Substrate holder and substrate processing device

Abstract

The present disclosure provides a substrate holder in which a mechanism for fixing a first holder and a second holder to each other can be operated in a non-contact manner. The substrate holder involved in the present disclosure comprises: a first holder; a second holder for clamping and holding a substrate together with the first holder; a clamping member provided on one of the first holder and the second holder; and a clamped member fixed to the other of the first holder and the second holder, the clamping member being configured to have a magnet and being able to move between a locked position and an unlocked position by a magnetic force acting on the magnet, the locked position being a position in which the clamping member and the clamped member are engaged to fix the first holder and the second holder to each other, and the unlocked position being a position in which the engagement of the clamping member and the clamped member is released to release the fixation of the first holder and the second holder.

Description

Technical Field

[0001] The invention relates to a substrate holder and a substrate processing device. Background Art

[0002] In a substrate processing device for plating a substrate, a substrate holder for holding the substrate is sometimes used. An example of such a substrate holder is disclosed in Patent Document 1. Figure 2 A and Figure 2 As shown in FIG. 1B , a substrate holder having a front frame, a rear frame, and a clamp for clamping the front frame and the rear frame is disclosed. In the substrate holder, when a substrate is clamped between the frames, the clamp clamps the front frame and the rear frame to fix the front frame and the rear frame relative to each other.

[0003] In the substrate holder of Patent Document 1, the clamp is exposed to the surface. Therefore, if the substrate holder is immersed in a treatment liquid such as a plating liquid and then taken out of the treatment liquid, the treatment liquid adheres to the clamp, causing the treatment liquid, which is a consumable, to be taken out of the treatment tank. In particular, the clamp is composed of fine parts with many concave and convex parts, so a large amount of treatment liquid adheres to the clamp and is taken out of the treatment tank. In addition, it is difficult to rinse the treatment liquid attached to the fine parts of the parts constituting the clamp during cleaning.

[0004] Therefore, a substrate holder such as a clamp that does not adhere to the processing liquid is sought. Patent document 2 discloses such a substrate holder. Figure 5 As shown in FIG. 1B , a substrate holder is disclosed, comprising: a first holding member; a second holding member; a sealing member configured to form a sealed space inside the substrate holder; a pin; a ring engaged with the pin; and a moving mechanism configured to move the ring in a circumferential direction. In the substrate holder, the pin and the ring are engaged with each other, thereby fixing the first holding member and the second holding member to each other. Moreover, the pin and the ring are arranged inside the sealed space. Therefore, even when the substrate holder is immersed in the plating solution, the pin and the ring do not contact the plating solution. As a result, the plating solution is not taken out of the plating tank by the mechanism for fixing the first holding member and the second holding member to each other.

[0005] Patent Document 1: Japanese Patent No. 6971922

[0006] Patent Document 2: Japanese Patent Application Publication No. 2020-2389

[0007] As described above, in the substrate holder disclosed in Patent Document 2, in order to fix the first holding member and the second holding member to each other, a moving mechanism for moving the ring in the circumferential direction is required. In Patent Document 2, a rod member is disclosed as the moving mechanism. The rod member is configured to extend from the outside of the substrate holder to the internal space of the substrate holder. Therefore, in the substrate holder of Patent Document 2, in order to configure the rod member, a passage connecting the outside of the substrate holder and the internal space of the substrate holder is required. As a result, it is necessary to consider the design of the space for configuring the passage, resulting in a reduction in the degree of freedom of design of the substrate holder. Moreover, the substrate holder disclosed in Patent Document 2 is based on the premise that the shape of the substrate to be held is circular. In the case where the shape of the substrate is rectangular, the structure becomes complicated and difficult to implement.

[0008] In contrast, if the mechanism for fixing the first holding member and the second holding member to each other can be operated in a non-contact manner, a passage connecting the outside of the substrate holder and the internal space of the substrate holder is not required, and the above-mentioned problem can be solved. Therefore, a substrate holder is required in which the mechanism for fixing the first holding member and the second holding member to each other can be operated in a non-contact manner. Summary of the invention

[0009] Therefore, one of the objects of the present disclosure is to provide a substrate holder and a substrate processing apparatus in which a mechanism for fixing a first holder (first holding member) and a second holder (second holding member) to each other can be operated in a contactless manner.

[0010] The substrate holder involved in one embodiment is a substrate holder, which comprises: a first holder; a second holder for clamping and holding the substrate together with the above-mentioned first holder; a clamping component, which is arranged on one of the above-mentioned first holder and the above-mentioned second holder; and a clamped component, which is fixed to the other of the above-mentioned first holder and the above-mentioned second holder, the above-mentioned clamping component is configured to have a magnet, and can move between a locked position and an unlocked position by the magnetic force acting on the above-mentioned magnet, the above-mentioned locking position is a position in which the above-mentioned clamping component is engaged with the above-mentioned clamped component to fix the above-mentioned first holder and the above-mentioned second holder to each other, and the above-mentioned unlocking position is a position in which the engagement between the above-mentioned clamping component and the above-mentioned clamped component is released, thereby releasing the fixation of the above-mentioned first holder and the above-mentioned second holder. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is an overall configuration diagram of a substrate processing apparatus according to an embodiment of the present disclosure.

[0012] Figure 2 It is schematically represented in Figure 1 A front view of a substrate holder used in a substrate processing apparatus.

[0013] Figure 3 yes Figure 2 A cross-sectional perspective view of a substrate holder.

[0014] Figure 4 yes Figure 3 Enlarged view of part A.

[0015] Figure 5 Yes means Figure 2 Structural diagram of the substrate holder and the opening and closing device.

[0016] Figure 6 When the first retaining member is separated from the second retaining member Figure 2 Cross-sectional view of a substrate holder.

[0017] Figure 7 It is used to indicate the position of the sealing part. Figure 2 Front view of the substrate holder.

[0018] Fig. 8A yes Figure 7 BB cross-sectional view.

[0019] Figure 8B It is a cross-sectional view of a substrate holder according to a comparative embodiment.

[0020] Fig.9A yes Figure 7 CC cross-sectional view.

[0021] Fig. 9B It is a cross-sectional view of a substrate holder according to a comparative embodiment.

[0022] Fig.10 The hook is in the locked position. Figure 2 Cross-sectional view of a substrate holder.

[0023] Fig.11 The hook is in the unlocked position. Figure 2 Cross-sectional view of a substrate holder.

[0024] Fig.12 Yes means Figure 2 Diagram of the internal wiring structure of the substrate holder.

[0025] Fig.13 is with Figure 2 A cross-sectional view of a substrate holder according to a different embodiment of a substrate holder.

[0026] Fig.14 yes Fig.13 DD cross-sectional view.

[0027] Fig.15A Yes means Fig.13 Structural diagram of the substrate holder and the opening and closing device.

[0028] Fig. 15B Yes means Fig.13 Structural diagram of the substrate holder and the opening and closing device. DETAILED DESCRIPTION

[0029] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals and duplicate descriptions are omitted.

[0030] <Substrate processing apparatus 100 >

[0031] Figure 1 1 is an overall configuration diagram of a substrate processing apparatus 100 using a substrate holder 200 according to an embodiment of the present disclosure. The substrate processing apparatus 100 is, as an example, a plating apparatus for performing plating treatment on a substrate W. In addition, the substrate holders 200 and 400 described later are used in the substrate processing apparatus 100, but can also be used in substrate processing apparatuses other than the substrate processing apparatus 100. In the present disclosure, a substrate processing apparatus refers to an apparatus that performs some treatment on a substrate W. Figure 1 The substrate processing apparatus 100 is generally divided into: loading the substrate W on the substrate holder 200 (refer to Figure 2 ) or a loading / unloading section 110 for unloading a substrate W from a substrate holder 200; a processing section 120 for processing a substrate W; and a cleaning section 150a. The processing section 120 also includes: a pre-processing / post-processing section 120A for performing pre-processing and post-processing of the substrate W; and a plating processing section 120B for plating the substrate W. In addition, the substrates W processed by the substrate processing device 100 include square substrates, circular substrates, etc. In addition, square substrates include polygonal glass substrates such as rectangular substrates, liquid crystal substrates, printed substrates, and other polygonal plating objects. Circular substrates include semiconductor wafers, glass substrates, and other circular plating objects.

[0032] The loading / unloading section 110 includes two cassette workstations 125 and a loading / unloading station 129. The cassette workstation 125 is configured to carry a cassette 125a containing substrates such as semiconductor wafers, glass substrates, liquid crystal substrates, and printed substrates. In the loading / unloading station 129, substrates W are loaded and unloaded from the substrate holder 200 by a known method. In addition, a storage box 130 for accommodating the substrate holder 200 is provided near (e.g., below) the loading / unloading station 129. A conveying robot 127 for conveying the substrate W is arranged between the cassette workstation 125 and the loading / unloading station 129. The conveying robot 127 is configured to be able to travel via a travel mechanism 128 and convey the substrate W between the cassette workstation 125 and the loading / unloading station 129.

[0033] The cleaning section 150 a includes a cleaning device 150 for cleaning and drying the substrate W after the plating process. The transport robot 127 is configured to transport the substrate W after the plating process to the cleaning device 150 and take out the cleaned substrate W from the cleaning device 150 .

[0034] The pre-processing and post-processing section 120A includes: a pre-wetting module 132, a pre-preg module 133, a first rinsing module 134, a blowing module 135, and a second rinsing module 136. In the pre-wetting module 132, the substrate W is immersed in pure water. In the pre-preg module 133, the oxide film on the surface of the conductive layer such as the seed layer formed on the surface of the substrate W is etched away. In the first rinsing module 134, the pre-preg substrate W is cleaned with a cleaning liquid (pure water, etc.) together with the substrate holder 200. In the blowing module 135, the liquid of the cleaned substrate W is removed. In the second rinsing module 136, the plated substrate W is cleaned with a cleaning liquid together with the substrate holder 200. The pre-wetting module 132, the pre-preg module 133, the first rinsing module 134, the blowing module 135, and the second rinsing module 136 are arranged in sequence. The configuration of the pre-processing / post-processing unit 120A of the substrate processing apparatus 100 is an example, and the configuration of the pre-processing / post-processing unit 120A of the substrate processing apparatus 100 is not limited, and other configurations may be adopted.

[0035] The plating processing section 120B is provided with a plating module 160 for plating the substrate W. The plating module 160 has a plurality of plating tanks 161 having an overflow tank 162. Each plating tank 161 immerses the substrate W in a plating solution held therein to plate the surface of the substrate W with copper or the like. Here, the type of plating solution is not particularly limited, and various plating solutions are used according to the purpose. In addition, in order to perform the above-mentioned treatment on the substrate W or the substrate holder 200, the pre-wetting module 132, the pre-preg module 133, the first rinsing module 134, the blowing module 135, the second rinsing module 136 and the plating module 160 have a treatment tank for accommodating the substrate holder 200. In the present disclosure, a tank capable of accommodating the substrate holder 200 is referred to as a treatment tank. In addition, the plating tank 161 is an example of a treatment tank.

[0036] Refer again Figure 1 The substrate processing apparatus 100 further includes a substrate holder conveying device 140 for conveying the substrate holder 200, for example, using a linear motor method. The substrate holder conveying device 140 includes a guide rail 141 and a conveying device 142. The conveying device 142 travels on the guide rail 141. The conveying device 142 has a function of conveying the substrate holder 200 between the loading / unloading station 129, the pre-wetting module 132, the pre-preg module 133, the first rinsing module 134, the blowing module 135, the second rinsing module 136, and the plating tank 161.

[0037] The substrate processing apparatus 100 has a control system 175 configured to control the above-mentioned components. The control system 175 has a memory 175B storing a predetermined program, a CPU (Central Processing Unit) 175A executing the program in the memory 175B, and a control unit 175C that controls the components of the substrate processing apparatus 100 based on instructions from the CPU 175A. The control unit 175C can, for example, control the conveyance of the conveying robot 127, control the loading and unloading of the substrate W in the loading / unloading station 129 to the substrate holder 200, control the conveyance of the conveying device 142, control the plating current and plating time in each plating tank 161, and control the opening diameter of the anode mask (not shown) and the opening diameter of the adjustment plate (not shown) arranged in each plating tank 161. In addition, the control system 175 is configured to be able to communicate with a higher-level control system (not shown) that generally controls the substrate processing apparatus 100 and other related devices, and can exchange data with a database of the higher-level control system. Here, the storage medium constituting the memory 175B stores various setting data, various programs such as the plating processing program, etc. As the storage medium, a computer-readable ROM, RAM or other memory, a hard disk, a CD-ROM, a DVD-ROM, a disk-shaped storage medium such as a floppy disk or other known storage medium can be used.

[0038] <Substrate holder 200>

[0039] Next, refer to Figure 2 to Figure 4 A more detailed structure of the substrate holder 200 will be described. Figure 2 1 is a front view schematically showing the substrate holder 200 . Figure 3 is a cross-sectional perspective view of the substrate holder 200 . Figure 4 yes Figure 3 The substrate holder 200 is a holder for holding the substrate W. Figure 2 In the figure, the substrate holder 200 holds a substrate W having a quadrilateral shape as an example. However, the substrate holder 200 is not limited to this structure, and may hold a substrate W having another shape such as a circle.

[0040] like Figure 2 to Figure 4 As shown, the substrate holder 200 comprises, as an example, a rectangular flat plate-shaped first holder 202; and a rectangular flat plate-shaped second holder 204 (see Figure 3 and Figure 4). In other words, the substrate holder 200 is configured to be able to sandwich and hold the substrate W between the first holder 202 and the second holder 204. In addition, the first holder 202 and the second holder 204 are made of titanium as an example.

[0041] In addition, openings 214 and 216 are formed in the first retaining member 202 and the second retaining member 204, respectively (see Figure 3 and Figure 4 ). Thus, the substrate holder 200 can expose the substrate W from each opening 214, 216. As a result, the substrate processing device 100 can perform various treatments such as plating treatment on the surface of the substrate W exposed from the openings 214, 216. In addition, in other embodiments involved in the present disclosure, the opening 214 may be formed only in the first holder 202, and the substrate W may be exposed only from the opening 214 of the first holder 202. In addition, the shape of the openings 214, 216 corresponds to the shape of the substrate W. For example, in Figure 2 In the substrate holder 200 of the embodiment, the openings 214 and 216 are square. However, in other embodiments of the present disclosure, the openings 214 and 216 may be other shapes such as circular.

[0042] In addition, if Figure 2 As shown, the substrate holder 200 includes a pair of handles 206 at its upper portion as an example. Two openings 207 are formed between the pair of handles 206. The transport device 142 (see Figure 1 ) grips the opening 207 of the substrate holder 200 to transport the substrate holder 200 in a vertical posture to each processing tank. In addition, the vertical posture refers to a posture when the handle 206 is on top and the plate surface of the substrate W extends in the vertical direction. In addition, when the substrate holder 200 is transported and the substrate W held in the substrate holder 200 is processed in each processing tank, the handle 206 is arranged on the handle supporting member (not shown) of each processing tank. Therefore, in the substrate processing device 100, the surface of the substrate W is processed while the substrate holder 200 is supported in a vertical posture.

[0043] In addition, the substrate holder 200 includes an external contact 208 as an example (see Figure 2 )、Bus bar 210 (refer to Figure 4 ) and electrical contacts 212 (see Figure 4). The external contact 208 is provided on the handle 206, and is electrically connected to the bus bar 210 through an electrical wiring and a bus bar not shown. The bus bar 210 is arranged inside the closed space 900 described later, and is electrically connected to the electrical contact 212. In addition, the electrical contact 212 is configured to contact the outer periphery of the substrate W held by the substrate holder 200. In the substrate processing apparatus 100, if the substrate holder 200 is transported to the plating tank 161, the external contact 208 contacts the electrical contact (not shown) of the handle support member provided in the plating tank 161, and current is supplied to the external contact 208 from an external power source. Furthermore, the current is supplied to the surface of the substrate W via the bus bar 210 and the electrical contact 212, and the substrate W is plated.

[0044] Reference Figure 2 The substrate holder 200, as an example, includes a plurality of clamps 220 (in Figure 2 In the example, there are 16 clamps 220. A plurality of clamps 220 are provided around the openings 214 and 216 so as to surround the substrate W. The clamps 220 have the function of fixing the first holder 202 and the second holder 204 relative to each other. In addition, the clamps 220 are provided inside the substrate holder 200, so that Figure 2 , Figure 7 and Fig.12 In FIG. 2 , the clamp 220 is shown by a dotted line. The detailed structure of the clamp 220 is described below. Figure 4 As an example, the clamp 220 includes an engaged member 230 and an engaging member assembly 240 .

[0045] The engaged component 230 is a thin plate-like component having a substantially rectangular parallelepiped shape. The engaged component 230 is embedded in the recess 203 formed in the first holder 202 and fixed to the first holder 202. In addition, the engaged component 230 has a claw 232. The claw 232 extends toward the engaging component assembly 240, and its front end is bent. In other words, the claw 232 is configured to be engaged with the engaging portion 252 of the hook 246 by the rotation of the hook 246 described later.

[0046] The engaging component assembly 240 is fixed to the second holder 204 in a manner facing the engaged component 230. In more detail, the engaging component assembly 240 includes a hook seat 242, a rotating shaft 244, and a hook (an example of an engaging component) 246. The hook seat 242 is a thin plate-shaped component having a substantially rectangular parallelepiped shape, and is configured to support the rotating shaft 244. The hook seat 242 is embedded in a recess 205 formed in the second holder 204 and is fixed to the second holder 204. The hook seat 242 is made of stainless steel as an example. The rotating shaft 244 is inserted into an axis hole 248 provided in the hook 246, and the hook 246 is supported to be rotatable. That is, the hook 246 is configured to be rotatable around the rotating shaft 244. The rotating shaft 244 extends in a direction extending toward the plate surface of the substrate W. The rotating shaft 244 is made of stainless steel as an example. The hook 246 has an L-shaped shape, has a rod 250 at one end, and has an engaging portion 252 at the other end. The engagement portion 252 is configured to extend toward the engaged member 230, and the front end of the engagement portion 252 is bent so as to be engageable with the claw 232. The rod 250 extends in a direction perpendicular to the direction in which the rotation shaft 244 extends.

[0047] In addition, the hook 246 is configured to be able to move in the locked position ( Figure 4 shown in the unlocked position ( Figure 5 204). When the hook 246 is located at the locked position, the engaging portion 252 of the hook 246 engages with the claw 232 of the engaged member 230 to fix the first holder 202 and the second holder 204 to each other. On the other hand, when the hook 246 is located at the unlocked position, the engagement between the engaging portion 252 of the hook 246 and the claw 232 of the engaged member 230 is released to release the fixation of the first holder 202 and the second holder 204. In other words, in the substrate holder 200, the first holder 202 and the second holder 204 are fixed to each other by the movement of the hook 246 to the locked position, and the fixation of the first holder 202 and the second holder 204 is released by the movement of the hook 246 to the unlocked position.

[0048] In addition, the hook 246 has a magnet 254. The magnet 254 is mounted on the rod 250 of the hook 246. Thus, the hook 246 rotates around the rotating shaft 244 as the center due to the magnetic force acting on the magnet 254. That is, the hook 246 can move between the locked position and the unlocked position due to the magnetic force acting on the magnet 254. Furthermore, it is preferred that the length L between the center of the rotating shaft 244 and the position of the magnet 254 farthest from the center of the rotating shaft 244 is longer. This is because according to the principle of leverage, when the length L is longer, the hook 246 can move with a smaller magnetic force. The preferred length L is 10 mm or more.

[0049] As described above, in the substrate holder 200, the engaged component 230 is fixed to the first holder 202, and the engaging component assembly 240 is fixed to the second holder 204. However, the substrate holder 200 may not have such a structure. In other embodiments of the present disclosure, the engaged component 230 may be fixed to the second holder 204, and the engaging component assembly 240 may be fixed to the first holder 202.

[0050] In addition, the engaging member assembly 240 includes a biasing member 256 as an example (see Figure 4 ). The force applying member 256 has a function of applying force to the hook 246 in the direction toward the locked position. More specifically, the force applying member 256 is a torsion spring. The force of the force applying member 256 acts on the hook 246, so that the hook 246 is located in the locked position as long as the magnetic force does not act on the magnet 254 of the hook 246. In other words, the force applying member 256 applies force to the hook 246 in a manner that maintains the engagement of the hook 246, thereby preventing the hook 246 from falling off the claw 232.

[0051] Figure 5 2 is a diagram showing the structure of the substrate holder 200 and the opening and closing device 180. Figure 5 The substrate processing apparatus 100 includes an opening and closing device 180 as an example. The opening and closing device 180 is provided at the loading / unloading station 129 (see Figure 1 ). In addition, the opening and closing device 180 is arranged to be located on the opposite side of the first holding member 202 across the second holding member 204. The opening and closing device 180 has a function of causing a magnetic force to act on the magnet 254 of the hook 246 to move between a locked position and an unlocked position. More specifically, the opening and closing device 180 includes: a magnet 182 for causing a magnetic force to act on the magnet 254 of the hook 246, and an actuator 184. The actuator 184 is, for example, a linear actuator having a function of causing the magnet 182 to move between a first position ( Figure 5The function of moving between the first position (shown in the figure) and the second position farther from the magnet 182 than the first position. The magnet 182 is configured to act repulsively on the magnet 254 of the hook 246. If the actuator 184 moves the magnet 182 from the second position to the first position, the repulsive force of the magnet 254 acting on the hook 246 is increased. As a result, the repulsive force of the magnet 254 acting on the hook 246 exceeds the force of the force applying member 256, and the hook 246 moves from the locked position to the unlocked position. As a result, the fixing of the first retaining member 202 and the second retaining member 204 based on the clamp 220 is released. On the other hand, if the actuator 184 moves the magnet 182 from the first position to the second position, the repulsive force of the magnet 254 acting on the hook 246 is weakened. As a result, the force of the force applying member 256 exceeds the repulsive force acting on the magnet 254, and the hook 246 moves from the unlocked position to the locked position. As a result, the clamp 220 fixes the first retaining member 202 and the second retaining member 204 relative to each other. As described above, in the substrate holder 200, the hook 246 is operated by magnetic force. In other words, the substrate holder 200 is configured so that the hook 246 can be operated in a non-contact manner. In addition, the opening and closing device 180 may have a structure other than the above as long as it can move between the locked position and the unlocked position by applying magnetic force to the magnet 254 of the hook 246.

[0052] When the substrate W is removed from the substrate holder 200, the first holder 202 is moved in the opening and closing direction 902 (see FIG. 1 ) while the clamp 220 is released from fixing. Figure 6 ). As a result, the first holder 202 is separated from the second holder 204, and the substrate W clamped by the first holder 202 and the second holder 204 can be removed. In addition, in the present disclosure, the opening and closing direction 902 of the substrate holder 200 refers to the direction in which the first holder 202 and the second holder 204 approach or separate when the substrate holder 200 releases or clamps the substrate W.

[0053] Refer again Figure 4, the substrate holder 200 includes an outer seal 272 and two inner seals 274a, 274b. In addition, the outer seal 272 and the two inner seals 274a, 274b are included in the sealing member 270. The outer seal 272 is configured to be mounted on the first holder 202 or the second holder 204 and to be in contact with the first holder 202 and the second holder 204. Therefore, the outer seal 272 has a function of sealing between the first holder 202 and the second holder 204. In addition, the inner seal 274a is configured to be mounted on the first holder 202 and to be in contact with the first holder 202 and the substrate W. Therefore, the inner seal 274a has a function of sealing between the first holder 202 and the substrate W. In addition, the inner seal 274b is configured to be mounted on the second holder 204 and to be in contact with the second holder 204 and the substrate W. Therefore, the inner seal 274b has a function of sealing between the second holder 204 and the substrate W.

[0054] Next, refer to Figure 7 . Figure 7 2 is a front view of the substrate holder 200 for showing the position of the sealing member 270. Figure 7 In FIG. 2 , the outer seal 272 and the two inner seals 274a, 274b are hidden on the back side of the first retaining member 202, so their positions are shown by dotted lines. Figure 7 In the figure, the inner seal 274a and the inner seal 274b appear to overlap each other and are therefore shown with a single dotted line. Figure 7 As shown, the outer seal 272 and the inner seals 274a, 274b are both formed in a substantially annular shape. The inner seals 274a, 274b are provided to surround the openings 214, 216 along the peripheral edge of the substrate W. The outer seal 272 is provided on the outer side than the inner seals 274a, 274b so that the plurality of clamps 220 are located between the outer seal 272 and the inner seals 274a, 274b.

[0055] In addition, in the substrate holder 200, when the first holder 202 and the second holder 204 hold the substrate W, the first holder 202, the second holder 204, the outer seal 272 and the two inner seals 274a and 274b are configured to form a closed space 900 (see Figure 4). Moreover, the hook 246 and the engaged component 230 are arranged inside the closed space 900. Therefore, when the substrate W and the substrate holder 200 are immersed in a processing liquid such as a plating liquid, the hook 246 and the engaged component 230 do not contact the processing liquid. As a result, the processing liquid is prevented from being attached to the hook 246 or the engaged component 230 and being taken out of the processing tank. In addition, since the processing liquid does not adhere to the hook 246 and the engaged component 230, it is not necessary to rinse the processing liquid from the hook 246 and the engaged component 230 when the substrate holder 200 is cleaned.

[0056] Next, refer to Fig. 8A . Fig. 8A yes Figure 7 BB cross-sectional view. Fig. 8A The outer seal 272 is configured to contact the outer end 282 of the surface 288 of the first retainer 202 facing the second retainer 204. In addition, the outer seal 272 is configured to contact the outer end 284 of the surface 290 of the second retainer 204 facing the first retainer 202. The effect of the outer seal 272 being configured in this way is compared with Figure 8B The substrate holder 800 according to the comparative embodiment shown will be described by way of comparison.

[0057] Figure 8B 800 is a cross-sectional view of a substrate holder 800 according to a comparative method, and shows a portion corresponding to the BB cross section. In the substrate holder 800, the outer seal 872 is not configured to contact the outer end 882 of the surface 888 of the first holder 802 facing the second holder 804, and the outer end 884 of the second holder 804 facing the surface 890 of the first holder 802. In this case, a region 886 surrounded by the outer seal 872, the surface 888 of the first holder 802, and the surface 890 of the second holder 804 is formed in the portion in contact with the processing liquid. In this way, liquid is easily accumulated in the region 886 surrounded by three sides. Therefore, when the substrate holder 800 is lifted from the processing tank, there is a concern that the processing liquid accumulates in the region 886 and more processing liquid is taken out of the processing tank.

[0058] In contrast, Fig. 8A In the case of the substrate holder 200 shown in FIG. 1 , the outer seal 272 is arranged to contact the outer end 282 of the surface 288 of the first holder 202 or the outer end 284 of the surface 290 of the second holder 204. Therefore, a portion corresponding to the region 886 of the substrate holder 800 is not formed in the substrate holder 200. Therefore, the substrate holder 200 can reduce the amount of the processing liquid carried out from the processing tank.

[0059] Next, refer to Fig.9A . Fig.9A yes Figure 7 CC section view of the Fig.9A The inner seal 274a is arranged to contact the inner end 293 of the surface 291 of the first holder 202 facing the substrate W. And the inner seal 274b is arranged to contact the inner end 294 of the surface 292 of the second holder 204 facing the substrate W. The effect of arranging the inner seals 274a and 274b in this way is similar to that of Fig. 9B The substrate holder 800 according to the comparative embodiment shown will be described by way of comparison.

[0060] Fig. 9B : is a cross-sectional view of a substrate holder 800 involved in a comparative embodiment, and shows a portion corresponding to the CC cross section. In the substrate holder 800, the inner seal 874a is not configured to contact the inner end 893 of the surface 891 of the first holder 802 facing the substrate W. In this case, a region 895 surrounded by the inner seal 874a, the surface 891 of the first holder 802, and the substrate W is formed in the portion in contact with the processing liquid. The region 895 is surrounded on three sides, so the liquid is easily accumulated. In addition, the inner seal 874b is not configured to contact the inner end 894 of the surface 892 of the second holder 804 facing the substrate W. In this case, a region 896 surrounded by the inner seal 874b, the surface 892 of the second holder 804, and the substrate W is formed in the portion in contact with the processing liquid. The region 896 is surrounded on three sides, so the liquid is easily accumulated. Therefore, when the substrate holder 800 is lifted from the processing tank, there is a concern that the processing liquid may accumulate in the regions 895 and 896 and more processing liquid may be carried out of the processing tank.

[0061] In contrast, Fig.9A In the illustrated substrate holder 200, the inner seal 274a is arranged to contact the inner end 293, and the inner seal 274b is arranged to contact the inner end 294. Therefore, the portions corresponding to the regions 895 and 896 of the substrate holder 800 are not formed in the substrate holder 200. Therefore, the substrate holder 200 can reduce the amount of the processing liquid carried out from the processing tank.

[0062] Next, refer to Figure 10 to Figure 12 The mechanism for confirming the position of the hook 246 will be described. Fig.10 2 is a cross-sectional view of the substrate holder 200 with the hook 246 in the locked position. Fig.11 2 is a cross-sectional view of the substrate holder 200 when the hook 246 is located at the unlocking position. Fig.12 2 is a diagram showing the wiring structure inside the substrate holder 200. Fig.10 In the example, the third wiring 320 and the fourth wiring 330 are omitted. Fig.11In FIG. 1 , the first wiring 300 and the second wiring 310 are omitted.

[0063] Reference Fig.10 and Fig.11 The substrate holder 200 has a first wiring 300 (refer to Fig.10 ), the second wiring 310 (refer to Fig.10 ), the third wiring 320 (refer to Fig.11 ) and the fourth wiring 330 (refer to Fig.11 ). The hook 246 has a first contact portion 258, a second contact portion 260 and an insulating portion 262. The first contact portion 258 and the second contact portion 260 are made of stainless steel as an example. The insulating portion 262 electrically insulates the first contact portion 258 from the second contact portion 260. In more detail, the insulating portion 262 is made of a resin such as PEEK as an example. The engaged component 230 has a first contact portion 234, a second contact portion 236 and an insulating portion 238. The first contact portion 234 and the second contact portion 236 are made of stainless steel as an example. The insulating portion 238 electrically insulates the first contact portion 234 from the second contact portion 236. In more detail, the insulating portion 238 is made of a resin such as PEEK as an example.

[0064] The first wiring 300 has a first end portion 302 electrically connected to the first contact portion 258 (see Fig.10 and a second end portion 304 exposed to the outside of the substrate holder 200 (reference Fig.12 The second wiring 310 has a first end portion 312 electrically connected to the first contacted portion 234 (see Fig.10 ); and a second end portion 314 exposed to the outside of the substrate holder 200 ( Fig.12 The third wiring 320 has a first end portion 322 (see Fig.11 and a second end portion 324 exposed to the outside of the substrate holder 200 (reference Fig.12 The fourth wiring 330 has a first end portion 332 electrically connected to the second contacted portion 236 (see Fig.11 and a second end portion 334 exposed to the outside of the substrate holder 200 (reference Fig.12 ).

[0065] In addition, if Fig.10 As shown, when the hook 246 is located at the locking position, the first contact portion 258 is configured to contact and electrically connect with the first contacted portion 234. Fig.11As shown, when the hook 246 is not in the locked position, the first contact portion 258 is configured not to contact the first contacted portion 234 and not to be electrically connected. Since the substrate holder 200 has such a structure, only when the hook 246 is in the locked position, the second end 304 of the first wiring 300 is electrically connected to the second end 314 of the second wiring 310 via the first wiring 300, the first contact portion 258, the first contacted portion 234 and the second wiring 310. Therefore, if the second end 304 of the first wiring 300 and the second end 314 of the second wiring 310 are conductive, it is guaranteed that the hook 246 is in the locked position. That is, the operator can confirm whether the hook 246 is in the locked position by confirming the conductive connection between the second end 304 of the first wiring 300 and the second end 314 of the second wiring 310. In other words, the operator can confirm whether the clamp 220 fixes the first holder 202 and the second holder 204 by confirming the conductive connection.

[0066] In addition, if Fig.11 As shown, when the hook 246 is located at the unlocking position, the second contact portion 260 is configured to contact and electrically connect with the second contacted portion 236. Fig.10 As shown, when the hook 246 is not in the unlocked position, the second contact portion 260 is configured to be out of contact with the second contacted portion 236 and not electrically connected. Since the substrate holder 200 has such a structure, only when the hook 246 is in the unlocked position, the second end 324 of the third wiring 320 is electrically connected to the second end 334 of the fourth wiring 330 via the third wiring 320, the second contact portion 260, the second contacted portion 236, and the fourth wiring 330. Therefore, if the second end 324 of the third wiring 320 and the second end 334 of the fourth wiring 330 are conductive, it is guaranteed that the hook 246 is in the unlocked position. That is, the operator can confirm whether the hook 246 is in the unlocked position by confirming the conductive connection between the second end 324 of the third wiring 320 and the second end 334 of the fourth wiring 330. In other words, the operator can confirm whether the clamp 220 is released by confirming the conductive connection.

[0067] Furthermore, the substrate processing apparatus 100 may also be equipped with a loading / unloading station 129. Fig.12 The detector 102 is as shown. The detector 102 has a function of checking the continuity between the second end 304 of the first wiring 300 and the second end 314 of the second wiring 310, and the continuity between the second end 324 of the third wiring 320 and the second end 334 of the fourth wiring 330. Thus, the substrate processing apparatus 100 can use the detector 102 to detect that the clamp 220 has fixed the first holder 202 and the second holder 204, and that the clamp 220 has been released.

[0068] <Substrate holder 400>

[0069] Fig.13 It is a cross-sectional view of a substrate holder 400 according to an embodiment different from the substrate holder 200 . Fig.14 yes Fig.13 DD sectional view. Fig.13 and 14 The structure of the substrate holder 400 will be described. The substrate holder 400 has a structure common to the substrate holder 200 in part. Therefore, the substrate holder 400 will be described with a focus on the parts that are different from the substrate holder 200, and the same reference numerals are given to the common structures in the drawings, and their description will be omitted.

[0070] Reference Fig.13 As an example, the substrate holder 400 includes a clamp 420 instead of the clamp 220 included in the substrate holder 200 . The clamp 420 includes an engaged member 430 and an engaging member 446 .

[0071] The engaged component 430 is a component formed by bending a thin plate. Furthermore, the engaged component 430 includes: two ends 434a, 434b fixed to the first holder 202, a limiting wall 432, a first wall 436, and a second wall 438. The ends 434a, 434b, the limiting wall 432, the first wall 436, and the second wall 438 have a flat plate shape as an example. Furthermore, the first wall 436 connects the end 434a with the limiting wall 432, and is orthogonal to the end 434a and the limiting wall 432. The second wall 438 connects the end 434b with the limiting wall 432, and is orthogonal to the end 434b and the limiting wall 432. In addition, the limiting wall 432 extends on a plane perpendicular to the opening and closing direction 902 of the substrate holder 200. In addition, from another perspective, the limiting wall 432 extends on a plane parallel to the plate surface of the substrate W.

[0072] The engaging member 446 is provided on the second holder 204. More specifically, the engaging member 446 is mounted on the second holder 204 in such a manner that it can move in the vertical direction 904 relative to the second holder 204, but is restricted from moving in the opening and closing direction 902 relative to the second holder 204 (see Fig.14 ). Moreover, the engaging member 446 can be moved in the locking position ( Fig.15A shown in the unlocked position ( Fig. 15B In addition, the engaging member 446 has a magnet 454. Thus, the engaging member 446 can move between the locked position and the unlocked position by the magnetic force acting on the magnet 454. In addition, the vertical direction 904 refers to a direction perpendicular to the opening and closing direction 902.

[0073] In addition, the engaging member 446 has a rod-shaped portion 452. Furthermore, the rod-shaped portion 452 and the limiting wall 432 are configured so that when the engaging member 446 is in the locked position ( Fig.15A , the limiting wall 432 contacts the rod-shaped portion 452 to limit the movement of the rod-shaped portion 452 in the opening and closing direction 902 relative to the first retaining member 202. On the other hand, the rod-shaped portion 452 and the limiting wall 432 are configured so that when the engaging member 446 is in the unlocked position ( Fig. 15B ), the restricting wall 432 does not restrict the movement of the rod-shaped portion 452 in the opening and closing direction 902 relative to the first retaining member 202.

[0074] Next, refer to Fig.15A and Fig. 15B . Fig.15A 1 is a diagram showing the structure of the substrate holder 400 and the opening and closing device 190 , and shows a state where the engaging member 446 is located at a locked position. Fig. 15B 4 is a structural diagram showing the substrate holder 400 and the opening and closing device 190, and shows a case where the engaging member 446 is in the unlocked position. When the substrate processing apparatus 100 uses the substrate holder 400 to process the substrate W, the substrate processing apparatus 100 may also include Fig.15A and Fig. 15B The opening and closing device 190 shown in the figure replaces Figure 5 The opening and closing device 180. The opening and closing device 190 is arranged to be located on the opposite side of the first retaining member 202 across the second retaining member 204. Moreover, the opening and closing device 190 has a function of moving between a locked position and an unlocked position by causing a magnetic force to act on the magnet 454 of the engaging member 446. In more detail, the opening and closing device 190 comprises: a magnet 192 for causing a magnetic force to act on the magnet 454 of the engaging member 446, and an actuator 194. The actuator 194 is, as an example, a linear actuator, and has a function of moving the magnet 192 between a first position and a second position. The first position is a position of the magnet 192 such that the magnet 192 can be opposite to the magnet 454 across the second retaining member 204 when the engaging member 446 is in the locked position ( Fig.15A On the other hand, the second position is a position of the magnet 192 such that the magnet 192 can be opposite to the magnet 454 via the second retaining member 204 when the engaging member 446 is in the unlocking position ( Fig. 15B shown in the position).

[0075] If the actuator 194 causes the magnet 192 to move from the first position ( Fig.15A position shown) to a second position ( Fig. 15B), the magnet 454 is attracted by the attraction of the magnet 192, and the engaging member 446 moves from the locked position to the unlocked position. As a result, the fixing of the first retaining member 202 and the second retaining member 204 based on the clamp 420 is released. On the other hand, if the actuator 194 moves the magnet 192 from the second position ( Fig. 15B shown in the position) to the first position ( Fig.15A The clamp 420 fixes the first retaining member 202 and the second retaining member 204 to each other. In this way, in the substrate retainer 400, the engaging member 446 is operated by magnetic force. In other words, the substrate retainer 400 is configured so that the engaging member 446 can be operated in a non-contact manner. In addition, the opening and closing device 190 may have a structure other than the above as long as it can cause the magnetic force to act on the magnet 454 of the engaging member 446 and move between the locked position and the unlocked position.

[0076] [Notes]

[0077] A part or all of the above-mentioned embodiments may be described as the following notes, but are not limited to the following contents.

[0078] (Note 1)

[0079] The substrate holder involved in Note 1 is a substrate holder, comprising: a first holder; a second holder for clamping and holding the substrate together with the above-mentioned first holder; a clamping component, which is arranged on one of the above-mentioned first holder and the above-mentioned second holder; and a clamped component, which is fixed to the other of the above-mentioned first holder and the above-mentioned second holder, the above-mentioned clamping component is configured to have a magnet, and can move between a locked position and an unlocked position by the magnetic force acting on the above-mentioned magnet, the above-mentioned locking position is a position in which the above-mentioned clamping component is engaged with the above-mentioned clamped component to fix the above-mentioned first holder and the above-mentioned second holder to each other, and the above-mentioned unlocking position is a position in which the engagement between the above-mentioned clamping component and the above-mentioned clamped component is released, thereby releasing the fixation of the above-mentioned first holder and the above-mentioned second holder.

[0080] In the substrate holder according to Note 1, the engaging member moves between the locked position and the unlocked position by the magnetic force acting on the magnet. In accordance with the movement, the first holder and the second holder are fixed to each other, or the fixing of the first holder and the second holder is released. That is, the substrate holder according to Note 1 is configured so that the engaging member can be operated in a non-contact manner.

[0081] (Note 2)

[0082] The substrate holder involved in Note 2 is completed on the basis of the substrate holder described in Note 1, and also has a sealing component. When the first holder and the second holder hold the above-mentioned substrate, the first holder, the second holder and the sealing component are configured to form a closed space, and the above-mentioned clamping component and the above-mentioned clamped component are arranged inside the above-mentioned closed space.

[0083] In the substrate holder involved in Note 2, when the substrate and the substrate holder are immersed in a processing liquid such as a plating liquid, the engaging part and the engaged part do not contact the processing liquid. Therefore, the processing liquid is prevented from being attached to the engaging part or the engaged part and being taken out of the processing tank. In addition, since the processing liquid does not adhere to the engaging part and the engaged part, it is not necessary to rinse the processing liquid from the engaging part and the engaged part.

[0084] (Note 3)

[0085] The substrate holder involved in Note 3 is completed on the basis of the substrate holder described in Note 2, and the above-mentioned sealing component comprises: an inner sealing member configured to contact the above-mentioned first holding member or the above-mentioned second holding member, and the above-mentioned substrate; and an outer sealing member configured to contact the above-mentioned first holding member and the above-mentioned second holding member.

[0086] The substrate holder according to Supplementary Note 3 can seal the space between the first holder or the second holder and the substrate by an inner seal member, and can seal the space between the first holder and the second holder by an outer seal member.

[0087] (Note 4)

[0088] The substrate holder according to Note 4 is completed on the basis of the substrate holder described in Note 3, and the outer seal is configured to contact the outer end of the surface of the first holder facing the second holder, or the outer end of the surface of the second holder facing the first holder.

[0089] When the outer seal is arranged to contact the outer end of the surface of the first holder or the outer end of the surface of the second holder, the area surrounded by the outer seal, the surface of the first holder, and the surface of the second holder is not formed in the portion in contact with the processing liquid. Therefore, the substrate holder involved in Note 4 does not have such an area, so the amount of processing liquid carried out from the processing tank can be reduced.

[0090] (Note 5)

[0091] The substrate holder involved in Note 5 is completed based on the substrate holder described in Note 3 or 4, and the above-mentioned inner seal is configured to contact the inner end of the surface of the above-mentioned first holder facing the above-mentioned substrate, or the inner end of the surface of the above-mentioned second holder facing the above-mentioned substrate.

[0092] When the inner seal is arranged to contact the inner end of the surface of the first holder facing the substrate, or the inner end of the surface of the second holder facing the substrate, the area surrounded by the inner seal, the surface of the first holder, the surface of the second holder, and the substrate is not formed in the portion in contact with the processing liquid. Therefore, the substrate holder involved in Note 5 does not have such an area, so the amount of processing liquid carried out from the processing tank can be reduced.

[0093] (Note 6)

[0094] The substrate holder involved in Note 6 is completed on the basis of the substrate holder recorded in any one of Notes 1 to 5, and the above-mentioned engaging component is constructed as a hook that can rotate around a rotation axis, and the above-mentioned engaged component has a claw, which is constructed to be engaged by the above-mentioned hook through the rotation of the above-mentioned hook, and when the above-mentioned engaging component is in a locked position, the above-mentioned hook is engaged with the above-mentioned claw, and when the above-mentioned engaging component is in an unlocked position, the above-mentioned hook is not engaged with the above-mentioned claw.

[0095] According to the substrate holder according to Supplementary Note 6, the first holder and the second holder are fixed to each other by the engagement of the hook and the claw. Also, the first holder and the second holder are released from being fixed by releasing the engagement of the hook with the claw.

[0096] (Note 7)

[0097] The substrate holder according to attachment 7 is the substrate holder according to any one of attachments 1 to 6, and includes a biasing member for biasing the engagement member in a direction toward the locking position.

[0098] In the substrate holder according to Supplementary Note 7, the engaging member is located at the locked position unless magnetic force acts on the magnet of the engaging member.

[0099] (Note 8)

[0100] The substrate holder involved in Note 8 is completed on the basis of the substrate holder described in any one of Notes 1 to 5, the above-mentioned engaging component has a rod-shaped portion, and the above-mentioned engaging component is installed on the above-mentioned second holding member in a manner that the above-mentioned engaging component can move in a vertical direction perpendicular to the opening and closing direction of the above-mentioned substrate holder relative to the above-mentioned second holding member, but the movement in the above-mentioned opening and closing direction is restricted, the above-mentioned engaged component has a restriction wall, which is used to restrict the movement of the above-mentioned rod-shaped portion in the above-mentioned opening and closing direction by contacting the above-mentioned rod-shaped portion, and the above-mentioned engaged component is fixed to the above-mentioned first holding member, and when the above-mentioned engaging component is located in the locked position, the above-mentioned restriction wall restricts the movement of the above-mentioned rod-shaped portion in the above-mentioned opening and closing direction, and when the above-mentioned engaging component is located in the unlocked position, the above-mentioned restriction wall does not restrict the movement of the above-mentioned rod-shaped portion in the above-mentioned opening and closing direction.

[0101] (Note 9)

[0102] The substrate holder involved in Note 9 is completed on the basis of the substrate holder described in any one of Notes 1 to 8, the above-mentioned engaging component has a first contact portion, the above-mentioned engaged component has a first contacted portion, the above-mentioned substrate holder has a first wiring and a second wiring, the above-mentioned first wiring has: a first end portion electrically connected to the above-mentioned first contact portion; and a second end portion exposed to the outside of the above-mentioned substrate holder, the above-mentioned second wiring has: a first end portion electrically connected to the above-mentioned first contacted portion; and a second end portion exposed to the outside of the above-mentioned substrate holder, when the above-mentioned engaging component is located in a locked position, the above-mentioned first contact portion is configured to be electrically connected to the above-mentioned first contacted portion, and when the above-mentioned engaging component is not located in the locked position, the above-mentioned first contact portion is configured not to be electrically connected to the above-mentioned first contacted portion.

[0103] According to the substrate holder involved in Note 9, when the engaging component is in the locked position, the second end of the first wiring and the second end of the second wiring are electrically connected via a plurality of components. Therefore, if the second end of the first wiring and the second end of the second wiring are conductive, it is ensured that the engaging component is in the locked position. That is, the operator can confirm whether the engaging component is in the locked position by confirming the conductive connection between the second end of the first wiring and the second end of the second wiring.

[0104] (Note 10)

[0105] The substrate holder involved in Note 10 is completed on the basis of the substrate holder described in any one of Notes 1 to 9, the above-mentioned engaging component has a second contact portion, the above-mentioned engaged component has a second contacted portion, the above-mentioned substrate holder has a third wiring and a fourth wiring, the above-mentioned third wiring has: a first end portion electrically connected to the above-mentioned second contact portion; and a second end portion exposed to the outside of the above-mentioned substrate holder, the above-mentioned fourth wiring has: a first end portion electrically connected to the above-mentioned second contacted portion; and a second end portion exposed to the outside of the above-mentioned substrate holder, when the above-mentioned engaging component is located in the unlocked position, the above-mentioned second contact portion is configured to be electrically connected to the above-mentioned second contacted portion, and when the above-mentioned engaging component is not located in the unlocked position, the above-mentioned second contact portion is configured not to be electrically connected to the above-mentioned second contacted portion.

[0106] According to the substrate holder involved in Note 10, when the engaging component is in the unlocked position, the second end of the third wiring and the second end of the fourth wiring are electrically connected via a plurality of components. Therefore, if the second end of the third wiring and the second end of the fourth wiring are conductive, it is ensured that the engaging component is in the unlocked position. That is, the operator can confirm whether the engaging component is in the unlocked position by confirming the conductive connection between the second end of the third wiring and the second end of the fourth wiring.

[0107] (Note 11)

[0108] The substrate processing apparatus according to Appendix 11 comprises: the substrate holder according to any one of Appendixes 1 to 10; and an opening and closing device for causing a magnetic force to act on the magnet of the substrate holder to move the substrate holder between the locked position and the unlocked position.

[0109] In the substrate processing apparatus according to Supplementary Note 11, the opening and closing device can move the engaging member of the substrate holder between the locked position and the unlocked position.

[0110] (Note 12)

[0111] The substrate processing apparatus according to Appendix 12 comprises: the substrate holder described in any one of Appendixes 1 to 10; and a plating module for performing a plating process on the substrate.

[0112] The substrate processing apparatus according to Supplementary Note 12 can perform plating processing on a substrate held by a substrate holder.

[0113] Description of Reference Numerals

[0114] 100…substrate processing device; 102…detector; 160…plating module; 180, 190…opening and closing device; 200…substrate holder; 202…first holder; 204…second holder; 220…clamp; 230…engaged component; 232…claw; 234…first contacted portion; 236…second contacted portion; 240…engaging component assembly; 246…hook; 254…magnet; 256…force applying component; 258…first contact portion; 260…second contact portion; 270…sealing component; 272…outer seal; 274a, 274b…inner seal; 282, 284…outer end; 293, 294…inner end; 300…first wiring; 310…second wiring; 320…third wiring; 330…fourth wiring; 400…substrate holder; 420…clamp; 430…engaged component; 432…limiting wall; 446…engaging component; 452…rod-shaped portion; 454…magnet; 900…enclosed space; 902…opening and closing direction; 904…vertical direction; W…substrate.

Claims

1. A substrate holder, characterized in that: have: a first retaining member; a second holding member, used for clamping and holding the substrate together with the first holding member; an engaging member provided on one of the first retaining member and the second retaining member; and The engaged member is fixed to the other of the first retaining member and the second retaining member, The engaging member is configured to have a magnet and can move between a locked position and an unlocked position by a magnetic force acting on the magnet. The locked position is a position in which the engaging member is engaged with the engaged member to fix the first retaining member and the second retaining member to each other, and the unlocked position is a position in which the engagement between the engaging member and the engaged member is released to release the fixation of the first retaining member and the second retaining member. The substrate holder further comprises a sealing member, When the first holder and the second holder hold the substrate, the first holder, the second holder and the sealing member are configured to form a closed space. The engaging member and the engaged member are disposed inside the enclosed space.

2. The substrate holder according to claim 1, characterized in that The sealing component comprises: an inner sealing member configured to be in contact with the first holding member or the second holding member and the substrate; and The outer seal is configured to be in contact with the first retainer and the second retainer.

3. The substrate holder according to claim 2, characterized in that The outer seal is arranged to be in contact with an outer end portion of a surface of the first retainer facing the second retainer or an outer end portion of a surface of the second retainer facing the first retainer.

4. The substrate holder according to claim 2 or 3, characterized in that: The inner seal member is arranged to be in contact with an inner end portion of a surface of the first holder facing the substrate or an inner end portion of a surface of the second holder facing the substrate.

5. The substrate holder according to any one of claims 1 to 3, characterized in that The engaging member is a hook configured to be rotatable about a rotation axis. The engaged member has a claw configured to be engaged with the hook by the rotation of the hook. When the engaging member is in the locking position, the hook engages with the claw. When the engaging member is located at the unlocking position, the hook is not engaged with the claw.

6. The substrate holder according to any one of claims 1 to 3, characterized in that: have: The force applying component is used to apply force to the engaging component in a direction toward the locking position.

7. The substrate holder according to any one of claims 1 to 3, characterized in that The engaging member has a rod-shaped portion, The engaging member is mounted on the second holding member in such a manner that the engaging member can move in a direction perpendicular to the opening and closing direction of the substrate holder relative to the second holding member, but the movement in the opening and closing direction is restricted. The engaged member has a limiting wall for limiting movement of the rod-shaped portion in the opening and closing direction by contacting the rod-shaped portion, and the engaged member is fixed to the first retaining member. When the engaging member is located at the locking position, the limiting wall limits the movement of the rod-shaped portion in the opening and closing direction. When the engaging member is located at the unlocking position, the restricting wall does not restrict movement of the rod-shaped portion in the opening and closing direction.

8. The substrate holder according to any one of claims 1 to 3, characterized in that The engaging member has a first contact portion, The engaged member has a first contacted portion, The substrate holder has a first wiring and a second wiring, The first wiring has: a first end portion electrically connected to the first contact portion; and a second end portion exposed to the outside of the substrate holder, The second wiring has: a first end portion electrically connected to the first contacted portion; and a second end portion exposed to the outside of the substrate holder, When the engaging member is located at the locking position, the first contact portion is configured to be electrically connected to the first contacted portion. When the engaging member is not located at the locking position, the first contact portion is configured not to be electrically connected to the first contacted portion.

9. The substrate holder according to any one of claims 1 to 3, characterized in that The engaging member has a second contact portion, The engaged member has a second contacted portion, The substrate holder has a third wiring and a fourth wiring, The third wiring has: a first end portion electrically connected to the second contact portion; and a second end portion exposed to the outside of the substrate holder, The fourth wiring has: a first end portion electrically connected to the second contacted portion; and a second end portion exposed to the outside of the substrate holder, When the engaging member is located at the unlocking position, the second contact portion is configured to be electrically connected to the second contacted portion. When the engagement member is not located at the unlocking position, the second contact portion is configured not to be electrically connected to the second contacted portion.

10. A substrate processing device, characterized in that: have: The substrate holder according to any one of claims 1 to 3; and The opening and closing device is configured to cause a magnetic force to act on the magnet of the substrate holder to move the substrate holder between the locked position and the unlocked position.

11. A substrate processing device, characterized in that: have: The substrate holder according to any one of claims 1 to 3; and The plating module is used for plating the substrate.

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