Chip automatic detection device and detection method

Abstract

The present invention belongs to the technical field of chip processing, and specifically is an automatic chip detection device and detection method, comprising a control box, wherein the upper end of the control box is fixedly connected to a support frame at four corners, a support plate is installed on the upper end of the support frame, a hydraulic cylinder is arranged in the middle of the upper end of the support plate, a push plate is fixedly connected to the piston rod end of the hydraulic cylinder, a detection plate is installed in the middle of the lower end of the push plate, the detection plate is provided in two pieces, and they are rotatably connected by hinges, a plurality of detection holes are arranged on the lower end surface of the detection plate, and probes are inserted into the inner cavity of the detection hole; the problem of clamping the chip for detection by an adapted limit groove is solved, but the detection operation cannot be performed on the packaged special-shaped chip, and the clamping component and the limit groove cannot be rotated to adjust the angle, which results in the need to repeatedly release the clamping and adjust the position and angle of the chip when detecting different chips, resulting in the situation that the detection is not convenient enough.

Description

Technical Field

[0001] The invention belongs to the technical field of chip processing, and in particular relates to a chip automatic detection device and a detection method. Background Art

[0002] With the rapid development of the Internet era, smart digital chips have been widely used in smart hardware, information communication, smart transportation and other fields. In order to ensure the production and manufacturing quality of chips, chip testing equipment is needed to test the chips after the finished chips are produced. The testing contents include physical defect detection, magnetic induction detection, etc., to ensure that the factory quality of smart digital chips meets the industry sales standards.

[0003] A patent application with publication number CN117169677A discloses a chip detection device, which cooperates between a support plate and an adjustment part, and provides a limit groove adapted to the chip contour to limit the chip. The chip entered into the limit groove is restricted in the horizontal direction by the resistance of the inner wall of the limit groove, ensuring that the detection unit will not be positionally shifted when detecting the chip; and the setting of the adjustment part can be used to limit the horizontal freedom of the support plate, so that support plates of different sizes and shapes can be replaced, and even circuit boards on which chips need to be detected can be directly placed, so that the entire fixture unit can be suitable for chip detection in different situations such as bare chips and chips on circuit boards, thereby greatly reducing the difficulty of detecting various chips and reducing unnecessary troubles; at the same time, for a detachable support plate, after the support plate is removed, the circuit board to be detected can be limited on the adjustment part to detect the chip on the circuit board, thereby realizing multi-functional and multi-range use.

[0004] In the above-mentioned prior art, the chip is placed in a limiting groove, and then an adjustment block is driven to support one side of the chip to fix the chip in the limiting groove. However, although this clamping method can clamp and fix the chip, when clamping chips of different sizes, the probe cannot accurately contact the detection part of the chip due to the influence of the chip size, which limits the detection of the chip, and the clamping component and the limiting groove cannot be rotated to adjust the angle. This results in the need to repeatedly loosen the clamp and adjust the position and angle of the chip when detecting chips of different sizes or packaged chips, resulting in the problem of inconvenient detection.

[0005] To this end, the present invention provides a chip automatic detection device and a detection method. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problem is: the chip automatic detection equipment described in the present invention comprises a control box, the upper end of the control box is fixedly connected to a support frame at four corners, the upper end of the support frame is installed with a support plate, a hydraulic cylinder is arranged in the middle of the upper end of the support plate, the piston rod end of the hydraulic cylinder is fixedly connected to a push frame, a detection plate is installed in the middle of the lower end of the push frame, the detection plate is arranged in two pieces, and they are rotatably connected by hinges, a plurality of detection holes are arranged on the lower end surface of the detection plate, and probes are inserted into the inner cavity of the detection hole, a bracket is installed on the upper end of the control box, a conveyor belt is installed in the inner cavity of the bracket, and a plurality of chip detection fixtures are installed outside the conveyor belt;

[0008] The chip detection fixture includes a mounting column installed on the upper end of the conveyor belt, and a micro motor is arranged inside the mounting column, and the micro motor is fixedly connected to a rotating disk through an output shaft, and the upper end surface of the rotating disk is provided with four cross slides, and the inner cavities of the four cross slides are all slidably connected with support pins, and the upper end of the support pin is fixedly connected with a clamping block, and the outside of the clamping block is provided with a latex protective pad;

[0009] A good product collection slot is arranged on one side of the upper end of the control box, a defective product collection slot is arranged on one side of the upper end of the control box, a protective cover is fixedly connected to one side of the upper end of the bracket, an electric push rod is arranged in the inner cavity of the protective cover, and a single-sided gear rod is fixedly connected to the output shaft end of the electric push rod.

[0010] Preferably, the control box is provided with universal wheels at the lower end, and slots are provided at the four corners of the lower end of the support plate, and the slots are plug-connected and installed with the support frame.

[0011] Preferably, a transmission groove is provided at the bottom of the inner cavity of the cross slide, the inner cavity of the transmission groove is rotatably connected to a cross rotating frame, the cross rotating frame is rotatably connected to pull rods at four corners, and the pull rod is rotatably connected to a support pin at one end away from the cross rotating frame.

[0012] Preferably, a driven bevel gear is fixed to the outside of the cross rotating frame, the driven bevel gear is meshingly connected to the transmission bevel gear, a transmission shaft is fixed to the inside of the transmission bevel gear, one end of the transmission shaft passes through the rotating disk and is fixed to a gear, a fixed block is fixed to the bottom of the inner cavity of the transmission groove, and the transmission shaft is rotatably connected to the fixed block, the support pin is located outside the inner cavity of the cross slide groove and is fixed to a supporting sliding disk, and four limiting protrusions are arranged on the outside of the supporting sliding disk.

[0013] Preferably, a plurality of blocks are provided on the lower end surface of the rotating disk, a single-sided gear ring is provided on the outside of the rotating disk, a tray is fixedly connected to the outside of the mounting column, a scale groove is provided on the upper end of the tray, and the scale groove is plugged into the block, and the block is made of an elastic member.

[0014] Preferably, a threaded groove is provided at the lower end of the mounting column, and the mounting column is mounted on the conveyor belt through the threaded groove and bolts.

[0015] Preferably, industrial cameras are installed inside both ends of the pushing frame, limiting sleeves are fixedly connected on both sides of the support plate, and the limiting sleeves are slidably connected to two T-shaped sliding columns inside the upper surface of the support plate for arranging wires, and the lower ends of the two T-shaped sliding columns are fixedly connected to the pushing frame, a buckle is provided at one end of the detection plate, power interfaces are provided on both sides of the detection plate, and power connectors are inserted into the inner cavity of the power interfaces, and the power connector is electrically connected to a threaded elastic wire at one end away from the power interface.

[0016] Preferably, two servo push rods are arranged inside the lower end of the bracket on both sides of the inner cavity of the support frame, and the piston rod ends of the two servo push rods are fixedly connected to a push plate, the lower end of the push plate is fixedly connected to a rack, and the rack is pushed to engage with the gear through the push plate.

[0017] A chip automatic detection method, applied to chip automatic detection equipment, comprises the following steps:

[0018] S1, obtaining chip information of the chip to be detected, and determining the chip type of the chip to be detected according to the chip information, and then mounting the chip on a clamping and positioning component, and conveying it to an appearance inspection area through a conveyor belt;

[0019] S2. Use an industrial camera to inspect the appearance and surface defects of the chip to obtain the first inspection result of the chip to be inspected;

[0020] S3. After the appearance and surface defects of the chip to be tested are tested, the conveyor belt is driven again to transport the chip to be tested to the functional test area, and then the function and operation status of the chip to be tested are tested using the PLC board and the probe to obtain the test result of whether the function and operation status of the chip to be tested are stable and normal;

[0021] S4, then the chip to be tested is conveyed to the second appearance inspection area by a conveyor belt, and the appearance and surface defects of the chip to be tested are secondarily inspected by an industrial camera to observe whether there are scratches on the surface of the bare chip due to the probe test. If the function operation and appearance of the chip to be tested meet the predetermined requirements, it is determined that the chip to be tested has passed the inspection.

[0022] Preferably, the industrial camera is a CameraLink camera equipped with a back-illuminated CMOS sensor.

[0023] Preferably, two industrial cameras are provided, and one is used for preliminary inspection of chip appearance and surface defects, while the second industrial camera is used for secondary inspection of chip appearance and whether there are scratches on the surface after the probe inspection is completed.

[0024] The beneficial effects of the present invention are as follows:

[0025] 1. The chip automatic detection equipment described in the present invention places the chip to be detected on a rotating disk, then drives the chip detection fixture to clamp and position the chip to be detected, and at the same time starts the conveyor belt to drive the rotating disk to move, thereby driving the chip to be detected to move to the bottom of the detection plate, and at the same time starts the hydraulic cylinder to drive the push plate to move downward, thereby driving the detection plate to move synchronously. Before the detection plate moves downward, the operator can install the probe in the detection holes at different positions according to the models of the chips to be detected, so as to ensure that the probe can accurately perform function tests, timing tests, performance tests and stability tests on chips of different models, thereby solving the problem that when the existing chip automatic detection equipment detects the chip, the clamp is fixedly installed on the workbench and cannot be rotated and adjusted. This results in the need to repeatedly release the clamp and adjust the position and angle of the chip when detecting different chips to ensure that the chip can be aligned with the probe for detection, resulting in inconvenient detection.

[0026] 2. The chip automatic detection equipment described in the present invention, when detecting the chip, twist the buckle to open the detection board, and then install the PLC board for chip detection in the inner cavity of the detection board, and at the same time use the power-on connector to pull the threaded elastic wire into the inner cavity of the power-on interface and power on the PLC board, and then use the probe to cooperate with the PLC board to perform function test, timing test, performance test and stability test on the chip, thereby solving the problem that when the existing chip automatic detection equipment detects the chip, the chip is installed on the PLC board and then the PLC board is powered on to start detection, which results in not only slow chip detection efficiency but also cumbersome detection steps and inconvenient operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention will be further described below in conjunction with the accompanying drawings.

[0028] Figure 1 It is a schematic diagram of the structure of the main view of the present invention as a whole;

[0029] Figure 2 This is a schematic diagram of the overall structure of the push frame of the present invention when viewed from above;

[0030] Figure 3 It is a schematic diagram of the overall structure of the chip detection fixture of the present invention;

[0031] Figure 4 It is a schematic diagram of the internal structure of a rotating disk of the present invention in partial section;

[0032] Figure 5 It is a schematic diagram of a partial cross-sectional structure of a rotating disk of the present invention;

[0033] Figure 6 is a schematic diagram of the structure of the rotating disk of the present invention when viewed from above;

[0034] Figure 7 It is a schematic diagram of the structure of the chip detection fixture installation of the present invention;

[0035] Figure 8 It is a schematic diagram of the structure of the detection board of the present invention when it is opened and viewed from above;

[0036] Fig. 9 It is a schematic diagram of the structure of the conveyor belt of the present invention when viewed from above;

[0037] In the figure: 1. control box; 2. universal wheel; 3. support frame; 4. support plate; 5. hydraulic cylinder; 6. T-type slide column; 7. limit sleeve; 8. slot; 9. push frame; 10. industrial camera; 11. detection board; 12. probe; 13. power interface; 14. buckle; 15. power connector; 16. threaded elastic wire; 17. bracket; 18. conveyor belt; 19. chip detection fixture;

[0038] 191, rotating plate; 192, transmission groove; 193, cross slide; 194, cross rotating frame; 195, pull rod; 196, support pin; 197, support slide plate; 198, driven bevel gear; 199, transmission bevel gear; 1910, transmission shaft; 1911, fixed block;

[0039] 20. Clamping block; 21. Gear; 22. Tray; 23. Scale groove; 24. Mounting column; 25. Block; 26. Threaded groove; 27. Detection hole; 28. Rack; 29. ​​Push plate; 30. Good product collection slot; 31. Defective product collection slot; 32. Protective cover; 33. Single-sided gear rod. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] Embodiment 1

[0042] See also Figure 1-9 , the present invention provides a technical solution:

[0043] A chip automatic detection device, comprising a control box 1, wherein the upper end of the control box 1 is fixedly connected with a support frame 3 at four corners, a support plate 4 is installed on the upper end of the support frame 3, a hydraulic cylinder 5 is arranged in the middle of the upper end of the support plate 4, a push frame 9 is fixedly connected to the piston rod end of the hydraulic cylinder 5, a detection plate 11 is installed in the middle of the lower end of the push frame 9, the detection plate 11 is arranged in two pieces, and the two detection plates 11 are rotatably connected by hinges, a plurality of detection holes 27 are arranged on the lower end surface of the detection plate 11, and a probe 12 is inserted into the inner cavity of the detection hole 27, a bracket 17 is installed on the upper end of the control box 1, a conveyor belt 18 is installed in the inner cavity of the bracket 17, and a plurality of chip detection fixtures 19 are installed outside the conveyor belt 18;

[0044] The chip detection fixture 19 includes a mounting column 24 mounted on the upper end of the conveyor belt 18, and a micro motor is arranged inside the mounting column 24, and the micro motor is fixedly connected to a rotating disk 191 through an output shaft, and four cross slides 193 are arranged on the upper end surface of the rotating disk 191, and the inner cavities of the four cross slides 193 are all slidably connected with support pins 196, and the upper end of the support pin 196 is fixedly connected to a clamping block 20, and a latex protective pad is arranged outside the clamping block 20;

[0045] A good product collection slot 30 is provided on one side of the upper end of the control box 1, a defective product collection slot 31 is provided on one side of the upper end of the control box 1, a protective cover 32 is fixedly connected to one side of the upper end of the bracket 17, an electric push rod is provided in the inner cavity of the protective cover 32, and a single-sided gear rod 33 is fixedly connected to the output shaft end of the electric push rod.

[0046] Specifically, in the prior art, the chip is placed in a limiting groove, and then an adjustment block is driven to hold one side of the chip so that the chip is fixed in the limiting groove. However, although this clamping method can clamp and fix the chip, when clamping chips of different sizes, the probe cannot accurately contact the detection part of the chip due to the influence of the chip size, which limits the detection of the chip. In addition, the clamping component and the limiting groove cannot be rotated to adjust the angle. This results in the need to repeatedly release the clamping and adjust the position and angle of the chip when detecting chips of different sizes or packaged chips, resulting in the problem of inconvenient detection.

[0047] The present invention places the chip to be tested on the rotating disk 191, and then drives the support pin 196 to slide in the inner cavity of the cross slide 193. At the same time, the support pin 196 drives the clamping block 20 to move closer to each other, so that the chip to be tested on the rotating disk 191 can be clamped and positioned so that it is ensured to be in the middle of the rotating disk 191. A latex protective pad is provided on the outside of the clamping block 20, so as to ensure that during the chip clamping process, the clamping block 20 is prevented from directly contacting the chip and causing scratches on it. Then, the conveyor belt 18 is started to drive the rotating disk 191 to move, and the rotating disk 191 drives the chip to be tested to move to the bottom of the detection plate 11. At the same time, the hydraulic cylinder 5 is started to drive the pushing frame 9 to move downward, and the pushing frame 9 pushes the detection plate 11 to move downward. Before the detection plate 11 moves downward, the operator can install the probe 12 in the detection holes 27 at different positions according to the models of the chips to be detected, so as to ensure that the probe 12 can accurately perform functional tests and timing tests on chips of different models. , performance test and stability test. After the chip is inspected by the probe 12, the inspection data is transmitted to the external main console and displayed through the external main console, so that the operator can intuitively observe the quality of the chip. When the chip is damaged, the main console will start the electric push rod in the inner cavity of the protective cover 32, and the electric push rod will push the single-sided gear rod 33 to slide out of the protective cover 32. At the same time, the single-sided gear rod 33 is engaged with the single-sided gear ring outside the rotating disk 191, thereby driving the rotating disk 191 to rotate, and the rotating disk 191 drives the gear 21 to rotate 180 degrees, and accelerates the conveyor belt 18 at the same time, omitting the secondary inspection step of the chip, and improving the inspection efficiency of subsequent chips, thereby solving the problem that when the existing chip automatic inspection equipment is inspecting the chip, the clamp is fixedly installed on the workbench and cannot be rotated and adjusted. This results in the need to repeatedly release the clamp and adjust the position and angle of the chip when inspecting different chips to ensure that the chip can be aligned with the probe for inspection, resulting in inconvenient inspection.

[0048] like Figure 1 to Figure 2 As shown, a universal wheel 2 is provided at the lower end of the control box 1, and slots 8 are provided at the four corners of the lower end of the support plate 4, and the slots 8 are plug-connected and installed with the support frame 3.

[0049] Specifically, when the chip automatic detection equipment needs to be moved to the chip production line, the control box 1 is driven to move by utilizing the universal wheel 2, thereby improving the convenience of using the chip automatic detection equipment, and the support plate 4 is installed on the support frame 3 by utilizing the slot 8, and then fixed by bolts. This installation method is convenient for disassembly and assembly, especially for some studios that are inconvenient to enter, it can be quickly disassembled to facilitate the operator's carrying and moving, thereby improving practicality.

[0050] like Figure 3,to Figure 6 As shown, a transmission groove 192 is provided at the bottom of the inner cavity of the cross slide groove 193, and a cross rotating frame 194 is rotatably connected to the inner cavity of the transmission groove 192. The cross rotating frame 194 is rotatably connected to pull rods 195 at the four corners, and the pull rod 195 is rotatably connected to the support pin 196 at one end away from the cross rotating frame 194.

[0051] Specifically, when the chip is tested, the cross rotating frame 194 is driven to rotate, and at the same time, the cross rotating frame 194 pulls the pull rod 195 to rotate. During the pulling process of the cross rotating frame 194, the pull rod 195 drives the support pin 196 to move in the inner cavity of the cross slide groove 193, and then the support pin 196 clamps and fixes the chip. In the process of clamping the chip, it can be ensured that the chip is always in the middle of the rotating disk 191, thereby improving the detection accuracy.

[0052] like Figure 3 ,to Figure 6 As shown, a driven bevel gear 198 is fixedly connected to the outside of the cross rotating frame 194, and the driven bevel gear 198 is meshedly connected to the transmission bevel gear 199. A transmission shaft 1910 is fixedly connected to the inside of the transmission bevel gear 199. One end of the transmission shaft 1910 passes through the rotating disk 191 and is fixedly connected to the gear 21. A fixed block 1911 is fixedly connected to the bottom of the inner cavity of the transmission groove 192, and the transmission shaft 1910 is rotatably connected to the fixed block 1911. The support pin 196 is located on the outside of the inner cavity of the cross slide groove 193 and is fixedly connected to a supporting sliding plate 197, and four limiting protrusions are arranged on the outside of the supporting sliding plate 197.

[0053] Specifically, when the chip is clamped and positioned, the driving gear 21 rotates, and the gear 21 drives the transmission shaft 1910 to rotate, and then drives the transmission bevel gear 199 to rotate. During the rotation process, the transmission bevel gear 199 meshes with the driven bevel gear 198 to rotate, and then drives the cross rotating frame 194 to rotate through the driven bevel gear 198, and then drives the support pins 196 to slide in the inner cavity of the cross slide groove 193 and move closer to each other. When the support pins 196 move closer to each other, they can drive the support sliding plate 197 to move in the inner cavity of the cross slide groove 193. At the same time, four limiting protrusions are used to ensure stability during movement to prevent the support pins 196 from rotating during movement, so that the chip on the rotating plate 191 can be clamped and positioned quickly, and the operation is simple and convenient.

[0054] like Figure 3 and Figure 6 As shown, a plurality of blocks 25 are provided on the lower end surface of the rotating disk 191, a single-sided gear ring is provided on the outside of the rotating disk 191, a tray 22 is fixedly connected to the outside of the mounting column 24, a scale groove 23 is provided on the upper end of the tray 22, and the scale groove 23 is plugged into the block 25, and the block 25 is made of an elastic member.

[0055] Specifically, when the chip position needs to be adjusted, the rotating disk 191 is driven to rotate. During the rotation of the rotating disk 191, the card block 25 is driven to slide out from the inner cavity of the scale groove 23 and show deformation. Then, as the rotating disk 191 continues to rotate, the card block 25 will rebound and reset when it moves above the scale groove 23, and re-enter the inner cavity of the scale groove 23, thereby being able to accurately adjust the position of the chip and improve the convenience of detection.

[0056] Embodiment 2

[0057] like Figures 1 to 8 As shown in Comparative Example 1, another embodiment of the present invention is:

[0058] like Figure 1 , Figure 6 and Fig. 9 As shown, a thread groove 26 is provided at the lower end of the mounting column 24 , and the mounting column 24 is mounted on the conveyor belt 18 through the thread groove 26 and the matching bolts.

[0059] Specifically, when the chip detection fixture 19 is damaged or needs maintenance, the bolt is disengaged from the threaded groove 26 by twisting, and then the mounting column 24 is removed from the conveyor belt, thereby achieving rapid disassembly and installation of the chip detection fixture 19, improving practicality, and also increasing the number of chip detection fixtures 19 according to chip detection efficiency.

[0060] like Figure 1 , Figure 2 and Figure 8 As shown, industrial cameras 10 are installed inside both ends of the pushing frame 9, limiting sleeves 7 are fixedly connected to both sides of the support plate 4, and the limiting sleeves 7 are used to arrange the wires, two T-shaped slide columns 6 are slidably connected inside the upper end surface of the support plate 4, and the lower ends of the two T-shaped slide columns 6 are fixedly connected to the pushing frame 9, a buckle 14 is provided at one end of the detection plate 11, power interfaces 13 are provided on both sides of the detection plate 11, and power connectors 15 are inserted into the inner cavity of the power interfaces 13, and the power connector 15 is electrically connected to a threaded elastic wire 16 at one end away from the power interface 13.

[0061] Specifically, when inspecting the chip appearance, the chip is mounted on the chip inspection fixture 19, and then the push frame 9 is driven to move downward. In the process of driving the push frame 9 to move downward, the T-shaped slide column 6 is used to ensure the stability of the push frame 9 when it moves downward, thereby further ensuring that when inspecting the chip, the push frame 9 is prevented from tilting, etc., which causes the probe 12 to be unable to accurately dock with the chip inspection interface, causing the trouble of constantly adjusting the chip position. At the same time, the push frame 9 drives the industrial camera 10 to move downward, and the industrial camera 10 detects whether there is wear on the chip appearance and the data transmission connector, and in the process of driving the industrial camera 10 to move downward, the limit sleeve 7 can be used to adjust the wires The limit is performed to prevent entanglement. When testing the chip, the buckle 14 is twisted to open the test board 11, and then the PLC board for chip testing is installed in the inner cavity of the test board 11. At the same time, the threaded elastic wire 16 is pulled by the power connector 15 to insert it into the inner cavity of the power interface 13 and the PLC board is powered on. Then, the probe 12 is used to cooperate with the PLC board to perform function test, timing test, performance test and stability test on the chip, thereby solving the problem that when the existing chip automatic detection equipment detects the chip, the chip is installed on the PLC board, and then the PLC board is powered on to start detection, which results in not only slow chip detection efficiency, but also cumbersome detection steps and inconvenient operation.

[0062] like Figure 1 , Figure 7 and Fig. 9 As shown, two servo push rods are arranged inside the lower end of the bracket 17 on both sides of the inner cavity of the support frame 3, and the piston rod ends of the two servo push rods are fixedly connected to a push plate 29, and the lower end of the push plate 29 is fixedly connected to a rack 28, and the rack 28 is pushed to engage with the gear 21 through the push plate 29.

[0063] Specifically, after the chip is inspected by the probe 12, the inspection board 11 will transmit the inspection data to the external main console and display it through the external main console, so that the operator can intuitively observe the quality of the chip. When the chip is damaged, the main console will start the electric push rod in the inner cavity of the protective cover 32, and the electric push rod will push the single-sided gear rod 33 to slide out of the protective cover 32. At the same time, the single-sided gear rod 33 is engaged with the single-sided gear ring outside the rotating disk 191, thereby driving the rotating disk 191 to rotate, and the rotating disk 191 drives the gear 21 to rotate 180 degrees, and at the same time accelerates the conveyor belt 18, omitting the secondary inspection step of the chip. When the conveyor belt 18 drives the rotating disk 191 to move above the defective collection slot 31, the main console will simultaneously start the synchronous push rod to drive the push plate 29 to move downward, and the push plate 29 pushes the rack 28 to move downward. The conveyor belt 18 drives the rotating disk 191 to move, and the gear 21 will engage with the rack 28. At the same time, the rotation of the gear 21 drives the chip detection fixture 19 to open, and then the defective chips are discharged into the defective collection slot 31 for storage and collection. When the detected chip is a good chip, the main control console will start the micro motor to drive the rotating disk 191 to rotate, and the rotating disk 191 drives the gear 21 to rotate to the front end of the control box 1, and at the same time start the synchronous push rod to push the push plate 29 above the good collection slot 30, and the push plate 29 pushes the rack 28 to move downward, and then when the conveyor belt 18 transports the chip detection fixture 19 to move above the good collection slot 30, the gear 21 engages with the rack 28, thereby opening the chip detection fixture 19 and discharging the good chips into the good collection slot 30 for collection, which is convenient for distinguishing and collecting the good and bad chips, and avoiding the mixing of good chips and defective chips.

[0064] A chip automatic detection method, applied to chip automatic detection equipment, comprises the following steps:

[0065] S1, obtaining chip information of the chip to be detected, and determining the chip type of the chip to be detected according to the chip information, and then mounting the chip on a clamping and positioning component, and conveying it to an appearance inspection area through a conveyor belt;

[0066] S2. Use an industrial camera to inspect the appearance and surface defects of the chip to obtain the first inspection result of the chip to be inspected;

[0067] S3. After the appearance and surface defects of the chip to be tested are tested, the conveyor belt is driven again to transport the chip to be tested to the functional test area, and then the function and operation status of the chip to be tested are tested using the PLC board and the probe to obtain the test result of whether the function and operation status of the chip to be tested are stable and normal;

[0068] S4, then the chip to be tested is conveyed to the second appearance inspection area by a conveyor belt, and the appearance and surface defects of the chip to be tested are secondarily inspected by an industrial camera to observe whether there are scratches on the surface of the bare chip due to the probe test. If the function operation and appearance of the chip to be tested meet the predetermined requirements, it is determined that the chip to be tested has passed the inspection.

[0069] The industrial camera uses a CameraLink camera equipped with a back-illuminated CMOS sensor.

[0070] There are two industrial cameras, one for preliminary inspection of chip appearance and surface defects, and the second industrial camera for secondary inspection of chip appearance and whether there are scratches on the surface after the probe inspection is completed.

[0071] The working principle is as follows: the chip to be detected is placed on the rotating disk 191, and then the driving gear 21 is rotated. At the same time, the gear 21 drives the transmission shaft 1910 to rotate, and then drives the transmission bevel gear 199 to rotate. During the rotation process, the transmission bevel gear 199 meshes with the driven bevel gear 198 to rotate, and then drives the cross rotating frame 194 to rotate through the driven bevel gear 198, and makes the cross rotating frame 194 pull the pull rod 195 to rotate. During the pulling process of the pull rod 195 through the cross rotating frame 194, it will drive the support pin 196 to slide in the inner cavity of the cross slide 193, and at the same time, the support pin 196 drives the clamping block 20 to move closer to each other, and then the chip to be detected on the rotating disk 191 can be clamped, and at the same time, it is positioned to ensure that it is in the middle of the rotating disk 191, and a latex protective pad is arranged on the outside of the clamping block 20, so as to ensure that in the process of clamping the chip, the clamping block 20 is prevented from directly contacting the chip, resulting in wear marks on it.

[0072] Then, the conveyor belt 18 is started to drive the rotating disk 191 to move, and the rotating disk 191 drives the chip to be tested to move to the bottom of the test plate 11, and at the same time, the hydraulic cylinder 5 is started to drive the push frame 9 to move downward, and the push frame 9 pushes the test plate 11 to move downward. Before the test plate 11 moves downward, the operator can install the probe 12 in the test hole 27 at different positions according to the model of the chip to be tested, so as to ensure that the probe 12 can accurately perform function test, timing test, performance test and stability test on the chips of different models;

[0073] When inspecting the chip appearance, the chip is installed on the chip inspection fixture 19, and then the push frame 9 is driven to move downward. At the same time, the push frame 9 drives the industrial camera 10 to move downward, and the industrial camera 10 inspects the chip appearance and the data transmission connector for wear. In the process of driving the industrial camera 10 to move downward, the limit sleeve 7 can be used to limit the wires to prevent entanglement.

[0074] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A chip automatic detection device, characterized in that: The invention comprises a control box (1), wherein the upper end of the control box (1) is fixedly connected to a support frame (3) at four corners, the upper end of the support frame (3) is installed with a support plate (4), the middle part of the upper end of the support plate (4) is provided with a hydraulic cylinder (5), the piston rod end of the hydraulic cylinder (5) is fixedly connected to a push frame (9), the middle part of the lower end of the push frame (9) is installed with a detection plate (11), the detection plate (11) is provided with two pieces, and the two pieces are rotatably connected by a hinge, the lower end surface of the detection plate (11) is provided with a plurality of detection holes (27), and the inner cavity of the detection hole (27) is plugged with a probe (12), the upper end of the control box (1) is installed with a bracket (17), the inner cavity of the bracket (17) is installed with a conveyor belt (18), and the outer part of the conveyor belt (18) is installed with a plurality of chip detection fixtures (19); The chip detection fixture (19) includes a mounting column (24) mounted on the upper end of the conveyor belt (18), and a micro motor is arranged inside the mounting column (24), and the micro motor is fixedly connected to a rotating disk (191) through an output shaft, and the upper end surface of the rotating disk (191) is provided with four cross grooves (193), and the inner cavities of the four cross grooves (193) are all slidably connected with support pins (196), and the upper end of the support pin (196) is fixedly connected with a clamping block (20), and the outside of the clamping block (20) is provided with a latex protective pad; A good product collection groove (30) is provided on one side of the upper end of the control box (1), a defective product collection groove (31) is provided on one side of the upper end of the control box (1), a protective cover (32) is fixedly connected to one side of the upper end of the bracket (17), an electric push rod is provided in the inner cavity of the protective cover (32), and a single-sided gear rod (33) is fixedly connected to the output shaft end of the electric push rod; A transmission groove (192) is provided at the bottom of the inner cavity of the cross slide groove (193), and the inner cavity of the transmission groove (192) is rotatably connected to a cross rotating frame (194), and the cross rotating frame (194) is rotatably connected to pull rods (195) at four corners, and one end of the pull rod (195) away from the cross rotating frame (194) is rotatably connected to a support pin (196), and the cross rotating frame (194) is fixedly connected to a driven bevel gear (198) on the outside, and the driven bevel gear (198) is meshingly connected to a transmission bevel gear (199), and a transmission shaft (1910) is fixedly connected to the inside of the transmission bevel gear (199), and one end of the transmission shaft (1910) passes through the rotating disk (191) and is fixedly connected to a gear (2 1), a fixed block (1911) is fixedly connected to the bottom of the inner cavity of the transmission groove (192), and the transmission shaft (1910) is rotatably connected to the fixed block (1911), the support pin (196) is located outside the inner cavity of the cross slide groove (193) and is fixedly connected to a support slide plate (197), and four limiting protrusions are arranged outside the support slide plate (197), a plurality of clamping blocks (25) are arranged on the lower end surface of the rotating disk (191), a single-sided gear ring is arranged outside the rotating disk (191), a tray (22) is fixedly connected to the outside of the mounting column (24), a scale groove (23) is arranged on the upper end of the tray (22), and the scale groove (23) is plugged into the clamping block (25), and the clamping block (25) is made of an elastic member.

2. The chip automatic detection device according to claim 1, characterized in that: The control box (1) is provided with a universal wheel (2) at the lower end, and the support plate (4) is provided with slots (8) at the four corners of the lower end, and the slots (8) are plug-connected and installed with the support frame (3).

3. The chip automatic detection device according to claim 1, characterized in that: The lower end of the installation column (24) is provided with a thread groove (26), and the installation column (24) is installed with the conveyor belt (18) through the thread groove (26) and the matching bolts.

4. The chip automatic detection device according to claim 1, characterized in that: Industrial cameras (10) are installed inside both ends of the pushing frame (9), and both sides of the support plate (4) are fixedly connected to limit sleeves (7), and the limit sleeves (7) are used to arrange wires. Two T-shaped sliding columns (6) are slidably connected inside the upper end surface of the support plate (4), and the lower ends of the two T-shaped sliding columns (6) are fixedly connected to the pushing frame (9), and a buckle (14) is provided at one end of the detection plate (11). Both sides of the detection plate (11) are provided with power interfaces (13), and the inner cavity of the power interface (13) is plugged with a power connector (15), and the end of the power connector (15) away from the power interface (13) is electrically connected to a threaded elastic wire (16).

5. The chip automatic detection device according to claim 1, characterized in that: Two servo push rods are arranged inside the lower end of the bracket (17) on both sides of the inner cavity of the support frame (3), and the piston rod ends of the two servo push rods are fixedly connected to a push plate (29), and the lower end of the push plate (29) is fixedly connected to a rack (28), and the rack (28) is pushed by the push plate (29) to engage with the gear (21).

6. A chip automatic detection method, applied to the chip automatic detection device according to claim 1, characterized in that : Includes the following steps: S1. Obtain chip information of the chip to be tested, and determine the chip type of the chip to be tested according to the chip information, then mount the chip on a clamping and positioning component, and convey it to the appearance inspection area through a conveyor belt; S2. Use an industrial camera to inspect the appearance and surface defects of the chip to obtain the first inspection result of the chip to be inspected; S3. After the appearance and surface defects of the chip to be tested are tested, the conveyor belt is driven again to transport the chip to be tested to the functional test area, and then the function and operation status of the chip to be tested are tested using the PLC board and the probe to obtain the test result of whether the function and operation status of the chip to be tested are stable and normal; S4, then the chip to be tested is conveyed to the second appearance inspection area by a conveyor belt, and the appearance and surface defects of the chip to be tested are secondarily inspected by an industrial camera to observe whether there are scratches on the surface of the bare chip caused by the probe test. If the function operation and appearance of the chip to be tested meet the predetermined requirements, it is determined that the chip to be tested has passed the inspection.

7. The chip automatic detection method according to claim 6, characterized in that: There are two industrial cameras, one for preliminary inspection of chip appearance and surface defects, and the second industrial camera for secondary inspection of chip appearance and whether there are scratches on the surface after the probe inspection is completed.

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