The sensor detects the temperature of the processing body, and the regulator drives the motor to operate. , the lifting block slides to fit the treatment body, the auxiliary fan assists in cooling, and the telescopic cover prevents dust from entering.

Benefits of technology

Effectively avoid the problem of overheating caused by single -sided heat dissipation of the chip, extend the service life of the processor, improves the heat dissipation performance, prevent high temperature damage, and avoid dust from entering the normal work.

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Abstract

The present invention provides a data information processor device, which relates to the field of processor technology, and specifically includes: a circuit board; a radiator is fixedly connected to the middle position of the top of the circuit board, the radiator is provided with a connecting line, copper pillars are provided at the four corners of the top of the radiator, and the copper pillars of the radiator are fixedly connected to the mounting plate. When the bonding sensor contacts the processing body, it will transmit instructions to the auxiliary fan through its connection with the auxiliary fan to ensure that the auxiliary fan is in a working state. At this time, when the mounting plate is in the process of bonding and cooling the processing body, the auxiliary fan assists in cooling the cooling rack and the copper pipe fittings. This solves the problem that in the existing heat dissipation process of the processor chip, most of the chips are coated with silicone grease to contact the cooling fan or the processor chip is subjected to cyclic heat dissipation by water cooling, and the single-sided heat dissipation of the chip still causes overheating.
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Description

Technical Field

[0001] The present invention relates to the field of processor technology, and in particular to a data information processor device. Background Art

[0002] The data processor is a new generation of processor for data-centric computing. It integrates complete data center functions into a single chip. Together with the CPU and GPU, it constitutes the three major pillars of new computing. Many of them exist in the form of chips, forming a complete information processing library.

[0003] Application No. CN202110663369.0 The present invention discloses an information security processor, which relates to the technical field of information security processors, including a mounting shell, a movable box cover mounted on the top of the mounting shell, and an information security processor mounted inside the mounting shell. A heat dissipation and anti-burning component and a drive component for cooling the inside of the mounting shell are mounted on the side wall of the mounting shell, and a temperature sensor is mounted on the inner wall of the mounting shell. The present invention has a reasonable structure, and the temperature sensor can detect the internal temperature of the mounting shell, so that the drive component is connected to the heat dissipation and anti-burning component, so that the heat dissipation and anti-burning component can stably and efficiently cool the inside of the mounting shell, so that the power loss is lower, dust will not enter the information security processor, the information security processor has better heat dissipation performance, and the information security processor is protected from being burned due to high temperature, so that the service life of the information security processor is longer.

[0004] Based on the search of the above patents and the application of existing data information processor devices, it is understood that current processor chips are prone to generate heat in the working state. If the heat is not dissipated in time, it will cause overheating and damage to the body. However, in the current processor chip heat dissipation process, most of them apply silicone grease on the top of the chip to contact the cooling fan or use water cooling to perform cyclic heat dissipation treatment on the processor chip. Single-sided heat dissipation of the chip will still cause overheating.

[0005] Therefore, in view of this, the existing structure and defects are studied and improved, and a data information processor device is provided to achieve a more practical purpose. Summary of the invention

[0006] In order to solve the above technical problems, the present invention provides a data information processor device to solve the problem that in the existing processor chip heat dissipation process, most of the chips are coated with silicone grease to contact with the cooling fan or the processor chip is subjected to circulation heat dissipation treatment by water cooling. However, the single-sided heat dissipation of the chip still leads to overheating.

[0007] The present invention provides a data information processor device, specifically comprising: a circuit board; a radiator is fixedly connected to the middle position of the top of the circuit board, the radiator is provided with a connecting line, copper columns are provided at the four corners of the top of the radiator, and the copper columns of the radiator are fixedly connected to a mounting plate, a processor holder is installed at the middle position of the top of the mounting plate, a processing body is fixed inside the processor holder, a temperature transfer component is provided at the middle and rear position of the top of the mounting plate, a regulator is fixedly connected to the rear end position of the top of the mounting plate, a sensor is provided at the front and lower position of the regulator, the sensor is plugged into the temperature transfer component, a motor is provided at the top position of the regulator, and a lifting block is slidably connected to the front end position of the regulator, a threaded hole is opened at the top position of the lifting block, a motor shaft is located at the front end position inside the regulator, and a thread is provided on the motor shaft, and the motor shaft is located in the threaded hole of the lifting block.

[0008] Furthermore, a power port is fixedly connected to the left middle position of the front end of the circuit board, a USB port is arranged on the left top position of the circuit board, and an HDMI port is arranged on the right front end position of the circuit board.

[0009] Furthermore, a power supply port is provided at the top left position of the circuit board, and the power supply port is plugged into the connection line position of the radiator.

[0010] Furthermore, a telescopic cover A is provided at the upper position of the front end of the regulator, the lower position of the telescopic cover A is connected to the upper position of the lifting block, and the lower position of the lifting block is connected to the upper position of the telescopic cover B.

[0011] Furthermore, the lower position of the telescopic cover B is connected to the lower position of the front end of the regulator, the telescopic cover A and the telescopic cover B are symmetrically designed, and the motor shaft is located inside the telescopic cover A and the telescopic cover B.

[0012] Furthermore, the front end position of the lifting block is fixedly connected to the middle position of the rear end of the transverse frame, the internal position of the transverse frame is rotatably connected with a bidirectional screw, the left and right sides of the bidirectional screw are designed with reverse threads, and the front end position of the transverse frame is slidably connected with a positioning piece.

[0013] Furthermore, the two positioning members are symmetrically designed, and threaded holes are provided at the rear positions of the sides of the two positioning members, and the left and right sides of the bidirectional screw are located in the threaded holes on the sides of the two positioning members.

[0014] Furthermore, a fitting groove is provided above the two positioning members, a cooling rack is clamped in the fitting grooves of the two positioning members, a copper pipe fitting is provided at the lower inner portion of the cooling rack, a fitting member is installed below the copper pipe fitting, the fitting member is located above the processing body, an auxiliary fan is installed at the front end of the cooling rack, a sensor is provided at the bottom of the fitting member, and the sensor of the fitting member is connected to the auxiliary fan.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] When the operating temperature of the processing body is too high, the mounting plate transfers the heat to the sensor through the temperature transfer component. The sensor receives the high temperature warning prompt and transmits it to the regulator, which in turn drives the motor to rotate. The lifting block will slide downward at the front end of the regulator until the bottom of the fitting fits the processing body. At the same time, the fitting sensor contacts the processing body and transmits the command to the auxiliary fan through its connection with the auxiliary fan to ensure that the auxiliary fan is in working condition. At this time, when the mounting plate is fitting and cooling the processing body, the auxiliary fan assists in cooling the cooling rack and copper pipe fittings, avoiding the situation where the chip's single-sided heat dissipation still causes overheating and affects itself.

[0017] Combined with the cooperation of telescopic cover A and telescopic cover B, the telescopic adjustment of telescopic cover A and telescopic cover B will always be buckled at the outer position of the front end of the regulator to prevent dust driven by the auxiliary fan during the heat dissipation process from entering the transmission position of the motor shaft and the lifting block threaded hole, interfering with the normal operation of the motor shaft and the lifting block threaded hole.

[0018] When the high temperature of the processing body drops, its own temperature will be transmitted to the mounting plate, and the mounting plate will transmit the temperature value to the sensor through the temperature transfer component. The sensor receives the appropriate temperature and transmits the information to the regulator, thereby driving the motor to rotate in the opposite direction. The lifting block will slide upward at the front end of the regulator, and the bottom position of the fitting part will be separated from the top position of the processing body, reducing the contact area at the upper end of the processing body, thereby meeting the heat dissipation standard of the processing body during basic work.

[0019] When the bidirectional screw is rotated, the two positioning parts will move in opposite directions, and the distance between the two positioning parts can be adjusted, so that the cooling rack can be disassembled and maintained as a whole. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings of the embodiment are briefly introduced below.

[0021] In the attached picture:

[0022] Figure 1 It shows a schematic diagram of the main structure of the data information processor device according to an embodiment of the present invention;

[0023] Figure 2 It shows a schematic diagram of the top view of the main body of the data information processor device according to an embodiment of the present invention;

[0024] Figure 3 It shows a left-view structural diagram of the main body of a data information processor device according to an embodiment of the present invention;

[0025] Figure 4 It shows a schematic diagram of the side structure of the main body of a data information processor device according to an embodiment of the present invention;

[0026] Figure 5 A schematic diagram of a half-section top view of a circuit board body according to an embodiment of the present invention is shown;

[0027] Figure 6 A schematic diagram of a half-section side view of a circuit board body according to an embodiment of the present invention is shown;

[0028] Figure 7 It shows a left-side structural schematic diagram of the separation of the regulator body and the cooling rack body according to an embodiment of the present invention;

[0029] Figure 8 A schematic diagram of the side view structure of the regulator body and the cooling rack body being separated according to an embodiment of the present invention is shown.

[0030] Reference numerals list

[0031] 1. Circuit board; 101. Power port; 102. Power port; 103. Radiator; 104. USB port; 105. HDMI port; 106. Mounting plate; 107. Processor holder; 108. Processor body; 109. Temperature transfer element;

[0032] 2. Regulator; 201. Sensor; 202. Motor; 203. Lifting block; 204. Telescopic cover A; 205. Telescopic cover B; 206. Horizontal frame; 207. Bidirectional screw; 208. Positioning piece;

[0033] 3. Cooling rack; 301. Copper pipe fittings; 302. Auxiliary fan; 303. Laminating parts. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0035] Unless otherwise defined, all terms (including technical and scientific terms) used in the embodiments of the present disclosure have the same meanings as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It should also be understood that terms such as those defined in common dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined in this manner in the embodiments of the present disclosure.

[0036] The "first", "second" and similar words used in the embodiments of the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "One", "one" or "the" and similar words do not indicate a quantity limitation, but indicate that there is at least one. Similarly, "including" or "comprising" and similar words mean that the element or object appearing in front of the word covers the elements or objects listed after the word and their equivalents, without excluding other elements or objects. In the following description, spatial and directional terms such as "upper", "lower", "front", "back", "top", "bottom", "vertical" and "horizontal" may be used to describe the embodiments of the present disclosure, but it should be understood that these terms are only for the convenience of describing the embodiments shown in the figures, and do not require the actual device to be constructed or operated in a specific orientation. In the following description, the use of terms such as "connect", "connect", "fix" and "attach" may refer to two elements or structures being directly connected without other elements or structures between them, or may refer to two elements or structures being indirectly connected through an intermediate element or structure, unless otherwise clearly stated in this article. Embodiment 1:

[0037] As attached Figure 1 To Attachment Figure 8 As shown:

[0038] The present invention provides a data information processor device, comprising: a circuit board 1; a heat sink 103 is fixedly connected to the middle position of the top of the circuit board 1, the heat sink 103 is provided with a connecting line, copper columns are provided at the four corners of the top of the heat sink 103, and the copper columns of the heat sink 103 are fixedly connected to a mounting plate 106, a processor holder 107 is installed at the middle position of the top of the mounting plate 106, a processing body 108 is fixed inside the processor holder 107, and a temperature transfer member is provided at the middle and rear position of the top of the mounting plate 106 109, the regulator 2 is fixedly connected to the top rear end position of the mounting plate 106, the sensor 201 is arranged at the front lower position of the regulator 2, the sensor 201 is plugged into the temperature transfer component 109, the motor 202 is arranged at the top position of the regulator 2, and the lifting block 203 is slidably connected to the front end position of the regulator 2, a threaded hole is provided at the top position of the lifting block 203, the rotating shaft of the motor 202 is located at the front end position inside the regulator 2, and the rotating shaft of the motor 202 is provided with threads, and the rotating shaft of the motor 202 is located in the threaded hole of the lifting block 203.

[0039] Among them, a power port 101 is fixedly connected to the left middle position of the front end of the circuit board 1, a USB interface 104 is set on the left top position of the circuit board 1, an HDMI interface 105 is set on the right front end of the circuit board 1, and a power supply port 102 is set on the left top position of the circuit board 1. The power supply port 102 is plugged into the connecting line position of the radiator 103. The radiator 103 is composed of copper sheets and fans, which provide basic heat dissipation for the processing body 108.

[0040] Among them, a telescopic cover A204 is set at the upper position of the front end of the regulator 2, the lower position of the telescopic cover A204 is connected to the upper position of the lifting block 203, the lower position of the lifting block 203 is connected to the upper position of the telescopic cover B205, the lower position of the telescopic cover B205 is connected to the lower position of the front end of the regulator 2, the telescopic cover A204 and the telescopic cover B205 are symmetrically designed, and the rotating shaft of the motor 202 is located inside the telescopic cover A204 and the telescopic cover B205. When the lifting block 203 slides at the front end of the regulator 2, combined with the cooperation of the telescopic cover A204 and the telescopic cover B205, the telescopic adjustment of the telescopic cover A204 and the telescopic cover B205 itself will always be buckled at the outer position of the front end of the regulator 2, so as to prevent the dust driven by the auxiliary fan 302 during the heat dissipation from entering the transmission position of the rotating shaft of the motor 202 and the threaded hole of the lifting block 203, and interfering with the normal operation of the rotating shaft of the motor 202 and the threaded hole of the lifting block 203.

[0041] The front end of the lifting block 203 is fixedly connected to the middle position of the rear end of the horizontal frame 206, and the internal position of the horizontal frame 206 is rotatably connected with a bidirectional screw 207. The left and right sides of the bidirectional screw 207 are designed with reverse threads. The front end of the horizontal frame 206 is slidably connected with a positioning piece 208, and the two positioning pieces 208 are symmetrically designed. The rear positions of the two positioning pieces 208 are both provided with threaded holes. The left and right sides of the bidirectional screw 207 are both located in the threaded holes on the sides of the two positioning pieces 208. The upper positions of the two positioning pieces 208 are both provided with matching grooves. The matching grooves of the two positioning pieces 208 A cooling rack 3 is clamped in the groove, a copper pipe fitting 301 is provided at the lower inner position of the cooling rack 3, a fitting 303 is installed at the lower position of the copper pipe fitting 301, the fitting 303 is located above the processing body 108, an auxiliary fan 302 is installed at the front end of the cooling rack 3, a sensor is provided at the bottom position of the fitting 303, and the sensor of the fitting 303 is connected to the auxiliary fan 302, when the bidirectional screw 207 is rotated, the two positioning members 208 will move in opposite directions, and the distance between the two positioning members 208 can be adjusted, so as to facilitate the disassembly and maintenance of the cooling rack 3 as a whole.

[0042] When using:

[0043] Place the circuit board 1 in a suitable position and connect the power source through the power port 101 to provide a power source for the circuit board 1. Provide itself with relative output and input connection methods through the USB interface 104 or the HDMI interface 105 to ensure that the processing body 108 installed on the upper end of the mounting plate 106 operates normally.

[0044] An operating space is provided for the processor body 108 , and then the circuit board 1 cooperates with the radiator 103 connection line through the power supply port 102 to provide relative energy for the radiator 103 . The radiator 103 operates through the copper sheet composed of itself and the fan to perform wind cooling to the middle position below the upper mounting plate 106 , providing basic heat dissipation effect for the processor body 108 . Embodiment 2:

[0045] Based on the basic heat dissipation of the processing body 108 provided in the first embodiment, when the operating temperature of the processing body 108 is too high, the mounting plate 106 transfers the heat to the sensor 201 through the heat transfer member 109. The sensor 201 receives the high temperature warning prompt and transmits it to the regulator 2, thereby driving the motor 202 to rotate. The lifting block 203 will slide downward at the front end position of the regulator 2 until the bottom position of the fitting member 303 fits the processing body 108. At the same time, the fitting member 303 sensor contacts the processing body 108 and transmits the command to the auxiliary fan 302 through the connection relationship between itself and the auxiliary fan 302, ensuring that the auxiliary fan 302 is in working condition. At this time, the mounting plate 106 is in the process of cooling the processing body 108, and the auxiliary fan 302 assists in cooling the cooling rack 3 and the copper pipe 301. Embodiment three:

[0046] Based on the second embodiment, when the high temperature of the processing body 108 drops, its own temperature will be transmitted to the mounting plate 106, and the mounting plate 106 will transmit the temperature value to the sensor 201 through the temperature transfer component 109. The sensor 201 receives the temperature and transmits the information to the regulator 2, thereby driving the motor 202 to rotate in the reverse direction. The lifting block 203 will slide upward at the front end of the regulator 2, and the bottom position of the fitting component 303 will be separated from the top position of the processing body 108, thereby reducing the contact area of ​​the upper end of the processing body 108, and meeting the heat dissipation standard of the processing body 108 during basic operation.

[0047] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A data information processor device, characterized in that: include: A circuit board (1); a heat sink (103) is fixedly connected to the middle position of the top of the circuit board (1), the heat sink (103) is provided with a connecting line, copper pillars are provided at the four corners of the top of the heat sink (103), and the copper pillars of the heat sink (103) are fixedly connected to the mounting plate (106), a processor holder (107) is installed at the middle position of the top of the mounting plate (106), a processing body (108) is fixed inside the processor holder (107), a heat transfer component (109) is provided at the middle and rear position of the top of the mounting plate (106), and the mounting plate (106) A regulator (2) is fixedly connected at the top rear end position of the regulator (2), a sensor (201) is arranged at the front lower position of the regulator (2), the sensor (201) is plugged into the temperature transfer element (109), a motor (202) is arranged at the top position of the regulator (2), and a lifting block (203) is slidably connected at the front end position of the regulator (2), a threaded hole is provided at the top position of the lifting block (203), a rotating shaft of the motor (202) is located at the front end position inside the regulator (2), and a thread is provided on the rotating shaft of the motor (202), and the rotating shaft of the motor (202) is located in the threaded hole of the lifting block (203). The front end of the lifting block (203) is fixedly connected to the middle position of the rear end of the horizontal frame (206), and the internal position of the horizontal frame (206) is rotatably connected with a bidirectional screw (207). The left and right sides of the bidirectional screw (207) are designed with reverse threads. The front end of the horizontal frame (206) is slidably connected with a positioning piece (208). The two positioning pieces (208) are symmetrically designed, and the rear positions of the two positioning pieces (208) are both provided with threaded holes. The left and right sides of the bidirectional screw (207) are both located in the threaded holes on the sides of the two positioning pieces (208). A fitting groove is provided above each positioning member (208), a cooling rack (3) is clamped in the fitting grooves of the two positioning members (208), a copper pipe fitting (301) is provided at a lower position inside the cooling rack (3), a fitting member (303) is installed at a lower position of the copper pipe fitting (301), the fitting member (303) is located above the processing body (108), an auxiliary fan (302) is installed at the front end of the cooling rack (3), a sensor is provided at the bottom of the fitting member (303), and the sensor of the fitting member (303) is connected to the auxiliary fan (302).

2. A data information processor device as claimed in claim 1, characterized in that: The circuit board (1) has an electrical port (101) fixedly connected to the left side of the middle of the front end, a USB port (104) is arranged on the left side of the top of the circuit board (1), and an HDMI port (105) is arranged on the right side of the front end of the circuit board (1).

3. A data information processor device as claimed in claim 1, characterized in that: A power supply port (102) is provided at the left side of the top of the circuit board (1), and the power supply port (102) is plugged into a connection line position of the heat sink (103).

4. A data information processor device as claimed in claim 1, characterized in that: A telescopic cover A (204) is provided at an upper position of the front end of the regulator (2); a lower position of the telescopic cover A (204) is connected to an upper position of the lifting block (203); and a lower position of the lifting block (203) is connected to an upper position of the telescopic cover B (205).

5. A data information processor device as claimed in claim 4, characterized in that: The lower part of the telescopic cover B (205) is connected to the lower part of the front end of the regulator (2), the telescopic cover A (204) and the telescopic cover B (205) are symmetrically designed, and the rotating shaft of the motor (202) is located inside the telescopic cover A (204) and the telescopic cover B (205).

Citation Information

Patent Citations

  • Information safety processor

    CN113311918A

  • Temperature-adjustable heat dissipation equipment

    CN110865700A

  • Cooling device for chip design

    CN217955023U