Wafer automatic detection and sorting device and control system

Abstract

The application discloses a wafer automatic detection and sorting device and a control system, which comprises a conveying assembly, a detection mounting rack, a controller and a detection assembly, wherein the conveying assembly is arranged on the top of an external rack; the detection mounting rack is arranged on the middle end surface of the conveying assembly; the controller is arranged on the upper end surface of the detection mounting rack and is electrically connected with an external power supply; the detection assembly comprises a detection mounting seat, a wafer flatness measuring module, a wafer thickness measuring module, a wafer surface film thickness measuring module, a wafer surface film type identifying module and a wafer inscription code reading module, and the detection mounting seat is arranged on the lower end surface of the detection mounting rack. Therefore, the device integrates multiple detection functions, and the detection efficiency is effectively improved without back-and-forth detection. The repeated and useless structure of the existing device is removed, the production cost is greatly reduced, and the device also has a sorting function, so that manual sorting is not needed, the work efficiency is further improved, and the labor intensity of the operator is reduced.

Description

Technical Field

[0001] This invention relates to the technical field of wafer regeneration, and in particular to an automatic wafer inspection and sorting device and control system. Background Technology

[0002] Wafers can be divided into positive wafers, control wafers, and die-holding wafers according to their application scenarios in chip factories. Positive wafers are directly used for semiconductor chip processing, while control wafers and die-holding wafers are mainly used for daily machine monitoring and testing.

[0003] The sources of the wafers are mainly new wafers and recycled wafers. Wafer recycling is the process of recycling used wafers or control wafers and removing various films and surface particle residues generated on the surface of the wafers and control wafers due to testing through chemical soaking, physical grinding and other treatment methods, so that they can regain the function of testing and stabilizing the stability of the equipment.

[0004] Wafer regeneration processes mainly involve wet and dry film removal processes and chemical mechanical polishing (CMP). For wafers, the detection of the type, thickness, and internal properties of the incoming film is paramount, as these factors determine the wafer regeneration process route and the film removal method and processing time. Therefore, the detection of these factors is crucial in wafer regeneration. However, existing detection equipment has the following problems: First, existing equipment offers relatively limited detection types, leading to a large number of equipment purchases. Multiple sets of single-type detection devices are expensive, occupy significant space when distributed, and require frequent movement between them to complete various tests. This method is inefficient, and the repeated transport of wafers can damage them. Second, existing detection equipment lacks wafer sorting capabilities. In practice, sorting is done manually based on the test results, resulting in low efficiency and high labor intensity. Summary of the Invention

[0005] The present invention aims to at least partially solve one of the technical problems in the related art.

[0006] Therefore, the purpose of this invention is to provide an automatic wafer inspection and sorting device and control system. This device integrates multiple inspection functions, eliminating the need for repeated inspections and effectively improving inspection efficiency. By eliminating redundant and useless structures in existing devices, production costs are greatly reduced. At the same time, this device also has a sorting function, eliminating the need for manual sorting, further improving work efficiency and reducing the labor intensity of operators.

[0007] To achieve the above objectives, this invention proposes an automatic wafer inspection and sorting device, comprising a conveying assembly, an inspection mounting frame, a controller, and an inspection component. The conveying assembly is disposed on the top of an external rack; the inspection mounting frame is disposed on the middle surface of the conveying assembly; the controller is disposed on the upper surface of the inspection mounting frame and electrically connected to an external power supply. The inspection component includes an inspection mounting base, a wafer flatness measurement module, a wafer thickness measurement module, a wafer surface film thickness measurement module, a wafer surface film type identification module, and a wafer marking code reading module. The inspection mounting base is disposed on the lower surface of the inspection mounting frame. The wafer flatness measurement module, wafer thickness measurement module, wafer surface film thickness measurement module, wafer surface film type identification module, and wafer marking code reading module are sequentially arranged from left to right along the X-axis at the bottom of the inspection mounting base. The controller is electrically connected to the conveying assembly, the wafer flatness measurement module, the wafer thickness measurement module, the wafer surface film thickness measurement module, the wafer surface film type identification module, and the wafer marking code reading module, respectively.

[0008] The present invention discloses an automatic wafer inspection and sorting device. This device integrates multiple inspection functions, eliminating the need for repeated inspections and effectively improving inspection efficiency. By eliminating redundant and useless structures in existing devices, production costs are greatly reduced. At the same time, this device also has a sorting function, eliminating the need for manual sorting, further improving work efficiency and reducing the labor intensity of operators.

[0009] In addition, the automated wafer inspection and sorting device proposed in the above application may also have the following additional technical features:

[0010] Specifically, the conveying assembly includes an H-shaped mounting bracket, a conveyor belt mechanism, a wafer mounting base, and a planar pick-and-place mechanism. The H-shaped mounting bracket is bolted to the top of the external frame; the conveyor belt mechanism is located on the top of the H-shaped mounting bracket; the wafer mounting bases are evenly distributed on the surface of the conveyor belt mechanism; and the planar pick-and-place mechanism is symmetrically distributed on the surface of the H-shaped mounting bracket and located outside the detection mounting bracket.

[0011] Specifically, the H-shaped mounting bracket includes a left vertical bracket, a middle horizontal bracket, and a right vertical bracket, wherein the left vertical bracket, the middle horizontal bracket, and the right vertical bracket are arranged sequentially from left to right along the X-axis and are fixedly connected; the conveyor belt mechanism includes a first conveyor belt, a second conveyor belt, a third conveyor belt, a fourth conveyor belt, and a fifth conveyor belt, wherein the first conveyor belt, the second conveyor belt, and the third conveyor belt are arranged sequentially from front to back along the Y-axis on the top of the left vertical bracket; the fourth conveyor belt is arranged on the top of the middle horizontal bracket along the X-axis; and the fifth conveyor belt is arranged on the top of the right vertical bracket along the Y-axis; each of the first, second, third, fourth, and fifth conveyor belts has a built-in first drive motor and is electrically connected to the controller; the wafer mounting bases are evenly arranged on the surfaces of the fourth and fifth conveyor belts; the planar pick-and-place mechanism includes a fixed base, a U-shaped limiting groove, a swing arm, a synchronous shaft, a horizontal slide, a vertical lifting guide rod, and a negative pressure suction head. The mounting bracket is bolted to the surface of the horizontal frame and located outside the detection mounting bracket; the U-shaped limiting groove is formed on the surface of the mounting bracket; the swing arm is rotatably connected to the surface of the mounting bracket and located inside the U-shaped limiting groove; the synchronous shaft is fixedly connected to the inner wall of the end of the swing arm away from the surface of the mounting bracket, one end of the synchronous shaft extends through the outside of one end of the swing arm and is slidably connected to the inner wall of the U-shaped limiting groove; the horizontal slide is horizontally slidably connected to the surface of the mounting bracket and located outside the swing arm; the vertical lifting guide rod is vertically slidably connected to the inner wall of the horizontal slide, the other end of the synchronous shaft extends through the outside of one end of the swing arm and is rotatably connected to the surface of the vertical lifting guide rod; the negative pressure suction head is threaded to the bottom of the vertical lifting guide rod and connected to one end of the external air supply pipe; a second drive motor is provided inside the mounting bracket, the output end of the second drive motor is fixedly connected to one end of the central shaft of the swing arm, an electromagnetic valve is provided on the external air supply pipe, and the second drive motor and the electromagnetic valve are electrically connected to the controller.

[0012] Specifically, the conveying assembly further includes a positioning module, which includes multiple sets of infrared transmitting and receiving bases and multiple sets of infrared reflecting bases. The multiple sets of infrared reflecting bases are respectively disposed on one end surface of the multiple sets of wafer mounting bases. The multiple sets of infrared transmitting and receiving bases are respectively disposed on the bottom of the detection mounting base and the surfaces of the two sets of fixing bases, and correspond to the positions of the infrared reflecting bases. The multiple sets of infrared transmitting and receiving bases are respectively electrically connected to the controller.

[0013] Specifically, the conveying assembly further includes a second negative pressure annular suction seat. The surfaces of the multiple sets of wafer mounting seats are respectively provided with positioning slots to facilitate the placement of wafers. The positioning slots are adapted to the outer dimensions of the wafers. The second negative pressure annular suction seat is fixedly connected to the inner wall of the positioning slots. The second negative pressure annular suction seat is connected to one end of an external gas supply pipe. The surface of the external gas supply pipe is provided with a solenoid valve and is electrically connected to the controller.

[0014] Specifically, the conveying assembly further includes a flipping module, which comprises a support, a gear, and two sets of toothed rods. The support is evenly distributed on the surface of the fourth conveyor belt. The wafer mounting base, corresponding to the position of the fourth conveyor belt, is disposed on the top of the support and rotatably connected to the inner wall of one end of the support. One end of the central shaft of the wafer mounting base disposed on the top of the support extends out of the support and is fixedly connected to the gear. The two sets of toothed rods are bolted to the top of the intermediate horizontal frame and located outside the wafer engraving code reading module. The top of one end of each of the two sets of toothed rods is provided with teeth, which correspond to the position of the gear. The gear meshes with the teeth on the surface of the teeth. The angle range that the teeth on the surface of the toothed rods can drive the wafer mounting base to flip after meshing with the gear is between 0° and 180°.

[0015] A control system for an automated wafer sorting and inspection device includes the following steps:

[0016] S1: The controller controls the first drive motors of the first conveyor belt, the second conveyor belt, the third conveyor belt, the fourth conveyor belt and the fifth conveyor belt to be powered on and run respectively. The first conveyor belt and the third conveyor belt are in a normally open conveying state, and the second conveyor belt, the fourth conveyor belt and the fifth conveyor belt are in an intermittent conveying state.

[0017] S2: The fifth conveyor belt transports the wafer to be tested from back to front along the Y-axis. When the positioning module on the right-side planar pick-and-place mechanism detects the second set of wafer mounting seats on the fifth conveyor belt, the first set of wafer mounting seats on the fifth conveyor belt is now aligned with the first set of wafer mounting seats on the fourth conveyor belt. The positioning module sends the detected data to the controller, which then synchronously controls the fourth and fifth conveyor belts to stop. Next, the controller powers on the right-side planar pick-and-place mechanism, which then moves the wafer to be tested from the first set of wafer mounting seats on the fifth conveyor belt to the first set of wafer mounting seats on the fourth conveyor belt, thus achieving wafer position transfer.

[0018] S3: After the transfer is completed, the controller controls the right-side planar pick-and-place mechanism to reset. Then, the controller controls the fourth and fifth conveyor belts to continue running. The fourth conveyor belt continues to run synchronously along the X-axis, moving the wafer to be tested to the left. During the movement, the controller controls the wafer flatness measurement module, the wafer thickness measurement module, the wafer surface film thickness measurement module, the wafer surface film type identification module, and the wafer marking code reading module to power on. The wafer marking code reading module is powered on to read the marking codes on the back of the wafer. The wafer surface film type identification module is powered on to use optical and electrical methods to analyze the thin film on the wafer surface. The wafer surface film thickness measurement module, when powered on, uses optical interference to measure the film thickness by observing changes in refractive index. The wafer thickness measurement module, when powered on, measures the center thickness of the wafer placed in the positioning slot using electrostatic capacitance. The wafer flatness measurement module, when powered on, measures the flatness of the wafer surface using electrostatic capacitance. These devices enable the reading of wafer markings, identification of surface film types, measurement of surface film thickness, wafer thickness, and wafer flatness. All data obtained from these tests are sent to the controller, which analyzes the test data results and determines whether the current wafer quality is acceptable after the analysis.

[0019] S4: As the fourth conveyor belt continues to operate, the inspected wafers are moved to the left side of the wafer flatness measurement module and detected by the positioning module located on the left-side planar pick-and-place mechanism. The positioning module sends data information to the controller. After receiving the data, the controller synchronously controls the second, fourth, and fifth conveyor belts to stop operating. Then, the controller controls the left-side planar pick-and-place mechanism to operate and transport the first group of inspected wafers onto the second conveyor belt. After the transport is completed, the controller controls the left-side planar pick-and-place mechanism to reset. After the left-side planar pick-and-place mechanism resets, the controller controls the second, fourth, and fifth conveyor belts to continue operating. The operating direction of the second conveyor belt is related to the current wafer quality judgment result. When the quality is qualified, the second conveyor belt transports the wafers towards the first conveyor belt. When the quality is unqualified, the second conveyor belt transports the wafers towards the third conveyor belt, thus realizing the sorting operation.

[0020] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0022] Figure 1 This is a schematic diagram of the structure of an automatic wafer inspection and sorting device and control system according to the present invention;

[0023] Figure 2 This is a schematic diagram of the detection component structure in an automatic wafer inspection and sorting device and control system of the present invention;

[0024] Figure 3 This is a schematic diagram of the conveying component structure in an automatic wafer inspection and sorting device and control system of the present invention;

[0025] Figure 4 This is a schematic diagram of the planar pick-and-place mechanism in the automatic wafer inspection and sorting device and control system of the present invention.

[0026] Figure 5 This is a schematic diagram of the second negative pressure annular suction seat structure in an automatic wafer inspection and sorting device and control system of the present invention;

[0027] Figure 6 This is a schematic diagram of the flipping module structure in an automatic wafer inspection and sorting device and control system of the present invention.

[0028] As shown in the figure:

[0029] 1. Conveying assembly; 2. Inspection mounting bracket; 3. Controller; 4. Inspection assembly; 41. Inspection mounting base; 42. Wafer flatness measurement module; 43. Wafer thickness measurement module; 44. Wafer surface film thickness measurement module; 45. Wafer surface film type identification module; 46. Wafer marking code reading module;

[0030] 11. H-type mounting bracket; 12. Conveyor belt mechanism; 13. Wafer mounting base; 14. Planar pick-and-place mechanism;

[0031] 111. Left vertical frame; 112. Middle horizontal frame; 113. Right vertical frame; 121. First conveyor belt; 122. Second conveyor belt; 123. Third conveyor belt; 124. Fourth conveyor belt; 125. Fifth conveyor belt;

[0032] 141. Fixed base; 142. U-shaped limiting groove; 143. Swing arm; 144. Synchronous shaft; 145. Horizontal slide; 146. Vertical lifting guide rod; 147. Negative pressure suction head;

[0033] 15. Positioning module; 151. Infrared transmitter and receiver base; 152. Infrared reflector base;

[0034] 6. Second negative pressure annular suction seat; 131. Positioning through groove;

[0035] 7. Flip module; 71. Support; 72. Gear; 73. Tooth rod frame; 731. Tooth part. Detailed Implementation

[0036] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention. Rather, embodiments of the invention include all variations, modifications, and equivalents falling within the spirit and scope of the appended claims.

[0037] The following description, in conjunction with the accompanying drawings, describes an embodiment of the present invention of an automatic wafer inspection and sorting device and control system.

[0038] like Figures 1-6 As shown, an automatic wafer inspection and sorting device according to an embodiment of the present invention includes a conveying assembly 1, an inspection mounting frame 2, a controller 3, and an inspection assembly 4. The conveying assembly 1 is disposed on the top of an external rack; the inspection mounting frame 2 is disposed on the middle surface of the conveying assembly 1; the controller 3 is disposed on the upper surface of the inspection mounting frame 2 and is electrically connected to an external power supply; the inspection assembly 4 includes an inspection mounting base 41, a wafer flatness measurement module 42, a wafer thickness measurement module 43, a wafer surface film thickness measurement module 44, a wafer surface film type identification module 45, and a wafer marking code reading module 46. The detection mounting base 41 is located on the lower surface of the detection mounting frame 2; the wafer flatness measurement module 42, wafer thickness measurement module 43, wafer surface film thickness measurement module 44, wafer surface film type identification module 45, and wafer engraving code reading module 46 are arranged sequentially from left to right along the X-axis at the bottom of the detection mounting base 41; the controller 3 is electrically connected to the conveying assembly 1, the wafer flatness measurement module 42, the wafer thickness measurement module 43, the wafer surface film thickness measurement module 44, the wafer surface film type identification module 45, and the wafer engraving code reading module 46 respectively.

[0039] It should be noted that the controller 3, wafer flatness measurement module 42, wafer thickness measurement module 43, wafer surface film thickness measurement module 44, wafer surface film type identification module 45 and wafer engraving code reading module 46 described in this embodiment are all existing technologies, and therefore will not be described in detail here.

[0040] Specifically, the conveying component 1 is responsible for conveying the wafers. During the wafer conveying process, the detection component 4 reads the engraving code, identifies the type of surface film, measures the surface film thickness, measures the wafer thickness, and measures the wafer flatness. All the data obtained from the above detections are sent to the controller 3, which analyzes the detection data results and determines whether the quality of the wafer being inspected is qualified after the analysis. If the quality is qualified, the conveying component 1 conveys the qualified wafers to the next process. If the quality is unqualified, the conveying component 1 conveys the unqualified wafers to another conveyor belt for recycling.

[0041] Furthermore, such as Figure 3 As shown, the conveying assembly 1 includes an H-shaped mounting bracket 11, a conveyor belt mechanism 12, a wafer mounting base 13, and a planar pick-and-place mechanism 14. The H-shaped mounting bracket 11 is bolted to the top of the outer frame; the conveyor belt mechanism 12 is located on the top of the H-shaped mounting bracket 11; the wafer mounting bases 13 are evenly distributed on the surface of the conveyor belt mechanism 12; and the planar pick-and-place mechanism 14 is symmetrically distributed on the surface of the H-shaped mounting bracket 11 and located outside the detection mounting bracket 2.

[0042] Specifically, the structure and connection relationship of the conveying component 1 will be further explained.

[0043] Furthermore, such as Figure 3As shown, the H-shaped mounting frame 11 includes a left vertical frame 111, a middle horizontal frame 112, and a right vertical frame 113. The left vertical frame 111, middle horizontal frame 112, and right vertical frame 113 are arranged sequentially from left to right along the X-axis and are fixedly connected. The conveyor belt mechanism 12 includes a first conveyor belt 121, a second conveyor belt 122, a third conveyor belt 123, a fourth conveyor belt 124, and a fifth conveyor belt 125. The first conveyor belt 121, second conveyor belt 122, and third conveyor belt 123 are arranged sequentially from front to back on top of the left vertical frame 111 along the Y-axis. The fourth conveyor belt 124... The conveyor belt 124 is positioned at the top of the horizontal frame 112 along the X-axis; the fifth conveyor belt 125 is positioned at the top of the right vertical frame 113 along the Y-axis; the first conveyor belt 121, the second conveyor belt 122, the third conveyor belt 123, the fourth conveyor belt 124, and the fifth conveyor belt 125 each have a built-in first drive motor, which is electrically connected to the controller 3; the wafer mounting bases 13 are evenly distributed on the surfaces of the fourth conveyor belt 124 and the fifth conveyor belt 125; the planar pick-and-place mechanism 14 includes a fixed base 141, a U-shaped limiting groove 142, a swing arm 143, a synchronous shaft 144, and a horizontal slide 14. 5. Vertical lifting guide rod 146 and negative pressure suction head 147, wherein the fixed base 141 is bolted to the surface of the horizontal frame 112 and is located outside the detection mounting frame 2; the U-shaped limiting groove 142 is formed on the surface of the fixed base 141; the swing arm 143 is rotatably connected to the surface of the fixed base 141 and is located inside the U-shaped limiting groove 142; the synchronous shaft 144 is fixedly connected to the inner wall of the end of the swing arm 143 away from the surface of the fixed base 141, one end of the synchronous shaft 144 extends through the outside of one end of the swing arm 143 and is slidably connected to the inner wall of the U-shaped limiting groove 142; the horizontal slide 145 is horizontally slidably connected to the fixed base. The surface of the fixed base 141 is located outside the swing arm 143; the vertical lifting guide rod 146 is vertically slidably connected to the inner wall of the horizontal slide 145, and the other end of the synchronous shaft rod 144 passes through the outside of one end of the swing arm 143 and is rotatably connected to the surface of the vertical lifting guide rod 146; the negative pressure suction head 147 is threadedly connected to the bottom of the vertical lifting guide rod 146 and is connected to one end of the external air supply pipe; a second drive motor is provided inside the fixed base 141, and the output end of the second drive motor is fixedly connected to one end of the central shaft of the swing arm 143; a solenoid valve is provided on the external air supply pipe, and the second drive motor and the solenoid valve are electrically connected to the controller 3 respectively.

[0044] Specifically, the structure and connection relationship of the H-type mounting bracket 11, the conveyor belt mechanism 12, the wafer mounting base 13 and the planar pick-and-place mechanism 14 will be further explained.

[0045] The principle of the planar pick-and-place mechanism 14 is as follows: When the controller 3 powers on the second drive motor, the second drive motor synchronously drives the swing arm 143 to rotate. The rotation of the swing arm 143 synchronously drives the synchronous shaft 144 to move along the inner wall of the U-shaped limiting groove 142. The movement of the synchronous shaft 144 synchronously drives the horizontal slide 145 to move horizontally and synchronously drives the vertical lifting guide rod 146 to move vertically. When the synchronous shaft 144 moves to the end of the U-shaped limiting groove 142 near the end of the fifth conveyor belt 125, the negative pressure suction head 147 contacts the wafer on the fifth conveyor belt 125 and adsorbs the wafer. Then, the controller 3 controls the second drive motor to reverse. The reverse rotation of the second drive motor synchronously links the negative pressure suction head 147 to move the wafer to the wafer mounting seat 13 on the fourth conveyor belt 124, thereby realizing wafer handling.

[0046] Furthermore, such as Figure 2 and Figure 5 As shown, the conveying assembly 1 also includes a positioning module 15, which includes multiple sets of infrared transmitting and receiving bases 151 and multiple sets of infrared reflecting bases 152. The multiple sets of infrared reflecting bases 152 are respectively disposed on one end surface of multiple sets of wafer mounting bases 13. The multiple sets of infrared transmitting and receiving bases 151 are respectively disposed on the bottom of the detection mounting base 41 and the surfaces of the two sets of fixing bases 141, and correspond to the positions of the infrared reflecting bases 152. The multiple sets of infrared transmitting and receiving bases 151 are electrically connected to the controller 3.

[0047] Specifically, the structure and connection relationship of the positioning module 15 will be further explained. The positioning module 15 is set up to facilitate transportation, handling and detection positioning, with high accuracy and good performance.

[0048] Furthermore, such as Figure 5 As shown, the conveying assembly 1 also includes a second negative pressure annular suction seat 6. Multiple sets of wafer mounting seats 13 are respectively provided with positioning slots 131 to facilitate the placement of wafers. The positioning slots 131 are adapted to the outer dimensions of the wafers. The second negative pressure annular suction seat 6 is fixedly connected to the inner wall of the positioning slots 131. The second negative pressure annular suction seat 6 is connected to one end of an external gas supply pipe. The surface of the external gas supply pipe is provided with a solenoid valve and is electrically connected to the controller 3.

[0049] Specifically, the second negative pressure annular suction seat 6 is designed to facilitate the adsorption and fixation of the wafer when the wafer mounting seat 13 is flipped, so as to stabilize its position and structure and improve the detection accuracy.

[0050] Furthermore, such as Figure 6As shown, the conveying assembly 1 also includes a flipping module 7, which includes a support 71, a gear 72, and two sets of toothed rods 73. The support 71 is evenly distributed on the surface of the fourth conveyor belt 124. The wafer mounting base 13, corresponding to the position of the fourth conveyor belt 124, is disposed on the top of the support 71 and is rotatably connected to the inner wall of one end of the support 71. One end of the central shaft of the wafer mounting base 13 disposed on the top of the support 71 extends out of the support 71 and is fixedly connected to the gear 72. The two sets of toothed rods 73 are respectively bolted to the top of the horizontal frame 112 and located outside the wafer engraving code reading module 46. The top of one end of each of the two sets of toothed rods 73 is provided with a toothed part 731, which corresponds to the position of the gear 72. The gear 72 meshes with the teeth on the surface of the toothed part 731. The angle range that the wafer mounting base 13 can be flipped by the teeth on the surface of the toothed rod 73 after meshing with the gear 72 is between 0° and 180°.

[0051] Specifically, the structure and connection relationship of the flip module 7 are further explained. The flip module 7 is set up to flip the wafer before the wafer marking code reading module 46 reads the marking code, so that it can read the marking code on the back of the wafer. After reading, it automatically flips the wafer again to reset it and make it face up, which is convenient for subsequent testing. The effect is good.

[0052] When gear 72 contacts and meshes with the teeth on the toothed portion 731 of the first set of toothed rods 73, it will simultaneously drive the wafer mounting base 13 and the wafer to rotate 180° so that its back side faces upward. When gear 72 contacts and meshes with the teeth on the toothed portion 731 of the second set of toothed rods 73, it will simultaneously drive the wafer mounting base 13 and the wafer to rotate back 180° so that it resets and its front side faces upward, which is convenient for subsequent testing and has a better effect.

[0053] A control system for an automated wafer sorting and inspection device includes the following steps:

[0054] S1: The controller 3 controls the first drive motors of the first conveyor belt 121, the second conveyor belt 122, the third conveyor belt 123, the fourth conveyor belt 124 and the fifth conveyor belt 125 to be energized and run. The first conveyor belt 121 and the third conveyor belt 123 are in a normally open conveying state, while the second conveyor belt 122, the fourth conveyor belt 124 and the fifth conveyor belt 125 are in an intermittent conveying state.

[0055] S2: The fifth conveyor belt 125 transports the wafer to be tested from back to front along the Y-axis. When the positioning module 15 on the right-side planar pick-and-place mechanism 14 detects the second set of wafer mounting seats 13 located on the fifth conveyor belt 125, the first set of wafer mounting seats 13 on the fifth conveyor belt 125 is now aligned with the first set of wafer mounting seats 13 on the fourth conveyor belt 124. The positioning module 15 sends the detected data to the controller 3, which then synchronously controls the fourth conveyor belt 124 and the fifth conveyor belt 125 to stop running. Then, the controller 3 controls the right-side planar pick-and-place mechanism 14 to be powered on and run. The right-side planar pick-and-place mechanism 14 is powered on and runs to move the wafer to be tested in the first set of wafer mounting seats 13 on the fifth conveyor belt 125 into the first set of wafer mounting seats 13 on the fourth conveyor belt 124, thus realizing the wafer position transfer.

[0056] S3: After the transfer is completed, controller 3 controls the right-side planar pick-and-place mechanism 14 to reset. Then, controller 3 controls the fourth conveyor belt 124 and the fifth conveyor belt 125 to continue running. The fourth conveyor belt 124 continues to run synchronously along the X-axis, moving the wafer to be tested to the left. During the movement, controller 3 controls the wafer flatness measurement module 42, wafer thickness measurement module 43, wafer surface film thickness measurement module 44, wafer surface film type identification module 45, and wafer marking code reading module 46 to be powered on. The wafer marking code reading module 46 is powered on to read the marking codes on the back of the wafer. The wafer surface film type identification module 45 is powered on to use optical and electrical methods to analyze the thin film on the wafer surface. The wafer surface film thickness measurement module 44 is powered on and operates, using optical interference to measure the film thickness by observing changes in refractive index. The wafer thickness measurement module 43 is powered on and operates, using electrostatic capacitance to measure the thickness of the wafer center placed in the positioning slot 131. The wafer flatness measurement module 42 is powered on and operates, using electrostatic capacitance to measure the flatness of the wafer surface thickness. Through the above devices, the wafer marking code reading, surface film type identification, surface film thickness measurement, wafer thickness measurement, and wafer flatness measurement are realized. All the data obtained from the above tests are sent to the controller 3, which analyzes the test data results and determines whether the quality of the current tested wafer is qualified after the analysis.

[0057] S4: As the fourth conveyor belt 124 continues to run, the inspected wafers are moved to the left side of the wafer flatness measurement module 42 and detected by the positioning module 15 set on the left-side planar pick-and-place mechanism 14. The positioning module 15 sends data information to the controller 3. After receiving the data, the controller 3 synchronously controls the second conveyor belt 122, the fourth conveyor belt 124 and the fifth conveyor belt 125 to stop running. Then, the controller 3 controls the left-side planar pick-and-place mechanism 14 to run and transport the first group of inspected wafers onto the second conveyor belt 122. After the transport is completed, the controller 3 controls the left-side planar pick-and-place mechanism 14 to reset. After the left-side planar pick-and-place mechanism 14 is reset, the controller 3 controls the second conveyor belt 122, the fourth conveyor belt 124 and the fifth conveyor belt 125 to continue running. The running direction of the second conveyor belt 122 is related to the current wafer quality judgment result. When the quality is qualified, the second conveyor belt 122 transports the wafers to the first conveyor belt 121. When the quality is unqualified, the second conveyor belt 122 transports the wafers to the third conveyor belt 123, thus realizing the sorting operation.

[0058] In summary, the wafer automatic inspection and sorting device and control system of this invention integrate multiple inspection functions, eliminating the need for repeated inspections and effectively improving inspection efficiency. By eliminating redundant and useless structures in existing devices, production costs are greatly reduced. At the same time, this device also has a sorting function, eliminating the need for manual sorting, further improving work efficiency and reducing the labor intensity of operators.

[0059] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0060] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0061] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An automatic wafer inspection and sorting device, characterized in that, It includes a conveying assembly (1), a detection mounting bracket (2), a controller (3), and a detection assembly (4), wherein, The conveying assembly (1) is mounted on top of the external frame; The detection mounting bracket (2) is disposed on the middle surface of the conveying assembly (1); The controller (3) is disposed on the upper surface of the detection mounting bracket (2) and is electrically connected to an external power source; The detection component (4) includes a detection mounting base (41), a wafer flatness measurement module (42), a wafer thickness measurement module (43), a wafer surface film thickness measurement module (44), a wafer surface film type identification module (45), and a wafer marking code reading module (46), wherein, The detection mounting base (41) is disposed on the lower surface of the detection mounting frame (2); The wafer flatness measurement module (42), the wafer thickness measurement module (43), the wafer surface film thickness measurement module (44), the wafer surface film type identification module (45), and the wafer engraving code reading module (46) are sequentially arranged at the bottom of the detection mounting base (41) from left to right along the X-axis. The controller (3) is electrically connected to the conveying assembly (1), the wafer flatness measurement module (42), the wafer thickness measurement module (43), the wafer surface film thickness measurement module (44), the wafer surface film type identification module (45), and the wafer engraving code reading module (46), respectively. The conveying assembly (1) includes an H-type mounting bracket (11), a conveyor belt mechanism (12), a wafer mounting base (13), and a planar pick-and-place mechanism (14), wherein, The H-type mounting bracket (11) is bolted to the top of the external frame; The conveyor belt mechanism (12) is located on top of the H-shaped mounting frame (11); The wafer mounting base (13) is uniformly disposed on the surface of the conveyor belt mechanism (12); The planar pick-and-place mechanism (14) is symmetrically arranged on the surface of the H-shaped mounting bracket (11) and located outside the detection mounting bracket (2); The H-type mounting bracket (11) includes a left vertical bracket (111), a middle horizontal bracket (112), and a right vertical bracket (113), wherein, The left vertical frame (111), the middle horizontal frame (112), and the right vertical frame (113) are arranged sequentially from left to right along the X-axis and are fixedly connected. The conveyor belt mechanism (12) includes a first conveyor belt (121), a second conveyor belt (122), a third conveyor belt (123), a fourth conveyor belt (124), and a fifth conveyor belt (125), wherein, The first conveyor belt (121), the second conveyor belt (122), and the third conveyor belt (123) are arranged sequentially from front to back along the Y-axis on the top of the left vertical frame (111); The fourth conveyor belt (124) is arranged on top of the middle horizontal frame (112) along the X-axis direction; The fifth conveyor belt (125) is arranged on top of the right vertical frame (113) along the Y-axis direction; The first conveyor belt (121), the second conveyor belt (122), the third conveyor belt (123), the fourth conveyor belt (124) and the fifth conveyor belt (125) are all equipped with a first drive motor and are electrically connected to the controller (3) respectively; The wafer mounting base (13) is uniformly disposed on the surface of the fourth conveyor belt (124) and the surface of the fifth conveyor belt (125); The conveying assembly (1) also includes a second negative pressure annular suction seat (6). The surfaces of the multiple sets of wafer mounting seats (13) are respectively provided with positioning slots (131) to facilitate the placement of wafers. The positioning slots (131) are adapted to the outer dimensions of the wafers. The second negative pressure annular suction seat (6) is fixedly connected to the inner wall of the positioning slots (131). The second negative pressure annular suction seat (6) is connected to one end of the external gas supply pipe. The surface of the external gas supply pipe is provided with an electromagnetic valve and is electrically connected to the controller (3).

2. The automatic wafer inspection and sorting device according to claim 1, characterized in that, The planar pick-and-place mechanism (14) includes a fixed base (141), a U-shaped limiting groove (142), a swing arm (143), a synchronous shaft (144), a horizontal slide (145), a vertical lifting guide rod (146), and a negative pressure suction head (147), wherein, The fixing seat (141) is bolted to the surface of the middle horizontal frame (112) and is located outside the detection mounting frame (2); The U-shaped limiting groove (142) is formed on the surface of the fixed base (141); The swing arm (143) is rotatably connected to the surface of the fixed base (141) and located inside the U-shaped limiting groove (142); The synchronous shaft (144) is fixedly connected to the inner wall of one end of the swing arm (143) away from the surface of the fixed seat (141). One end of the synchronous shaft (144) extends through the outside of one end of the swing arm (143) and is slidably connected to the inner wall of the U-shaped limiting groove (142). The horizontal slide (145) is horizontally slidably connected to the surface of the fixed seat (141) and located outside the swing arm (143); The vertical lifting guide rod (146) is vertically slidably connected to the inner wall of the horizontal slide block (145), and the other end of the synchronous shaft rod (144) passes through the outside of one end of the swing arm (143) and is rotatably connected to the surface of the vertical lifting guide rod (146). The negative pressure suction head (147) is threaded to the bottom of the vertical lifting guide rod (146) and connected to one end of the external air supply pipe; The fixed base (141) is equipped with a second drive motor. The output end of the second drive motor is fixedly connected to one end of the central shaft of the swing arm (143). An electromagnetic valve is installed on the external air supply pipe. The second drive motor and the electromagnetic valve are electrically connected to the controller (3) respectively.

3. The automatic wafer inspection and sorting device according to claim 2, characterized in that, The conveying assembly (1) further includes a positioning module (15), which includes multiple sets of infrared transmitting and receiving bases (151) and multiple sets of infrared reflector bases (152), wherein, Multiple sets of infrared reflector mounts (152) are respectively disposed on one end surface of multiple sets of wafer mounting mounts (13); Multiple sets of infrared transmitter and receiver bases (151) are respectively disposed at the bottom of the detection mounting base (41) and on the surfaces of the two sets of fixed bases (141), and correspond to the positions of the infrared reflector base (152); The multiple sets of infrared transmitter and receiver bases (151) are electrically connected to the controller (3).

4. The automatic wafer inspection and sorting device according to claim 3, characterized in that, The conveying assembly (1) further includes a tilting module (7), which includes a support (71), a gear (72), and two sets of toothed rods (73). The supports (71) are evenly distributed on the surface of the fourth conveyor belt (124); The wafer mounting base (13) corresponding to the position of the fourth conveyor belt (124) is disposed on the top of the support (71) and is rotatably connected to the inner wall of one end of the support (71); One end of the central shaft of the wafer mounting base (13) located on the top of the support (71) extends out of the outside of the support (71) and is fixedly connected to the gear (72). Two sets of toothed rod frames (73) are bolted to the top of the middle horizontal frame (112) and located outside the wafer engraving code reading module (46); The two sets of toothed rods (73) are respectively provided with toothed parts (731) at one end of the top, and are corresponding to the position of the gear (72). The gear (72) is engaged with the teeth on the surface of the toothed parts (731). The angle at which the wafer mounting base (13) can be rotated after the teeth on the surface of the toothed rod (73) mesh with the gear (72) is between 0° and 180°.

5. The control system of the automatic wafer inspection and sorting device according to any one of claims 1-4, characterized in that, Includes the following steps: S1: The controller (3) controls the first drive motors of the first conveyor belt (121), the second conveyor belt (122), the third conveyor belt (123), the fourth conveyor belt (124) and the fifth conveyor belt (125) to be powered on and run respectively. The first conveyor belt (121) and the third conveyor belt (123) are in a normally open conveying state, while the second conveyor belt (122), the fourth conveyor belt (124) and the fifth conveyor belt (125) are in an intermittent conveying state. S2: The fifth conveyor belt (125) transports the wafer to be tested from back to front along the Y-axis. When the positioning module (15) on the right-side planar pick-and-place mechanism (14) detects the second set of wafer mounting seats (13) located on the fifth conveyor belt (125), the first set of wafer mounting seats (13) on the fifth conveyor belt (125) is now aligned with the first set of wafer mounting seats (13) on the fourth conveyor belt (124). The positioning module (15) sends the detected data to the... The controller (3) synchronously controls the fourth conveyor belt (124) and the fifth conveyor belt (125) to stop running. Then, the controller (3) controls the right-side planar pick-and-place mechanism (14) to be powered on and run. The right-side planar pick-and-place mechanism (14) is powered on and runs to transport the wafer to be tested in the first set of wafer mounting bases (13) on the fifth conveyor belt (125) to the inside of the first set of wafer mounting bases (13) on the fourth conveyor belt (124), thereby realizing the wafer position transfer. S3: After the transfer is completed, the controller (3) controls the right-side planar pick-and-place mechanism (14) to reset. Then, the controller (3) controls the fourth conveyor belt (124) and the fifth conveyor belt (125) to continue running. The fourth conveyor belt (124) continues to run synchronously along the X-axis direction, driving the wafer to be tested to move to the left. During the movement, the controller (3) controls the wafer flatness measurement module (42), the wafer thickness measurement module (43), the wafer surface film thickness measurement module (44), the wafer surface film type identification module (45), and the wafer marking code reading module (46) to be powered on and run. The wafer marking code reading module (46) is powered on and runs to read the marking code on the back of the wafer. The wafer surface film type identification module (45) is powered on and runs to use optical... The wafer surface thin film is identified by electrical methods. The wafer surface film thickness measurement module (44) is powered on and uses optical interference to measure the thickness of the film by measuring the change of refractive index. The wafer thickness measurement module (43) is powered on and uses electrostatic capacitance to measure the thickness of the wafer center placed in the positioning slot (131). The wafer flatness measurement module (42) is powered on and uses electrostatic capacitance to measure the flatness of the wafer surface thickness. The above devices realize the reading of wafer marking codes, identification of surface film type, measurement of surface film thickness, measurement of wafer thickness and measurement of wafer flatness. The data obtained from the above detection are sent to the controller (3). The controller (3) analyzes the detection data results and judges whether the current detection wafer quality is qualified after the analysis. S4: As the fourth conveyor belt (124) continues to run, the inspected wafers are moved to the left side of the wafer flatness measurement module (42) and detected by the positioning module (15) located on the left-side planar pick-and-place mechanism (14). The positioning module (15) sends data information to the controller (3). After receiving the data, the controller (3) synchronously controls the second conveyor belt (122), the fourth conveyor belt (124), and the fifth conveyor belt (125) to stop running. Then, the controller (3) controls the left-side planar pick-and-place mechanism (14) to run and transports the first group of inspected wafers onto the second conveyor belt (122). After the transport is completed, the controller (3) controls the left-side planar pick-and-place mechanism (14) to reset. After the left-side planar pick-and-place mechanism (14) is reset, the controller (3) controls the second conveyor belt (122), the fourth conveyor belt (124) and the fifth conveyor belt (125) to continue running. The running direction of the second conveyor belt (122) is related to the current wafer quality judgment result. When the quality is qualified, the second conveyor belt (122) transports the wafer to the first conveyor belt (121). When the quality is unqualified, the second conveyor belt (122) transports the wafer to the third conveyor belt (123) to realize the sorting operation.

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