Display panel and manufacturing method thereof

Abstract

A display panel and its manufacturing method are disclosed. The display panel includes an array substrate, a chip (IC), and a circuit board (200). The array substrate includes a display portion (101) and a transition portion (102), a bending portion (103), and a first bonding portion (104) sequentially connected to one end of the display portion (101). The first bonding portion (104) is bent through the bending portion (103) to one side of the transition portion (102) in the second direction Y. The circuit board (200) includes a main body portion (201) and a second bonding portion (203). The second bonding electrode (EP2) of the second bonding portion (203) is connected to the first bonding electrode (EP1). The main body portion (201) is connected to the first bonding electrode (EP1). 1) The chip (IC) is located on the same side of the second bonding part (203) in the first direction X; wherein, the first bonding part (104) has a protrusion (105) extending along the first direction X at one end where the first bonding electrode (EP1) connects to the second bonding electrode (EP2), and the second bonding part (203) exposes the protrusion (105) in the second direction Y; the extension length of the protrusion (105) in the first direction X is L1, and the protrusion height of the second bonding part (203) in the first bonding part (104) along the second direction Y is h1, and the ratio of L1 to h1 is greater than or equal to 0.4 and less than or equal to 3.5.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more specifically, to a display panel and a method for manufacturing the same. Background Technology

[0002] With the development of the OLED market, insufficient battery life has become a common problem in the industry, especially for mid-sized foldable mobile phones, where battery life has become a pain point restricting their development.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a display panel and a method for manufacturing the same.

[0005] According to one aspect of this disclosure, a display panel is provided, comprising: an array substrate including a display portion and a transition portion, a bending portion, and a first bonding portion sequentially connected to one end of the display portion, wherein the first bonding portion has a first bonding electrode at an end away from the bending portion, and the first bonding portion is bent to a non-display side of the display portion through the bending portion, and a second direction is perpendicular to the plane of the array substrate; a chip bonded to the first bonding portion; and a circuit board including a main body portion and a second bonding portion, wherein the second bonding portion has a second bonding electrode at an end away from the main body portion, the second bonding electrode being connected to the first bonding electrode, and the main body portion and the chip being located on the same side of the second bonding portion in a first direction, the first direction being perpendicular to the interface between the display portion and the bending portion; wherein the first bonding portion has a protrusion at the end where the first bonding electrode is connected to the second bonding electrode, the protrusion extending along a first direction, and the second bonding portion exposing the protrusion in a second direction; the extension length of the protrusion in the first direction is L1, and the protrusion height of the second bonding portion on the first bonding portion along the second direction is h1, and the ratio of L1 to h1 is greater than or equal to 0.4 and less than or equal to 3.5.

[0006] In an exemplary embodiment of this disclosure, the interface between the first binding portion and the bending portion is a first interface; the display panel further includes: a protective layer located on the side of the first binding portion away from the transition portion and at least covering the protruding portion, wherein the distance between the sidewall of the protective layer away from the bending portion and the plane of the first interface in the first direction is equal to the distance between the end of the protruding portion and the plane of the first interface in the first direction, and the protective layer is connected to the first binding electrode and the second binding electrode respectively.

[0007] In an exemplary embodiment of this disclosure, the height of the protrusion of the protective layer on the first binding portion along the second direction is h2, and the ratio of L1 to h2 is greater than or equal to 0.4 and less than or equal to 3.4.

[0008] In an exemplary embodiment of this disclosure, the second bonding portion includes: a second conductive layer, wherein the second bonding electrode is located on the second conductive layer; and an insulating layer covering the second conductive layer on the side of the second conductive layer opposite to the first bonding portion; wherein the sidewalls of the second conductive layer and the insulating layer facing the protective layer are both sealed to the protective layer.

[0009] In an exemplary embodiment of this disclosure, the insulating layer has a protrusion at one end where the second bonding electrode connects to the first bonding electrode; in the first direction, the distance between the end of the protrusion away from the first interface and the plane where the first interface is located is greater than the distance between the end of the second conductive layer away from the first interface and the plane where the first interface is located; the protective layer is sealed to the side of the protrusion facing the transition portion.

[0010] In an exemplary embodiment of this disclosure, the surface of the protective layer facing away from the first binding portion is a slope; the slope forms an ascending structure from the side near the plane where the first interface is located to the side away from the plane where the first interface is located; and / or, the slope forms a descending structure from the side near the plane where the first interface is located to the side away from the plane where the first interface is located.

[0011] In an exemplary embodiment of this disclosure, the protective layer exposes the sidewall of the protrusion to the sidewall of the second binding portion.

[0012] In an exemplary embodiment of this disclosure, the protective layer exposes a portion of the sidewall of the protrusion facing the sidewall of the second binding portion.

[0013] In an exemplary embodiment of this disclosure, the protective layer is sealed to the sidewall of the protrusion facing the sidewall of the second binding portion.

[0014] In an exemplary embodiment of this disclosure, the protective layer has a main extension and a secondary extension; wherein the main extension covers the protrusion and the secondary extension covers the insulating layer.

[0015] In an exemplary embodiment of this disclosure, the extension length of the secondary extension in the first direction is less than or equal to 100 μm.

[0016] In an exemplary embodiment of this disclosure, when the slope forms a climbing structure from the side away from the bend towards the side closer to the bend, the slope angle of the slope is less than or equal to 60°.

[0017] In an exemplary embodiment of this disclosure, the main body portion has an opening groove facing the first binding portion, the depth of the opening groove in the second direction being greater than or equal to 200 μm.

[0018] In an exemplary embodiment of this disclosure, the opening groove penetrates the main body portion in the second direction; the thickness of the main body portion in the second direction is greater than or equal to 120 μm.

[0019] In an exemplary embodiment of this disclosure, the display panel further includes: an electronic device located on the side of the chip opposite to the first bonding portion, wherein the orthographic projection of the electronic device on the first bonding portion is separate from the orthographic projection of the opening slot on the first bonding portion.

[0020] In an exemplary embodiment of this disclosure, the array substrate includes: a substrate; a bottom film located on one side of the substrate; a first conductive layer located on the side of the substrate opposite to the bottom film in the first bonding portion, wherein the first bonding electrode is located on the first conductive layer; and a third conductive layer located on the side of the first conductive layer opposite to the substrate and connected to the second conductive layer; wherein the orthographic projection of the second conductive layer on the substrate covers the orthographic projection of the first conductive layer on the substrate and the orthographic projection of the third conductive layer on the substrate, and the orthographic projection of the third conductive layer on the substrate at least partially overlaps with the orthographic projection of the first conductive layer on the substrate; the sidewalls of the first conductive layer and the third conductive layer facing the protective layer are both sealed to the protective layer.

[0021] In an exemplary embodiment of this disclosure, the array substrate further includes: a support layer located on the side of the bottom film in the display portion and the transition portion away from the substrate; a first adhesive layer located between the support layer and the bottom film; a second adhesive layer connecting the bottom film in the first bonding portion and the support layer in the transition portion; and a cover plate layer located on the side of the substrate in the display portion away from the bottom film.

[0022] In an exemplary embodiment of this disclosure, L1 is 50–200 μm and h2 is 60–120 μm.

[0023] According to a second aspect of this disclosure, a method for manufacturing a display panel is also provided, for manufacturing the display panel described in any embodiment of this disclosure. The method includes: providing an array substrate and a chip, wherein the array substrate includes a display portion and a transition portion, a bending portion, and a first bonding portion sequentially connected to one end of the display portion, the first bonding portion having a first bonding electrode at an end away from the bending portion, and the chip being bonded to the first bonding portion; providing a circuit board, the circuit board including a main body portion and a second bonding portion, the second bonding portion having a second bonding electrode at an end away from the main body portion; bonding the second bonding electrode to the first bonding electrode, wherein the main body portion and the chip are located in the same direction as the second bonding portion in a first direction. On one side, the first bonding portion has a protrusion extending along the first direction at one end where the first bonding electrode connects to the second bonding electrode, and the second bonding portion exposes the protrusion in the second direction. The first direction is perpendicular to the interface between the display portion and the bent portion, and the second direction is perpendicular to the plane where the array substrate is located. The protrusion is cut using a cutting process, wherein the extension length of the cut protrusion in the first direction is L1, and the protrusion height of the second bonding portion on the first bonding portion along the second direction is h1, and the ratio of L1 to h1 is greater than or equal to 0.4 and less than or equal to 3.5. The bent portion is bent to bend the first bonding portion to the non-display side of the display portion.

[0024] In an exemplary embodiment of this disclosure, before cutting the protrusion using a cutting process, the method further includes: forming a protective layer on one side of the protrusion, wherein the protective layer is respectively connected to the first bonding electrode and the second bonding electrode; the cutting of the protrusion using a cutting process includes: cutting the protective layer and the protrusion using a cutting process, wherein the protective layer covers the protrusion after cutting.

[0025] In an exemplary embodiment of this disclosure, the method further includes: cutting the array substrate using a cutting process to form a plurality of sub-substrates, wherein the cutting process performed on the array substrate is performed synchronously with the cutting process performed on the protective layer and the protrusion.

[0026] In an exemplary embodiment of this disclosure, the array substrate includes a substrate and a bottom film, the bottom film being located on one side of the substrate in the display portion, the transition portion, and the first bonding portion; before bending the bending portion, the method further includes: forming a support layer on the side of the bottom film facing away from the substrate in the display portion and the transition portion; forming a first adhesive layer between the support layer and the bottom film to connect the support layer and the bottom film; forming a second adhesive layer on the side of the bottom film facing away from the substrate in the first bonding portion; and forming a cover layer on the side of the substrate in the display portion facing away from the bottom film.

[0027] In the display panel disclosed herein, the array substrate is bent by a bending portion, such that the first bonding portion of the array substrate is bent to the non-display side of the display portion. Furthermore, since the main body of the circuit board and the chip are located on the same side of the second bonding portion, it is equivalent to the main body of the circuit board also being located on the back side of the first bonding portion. This saves space occupied by the main body in the main extension direction of the array substrate. When this display panel is applied to a display device, this saved space can be used to increase the storage space of the display device, such as increasing the battery compartment space, thereby increasing the battery capacity of the display device. Moreover, by setting the ratio of the extension length of the protrusion to the protrusion height of the second bonding portion on the first bonding portion of the circuit board to the aforementioned ratio, the space occupied by the first bonding portion in the main extension direction of the array substrate after bending can be further reduced, thereby further increasing the battery capacity of the display device.

[0028] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0029] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0030] Figure 1 This is a schematic diagram of the semi-finished structure of a display panel before bending, according to one embodiment of the present disclosure.

[0031] Figure 2 for Figure 1 A schematic diagram of the finished structure of the display panel after bending;

[0032] Figure 3a for Figure 2 Enlarged view of a section of the M-shaped part;

[0033] Figure 3b for Figure 2 Enlarged view of the first binding part and the bent part in the middle;

[0034] Figure 4a , Figure 4b This is a schematic diagram of the structure of a protective electrode according to one embodiment of the present disclosure;

[0035] Figures 5-9 Schematic diagrams of various exemplary structures of the protective layer in the binding provided in this disclosure;

[0036] Figure 10 This is a schematic diagram of the structure of the binding part according to another embodiment of the present disclosure;

[0037] Figures 11-15 This is a process flow diagram of the manufacturing process of a display panel according to one embodiment of the present disclosure. Detailed Implementation

[0038] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0039] Figure 1 This is a schematic diagram of the semi-finished structure of a display panel before bending, according to one embodiment of the present disclosure. Figure 2 for Figure 1 A schematic diagram of the finished structure of the display panel after bending. Figure 3a for Figure 2 A magnified view of part M in the middle, as shown below. Figures 1 to 3a As shown, the display panel may include an array substrate 100, a chip IC, and a circuit board 200. The array substrate 100 includes a display section 101 and a transition section 102, a bending section 103, and a first bonding section 104 sequentially connected to one end of the display section 101. The first bonding section 104 has a first bonding electrode EP1 at its end away from the bending section 103. The first bonding section 104 is bent through the bending section 103 to the non-display side of the display section 101, and the second direction Y is perpendicular to the plane of the array substrate 100. The chip IC is bonded to the first bonding section 104. The circuit board 200 includes a main body section 201 and a second bonding section 203. The second bonding section 203 has a second bonding electrode EP2 at its end away from the main body section 201. The second bonding electrode EP2 is connected to the first bonding electrode EP1, and the main body 201 and the chip IC are located on the same side of the second bonding part 203 in the first direction X; wherein, the first bonding part 104 has a protrusion 105 at the end where the first bonding electrode EP1 is connected to the second bonding electrode EP2, the protrusion 105 extends along the first direction X, and the second bonding part 203 exposes the protrusion 105 in the second direction Y, the first direction X is perpendicular to the interface between the display part 101 and the bending part 103; the extension length of the protrusion 105 in the first direction X is L1, and the protrusion height of the second bonding part 203 on the first bonding part 104 along the second direction Y is h1, and the ratio of L1 to h1 is greater than or equal to 0.4 and less than or equal to 3.5.

[0040] In the display panel provided in this disclosure, the array substrate 100 is bent by the bending portion 103, so that the first bonding portion 104 of the array substrate 100 is bent to the non-display side of the display portion 101. Furthermore, since the main body portion 201 of the circuit board 200 and the chip IC are located on the same side of the second bonding portion 203, it is equivalent to the main body portion 201 of the circuit board 200 also being located on the back side of the first bonding portion 104. This saves space occupied by the main body portion 201 in the main extension direction of the array substrate. When this display panel is applied to a display device, the saved space can be used to increase the storage space of the display device, such as increasing the battery compartment space, thereby increasing the battery capacity of the display device. Furthermore, by setting the ratio of the extension length L1 of the protrusion to the protrusion height of the second bonding portion 203 on the first bonding portion 104 to the aforementioned ratio, the space occupied by the first bonding portion 104 in the main extension direction of the array substrate 100 after bending can be further reduced, thereby further increasing the battery capacity of the display device.

[0041] The display panel described in this disclosure is a flexible display panel. The bending portion 103 allows for reverse bending of a portion of the display panel's structure, thereby reducing the panel's length and increasing its screen-to-body ratio. Combined with... Figure 1 , Figure 2 As can be seen, after the display panel is bent, the first binding portion 104 is bent to the non-display side of the display portion 101 (i.e., the back of the display panel). This saves back space in the first direction X (length direction) by utilizing the back space of the display panel in the second direction Y (thickness direction), reducing the length of the display panel and increasing its screen-to-body ratio. In this disclosure, after the bending portion 103 is bent, the first binding portion 104 can be parallel to the transition portion 102, meaning the first binding portion 104 extends along the first direction X on one side of the transition portion 102.

[0042] It is understood that the array substrate 100 typically includes a substrate, and the substrate extends from the display portion 101 to the first bonding portion 104. The protrusion height of a certain structure described in this disclosure on the first bonding portion 104 can be understood as the protrusion height of that structure on the substrate in the first bonding portion 104. For example, the side of the second bonding portion 203 facing away from the first bonding portion 104 is the upper surface of the second bonding portion 203, and the protrusion height h1 of the second bonding portion 203 on the first bonding portion 104 along the second direction Y can be understood as the distance in the second direction Y between the upper surface of the second bonding portion 203 and the surface of the substrate in the first bonding portion 104 facing the second bonding portion 203.

[0043] The transition section 102 connects the display section 101 and the bending section 103. The transition section 102 can be, for example, the lower borough area of ​​the terminal device. In actual products, the transition section 102 is relatively small, and the first bonding section 104 only partially faces the transition section 102 on the back of the display panel, while the remaining portion faces the display section 101. Figure 1 , Figure 2 This is an illustrative description for ease of understanding only, and the complete structure of the display part is not shown. The lengths of the display part, transition part, bending part, and first binding part shown in the figure in the first direction X should not be interpreted as size limitations of each part. In actual products, the size of the display part in the first direction X is much larger than the size of the transition part in the first direction X.

[0044] The first direction X of this disclosure is perpendicular to the interface between the display part 101 and the bending part 103, that is, the first direction X is parallel to the plane where the display part 101 is located and parallel to the extension direction of the display part 101. Here, the extension direction of the display part 101 can be understood as the extension direction of the display part 101 in its length direction.

[0045] It is worth noting that, in the present disclosure, a structure A extending along the direction B means that A may include a main part and a secondary part connected to the main part. The main part is a line, line segment, or strip shape. The main part extends along the direction B, and the length of the main part extending along the direction B is greater than the length of the secondary part extending along other directions.

[0046] refer to Figure 2 When the display panel is bent, the main body 201 of the circuit board 200 occupies the rear space of the display panel in the first direction X. As is known, in display devices using display panels, the rear space of the display panel is primarily used to house the battery. With the increasing size of the display screen, battery life directly impacts the user experience. Therefore, it is necessary to maximize battery capacity within a limited space, i.e., increase the rear space of the display panel in the first direction X. When the array substrate 100 is bent, the main body 201 of the circuit board 200 encroaches on the rear space of the display panel in the first direction X, thus limiting the battery size of the display device and restricting its battery life.

[0047] like Figure 2As shown, in the display panel of this disclosure, the chip IC is bonded to the first bonding portion 104, and the main body portion 201 of the circuit board 200 and the chip IC are located on the same side of the second bonding portion 203 in the first direction X. That is, the main body portion 201 and the chip IC are both located on the side of the first bonding portion 104 away from the display portion 101, so that the main body portion 201 of the circuit board 200 is disposed opposite to the first bonding portion 104 of the array substrate 100 in the second direction Y. In other words, the circuit board 200 and the first bonding portion 104 of the array substrate 100 are stacked on the back of the display panel. Thus, by utilizing the thickness space of the display panel in the second direction Y, the back space of the display panel in the first direction X can be increased. The increased back space in the first direction X can be used to increase the battery volume of the display device, thereby improving the battery life of the display device and meeting the battery life requirements of the display device.

[0048] like Figure 2 , Figure 3a As shown, after the array substrate 100 is bent, the protrusion 105 refers to the portion of the first bonding portion 104 that extends further than the second bonding portion 203 in the direction away from the bent portion 103, thereby exposing the second bonding portion 203 in the second direction Y. In other words, the second bonding portion 203 is closer to the bent portion 103 in the first direction X than the first bonding portion 104. The protrusion 105 extends along the first direction X on the back of the display panel, which will occupy the back space of the display panel in the first direction X. In this disclosure, the ratio of the extension length L1 of the protrusion 105 to the protrusion height h1 of the second bonding portion 203 is set to 0.4 to 3.5, for example, it can be 0.4, 0.45, 0.5, 0.8, 1.0, 1.1, 1.2, 1.5, 1.8, 2.0, 2.4, 2.6, 2.8, 3.0, 3.1, 3.2, 3.5, etc. This configuration can further reduce the space occupied by the protrusion 105 in the first direction X, that is, it can save the back space of the display panel in the first direction X. The saved space can be used to further increase the battery size of the display device, thereby further improving the battery life. In an exemplary embodiment, the extension length L1 of the protrusion 105 can specifically be 50 to 200 μm, for example, 50 μm, 100 μm, 150 μm, 200 μm, etc. The protrusion height h1 of the second binding part 203 on the first binding part 104 along the second direction Y can specifically be 58 to 110 μm, for example, 58 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, etc.

[0049] In an exemplary embodiment, the extension length L1 of the protrusion 105 in the first direction X can be trimmed using a cutting process to ensure that the extension length L1 of the protrusion 105 in the first direction X meets the requirements. For example, the protrusion 105 can be cut using a laser cutting process to control the length of the protrusion 105.

[0050] Understandably, the protrusion height h1 of the second binding part 203 on the first binding part 104 is related to the material of the second binding part 203, the conductive material connecting the first binding electrode EP1 and the second binding electrode EP2, and the precision of the pressing process for pressing the aforementioned components together. In an exemplary embodiment, once the protrusion height h1 of the second binding part 203 on the first binding part 104 is determined, the extension length L1 of the protrusion 105 in the first direction X can be determined based on the determined protrusion height h1 of the second binding part 203 and the aforementioned proportional relationship, and then a cutting process is used for cutting. Of course, the extension length L1 of the protrusion 105 also needs to be specifically controlled in conjunction with the cutting precision of the cutting process.

[0051] Figure 3b for Figure 2 Enlarged view of the first binding part and the bent part, as shown below Figure 3b As shown, the interface between the first binding part 104 and the bending part 103 is the first interface S1, which is combined with... Figure 3a and Figure 3b The second binding portion 203 has a first sidewall on the side away from the bent portion 103 that is opposite to the plane containing the first interface S1 in the first direction X. The protruding portion 105 has a second sidewall on the side away from the bent portion 103 that is opposite to the plane containing the first interface S1 in the first direction X. The extension length L1 of the protruding portion 105 along the first direction X as described in this disclosure can be understood as the distance between the second sidewall of the protruding portion 105 and the first sidewall of the second binding portion 203 in the first direction X.

[0052] It should be understood. Figure 1 The state shown is only an intermediate state in the display panel manufacturing process. Figure 2 This refers to the final state of the resulting display panel; therefore, unless otherwise specified, all distances mentioned below refer to... Figure 2 The distance between the structures in the array substrate 100 shown after it has been bent.

[0053] like Figures 1 to 3aAs shown, in an exemplary embodiment, the display panel may further include a protective layer 300. The protective layer 300 is connected to the first bonding electrode EP1 and the second bonding electrode EP2, and the protective layer 300 covers at least the protruding portion 105 on the side of the first bonding portion 104 facing away from the transition portion 102. The protective layer 300 connects the first bonding electrode EP1 and the second bonding electrode EP2, thereby isolating the first bonding electrode EP1 and the second bonding electrode EP2 from the external environment and preventing external moisture from entering the bonding portion of the circuit board 200 and the array substrate 100, thus protecting the bonding electrodes from oxidation and corrosion. The material of the protective layer 300 may be, for example, UV adhesive, which can be applied to the protruding portion 105 by a coating process to form the protective layer 300.

[0054] like Figure 3b As shown, in an exemplary embodiment, the distance between the protective layer 300 and the plane containing the first interface S1 away from the sidewall of the bent portion 103 in the first direction X is equal to the distance between the end of the protruding portion 105 and the plane containing the first interface S1 in the first direction X. Thus, the protective layer 300 can isolate the bonding portion of the circuit board and the array substrate from the external environment without additionally occupying the back space of the display panel in the first direction X, thereby ensuring that the battery capacity of the display device is increased.

[0055] like Figure 3a As shown, the protrusion height of the protective layer 300 on the first bonding portion 104 along the second direction Y is h2, and the ratio of L1 to h2 is greater than or equal to 0.4 and less than or equal to 3.4, for example, it can be 0.4, 0.45, 0.5, 0.8, 0.9, 1.0, 1.4, 1.5, 1.8, 2.0, 2.5, 3.0, 3.2, 3.3, 3.34, 3.4, etc. Thus, within the allowable range of process precision, while ensuring that the protective layer 300 covers the protrusion 105, the extension length of the protrusion 105 and the protective layer 300 in the first direction X is minimized as much as possible, thereby saving the back space of the display panel in the first direction X, and thus increasing the battery capacity of the display device. In an exemplary embodiment, the extension length L1 of the protrusion 105 can specifically be 50 to 200 μm, for example, 50 μm, 100 μm, 150 μm, 200 μm, etc. The height h2 of the protrusion of the protective layer 300 along the second direction Y on the first binding part 104 can be 60 to 120 μm, for example, it can be 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, etc.

[0056] In addition, it should be noted that the protrusion height h2 of the protective layer 300 can be as follows: Figure 3a The protrusion height h1 shown is the same as that of the second binding part 203, and it can also be like this. Figure 8The protrusion height h1 shown is different from that of the second binding part 203, and this disclosure does not limit it.

[0057] In an exemplary embodiment, after the protective layer 300 is formed, a cutting process can be performed simultaneously to cut the protective layer 300 and the protrusion 105, so that the protrusion length of the protrusion 105 meets the requirements and the protective layer 300 completely covers the protrusion 105. It is understood that... Figure 2 As shown, after the array substrate 100 is bent, the sidewall of the protrusion 105 away from the bending portion 103 and the sidewall of the protective layer 300 away from the bending portion 103 are located in the same plane.

[0058] Furthermore, in some embodiments, such as Figure 4a As shown, before cutting the protective layer 300 and the protrusion 105, the first bonding electrode EP1 and / or the second bonding electrode EP2 may expose the protective layer 300 (the figure illustrates this by showing the first bonding electrode EP1 exposed in the protective layer 300). By cutting the protective layer 300 and the protrusion 105, the electrode not covered by the protective layer 300 can be removed, such as... Figure 4b As shown, after cutting, the protective layer 300 completely covers the upper surface of the electrode, with only the sidewall of the electrode exposed. Because the electrode is very thin, it is minimally affected by moisture. Furthermore, since the sidewall of the electrode abuts against the wall of the battery compartment of the display device, the battery compartment wall can act as a moisture barrier for the electrode sidewall. Therefore, by cutting off the portion of the electrode exposed by the protective layer 300, the electrode can be protected from oxidation and corrosion by moisture.

[0059] like Figure 2 , Figure 3a As shown, in an exemplary embodiment, the second bonding portion 203 may include a second conductive layer 2031 and an insulating layer 2032. The second bonding electrode EP2 is located on the second conductive layer 2031. The second conductive layer 2031 may face the first bonding portion 104 of the array substrate 100. The insulating layer 2032 covers the second conductive layer 2031 on the side facing away from the first bonding portion 104. The sidewalls of the second conductive layer 2031 and the insulating layer 2032 facing the protective layer 300 are sealed to the protective layer 300, thereby preventing moisture from entering the first electrode and / or the second electrode, thus isolating moisture and protecting the bonding electrode from oxidation and corrosion. Of course, in other embodiments, the circuit board 200 may have more conductive and insulating layers at the second bonding portion 203, which will not be detailed here.

[0060] like Figure 1 , Figure 2As shown, in an exemplary embodiment, the array substrate 100 may include a substrate 10, a bottom film 20, a first conductive layer 1041, and a third conductive layer 301. The bottom film 20 is located on one side of the substrate 10 in the display portion 101, the transition portion 102, and the first bonding portion 104. The first conductive layer 1041 is located on the side of the substrate 10 in the first bonding portion 104 that is away from the bottom film 20, and the first bonding electrode EP1 is located on the first conductive layer 1041. The third conductive layer 301 is located on the side of the first conductive layer 1041 that is away from the substrate 10 and is connected to the second conductive layer 2031.

[0061] In this design, the orthographic projection of the second conductive layer 2031 onto the substrate 10 can cover the orthographic projections of the first conductive layer 1041 and the third conductive layer 301 onto the substrate 10. Furthermore, the orthographic projection of the third conductive layer 301 onto the substrate 10 at least partially overlaps with the orthographic projection of the first conductive layer 1041 onto the substrate 10. This results in a stacked structure of the first conductive layer 1041, the third conductive layer 301, and the second conductive layer 2031 on the side of the substrate 10 away from the base film 20 (i.e., the back of the display panel). This allows for physical and electrical connection between the first conductive layer 1041 and the second conductive layer 2031 via the third conductive layer 301, thereby bonding the first bonding electrode EP1 and the second bonding electrode EP2. The third conductive layer 301 can be, for example, a conductive adhesive.

[0062] Understandably, the side of the bottom film 20 facing away from the substrate 10 is the back of the display panel, and the side of the substrate 10 facing away from the bottom film 20 is the display side of the display panel. The bottom film 20 can protect the display section 101, the transition section 102, and the first bonding section 104. In addition, the bottom film 20 may not be provided at the position corresponding to the bending section 103, thereby reducing the thickness of the bending section 103 and improving the flexibility of the bending section 103.

[0063] The sidewalls of the first conductive layer 1041 and the third conductive layer 301 facing the protective layer 300 are sealed to the protective layer 300. Thus, the protective layer 300 can prevent moisture from entering the bonding part between the circuit board 200 and the array substrate 100, and can protect the first conductive layer 1041 and the third conductive layer 301 from oxidation and corrosion.

[0064] like Figure 1 , Figure 2As shown, in an exemplary embodiment, the array substrate may further include a support layer 30, a first adhesive layer 40, a second adhesive layer 50, and a cover layer (not shown). The support layer 30 is located on the side of the bottom film 20 in the display section 101 and the transition section 102 that faces away from the substrate 10, and serves to provide support and heat dissipation. The first adhesive layer 40 is located between the support layer 30 and the bottom film 20 to connect them. The second adhesive layer 50 connects the bottom film 20 in the first bonding section 104 and the support layer 30 in the transition section 102; that is, after the array substrate 100 is bent, the bottom film 20 of the first bonding section 104 and the support layer 30 of the transition section 102 are connected by the second adhesive layer 50. The cover layer is located on the side of the substrate 10 in the display section 101 that faces away from the bottom film 20, and the material of the cover layer may be polyimide (PI), glass, etc.

[0065] It should be understood that in actual products, the array substrate 100 may also have other film layer structures, such as driving circuit layers, encapsulation layers, etc., which will not be described in detail here.

[0066] like Figure 3b As shown, in an exemplary embodiment, the interface between the first binding portion 104 and the bending portion 103 is the first interface S1. The insulating layer 2032 has a protrusion 2034 at one end where the second binding electrode EP2 is connected to the first binding electrode EP1. In the first direction X, the distance L2 between the end of the protrusion 2034 away from the first interface S1 and the plane where the first interface S1 is located is greater than the distance L3 between the end of the second conductive layer 2031 away from the first interface S1 and the plane where the first interface S1 is located. The protective layer 300 is sealed to the side of the protrusion 2034 facing the transition portion 102. The insulating layer 2032 has a protrusion 2034 at the end where the second bonding electrode EP2 is connected to the first bonding electrode EP1. This indicates that the insulating layer 2032 extends further than the second conductive layer 2031 in the direction away from the bend 103. As a result, the distance L2 between the protrusion 2034 and the plane where the first interface S1 is located in the first direction X is greater than the distance L3 between the second conductive layer 2031 and the plane where the first interface S1 is located in the first direction X. In other words, at the end where the second bonding electrode EP2 is connected to the first bonding electrode EP1, the sidewall of the insulating layer 2032 is farther from the plane where the first interface S1 is located than the sidewall of the second conductive layer 2031.

[0067] The protective layer 300 and the protrusion 2034 are sealed together on the side facing the transition portion 102, thereby preventing moisture from entering through the contact interface between the protective layer 300 and the insulating layer 2032 and causing oxidation and corrosion of the electrode.

[0068] As described above, the side of the protrusion 105 away from the bend 103 has a second sidewall that is opposite to the first interface S1 in the first direction X, such as... Figure 3a As shown, in an exemplary embodiment, when the insulating layer 2032 includes a protrusion 2034, the extension length L1 of the protrusion 105 of the first binding portion 104 in the first direction X can be further understood as the distance in the first direction X between the second sidewall of the protrusion 105 and the sidewall of the insulating layer 2032 facing the plane containing the second sidewall.

[0069] Combination Figures 5-8 In an exemplary embodiment, the surface of the protective layer 300 facing away from the substrate 10 is a slope 311. The slope 311 can form a climbing structure from the first end to the second end, such as... Figure 5 and Figure 6 As shown, the height h3 of the protrusion on the first binding part 104 at the first end is lower than the height h4 of the protrusion on the second end of the first binding part 104. Alternatively, a downward slope structure can be formed from the first end to the second end, such as... Figure 7 As shown, the height h3 of the protrusion on the first binding part 104 of the first end is higher than the height h4 of the protrusion on the second end of the first binding part 104. Alternatively, it can be as follows: Figure 8 As shown, a structure with both uphill and downhill sections is formed from the first end to the second end, that is, the height of the protrusion on the first binding part 104 of the slope surface 311 undulates from the first end to the second end. The first end of the slope surface 311 mentioned here is the end of the slope surface 311 away from the first interface S1, and the second end of the slope surface 311 is the end of the slope surface 311 close to the first interface S1.

[0070] In one exemplary embodiment, such as Figure 5 As shown, the protective layer 300 exposes the sidewall of the protrusion 2034 on the sidewall facing the second bonding portion 203, meaning the sidewall of the insulating layer 2032 facing the protective layer 300 does not contact the protective layer 300. In this structure, the protective layer 300 can extend from the edge at the junction of the sidewall of the protrusion 2034 and the lower surface towards the first conductive layer 1041, the second conductive layer 2031, and the third conductive layer 301, exposing the sidewall of the insulating layer 2032, and the protective layer 300 is sealed to the bottom of the protrusion 2034. Further, in this exemplary embodiment, when the slope 311 is as... Figure 5When a sloping structure is formed from the first end to the second end, the slope angle of the slope 311 can be less than or equal to 60°, for example, it can be 20°, 30°, 45°, 60°, etc. This exemplary embodiment sets the slope angle of the protective layer 300 to the above range to reduce the sloping angle of the slope 311 and control the slope 311 to prevent it from becoming too steep. This avoids the situation where, after a period of use, the protective layer 300 and the insulating layer 2032 of the circuit board 200 do not adhere properly, causing moisture to enter and corrode the electrodes, thus improving the service life of the display panel.

[0071] The slope angle of the slope 311 described in this disclosure can be understood as the acute angle between the tangent plane passing through any node on the slope 311 and the plane where the array substrate 100 is located.

[0072] In another exemplary embodiment, such as Figure 9 As shown, the protective layer 300 exposes the side wall of the protrusion 2034 facing the side wall of the second binding part 203. That is, a part of the side wall of the protrusion 2034 contacts the side wall of the protective layer 300. The side wall of the protrusion 2034 is the side wall away from the bending part 103 in the first direction X.

[0073] In yet another exemplary embodiment, such as Figure 6 , Figure 7 As shown, the protective layer 300 seals the sidewall of the protrusion 2034 facing the sidewall of the second bonding portion 203, meaning the sidewall of the protrusion 2034 is completely fitted to the sidewall of the protective layer 300. For example, the protective layer 300 can be formed by applying UV adhesive. In this case, not only are UV adhesives applied to the sidewalls of the first conductive layer 1041, the second conductive layer 2031, and the third conductive layer 301, but UV adhesives are also needed to cover the sidewall of the insulating layer 2032 away from the bend 103, thus forming the protective layer 300. Figure 6 , Figure 7 The structure shown.

[0074] In yet another exemplary embodiment, such as Figure 8 As shown, the protective layer 300 may have a main extension 320 and a secondary extension 330. The main extension 320 covers the protrusion 105, and the secondary extension 330 covers the insulating layer 2032. That is, the orthographic projection of the secondary extension 330 onto the substrate 10 is located on the insulating layer 2032, and the orthographic projection of the main extension 320 onto the substrate 10 is located on the protrusion 105. This disclosure does not limit the extension length of the secondary extension 330 on the upper surface of the insulating layer 2032, and it can be specifically set according to user needs. For example, the extension length of the secondary extension 330 can be less than or equal to 100 μm. The upper surface of the insulating layer 2032 mentioned here refers to the side of the insulating layer 2032 facing away from the second conductive layer 2031.

[0075] It should be noted that the above embodiments of this disclosure are only illustrated by the example that the distance between the second bonding electrode EP2 and the plane containing the first interface S1 in the first direction X is greater than the distance between the first bonding electrode EP1 and the plane containing the first interface S1 in the first direction X. That is, the second bonding electrode EP2 is farther from the plane containing the first interface S1 in the first direction X than the first bonding electrode EP1. In other embodiments of this disclosure, such as Figure 4b and Figure 10 As shown, the distance between the second bonding electrode EP2 and the plane where the first interface S1 is located in the first direction X can also be less than the distance between the first bonding electrode EP1 and the plane where the first interface S1 is located in the first direction X. That is, the second bonding electrode EP2 is closer to the display unit 101 in the first direction X than the first bonding electrode EP1.

[0076] like Figure 2 , Figure 3a As shown, in an exemplary embodiment, the thickness d1 of the main body 201 of the circuit board 200 in the second direction Y is greater than the thickness d2 of the second bonding portion 203 in the second direction Y. For example, the thickness d1 of the main body 201 in the second direction Y can be greater than or equal to 120 μm, and the thickness d2 of the second bonding portion 203 in the second direction Y can be 40 to 60 μm. Here, the thickness of the main body 201 of the circuit board 200 in the second direction Y can be understood as follows: the main body 201 has an upper surface facing away from the first bonding portion 104 and a lower surface facing the first bonding portion 104, and the distance between the upper and lower surfaces of the main body 201 in the second direction Y is the thickness of the main body 201 in the second direction Y. Similarly, the thickness d2 of the second bonding portion 203 in the second direction Y is the distance between the upper surface of the second bonding portion 203 facing away from the first bonding portion 104 and the lower surface facing the first bonding portion 104 in the second direction Y. For example, the circuit board 200 at the second bonding portion 203 can be a single-layer structure, that is, it includes only one conductive layer in addition to the substrate layer. The main body portion 201 of the circuit board 200 can be a multi-layer structure, for example, it may include six conductive layers and interlayer insulating layers stacked on one side of the substrate layer in addition to the substrate layer.

[0077] Furthermore, the display panel may also include a chip IC, which is bonded to a first bonding portion 104. The chip IC and the circuit board 200 are located on the same side of the array substrate 100. The chip IC is connected to a second bonding electrode EP2 via a first bonding electrode EP1, thereby electrically connecting the chip IC to external devices through the circuit board 200. Accordingly, the main body 201 of the circuit board 200 has an opening slot 204 facing the first bonding portion 104, which is used to accommodate the chip IC.

[0078] like Figure 2As shown, in an exemplary embodiment, the main body 201 of the circuit board 200 may include an electronic device 205 connected thereto on the side opposite to the first bonding portion 104. The orthographic projection of the electronic device 205 on the first bonding portion 104 can be separated from the orthographic projection of the opening slot 204 on the first bonding portion 104. That is, the portion of the main body 201 above the opening slot 204 does not have the electronic device 205. In other words, the electronic device 205 avoids the area above the opening slot 204. This prevents the formation of additional traces on the main body 201 at the position corresponding to the opening slot 204, thereby not affecting the shape of the main body 201 above the opening slot 204 and ensuring the stable operation of the chip IC.

[0079] It should be understood that the depth of the opening slot 204 is slightly greater than the height of the chip IC so that the opening slot 204 can accommodate the chip IC. In an exemplary embodiment, the depth d3 of the opening slot 204 in the second direction Y can be greater than or equal to 200 μm to provide sufficient space for the chip IC.

[0080] In an exemplary embodiment, the opening slot 204 can also be a through hole, that is, the opening slot 204 penetrates the main body portion 201 in the second direction Y. Furthermore, in this structure, the height of the chip IC located within the through hole can be greater than the thickness d1 of the main body portion 201 in the second direction Y. It is understood that when the opening slot 204 is a through hole, the depth of the opening slot 204 is equal to the thickness of the main body portion 201.

[0081] Furthermore, it should be understood that, when the opening slot 204 is included, the thickness d1 of the main body portion 201 of the circuit board in the second direction Y refers to the thickness of the peripheral portion of the main body portion 201 surrounding the opening slot 204 in the second direction Y.

[0082] This disclosure also provides a method for manufacturing a display panel, used to manufacture the display panel described in any embodiment of this disclosure. The manufacturing method may include the following steps:

[0083] S110, such as Figure 11 As shown, an array substrate 100 and a chip IC are provided. The array substrate 100 includes a display portion 101 and a transition portion 102, a bending portion 103 and a first bonding portion 104 connected sequentially to one end of the display portion 101. The first bonding portion 104 has a first bonding electrode EP1 at one end away from the bending portion 103. The chip IC is bonded to the first bonding portion 104.

[0084] The array substrate 100 can be a flexible array substrate 100. The array substrate 100 may include a substrate 10, a bottom film 20, a first conductive layer 1041, and a third conductive layer 301. The bottom film 20 is located on one side of the substrate 10 in the display portion 101, the transition portion 102, and the first bonding portion 104. The first conductive layer 1041 is located on the side of the substrate 10 in the first bonding portion 104 that is away from the bottom film 20, and the first bonding electrode EP1 is located on the first conductive layer 1041. The third conductive layer 301 is located on the side of the first conductive layer 1041 that is away from the substrate 10 and is connected to the second conductive layer 2031.

[0085] It is worth noting that this disclosure pertains to reverse bonding of ICs, with the chip IC located on the side of the array substrate 100 in the bonding section opposite to the base film 20. For example... Figure 11 As shown, the chip IC protrudes to a certain height on the first bonding portion 104 of the array substrate 100. Based on this, before reverse bonding the circuit board 200, an opening groove 204 can be formed on the main body portion 201 of the circuit board 200. The opening groove 204 opens towards the substrate 10, and the depth of the opening groove 204 is greater than the height of the chip IC, and the width of the opening groove 204 is greater than the width of the chip IC. Thus, after reverse bonding of the main body portion 201, the chip IC can be accommodated through the opening groove 204.

[0086] S120, such as Figure 11 As shown, a circuit board 200 is provided, the circuit board 200 including a main body 201 and a second bonding part 203, the second bonding part 203 having a second bonding electrode EP2 at one end away from the main body 201.

[0087] S130, such as Figure 11 As shown, the second bonding electrode EP2 is bonded to the first bonding electrode EP1, and the main body 201 and the chip IC are located on the same side of the second bonding part 203 in the first direction X. The first bonding part 104 has a protrusion 105 extending along the first direction X at one end of the first bonding electrode EP1 connected to the second bonding electrode EP2. The second bonding part 203 exposes the protrusion 105 in the second direction Y. The first direction X is perpendicular to the interface between the display part 101 and the bending part 103, and the second direction Y is perpendicular to the plane where the array substrate 100 is located.

[0088] The circuit board 200 can be, for example, a flexible circuit board 200. The first bonding portion 104 of the circuit board 200 and the array substrate 100 is stacked on the non-display side of the display portion 101. Thus, by utilizing the space of the array substrate 100 in the second direction Y, the space on the back of the array substrate 100 in the first direction X can be saved. This saved space can be used to increase the battery compartment space of the display device, thereby increasing the battery capacity of the display device.

[0089] In an exemplary embodiment, electronic devices 205 connected to the main body 201 of the circuit board 200 can be formed on the main body 201. Specifically, electronic devices 205 can be formed on both sides of the main body 201 located in the first direction X of the opening slot 204. That is, the electronic devices 205 are above the main body 201, avoiding the area directly opposite the opening slot 204, thereby ensuring the shape of the opening slot 204, ensuring the stable operation of the chip IC, and improving the service life of the display panel.

[0090] In some embodiments, such as Figure 12 As shown, after step S130, the preparation method may further include: forming a protective layer 300 on one side of the protrusion 105, wherein the protective layer 300 connects the first bonding electrode EP1 and the second bonding electrode EP2 respectively. For example, a UV adhesive can be applied to one end of the first bonding portion 104 extending beyond the second bonding portion 203 to form the protective layer 300. This protective layer 300 can isolate the first bonding electrode EP1 and the second bonding electrode EP2 from the external environment, thereby preventing moisture from entering the bonding portions of the circuit board 200 and the array substrate 100, and protecting the bonding electrodes from oxidation and corrosion by moisture.

[0091] S140, such as Figure 13 As shown, the protruding part 105 is cut using a cutting process, wherein the extension length of the protruding part 105 after cutting in the first direction X is L1, and the protrusion height of the second binding part 203 on the first binding part 104 along the second direction Y is h1, and the ratio of L1 to h1 is greater than or equal to 0.4 and less than or equal to 3.5.

[0092] In an exemplary embodiment, the protrusion 105 can be cut using a laser process so that the extension length L1 of the protrusion 105 in the first direction X meets the requirements.

[0093] As mentioned above, after step S130, it is usually necessary to form a protective layer 300 on the protrusion 105. Therefore, this step can specifically be to use a cutting process to cut the protective layer 300 and the protrusion 105 so that the cut protective layer 300 covers the cut protrusion 105.

[0094] contrast Figure 12 and Figure 13 As can be seen, after the cutting, the length of the protrusion 105 is shortened by L0, and this area is the increased battery compartment space, thereby further increasing the battery capacity.

[0095] As is known, before forming the display panel, the array substrate 100 needs to be shaped. In this exemplary embodiment, the protruding portion 105 and the protective layer 300 can be cut simultaneously during the shape cutting process of the substrate, thereby saving process steps, improving production efficiency and reducing production costs.

[0096] In an exemplary embodiment, such as Figure 14 As shown, after cutting the protruding portion 105 and the protective layer 300, the preparation method may further include:

[0097] A first adhesive layer 40 is formed on the side of the bottom film 20 that is away from the substrate 10;

[0098] In the display section 101 and the transition section 102, a support layer 30 is formed on the side of the first adhesive layer 40 away from the substrate 10. The support layer 30 can provide support and heat dissipation. The support layer 30 and the bottom film 20 are connected through the first adhesive layer 40.

[0099] A second adhesive layer 50 is formed on the side of the bottom film 20 in the first bonding portion 104 away from the substrate 10. The second adhesive layer 50 can connect the bottom film 20 of the first bonding portion 104 and the support layer 30 of the transition portion 102 after the array substrate 100 is bent.

[0100] In the display section 101, a cover layer CP is formed on the side of the substrate 10 away from the bottom film 20.

[0101] S150, such as Figure 15 As shown, the bending portion 103 is bent to bend the first binding portion 104 to the non-display side of the display portion 101. It can be seen that after bending, the first binding portion 104 faces the battery compartment 400 on the back of the display panel. Because the protective layer 300 is cut, compared to the prior art, the size of the battery compartment 400 can be extended by an additional L0 length in the direction shown by the arrow in the figure, thereby further increasing the size of the battery compartment 400.

[0102] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A display panel, wherein, include: An array substrate includes a display section and a transition section, a bending section and a first bonding section connected sequentially to one end of the display section. The first bonding section has a first bonding electrode at the end away from the bending section. The first bonding section is bent to the non-display side of the display section through the bending section. The chip is bonded to the first bonding part; The circuit board includes a main body and a second bonding part. The second bonding part has a second bonding electrode at one end away from the main body. The second bonding electrode is connected to the first bonding electrode. The main body and the chip are located on the same side of the second bonding part in a first direction, which is perpendicular to the interface between the display part and the bent part. The battery is disposed adjacent to the first bonding portion along the first direction, and the sidewall of the first bonding electrode abuts against the sidewall of the battery compartment. Wherein, the first bonding part has a protrusion at one end where the first bonding electrode connects to the second bonding electrode, the protrusion extends along a first direction, and the second bonding part exposes the protrusion in a second direction, the second direction being perpendicular to the plane where the array substrate is located; The extension length of the protruding part in the first direction is L1, and the protrusion height of the second binding part on the first binding part along the second direction is h1. The ratio of L1 to h1 is greater than or equal to 0.4 and less than or equal to 3.

5. The interface between the first binding part and the bent part is the first interface; the display panel further includes: A protective layer is located on the side of the first binding portion away from the transition portion and at least covers the protruding portion. The distance between the sidewall of the protective layer away from the bend portion and the plane where the first interface is located in the first direction is equal to the distance between the end of the protruding portion and the plane where the first interface is located in the first direction. The protective layer is connected to the first binding electrode and the second binding electrode respectively.

2. The display panel according to claim 1, wherein, The height of the protrusion of the protective layer on the first binding part along the second direction is h2, and the ratio of L1 to h2 is greater than or equal to 0.4 and less than or equal to 3.

4.

3. The display panel according to claim 1, wherein, The second binding part includes: The second conductive layer, wherein the second bonding electrode is located in the second conductive layer; An insulating layer covers the second conductive layer on the side of the second conductive layer that is away from the first bonding portion; The second conductive layer and the insulating layer are both sealed to the protective layer from the sidewalls facing the protective layer.

4. The display panel according to claim 3, wherein, The insulating layer has a protrusion at one end where the second bonding electrode connects to the first bonding electrode; in the first direction, the distance between the end of the protrusion away from the first interface and the plane where the first interface is located is greater than the distance between the end of the second conductive layer away from the first interface and the plane where the first interface is located. The protective layer is sealed to the side of the protrusion facing the transition portion.

5. The display panel according to claim 4, wherein, The surface of the protective layer facing away from the first binding part is a slope. The slope forms a climbing structure from the side closest to the plane containing the first interface to the side furthest from the plane containing the first interface; and / or, The slope forms a downhill structure from the side closest to the plane where the first interface is located to the side furthest from the plane where the first interface is located.

6. The display panel according to claim 5, wherein, The protective layer exposes the sidewall of the protrusion to the sidewall of the second binding part.

7. The display panel according to claim 5, wherein, The protective layer exposes a portion of the sidewall of the protrusion facing the sidewall of the second binding part.

8. The display panel according to claim 5, wherein, The protective layer is sealed to the sidewall of the protrusion facing the sidewall of the second binding part.

9. The display panel according to claim 8, wherein, The protective layer has a main extension and a secondary extension; The main extension covers the protruding portion, and the secondary extension covers the insulating layer.

10. The display panel according to claim 9, wherein, The extension length of the secondary extension in the first direction is less than or equal to 100 μm.

11. The display panel according to claim 6, wherein, When the slope forms a climbing structure from the side away from the bend to the side closer to the bend, the slope angle of the slope is less than or equal to 60°.

12. The display panel according to claim 1, wherein, The main body has an opening groove facing the first binding part, and the depth of the opening groove in the second direction is greater than or equal to 200 μm.

13. The display panel according to claim 12, wherein, The opening groove penetrates the main body portion in the second direction; The thickness of the main body in the second direction is greater than or equal to 120 μm.

14. The display panel according to claim 13, wherein, The display panel also includes: An electronic device is located on the side of the chip opposite to the first bonding portion, and the orthographic projection of the electronic device on the first bonding portion is separate from the orthographic projection of the opening slot on the first bonding portion.

15. The display panel according to claim 3, wherein, The array substrate includes: Substrate; The bottom film is located on one side of the substrate. A first conductive layer is located on the side of the substrate away from the bottom film in the first bonding portion, and the first bonding electrode is located in the first conductive layer; The third conductive layer is located on the side of the first conductive layer away from the substrate and is connected to the second conductive layer; Wherein, the orthographic projection of the second conductive layer on the substrate covers the orthographic projection of the first conductive layer on the substrate and the orthographic projection of the third conductive layer on the substrate, and the orthographic projection of the third conductive layer on the substrate at least partially overlaps with the orthographic projection of the first conductive layer on the substrate. The first conductive layer and the third conductive layer are both sealed to the protective layer from their sidewalls.

16. The display panel according to claim 15, wherein, The array substrate further includes: A support layer is located on the side of the bottom film facing away from the substrate in the display section and the transition section; A first adhesive layer is located between the support layer and the base film; The second adhesive layer connects the base film in the first bonding portion and the support layer in the transition portion; A cover plate layer is located on the side of the substrate in the display section that faces away from the bottom film.

17. The display panel according to any one of claims 2-11, wherein, L1 is 50–200 μm, and h2 is 60–120 μm.

18. A method for manufacturing a display panel, wherein, The method for preparing the display panel according to any one of claims 1-17 comprises: An array substrate and a chip are provided, wherein the array substrate includes a display portion and a transition portion, a bending portion and a first bonding portion sequentially connected to one end of the display portion, the first bonding portion having a first bonding electrode at the end away from the bending portion, and the chip being bonded to the first bonding portion; A circuit board is provided, the circuit board including a main body and a second bonding part, the second bonding part having a second bonding electrode at one end away from the main body; The second bonding electrode is bonded to the first bonding electrode, and the main body and the chip are located on the same side of the second bonding part in a first direction. The first bonding part has a protrusion extending along the first direction at one end where the first bonding electrode connects to the second bonding electrode. The second bonding part exposes the protrusion in a second direction. The first direction is perpendicular to the interface between the display part and the bent part, and the second direction is perpendicular to the plane where the array substrate is located. The protruding part is cut using a cutting process, wherein the extension length of the cut protruding part in the first direction is L1, the protrusion height of the second binding part on the first binding part along the second direction is h1, and the ratio of L1 to h1 is greater than or equal to 0.4 and less than or equal to 3.

5. The bending portion is bent to bend the first binding portion to the non-display side of the display portion.

19. The method according to claim 18, wherein, Before cutting the protruding portion using a cutting process, the method further includes: A protective layer is formed on one side of the protrusion, wherein the protective layer is respectively connected to the first bonding electrode and the second bonding electrode; The process of cutting the protruding portion includes: The protective layer and the protrusion are cut using a cutting process, wherein the protective layer covers the protrusion after cutting.

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