3D integrated imaging device and method of making the same

Abstract

The application relates to the printing technical field, and particularly discloses a 3D integrated imaging device and a preparation method thereof. The 3D integrated imaging device comprises a stereoscopic structure layer, a spacing layer and a microlens array. The spacing layer has a preset thickness. The stereoscopic structure layer is arranged on one side surface of the spacing layer. The stereoscopic structure layer comprises a plurality of micro-nano structure units. The microlens array is arranged on the side surface of the spacing layer away from the stereoscopic structure layer. The microlens array comprises a plurality of microlenses. The micro-nano structure units correspond to the microlenses one by one. The front view pattern of the micro-nano structure units is the superposition of images of each layer of images after a target stereoscopic image is layered, and each layer of images is imaged under the microlenses according to different depths of field. The thickness of the spacing layer can be controlled to control the distance between the vertex of the microlens array and the stereoscopic structure layer, and then the depth of field of the image can be controlled, so that the function of adjusting the depth of field of the reproduced image is achieved.

Description

Technical Field

[0001] This application relates to the field of printing technology, and in particular to a 3D integrated imaging device and its preparation method. Background Technology

[0002] Because there is a certain distance between the human eyes, and a certain angle is formed between the left and right eyes and the object, subtle differences occur in how the objects are seen by the left and right eyes, creating parallax. This parallax is reflected in the brain, producing a sense of spatial depth. The naked-eye 3D display effect based on microlens arrays is the result of the optical effects between the microlens array and the microimage array, combined with the combined effect of binocular vision. When the microlens array and the microimage array are superimposed, based on the principle of binocular parallax, the observer can directly see 3D images with the naked eye. However, currently, the image reproduction effect of naked-eye 3D displays based on microlens arrays is generally poor. Summary of the Invention

[0003] Therefore, it is necessary to provide a 3D integrated imaging device and its fabrication method to address the above problems.

[0004] According to a first aspect of the embodiments of this application, a 3D integrated imaging device is provided, comprising:

[0005] The spacer layer has a preset thickness;

[0006] A three-dimensional structure layer is disposed on one side surface of the spacer layer, and the three-dimensional structure layer includes a plurality of micro-nano structure units;

[0007] A microlens array is disposed on the side surface of the spacer layer away from the three-dimensional structure layer, and the microlens array includes a plurality of microlenses;

[0008] The micro-nano structure unit corresponds one-to-one with the microlens. The front view of the micro-nano structure unit is a superposition of images formed by layering the target stereoscopic image and imaging each layer under the microlens according to different depths of field.

[0009] In one embodiment, the spacer layer is made of a light-transmitting material, and the material of the spacer layer is the same as that of the microlens array layer.

[0010] In one embodiment, a reflective material layer is disposed on the side of the microlens array away from the spacer layer.

[0011] In one embodiment, the sum of the thickness of the spacer layer and the thickness of the microlens is greater than the focal length of the microlens.

[0012] In one embodiment, the preset thickness is between 1 micrometer and 200 micrometers.

[0013] In one embodiment, the microlens array includes an array of plano-convex lenses, wherein the plano-convex lenses are arranged in an orthogonal or honeycomb arrangement.

[0014] In one embodiment, the relationship between the pixel coordinates of the layered target stereoscopic image under a single microlens in a three-dimensional coordinate system and the pixel coordinates in the stereoscopic structure layer is as follows:

[0015]

[0016]

[0017] Where (X, Y) are the pixel coordinates of the layered image in the three-dimensional coordinate system, (X0, Y0) are the center coordinates of the microlens, (x, y) are the coordinates of each pixel on the micro / nano structure unit, (x0, y0) are the center coordinates of the micro / nano structure unit, n is the refractive index of the microlens, g is the thickness of the spacer layer plus the height of the microlens in the microlens array, and d is the depth of field, which is the distance from the plane of the layered image to the vertex of the microlens.

[0018] According to a second aspect of the embodiments of this application, a method for fabricating a 3D integrated imaging device is provided, comprising:

[0019] Simulate the formation of a three-dimensional coordinate system;

[0020] Convert the pixel coordinates of the three-dimensional target object in the three-dimensional coordinate system into pixel coordinates on the recording plane;

[0021] A three-dimensional structure layer is formed on one side surface of the substrate according to the pixel coordinates on the recording plane;

[0022] A spacer layer is provided on the surface of the three-dimensional structure layer away from the substrate;

[0023] A microlens array is disposed on the side surface of the spacer layer away from the three-dimensional structure layer.

[0024] In one embodiment, the step of converting the pixel coordinates of the three-dimensional target object in the three-dimensional coordinate system to pixel coordinates on the recording plane includes:

[0025] The three-dimensional target object is layered to form a plurality of planar images;

[0026] Different depth-of-field values ​​are set for different planar objects;

[0027] Based on the depth of field of the plane where each image is located and the parameters of the microlens array, the pixel coordinates of each image in the three-dimensional coordinate system are converted into pixel coordinates on the recording plane.

[0028] In one embodiment, when setting the depth of field value, a reference value d0 for calculating the depth of field is also included, where d0 is represented by the following formula:

[0029]

[0030] Where d0 is the reference value for depth of field, P1 is the period of the microlens, f is the focal length of the microlens, and P p To record the resolution of pixels on the plane, n is the number of pixels in the microlens;

[0031] After the step of converting the coordinates of the three-dimensional target object in the three-dimensional coordinate system to coordinates on the recording plane, the preparation method further includes:

[0032] The coordinates on the recording plane are adjusted using the following mapping relationship:

[0033]

[0034] in, To adjust the coordinates of the (s', t')th pixel in the recording plane corresponding to the (i', j')th microlens, The coordinates of the (s, t)th pixel in the recording plane corresponding to the (i, j)th microlens before adjustment are given, where k is a constant and n is the number of pixels corresponding to a single microlens.

[0035] In one embodiment, the step of forming a three-dimensional structure layer on one side surface of the substrate according to pixel coordinates on the recording plane includes:

[0036] Based on the pixel coordinates on the recording plane, a plurality of micro / nano structure units are formed on one side of the substrate surface;

[0037] Coloring materials are filled into the surface of a substrate with multiple micro / nano structural units.

[0038] In one embodiment, after the step of forming a three-dimensional structural layer on one side surface of the substrate according to pixel coordinates on the recording plane, the method further includes: peeling off the substrate.

[0039] The fabrication method of the 3D integrated imaging device provided in this embodiment first simulates a three-dimensional coordinate system, then converts the pixel coordinates of the three-dimensional target object to be reproduced in the three-dimensional coordinate system into pixel coordinates on the recording plane, and then forms a three-dimensional structure layer with a three-dimensional pattern of light and dark contrast on one side surface of the substrate according to the pixel coordinates on the recording plane. In addition, a spacer layer and a microlens array are sequentially set on the three-dimensional structure layer. By cooperating with the three-dimensional structure layer and the microlens array, a 3D image can be observed at the corresponding observation position. By controlling the thickness of the spacer layer, the distance between the vertex of the microlens array and the three-dimensional structure layer can be controlled, thereby controlling the depth of field of the image, and has the function of adjusting the depth of field effect of the reproduced image. Attached Figure Description

[0040] Figure 1 This is a schematic diagram of the structure of a 3D integrated imaging device provided in an embodiment of this application;

[0041] Figure 2 This is a schematic diagram of the structure of a 3D integrated imaging device provided in another embodiment of this application;

[0042] Figure 3 This is a schematic diagram of an imaging device for a 3D integrated imaging apparatus provided in an embodiment of this application;

[0043] Figure 4 This is a schematic diagram of the structure of a 3D integrated imaging device provided in another embodiment of this application;

[0044] Figure 5 A flowchart illustrating a method for fabricating a 3D integrated imaging device according to an embodiment of this application;

[0045] Figure 6 A schematic diagram of recording and reproducing an image using a single microlens;

[0046] Figure 7 and Figure 8 This is a schematic diagram of recording an image using a microlens array.

[0047] Explanation of reference numerals in the attached figures:

[0048] 100, Substrate; 200, Three-dimensional structural layer; 210, Micro / nano structural unit; 300, Spacer layer; 400, Microlens array; 500, Recording plane; 600, Reflective material layer. Detailed Implementation

[0049] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0051] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0053] In one embodiment, refer to Figure 1A 3D integrated imaging device is provided, comprising a stereoscopic structure layer 200, a spacer layer 300, and a microlens array 400. The spacer layer 300 has a predetermined thickness. The stereoscopic structure layer 200 is disposed on one side surface of the spacer layer 300 and includes a plurality of micro / nanostructure units 210. The microlens array 400 is disposed on the side surface of the spacer layer 300 away from the stereoscopic structure layer 200 and includes a plurality of microlenses. Each micro / nanostructure unit 210 corresponds to one microlens. The front view of the micro / nanostructure unit 210 represents the superposition of images formed by layering a target stereoscopic image, with each layer imaged under the microlenses according to different depths of field. In other words, the microlens array 400 and the stereoscopic structure layer 200 work together to present a stereoscopic display effect. Under the influence of light, an observer at the observation position can observe a 3D reconstructed image of the pattern in the three-dimensional structure layer 200 after passing through the microlens array 400. Furthermore, by controlling the thickness of the spacer layer 300, the distance between the vertices of the microlens array 400 and the three-dimensional structure layer 200 can be controlled, thereby controlling the depth of field of the reconstructed image and providing the function of adjusting the depth of field effect of the reconstructed image. The greater the thickness of the spacer layer 300, the smaller the depth of field of the reconstructed image; conversely, the smaller the thickness of the spacer layer 300, the greater the depth of field of the reconstructed image.

[0054] In practical applications, the thickness of the spacer layer 300 can be set according to actual needs. In one embodiment, the preset thickness of the spacer layer 300 can be set between 1 micrometer and 200 micrometers, such as 1 micrometer, 20 micrometers, 50 micrometers, or 200 micrometers, depending on the actual depth-of-field display effect.

[0055] In this embodiment, the sum of the thickness of the spacer layer 300 and the thickness of the microlens is greater than the focal length of the microlens, thereby ensuring the reproduction of the image. Specifically, the thickness of the spacer layer 300 can be set according to imaging requirements so that the sum of the thicknesses of the spacer layer 300 and the microlens meets certain conditions with the focal length of the microlens, thereby presenting the desired display effect. When the sum of the thicknesses of the spacer layer 300 and the microlens is greater than one focal length of the microlens but less than two focal lengths, a virtual image is formed; when the sum of the thicknesses of the spacer layer 300 and the microlens is greater than two focal lengths, a real image is formed.

[0056] The spacer layer 300 can be made of a light-transmitting material, such as a transparent film like a PET film. In this embodiment, the material of the spacer layer 300 can be the same as that of the microlens array layer 400.

[0057] The 3D integrated imaging device provided in this embodiment can be either transmissive or reflective. (Refer to...) Figures 2-4 The surface of the three-dimensional structural layer 200 away from the spacer layer 300 may have a substrate 100, as shown in the reference. Figure 2 and Figure 3When it is a transmissive type, the substrate 100 can be made of a light-transmitting material, which may include materials such as UV adhesive. The observer can observe the stereoscopic image from either the substrate 100 side or the microlens array 400 side (only the observation position shown in the figure is the microlens array 400 side), achieving a transmissive 3D effect. (Refer to...) Figure 4 When it is a reflective type, the substrate 100 can be made of an opaque material, and a reflective material layer 600 is provided on the side of the microlens array 400 away from the spacer layer 300. The reflective material layer 600 can be plated with aluminum. The observer can observe the stereoscopic image on the side of the substrate 100 to achieve a reflective 3D effect.

[0058] In this embodiment, the three-dimensional structure layer 200 is formed on the surface of the substrate 100. Specifically, a three-dimensional pattern (i.e., micro-nano structure unit 210) can be formed on the surface of the substrate 100 by photolithography, transfer and other techniques. Coloring materials, such as ink, are filled in the pits to form a three-dimensional pattern with light and dark contrast.

[0059] In one embodiment, the microlens array 400 includes an array of plano-convex lenses arranged in either an orthogonal or honeycomb configuration. The aperture of the plano-convex lenses can range from 10 micrometers to 250 micrometers. When the plano-convex lenses are orthogonally arranged, their arrangement periods in the X and Y directions are the same and greater than or equal to the aperture of the plano-convex lenses. When the plano-convex lenses are honeycomb arranged, their arrangement periods in the X and Y directions are different. When the microlens array 400 is honeycomb arranged, the imaging is more detailed.

[0060] In one embodiment, the relationship between the pixel coordinates of the layered target stereoscopic image under a single microlens in a three-dimensional coordinate system and the pixel coordinates in the stereoscopic structure layer 200 can be expressed as:

[0061]

[0062]

[0063] Where (X, Y) are the pixel coordinates of the layered image in the three-dimensional coordinate system, (X0, Y0) are the center coordinates of the microlens, (x, y) are the coordinates of each pixel on the micro / nano structure unit 210, (x0, y0) are the center coordinates of the micro / nano structure unit 210, n is the refractive index of the microlens, g is the thickness of the spacer layer 300 plus the height of the microlenses in the microlens array 400, and d is the depth of field, which is the distance from the plane of the layered image to the apex of the microlens. This formula applies to each layer of the image after layering.

[0064] In another embodiment, reference is made to Figure 5A method for fabricating a 3D integrated imaging device is provided, comprising the following steps:

[0065] Step S100: Simulate and form a three-dimensional coordinate system.

[0066] First, based on the parameters of the microlens array 400, a three-dimensional coordinate system in space can be simulated by computer to determine the position information of the three-dimensional target object.

[0067] Step S200: Convert the pixel coordinates of the three-dimensional target object in the three-dimensional coordinate system into pixel coordinates on the recording plane 500.

[0068] Once the 3D coordinate system is simulated, the pixel coordinates of the 3D target object within that system can be determined. The 3D target object is the object whose image needs to be reproduced in the actual application. Then, the pixel coordinates of the 3D target object are converted into pixel coordinates on the recording plane 500. Specifically, black and white dot matrix data can be generated on the recording plane 500. White indicates that pixel data exists at that location on the recording plane 500, and black indicates that pixel data does not exist at that location.

[0069] Step S300: A three-dimensional structure layer 200 is formed on one side surface of the substrate 100 according to the pixel coordinates on the recording plane 500.

[0070] Once the pixel coordinates on the recording plane 500 are determined, they can be transferred to the surface of the substrate 100 to form a three-dimensional structure layer 200. Specifically, a three-dimensional pattern corresponding to the pixel coordinates on the recording plane 500 can be formed on the surface of the substrate 100 using techniques such as photolithography and transfer printing. Then, ink is applied to the three-dimensional pattern to give it light and dark contrast, thereby forming the three-dimensional structure layer 200.

[0071] Step S400: A spacer layer 300 is provided on the surface of the three-dimensional structure layer 200 away from the substrate 100.

[0072] After the three-dimensional structure layer 200 is formed, a spacer layer 300 with a preset thickness can be set on its surface. The thickness of the spacer layer 300 can be determined according to the actual depth of field display requirements. The greater the thickness of the spacer layer 300, the smaller the depth of field of the reproduced image, and the smaller the thickness of the spacer layer 300, the greater the depth of field of the reproduced image.

[0073] Step S500: A microlens array 400 is disposed on the side surface of the spacer layer 300 away from the three-dimensional structure layer 200.

[0074] Finally, a microlens array 400 is disposed on the surface of the spacer layer 300. Under the influence of light, the image of a three-dimensional target object can be reproduced within a specified distance range from the 3D integrated imaging device. The microlens array 400 includes plano-convex lenses arranged in an array, with the lenses arranged either orthogonally or in a honeycomb pattern. The sum of the thickness of the microlenses and the thickness of the spacer layer 300 is generally greater than one focal length of the microlenses to meet imaging requirements.

[0075] The fabrication method of the 3D integrated imaging device provided in this embodiment first simulates a three-dimensional coordinate system, then converts the pixel coordinates of the three-dimensional target object to be reproduced in the three-dimensional coordinate system into pixel coordinates on the recording plane 500, and then forms a three-dimensional structure layer 200 with a three-dimensional pattern of light and dark contrast on the surface of the substrate 100 according to the pixel coordinates on the recording plane 500. In addition, a spacer layer 300 and a microlens array 400 are sequentially arranged on the three-dimensional structure layer 200. By cooperating with the three-dimensional structure layer 200 and the microlens array 400, a 3D image can be observed at the corresponding observation position. By controlling the thickness of the spacer layer 300, the distance between the vertex of the microlens array 400 and the three-dimensional structure layer 200 can be controlled, thereby controlling the depth of field of the reproduced image and having the function of adjusting the depth of field effect of the reproduced image.

[0076] Reference Figures 6-8 In one embodiment, step S200, namely, converting the pixel coordinates of the three-dimensional target object in the three-dimensional coordinate system into pixel coordinates on the recording plane 500, includes the following steps:

[0077] Step S210: Divide the three-dimensional target object into layers to form multiple planar images.

[0078] Step S220: Set different depth values ​​for different planar objects.

[0079] Step S230: Based on the depth of field of the plane where each image is located and the parameters of the microlens array 400, convert the pixel coordinates of each image in the three-dimensional coordinate system into pixel coordinates on the recording plane 500.

[0080] First, the 3D target object can be layered according to a specified layer thickness to form a finite number of planar images with continuously varying depths of field, and each planar image can be assigned a corresponding depth value. After determining the images with different depth planes, the pixel coordinates of each image in the 3D coordinate system can be converted to pixel coordinates on the recording plane 500 based on the depth of field of the plane where each image is located and the parameters of the microlens array 400. Specifically, starting with the image with the largest depth of field, the corresponding images can be converted to pixel data on the recording plane 500 in sequence. When data at the same recording position on the recording plane 500 conflict, the pixel data corresponding to the image with the smaller depth of field is used to overwrite the pixel data corresponding to the image with the larger depth of field.

[0081] In one embodiment, in step S230, that is, the step of converting the pixel coordinates of each image in the three-dimensional coordinate system into pixel coordinates on the recording plane 500, the following formula is used to perform the conversion of the coordinates on the recording plane 500 corresponding to a single microlens:

[0082]

[0083]

[0084] Where (X, Y) are the pixel coordinates of the object image in the three-dimensional coordinate system, (X0, Y0) are the center coordinates of the microlens, n is the refractive index of the lens, g is the distance from the recording plane 500 to the vertex of the microlens, d is the depth of field, which is the distance from the plane where the object image is located to the vertex of the microlens, (x, y) are the coordinates of each pixel on the recording plane 500, and (x0, y0) are the center coordinates of the micro / nano structure unit on the recording plane.

[0085] Reference Figure 6 and Figure 7 A single microlens can record an image of an object located at a specified distance on one side of the convex surface of the lens onto a plane at a specified distance on the other side of the lens plane. Since the range of an image that a single microlens can record is limited, by combining multiple microlenses to form a microlens array 400, it is possible to record large-sized three-dimensional objects over a wide area.

[0086] In this embodiment, the reference value d0 of the depth of field of the reconstructed image can be expressed by the following formula:

[0087]

[0088] Where d0 is the reference value for the depth of field of the reproduced image, P1 is the period of the microlens, f is the focal length of the microlens, and P p To record the pixel resolution on the 500-degree plane, n is the number of pixels in the microlens, and k is a constant.

[0089] In one embodiment, after step S230, i.e., the step of converting the coordinates of the three-dimensional target object in the three-dimensional coordinate system into coordinates on the recording plane 500, the preparation method provided in this embodiment further includes the following step: adjusting the coordinates on the recording plane 500 through the following mapping relationship:

[0090]

[0091] in, To adjust the coordinates of the (s', t')th pixel in the recording plane 500 corresponding to the (i', j')th microlens after adjustment, The coordinates of the (s, t)th pixel in the recording plane 500 corresponding to the (i, j)th microlens before adjustment are given, where k is a constant and n is the number of pixels corresponding to a single microlens.

[0092] In other words, the k-value can be used to establish a mapping relationship between the initial pixel coordinates and the adjusted pixel coordinates on the recording plane 500 under the microlens array 400. The adjusted pixel coordinates will change for different k-values. This mapping relationship can be obtained using a ray tracing algorithm.

[0093] Based on the aforementioned relationship matrix, the coordinates of the (i, j)th microlens corresponding to the (s, t)th pixel on the recording plane 500 can be mapped to the coordinates of the (i', j')th microlens corresponding to the (s', t')th pixel on the adjusted recording plane 500. This adjusts the coordinates of each pixel on the recording plane 500, thereby changing the relative position between the microlens array 400 and the reproduced image during final display, and realizing the change in the depth of field of the reproduced image from a real image to a virtual image.

[0094] In one embodiment, step S300, which is the step of forming a three-dimensional structure layer 200 on one side surface of the substrate 100 according to the pixel coordinates on the recording plane 500, includes:

[0095] Step S310: A plurality of micro / nano structure units 210 are formed on one side surface of the substrate according to the pixel coordinates on the recording plane 500.

[0096] Step S320: Fill the surface of the substrate 100 on which a plurality of micro / nano structural units 210 are formed with a coloring material.

[0097] Specifically, a three-dimensional pattern, i.e., a micro / nano structure unit 210, corresponding to the pixel coordinates on the recording plane 500 can be formed on the surface of the substrate using techniques such as photolithography and transfer printing. Then, coloring materials such as ink are filled on the surface of the three-dimensional pattern to give the micro / nano structure unit 210 light and dark contrast. The microlens array 400 formed subsequently has a plurality of microlenses, and each microlens corresponds one-to-one with the micro / nano structure unit 210.

[0098] In another embodiment, after step S500, i.e., the step of setting the microlens array 400 on the surface of the spacer layer 300 away from the three-dimensional structure layer 200, the fabrication method provided in this embodiment further includes: forming a reflective material layer 600 on the side of the microlens array 400 away from the spacer layer 300. This can present a reflective 3D effect.

[0099] In one embodiment, after step S300, i.e., the step of forming a three-dimensional structure layer 200 on one side surface of the substrate 100 according to the pixel coordinates on the recording plane 500, the preparation method provided in this embodiment may further include a step of peeling off the substrate 100. The step of peeling off the substrate 100 may be performed after step S300 and before step S400, or after step S400 and before step S500, or after step S500.

[0100] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0101] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0102] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A 3D integrated imaging device, characterized in that, include: The spacer layer has a preset thickness; A three-dimensional structure layer is disposed on one side surface of the spacer layer, and the three-dimensional structure layer includes a plurality of micro-nano structure units; A microlens array is disposed on the side surface of the spacer layer away from the three-dimensional structure layer, and the microlens array includes a plurality of microlenses; The micro-nano structure unit corresponds one-to-one with the microlens. The front view of the micro-nano structure unit is a superposition of images formed by each layer of the target stereoscopic image under the microlens according to different depths of field after the image is layered. The three-dimensional structural layer is formed by converting the pixel coordinates of the three-dimensional target object in the three-dimensional coordinate system into pixel coordinates on the recording plane, and then forming it on one side surface of the substrate according to the pixel coordinates on the recording plane. After converting the pixel coordinates of the three-dimensional target object in the three-dimensional coordinate system into pixel coordinates on the recording plane, the coordinates on the recording plane are adjusted according to the following mapping relationship: in, To adjust the coordinates of the (s', t')th pixel in the recording plane corresponding to the (i', j')th microlens, The coordinates of the (s, t)th pixel in the recording plane corresponding to the (i, j)th microlens before adjustment are given, where k is a constant and n is the number of pixels corresponding to a single microlens.

2. The 3D integrated imaging device according to claim 1, characterized in that, The spacer layer is made of a light-transmitting material, and the material of the spacer layer is the same as that of the microlens array layer.

3. The 3D integrated imaging device according to claim 1, characterized in that, A reflective material layer is disposed on the side of the microlens array away from the spacer layer.

4. The 3D integrated imaging device according to claim 1, characterized in that, The sum of the thickness of the spacer layer and the thickness of the microlens is greater than the focal length of the microlens.

5. The 3D integrated imaging device according to claim 1, characterized in that, The preset thickness is between 1 micrometer and 200 micrometers.

6. The 3D integrated imaging device according to claim 1, characterized in that, The microlens array includes plano-convex lenses arranged in an array, and the arrangement of the plano-convex lenses includes orthogonal arrangement or honeycomb arrangement.

7. The 3D integrated imaging device according to claim 1, characterized in that, The relationship between the pixel coordinates of the layered target stereo image under a single microlens in the three-dimensional coordinate system and the pixel coordinates in the stereo structure layer is as follows: Where (X, Y) are the pixel coordinates of the layered image in the three-dimensional coordinate system, (X0, Y0) are the center coordinates of the microlens, (x, y) are the coordinates of each pixel on the micro / nano structure unit, (x0, y0) are the center coordinates of the micro / nano structure unit, n is the refractive index of the microlens, g is the thickness of the spacer layer plus the height of the microlens in the microlens array, and d is the depth of field, which is the distance from the plane of the layered image to the vertex of the microlens.

8. A method for fabricating a 3D integrated imaging device as described in any one of claims 1-7, characterized in that, include: Simulate the formation of a three-dimensional coordinate system; Convert the pixel coordinates of the three-dimensional target object in the three-dimensional coordinate system into pixel coordinates on the recording plane; A three-dimensional structure layer is formed on one side surface of the substrate according to the pixel coordinates on the recording plane; A spacer layer is provided on the surface of the three-dimensional structure layer away from the substrate; A microlens array is disposed on the side surface of the spacer layer away from the three-dimensional structure layer.

9. The method for fabricating the 3D integrated imaging device according to claim 8, characterized in that, The step of converting the pixel coordinates of the three-dimensional target object in the three-dimensional coordinate system into pixel coordinates on the recording plane includes: The three-dimensional target object is layered to form a plurality of planar images; Different depth-of-field values ​​are set for different planar objects; Based on the depth of field of the plane where each image is located and the parameters of the microlens array, the pixel coordinates of each image in the three-dimensional coordinate system are converted into pixel coordinates on the recording plane.

10. The method for fabricating the 3D integrated imaging device according to claim 9, characterized in that, When setting the depth of field value, a reference value d0 for calculating the depth of field is also included. d0 is expressed by the following formula: in, This serves as a reference value for depth of field. Let f be the period of the microlens and f be the focal length of the microlens. To record the resolution of pixels on the plane, n is the number of pixels in the microlens; After the step of converting the coordinates of the three-dimensional target object in the three-dimensional coordinate system to coordinates on the recording plane, the preparation method further includes: The coordinates on the recording plane are adjusted using the following mapping relationship: in, To adjust the coordinates of the (s', t')th pixel in the recording plane corresponding to the (i', j')th microlens, The coordinates of the (s, t)th pixel in the recording plane corresponding to the (i, j)th microlens before adjustment are given, where k is a constant and n is the number of pixels corresponding to a single microlens.

11. The method for fabricating the 3D integrated imaging device according to claim 8, characterized in that, The step of forming a three-dimensional structure layer on one side surface of the substrate according to the pixel coordinates on the recording plane includes: A plurality of micro / nano structure units are formed on one side surface of the substrate according to the pixel coordinates on the recording plane; Coloring materials are filled into the surface of a substrate with multiple micro / nano structural units.

12. The method for fabricating the 3D integrated imaging device according to claim 8, characterized in that, After the step of forming a three-dimensional structural layer on one side surface of the substrate according to the pixel coordinates on the recording plane, the method further includes: peeling off the substrate.

Images