Chip aging test device

Abstract

The embodiment of the present specification provides a chip aging test device, including a box body, a multi-layer aging board is arranged in the box body, and a chip to be tested is installed on the aging board; a guide mechanism forms a plurality of guide channels, and the outlet openings of the plurality of guide channels correspond to the multi-layer aging boards respectively; a plurality of wind speed adjustment mechanisms are respectively located above the multi-layer aging boards, and the wind speed adjustment mechanism includes an adjustment plate, and a plurality of wind speed adjustment areas are formed on the side of the adjustment plate close to the aging board, and the distance between the wind speed adjustment area and the aging board decreases along the direction away from the guide mechanism; the fan corresponds to the inlet openings of the plurality of guide channels, and the heat dissipation mechanism is arranged below the chip to be tested. The wind speed above the aging board is adjusted by the wind speed adjustment mechanism, so that the wind speed is greater the farther away from the guide mechanism, thereby ensuring the heat dissipation effect on the chip farther away from the guide mechanism, reducing the temperature difference of the chip, and ensuring that the chip can have good temperature uniformity at different positions in the horizontal direction.

Description

Technical Field

[0001] The present invention relates to the field of chip testing technology, and in particular to a chip aging testing device. Background Art

[0002] At present, the market demand for high-computing power GPUs is increasing day by day. High-computing power GPUs have a common characteristic of high heat generation power, which brings some troubles to chip aging tests. How to control the chip aging test temperature is a relatively important issue. Under high-power heating conditions, if the temperature is not well controlled, the large temperature difference inside the chip will cause some micro cracks.

[0003] At present, mature solutions on the market all use air cooling to control the temperature of chip aging. Under the existing technology, the heat generation power of GPU is relatively small, generally below 500W, and the uneven heat distribution at different positions does not bring a big impact, so the general air cooling design can meet the test requirements. With the iteration of technology, the current latest GPU heat generation power is as high as 1000W. After testing, if there is no interference, the temperature difference at different positions of the GPU is greater than 50℃. Due to the temperature difference, the internal expansion and contraction deformation of the chip will be inconsistent, which is very likely to cause micro cracks in the chip. Summary of the invention

[0004] In view of this, the embodiment of the present specification provides a chip aging test device, which guides the cooling air by setting a guide mechanism to ensure that the air volume of each layer of chips to be tested is the same, and sets a wind speed adjustment mechanism above each aging board. The wind speed adjustment mechanism adjusts the wind speed above the aging board so that the farther the wind speed is from the guide mechanism, the greater the wind speed is, thereby ensuring the heat dissipation effect of the chips farther away from the guide mechanism, reducing the temperature difference of the chips, and ensuring that the chips at different positions in the horizontal direction can have good temperature uniformity.

[0005] The embodiments of this specification provide the following technical solutions: a chip aging test device, comprising:

[0006] A box body, wherein a plurality of aging boards are arranged in the box body, and a plurality of chips to be tested are installed on each aging board;

[0007] A flow guiding mechanism, wherein the flow guiding mechanism forms a plurality of the flow guiding channels, and the outlet openings of the plurality of the flow guiding channels respectively correspond to the plurality of layers of the aging plates;

[0008] A plurality of wind speed regulating mechanisms, each of which is located above the plurality of aging boards, and each of which comprises an adjusting plate, wherein a plurality of wind speed regulating areas are formed on one side of the adjusting plate close to the aging board, and a distance between the wind speed regulating area and the aging board decreases along a direction away from the guide mechanism;

[0009] A fan, the fan corresponding to the inlet openings of the plurality of guide channels;

[0010] A heat dissipation mechanism is arranged on a side of the chip to be tested away from the aging board, and the heat dissipation mechanism dissipates heat from the side of the chip to be tested away from the aging board.

[0011] Preferably, the adjustment plate includes a first area, a second area and a third area, the thicknesses of the first area, the second area and the third area increase successively, a first wind speed adjustment area is formed between the first area and the aging plate, a second wind speed adjustment area is formed between the second area and the aging plate, and a third wind speed adjustment area is formed between the third area and the aging plate.

[0012] Preferably, the first area is an area where the adjustment plate is close to the guide mechanism, the third area is an area where the adjustment plate is away from the guide mechanism, and the second area is an area between the first area and the third area.

[0013] Preferably, the thickness of the first region is 1 / 5 to 2 / 5 of the thickness of the third region;

[0014] The thickness of the second region is 3 / 5-4 / 5 of the thickness of the third region.

[0015] Preferably, the thickness of the third region is 15 mm to 30 mm.

[0016] Preferably, the distance between the adjustment plate and the aging plate gradually decreases along the direction away from the guide mechanism.

[0017] Preferably, the guide mechanism includes a guide plate, in which a plurality of guide channels isolated from each other are opened, the inlet opening widths of the plurality of guide channels are the same, the outlet opening widths of the plurality of guide channels are the same, and the intervals between the plurality of guide channels are the same.

[0018] Preferably, the testing device further comprises a cooling mechanism, which is disposed in the box and cools down the fluid after absorbing the heat of the chip to be tested.

[0019] Preferably, the cooling mechanism includes an evaporator.

[0020] Preferably, the heat dissipation mechanism comprises a water cooling mechanism, and the water cooling mechanism comprises a plurality of water cooling plates, and the plurality of water cooling plates are respectively arranged under the plurality of chips to be tested, and the water cooling plates are provided with a liquid inlet and a liquid outlet.

[0021] Compared with the prior art, the at least one technical solution adopted in the embodiments of this specification can achieve the following beneficial effects:

[0022] By setting up a guide mechanism to guide the cooling air, the air volume of each layer of chips to be tested is guaranteed to be the same. By setting up a wind speed adjustment mechanism above each layer of aging boards, the wind speed adjustment mechanism adjusts the wind speed above the aging board so that the wind speed is greater the farther away from the guide mechanism, thereby ensuring the heat dissipation effect on the chips farther away from the guide mechanism, reducing the temperature difference of the chips, and ensuring that the chips have good temperature uniformity at different positions in the horizontal direction. At the same time, by setting up a heat dissipation mechanism below the chip to be tested, the heat dissipation mechanism dissipates the bottom of the chip, thereby avoiding a large temperature difference between the upper and lower sides of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a structural schematic diagram of the chip aging test device provided by the present application;

[0025] Figure 2 It is a structural schematic diagram of the adjustment mechanism of the chip aging test device provided by the present application;

[0026] Figure 3 It is a schematic diagram of the distribution of the adjustment mechanism and aging board of the chip aging test device provided by the present application;

[0027] Figure 4 It is a schematic diagram of the water cooling mechanism of the chip aging test device provided by the present application after installation;

[0028] Figure 5 It is a structural schematic diagram of the flow guiding mechanism of the chip aging test device provided by the present application;

[0029] Figure 6 It is an enlarged structural schematic diagram of the flow guiding mechanism of the chip aging test device provided by the present application;

[0030] Figure 7 It is another structural schematic diagram of the adjustment mechanism provided in this application.

[0031] Figure 8 It is a schematic diagram of air cooling design in the prior art.

[0032] In the figure, 1, box body; 2, guide mechanism; 21, guide plate; 22, guide channel; 3, wind speed adjustment mechanism; 31, first area; 32, second area; 33, third area; 34, adjustment plate; 4, aging board; 5, chip to be tested; 6, fan; 7, water cooling mechanism; 8, cooling mechanism. DETAILED DESCRIPTION

[0033] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0034] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0035] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0036] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0037] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects described may be practiced without these specific details.

[0038] At present, mature solutions on the market all use air cooling to control the temperature of chip aging. Under the existing technology, the heat dissipation power of GPU is relatively small, generally below 500W, and the uneven heat dissipation distribution at different positions does not bring a big impact. Therefore, the general air cooling design can meet the test requirements. The existing air cooling design is generally as follows: Figure 8 As shown. With the iteration of technology, the current latest GPU heat power is as high as 1000W. After testing, if no interference is made, the temperature difference at different positions of the GPU is greater than 50°C. Due to this temperature difference, the expansion and contraction deformation inside the chip will be inconsistent, which is very likely to cause micro cracks in the chip.

[0039] The inventor has designed a chip aging test device after extensive and in-depth experiments.

[0040] The technical problem solved by the present invention is: how to ensure that the temperature difference of a high-power GPU is controlled within a certain range.

[0041] The technical solutions provided by various embodiments of the present application are described below in conjunction with the accompanying drawings.

[0042] like Figure 1-Figure 6 As shown, a chip aging test device comprises:

[0043] A box 1, wherein a plurality of aging boards 4 are arranged in the box 1, and the plurality of aging boards 4 are sequentially distributed along the vertical direction, and a plurality of chips 5 to be tested are installed on each layer of the aging boards 4;

[0044] A flow guiding mechanism 2, wherein the flow guiding mechanism 2 forms a plurality of flow guiding channels 22, and the outlet openings of the plurality of flow guiding channels 22 correspond to the plurality of layers of the aging plates 4 respectively;

[0045] A plurality of wind speed regulating mechanisms 3, each of which is located above the plurality of aging plates 4, and each of which comprises an adjusting plate 34, wherein a plurality of wind speed regulating areas are formed on one side of the adjusting plate 34 close to the aging plate 4, and a distance between the wind speed regulating area and the aging plate 4 decreases along a direction away from the guide mechanism 2;

[0046] A fan 6, wherein the fan 6 corresponds to the inlet openings of the plurality of guide channels 22;

[0047] The heat dissipation mechanism is arranged on a side of the chip to be tested 5 away from the aging board 4 , and the heat dissipation mechanism dissipates heat from the side of the chip to be tested 5 away from the aging board 4 .

[0048] Cooling air is blown into the inlet openings of the plurality of guide channels 22 through the fan 6, and the cooling air evenly enters the plurality of guide channels 22. The cooling air flows into each layer of the aging board 4 through the outlet openings of the plurality of guide channels 22 respectively, and the cooling air flows in the direction away from the outlet openings of the guide channels 22 to absorb heat from the chip to be tested 5 on the aging board 4. As the flow distance of the cooling air increases, the temperature of the cooling air gradually increases, resulting in a poor heat dissipation effect on the chip. The wind speed regulating mechanism 3 regulates the wind speed above the aging board 4. In the direction away from the guide mechanism 2, the distance between the wind speed regulating area and the aging board 4 decreases. Under the same flow rate, the smaller the flow channel cross-section, the greater the flow rate, so that the wind speed is greater the farther away from the guide mechanism 2, thereby ensuring the heat dissipation effect on the chip farther away from the guide mechanism 2, reducing the temperature difference of the chip, and ensuring that the chip has good temperature uniformity at different positions in the horizontal direction. By arranging a heat dissipation mechanism below the chip to be tested 5, the heat dissipation mechanism dissipates heat from the bottom of the chip, which can avoid a large temperature difference between the upper and lower sides of the chip.

[0049] It should be noted that the number of guide channels 22 is the same as the number of aging plates 4 , each guide channel 22 corresponds to an aging plate 4 , the number of wind speed adjustment mechanisms 3 is the same as the number of aging plates 4 , and a wind speed adjustment mechanism 3 is arranged above each aging plate 4 .

[0050] It should also be noted that the fan 6 is a centrifugal fan, which can efficiently convert electrical energy or power energy into airflow kinetic energy, provide strong wind force and pressure, and provide a pressure difference so that the gas can flow smoothly in the box 1.

[0051] like Figure 1-Figure 3 As shown, in some embodiments, the adjustment plate 34 includes a first area 31, a second area 32 and a third area 33, and the thicknesses of the first area 31, the second area 32 and the third area 33 increase successively, and a first wind speed adjustment area is formed between the first area 31 and the aging plate 4, a second wind speed adjustment area is formed between the second area and the aging plate 4, and a third wind speed adjustment area is formed between the third area 33 and the aging plate 4. By arranging the first area 31, the second area 32 and the third area 33 with increasing thicknesses successively on the adjustment plate 34, the distances between the first area 31, the second area 32 and the third area 33 and the aging plate 4 are respectively reduced successively, so that the same cooling air flow rate gradually increases in the first wind speed adjustment area, the second wind speed adjustment area and the third wind speed adjustment area.

[0052] It should be noted that, in this embodiment, three chips to be tested 5 are arranged under each aging board 4, and the three chips to be tested 5 correspond to the first area 31, the second area 32 and the third area 33 respectively. The adjustment board 34 can be evenly segmented to form the first area 31, the second area 32 and the third area 33, or it can be unevenly segmented.

[0053] It should also be noted that in other embodiments, the adjustment plate 34 can also be divided into two groups, four groups, five groups, etc. of areas, which can be set according to actual conditions. It only needs to ensure that the thickness of the area increases successively in the direction away from the guide mechanism 2.

[0054] like Figure 1-Figure 3 As shown, in some embodiments, the first area 31 is the area where the adjustment plate 34 is close to the guide mechanism 2, the third area 33 is the area where the adjustment plate 34 is away from the guide mechanism 2, and the second area 32 is the area between the first area 31 and the third area 33. The thickness of the first area 31 is the smallest, so that the flow channel between the first area 31 and the aging plate 4 is larger. Under the same cooling air flow rate, the flow velocity of the first area 31 is the slowest, and the thickness of the second area 32 is in the middle. Under the same cooling air flow rate, the flow velocity of the second area 32 is greater than the flow velocity of the first area 31. The thickness of the third area 33 is the largest. Under the same cooling air flow rate, the flow velocity of the third area 33 is greater than the flow velocity of the second area 32. Therefore, the first area 31 is located closest to the guide mechanism 2, and the third area 33 is located farthest from the guide mechanism 2.

[0055] It should be noted that the upper surface of the wind speed adjustment plate 34 is a flat surface, an inclined first guide surface is provided between the first area 31 and the second area 32 , and an inclined second guide surface is provided between the second area 32 and the third area 33 .

[0056] like Figure 1-Figure 3 As shown, in some embodiments, the thickness of the first area 31 is 1 / 5 to 2 / 5 of the thickness of the third area 33; the thickness of the second area 32 is 3 / 5-4 / 5 of the thickness of the third area 33. By setting the thickness of the first area 31 to 1 / 5 to 2 / 5 of the thickness of the third area 33 and setting the thickness of the second area 32 to 3 / 5-4 / 5 of the thickness of the third area 33, the cooling wind flow rates of the first area 31, the second area 32 and the third area 33 are changed, which can ensure that the cooling effects of the aging board 4 areas corresponding to the first area 31, the second area 32 and the third area 33 are basically the same, thereby ensuring the uniformity of the temperature of the aging board 4.

[0057] like Figure 1-Figure 3As shown, in some embodiments, the thickness of the third region 33 is 15 mm to 30 mm. By limiting the thickness of the third region 33, testing is facilitated.

[0058] It should be noted that the distance between the lower surface of the third region 33 and the aging plate 4 is generally set to be between 1 and 1.5 times the thickness of the third region 33, which can ensure the normal flow of cooling air.

[0059] like Figure 7 As shown, in some embodiments, the distance between the adjustment plate 34 and the aging plate 4 gradually decreases along the direction away from the guide mechanism 2. In this embodiment, the side of the adjustment plate 34 close to the aging plate 4 can be set as an inclined surface, and the inclined surface gradually approaches the aging plate 4 along the direction away from the guide mechanism 2.

[0060] like Figure 1 and Figure 5-Figure 6 As shown, in some embodiments, the guide mechanism 2 includes a guide plate 21, and a plurality of guide channels 22 isolated from each other are opened in the guide plate 21, the inlet opening widths of the plurality of guide channels 22 are the same, the outlet opening widths of the plurality of guide channels 22 are the same, and the intervals between the plurality of guide channels 22 are the same. By setting the inlet opening of each guide channel 22 to the same size and the intervals between each guide channel 22 to the same size, the same amount of air entering the guide channel 22 from the fan 6 is ensured.

[0061] It should be noted that the guide plate 21 is in a horizontal “L” shape, and the inlet openings of the plurality of guide channels 22 are all located directly above the fan 6 .

[0062] It should also be noted that, in this embodiment, 10 layers of aging boards 4 are provided, 10 guide channels 22 are provided, and each guide channel 22 corresponds to one aging board 4. In other embodiments, the aging boards 4 may also be other numbers, and the number of guide channels 22 and aging boards 4 is the same.

[0063] like Figure 1 As shown, in some embodiments, the testing device further includes a cooling mechanism 8, which is disposed in the box body 1. The cooling mechanism 8 cools the fluid after absorbing the heat of the chip to be tested 5. By arranging the cooling mechanism 8 in the box body 1, the cooling mechanism 8 cools the fluid after absorbing the heat of the chip to be tested 5, and the fan 6 blows the cooled fluid to the guide mechanism 2 to realize the circulation of the fluid.

[0064] It should be noted that the circulation process of the fluid is as follows: under the action of the fan 6, the low-temperature fluid passes through the guide mechanism 2 and then enters the wind speed regulating mechanism 3. In the wind speed regulating mechanism 3, the cold air is heated by the high-temperature chip to be tested 5 and its temperature rises to form a high-temperature fluid. Because of the pressure difference created by the fan 6, the high-temperature fluid flows downward and enters the right side of the cooling mechanism 8. The cooling mechanism 8 cools down the fluid after absorbing the heat of the chip to be tested 5, and the cooled fluid flows to the fan 6 under the action of the pressure difference.

[0065] In this embodiment, the cooling mechanism 8 includes an evaporator, which cools the high-temperature fluid. The heat flow is converted into a low-temperature fluid after heat exchange through the evaporator, so that the fluid completes heat exchange inside the box 1.

[0066] In other embodiments, the cooling mechanism 8 may also be other structures as long as it can achieve heat exchange from the heat flow to the low-temperature fluid.

[0067] like Figure 1 and Figure 3-Figure 4 As shown, in some embodiments, the heat dissipation mechanism includes a water cooling mechanism 7, and the water cooling mechanism 7 includes a plurality of water cooling plates, and the plurality of water cooling plates are respectively arranged under the plurality of chips to be tested 5, and a liquid inlet and a liquid outlet are arranged on the water cooling plate. By setting the water cooling mechanism 7, the cooling liquid enters the cooling plate from the liquid inlet and flows out from the liquid outlet, and the bottom of the chip to be tested 5 is cooled to ensure that during the aging process, the temperature difference between the upper and lower surfaces of the chip to be tested 5 is controlled within a smaller range, such as ±10°C.

[0068] It should be noted that, in other embodiments, the heat dissipation mechanism may also use an air cooling mechanism or other liquid cooling mechanism to dissipate heat from the bottom of the chip to be tested 5 , and it is only necessary to ensure that the temperature difference between the upper and lower surfaces of the chip to be tested 5 is controlled within an appropriate range.

[0069] The same or similar parts between the various embodiments in this specification can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the method embodiment described later, since it corresponds to the system, the description is relatively simple, and the relevant parts can be referred to the partial description of the system embodiment.

[0070] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A chip aging test device, characterized in that: include: A box body, wherein a plurality of aging boards are arranged in the box body, and a plurality of chips to be tested are installed on each aging board; A flow guiding mechanism, wherein the flow guiding mechanism forms a plurality of flow guiding channels, and the outlet openings of the plurality of flow guiding channels respectively correspond to the plurality of layers of the aging plates; A plurality of wind speed regulating mechanisms, each of which is located above the plurality of aging plates, and each of which comprises an adjusting plate, wherein a plurality of wind speed regulating areas are formed on one side of the adjusting plate close to the aging plate, and the distance between the wind speed regulating area and the aging plate decreases along the direction away from the guide mechanism, so that the wind speed increases as the distance from the guide mechanism increases; A fan, wherein the fan corresponds to the inlet openings of the plurality of guide channels, and the air volume entering each of the guide channels from the fan is the same; A heat dissipation mechanism is arranged on a side of the chip to be tested away from the aging board, and the heat dissipation mechanism dissipates heat from the side of the chip to be tested away from the aging board.

2. The chip aging test device according to claim 1, characterized in that: The adjustment plate includes a first area, a second area and a third area, the thicknesses of the first area, the second area and the third area increase successively, a first wind speed adjustment area is formed between the first area and the aging plate, a second wind speed adjustment area is formed between the second area and the aging plate, and a third wind speed adjustment area is formed between the third area and the aging plate.

3. The chip aging test device according to claim 2, characterized in that: The first area is an area where the adjustment plate is close to the guide mechanism, the third area is an area where the adjustment plate is far from the guide mechanism, and the second area is an area between the first area and the third area.

4. The chip aging test device according to claim 3, characterized in that: The thickness of the first region is 1 / 5 to 2 / 5 of the thickness of the third region; And / or, the thickness of the second region is 3 / 5-4 / 5 of the thickness of the third region.

5. The chip aging test device according to claim 4, characterized in that: The thickness of the third region is 15 mm to 30 mm.

6. The chip aging test device according to claim 1, characterized in that: The distance between the adjustment plate and the aging plate gradually decreases along the direction away from the guide mechanism.

7. The chip aging test device according to any one of claims 1 to 6, characterized in that: The guide mechanism includes a guide plate, in which a plurality of guide channels isolated from each other are provided, the inlet opening widths of the plurality of guide channels are the same, the outlet opening widths of the plurality of guide channels are the same, and the intervals between the plurality of guide channels are the same.

8. The chip aging test device according to any one of claims 1 to 6, characterized in that: The testing device further comprises a cooling mechanism, which is disposed in the box and cools the fluid after absorbing the heat of the chip to be tested.

9. The chip aging test device according to claim 8, characterized in that: The temperature reduction mechanism includes an evaporator.

10. The chip aging test device according to any one of claims 1 to 6, characterized in that: The heat dissipation mechanism comprises a water cooling mechanism, and the water cooling mechanism comprises a plurality of water cooling plates, and the plurality of water cooling plates are respectively arranged under the plurality of chips to be tested, and the water cooling plates are provided with a liquid inlet and a liquid outlet.

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