An adsorption mold for bonding semiconductor refrigeration chips

Abstract

This invention relates to the field of semiconductor technology, specifically to an adsorption mold for bonding semiconductor refrigeration chips. The mold includes a mold base with a vacuum hole adsorption panel fixedly connected to the top of the base; a multi-size automatic positioning device; an automatic hole-closing device; and an anti-clogging cleaning device. This invention uses the multi-size automatic positioning device to drive the automatic hole-closing device, achieving the effects of aligning and positioning semiconductor refrigeration chips of different sizes, elastically clamping them, and sealing excess vacuum holes. This avoids errors caused by manual positioning. Combined with adsorption positioning, it provides a dual fixing effect, improving stability and further preventing adsorption instability caused by the use of excess vacuum holes. The anti-clogging cleaning device automatically cleans impurities from the filter screen and seals the cleaned impurities, preventing filter screen clogging and ensuring that the adsorption force does not affect impurity collection, thus avoiding problems such as reduced adsorption force due to clogging.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, specifically to an adsorption mold for bonding semiconductor cooling chips. Background Technology

[0002] Before bonding semiconductor refrigeration chips, a mold is needed to position the chips to be bonded. Traditional mold clamping components are insufficient for holding and bonding semiconductor refrigeration chips of different sizes. Therefore, most molds for semiconductor refrigeration chip bonding use vacuum hole adsorption positioning. However, existing adsorption positioning molds require manual alignment of the board. Since the positioning positions differ for semiconductor refrigeration chips of different sizes, manual positioning introduces errors. Furthermore, other vacuum holes not in contact with the semiconductor refrigeration chip are ineffective during adsorption positioning, weakening the adsorption force of the remaining holes. Additionally, over prolonged use, the filter screen inside the vacuum chamber becomes clogged with adsorbed lint, particles, and other impurities, significantly weakening the adsorption force and affecting the bonding process. Therefore, we propose an adsorption mold for semiconductor refrigeration chip bonding. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides an adsorption mold for bonding semiconductor refrigeration chips, solving the problems mentioned in the background section. To achieve the above objectives, this invention is implemented through the following technical solution: an adsorption mold for bonding semiconductor refrigeration chips, comprising a mold base, an adsorption motor fixedly connected to the interior of the mold base by bolts, a fan connected to the output shaft of the adsorption motor, and a vacuum hole adsorption panel fixedly connected to the top of the mold base; a multi-size automatic positioning device; an automatic hole-closing device; and an anti-clogging cleaning device.

[0004] Preferably, the multi-size automatic positioning device includes an active motor, a longitudinal bidirectional reciprocating lead screw, a transverse bidirectional reciprocating lead screw, and a transverse and longitudinal positioning device. The surface of the active motor is fixedly connected to the interior of the mold base by bolts. The output shaft of the active motor is engaged with an active roller. The surface of the active roller is connected to a passive roller via a toothed belt drive. The surfaces of the longitudinal bidirectional reciprocating lead screw and the transverse bidirectional reciprocating lead screw are both fixedly connected with meshing gears.

[0005] Preferably, the end of the active roller is rotatably connected to the interior of the mold base, the interior of the passive roller is rotatably connected to the surface of the longitudinal bidirectional reciprocating lead screw, and the ends of both the longitudinal bidirectional reciprocating lead screw and the transverse bidirectional reciprocating lead screw are rotatably connected to the interior of the mold base.

[0006] Preferably, the longitudinal and transverse positioning device includes a limiting slide block one and a limiting slide block two. The surfaces of the longitudinal bidirectional reciprocating lead screw and the transverse bidirectional reciprocating lead screw are slidably connected inside the limiting slide block one and the limiting slide block two, respectively. A base plate is fixedly connected to the top of the limiting slide block one, and a connecting seat is fixedly connected to the top of the base plate. A clamping block one is elastically connected to the surface of the connecting seat by a spring, and a moving plate is elastically connected to the surface of the limiting slide block two by a spring.

[0007] Preferably, the surfaces of the limiting slide one and the limiting slide two are slidably connected to the interior of the mold base, the surfaces of the base plate, the connecting seat and the moving plate are slidably connected to the inner wall of the mold base, and the surface of the moving plate is fixedly connected to the clamping block two by a long rod.

[0008] Preferably, the automatic hole-closing device includes a slide rod and a hole stop bar. One end of the slide rod is fixedly connected to the surface of the clamping block, and the other end of the slide rod is fixedly connected to a connecting plate. A connecting rod is fixedly connected to the surface of the connecting plate, and a hole stop bar is fixedly connected to the end of the connecting rod.

[0009] Preferably, the surface of the slide rod is slidably connected to the interior of the connecting seat, the surface of the connecting rod is slidably connected to the interior of the base plate, the surface of the hole baffle is slidably connected to the inner wall of the mold base, and the interior of the hole baffle is elastically connected to the surface of the moving plate by a spring, and the surface of the hole baffle is slidably connected to the interior of the mold base.

[0010] Preferably, the mold base has an internal storage groove, and the anti-clogging cleaning device includes a filter screen, a shaft, and a sealing plate. One end of the shaft is fixedly connected to the surface of the base plate, and the other end of the shaft is fixedly connected to a cleaning brush plate. A drive plate is fixedly connected to the surface of the shaft.

[0011] Preferably, the surface of the filter screen is fixedly connected to the interior of the mold base, the surface of the shaft is slidably connected to the interior of the hole baffle, and the surface of the sealing plate is elastically connected to the interior of the mold base by a spring.

[0012] As can be seen from the above technical solutions, the adsorption mold for bonding semiconductor cooling chips provided in the embodiments of this specification has at least the following beneficial effects:

[0013] (1) The present invention uses a multi-size automatic positioning device to drive an automatic hole-closing device, which achieves the effect of aligning and positioning, elastically clamping and sealing excess vacuum holes on all four sides of semiconductor cooling chips of different sizes, avoiding the problem of errors caused by manual positioning. At the same time, combined with adsorption positioning, it has a double fixing effect, improving the stability of positioning semiconductor cooling chips of different sizes, and further avoiding the problem of unstable adsorption of semiconductor cooling chips due to the use of excess vacuum holes. The anti-clogging cleaning device automatically cleans the impurities on the filter screen and seals the cleaned impurities, further achieving the effect of avoiding filter screen clogging and avoiding the problem of adsorption force affecting impurity collection, and avoiding the problem of suction force being affected by filter screen clogging.

[0014] (2) In this invention, the hole baffle is affected by the connecting plate and the sliding rod on the connecting rod, and moves in the same direction as the clamping block one. During the movement, the hole baffle covers the vacuum hole at the corresponding position, thereby achieving the effect of sealing the holes on both sides of the semiconductor cooling chip that do not contact the plate. At the same time, since the clamping block can be adjusted according to the semiconductor cooling chip of different sizes, the hole baffle can also be adjusted according to the semiconductor cooling chip of different sizes, thereby achieving the effect of sealing the vacuum holes on both sides of the semiconductor cooling chip that do not contact the plate. The clamping block two can be adjusted according to the semiconductor cooling chip of different sizes, so the hole baffle can also be adjusted according to the semiconductor cooling chip of different sizes, thereby achieving the effect of sealing the vacuum holes on both sides of the semiconductor cooling chip that do not contact the plate.

[0015] (3) The present invention uses the force of the base plate moving and resetting to drive the cleaning brush plate on the shaft to move. During the movement of the brush plate, the impurities on the filter screen are cleaned. During the movement of the shaft, the sealing plate is moved by the drive plate to make way and expose the collection groove. During the movement, the brush plate sweeps the impurities on the filter screen into the inside of the collection groove for collection, thereby achieving the effect of automatically cleaning the impurities on the filter screen and collecting the cleaned impurities. Attached Figure Description

[0016] The accompanying drawings, which are provided to further illustrate the invention, constitute a part of this application:

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 This is a schematic diagram of the internal structure of the mold base in this invention;

[0019] Figure 3 This is a schematic diagram of the multi-size automatic positioning device in this invention;

[0020] Figure 4This is a schematic diagram of the horizontal and vertical positioning device structure in this invention;

[0021] Figure 5 This is a schematic diagram of the structure of the storage slot in this invention;

[0022] Figure 6 This is a schematic diagram of the anti-clogging cleaning device in this invention;

[0023] Figure 7 This is a schematic diagram of the filter structure in this invention.

[0024] In the diagram: 1. Mold base; 2. Adsorption motor; 3. Vacuum hole adsorption panel; 4. Multi-size automatic positioning device; 41. Active motor; 42. Active roller; 43. Toothed belt; 44. Passive roller; 45. Longitudinal bidirectional reciprocating lead screw; 46. Transverse bidirectional reciprocating lead screw; 47. Meshing gear; 48. Transverse and longitudinal positioning device; 481. Limiting slide one; 482. Base plate; 483. Connecting seat; 484. Clamping block one; 485. Limiting slide two; 486. Moving plate; 487. Clamping block two; 5. Automatic hole closing device; 51. Slide rod; 52. Connecting plate; 53. Connecting rod; 54. Hole baffle; 55. Hole stop bar; 6. Anti-clogging cleaning device; 61. Filter screen; 62. Shaft; 63. Sealing plate; 64. Cleaning brush plate; 65. Driving plate; 7. Storage slot. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] See also Figures 1-7 As shown, the technical solution provided by this invention is as follows:

[0027] An adsorption mold for bonding semiconductor refrigeration chips includes a mold base 1, an adsorption motor 2 fixedly connected to the inside of the mold base 1 by bolts, a fan being snapped onto the output shaft of the adsorption motor 2, and a vacuum hole adsorption panel 3 fixedly connected to the top of the mold base 1. The adsorption function is achieved by starting the adsorption motor 2 and driving the fan. The adsorption airflow acts on the bottom of the semiconductor refrigeration chip on the vacuum hole adsorption panel 3 through the vacuum chamber, achieving the effect of vacuum adsorption on the bottom of the semiconductor refrigeration chip; a multi-size automatic positioning device 4; an automatic hole closing device 5; and an anti-clogging cleaning device 6.

[0028] In this embodiment, the multi-size automatic positioning device 4 includes an active motor 41, a longitudinal bidirectional reciprocating lead screw 45, a transverse bidirectional reciprocating lead screw 46, and a longitudinal and transverse positioning device 48. The longitudinal bidirectional reciprocating lead screw 45 and the transverse bidirectional reciprocating lead screw 46 are identical. The reciprocating lead screw is an existing structure, generally used in conjunction with a slider for movement. The rotation of the lead screw drives the reciprocating movement of the slider. Here, the bidirectional reciprocating lead screw is actually a rod with reciprocating grooves at both ends. The surface of the active motor 41 is fixedly connected to the interior of the mold base 1 by bolts. The output shaft of the active motor 41 is engaged with an active roller 42. The surface of the active roller 42 is connected to a passive roller 44 via a toothed belt 43. Figure 2-4 and Figure 7 As shown, the toothed belt 43 is provided with two sets of teeth, which are staggered. The transmission of the toothed belt 43 is affected by the rotation of two moving rollers. During the transmission, the two sets of teeth are used to drive the gears on the longitudinal bidirectional reciprocating screw 45 and the transverse bidirectional reciprocating screw 46 to rotate in sequence. The surfaces of the longitudinal bidirectional reciprocating screw 45 and the transverse bidirectional reciprocating screw 46 are fixedly connected with meshing gears 47. The two meshing gears 47 are used to be driven by the toothed belt 43 during the transmission, thereby achieving the purpose of driving the longitudinal bidirectional reciprocating screw 45 and the transverse bidirectional reciprocating screw 46 to rotate in sequence.

[0029] Furthermore, the end of the active roller 42 is rotatably connected to the interior of the mold base 1, the interior of the passive roller 44 is rotatably connected to the surface of the longitudinal bidirectional reciprocating screw 45, and the ends of both the longitudinal bidirectional reciprocating screw 45 and the transverse bidirectional reciprocating screw 46 are rotatably connected to the interior of the mold base 1.

[0030] Furthermore, the longitudinal and transverse positioning device 48 includes a first limiting slide 481 and a second limiting slide 485. The surfaces of the longitudinal bidirectional reciprocating lead screw 45 and the transverse bidirectional reciprocating lead screw 46 are slidably connected to the interiors of the first limiting slide 481 and the second limiting slide 485, respectively. As shown in the figure, there are two limiting slides symmetrically distributed on the reciprocating lead screw. The rotation of the lead screw drives the two limiting slides to move relative to each other. A base plate 482 is fixedly connected to the top of the first limiting slide 481. A connecting seat 483 is fixedly connected to the top. A clamping block 484 is elastically connected to the surface of the connecting seat 483 via a spring. The elastically connected clamping block 484 can be driven and clamped by the connecting seat 483 while automatically moving to avoid the problem of the limiting slide 481 moving and causing the clamping block to move and hardly damage the semiconductor cooling chip. At the same time, it can achieve the effect of aligning and clamping both sides of semiconductor cooling chips of different sizes. A moving plate 486 is elastically connected to the surface of the limiting slide 485 via a spring.

[0031] It is worth noting that the surfaces of limit slide 1 481 and limit slide 2 485 are slidably connected to the interior of mold base 1. The sliding groove inside the base limits the two limit slides, allowing them to move only in a straight line. The interior of each slide is provided with a slider corresponding to the screw groove on the reciprocating screw, which is used to reciprocate under the restriction of the screw groove. The surfaces of base plate 482, connecting seat 483 and moving plate 486 are slidably connected to the inner wall of mold base 1. The surface of moving plate 486 is fixedly connected to clamping block 2 487 by a long rod. There are also two clamping blocks 2 487, which are used to align and clamp the other two sides of the semiconductor cooling chip, thereby achieving the purpose of aligning and clamping the semiconductor cooling chip on all four sides.

[0032] It is worth noting that the automatic hole-closing device 5 includes a slide rod 51 and hole-stopping strips 55. The number of hole-stopping strips 55 corresponds to the horizontal number of vacuum holes on the vacuum hole adsorption panel 3. Each hole-stopping strip 55 is connected to the moving plate 486 by a spring, enabling each hole-stopping strip 55 to move independently. When some hole-stopping strips 55 are affected by the hole baffle 54, they can elastically move, while the remaining unobstructed hole-stopping strips 55 can move and cover the corresponding vacuum holes under the influence of the moving plate 486. One end of the slide rod 51 is fixedly connected to the surface of the clamping block 484, and the other end of the slide rod 51 is fixedly connected to the connecting plate 52. A connecting rod 53 is fixedly connected to the surface of the connecting plate 52, and a hole baffle 54 is fixedly connected to the end of the connecting rod 53. The hole baffle 54 is affected by the connecting plate 52 and the sliding rod 51 on the connecting rod 53, and moves in the same direction as the clamping block 484. During the movement, the hole baffle 54 covers the vacuum hole at the corresponding position, thereby achieving the effect of sealing the holes on both sides of the semiconductor cooling chip that do not contact the plate. At the same time, since the clamping block can be adjusted in position according to semiconductor cooling chips of different sizes, the hole baffle 54 can also be adjusted in position according to semiconductor cooling chips of different sizes, thereby further achieving the effect of sealing the vacuum holes on both sides of the semiconductor cooling chip that do not contact the plate.

[0033] Furthermore, the surface of the slide rod 51 is slidably connected to the interior of the connecting seat 483, the surface of the connecting rod 53 is slidably connected to the interior of the base plate 482, the surface of the hole baffle 54 is slidably connected to the inner wall of the mold base 1, and the interior of the hole baffle 55 is elastically connected to the surface of the moving plate 486 via a spring. The surface of the hole baffle 55 is also slidably connected to the interior of the mold base 1, further achieving the effect of sealing the holes on the remaining two sides of the semiconductor cooling chip that do not contact the outer plate. At the same time, since the clamping block can be adjusted in position according to semiconductor cooling chips of different sizes, the hole baffle 55 can also be adjusted in position according to semiconductor cooling chips of different sizes, further achieving the effect of sealing the vacuum holes on the two sides of the semiconductor cooling chip that do not contact the outer plate.

[0034] In addition, the mold base 1 has a storage groove 7 inside, which is used to collect the impurities that are blocked on the filter screen. The anti-clogging cleaning device 6 includes a filter screen 61, a shaft 62 and a sealing plate 63. One end of the shaft 62 is fixedly connected to the surface of the base plate 482. The filter screen 61 is used to filter the adsorbed gas. The other end of the shaft 62 is fixedly connected to a cleaning brush plate 64. The surface of the shaft 62 is fixedly connected to a drive plate 65. Figure 4 , 5 The anti-clogging cleaning device 6 in sections 7 and 8 are both in the state after cleaning. During the adsorption bonding period, the cleaning brush 64 is located at the other end of the filter screen 61, and the sealing plate 63 is located directly above the storage tank 7 and is used to seal it. It is mainly used to seal the impurities in the tank to avoid the adsorption force affecting the impurity storage. The surface of the filter screen 61 is fixedly connected to the inside of the mold base 1, the surface of the shaft 62 is slidably connected to the inside of the hole baffle 54, and the surface of the sealing plate 63 is elastically connected to the inside of the mold base 1 through a spring.

[0035] In use, the adsorption mold for bonding semiconductor refrigeration chips of the present invention places the semiconductor refrigeration chip on the vacuum hole adsorption panel 3. A bonding assembly is provided on the mold base 1 for bonding the adsorbed and fixed semiconductor refrigeration chip. Before adsorption positioning, the active motor 41 is started. The output shaft of the active motor 41 drives the passive roller 44, which is connected to it by a toothed belt 43, to rotate synchronously via the active roller 42. The toothed belt 43 performs corresponding transmission work, sequentially driving the meshing gears 47 on the longitudinal bidirectional reciprocating screw 45 and the transverse bidirectional reciprocating screw 46 to rotate, thereby achieving the purpose of sequentially driving the longitudinal bidirectional reciprocating screw 45 and the transverse bidirectional reciprocating screw 46 to rotate. When the longitudinal bidirectional reciprocating screw 45 rotates, it drives the sliding connection on it, which is linearly limited. The two limiting slide blocks 481 move relative to each other. When the limiting slide blocks 481 are relatively close, they drive the clamping blocks 484 elastically connected to the connecting seat 483 to move through the base plate 482. During the relative close movement of the two clamping blocks 484, they clamp the thermoelectric cooler on both sides of the adsorption panel. During the clamping, they contact both sides of the thermoelectric cooler and generate auxiliary movement alignment to achieve automatic alignment and clamping. When the thermoelectric cooler is located in the longitudinal center area, it is difficult for the two clamping blocks to continue to move relative to each other. At this time, the clamping blocks will make way through the elastic force to avoid the problem of the limiting slide blocks 481 moving and causing the clamping blocks to move and hardly damage the thermoelectric cooler. At the same time, it has the effect of aligning and clamping both sides of thermoelectric coolers of different sizes. The vacated clamping block 484 moves accordingly via the connecting plate 52 at the end of the slide rod 51, which drives the hole baffle 54 on the connecting rod 53 to move accordingly. The hole baffle 54 is restricted to keep its position consistent with that of the clamping block 484. During the movement of the clamping block 484, the hole baffle 54 moves and seals the hole on the vacuum hole adsorption panel 3, thereby sealing the holes on both sides of the semiconductor cooling chip that do not contact the outer plate. At the same time, since the clamping block can be adjusted in position according to semiconductor cooling chips of different sizes, the hole baffle 54 can also be adjusted in position according to semiconductor cooling chips of different sizes, further achieving the effect of sealing the vacuum holes on both sides of the semiconductor cooling chip that do not contact the outer plate. After the longitudinal bidirectional reciprocating lead screw 45 rotates, the transverse bidirectional reciprocating lead screw 46 rotates. The lead screw drives the two limiting slide blocks 485 at that location to move relative to each other. The limiting slide blocks drive the clamping blocks 487 fixed on the long rod on the moving plate 486 to move relative to each other through springs. During the relative movement of the two clamping blocks, the other two sides of the thermoelectric cooler are automatically aligned and clamped. At the same time, when the thermoelectric cooler is located in the center area of ​​the transverse direction, the two clamping blocks can hardly continue to move relative to each other. At this time, the clamping blocks will make way through the elastic force to avoid the problem of the limiting slide blocks 485 moving and causing the clamping blocks to move and hardly damage the thermoelectric cooler. At the same time, it can achieve the effect of aligning and clamping the remaining two sides of thermoelectric coolers of different sizes.The hole-stop strips 55 move with the movement of the moving plate 486 under the influence of the spring. During the movement, some of the hole-stop strips 55 can elastically yield when affected by the hole baffle 54, while the remaining unobstructed hole-stop strips 55 can move and cover the corresponding vacuum holes under the influence of the moving plate 486, further achieving the effect of sealing the remaining holes on both sides of the thermoelectric cooler that are not in contact with the plate. At the same time, because the clamping block can be adjusted in position according to thermoelectric coolers of different sizes, the hole-stop strips 55 can also be adjusted in position according to thermoelectric coolers of different sizes, further achieving the effect of sealing the remaining vacuum holes on both sides of the thermoelectric cooler that are not in contact with the plate. Overall, it achieves the effect of aligning and positioning thermoelectric coolers of different sizes on all four sides, elastically clamping and sealing excess vacuum holes, avoiding the problem of errors caused by manual positioning. At the same time, combined with adsorption positioning, it has a double fixing effect, improving the stability of positioning thermoelectric coolers of different sizes, and further avoiding the problem of unstable adsorption of thermoelectric coolers due to the use of excess vacuum holes.

[0036] After the multi-size automatic positioning device 4 and the automatic hole-closing device 5 align, position, elastically clamp, and seal excess vacuum holes on all four sides of the thermoelectric cooler, the adsorption motor 2 is activated to drive the fan to achieve the adsorption function. The adsorption airflow acts on the bottom of the thermoelectric cooler on the vacuum hole adsorption panel 3 through the vacuum chamber, achieving the effect of vacuum adsorption on the bottom of the thermoelectric cooler, which facilitates the bonding work of the thermoelectric cooler after adsorption and positioning. After the bonding work is completed, the toothed belt 43 on the active roller 42 is controlled by the active motor 41 to drive the passive roller 44. During the transmission of the toothed belt 43, the gears on the longitudinal bidirectional reciprocating screw 45 and the transverse bidirectional reciprocating screw 46 are meshed again in sequence, and the two screws continue to rotate. During the rotation, the two limit slides on them are driven to move and reset in sequence. After the movement, the clamping block loses its clamping of the thermoelectric cooler, and the hole baffle 54 and the hole stop bar 55 move and reset. The excess vacuum holes lose their sealing effect and are on the bottom plate. During the repositioning process of 482, the base plate 482 moves via the cleaning brush 64 on the shaft 62. During the movement of the brush, impurities on the filter screen 61 are cleaned. During the movement, the shaft 62 moves the sealing plate 63 via the driving plate 65 to make way and expose the collection groove 7. During the movement, the brush sweeps the impurities on the filter screen into the collection groove 7 for collection, achieving the effect of automatically cleaning the impurities on the filter screen 61. At the same time, the cleaned impurities are collected. When the multi-size automatic positioning device 4 performs clamping work again, the moving base plate 482 moves the cleaning brush 64 and the driving plate 65 to the other side of the filter screen via the shaft 62. After the sealing plate 63 is no longer restricted by the driving plate 65, it is spring-loaded back to the collection groove 7. The sealing plate 63 is located directly above the collection groove 7 and is sealed. It is mainly used to seal the impurities in the groove to avoid the adsorption force affecting the collection of impurities. While automatically cleaning impurities on filter screen 61, the system also seals the cleaned impurities to further prevent filter screen 61 from clogging and to avoid the adsorption force affecting the collection of impurities, thus avoiding problems such as reduced suction power due to filter screen clogging.

[0037] The above embodiments are only used to illustrate the embodiments of the present invention, and are not intended to limit the embodiments of the present invention. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of the present invention. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of the present invention, and the patent protection scope of the embodiments of the present invention should be defined by the claims.

Claims

1. An adsorption mold for bonding semiconductor refrigeration chips, characterized in that: Includes a mold base (1), an adsorption motor (2) connected inside the mold base (1), a fan connected to the adsorption motor (2), and a vacuum hole adsorption panel (3), a multi-size automatic positioning device (4), an automatic hole closing device (5), and an anti-clogging cleaning device (6) on the mold base (1). The multi-size automatic positioning device (4) includes an active motor (41), a longitudinal bidirectional reciprocating lead screw (45), a transverse bidirectional reciprocating lead screw (46), and a transverse and longitudinal positioning device (48). The surface of the active motor (41) is connected to the interior of the mold base (1). The output shaft of the active motor (41) is connected to an active roller (42). The surface of the active roller (42) is connected to a passive roller (44) via a toothed belt (43). The surfaces of the longitudinal bidirectional reciprocating lead screw (45) and the transverse bidirectional reciprocating lead screw (46) are both connected to meshing gears (47). The end of the active roller (42) is connected to the inside of the mold base (1), the inside of the passive roller (44) is connected to the surface of the longitudinal bidirectional reciprocating screw (45), and the ends of the longitudinal bidirectional reciprocating screw (45) and the transverse bidirectional reciprocating screw (46) are both connected to the inside of the mold base (1). The horizontal and vertical positioning device (48) includes a limiting slide block one (481) and a limiting slide block two (485). The interiors of the limiting slide block one (481) and the limiting slide block two (485) are respectively connected to the surfaces of the longitudinal bidirectional reciprocating screw (45) and the transverse bidirectional reciprocating screw (46). The top of the limiting slide block one (481) is connected to a base plate (482). The top of the base plate (482) is connected to a connecting seat (483). The surface of the connecting seat (483) is elastically connected to a clamping block one (484) by a spring. The surface of the limiting slide block two (485) is elastically connected to a moving plate (486) by a spring. The surfaces of the limiting slide one (481) and the limiting slide two (485) are respectively connected to the interior of the mold base (1), the surfaces of the base plate (482), the connecting seat (483) and the moving plate (486) are respectively connected to the inner wall of the mold base (1), and the surface of the moving plate (486) is fixedly connected to the clamping block two (487) by a long rod. The automatic hole-closing device (5) includes a slide rod (51) and a hole stop bar (55). One end of the slide rod (51) is connected to the surface of the clamping block (484), and the other end of the slide rod (51) is connected to a connecting plate (52). A connecting rod (53) is connected to the surface of the connecting plate (52), and a hole stop bar (54) is connected to the end of the connecting rod (53). The surface of the slide bar (51) is connected to the interior of the connecting seat (483), the surface of the connecting rod (53) is connected to the interior of the base plate (482), the surface of the hole baffle (54) is connected to the inner wall of the mold base (1), and the interior of the hole baffle (55) is elastically connected to the surface of the moving plate (486) by a spring, and the surface of the hole baffle (55) is connected to the interior of the mold base (1). The mold base (1) has a storage groove (7) inside. The anti-clogging cleaning device (6) includes a filter screen (61), a shaft (62) and a sealing plate (63). One end of the shaft (62) is connected to the surface of the base plate (482), and the other end of the shaft (62) is connected to a cleaning brush plate (64). The surface of the shaft (62) is connected to a drive plate (65). The surface of the filter screen (61) is connected to the interior of the mold base (1), the surface of the shaft (62) is connected to the interior of the hole baffle (54), and the surface of the sealing plate (63) is elastically connected to the interior of the mold base (1) by a spring. In use, the semiconductor cooling chip is placed on the vacuum hole adsorption panel (3). A bonding assembly is provided on the mold base (1) for bonding the adsorbed and fixed semiconductor cooling chip. Before adsorption positioning, the active motor (41) is started. The output shaft of the active motor (41) drives the passive roller (44) connected by the toothed belt (43) to rotate synchronously through the active roller (42). The toothed belt (43) performs corresponding transmission work. During the transmission, it sequentially drives the longitudinal bidirectional reciprocating screw (45) and the transverse bidirectional reciprocating screw (46). The gear (47) meshing with the reciprocating screw (46) rotates, thereby sequentially driving the longitudinal bidirectional reciprocating screw (45) and the transverse bidirectional reciprocating screw (46) to rotate. When the longitudinal bidirectional reciprocating screw (45) rotates, it drives the two slidingly connected and linearly limited limit slides (481) on it to move relative to each other. When the limit slides (481) are relatively close, they drive the elastically connected clamping blocks (484) on the connecting seat (483) to move through the base plate (482). The two clamping blocks (484) move in... During the relatively close movement, the thermoelectric cooler on the adsorption panel is clamped on both sides. During the clamping, the thermoelectric cooler is contacted on both sides and auxiliary movement alignment is generated to achieve automatic alignment and clamping. When the thermoelectric cooler is located in the longitudinal center area, the two clamping blocks can hardly achieve continued relative movement. At this time, the clamping blocks will make way through the elastic force to avoid the problem of hard clamping of the thermoelectric cooler caused by the moving limit slide block (481) driving the clamping blocks to move. At the same time, it achieves the effect of aligning and clamping the thermoelectric cooler on both sides of different sizes. The clamping block (484) that makes way drives the hole baffle (54) on the connecting rod (53) to move accordingly through the connecting plate (52) at the end of the slide rod (51). The hole baffle (54) is restricted to keep the position consistent with the clamping block (484). During the movement of the clamping block (484), the hole baffle (54) achieves the effect of moving and sealing the hole on the vacuum hole adsorption panel (3), achieving the effect of sealing the hole on both sides of the thermoelectric cooler that does not contact the plate.

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