Substrate and manufacturing method thereof, housing and manufacturing method thereof, and electronic device

Abstract

The present application discloses a substrate and a manufacturing method thereof, a housing and a manufacturing method thereof, and an electronic device, belonging to the technical field of electronic devices. The substrate includes a glass substrate, the glass substrate includes a first surface, the first surface is protruding with a plurality of protrusion structures, the size of the plurality of protrusion structures protruding from the first surface is less than or equal to 100 μm, the protrusion structure includes at least one of a first protrusion and a second protrusion, the first protrusion is formed by microcrystalline glass particles, and the second protrusion is formed by ceramic particles. The housing is applied with the above-mentioned substrate, and the electronic device is applied with the above-mentioned housing. The substrate provided in the present application has better scratch resistance.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a substrate and a manufacturing method thereof, a housing and a manufacturing method thereof, and an electronic device. Background Art

[0002] With the development of technology, electronic devices are used more and more widely and have become important tools in people's daily life and work. Glass materials are often used to manufacture electronic device shells because of their good processability and applicability to a variety of surface processing techniques. However, the surface of shells made of glass materials is prone to scratches, that is, the anti-scratch performance of glass shells in related technologies is poor. Summary of the invention

[0003] The present application provides a substrate and a manufacturing method thereof, a housing and a manufacturing method thereof, and an electronic device. The substrate can improve the anti-scratch performance of the substrate by providing a protruding structure on a first surface.

[0004] The technical solution is as follows:

[0005] In a first aspect, the present application provides a substrate, comprising: a glass substrate, the glass substrate comprising a first surface, the first surface being protruded with a plurality of protrusion structures, the plurality of protrusion structures protruding from the first surface having a size less than or equal to 100 μm, the protrusion structure comprising at least one of a first protrusion and a second protrusion, the first protrusion being formed by microcrystalline particles, and the second protrusion being formed by ceramic particles.

[0006] In the substrate provided in the present application, since a protruding structure is formed on the first surface of the glass substrate, the protruding structure is formed by microcrystalline particles or ceramic particles, so that the protruding structure has a greater hardness and better anti-scratch performance, that is, the first surface of the glass substrate has better anti-scratch performance.

[0007] In some implementations, a dimension of at least a portion of the protruding structures protruding from the first surface is greater than 5 μm.

[0008] In some implementations, at least a portion of the protruding structures protrudes from the first surface by a size of 20 μm to 50 μm.

[0009] In some implementations, the glass substrate includes a second surface, the second surface is disposed opposite to the first surface, and a plurality of protruding structures are protruded from the second surface.

[0010] In some implementations, the protrusion structure on the second surface is a first protrusion.

[0011] In a second aspect, a method for manufacturing a substrate is provided, which is suitable for manufacturing a substrate provided by any of the above technical solutions, and the method comprises:

[0012] Prepare a first powder material, wherein the first powder material is glass particles;

[0013] preparing a second powder material, wherein the second powder material comprises at least one of microcrystalline glass particles and ceramic particles;

[0014] Prepare an embryo body by using the first powder and the second powder;

[0015] The green body is sintered to form a substrate, and a portion of the second powder protrudes from the first surface of the substrate to form a protruding structure.

[0016] In the manufacturing method of the substrate provided in the present application, since a protruding structure is formed on the first surface of the substrate, the protruding structure is formed by a second powder material, and the second powder material is at least one of microcrystalline glass particles and ceramic particles. Therefore, the protruding structure is microcrystalline particles or ceramic particles formed by crystallization of microcrystalline glass particles, which have higher hardness and better scratch resistance, thereby making the first surface of the substrate have better scratch resistance.

[0017] In some implementations, the process of preparing an embryo body includes:

[0018] A mixed material body is prepared, the mixed material body includes a first powder and a second powder, the mass fraction of the first powder in the mixed material body is 20wt% to 80wt%, and the second powder includes one of microcrystalline glass particles and ceramic particles, the mass fraction of the second powder in the mixed material body is 20wt% to 80wt%.

[0019] In some implementations, the process of preparing an embryo body includes:

[0020] A mixture body is prepared, the mixture body comprising a first powder and a second powder, the mass fraction of the first powder in the mixture body is 20wt% to 80wt%, the second powder comprises microcrystalline glass particles and ceramic particles, the mass fraction of the microcrystalline glass particles in the mixture body is less than 80wt%, and the mass fraction of the ceramic particles in the mixture body is less than 60wt%.

[0021] In some implementations, the mixture body further includes a binder, and the mass fraction of the binder in the mixture body is less than 30 wt %.

[0022] In some implementations, the glass particles have a particle size less than or equal to 5 μm.

[0023] In some implementations, the glass particles include SiO2, Al2O3, B2O3, alkali metal oxides, and alkaline earth metal oxides, wherein 5wt%≤alkali metal oxides≤20wt%; 55wt%≤B2O3+SiO2+Al2O3≤75wt%, and 5wt%≤alkaline earth metal oxides≤15wt%.

[0024] In some implementations, the glass particles further include a first auxiliary raw material, the first auxiliary raw material is ≤5 wt %; the first auxiliary raw material may include: at least one of a colorant, a clarifier, a flux, an oxidant, and a reducing agent.

[0025] In some implementations, the glass particles have a glass transition temperature of 450°C to 700°C.

[0026] In some implementations, when the second powder includes microcrystalline glass particles, the crystal phase of the microcrystalline glass particles is one or more of cordierite, spinel, olivine, diopside, petalite, spodumene, eucryptite, lithium silicate and quartz solid solution.

[0027] In some implementations, when the second powder includes microcrystalline glass particles, the microcrystalline glass particles include SiO2, Al2O3, B2O3 and alkaline earth metal oxides, wherein 55wt%≤B2O3+SiO2+Al2O3≤80wt%; 10wt%≤alkaline earth metal oxides≤20wt%.

[0028] In some implementations, the glass-ceramic particles further include ZnO, wherein ZnO≤15 wt %.

[0029] In some implementations, the microcrystalline glass particles further include alkali metal oxides, and the proportion of the alkali metal oxides in the microcrystalline glass particles is less than or equal to 15 wt %.

[0030] In some embodiments, the microcrystalline glass particles also include a nucleating agent and a first auxiliary raw material, the nucleating agent accounts for less than or equal to 10wt% of the microcrystalline glass particles, the first auxiliary raw material accounts for less than or equal to 5wt% of the microcrystalline glass particles, and the first auxiliary raw material includes at least one of a colorant, a clarifier, a flux, an oxidant, and a reducing agent.

[0031] In some implementations, when the second powder includes glass-ceramics particles, the particle size of the glass-ceramics particles is 5 μm to 100 μm.

[0032] In some implementations, when the second powder includes microcrystalline glass particles, the preparation of the second powder includes a crystallization process. During the crystallization process, the microcrystalline glass particles precipitate microcrystalline particles. The microcrystalline particles include first grains and second grains. The average particle size of the first grains is 1nm to 80nm, and the average particle size of the second grains is 10μm to 20μm.

[0033] In some implementations, when the second powder includes ceramic particles, the particle size of the ceramic particles is 10 μm to 150 μm.

[0034] In some implementations, when the second powder includes ceramic particles, a main crystalline phase of the ceramic particles is at least one of aluminum oxide, zirconium oxide, cordierite, spinel, silicon carbide, silicon nitride, and aluminum nitride.

[0035] In some implementations, when the second powder includes ceramic particles, the melting temperature of the ceramic particles is at least 500° C. higher than the melting temperature of the glass particles.

[0036] In some implementations, when the second powder includes ceramic particles, the melting temperature of the ceramic particles is greater than or equal to 1400°C.

[0037] In some implementations, when the second powder includes ceramic particles, the ceramic particles have a Mohs hardness greater than or equal to 7.5.

[0038] In some implementations, when the second powder includes ceramic particles, preparing the second powder further includes: performing wettability treatment on the ceramic particles.

[0039] In a third aspect, a method for manufacturing a shell is provided, including the method for manufacturing a substrate provided by any of the above technical solutions.

[0040] Through the above technical solution, since the manufacturing method of the shell includes the manufacturing method of the substrate, it at least has all the beneficial effects of the manufacturing method of the substrate, which will not be repeated here.

[0041] In some implementations, the method further includes post-processing the substrate, wherein the post-processing includes at least one of CNC cold engraving, hot bending, polishing, chemical strengthening, laser engraving, surface etching, and surface coating.

[0042] In a fourth aspect, a shell is provided, comprising a substrate provided by any of the above technical solutions.

[0043] Through the above technical solution, since the shell includes the above substrate, it at least has all the beneficial effects of the substrate, which will not be repeated here.

[0044] In a fifth aspect, an electronic device is provided, comprising a housing provided by the above technical solution.

[0045] Through the above technical solution, since the electronic device includes the above shell, it at least has all the beneficial effects of the shell, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 is a schematic diagram of the structure of the substrate provided in an embodiment of the present application;

[0047] Figure 2 yes Figure 1 The enlarged view of point B in the middle;

[0048] Figure 3 yes Figure 1 Sectional view at AA in the middle;

[0049] Figure 4 A substrate provided in an embodiment of the present application is Figure 3 Enlarged view of point C in the middle;

[0050] Figure 5 Another substrate provided in the embodiment of the present application is Figure 3 Enlarged view of point C in the middle;

[0051] Figure 6 It is a schematic flow chart of a method for manufacturing a substrate provided in an embodiment of the present application;

[0052] Figure 7 is a schematic diagram of the morphological changes of glass particles and microcrystalline glass particles during the manufacturing process of the substrate provided by the embodiment of the present application;

[0053] Figure 8 is a schematic diagram of the morphological changes of glass particles and ceramic particles during the manufacturing process of the substrate provided by the embodiment of the present application;

[0054] Fig. 9 is a partial view of a cross section of a substrate provided in an embodiment of the present application under a microscope;

[0055] Fig.10 is a schematic flow chart of a method for manufacturing a housing provided in an embodiment of the present application;

[0056] Fig.11 It is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0057] The meanings of the figures are as follows:

[0058] 100, glass substrate; 110, first surface; 120, second surface;

[0059] 200, raised structure;

[0060] 310, glass particles; 320, microcrystalline glass particles; 330, ceramic particles;

[0061] 400, electronic device; 411, battery cover; 412, middle frame; 420, battery; 430, display screen. DETAILED DESCRIPTION

[0062] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0063] It should be understood that the "multiple" mentioned in this application refers to two or more. In the description of this application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in order to facilitate the clear description of the technical solution of this application, the words "first" and "second" are used to distinguish between the same items or similar items with basically the same functions and effects. Those skilled in the art can understand that the words "first" and "second" do not limit the quantity and execution order, and the words "first" and "second" do not limit them to be different.

[0064] It should be understood that the "microcrystalline glass particles" and "microcrystalline particles" mentioned in this application are not the same structure. "Microcrystalline glass particles" are powdered raw materials used to prepare microcrystalline glass, which are a combination of glass phase and microcrystalline particles. Different from "microcrystalline glass particles", "microcrystalline particles" refer to the crystal grains precipitated after the crystallization of "microcrystalline glass particles".

[0065] The substrate, the manufacturing method of the substrate, the housing and the electronic device provided in the embodiments of the present application are explained in detail below. In each embodiment of the present application, electrical connection refers to the connection between two electrical devices through a conductor so that electrical signals can be transmitted between the two electrical devices. In each of the drawings of the present application, the leads with arrows all point to the surface of the device, and the leads with dots all point to the device itself.

[0066] In conventional technology, the shell of an electronic device is made of glass material, and a frosted layer is processed on the surface of some shells, for example, a convex structure is formed by etching on the surface of the glass material. However, the convex points on the surface of this shell are made of glass material, and when scratched by external objects, the convex point structure formed by the glass material is easily ground flat, leaving scratches on the surface of the shell. In some shell preparation processes, the surface of the shell is hardened, but the cost of this hardening treatment is high, and it is impossible to prepare a frosted shell.

[0067] As can be seen from the above, the anti-scratch performance of the frosted housing of the electronic device in the related art is poor.

[0068] In view of this, the embodiments of the present application provide a substrate, a housing, and an electronic device, and provide a method for manufacturing the substrate, which are used to solve the problems that trouble those skilled in the art to a certain extent. The substrate, housing, and electronic device provided in the embodiments of the present application, as well as a method for manufacturing a substrate provided are explained in detail below.

[0069] Figure 1is a top view of a substrate provided in an embodiment of the present application, Figure 2 for Figure 1 Enlarged view of the middle substrate at A, Figure, Figure 3 for Figure 1 A cross-sectional view of the middle substrate at AA; Figure 4 for Figure 3 The enlarged view of the substrate at C in the middle. The substrate includes a glass substrate 100, the glass substrate 100 includes a first surface 110, and the first surface 110 is protruded with a plurality of protruding structures 200, the size of the plurality of protruding structures 200 protruding from the first surface 110 is less than or equal to 100 μm, and the protruding structure 200 includes at least one of a first protrusion and a second protrusion, the first protrusion is formed by microcrystalline particles, the microcrystalline particles can be formed by crystallization of microcrystalline glass particles, and the second protrusion is formed by ceramic particles. Since the size of the protruding structure 200 protruding from the first surface 110 is less than or equal to 100 μm, there is no obvious foreign body sensation when touching the first surface 110 by hand, and it is usually difficult to clearly distinguish each protruding structure 200 by naked eyes, so that there will be no obvious impact on the aesthetics of the first surface 110.

[0070] In one possible embodiment, the protrusion structure 200 includes a first protrusion, that is, only the first protrusion formed by microcrystalline particles may be disposed on the first surface 110 of the glass substrate 100. In another possible embodiment, the protrusion structure 200 includes a second protrusion, that is, only the second protrusion formed by ceramic particles may be disposed on the first surface 110 of the glass substrate 100. In yet another possible embodiment, the protrusion structure 200 includes a first protrusion and a second protrusion, that is, both the first protrusion formed by microcrystalline particles and the second protrusion formed by ceramic particles are disposed protrudingly on the first surface 110 of the glass substrate 100.

[0071] Since the first surface 110 of the substrate provided in this embodiment is provided with a micron-sized protrusion structure 200, the micron-sized protrusion structure 200 makes the first surface 110 of the shell present a frosted feel. The protrusion structure 200 is formed of microcrystalline particles and / or ceramic particles, and the hardness of the microcrystalline particles and the ceramic particles is greater than the hardness of the glass substrate 100. Therefore, during use, if the first surface 110 of the substrate encounters scratches by foreign objects, the protrusion structure 200 first contacts the foreign objects. Since the hardness of the protrusion structure 200 is relatively large, the degree of scratching or wear is lower, and the setting of the protrusion structure 200 can prevent foreign objects from directly scratching the glass substrate 100 to a certain extent, thereby improving the scratch resistance of the first surface 110 of the substrate.

[0072] In the substrate provided in this embodiment, since the protruding structure 200 is formed on the first surface 110 of the glass substrate 100, and the protruding structure 200 is formed of microcrystalline particles or ceramic particles, the protruding structure 200 has a greater hardness and better anti-scratch performance, that is, the first surface 110 of the glass substrate 100 has a better anti-scratch performance.

[0073] The substrate provided in this embodiment can be used for the housing of an electronic device, that is, the substrate can be processed to form the housing of the electronic device, or the substrate can be processed to form a part of the housing of the electronic device, for example, as a battery cover in the housing of the electronic device, the battery cover is also called a back cover. The substrate can also be used as a decorative layer (or surface layer) of the housing of the electronic device. In addition, the substrate can also be applied to other structures, such as biomedical equipment, tableware and kitchen utensils, daily decorations, etc.

[0074] In some implementations, at least some of the protruding structures 200 protrude from the first surface 110 by a size of 5 μm or more. That is, among the plurality of protruding structures 200, all or at least some of the protruding structures 200 protrude from the first surface 110 by a size of 5 μm or more, and within this size range, the protection performance for the first surface 110 is better. That is to say, when the substrate is applied to the shell, and the shell is applied to daily necessities (such as furniture, household appliances, and electronic devices), during daily use, the protruding structures 200 protruding from the first surface 110 by a size of 20 μm or more can protect against most wear and tear, such as unintentional scratches by the user's hands, and when the first surface 110 is placed on a desktop, a bracket, etc., it is scratched by the desktop, the bracket, etc.

[0075] In some implementations, at least a portion of the protrusion structure 200 protrudes from the first surface 110 by a size of 20 μm to 50 μm.

[0076] In some implementations, such as Figure 5 As shown, in the enlarged view of other substrates provided in this embodiment at C, the glass substrate 100 includes a second surface 120, which is arranged opposite to the first surface 110, and the second surface 120 is protrudingly provided with a plurality of protrusion structures 200. In this arrangement, the surfaces of the opposite sides of the glass substrate 100 are both frosted and have better anti-scratch performance. This glass substrate 100 can be used in a housing whose two sides are in contact with external objects.

[0077] The protrusion structure 200 formed on the second surface 120 of the glass substrate 100 may be a first protrusion or a second protrusion, or the protrusion structure 200 formed on the second surface 120 may include both first protrusions and second protrusions, which may be specifically controlled by the selection of raw materials and the specific manufacturing process during the manufacturing process of the substrate.

[0078] In some implementations, the protruding structures 200 on the second surface 120 are all first protrusions. The first protrusions are formed by microcrystalline glass particles. During the manufacturing process, glass particles are sintered with microcrystalline glass particles, and the glass particles are liquefied into a glass phase. The glass phase wraps the microcrystalline glass particles. The microcrystalline glass particles further crystallize into microcrystalline particles and then grow and protrude from the first surface to form the first protrusion. Etching can also be used to adjust the size of the first protrusion protruding from the surface. This manufacturing method manufactures a substrate with a frosted feel on both sides, that is, the method of making the first surface 110 and the second surface 120 of the substrate have first protrusions is simpler, easy to operate and implement, and the production cost is relatively lower.

[0079] The substrate provided in this embodiment includes at least one of microcrystalline particles and ceramic particles, and glass particles together form a glass substrate. The substrate provided in this embodiment can be subjected to post-processing processes such as chemical strengthening and hot bending, so as to better adapt to the various different usage scenarios of the housing of electronic devices. The surface of the substrate provided in this embodiment forms a micron-sized protrusion structure 200, and the micron-sized protrusion structure 200 makes the surface of the substrate less prone to wear and tear, and presents an anti-glare frosted texture on the surface of the substrate, so that it can be used as a housing for electronic devices.

[0080] This embodiment also provides a method for manufacturing a substrate, which is suitable for manufacturing a substrate provided by any of the above technical solutions. The method for manufacturing a substrate provided by this embodiment includes:

[0081] Prepare a first powder material, wherein the first powder material is glass particles;

[0082] preparing a second powder material, wherein the second powder material comprises at least one of microcrystalline glass particles and ceramic particles;

[0083] Prepare an embryo body by using the first powder and the second powder;

[0084] The green body is sintered to form a glass substrate, and a portion of the second powder protrudes from the first surface of the substrate to form a protruding structure.

[0085] From the above, we can see that Figure 6 As shown, the manufacturing method of the substrate can be summarized as at least including three parts: S10 preparing powder, S20 preparing a green body and S30 sintering.

[0086] When the second powder includes microcrystalline glass particles, during the sintering process, the liquid glass phase formed after the glass particles are melted provides sintering driving force, optical properties and thermal processing properties for the sintering process. Depending on the selection of the crystallization process and sintering temperature, the microcrystalline glass particles can be used to improve the mechanical reliability of the glass phase force-bearing body, or form larger grains to form the first protrusion. Figure 7As shown in (1), the mixed glass particles 310 and microcrystalline glass particles 320 are sintered together. The microcrystalline glass particles 320 include microcrystalline particles wrapped in glass, and the volume of the microcrystalline particles is relatively small. During the sintering process, the droplets of the glass phase are connected under the driving force of surface tension, and closed pores are formed inside. When the temperature is further increased, the viscosity of the glass phase decreases, and the gas is gradually discharged and clarified. At this time, as shown in FIG. Figure 7 As shown in (2), the high-temperature crystalline phase in the microcrystalline glass particles 320 has not yet reached the crystallization temperature, and the glass phase in the microcrystalline glass particles 320 has gradually liquefied and connected with the glass phase droplets formed by the glass particles 310, thereby forming a microcrystalline glass matrix. During the sintering process, some of the microcrystalline particles in the microcrystalline glass particles 320 grow, and the large-sized microcrystalline particles form the first protrusion. Furthermore, the difference in corrosion resistance between the microcrystalline phase and the glass phase can be used to selectively etch the glass phase. Therefore, the first protrusion effect formed by the above-mentioned microcrystalline particles can be amplified by pickling, etching and other effects. In other words, Figure 7 As shown in (3), the surface of the glass substrate can be pickled, etched, etc. to reduce the glass phase in the glass substrate to a certain extent, so that the size of the microcrystalline particles exposed from the glass phase is larger, that is, the size of the first protrusion protruding from the first surface is larger. In other words, the glass substrate can also be combined with the surface etching technology to enhance the wear resistance of the protrusion structure.

[0087] When the second powder includes ceramic particles 330, during the sintering process, the liquid glass phase formed after the glass particles 310 are melted provides sintering driving force, optical properties and thermal processing properties for the sintering process. The density of the ceramic particles 330 is greater than that of the glass phase, so the ceramic particles 330 will settle to the bottom side during the sintering process, and the ceramic particles 330 with larger particle sizes will protrude from the glass phase to form a second protrusion, thereby improving the mechanical strength and scratch resistance of the surface of the glass substrate. Figure 8 As shown in (1), during the sintering process, the glass phase droplets are connected under the driving force of surface tension, and closed pores are formed inside. When the temperature is further increased, the viscosity of the glass phase decreases, and the gas is gradually discharged and clarified. The ceramic particles 330 with a higher melting point than the glass particles 310 will not dissolve in the glass phase, nor will they grow significantly. The liquefied glass phase is wrapped around the surface of the ceramic particles 330 under the action of surface tension. Figure 8 As shown in (2), when sintered under high temperature, the viscosity of the glass phase decreases, and the ceramic particles 330 with a density greater than that of the glass phase settle, so that the ceramic particles 330 are all settled to the bottom area to form a ceramic particle 330 enriched layer. When forming a glass substrate, the surface of the side where the ceramic particles 330 are gathered is the first surface. Among the ceramic particles 330, the part of the ceramic particles 330 with a larger size forms the second protrusion.

[0088] When the second powder includes both microcrystalline glass particles and ceramic particles, compared with the in-situ crystallized microcrystalline glass in the related art, in the substrate provided by this embodiment, the thermal performance gap between the ceramic particles and the glass particles is relatively large, so that the crystallinity and grain size of the microcrystalline glass during thermal processing can be better controlled, thereby meeting the processing conditions of hot bending and chemical strengthening. Utilizing the difference in corrosion resistance between the microcrystalline particles and the glass phase, the first protrusion effect formed by the above-mentioned microcrystalline particles can be amplified by pickling, etching and other effects. In other words, pickling, etching and other treatments can be performed on the surface of the glass substrate to thin the glass phase in the glass substrate to a certain extent, so that the size of the microcrystalline particles exposed to the glass phase is larger, that is, the size of the first protrusion protruding from the first surface is larger. In other words, the glass substrate can also be combined with surface etching technology to enhance the wear resistance of the protruding structure.

[0089] After forming the glass substrate, the sintered glass substrate can be directly used as a glass substrate, and the glass substrate can be used to process and manufacture the housing. Alternatively, a post-processing process can be added according to the appearance requirements and reliability requirements, that is, the sintered glass substrate can be post-processed and the post-processed glass substrate can be used as a glass substrate, and the glass substrate can be used to process and manufacture the housing.

[0090] In the manufacturing method of the substrate provided in this embodiment, since a protruding structure is formed on the first surface of the substrate, the protruding structure is formed by a second powder material, and the second powder material is at least one of microcrystalline glass particles and ceramic particles. Therefore, the protruding structure is microcrystalline glass particles or ceramic particles, which have higher hardness and better anti-scratch performance, thereby making the first surface of the substrate have better anti-slip performance.

[0091] In some embodiments, the first powder material is composed of glass particles, and the glass particles can be prepared by melt quenching method and ball milling method. Exemplarily, the preparation method of the first powder material may include:

[0092] preparing glass slag;

[0093] The glass granules are produced by using glass slag.

[0094] The process of preparing glass slag may be: according to the volume difference of the components of the glass particles, the glass is melted at 1000°C to 1400°C for 30min to 240min and then quenched to form glass slag. Specifically, the temperature selection of the preparation process is specifically set according to the volume of the components of the glass particles. The components of the glass particles may include SiO2, Al2O3, B2O3, alkali metal oxides and alkaline earth metal oxides, wherein the proportion of each component is: 5wt%≤alkali metal oxide≤20wt%; 55wt%≤B2O3+SiO2+Al2O3≤75wt%, 5wt%≤alkaline earth metal oxide≤15wt%. In addition, the components of the glass particles may also include a first auxiliary raw material, the proportion of the first auxiliary raw material in all the components of the glass particles is not more than 5wt%, and the first auxiliary raw material may include: at least one of a colorant, a clarifier, a flux, an oxidant, and a reducing agent.

[0095] Alkali metal oxides and alkaline earth metal oxides are both metal oxides. Alkali metal oxides refer to oxides formed by alkali metal elements, such as sodium oxide, potassium oxide, etc.; alkaline earth metal oxides refer to oxides formed by alkaline earth metal elements, such as calcium oxide, magnesium oxide, etc. Exemplarily, alkali metal oxides include Li2O, Na2O and K2O, that is, 5wt%≤Li2O+Na2O+K2O≤20wt%. Alkaline earth metal oxides include CaO, SrO and BaO, that is, 5wt%≤CaO+SrO+BaO≤15wt%.

[0096] Among the components of glass particles, SiO2 and Al2O3, as the main components of glass particles, can improve the mechanical strength and stability of glass, so that the glass has a wider processing temperature range. B2O3, as a glass network former, can enhance the chemical stability and scratch resistance of glass and reduce the processing temperature of glass; alkali metal oxides can greatly reduce the melting temperature and processing temperature of glass and support the chemical strengthening ability of glass; alkaline earth metal oxides can reduce the processing temperature of glass and can also be used to adjust the chemical stability, material properties, optical alkalinity and refractive index of glass.

[0097] Among the first auxiliary raw materials, one or more of a colorant, a clarifier, a flux, an oxidant, and a reducing agent may be selected according to the requirements for the glass substrate.

[0098] The process of preparing glass particles from glass slag is as follows: ball-milling the glass slag to obtain glass particles of relatively smaller size, drying the glass particles and sieving them to obtain glass particles with a particle size not greater than 5 μm, and the glass particles obtained after sieving form the first powder.

[0099] In some embodiments, after sieving to obtain glass particles with a particle size of no more than 5 μm, the characteristic temperature of the glass particles can be tested by a differential scanning calorimetry (DSC). The characteristic temperature includes a glass transition temperature and a crystallization temperature. The glass transition temperature of the first powder is 450° C. to 700° C., and there is no obvious crystallization peak or crystallization phenomenon in the range of 600° C. to 1000° C. The glass particles that meet the above characteristic temperature requirements are the first powder for standby use.

[0100] When the second powder includes microcrystalline glass particles, the microcrystalline glass particles can be prepared by a melt quenching method and a ball milling method. The preparation process of the microcrystalline glass particles can be as follows:

[0101] preparing glass-ceramic slag;

[0102] The microcrystalline glass particles are prepared by using microcrystalline glass slag.

[0103] Exemplarily, the process of preparing glass slag can be: according to the volume difference of the components of the microcrystalline glass particles, the glass is melted at 1000℃~1400℃ for 30min~120min and then quenched with water to form glass slag. The uncrystallized glass slag needs to be crystallized to obtain microcrystalline glass slag. The crystallization process can be a one-step crystallization method and a two-step crystallization method, and the crystal phase type, the number of microcrystalline particles and the crystallinity of the precipitated microcrystalline particles are controlled by the crystallization temperature and time. Since there are different crystals in the microcrystalline glass particles, different crystals will grow to form microcrystalline particles at the corresponding temperature. Therefore, the temperature can be controlled to make the crystals that grow relatively faster at this temperature grow into microcrystalline particles. The crystal phase corresponding to this crystal is the main crystal phase, and the number and crystallinity of the microcrystalline particles are controlled by controlling the growth time of the crystal at this temperature. At the same temperature, multiple crystal phases will be produced, and the one with the largest number of crystal phases is the main crystal phase. After adjusting the temperature, the type of crystal phase and the number of the same crystal phase will change, thereby changing the main crystal phase. That is, the type of the main crystal phase can be changed by changing the temperature. Different crystal phases have a significant impact on the performance of microcrystalline glass particles. Microcrystalline glass particles are a composite material of crystals and glass bodies, and their performance is determined by the properties and quantity ratio of the two. The crystal phase can affect the hardness, strength, thermal stability and other physical properties of the first protrusion formed by the microcrystalline particles. Therefore, by controlling the type and quantity of the crystal phase by temperature and time, the performance of the first protrusion formed by the microcrystalline particles can be effectively regulated.

[0104] The components of the microcrystalline glass particles may include SiO2, Al2O3, B2O3 and alkaline earth metal oxides, wherein the proportions of the components are: 55wt%≤B2O3+SiO2+Al2O3≤80wt%; 10wt%≤alkaline earth metal oxides≤20wt%. Exemplarily, the alkaline earth metal oxides include CaO, SrO and BaO, that is, 10wt%≤CaO+SrO+BaO≤20wt%.

[0105] In some embodiments, the components of the microcrystalline glass particles may further include alkali metal oxides, wherein the alkali metal oxides are ≤15 wt %. For example, the alkali metal oxides include Li2O, Na2O, and K2O, that is, Li2O+Na2O+K2O≤20 wt %.

[0106] In some embodiments, the components of the microcrystalline glass particles may further include ZnO, wherein ZnO≤15 wt %. ZnO can be used to adjust the density, refractive index, acid and alkali resistance, and crystallization performance of the glass.

[0107] In some embodiments, the components of the microcrystalline glass particles may further include a nucleating agent and a first auxiliary raw material, the nucleating agent accounts for less than or equal to 10wt% of the microcrystalline glass particles, the first auxiliary raw material accounts for no more than 5wt% of the components of all microcrystalline glass particles, and the first auxiliary raw material may include: at least one of a colorant, a clarifier, a flux, an oxidant, and a reductant. The nucleating agent is a functional chemical additive that can be used to adjust the crystallization phase, the number of crystal nuclei, the grain size, and the crystallization mode of the microcrystalline glass particles. The nucleating agent may be P2O5, ZrO2, and TiO2, etc.

[0108] Among the components of glass-ceramics particles, SiO2 and Al2O3, as the main components of glass-ceramics particles, can improve the mechanical strength and stability of glass-ceramics, making glass-ceramics have a wider processing temperature range. B2O3, as a glass-ceramics network former, can enhance the chemical stability and scratch resistance of glass-ceramics and reduce the processing temperature of glass-ceramics; alkali metal oxides can greatly reduce the melting temperature and processing temperature of glass-ceramics and support the chemical strengthening ability of glass-ceramics; alkaline earth metal oxides can reduce the processing temperature of glass-ceramics and can also be used to adjust the chemical stability, material properties, optical alkalinity and refractive index of glass-ceramics.

[0109] In some implementations, the glass-ceramics particles further include a first auxiliary raw material, the first auxiliary raw material accounts for less than or equal to 5wt% of the glass-ceramics particles, and the first auxiliary raw material includes at least one of a colorant, a clarifier, a flux, an oxidant, and a reductant. In the first auxiliary raw material, one or more of the colorant, the clarifier, the flux, the oxidant, and the reductant can be selected according to the requirements for the glass-ceramics substrate.

[0110] In some embodiments, the crystal phase of the microcrystalline glass particles is one or more of cordierite, spinel, olivine, diopside, petalite, spodumene, eucryptite, lithium silicate, and quartz solid solution.

[0111] The microcrystalline particles precipitated from the microcrystalline glass slag can be divided into small-sized first grains and large-sized second grains. The average particle size of the first grains is 1nm to 80nm, and the average particle size of the second grains is 10μm to 20μm. In the glass substrate prepared by using microcrystalline glass particles including first grains and second grains, the size of the first grains is relatively small, which plays a role of dispersion toughening, can significantly improve the overall fracture toughness of the glass substrate, and will not significantly affect the optical properties of the glass substrate. In addition, if necessary, the first grains can grow to form second grains during subsequent thermal processing and sintering, thereby increasing the number of second grains, that is, the proportion of the first grains and the second grains can be adjusted by thermal processing and sintering. The second grains can provide micron-level protrusions on the surface of the substrate, which can protect the substrate from wear and scratches.

[0112] The process of preparing microcrystalline glass particles from microcrystalline glass slag is as follows: ball-milling the microcrystalline glass slag to obtain relatively smaller microcrystalline glass particles, drying the microcrystalline glass particles and sieving them to obtain microcrystalline glass particles with a particle size of 5μm to 100μm, and the microcrystalline glass particles obtained after sieving form the second powder, or form part of the second powder.

[0113] In some embodiments, after sieving to obtain glass-ceramics particles with a particle size of 5 μm to 100 μm, the characteristic temperature of the glass-ceramics particles can be tested by a calorimetric scanner. The characteristic temperature includes the glass transition temperature and the crystallization temperature. In the second powder, the glass transition temperature is 650° C. to 850° C., and the crystallization temperature is 900° C. to 1400° C. The glass-ceramics particles that meet the above characteristic temperature requirements are the second powder for standby use.

[0114] When the second powder includes ceramic particles, the preparation method of the ceramic particles may include:

[0115] preparing a ceramic precursor;

[0116] Ceramic particles are obtained by preparing ceramic precursors.

[0117] The preparation method of the ceramic precursor can be to mix a plurality of raw materials in a uniform ratio, grind the mixed raw materials and sinter them at high temperature to form the ceramic precursor. In some embodiments, the ceramic precursor can also be prepared by a sol-gel method, a chemical deposition method and other preparation methods.

[0118] The method for preparing ceramic particles from a ceramic precursor may include: ball milling the ceramic precursor to obtain relatively smaller ceramic particles, drying the ceramic particles and then sieving them to obtain ceramic particles with a particle size of 10 μm to 150 μm, and the ceramic particles obtained after sieving form the second powder, or form part of the second powder.

[0119] In some implementations, when the second powder includes ceramic particles, a main crystalline phase of the ceramic particles is at least one of aluminum oxide, zirconium oxide, cordierite, spinel, silicon carbide, silicon nitride, and aluminum nitride.

[0120] The characteristic temperature of the ceramic particles can be tested by a calorimetric scanner. The characteristic temperature includes the melting temperature of the ceramic particles, that is, the melting temperature of the ceramic particles.

[0121] In some embodiments, the melting temperature of the ceramic particles is at least 500° C. higher than the melting temperature of the glass particles. In this way, when the melting temperature of the glass particles is reached, the melting temperature of the ceramic particles is not reached, so that the ceramic particles are embedded in the glass substrate formed by the glass particles and remain in a particle state, so that the ceramic particles are finally used to form the second protrusions.

[0122] Exemplarily, the melting temperature of the ceramic particles is greater than or equal to 1400°C. Within the temperature range of the melting temperature, it is convenient to control the erosion effect of the glass droplets formed by the glass particles on the ceramic phase formed by the ceramic particles during the subsequent sintering process, so that the ceramic particles are more completely retained in the glass phase, so as to be finally used to form the second protrusion.

[0123] In some embodiments, the Mohs hardness of the ceramic particles is greater than or equal to 7.5. The hardness of such ceramic particles is relatively greater. Since the ceramic particles eventually form a second protrusion protruding from the first surface, the hardness of the second protrusion is greater, which can further enhance the wear resistance of the first surface.

[0124] In some embodiments, the surface of the ceramic particles can be wetted with the glass droplets, thereby reducing the porosity of the glass substrate formed by sintering. The wettability of the ceramic particles to the glass droplets can be increased through an infiltration treatment process. Exemplarily, when the main crystalline phase of the ceramic particles is silicon carbide, the infiltration treatment process for the ceramic particles includes pre-oxidizing the ceramic particles at a high temperature to form a silicon oxide film layer on the surface of the silicon carbide particles. When the main crystalline phase of the ceramic particles is silicon nitride, the infiltration treatment process for the ceramic particles includes coating the surface of the ceramic particles with silane to coat the surface of the silicon nitride with silane. When the main crystalline phase of the ceramic particles is aluminum nitride, the infiltration treatment process for the ceramic particles includes coating the surface of the ceramic particles with silane to coat the surface of the aluminum nitride with silane. Fig. 9 As shown, Fig. 9This is a cross-sectional view of the embryo after sintering. In the circled area, it can be seen that the ceramic particles exist in the glass phase, and the ceramic particles have good wettability with the glass phase, and there are no pores.

[0125] When the second powder includes both ceramic particles and glass-ceramic particles, ceramic particles and glass-ceramic particles are prepared separately, and then the ceramic particles and glass-ceramic particles are mixed in a set ratio to form the second powder. The set mixing ratio of ceramic particles and glass-ceramic particles can be determined by referring to the ratio of glass particles, glass-ceramic particles and ceramic particles in the mixed powder formed by the first powder and the second powder.

[0126] After the preparation of the first powder and the second powder is completed, the embryo body is prepared.

[0127] In some implementations, the process of preparing an embryo body includes:

[0128] A mixed material body is prepared, the mixed material body includes a first powder and a second powder, the mass fraction of the first powder in the mixed material body is 20wt% to 80wt%, and the second powder includes one of microcrystalline glass particles and ceramic particles, the mass fraction of the second powder in the mixed material body is 20wt% to 80wt%.

[0129] Specifically, in a specific embodiment, the mixed material body includes a first powder and a second powder, the first powder is glass particles, the second powder is microcrystalline glass particles, and the second powder does not contain ceramic particles. In the preparation process of this mixed material body, the glass particles and microcrystalline glass particles are evenly mixed together according to a set ratio to form a mixed powder. The proportion of glass particles in the mixed material body is 20wt% to 80wt%, and the proportion of microcrystalline glass particles in the mixed material body is 20wt% to 80wt%. Exemplarily, the glass particles are 20wt% and the microcrystalline glass particles are 80wt%, then the glass particles and the microcrystalline glass particles are evenly mixed in a ratio of 1:4 to obtain a mixed material body. In another example, the glass particles are 50wt% and the microcrystalline glass particles are 50wt%, then the glass particles and the microcrystalline glass particles are evenly mixed in a ratio of 1:1 to obtain a mixed material body. In another example, the glass particles are 80wt% and the microcrystalline glass particles are 20wt%, then the glass particles and the microcrystalline glass particles are evenly mixed in a ratio of 4:1 to obtain a mixed material body.

[0130] In another specific embodiment, the mixed material body includes a first powder and a second powder, the first powder is glass particles, the second powder is ceramic particles, and the second powder does not contain microcrystalline glass particles. In the preparation process of this mixed material body, the glass particles and ceramic particles are evenly mixed together according to a set ratio to form a mixed powder. The proportion of glass particles in the mixed material body is 20wt% to 80wt%, and the proportion of ceramic particles in the mixed material body is 20wt% to 80wt%. Exemplarily, the glass particles are 20wt% and the ceramic particles are 80wt%, then the glass particles and the ceramic particles are evenly mixed in a ratio of 1:4 to obtain a mixed material body. In another example, the glass particles are 50wt% and the ceramic particles are 50wt%, then the glass particles and the ceramic particles are evenly mixed in a ratio of 1:1 to obtain a mixed material body. In another example, the glass particles are 60wt% and the ceramic particles are 40wt%, then the glass particles and the ceramic particles are evenly mixed in a ratio of 3:2 to obtain a mixed material body. In another example, the glass particles account for 80 wt % and the ceramic particles account for 20 wt %, and a mixed material body can be obtained by uniformly mixing the glass particles and the ceramic particles in a ratio of 4:1.

[0131] In another specific embodiment, the mixed material body includes a first powder and a second powder, the first powder is glass particles, and the second powder includes ceramic particles and microcrystalline glass particles. The mass fraction of the glass particles in the mixed material body is 20wt% to 80wt%, the mass fraction of the microcrystalline glass particles in the mixed material body is less than 80wt%, and the mass fraction of the ceramic particles in the mixed material body is less than 60wt%. In other words, 20wt%≤glass particles≤80wt%, 0wt%<microcrystalline glass particles≤80wt%, 0wt%<ceramic particles≤60wt%.

[0132] Exemplarily, the glass particles are 20wt%, the microcrystalline glass particles are 60wt%, and the ceramic particles are 20wt%. Then, the glass particles, microcrystalline glass particles and ceramic particles are uniformly mixed in a ratio of 1:3:1 to obtain a mixed material body. In another example, the glass particles are 50wt%, the microcrystalline glass particles are 25wt%, and the ceramic particles are 25wt%. Then, the glass particles, microcrystalline glass particles and ceramic particles are uniformly mixed in a ratio of 2:1:1 to obtain a mixed material body. In another example, the glass particles are 80wt%, the microcrystalline glass particles are 10wt%, and the ceramic particles are 10wt%. Then, the glass particles, microcrystalline glass particles and ceramic particles are uniformly mixed in a ratio of 8:1:1 to obtain a mixed material body.

[0133] It is worth noting that, in the process of preparing the mixed material, the first powder and the second powder can be mixed evenly by grinding mixing, stirring mixing, suspension dispersion mixing and the like.

[0134] According to the granulation requirements of the molding process, a binder may be added to the mixed material. For example, in some implementations, the mixed material further includes a binder, and the mass fraction of the binder in the mixed material is less than 30wt%. In other words, 0wt%<binder≤30wt%.

[0135] In the process of preparing the embryo body by the mixed material body, the embryo body can be specifically a powder embryo or a green porcelain tape. For example, the mixed material body can be placed in a mold, and the mixed material body can be closely arranged under the action of a set pressure to reduce the gap between particles in the mixed material body, and the compacted mixed material body forms a powder embryo. When the mixed material body includes a binder, a green porcelain tape with a thickness of 0.5 to 8 mm can be obtained by tape casting after granulation under the auxiliary bonding effect of the binder.

[0136] After the embryo is prepared, the embryo and the mold are sent to the sintering device for sintering. That is, during the sintering process, the embryo is in the mold, and the mold has at least one flat surface, and the side of the embryo that contacts the flat surface is the first surface.

[0137] During the sintering process, since the melting temperature of glass particles is the lowest, the glass particles melt into a liquid glass phase with a certain viscosity. Since the melting temperatures of microcrystalline glass particles and ceramic particles are higher than those of glass particles, when the glass particles melt, the microcrystalline glass particles and ceramic particles are still in solid granular form, and the microcrystalline glass particles and ceramic particles are wrapped in the glass phase. The microscopic process of the sintering process can be divided into three modes: solid-phase sintering, grain rearrangement, and dissolution precipitation. Solid-phase sintering mainly occurs between crystal particles with high melting temperatures, grain rearrangement is mainly driven by the wetting effect and surface energy of the glass phase, and dissolution precipitation mainly occurs between the glass phase and the grains. The sintering process in the embryo is mainly dominated by the viscous flow of the low-viscosity glass phase, and the sintering process is mainly dominated by the grain rearrangement process. The growth of grains and interfacial reactions during the dissolution precipitation process can be controlled by adjusting the components included in the glass particles and the ratio of each component, as well as adjusting the sintering temperature.

[0138] It is worth noting that when the second powder is microcrystalline glass particles, that is, the mixed material body includes glass particles and microcrystalline glass particles, but does not include ceramic particles, the sintering can be low-temperature sintering or high-temperature sintering. The sintering temperature may be in the range of 600°C to 1200°C. The temperature can be selected according to the ratio of the first powder and the second powder in the mixed material. In some embodiments, the sintering specifically adopts low-temperature sintering, such as 600°C, 650°C, 700°C, etc. In the low-temperature sintering process, the energy consumption is relatively low and the cost is relatively low. When the second powder includes ceramic particles, that is, the mixed material body includes ceramic particles, the sintering can adopt high-temperature sintering, such as 780°C, 1050°C, 1200°C, etc.

[0139] The sintering process can be maintained for 2 hours to 12 hours, so that the mixed material body forms a high-density glass matrix.

[0140] When the mixed material body includes a binder, the embryo body is specifically a green porcelain tape. In this case, the embryo body can be preheated and debinded by keeping the embryo body at a temperature of 400°C to 600°C for a set time. The preheated embryo body is formally sintered, for example, it can be kept at a temperature of 600°C to 1200°C for 2h to 12h until the embryo body is completely densified. Exemplarily, the thickness of the densified glass substrate can be 0.3mm to 5mm.

[0141] The manufacturing method of the substrate provided in this embodiment is used to manufacture the substrate. In the manufacturing process of the substrate, the fluidity of the glass phase is fully utilized. The loss of the glass phase by the interface reaction is avoided to a certain extent through the component design of the mixed material body, thereby greatly improving the efficiency of grain rearrangement during the sintering process, and finally obtaining a high-density substrate. Compared with the ceramic substrate made by the low-temperature co-fired ceramic method in the related art, the substrate made by the manufacturing method of the substrate provided in this embodiment can be subjected to post-processing processes such as chemical strengthening and hot bending, so as to better adapt to the various different use scenarios of the housing of the electronic device. Compared with the processing method of performing surface processing on the surface of the glass substrate to form a strengthening layer in the related art, the manufacturing method of the substrate provided in this embodiment realizes the regulation of the size of the microcrystalline particles through temperature control, so that the surface of the manufactured substrate forms a micron-level convex structure, forming a substrate that is not easy to wear and has an anti-glare matte texture, so that it can be used as a decorative layer of the housing of the electronic device.

[0142] Ten specific cases are provided below to further illustrate the specific process of the substrate manufacturing method provided in this embodiment.

[0143] Table 1 shows the detailed process parameters and performance parameters of Case 1-Case 4, Table 2 shows the detailed process parameters and performance parameters of Case 5-Case 7, and Table 3 shows the detailed process parameters and performance parameters of Case 8-Case 10.

[0144] Table 1:

[0145]

[0146] As shown in Table 1 above, in Cases 1 to 4, the first powder includes glass particles, and the second powder includes ceramic particles, but does not include microcrystalline glass particles. In Case 1, the ratio of glass particles to ceramic particles is 4:1, and in Cases 2 to 4, the ratio of glass particles to ceramic particles is 1:1. Glass particles and ceramic particles are prepared according to the proportions of each component in Table 1. For example, in the glass particles, the component of SiO2 is 42wt%, the component of Al2O3 is 3wt%, the component of B2O3 is 25wt%, the component of Na2O is 19wt%, the component of K2O is 1wt%, and the component of alkaline earth metal oxide is 10wt%, and the alkaline earth metal oxide includes CaO, SrO and BaO.

[0147] In the manufacturing process of Case 1 to Case 4, the first powder and the second powder are first prepared according to the component ratio in Table 1, and the first powder and the second powder are evenly mixed according to the ratio of glass to ceramic in Table 1 to obtain a mixed powder. The mixed powder is poured into a mold and flattened, and the mold can be a graphite mold. The mixed powder is compacted under an auxiliary pressure of 10MPa, and then the mold containing the mixed powder is placed in a muffle furnace and sintered at a corresponding temperature (780°C). The sintered glass substrate is moved into an environment of 450°C and kept warm for 2h for annealing to reduce microcracks inside the glass substrate. The glass substrate obtained after annealing has a protruding structure on one side, and the protruding structure includes a second protruding structure formed by ceramic particles.

[0148] Taking Case 1 as an example, a cross-sectional analysis of the sintered glass substrate showed that the main crystalline phase Al2O3 of the ceramic particles was well infiltrated with the glass matrix and still existed in the form of grains.

[0149] Table 2:

[0150]

[0151] As shown in Table 2 above, in Cases 5 to 7, the first powder includes glass particles, the second powder includes microcrystalline glass particles, and ceramic particles are not included. In Cases 5 to 7, the ratio of glass particles to microcrystalline glass particles is 1:1. Glass particles and ceramic particles are prepared according to the proportions of each component in Table 2. For example, in the glass particles, the component of SiO2 is 42wt%, the component of Al2O3 is 3wt%, the component of B2O3 is 25wt%, the component of Na2O is 19wt%, the component of K2O is 1wt%, and the component of alkaline earth metal oxide is 10wt%, and the alkaline earth metal oxide includes CaO, SrO and BaO.

[0152] In the manufacturing process of Case 5 to Case 7, the first powder and the second powder are first prepared by installing the component ratio in Table 2, and the first powder and the second powder are evenly mixed according to the ratio of glass to microcrystalline glass in Table 1 to obtain a mixed powder. The mixed powder is poured into a mold and flattened, and the mold can be a graphite mold. The mixed powder is compacted under an auxiliary pressure of 10MPa, and then the mold containing the mixed powder is placed in a muffle furnace and sintered at a corresponding temperature (760°C). The sintered glass substrate is moved to a 450°C environment and kept warm for 2h for annealing to reduce microcracks inside the glass substrate. The glass substrate obtained after annealing is immersed in an etching solution for 4h, and finally a glass substrate having a first protrusion on both the first surface and the second surface is obtained.

[0153] It can be seen from Table 3 shown below that in Cases 8 to 10, the first powder includes glass particles, and the second powder includes microcrystalline glass particles and ceramic particles. In Cases 8 to 10, the ratio of glass particles, microcrystalline glass particles and ceramic particles is 1:1:1. Glass particles, microcrystalline glass particles and ceramic particles are prepared according to the ratio of each component in: 3. For example, in the glass particles, the component of SiO2 is 42wt%, the component of Al2O3 is 3wt%, the component of B2O3 is 25wt%, the component of Na2O is 19wt%, the component of K2O is 1wt%, and the component of alkaline earth metal oxide is 10wt%, and the alkaline earth metal oxide includes CaO, SrO and BaO.

[0154] In the manufacturing process of Case 8 to Case 10, glass particles, microcrystalline glass particles and ceramic glass particles are first prepared according to the component ratio in Table 3, and the glass particles, microcrystalline glass particles and ceramic glass particles are evenly mixed according to the ratio of glass, microcrystalline glass and ceramic in Table 1 (1:1:1) to obtain a mixed powder. The mixed powder is poured into a mold and flattened, and the mold can be a graphite mold. The mixed powder is compacted under an auxiliary pressure of 10MPa, and then the mold containing the mixed powder is placed in a muffle furnace and sintered at a corresponding temperature (760°C). The sintered glass substrate is moved into an environment of 450°C for 2h for annealing to reduce microcracks inside the glass substrate. The glass substrate obtained after annealing is immersed in an etching solution for 4h, and finally a glass substrate with convex structures on both the first surface and the second surface is obtained. Specifically, on the first surface, the convex structure includes both the first convexity and the second convexity, and on the second surface, the convex structure includes the first convexity.

[0155] Table 3:

[0156]

[0157] like Fig.10As shown, this embodiment also provides a method for manufacturing a housing, the housing includes the substrate provided in any of the above embodiments, so the method for manufacturing the housing includes the method for manufacturing the above substrate, and the method for manufacturing the substrate is not repeated here. The housing can be applied to electronic devices, and in addition, the housing can also be applied to other structures, such as biomedical equipment, tableware and kitchen utensils, daily decorations, etc.

[0158] In some implementations, the manufacturing method of the housing further includes performing post-processing step S40 on the substrate. The post-processing includes at least one of CNC (Computer Numerical Control) cold engraving, hot bending, polishing, chemical strengthening, laser engraving, surface etching and surface coating.

[0159] CNC cold engraving is a precision processing method, which is mainly carried out by computer numerical control automated machine tools. This technology can directly use CNC for fine engraving, hollowing out the inside of the flat glass and forming a curvature on the outside.

[0160] Hot bending is to heat a flat substrate to soften the substrate, place the softened substrate on a curved mold, deform the flat substrate into a curved shape that matches the mold shape through gravity deformation or pressure, and after cooling, the substrate is fixed in the curved shape. The substrate can be processed into a 3D glass substrate by hot bending. In the related art, if a pure microcrystalline glass plate is subjected to hot bending, the microcrystalline glass plate will undergo severe crystallization during the hot bending process, thereby quickly consuming the glass phase in the microcrystalline peeling force plate, resulting in the inability to perform hot bending. In other words, the pure microcrystalline glass plate cannot be hot bent. In the substrate with the first protrusion provided in this embodiment, the main body of the substrate is a glass phase, and the microcrystalline glass phase is only a small part, which is used to form the first protrusion. Therefore, the substrate provided in this embodiment has a relatively high thermal stability, which can effectively avoid severe crystallization and complete loss of the glass phase, thereby supporting hot bending.

[0161] Polishing is to reduce the roughness of the workpiece surface to obtain a relatively smoother surface. After sintering to form the substrate, the multiple protrusions formed on the first surface of the substrate protrude from the first surface in different sizes. Polishing can be used to control the maximum size of the multiple protrusions protruding from the first surface within a threshold range, thereby improving the touch feel of the substrate. In addition, among the outer surfaces of the substrate, other surfaces except the first surface can also be polished to make the other surfaces smoother and flatter.

[0162] Chemical strengthening is to place the substrate in a strengthening solution so that the ions on the surface of the substrate are exchanged with the ions in the solution, thereby forming a strengthening layer on the surface of the substrate. During the ion exchange process, compressive stress will be generated due to volume changes, so that a tensile stress layer is formed on both surfaces and inside of the substrate, thereby improving the structural strength of the substrate. Introducing a certain proportion of sodium ions and lithium ions into the glass phase of the substrate can make the substrate have better physical conditions for chemical strengthening. When the first surface of the substrate has a second protrusion formed by ceramic particles, a chemical strengthening effect with better shape and size control can be achieved by coating a protective layer on the outside of the first surface, distributing strengthening, and controlling the thermal stress of the crystal phase.

[0163] Laser engraving is a manufacturing process that uses CNC technology and laser as a processing medium. Laser engraving can be used to engrave text or patterns on the surface of a substrate, such as engraving product numbers, trademarks, etc. on the surface of a substrate. It can also be used to engrave text or patterns on the surface of a substrate to improve the aesthetics of the substrate or to meet the customer's personalized customization needs.

[0164] Surface etching can utilize the difference in acid and alkali resistance between the glass phase and other different crystalline phases (the crystalline phase of microcrystalline glass particles or the crystalline phase of ceramic particles) to expose more other crystalline phases by surface etching the glass phase, so that the size of the protruding structure exposed on the first surface is larger, thereby enhancing the roughness and frosted texture of the first surface.

[0165] Surface coating is a process of coating one or more layers of thin film on the surface of a substrate. Coating the surface of a substrate can provide a certain protective effect on the surface of the substrate or increase the function of the substrate. For example, adding a self-cleaning film on the surface of the substrate can make the surface of the substrate less prone to dirt. The self-cleaning film can be a self-cleaning super-hydrophilic glass film, a titanium dioxide film, etc.

[0166] The housing may be manufactured only from the substrate, and the method for manufacturing the housing may include cutting the substrate.

[0167] In addition to the substrate, the housing may also include other structural parts. In this case, the manufacturing method of the housing also includes a process step of assembling the substrate and other structural parts together. Exemplarily, the housing also includes a frame, and the substrate is installed in the frame. In this case, the manufacturing method of the housing also includes a step of connecting the substrate to the frame. In another example, the housing also includes a bottom plate, and the substrate is arranged on one side of the bottom plate. The substrate serves as a decorative layer of the housing. In this case, the manufacturing method of the housing also includes a step of connecting the substrate to the bottom plate.

[0168] This embodiment also provides a housing, which is applied with the substrate provided by any of the above embodiments. The housing can be applied to electronic devices, and in addition, the housing can also be applied to other structures, such as biomedical equipment, tableware and kitchenware, daily decorations, etc.

[0169] Since the shell includes the above-mentioned substrate, it at least has all the beneficial effects of the substrate, which will not be described in detail here.

[0170] This embodiment provides an electronic device, including the housing provided by the above technical solution.

[0171] Through the above technical solution, since the electronic device includes the above shell, it at least has all the beneficial effects of the shell, which will not be repeated here.

[0172] The electronic device may be an electronic product or component with a housing, such as an electronic paper, a mobile phone, a tablet computer, a television, a smart bracelet, a smart watch, a display, a laptop computer, an electronic photo frame, etc., which is not limited in this embodiment.

[0173] like Fig.11 As shown, in an electronic device 400 provided in an embodiment of the present application, the electronic device 400 may include a display screen 430, a battery 420 and a housing. The housing provided in the above embodiment may be used as a housing of the electronic device or a part of a housing. For example, the housing includes a middle frame 412 and a battery cover 411, and the substrate is used to process and manufacture the battery cover 411, that is, the battery cover 411 includes a substrate, and the first surface 110 of the substrate is the side surface of the battery cover 411 facing away from the battery 420, or in other words, the first surface 110 of the substrate is the side surface of the battery cover 411 facing outward. The middle frame 412 is connected to the battery cover 411, and the display screen 430 is installed on the middle frame 412. The display area of ​​the display screen 430 faces away from the battery cover 411, and the battery 420 is located between the display screen 430 and the battery cover 411.

[0174] The electronic device provided in the embodiment of the present application has a better scratch resistance performance of the housing of the electronic device because its housing adopts a substrate, and the surface of the substrate is provided with a micron-level protrusion structure 200, and the hardness of the protrusion structure 200 is relatively large.

[0175] It is worth noting that, since the housing provided in the above embodiment includes a substrate, the manufacturing method of the housing includes the manufacturing method of the substrate. Since the electronic device provided in the above embodiment includes a housing, the manufacturing method of the electronic device at least includes the manufacturing method of the substrate.

[0176] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for manufacturing a substrate, characterized in that: The method comprises: preparing a first powder material, wherein the first powder material is glass particles; preparing a second powder material, wherein the second powder material comprises at least one of microcrystalline glass particles and ceramic particles; preparing an embryo body by using the first powder and the second powder; The embryo body is sintered to form a glass substrate, and part of the second powder protrudes from the first surface of the substrate to form a protruding structure; wherein the hardness of the microcrystalline glass particles and the ceramic particles is greater than the hardness of the glass substrate, and the sintering temperature is 600°C to 1200°C. When the second powder includes ceramic particles, the melting temperature of the ceramic particles is at least 500°C higher than the melting temperature of the glass particles.

2. The method according to claim 1, characterized in that The process of preparing embryoid bodies comprises: A mixture is prepared, wherein the mixture includes the first powder and the second powder, wherein the mass fraction of the first powder in the mixture is 20wt% to 80wt%, and the second powder includes one of microcrystalline glass particles and ceramic particles, and the mass fraction of the second powder in the mixture is 20wt% to 80wt%.

3. The method according to claim 1, characterized in that The process of preparing embryoid bodies comprises: A mixture body is prepared, wherein the mixture body includes the first powder and the second powder, wherein the mass fraction of the first powder in the mixture body is 20wt% to 80wt%, and the second powder includes microcrystalline glass particles and ceramic particles, wherein the mass fraction of the microcrystalline glass particles in the mixture body is less than 80wt%, and the mass fraction of the ceramic particles in the mixture body is less than 60wt%.

4. The method according to claim 2 or 3, characterized in that The mixture body further includes a binder, and the mass fraction of the binder in the mixture body is less than 30wt%.

5. The method according to claim 1, characterized in that The particle size of the glass particles is less than or equal to 5 μm.

6. The method according to claim 1, characterized in that The glass particles include SiO2, Al2O3, B2O3, alkali metal oxides and alkaline earth metal oxides, wherein 5wt%≤alkali metal oxides≤20wt%; 55wt%≤B2O3+SiO2+Al2O3≤75wt%, and 5wt%≤alkaline earth metal oxides≤15wt%.

7. The method according to claim 6, characterized in that The glass particles further include a first auxiliary raw material, the first auxiliary raw material is ≤5wt%; the first auxiliary raw material may include: at least one of a colorant, a clarifier, a flux, an oxidant, and a reducing agent.

8. The method according to claim 1, characterized in that The glass transition temperature of the glass particles is 450°C to 700°C.

9. The method according to claim 1, characterized in that When the second powder includes microcrystalline glass particles, the crystal phase of the microcrystalline glass particles is one or more of cordierite, spinel, olivine, diopside, petalite, spodumene, eucryptite, lithium silicate and quartz solid solution.

10. The method according to claim 1, characterized in that When the second powder comprises microcrystalline glass particles, the microcrystalline glass particles comprise SiO2, Al2O3, B2O3 and alkaline earth metal oxides, wherein 55wt%≤ B2O3+SiO2+Al2O3≤80wt%;10wt%≤alkaline earth metal oxide≤20wt%.

11. The method according to claim 10, characterized in that The microcrystalline glass particles further include ZnO, wherein ZnO≤15wt%.

12. The method according to claim 10, characterized in that The microcrystalline glass particles further include alkali metal oxides, and the proportion of the alkali metal oxides in the microcrystalline glass particles is less than or equal to 15 wt %.

13. The method according to claim 10, characterized in that The microcrystalline glass particles also include a nucleating agent and a first auxiliary raw material, the nucleating agent accounts for less than or equal to 10wt% of the microcrystalline glass particles, the first auxiliary raw material accounts for less than or equal to 5wt% of the microcrystalline glass particles, and the first auxiliary raw material includes at least one of a colorant, a clarifier, a flux, an oxidant, and a reducing agent.

14. The method according to claim 1, wherein: When the second powder includes glass-ceramic particles, the particle size of the glass-ceramic particles is 5 μm to 100 μm.

15. The method according to claim 1, wherein: When the second powder includes microcrystalline glass particles, the preparation of the second powder includes a crystallization process. During the crystallization process, the microcrystalline glass particles precipitate microcrystalline particles. The microcrystalline particles include one or both of first grains and second grains. The average particle size of the first grains is 1nm to 80nm, and the average particle size of the second grains is 10μm to 20μm.

16. The method according to claim 1, wherein: When the second powder includes ceramic particles, the particle size of the ceramic particles is 10 μm to 150 μm.

17. The method according to claim 1, wherein: When the second powder includes ceramic particles, a main crystal phase of the ceramic particles is at least one of aluminum oxide, zirconium oxide, cordierite, spinel, silicon carbide, silicon nitride and aluminum nitride.

18. The method of claim 1, wherein: When the second powder includes ceramic particles, the melting temperature of the ceramic particles is greater than or equal to 1400°C.

19. The method of claim 1, wherein: When the second powder includes ceramic particles, the Mohs hardness of the ceramic particles is greater than or equal to 7.

5.

20. The method of claim 1, wherein: When the second powder material includes ceramic particles, preparing the second powder material further includes: performing wettability treatment on the ceramic particles.

21. A method for manufacturing a housing, characterized in that: A method for manufacturing a substrate comprising the steps of:

22. The method according to claim 21, characterized in that The method further comprises: The substrate is post-processed, and the post-processing includes at least one of CNC cold engraving, hot bending, polishing, chemical strengthening, laser engraving, surface etching and surface coating.

23. A substrate, characterized in that: The substrate is prepared by the method according to any one of claims 1 to 20.

24. A housing, characterized in that: Comprising the substrate as claimed in claim 23.

25. An electronic device, characterized in that: Comprising a housing as claimed in claim 24.

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