Composition based on bismaleimide and acrylic liquid crystal photosensitive resin and its application

The problem of poor brittleness and solubility of bismaleimide resin in 3D printing is solved by introducing a cross-linked curing network and carbon nanotube with specific structures into the composition of bismaleimide and acrylic liquid crystal photosensitive resin. , achieved excellent mechanical properties after 405nm photocuring.

CN118466117BActive Publication Date: 2024-12-20ZHONGSHAN GREATSIMPLE TECH CO LTD
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Patent Information

Application Number
CN202410696709.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-05-31
Publication Date
2024-12-20
Estimated Expiration
2044-05-31

AI Technical Summary

Technical Problem

The application of bismaleimide resin in 3D printing technology is limited by the problems of poor brittleness and solubility caused by the high cross-linking density of cured substances, which affects its application in 405nm photocuring 3D printing.

Method used

Using a composition based on bismaleimide and acrylic liquid crystal photosensitive resin, a cross-linking curing network with a specific structure is combined with carbon nanotubes and polyethylene glycol dimethacrylate resin to form excellent mechanical properties.

Benefits of technology

The bismaleimide-based resin composition has excellent mechanical properties after photocuring of 405 nm and is suitable for 3D printing technology.

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Abstract

The present application provides a composition based on bismaleimide and acrylic liquid crystal photosensitive resin, which includes 10-50 parts of bismaleimide-based resin, 10-50 parts of acrylic liquid crystal photosensitive resin, 5-20 parts of polyethylene glycol dimethacrylate resin, 5-20 parts of alkanediol diacrylate, 1-10 parts of carbon nanotubes, 1-15 parts of diluent and 1-5 parts of photoinitiator by weight. The composition provided by the present application can be used for 405nm light-curing 3D printing, and the objects formed by 3D printing of the composition provided by the present application have excellent mechanical properties.
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Description

Technical Field

[0001] The invention relates to the technical field of photosensitive resin compositions and applications thereof, and in particular to a composition based on bismaleimide and acrylic liquid crystal photosensitive resin and applications thereof. Background Art

[0002] 3D printing technology has the advantages of high precision and the ability to print objects with fine features, making the research and development of corresponding photosensitive reaction compositions of great significance.

[0003] Bismaleimide resin is a thermosetting polymer with good fatigue resistance and thermal stability. It is widely used in the fields of electrical device manufacturing, aerospace device manufacturing, etc. However, due to the weakness of high cross-linking density of the cured product of bismaleimide resin, which makes the material brittle, and the weakness of poor solubility, its application in 3D printing technology is limited. Therefore, it is of great significance to develop a photosensitive composition including bismaleimide resin for 3D printing technology. Summary of the invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of the present invention is to provide a composition based on bismaleimide and acrylic liquid crystal photosensitive resin that can be used for 405nm light-curing 3D printing. The composition provided in this application has excellent mechanical properties after cross-linking and curing by 3D printing.

[0005] To solve the above problems, the technical solution adopted by the present invention is as follows:

[0006] A composition based on bismaleimide and acrylic liquid crystal photosensitive resin, comprising, by weight:

[0007]

[0008]

[0009] The structural formula of the bismaleimide resin is:

[0010]

[0011] Wherein R1 is selected from A type of dephenylenedihydro group;

[0012] R2 is selected from A type of dephenylenedihydro group;

[0013] The structural formula of the acrylic liquid crystal photosensitive resin is:

[0014]

[0015] Wherein, the mesogen is selected from:

[0016] A type of dephenylenedihydro group.

[0017] In some possible implementations, the alkanediol diacrylate includes one of 1,6-hexanediol ethoxylate diacrylate, dipropylene glycol diacrylate, and tripropylene glycol diacrylate.

[0018] In some possible embodiments, the bismaleimide monomer of the bismaleimide-based resin is selected from one of N,N'-1,3-phenylene bismaleimide or 4,4'-diphenylmethane bismaleimide;

[0019] The aromatic diamine monomer of the bismaleimide-based resin is selected from one of p-phenylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether or 2,2'-dimethyl-4,4'-diaminobiphenyl;

[0020] The monomer of the mesogen is selected from 4,4'-dihydroxyazobenzene, 3,3'-sulfonyl biphenol or 4,4'-sulfonyl biphenol.

[0021] In some possible implementations, the photoinitiator includes 2,4,6-(trimethylbenzoyl)diphenylphosphine oxide or phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide.

[0022] In some possible implementations, the diluent is an acrylate reactive diluent.

[0023] In some possible embodiments, the composition further comprises:

[0024] 1-5 parts of defoaming agent;

[0025] 1-5 parts of leveling agent;

[0026] 1-5 parts of antioxidants.

[0027] In some possible implementations, the defoaming agent is selected from at least one of a silicone defoaming agent and a polyether defoaming agent.

[0028] In some possible implementations, the leveling agent is selected from at least one of an acrylic leveling agent and an acrylate leveling agent.

[0029] In some possible implementations, the antioxidant is selected from at least one of butyl pentaerythritol tetrakis[3-3',5'-di-tert-butyl-4'-hydroxyphenyl]propionate, dilauryl thiodipropionate and distearyl thiodipropionate.

[0030] The present application also provides an application of the composition, wherein the composition is used for 405nm photocuring 3D printing to obtain a molded part.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] In the present application, a bismaleimide-based resin, acrylic liquid crystal photosensitive resin, alkanediol diacrylate with a specific structure is selected to cooperate with carbon nanotubes and polyethylene glycol dimethacrylate resin to realize the photocuring molding of the bismaleimide-based resin composition. In addition, the introduced acrylic liquid crystal photosensitive resin, alkanediol diacrylate, polyethylene glycol dimethacrylate resin and carbon nanotubes form a cross-linked cured network with a specific structure, so that the bismaleimide-based resin composition has excellent mechanical properties after curing.

[0033] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A roadmap for preparing a bismaleimide-based resin according to an embodiment of the present application;

[0035] Figure 2 A roadmap for preparing acrylic liquid crystal photosensitive resin according to an embodiment of the present application. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0038] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0039] An embodiment of the present application provides a composition based on bismaleimide and acrylic liquid crystal photosensitive resin, wherein the composition comprises, by weight:

[0040]

[0041] The structural formula of the bismaleimide resin is:

[0042]

[0043] Wherein R1 is selected from A type of dephenylenedihydro group;

[0044] R2 is selected from A type of dephenylenedihydro group;

[0045] The structural formula of the acrylic liquid crystal photosensitive resin is:

[0046]

[0047] Wherein, the mesogen is selected from:

[0048] A type of dephenylenedihydro group.

[0049] In this embodiment, the preparation mechanism of the bismaleimide-based resin is as follows: bismaleimide and aromatic diamine monomers undergo addition reaction to obtain an intermediate product, and then the intermediate product reacts with glycidyl methacrylate to allow amino groups to undergo ring-opening addition to epoxy groups. The specific reaction route is as follows: Figure 1 shown.

[0050] In the specific preparation, bismaleimide, aromatic diamine monomer, organic solvent and catalyst can be added in a reaction container in proportion, reacted at 40-85°C for 2-3 hours and then concentrated under reduced pressure to obtain an intermediate product. Exemplarily, the intermediate product can also be separated by extraction. When preparing the intermediate product, the organic solvent can be selected from tetrahydrofuran, ethyl acetate and acetonitrile. The catalyst can be selected from glacial acetic acid or zinc chloride.

[0051] Then, glycidyl methacrylate, a catalyst for the corresponding ring-opening reaction and a polymerization inhibitor are added to the intermediate product in proportion, and the reaction is carried out at 50-70° C. for 4-13 hours to obtain a bismaleimide resin. In this step, illustratively, the catalyst for the ring-opening reaction can be selected from at least one of tetrabutylammonium bromide, tetrabutylammonium chloride, tetraethylammonium bromide, tetrabutylammonium hydrogen sulfate, benzyltriethylammonium chloride and trioctylmethylammonium chloride. Exemplarily, the polymerization inhibitor can be hydroquinone.

[0052] In some embodiments, the bismaleimide monomer of the bismaleimide-based resin is selected from one of N, N'-1, 3-phenylene bismaleimide or 4, 4'-diphenylmethane bismaleimide. When the bismaleimide monomer is N, N'-1, 3-phenylene bismaleimide, the nitrogen atoms of the two five-membered rings are bonded to the 1st and 3rd positions of the benzene ring, that is, R1 is a phenyl group obtained by dehydrogenating the 1st and 3rd positions of the benzene ring. When the bismaleimide monomer is 4, 4'-diphenylmethane bismaleimide, the N atoms of the two five-membered rings are bonded to the 4th and 4'th positions of diphenylmethane, and the corresponding R1 is a group obtained by dehydrogenating the 4th and 4'th positions of diphenylmethane.

[0053] In other embodiments, the form of the R1 group is altered by changing the bonding site of the nitrogen atom of the five-membered ring.

[0054] The aromatic diamine monomer of the bismaleimide resin is selected from one of p-phenylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether or 2,2'-dimethyl-4,4'-diaminobiphenyl. When the aromatic diamine monomer is phenylenediamine, R2 is a group dehydrogenated at positions 1 and 4 of the benzene ring. When the aromatic diamine monomer is 4,4'-diaminodiphenylmethane, R2 is a group dehydrogenated at positions 4 and 4' of diphenylmethane. When the aromatic diamine monomer is 4,4'-diaminodiphenyl ether, R2 is a group dehydrogenated at positions 4 and 4' of diphenyl ether. When the aromatic diamine monomer is 2,2'-dimethyl-4,4'-diaminobiphenyl, R2 is a group dehydrogenated at positions 4 and 4' of 2,2'-dimethylbiphenyl.

[0055] In other embodiments, the form of the R1 group is altered depending on the bonding site of the amino group.

[0056] In this embodiment, the preparation mechanism of acrylic liquid crystal photosensitive resin is as follows Figure 2 As shown, specifically, the mesogen with hydroxyl groups bonded at both ends and epichlorohydrin are subjected to the ring-opening addition reaction of alkylene oxide under the action of a catalyst to obtain the first intermediate product. For example, the catalyst can be selected from at least one of tetrabutylammonium bromide, tetrabutylammonium chloride, tetraethylammonium bromide, tetrabutylammonium hydrogen sulfate, benzyltriethylammonium chloride and trioctylmethylammonium chloride. The ring-opening reaction can be carried out under the protection of an inert gas, and the inert gas can be nitrogen. The reaction temperature can be set at 50-110° C. The reaction time can be 5-20 hours.

[0057] Next, an alkali solution, such as a sodium hydroxide solution or a potassium hydroxide solution, is dripped into the first intermediate product, so that the ortho-hydroxyl group reacts with the halogen atom to form a new epoxy group, thereby obtaining a second intermediate product. Impurities in the second intermediate product can be removed by vacuum filtration in combination with rotary evaporation. The crystallization of the second intermediate product can be obtained by precipitation and cooling crystallization and washing. The second intermediate product can be cooled in a mixed solution of methanol and acetone to precipitate crystals, and the crystals can be washed with methanol, and then the crystals of the second intermediate product can be obtained by suction filtration.

[0058] Afterwards, the crystals of the second intermediate product and the polymerization inhibitor are added to a reaction vessel and heated to melt. The reaction of the system can be set to 100-150°C. Exemplarily, in this step, the polymerization inhibitor can be selected from at least one of hydroquinone, benzoquinone and methylhydroquinone. Then, acrylic acid and a catalyst are dripped into the melt in proportion, and the reaction time can be controlled to be 2-5 hours, thereby obtaining an acrylic liquid crystal photosensitive resin. In this step, the catalyst can be selected from at least one of N, N-dimethylcyclohexylamine and N, N-dimethyl-p-toluidine.

[0059] In some embodiments, the monomer of the mesogen is selected from one of 4,4'-dihydroxyazobenzene, 3,3'-sulfonyl biphenol or 4,4'-sulfonyl biphenol. The increase in the spacing of the dihydroxyl groups in the mesogen monomer is conducive to reducing the interference force between the flexible chains at both ends of the mesogen unit in the acrylic liquid crystal photosensitive resin, thereby facilitating the free rotation orientation of the flexible chain, thereby facilitating the self-assembly behavior of regulating the brightness value of the liquid crystal.

[0060] In the present application, a bismaleimide-based resin, acrylic liquid crystal photosensitive resin, alkanediol diacrylate with a specific structure is selected to cooperate with carbon nanotubes and polyethylene glycol dimethacrylate resin to realize the photocuring molding of the bismaleimide-based resin composition. In addition, the introduced acrylic liquid crystal photosensitive resin, alkanediol diacrylate, polyethylene glycol dimethacrylate resin and carbon nanotubes form a cross-linked cured network with a specific structure, so that the bismaleimide-based resin composition has excellent mechanical properties after curing.

[0061] In some embodiments, the alkanediol diacrylate includes one of 1,6-hexanediol ethoxylate diacrylate, dipropylene glycol diacrylate, and tripropylene glycol diacrylate.

[0062] In some embodiments, the photoinitiator includes 2,4,6-(trimethylbenzoyl)diphenylphosphine oxide or phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide. The above two photoinitiators have high initiation activity and photobleaching effect, thus having better curing effect.

[0063] In other embodiments, the photoinitiator may be other types of free radical active initiators.

[0064] In some embodiments, the diluent is an acrylate reactive diluent, and exemplarily, the acrylate reactive diluent may include at least one of hydroxypropyl methacrylate and hydroxyethyl methacrylate. Acrylate diluents have high photocuring activity, which can help improve the curing rate of the composition.

[0065] In another embodiment, the diluent may be at least one of styrene, vinyl pyrrolidone, and vinyl acetate.

[0066] In some embodiments, the composition further comprises:

[0067] 1-5 parts of defoaming agent;

[0068] 1-5 parts of leveling agent;

[0069] 1-5 parts of antioxidants.

[0070] Adding the above-mentioned auxiliary agent to the composition is beneficial to improving the molding leveling property and oxidation resistance of the composition and reducing bubbles in the molded product.

[0071] In some embodiments, the defoamer is selected from at least one of a silicone defoamer and a polyether defoamer. The above-mentioned defoamers have the advantages of fast defoaming and strong stability.

[0072] In other embodiments, a mineral oil defoamer or a non-silicon defoamer may also be used.

[0073] In some embodiments, the leveling agent is selected from at least one of an acrylic leveling agent and an acrylate leveling agent. The above-mentioned leveling agent has good compatibility with the system of the present application and can balance the surface tension difference of the molded object, so that the molded object has a higher surface flatness.

[0074] In another embodiment, the leveling agent may be a silicone leveling agent or a fluorocarbon leveling agent.

[0075] In some embodiments, the antioxidant is selected from at least one of tetrakis[3-3',5'-di-tert-butyl-4'-hydroxyphenyl]propionate, dilauryl thiodipropionate and distearyl thiodipropionate. The above antioxidant has high compatibility with the reaction system of the present application, so that the composition has good antioxidant properties after molding.

[0076] Another embodiment of the present application also provides an application of the above composition, wherein the above composition is used for 405nm light-curing 3D printing to obtain a molded part. The intensity of the ultraviolet light can be set at 100-110W / cm 2, the UV curing time can be controlled within 10 minutes. For example, the P10d series 3D printer of Zhongshan Maixiang Technology Co., Ltd. can be used for printing the application.

[0077] When used, the other components of the above composition except the photoinitiator can be heated and mixed first, and the mixing temperature can be controlled at 3-100° C. Then, the photoinitiator is added to the mixed liquid and stirred evenly to form a photocurable printing liquid, and the photocurable printing liquid is introduced into the 3D printer for printing.

[0078] Specifically, in the specific embodiment, the general structure of the bismaleimide resin and the acrylic liquid crystal photosensitive resin is not changed, but the specific selection of the bismaleimide monomer, aromatic diamine monomer, and mesogenic monomer will lead to different group structures of R1, R2, and mesogenic unit. Therefore, the specific structure of the bismaleimide resin and the acrylic liquid crystal photosensitive resin is not repeated.

[0079] Embodiment 1:

[0080] A composition based on bismaleimide and acrylic liquid crystal photosensitive resin, the composition comprising by weight: 50 parts of bismaleimide-based resin; 10 parts of acrylic liquid crystal photosensitive resin; 10 parts of polyethylene glycol dimethacrylate resin; 5 parts of alkanediol diacrylate; 10 parts of carbon nanotubes; 10 parts of diluent; 5 parts of photoinitiator. The bismaleimide monomer of the bismaleimide-based resin is N, N'-1, 3-phenylene bismaleimide, so R1 is a phenyl group obtained by dehydrogenating the 1st and 3rd positions of the benzene ring. The aromatic diamine monomer of the bismaleimide-based resin is p-phenylenediamine, and R2 is a group of dehydrogenated positions 1 and 4 of the benzene ring. The monomer of the mesogen is 4, 4'-dihydroxyazobenzene, and the mesogen is a group of dehydrogenated positions 4 and 4' of azobenzene. The alkanediol diacrylate is 1,6-hexanediol ethoxy acid diacrylate (purchased from McLean, brand name 84170-27-4), the photoinitiator is 2,4,6-(trimethylbenzoyl) diphenylphosphine oxide (purchased from Aladdin Reagent (Shanghai) Co., Ltd.), and the diluent is an acrylate active diluent, specifically cyclotrimethylolpropane methyl acrylate (purchased from Sartomer's SR351). Among them, the polyethylene glycol dimethacrylate resin was purchased from Sartomer, brand name SR210. The carbon nanotubes in this embodiment and the following embodiments were purchased from Sigma-Aldrich (Shanghai) Co., Ltd., brand name 308068-56-6.

[0081] Embodiment 2:

[0082] The composition provided in this embodiment is different from the composition provided in Example 1 in that the composition includes 45 parts of bismaleimide resin composition and also includes 1 part of defoamer, 3 parts of leveling agent, and 1 part of antioxidant. The defoamer is a silicone defoamer (BYK-088 purchased from BYK Chemical Company of Germany), the leveling agent is an acrylic leveling agent (WE-D5510 purchased from Anhui Jiazhi Xinnuo Chemical Co., Ltd.), and the antioxidant is tetrakis[3-3',5'-di-tert-butyl-4'-hydroxyphenyl]propionate butyl pentaerythritol ester (antioxidant 1010 purchased from Shanghai Hongzuo Science and Trade Co., Ltd.).

[0083] Embodiment 3:

[0084] The present embodiment provides a composition based on bismaleimide and acrylic liquid crystal photosensitive resin, which comprises, by weight: 10 parts of bismaleimide-based resin; 50 parts of acrylic liquid crystal photosensitive resin; 5 parts of polyethylene glycol dimethacrylate resin; 5 parts of alkanediol diacrylate; 10 parts of carbon nanotubes; 10 parts of diluent; 5 parts of photoinitiator; 1 part of defoamer; 1 part of leveling agent, and 3 parts of antioxidant.

[0085] The bismaleimide monomer of the bismaleimide resin is 4,4'-diphenylmethane bismaleimide, so R1 is a group obtained by dehydrogenating the 4,4' positions of diphenylmethane. The aromatic diamine monomer of the bismaleimide resin is 4,4'-diaminodiphenylmethane, and R2 is a group obtained by dehydrogenating the 4,4' positions of diphenylmethane. The monomer of the mesogen is 3,3'-sulfonylbiphenol, and the mesogen is a group obtained by removing the hydroxyl group from the 3,3' positions of 3,3'-sulfonylbiphenol. The alkanediol diacrylate is dipropylene glycol diacrylate (purchased from McLean, brand name 57472-68-1), the photoinitiator is phenyl bis (2,4,6-trimethylbenzoyl) phosphine oxide (purchased from Aladdin Reagent (Shanghai) Co., Ltd.), the diluent is an acrylate active diluent, specifically cyclotrimethylolpropane formal acrylate (purchased from Sartomer SR351), the defoamer is a polyether defoamer (purchased from Guangdong Zhonglian Fine Chemical Co., Ltd. B-299), the leveling agent is an acrylate leveling agent (purchased from Qingtian New Materials DH-3170), and the antioxidant is dilauryl thiodipropionate (purchased from McLean, brand name 123-28-4). Example 4:

[0086] The composition provided in this embodiment is different from the composition provided in Example 3 in that the alkanediol diacrylate is tripropylene glycol diacrylate (purchased from Gaide Chemical Network, number 256-032-2), the aromatic diamine monomer is 4,4'-diaminodiphenyl ether, R2 is a dehydrogenated group at the 4,4' position of diphenyl ether, the mesogen monomer is 4,4'-sulfonyl biphenol, and the mesogen is a group after the two hydroxy groups of 4,4'-sulfonyl biphenol are removed. The antioxidant is distearyl thiodipropionate (antioxidant DSTP purchased from Gaide Chemical Network, brand 693-36-7).

[0087] Embodiment 5:

[0088] The composition provided in this embodiment is different from the composition provided in embodiment 4 in that the aromatic diamine monomer is 2,2'-dimethyl-4,4'-diaminobiphenyl, and R2 is a dehydrogenated group at the 4,4' position of 2,2'-dimethylbiphenyl.

[0089] Embodiment 6:

[0090] The composition provided in this embodiment is different from the composition provided in Example 3 in that the composition includes: 30 parts of bismaleimide resin; 20 parts of acrylic liquid crystal photosensitive resin; 5 parts of polyethylene glycol dimethacrylate resin; 5 parts of alkylene glycol diacrylate; 10 parts of carbon nanotubes; 15 parts of diluent; 5 parts of photoinitiator; 5 parts of defoaming agent; 4 parts of leveling agent, and 1 part of antioxidant.

[0091] Embodiment 7:

[0092] The composition provided in this embodiment is different from the composition provided in Example 3 in that the composition includes: 17 parts of bismaleimide resin; 18 parts of acrylic liquid crystal photosensitive resin; 20 parts of polyethylene glycol dimethacrylate resin; 20 parts of alkylene glycol diacrylate; 5 parts of carbon nanotubes; 5 parts of diluent; 5 parts of photoinitiator; 2 parts of defoaming agent; 3 parts of leveling agent, and 5 parts of antioxidant.

[0093] Comparative Example 1:

[0094] The difference between the composition provided in this comparative example and that in Example 3 is that no polyethylene glycol dimethacrylate resin is added in this comparative example.

[0095] Comparative Example 2:

[0096] The composition provided in this comparative example is different from that in Example 3 in that no alkanediol diacrylate is added in this comparative example.

[0097] Comparative Example 3:

[0098] The composition provided in this comparative example is different from that in Example 3 in that no carbon nanotubes are added in this comparative example.

[0099] This embodiment uses the following method to test the composition of the above embodiments and comparative forces by 405nm light curing 3D printing to obtain the object, and the 3D object used for testing can be a dumbbell bar or a square bar.

[0100] The hardness can be measured by a Shore hardness tester using the dynamic rebound measurement method. The tensile strength, elongation at break and flexural strength can be tested by a universal testing machine.

[0101] The test structures of the above embodiments and comparative examples are shown in the following table:

[0102]

[0103] From the test structure in the above table, it can be seen that the composition provided in this application is used for 405nm light-curing 3D printing to produce objects with good mechanical properties.

[0104] The above-mentioned embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A composition based on bismaleimide and acrylic liquid crystal photosensitive resin, characterized in that: By weight, the composition comprises: The structural formula of the bismaleimide resin is: Wherein R1 is selected from A type of dephenylenedihydro group; R2 is selected from A type of dephenylenedihydro group; The structural formula of the acrylic liquid crystal photosensitive resin is: Wherein, the mesogen is selected from: A type of dephenylenedihydro group.

2. The composition according to claim 1, characterized in that The alkanediol diacrylate includes one of 1,6-hexanediol ethoxylate diacrylate, dipropylene glycol diacrylate and tripropylene glycol diacrylate.

3. The composition according to claim 1, characterized in that The bismaleimide monomer of the bismaleimide-based resin is selected from one of N,N'-1,3-phenylene bismaleimide and 4,4'-diphenylmethane bismaleimide; The aromatic diamine monomer of the bismaleimide-based resin is selected from one of p-phenylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether or 2,2'-dimethyl-4,4'-diaminobiphenyl; The monomer of the mesogen is selected from 4,4'-dihydroxyazobenzene, 3,3'-sulfonyl biphenol or 4,4'-sulfonyl biphenol.

4. The composition according to claim 1, characterized in that The photoinitiator includes 2,4,6-(trimethylbenzoyl)diphenylphosphine oxide or phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide.

5. The composition according to claim 1, characterized in that The diluent is an acrylic ester active diluent.

6. The composition according to any one of claims 1 to 5, characterized in that Also includes: 1-5 parts of defoaming agent; 1-5 parts of leveling agent; 1-5 parts of antioxidants.

7. The composition according to claim 6, characterized in that The defoamer is selected from at least one of an organosilicon defoamer and a polyether defoamer.

8. The composition according to claim 6, characterized in that The leveling agent is selected from at least one of an acrylic leveling agent and an acrylate leveling agent.

9. The composition according to claim 6, characterized in that The antioxidant is selected from at least one of tetrakis[3-3',5'-di-tert-butyl-4'-hydroxyphenyl]propionate butylpentaerythritol, dilauryl thiodipropionate and distearyl thiodipropionate.

10. Use of the composition according to any one of claims 1 to 9, characterized in that: The composition is used for 405nm light-curing 3D printing to obtain a molded part.

Citation Information

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