Device for peeling substrate and PI film

Abstract

The present invention discloses a device for peeling a substrate and a PI film, and relates to the technical field of OLED display panel module manufacturing, wherein the device for peeling the substrate and the PI film comprises a vacuum adsorption table, a peeling mechanism and two flexible suction structures, the peeling mechanism comprises a base, a driving component, a first rotating shaft, a second rotating shaft, a first rotating wing and a second rotating wing, the first rotating shaft and the second rotating shaft are respectively rotatably connected to the base, the driving component is respectively driven and connected to the first rotating shaft and the second rotating shaft, the first side of the first rotating wing is connected to the first rotating shaft, and the first side of the second rotating wing is connected to the second rotating shaft, the two flexible suction structures are respectively arranged on the sides of the first rotating wing and the second rotating wing facing the vacuum adsorption table; the first rotating wing and the second rotating wing rotate in opposite directions to drive the substrate to be gradually peeled off from the PI film from the edges of the opposite sides to the middle; the technical solution provided by the present invention can improve the peeling yield of the substrate and the PI film.

Description

Technical Field

[0001] The present invention relates to the technical field of OLED display panel module manufacturing, and in particular to a device for peeling a substrate and a PI film. Background Art

[0002] In the AMOLED (active-matrix organic light-emitting diode) module manufacturing process, the LLO equipment (laser lift-off equipment) scans the interface between the glass substrate and the PI film with a line spot to destroy the chemical bond between the glass and the PI, performing a preliminary lift-off of the substrate and the PI film. The blade then separates the non-working areas of the substrate and the PI film, and the substrate and the PI film are then physically peeled off.

[0003] The current solution for peeling substrates and PI films on the market is that the PI film is adsorbed on a vacuum workbench, and the substrate is adsorbed by a group of vacuum suction cups installed on the same plane. Then the robot vertically lifts the suction cup group to peel the substrate and PI film. As the width of the glass substrate and PI film increases, the air cannot be filled in time during the peeling process, resulting in negative pressure between the PI film and the substrate, which increases the force on the PI film, making the PI film easily damaged and causing poor peeling. Summary of the Invention

[0004] The main purpose of the present invention is to provide a device for peeling a substrate and a PI film, aiming to improve the peeling yield of the substrate and the PI film.

[0005] To achieve the above-mentioned purpose, the present invention provides a device for peeling a substrate and a PI film, comprising:

[0006] A vacuum adsorption table, wherein the vacuum adsorption table is used to adsorb the PI film;

[0007] A peeling mechanism, the peeling mechanism comprising a base, a driving assembly, a first rotating shaft, a second rotating shaft, a first rotating wing, and a second rotating wing, the first rotating shaft and the second rotating shaft being rotatably connected to the base respectively, the first rotating shaft being located in the length direction of the second rotating shaft, the driving assembly being drivingly connected to the first rotating shaft and the second rotating shaft respectively, the first rotating shaft and the second rotating shaft rotating in opposite directions, a first side of the first rotating wing being connected to the first rotating shaft, and a first side of the second rotating wing being connected to the second rotating shaft, so as to drive the first rotating wing and the second rotating wing to rotate in opposite directions; and

[0008] Two flexible suction structures, the two flexible suction structures are respectively provided on the sides of the first rotating wing and the second rotating wing facing the vacuum adsorption platform, the flexible suction structures are used to adsorb the substrate provided on the PI film;

[0009] The first rotating wing and the second rotating wing rotate in opposite directions to drive the substrate to be gradually peeled off from the PI film from the edges on opposite sides to the middle.

[0010] Optionally, the drive assembly includes a rotating motor, an output bevel gear, a first input bevel gear and a second input bevel gear, the first input bevel gear is arranged at the end of the first rotating shaft close to the second rotating shaft, the second input bevel gear is arranged at the end of the second rotating shaft close to the first rotating shaft, the rotating motor is drivingly connected to the output bevel gear, and the opposite sides of the output bevel gear are respectively engaged with the first input bevel gear and the second input bevel gear.

[0011] Optionally, the drive assembly further includes a reducer, and the rotary motor is drivingly connected to the output bevel gear via the reducer.

[0012] Optionally, a first linkage portion and a first support portion are provided on the first side of the first rotating wing, the first linkage portion is connected to the first rotating shaft, and the first support portion is rotatably connected to the second rotating shaft;

[0013] A second linkage portion and a second support portion are provided on a first side of the second rotating wing. The second linkage portion is connected to the second rotating shaft, and the second support portion is rotatably connected to the first rotating shaft.

[0014] Optionally, the end of the first rotating shaft away from the second rotating shaft is provided with a first mounting end protruding from the base, the first linkage portion is connected to the first mounting end, and the second supporting portion is rotatably connected to the first mounting end;

[0015] The end of the second rotating shaft away from the first rotating shaft is provided with a second mounting end protruding from the base, the second linkage portion is connected to the second mounting end, and the first supporting portion is rotatably connected to the second mounting end.

[0016] Optionally, the first rotating shaft is rotatably connected to the base via a bearing; and / or

[0017] The second rotating shaft is rotatably connected to the base via a bearing; and / or

[0018] The second support portion is rotatably connected to the first mounting end via a bearing; and / or

[0019] The first support portion is rotatably connected to the second mounting end via a bearing.

[0020] Optionally, the stripping device further includes a vertical motion component, which is drivingly connected to the base to drive the base to move in a vertical direction.

[0021] Optionally, the peeling device for the substrate and the PI film further includes a frame, the vertical motion component includes a drive motor, the drive motor is arranged on the frame, the base is slidably connected to the frame, and the drive motor is drive-connected to the base.

[0022] Optionally, the first rotating wing and the second rotating wing are plate-shaped, and the first rotating wing and the second rotating wing are provided with a plurality of weight-reducing holes.

[0023] Optionally, each of the flexible suction structures includes a plurality of suction cups, and the plurality of suction cups are arranged in an array.

[0024] The technical solution of the present invention adopts a vacuum adsorption table to adsorb the PI film, and a flexible suction structure adsorbs and fixes the substrate on the first rotating wing and the second rotating wing, and then drives the first rotating shaft and the second rotating shaft to rotate in opposite directions through the driving component, thereby driving the first rotating wing connected to the first rotating shaft and the second rotating wing connected to the second rotating shaft to rotate in opposite directions; since the first rotating shaft and the second rotating shaft rotate in opposite directions, and the first rotating shaft is located in the length direction of the second rotating shaft, therefore, when the first rotating wing and the second rotating wing rotate, the swing amplitude of the side where the first rotating wing and the second rotating wing are away from each other is greater than the side where they are close to each other, so that the first rotating wing and the second rotating wing respectively drive the edges of the opposite sides of the substrate to start peeling off from the PI film, and as the first rotating shaft and the second rotating shaft gradually rotate, the swing amplitude of the first rotating wing and the second rotating wing also gradually increases, so that the peeling interface between the substrate and the PI film gradually spreads from the edge to the center, and finally the substrate and the PI film are peeled off. Because the peeling process between the substrate and the PI film is gradual, air can be promptly filled between the substrate and the PI film during the peeling process, maintaining a constant positive pressure between the PI film and the substrate, preventing the formation of a vacuum. This reduces the force exerted on the PI film, thereby reducing the peeling force between the substrate and the PI film, thereby reducing the chance of PI film damage and improving the peeling yield. Secondly, this solution utilizes the first and second rotating wings to simultaneously peel the substrate and PI film from opposite sides of the substrate, which helps improve the peeling efficiency of the substrate and PI film. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0026] Figure 1 A schematic structural diagram of a first perspective of an embodiment of a device for peeling a substrate and a PI film provided by the present invention;

[0027] Figure 2 for Figure 1 A partial enlarged view of point A in the middle;

[0028] Figure 3 A schematic structural diagram of the second viewing angle of the device for peeling a substrate and a PI film provided by the present invention;

[0029] Figure 4 This is a schematic diagram of the partial structure of the device for peeling a substrate and a PI film provided by the present invention.

[0030] Description of Figure Numbers:

[0031] 100. Vacuum adsorption table; 200. Peeling mechanism; 210. Base; 211. Slide; 220. Drive assembly; 221. Rotating motor; 222. Output bevel gear; 223. First input bevel gear; 224. Second input bevel gear; 225. Reducer; 230. First rotating shaft; 240. Second rotating shaft; 241. Second mounting end; 250. First rotating wing; 251. First supporting part; 260. Second rotating wing; 261. Second linkage part; 300. Suction cup; 400. Vertical motion assembly; 410. Drive motor; 420. Slider; 430. Guide rail; 500. Frame; 600. Substrate; 700. PI film.

[0032] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0034] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0035] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0036] The current solution for peeling off the substrate 600 and the PI film 700 on the market is that the PI film 700 side is adsorbed on the vacuum workbench, and the substrate 600 is adsorbed by a group of vacuum suction cups 300 installed on the same plane. Then the robot vertically lifts the suction cups 300 group to peel off the substrate 600 and the PI film 700. As the formats of the glass substrate 600 and the PI film 700 increase, the air cannot be filled in time during the peeling process, resulting in negative pressure between the PI film 700 and the substrate 600, which increases the force on the PI film 700 and causes poor peeling.

[0037] The present invention provides a device for peeling a substrate and a PI film.

[0038] The device for peeling the substrate and the PI film relates to the technical field of OLED (organic laser display, organic light-emitting semiconductor) display panel module manufacturing. Figure 1 and Figure 3In one embodiment of the present invention, the peeling device for the substrate and the PI film includes a vacuum adsorption table 100, a peeling mechanism 200 and two flexible suction structures. The vacuum adsorption table 100 is used to adsorb the PI film 700; the peeling mechanism 200 includes a base 210, a driving component 220, a first rotating shaft 230, a second rotating shaft 240, a first rotating wing 250 and a second rotating wing 260. The first rotating shaft 230 and the second rotating shaft 240 are respectively rotatably connected to the base 210, and the first rotating shaft 230 is located in the length direction of the second rotating shaft 240. The driving component 220 is driven and connected to the first rotating shaft 230 and the second rotating shaft 240 respectively. The two rotating shafts 240 rotate in opposite directions. The first side of the first rotating wing 250 is connected to the first rotating shaft 230, and the first side of the second rotating wing 260 is connected to the second rotating shaft 240, so as to drive the first rotating wing 250 and the second rotating wing 260 to rotate in opposite directions. Two flexible suction structures are respectively provided on the sides of the first rotating wing 250 and the second rotating wing 260 facing the vacuum adsorption table 100. The flexible suction structures are used to adsorb the substrate 600 placed on the PI film 700. The first rotating wing 250 and the second rotating wing 260 rotate in opposite directions to drive the substrate 600 to be gradually peeled off from the PI film 700 from the edges of the opposite sides to the middle.

[0039] The technical solution of the present invention adopts a vacuum adsorption table 100 to adsorb the PI film 700, and the flexible suction structure adsorbs and fixes the substrate 600 on the first rotating wing 250 and the second rotating wing 260, and then drives the first rotating shaft 230 and the second rotating shaft 240 to rotate in opposite directions through the driving component 220, thereby driving the first rotating wing 250 connected to the first rotating shaft 230 and the second rotating wing 260 connected to the second rotating shaft 240 to rotate in opposite directions; since the first rotating shaft 230 and the second rotating shaft 240 rotate in opposite directions, and the first rotating shaft 230 is located in the length direction of the second rotating shaft 240, When the first rotating wing 250 and the second rotating wing 260 rotate, the swing amplitude of the side of the first rotating wing 250 and the second rotating wing 260 that is away from each other is greater than the side that is close to each other, so that the first rotating wing 250 and the second rotating wing 260 respectively drive the edges of the opposite sides of the substrate 600 to start peeling off the PI film 700. As the first rotating shaft 230 and the second rotating shaft 240 gradually rotate, the swing amplitude of the first rotating wing 250 and the second rotating wing 260 also gradually increases, so that the peeling interface between the substrate 600 and the PI film 700 gradually spreads from the edge to the center, and finally the substrate 600 and the PI film 700 are peeled off. Since the peeling process of the substrate 600 and the PI film 700 is gradually diffused, the air can be filled in between the substrate 600 and the PI film 700 in time during the peeling process, so that the positive pressure is always maintained between the PI film 700 and the substrate 600, and no vacuum is formed, which reduces the force on the PI film 700, thereby reducing the peeling force between the substrate 600 and the PI film 700, thereby reducing the chance of damage to the PI film 700 and improving the peeling yield.

[0040] Secondly, this solution utilizes the first rotating wing 250 and the second rotating wing 260 to simultaneously peel off the substrate 600 and the PI film 700 from opposite sides of the substrate 600 , which is beneficial to improving the peeling efficiency of the substrate 600 and the PI film 700 .

[0041] It should be noted that the substrate 600 of this solution is a glass substrate. Before the substrate 600 and the PI film 700 are peeled off, the PI film 700 is vacuum-adsorbed by the vacuum adsorption table 100, the first rotating wing 250 and the second rotating wing 260 are in a horizontal state, and the flexible suction structure vertically adsorbs the substrate 600 downward, and the flexible suction structure is slightly compressed. After the vacuum of the flexible suction structure is established, the driving component 220 drives the first rotating wing 250 and the second rotating wing 260 to rotate upward. The swing distance of the edges of the first rotating wing 250 and the second rotating wing 260 is large, and the substrate 600 and the PI film 700 are first peeled off at the edge. As the rotation amplitude of the first rotating shaft 230 and the second rotating shaft 240 increases, the peeling interface gradually moves toward the middle until the substrate 600 and the PI film 700 are finally peeled off under the flexible suction structure close to the first rotating shaft 230 and the second rotating shaft 240.

[0042] Reference Figure 2 and Figure 4 Optionally, the driving assembly 220 includes a rotating motor 221, an output bevel gear 222, a first input bevel gear 223, and a second input bevel gear 224. The first input bevel gear 223 is provided at the end of the first rotating shaft 230 close to the second rotating shaft 240, and the second input bevel gear 224 is provided at the end of the second rotating shaft 240 close to the first rotating shaft 230. The rotating motor 221 is driven and connected to the output bevel gear 222. The opposite sides of the output bevel gear 222 are respectively engaged with the first input bevel gear 223 and the second input bevel gear 224. It can be understood that this solution utilizes the output bevel gear 222. The output bevel gear 222 is meshed with the first input bevel gear 223 and the second input bevel gear 224 to realize transmission between the rotating motor 221 and the first rotating shaft 230 and the second rotating shaft 240. Such a transmission structure is compact, which can reduce the linkage space between the rotating motor 221 and the first rotating shaft 230, and the rotating motor 221 and the second rotating shaft 240, making the structure of the drive assembly more compact. Moreover, the transmission is realized by the output bevel gear 222 being meshed with the first input bevel gear 223 and the second input bevel gear 224 to realize transmission. The transmission is smooth and the reliability of the drive assembly 220 can be increased. Of course, the present invention is not limited to this. In other embodiments, the drive assembly 220 can also include a transmission gear plate, a first bevel gear and a second bevel gear. The first bevel gear is provided at the end of the first rotating shaft 230 near the second rotating shaft 240, and the second bevel gear is provided at the end of the second rotating shaft 240 near the first rotating shaft 230. The rotating motor 221 is drivingly connected to the transmission gear plate. The side of the transmission gear plate is provided with a transmission tooth portion, and the opposite sides of the transmission tooth portion are respectively meshed with the first bevel gear and the second bevel gear.

[0043] Furthermore, the drive assembly 220 also includes a reducer 225, through which the rotary motor 221 is driven and connected to the output bevel gear 222. This is because the reducer 225 can not only amplify the output torque of the rotary motor 221 and reduce the load-inertia ratio of the rotary motor 221, but also play a role in speed regulation, preventing the rotation speed of the first rotating wing 250 and the second rotating wing 260 from being too high, thereby causing the air to be unable to be filled between the substrate 600 and the PI film 700 in time during the peeling process, resulting in a negative pressure being formed between the PI film 700 and the substrate 600, increasing the stress on the PI film 700 and causing poor peeling. Secondly, the reducer 225 can also protect the rotary motor 221. The reducer 225 can withstand a large torque and will be damaged first when the load is too large, protecting the rotary motor 221 from damage, thereby improving the service life of the motor. Furthermore, the reducer 225 can reduce energy consumption, avoid overheating and damage to the rotary motor 221, and improve energy utilization. Of course, the present invention is not limited thereto. In other embodiments, the driving assembly 220 may not include the reducer 225 , and directly drive the output bevel gear 222 through the rotating motor 221 , thereby driving the first input bevel gear 223 and the second input bevel gear 224 to rotate.

[0044] A first linkage portion and a first support portion 251 are provided on a first side of the first rotating wing 250. The first linkage portion is connected to the first rotating shaft 230, and the first support portion 251 is rotatably connected to the second rotating shaft 240. A second linkage portion 261 and a second support portion are provided on a first side of the second rotating wing 260. The second linkage portion 261 is connected to the second rotating shaft 240, and the second support portion is rotatably connected to the first rotating shaft 230. This ensures that the first rotating wing 250 and the second rotating wing 260 do not interfere with each other's rotation. At the same time, the first support portion 251 and the second support portion respectively provide a certain supporting force to the first rotating wing 250 and the second rotating wing 260, making the rotation of the first rotating wing 250 and the second rotating wing 260 more stable. Of course, the present invention is not limited to this. In some other embodiments, the first side of the first rotating wing 250 may also be provided with a first linkage portion and a first support portion 251, the first linkage portion is connected to the first rotating shaft 230, and the first support portion 251 may also be rotatably connected to the base 210. The first side of the second rotating wing 260 may also be provided with a second linkage portion 261 and a second support portion, the second linkage portion 261 is connected to the second rotating shaft 240, and the second support portion is rotatably connected to the base 210.

[0045] Furthermore, the end of the first rotating shaft 230 away from the second rotating shaft 240 is provided with a first mounting end protruding from the base 210, the first linkage portion is connected to the first mounting end, and the second support portion is rotatably connected to the first mounting end; the end of the second rotating shaft 240 away from the first rotating shaft 230 is provided with a second mounting end 241 protruding from the base 210, the second linkage portion 261 is connected to the second mounting end 241, and the first support portion 251 is rotatably connected to the second mounting end 241. It can be understood that since the first mounting end and the second mounting end 241 protrude from the base 210, during the process of connecting the first linkage portion to the first mounting end, the second support portion to the first mounting end, the second linkage portion 261 to the second mounting end 241, and the first support portion 251 to the second mounting end 241 being rotatably connected, the interference of the base 210 on the connection process can be reduced, thereby making the operation space of the installation process larger, more convenient to operate, and conducive to improving installation efficiency. Of course, the present invention is not limited to this. In some other embodiments, the first mounting end and the second mounting end 241 may not be provided, and the first linkage part may be directly connected to the first rotating shaft 230 provided under the base 210, the second linkage part 261 may be directly connected to the second rotating shaft 240 provided under the base 210, the second support part may be directly rotationally connected to the first rotating shaft 230 provided under the base 210, and the first support part 251 may be directly rotationally connected to the first rotating shaft 230 provided under the base 210.

[0046] Furthermore, a third linkage portion is provided between the first linkage portion and the first support portion 251, and the third linkage portion is connected to the first rotating shaft 230. A fourth linkage portion is provided between the second linkage portion 261 and the second support portion, and the fourth linkage portion is connected to the second rotating shaft 240. This can increase the stability of the installation of the first rotating wing 250 and the second rotating wing 260.

[0047] Optionally, the first rotating shaft 230 is rotatably connected to the base 210 via a bearing; and / or the second rotating shaft 240 is rotatably connected to the base 210 via a bearing; and / or the second support portion is rotatably connected to the first mounting end via a bearing; and / or the first support portion 251 is rotatably connected to the second mounting end 241 via a bearing. Specifically, in this embodiment, all rotational connections are achieved using bearings. This is because bearings offer low friction and power consumption, resulting in smoother rotation and improved mechanical efficiency. Furthermore, bearings are wear-resistant and have a long service life, which can extend the service life of the rotational connection and, consequently, the service life of the device for separating the substrate and the PI film. Furthermore, the bearings are easy to install and maintain, with a simple structure, making installation and maintenance relatively simple, thus helping to reduce downtime required for maintenance of the device for separating the substrate and the PI film. More importantly, the bearings produce less operating noise and vibration, which helps reduce noise levels in the device for separating the substrate and the PI film. Of course, the present invention is not limited to this embodiment; in other embodiments, rotation can also be achieved through the mating structure of a rotating shaft and a rotating hole.

[0048] Furthermore, the peeling device for the substrate and the PI film further includes a vertical motion component 400, which is driven by the base 210 to drive the base 210 to move in the vertical direction. It can be understood that the vertical motion component 400 can drive the base 210 to move in the direction close to or away from the vacuum adsorption table 100, so that when the peeling position of the substrate 600 and the PI film 700 is close to the first rotating shaft 230 and the second rotating shaft 240, the vertical motion component 400 is driven to move in the direction away from the vacuum adsorption table 100. On the one hand, the vertical motion component 400 is located at the first rotating shaft 230 and the second rotating shaft 240. The distance between the substrate 600 and the PI film 700 on the lower side of 40 and the first rotating shaft 230 and the second rotating shaft 240 is relatively close, and the first rotating wing 250 and the second rotating wing 260 are difficult to drive the substrate 600 and the PI film 700 to be peeled off. The vertical motion component 400 is driven to drive the base 210 to move away from the vacuum adsorption table 100, thereby driving the first rotating wing 250 and the second rotating wing 260 to move away from the vacuum adsorption table 100, and then driving the substrate 600 to move away from the vacuum adsorption table 100, thereby improving the effect of peeling the substrate 600 and the PI film 700.

[0049] Optionally, the peeling device for the substrate and the PI film also includes a frame 500, and the vertical motion component 400 includes a drive motor 410, which is arranged on the frame 500, and the base 210 is slidingly connected to the frame 500, and the drive motor 410 is drivingly connected to the base 210. Such a vertical motion component 400 has a simple structure, is easy to assemble, and is easy to purchase, and is easy to promote and apply.

[0050] The vertical motion assembly 400 may also include a rotary motor, a screw and a frame 500. The rotary motor is arranged on the frame 500 and is driven by the screw. The frame 500 is slidingly connected to the screw through a nut seat. The rotary motor drives the screw to rotate, thereby driving the base 210 to move toward or away from the vacuum adsorption table 100.

[0051] Among them, a slide 211 is provided on the base 210, and the slide 211 is connected to the frame 500 through a slider 420 and a guide rail 430. The drive motor 410 drives the slide 211 to move upward through a four-cylinder transmission mechanism until the substrate 600 and the PI film 700 are completely peeled off.

[0052] The first and second rotating wings 250 and 260 are plate-shaped and are provided with a plurality of weight-reducing holes. This can reduce the weight of the first and second rotating wings 250 and 260, thereby reducing the driving force of the rotating motor 221 and reducing energy consumption.

[0053] Each flexible suction structure includes a plurality of suction cups 300 , which are arranged in an array. The arrangement of the plurality of suction cups 300 can improve the stability of the substrate 600 being fixed to the first rotating wing 250 and the second rotating wing 260 .

[0054] Furthermore, the flexible suction structure is provided with a suction cup 300 at least corresponding to a corner of the substrate 600. The flexible suction structure is provided with a plurality of suction cups 300 corresponding to each edge of the substrate 600.

[0055] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformation made by utilizing the contents of the present invention's description and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A device for peeling a substrate and a PI film, characterized in that: include: A vacuum adsorption table, wherein the vacuum adsorption table is used to adsorb the PI film; A peeling mechanism, the peeling mechanism comprising a base, a driving assembly, a first rotating shaft, a second rotating shaft, a first rotating wing, and a second rotating wing, the first rotating shaft and the second rotating shaft being rotatably connected to the base respectively, the first rotating shaft being located in the longitudinal direction of the second rotating shaft, the driving assembly being drivably connected to the first rotating shaft and the second rotating shaft respectively, the first rotating shaft and the second rotating shaft rotating in opposite directions, a first side of the first rotating wing being connected to the first rotating shaft, and a first side of the second rotating wing being connected to the second rotating shaft, so as to drive the first rotating wing and the second rotating wing to rotate in opposite directions; and Two flexible suction structures, the two flexible suction structures are respectively provided on the sides of the first rotating wing and the second rotating wing facing the vacuum adsorption platform, the flexible suction structures are used to adsorb the substrate provided on the PI film; The first rotating wing and the second rotating wing rotate in opposite directions to drive the substrate to be gradually peeled off from the PI film from the edges on opposite sides to the middle.

2. The device for peeling a substrate and a PI film according to claim 1, wherein: The drive assembly includes a rotating motor, an output bevel gear, a first input bevel gear and a second input bevel gear. The first input bevel gear is arranged at the end of the first rotating shaft close to the second rotating shaft, and the second input bevel gear is arranged at the end of the second rotating shaft close to the first rotating shaft. The rotating motor is drivingly connected to the output bevel gear, and opposite sides of the output bevel gear are respectively engaged with the first input bevel gear and the second input bevel gear.

3. The device for peeling a substrate and a PI film according to claim 2, wherein: The driving assembly further includes a reducer, and the rotating motor is drivingly connected to the output bevel gear via the reducer.

4. The device for peeling a substrate and a PI film according to claim 1, wherein: A first linkage portion and a first support portion are provided on a first side of the first rotating wing, wherein the first linkage portion is connected to the first rotating shaft, and the first support portion is rotatably connected to the second rotating shaft; A second linkage portion and a second support portion are provided on a first side of the second rotating wing. The second linkage portion is connected to the second rotating shaft, and the second support portion is rotatably connected to the first rotating shaft.

5. The device for peeling a substrate and a PI film according to claim 4, wherein: The end of the first rotating shaft away from the second rotating shaft is provided with a first mounting end protruding from the base, the first linkage portion is connected to the first mounting end, and the second supporting portion is rotatably connected to the first mounting end; The end of the second rotating shaft away from the first rotating shaft is provided with a second mounting end protruding from the base, the second linkage portion is connected to the second mounting end, and the first supporting portion is rotatably connected to the second mounting end.

6. The device for peeling a substrate and a PI film according to claim 5, wherein: The first rotating shaft is rotatably connected to the base via a bearing; and / or The second rotating shaft is rotatably connected to the base via a bearing; and / or The second support portion is rotatably connected to the first mounting end via a bearing; and / or The first support portion is rotatably connected to the second mounting end via a bearing.

7. The device for peeling a substrate and a PI film according to claim 1, wherein: The device for peeling the substrate and the PI film further includes a vertical motion component, which is drivingly connected to the base to drive the base to move in a vertical direction.

8. The device for peeling a substrate and a PI film according to claim 7, wherein: The device for peeling the substrate and the PI film also includes a frame, the vertical motion component includes a drive motor, the drive motor is arranged on the frame, the base is slidably connected to the frame, and the drive motor is drive-connected to the base.

9. The device for peeling a substrate and a PI film according to any one of claims 1 to 8, wherein: The first rotating wing and the second rotating wing are plate-shaped, and are provided with a plurality of weight-reducing holes.

10. The device for peeling a substrate and a PI film according to any one of claims 1 to 8, wherein: Each of the flexible suction structures includes a plurality of suction cups, and the plurality of suction cups are arranged in an array.

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