An automatic wafer handling system at high altitude and a handling method thereof

Abstract

The application discloses a high-altitude wafer automatic carrying system and a carrying method thereof, and comprises a semiconductor main equipment loading and unloading machine, wherein the semiconductor main equipment loading and unloading machine is provided with a wafer box, the semiconductor main equipment loading and unloading machine is provided with a lifting mechanism, the lifting mechanism is provided with a moving mechanism, the lifting mechanism is provided with a clamping mechanism, the lower portion of the lifting mechanism is provided with a connecting conveying line, the side of the connecting conveying line is provided with a rotating mechanism, the top of the semiconductor main equipment loading and unloading machine is provided with a first conveying line and a second conveying line, and the rotating mechanism is located between the first conveying line and the second conveying line. Through the matched setting mode of the lifting mechanism, the first conveying line and the second conveying line, the first conveying line and the second conveying line are used for high-altitude conveying of the wafer box, the belt wheel is used for winding and releasing the lifting belt, the wafer box can be conveniently unloaded, the wafer box can be conveniently carried from a certain height, the wafer can be conveniently carried automatically at a high altitude, and the cost can be conveniently reduced.

Description

Technical Field

[0001] This invention relates to the field of automated high-altitude wafer handling, and particularly to an automated high-altitude wafer handling system and its handling method. Background Technology

[0002] In semiconductor manufacturing, wafers need to be moved between different workstations. Wafers are usually carried in wafer cassettes. When handling wafers, they need to be moved, which requires the use of wafer handling equipment.

[0003] The wafer handling method used in existing semiconductor factories is OHT (Out-of-Touch) handling. OHT typically includes overhead rails and transport vehicles, also known as overhead cranes. Overhead cranes are used to move wafers. When there are multiple wafer handling locations, multiple handling systems are used, which in turn requires multiple overhead cranes.

[0004] However, the cost of a single OHT transporter is very high, and the entire transport system requires many transporters to move around in a cycle. As a result, the entire wafer transport line setup requires very high costs. At the same time, the overhead crane has a complex structure and is not easy to maintain, which makes it inconvenient to transport wafers. Summary of the Invention

[0005] The purpose of this invention is to provide an automated high-altitude wafer handling system and method to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a high-altitude automated wafer handling system, comprising:

[0007] A semiconductor main equipment loading and unloading machine, wherein a wafer cassette is provided on the side of the semiconductor main equipment loading and unloading machine;

[0008] The semiconductor main equipment loading and unloading machine is provided with a lifting mechanism for moving the wafer cassette position above it, and a moving mechanism for sliding the lifting mechanism is provided on the top of the lifting mechanism.

[0009] The bottom of the lifting mechanism is provided with a clamping mechanism for lifting and limiting the wafer cassette. Below the lifting mechanism is a connecting conveyor line for transferring the wafer cassette. The side of the connecting conveyor line is provided with a rotating mechanism for adjusting the conveying position of the wafer cassette.

[0010] The semiconductor main equipment loading and unloading machine is provided with a first conveyor line and a second conveyor line on its top. The rotating mechanism is located on the first conveyor line and the second conveyor line, and the rotating mechanism is located on the side of the connecting conveyor line.

[0011] Preferably, the lifting mechanism includes a lifting box, a top plate, a pulley, an auxiliary wheel, a fixing frame, and a lifting belt. The top plate is embedded inside the lifting box. One end of the auxiliary wheel is rotatably connected to the fixing frame. The fixing frame is fixedly connected to the top of the top plate. One end of the lifting belt is fixedly connected to the inside of the pulley. The lifting belt is located outside the auxiliary wheel. The top of the top plate has a first through groove symmetrically formed. The top of the top plate has a second through groove formed. The pulley is rotatably connected to the inside of the first through groove. The lifting belt is slidably inserted into the inner cavity of the second through groove. The side of the lifting belt has a first locking tooth.

[0012] Preferably, the lifting mechanism further includes a first motor, a connecting shaft, a positioning frame, a rotating wheel, a drive wheel, and a drive belt. The first motor is fixedly connected to the bottom end of the top plate. The outer wall of the connecting shaft is fixedly inserted into the middle of the pulley. The outer wall of the connecting shaft is fixedly inserted into the middle of the rotating wheel. One end of the connecting shaft is rotatably connected to the positioning frame. The top end of the positioning frame is fixedly connected to the top plate. The output end of the first motor is connected to the drive wheel. The drive belt is located between the rotating wheel and the drive wheel.

[0013] Preferably, the clamping mechanism includes a fixed box, a cover plate, a support plate, a support cylinder, and a second motor. The cover plate is fixedly connected to the top of the fixed box, and a third through groove is provided at the top of the cover plate. The lifting belt is slidably inserted into the inner cavity of the third through groove. The support plate is fixedly connected to the inside of the fixed box, and the support cylinder is fixedly connected between the support plate and the cover plate. The second motor is fixedly connected to the top of the support plate, and an auxiliary seat is fixedly connected to the bottom of the support plate. A sliding plate is slidably arranged inside the auxiliary seat, and a clamping frame is fixedly connected to the bottom of the sliding plate.

[0014] Preferably, the auxiliary seat has a fourth through groove in the middle, and a fifth through groove is formed on the inner wall of the fourth through groove. A first gear is rotatably connected to the inner cavity of the fifth through groove, and a second gear is rotatably connected to the inner cavity of the fifth through groove. The first gear and the second gear mesh with each other. A drive seat is rotatably connected to the top of the first gear, and the bottom of the drive seat is rotatably connected to the sliding plate. A first reversing gear is driven to the output end of the second motor, and a second reversing gear is fixedly connected to the top of the second gear. The first reversing gear and the second reversing gear are in contact with each other.

[0015] Preferably, a clamping seat is fixedly connected to the top of the wafer box, a carrier seat is fixedly connected inside the fixed box, a snap-fit ​​seat is provided on the side of the carrier seat, a second snap-fit ​​tooth is provided on the side of the snap-fit ​​seat, the second snap-fit ​​tooth engages with the first snap-fit ​​tooth, and the side of the snap-fit ​​seat is fixedly connected to the carrier seat.

[0016] Preferably, the moving mechanism includes a support guide rail, an auxiliary guide rail, a driving component, and a traction component. The driving component is slidably disposed at the bottom of the support guide rail, the traction component is fixedly connected to the top of the lifting box, the traction component is located at the bottom of the auxiliary guide rail, and the bottom of the driving component is slidably connected to the auxiliary guide rail.

[0017] Preferably, the rotating mechanism includes an assembly plate, a connecting box, a support conveyor line, a guide wheel, and a third motor. The third motor is fixedly connected to the bottom of the assembly plate, and the output end of the third motor is connected to the support conveyor line for transmission. The guide wheel is rotatably connected to the side of the support conveyor line. Position sensors are installed on both the support conveyor line and the connecting conveyor line.

[0018] A method for automated handling of high-altitude wafers includes the following specific steps:

[0019] Step 1: Draw or import the conveyor line layout diagram to form a dataset;

[0020] Step 2: Classify the nodes in the dataset obtained in Step 1, including storage sites, routes, and basic device data;

[0021] Step 3: Create the basic data table for optimal path calculation;

[0022] Step 4: The wafer cassette enters the conveyor line from any storage site, and its unique number is read by radio frequency identification, waiting for the host system to generate the target storage site;

[0023] Step 5: Calculate the optimal path between the starting point and the destination using a path algorithm, where the path algorithm is F(n) = g(n) + h(n), g(n) is the actual cumulative cost from the starting node to node n, and h(n) is the heuristically estimated cost from node n to the target node.

[0024] Step 6: If an optimal path exists, the wafer cassette begins transportation, selecting the corresponding path branch based on the known path nodes, until the target storage site is reached;

[0025] Step 7: If no optimal path exists, notify the host system to generate an alarm and generate an automatic backflow task to return to the storage site.

[0026] Preferably, the path algorithm implementation steps in step five are as follows:

[0027] S1: Create an open list to store the nodes to be processed. Initially, it only contains the starting node and assigns it g(n) = 0 and the corresponding h(n);

[0028] S2: Create a closed list to store the processed nodes, initially empty;

[0029] S3: Select the node current with the smallest evaluation function F(n) value from the open list;

[0030] S4: If current is the target node, the algorithm ends, and the shortest path has been found;

[0031] S5: Otherwise, move current to the closed list and operate on all its unprocessed adjacent nodes. Specifically, calculate the g(n) value of the new node neighbor (g(neighbor) = g(current) + cost(current->neighbor)). If neighbor is not in the open list or the newly calculated g(n) value is less than the existing g(n) value, update neighbor's g(n) and F(n) and set its parent node to current. If neighbor was not added to the open list before, repeat S3 until the target node is found or the open list is empty.

[0032] The technical effects and advantages of this invention are as follows:

[0033] (1) The present invention utilizes a combination of a lifting mechanism, a first conveyor line and a second conveyor line to transport the wafer box at high altitude. The first motor drives the drive wheel to rotate, the drive wheel and the drive belt drive the pulley, and the pulley winds up and releases the lifting belt. This facilitates the unloading of the wafer box and allows the wafer box to be transported and lowered from a certain height. This makes it easier to carry out high-altitude automated handling of wafers and reduce costs.

[0034] (2) By using a combination of a rotating mechanism and a connecting conveyor line, the rotating mechanism causes the wafer box on the first or second conveyor line to change its orientation, so that the wafer box is transported by the connecting conveyor line and then operated by the lifting mechanism, which is beneficial for unloading the wafer box and facilitates automated handling of the wafer box.

[0035] (3) The present invention utilizes a combination of a fixed box, a cover plate, a support plate, a support cylinder, a second motor, a first reversing gear, a second reversing gear, a first gear, a second gear, a drive seat, a sliding plate, a clamping frame, and a clamping seat. The drive seat drives the sliding plate to move the clamping frame, and the clamping frame is clamped on the outside of the clamping seat, which facilitates the clamping and fixing of the wafer box and enables automatic handling of the wafer box. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0037] Figure 2 This is a schematic diagram of the front structure of the present invention.

[0038] Figure 3 This is a schematic diagram of the lifting box structure of the present invention.

[0039] Figure 4 This is a schematic diagram of the structure at the pulley of the present invention.

[0040] Figure 5 This is a schematic diagram of the structure at the drive wheel of the present invention.

[0041] Figure 6 This is a schematic diagram of the structure of the fixing box of the present invention.

[0042] Figure 7 This is a schematic diagram of the structure of the support plate of the present invention.

[0043] Figure 8 This is a schematic diagram of the sliding plate structure of the present invention.

[0044] Figure 9 This is a schematic diagram of the clamping frame structure of the present invention.

[0045] Figure 10 This is a schematic diagram of the lifting belt structure of the present invention.

[0046] Figure 11 This is a top view structural diagram of the assembly plate of the present invention.

[0047] Figure 12 This is a schematic diagram of the structure of the third motor in this invention.

[0048] Figure 13 This is a schematic diagram of the structure of the positioning sensor of the present invention.

[0049] Figure 14 This is a schematic diagram of the clamping seat structure of the present invention.

[0050] Figure 15 This is a block diagram of the functional structure of the control board of the present invention.

[0051] In the diagram: 1. Semiconductor main equipment loading and unloading machine; 2. Wafer box; 3. Clamping mechanism; 31. Fixing box; 32. Cover plate; 33. Support plate; 34. Support cylinder; 35. Second motor; 36. First reversing gear; 37. Second reversing gear; 38. First gear; 39. Second gear; 310. Sliding plate; 311. Clamping frame; 4. Lifting mechanism; 41. Lifting box; 42. Top plate; 43. Pulley; 44. Auxiliary wheel; 45. Fixing frame; 46. Lifting belt; 461. Socket ; 462, bearing seat; 47, first motor; 48, connecting shaft; 49, positioning frame; 410, rotating wheel; 411, drive wheel; 412, drive belt; 5, moving mechanism; 51, support guide rail; 52, auxiliary guide rail; 53, driving component; 6, rotating mechanism; 61, assembly plate; 62, connecting box; 63, support conveyor line; 64, guide wheel; 65, third motor; 66, positioning sensor; 7, first conveyor line; 8, second conveyor line; 9, connecting conveyor line; 10, clamping seat. Detailed Implementation

[0052] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0053] This invention provides, for example Figure 1-15The high-altitude automated wafer handling system shown includes a semiconductor main equipment loading and unloading machine 1. A wafer box 2 is installed on the side of the semiconductor main equipment loading and unloading machine 1. The high-altitude wafer box automatic semi-circular system also includes a drive control board. The drive control board allows a single board to control a motor independently and communicate with a host computer, or multiple boards to cascade and control multiple motors and communicate with the host computer via a bus, achieving control and scheduling functions. It also facilitates real-time monitoring and storage of motion status. The board implements power isolation to avoid the risk of damage caused by short circuits or abnormalities between cascaded components. The drive control board includes an isolated power supply unit, a main control unit, a storage unit, an isolated input unit, an isolated output unit, an isolated drive unit, an isolated communication unit, and a protection unit. The isolated power supply unit isolates the control boards of the cascaded motion modules, preventing power interference between them and ensuring stable power supply within the board. Qualitatively, the main control unit primarily handles communication, detection and data processing, control and output between cascaded modules, as well as data storage. The storage unit mainly stores parameter settings and recent relevant data for easy subsequent inspection and maintenance. The isolated input unit primarily detects the sensors of the motion module and the output signals from the upper level. The isolated output unit mainly controls the output to the lower-level I / O signals, controls abnormal output signals, and other related safety indication signals. The isolated drive unit mainly controls the motor drive, enabling the motion module's track rotation. The isolated communication unit's main function is to achieve communication with the scheduling system, real-time data upload, and communication between cascaded modules. This communication includes two protocols: CAN bus and RS485. The protection unit mainly includes overvoltage, overcurrent, ESD, surge protection, and reverse connection protection, ensuring the protection of the control board in abnormal situations. Figure 15 As shown, the internal electrical connections of the control board are implemented as follows: the input power supply is connected to the isolated power supply unit, which has multiple output isolation voltages, which are respectively connected to the main control unit, isolated input unit, isolated output unit, isolated drive unit, and isolated communication unit to provide power supply isolation. The main control unit and the storage unit are connected via I2C communication for parameter setting and real-time data storage. The isolated input unit is connected to the main control unit via IO signals to isolate detection input signals, such as sensor signals or upper-level output signals. The isolated output unit is connected to the main control unit via IO signals to isolate control output IO signals or abnormal signals. The isolated drive unit is connected to the main control unit via IO signals to drive the motor through the driver IC to realize track motion transmission. The isolated communication unit is connected to the main control unit via CAN bus or RS485 communication to realize communication with the scheduling system and communication between cascaded systems. The protection unit includes multiple protection functions, including overvoltage, overcurrent, surge protection, and reverse connection protection at the isolated power supply unit, and ESD protection and overcurrent protection at other units.

[0054] Furthermore, a lifting mechanism 4 for moving the wafer cassette 2 is provided above the semiconductor main equipment loading and unloading machine 1. A moving mechanism 5 for sliding the lifting mechanism 4 is provided at the top of the lifting mechanism 4. A clamping mechanism 3 for lifting and limiting the wafer cassette 2 is provided at the bottom of the lifting mechanism 4. A connecting conveyor line 9 for transferring the wafer cassette 2 is provided below the lifting mechanism 4. The connecting conveyor line 9 facilitates the connection of the wafer cassette 2 and makes it easy for the lifting mechanism 4 to remove the wafer cassette 2. A rotating mechanism 6 for adjusting the conveying orientation of the wafer cassette 2 is provided on the side of the connecting conveyor line 9. A first conveyor line 7 and a second conveyor line 8 are provided at the top of the semiconductor main equipment loading and unloading machine 1. The rotating mechanism 6 is located on the first conveyor line 7 and the second conveyor line 8. The first conveyor line 7 and the second conveyor line 8 facilitate the high-altitude conveying of the wafer cassette 2, which saves ground space and allows for flexible layout of material placement points. The rotating mechanism 6 is located on the side of the connecting conveyor line 9.

[0055] Specifically, the lifting mechanism 4 includes a lifting box 41, a top plate 42, a pulley 43, an auxiliary wheel 44, a fixing frame 45, and a lifting belt 46. The lifting box 41 facilitates the movement of the lifting belt 46 within it. The pulley 43 facilitates the winding or unwinding of the lifting belt 46, thereby facilitating the lifting operation of the wafer cassette 2. The auxiliary wheel 44 guides the movement of the lifting belt 46. The fixing frame 45 supports and fixes the auxiliary wheel 44. The lifting belt 46 facilitates the lifting operation of the fixing box 41, thereby facilitating the lifting operation of the wafer cassette 2. The top plate 42 is embedded inside the lifting box 41. One end of the auxiliary wheel 44 is rotatably connected to the fixing frame 45, and the fixing frame 45 is fixedly connected to the top plate 41. At the top of the 2, one end of the lifting belt 46 is fixedly connected to the inside of the pulley 43. The lifting belt 46 is located outside the auxiliary wheel 44. The top of the top plate 42 has a first through groove symmetrically opened, and the top of the top plate 42 has a second through groove. The pulley 43 is rotatably connected to the inside of the first through groove. The lifting belt 46 is slidably inserted into the inner cavity of the second through groove. The side of the lifting belt 46 is provided with a first retaining tooth. The lifting mechanism 4 also includes a first motor 47, a connecting shaft 48, a positioning frame 49, a rotating wheel 410, a drive wheel 411, and a drive belt 412. The first motor 47 is electrically connected to an external power supply through an external first switch. The first motor 47 facilitates the rotation of the drive wheel 411, which in turn facilitates the rotation of the connecting shaft 48. The connecting shaft 48 facilitates the rotation of the pulley 43, enabling it to be wound or released. The positioning frame 49 facilitates the installation of the connecting shaft 48. The drive wheel 411 facilitates the rotation of the rotating wheel 410 via the drive belt 412, thereby facilitating the rotation of the pulley 43. The first motor 47 is fixedly connected to the bottom end of the top plate 42. The outer wall of the connecting shaft 48 is fixedly inserted and connected to the middle of the pulley 43, and the outer wall of the connecting shaft 48 is fixedly inserted and connected to the middle of the rotating wheel 410. One end of the connecting shaft 48 is rotatably connected to the positioning frame 49, and the top end of the positioning frame 49 is fixedly connected to the top plate 42. The output end of the first motor 47 is connected to the drive wheel 411 via a drive belt 412. Located between the rotating wheel 410 and the drive wheel 411, a clamping seat 10 is fixedly connected to the top of the wafer cassette 2. The clamping seat 10 is conducive to cooperating with the clamping frame 311 to facilitate clamping and fixing the wafer cassette 2. A bearing seat 462 is fixedly connected inside the fixing box 31 to support the lifting belt 46. A snap-fit ​​seat 461 is provided on the side of the bearing seat 462 to snap and fix the lifting belt 46, thereby facilitating the installation and removal of the lifting belt 46 from the fixing box 31. A second snap-fit ​​tooth is provided on the side of the snap-fit ​​seat 461. The second snap-fit ​​tooth and the first snap-fit ​​tooth clamp and fix the lifting belt 46. The second snap-fit ​​tooth meshes with the first snap-fit ​​tooth. The side of the snap-fit ​​seat 461 is fixedly connected to the bearing seat 462.

[0056] Specifically, the clamping mechanism 3 includes a fixed box 31, a cover plate 32, a support plate 33, a support cylinder 34, and a second motor 35. The second motor 35 drives the first reversing gear 36 to rotate. The second motor 35 is electrically connected to an external power supply through an external second switch. The cover plate 32 is fixedly connected to the top of the fixed box 31. A third through groove is provided at the top of the cover plate 32. The lifting belt 46 is slidably inserted into the inner cavity of the third through groove. The support plate 33 is fixedly connected to the inside of the fixed box 31. The support cylinder 34 is fixedly connected between the support plate 33 and the cover plate 32. The second motor 35 is fixedly connected to the top of the support plate 33. An auxiliary seat is fixedly connected to the bottom of the support plate 33, which facilitates the sliding plate 310 to slide inside it. The sliding plate 310 is slidably arranged inside the auxiliary seat, which facilitates the movement of the clamping frame 311. The clamping frame 311 is fixedly connected to the bottom of the sliding plate 310. The clamping frame 311 facilitates the movement of the clamping seat 1. The 0 is clamped and fixed, which facilitates the clamping and fixing of the wafer cassette 2. A fourth through slot is opened in the middle of the auxiliary seat, and a fifth through slot is opened in the inner wall of the fourth through slot. A first gear 38 is rotatably connected to the inner cavity of the fifth through slot, and a second gear 39 is rotatably connected to the inner cavity of the fifth through slot. The second gear 39 facilitates the rotation of the first gear 38, which in turn facilitates the movement of the sliding plate 310 and facilitates the driving operation of the clamping frame 311. The first gear 38 and the second gear 39 mesh. The top of the first gear 38 is rotatably connected to the drive seat, and the bottom of the drive seat is rotatably connected to the sliding plate 310. The output end of the second motor 35 is driven by a first reversing gear 36, which facilitates the rotation of the second reversing gear 37. The top of the second gear 39 is fixedly connected to the second reversing gear 37, which facilitates the rotation of the second gear 39. The first reversing gear 36 and the second reversing gear 37 are in contact.

[0057] Specifically, the moving mechanism 5 includes a support rail 51, an auxiliary rail 52, a drive component 53, and a traction component. The support rail 51 is installed at a designated position to facilitate horizontal movement of the lifting box 41. The auxiliary rail 52 facilitates vertical movement of the lifting box 41. The drive component 53 facilitates sliding of the auxiliary rail 52 on the support rail 51. The traction component facilitates sliding of the lifting box 41 on the auxiliary rail 52. Both the drive component 53 and the traction component can be driven by wheel movement. The drive component 53 is slidably disposed at the bottom of the support rail 51. The traction component is fixedly connected to the top of the lifting box 41 and located at the bottom of the auxiliary rail 52. The bottom of the drive component 53 is slidably connected to the auxiliary rail 52.

[0058] Specifically, the rotating mechanism 6 includes an assembly plate 61, a connecting box 62, a support conveyor line 63, a guide wheel 64, and a third motor 65. The assembly plate 61 provides support for the support conveyor line 63, the connecting box 62 protects the third motor 65, and the circles inside the support conveyor line 63 represent the rotation range and do not obstruct the movement of the wafer cassette 2. The support conveyor line 63 facilitates receiving the wafer cassette 2 and simultaneously adjusts its rotational orientation for unloading. The guide wheel 64 facilitates receiving the wafer cassette 2. The third motor 65 is electrically connected to an external power supply via an external third switch. The third motor 65 drives the support conveyor line 63 to rotate. The third motor 65 is fixedly connected to the bottom of the assembly plate 61. The output end of the third motor 65 is connected to the support conveyor line 63 for transmission. The guide wheel 64 is rotatably connected to the side of the support conveyor line 63. Both the support conveyor line 63 and the connecting conveyor line 9 are equipped with position sensors 66. The position sensors 66 are used to sense the position of the wafer cassette 2 in order to stop or continue the conveying operation of the wafer cassette 2.

[0059] A method for automated high-altitude wafer handling includes drawing or importing a conveyor line layout diagram to form a dataset. The dataset obtained in step one is then categorized into nodes, including storage sites, routing, and basic equipment data, forming a basic data table for optimal path calculation. Wafer cassettes enter the conveyor line from any storage site, and their unique numbers are read via RFID. The system waits for the host system to generate the target storage site. A path algorithm is then implemented, with the following steps: creating an open list to store nodes to be processed (initially containing only the starting node, assigned g(n) = 0 and a corresponding h(n); creating a closed list to store processed nodes (initially empty); selecting the node `current` with the smallest evaluation function F(n) from the open list; if `current` is the target node, the algorithm terminates, indicating a shortest path has been found; otherwise, `current` is moved to the closed list, and operations are performed on all its unprocessed adjacent nodes. Specifically, the new node `neighbor` is calculated. The value of g(n) is calculated (g(neighbor) = g(current) + cost(current->neighbor)). If the neighbor is not in the open list or the newly calculated g(n) value is less than the existing g(n) value, the neighbor's g(n) and F(n) are updated, and its parent node is set to current. If the neighbor is not added to the open list before, S3 is repeated until the target node is found or the open list is empty. The optimal path between the starting point and the destination is calculated, where the path algorithm is F(n) = g(n) + h(n), g(n) is the actual cumulative cost from the starting node to node n, and h(n) is the heuristically estimated cost from node n to the target node. If an optimal path exists, the wafer box starts transportation, selects the corresponding path branch according to the known path nodes, and continues until the target storage site. If no optimal path exists, the upper system is notified to generate an alarm, and an automatic backflow task is generated to return to the storage site.

[0060] Working principle of this invention:

[0061] When the wafer cassette 2 needs to be automatically transported, the wafer cassette 2 is first transported on the first conveyor line 7 and the second conveyor line 8. When the wafer cassette 2 is unloaded, it enters the interior of the support conveyor line 63. Then, the position sensor 66 stops the wafer cassette 2 inside it. At this time, the third motor 65 drives the support conveyor line 63 to rotate, thereby rotating the support conveyor line 63 to correspond with the connecting conveyor line 9. Then, the wafer cassette 2 is sent out from the interior of the support conveyor line 63 and enters the interior of the connecting conveyor line 9. The position sensor 66 performs sensing operation.

[0062] After the wafer cassette 2 is in place, the drive unit 53 and the traction unit slide according to the position of the lifting box 41, so that the clamping frame 311 moves to the top of the wafer cassette 2. Then, the lifting box 41 releases the lifting belt 46, so that the clamping frame 311 moves to correspond with the clamping seat 10 on the wafer cassette 2. Then, the second motor 35 starts, so that the first reversing gear 36 and the second reversing gear 37 rotate. Then, the second gear 39 drives the first gear 38 to rotate, so that the first gear 38 drives the drive seat to slide. The drive seat drives the clamping frame 311 to move. The clamping frame 311 cooperates with the clamping seat 10 to clamp and fix the wafer cassette 2. Then, the lifting belt 46 lifts the wafer cassette 2 and transports it to the semiconductor main equipment loading and unloading machine 1.

[0063] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-altitude automated wafer handling system, comprising: Semiconductor main equipment loading and unloading machine (1), wherein a wafer box (2) is provided on the side of the semiconductor main equipment loading and unloading machine (1); The semiconductor main equipment loading and unloading machine (1) is characterized by having a lifting mechanism (4) for moving the position of the wafer cassette (2) above it, and a moving mechanism (5) for sliding the lifting mechanism (4) at the top of the lifting mechanism (4). The bottom of the lifting mechanism (4) is provided with a clamping mechanism (3) for lifting and limiting the wafer box (2), and a connecting conveyor line (9) for transferring the wafer box (2) is provided below the lifting mechanism (4). A rotating mechanism (6) for adjusting the conveying position of the wafer box (2) is provided on the side of the connecting conveyor line (9). The semiconductor main equipment loading and unloading machine (1) is provided with a first conveyor line (7) and a second conveyor line (8) on its top. The rotating mechanism (6) is located on the first conveyor line (7) and the second conveyor line (8), and the rotating mechanism (6) is located on the side of the connecting conveyor line (9).

2. The high-altitude automated wafer handling system according to claim 1, characterized in that, The lifting mechanism (4) includes a lifting box (41), a top plate (42), a pulley (43), an auxiliary wheel (44), a fixing frame (45), and a lifting belt (46). The top plate (42) is embedded inside the lifting box (41). One end of the auxiliary wheel (44) is rotatably connected to the fixing frame (45). The fixing frame (45) is fixedly connected to the top of the top plate (42). One end of the lifting belt (46) is fixedly connected to the inside of the pulley (43). The lifting belt (46) is located outside the auxiliary wheel (44). The top of the top plate (42) has a first through groove symmetrically opened. The top of the top plate (42) has a second through groove opened. The pulley (43) is rotatably connected to the inside of the first through groove. The lifting belt (46) is slidably inserted into the inner cavity of the second through groove. The side of the lifting belt (46) is provided with a first locking tooth.

3. The high-altitude automated wafer handling system according to claim 2, characterized in that, The lifting mechanism (4) further includes a first motor (47), a connecting shaft (48), a positioning frame (49), a rotating wheel (410), a drive wheel (411), and a drive belt (412). The first motor (47) is fixedly connected to the bottom end of the top plate (42). The outer wall of the connecting shaft (48) is fixedly inserted into the middle of the pulley (43). The outer wall of the connecting shaft (48) is fixedly inserted into the middle of the rotating wheel (410). One end of the connecting shaft (48) is rotatably connected to the positioning frame (49). The top end of the positioning frame (49) is fixedly connected to the top plate (42). The output end of the first motor (47) is connected to the drive wheel (411) for transmission. The drive belt (412) is located between the rotating wheel (410) and the drive wheel (411).

4. The high-altitude automated wafer handling system according to claim 3, characterized in that, The clamping mechanism (3) includes a fixed box (31), a cover plate (32), a support plate (33), a support cylinder (34), and a second motor (35). The cover plate (32) is fixedly connected to the top of the fixed box (31). A third through groove is provided at the top of the cover plate (32). The lifting belt (46) is slidably inserted into the inner cavity of the third through groove. The support plate (33) is fixedly connected to the inside of the fixed box (31). The support cylinder (34) is fixedly connected between the support plate (33) and the cover plate (32). The second motor (35) is fixedly connected to the top of the support plate (33). An auxiliary seat is fixedly connected to the bottom of the support plate (33). A sliding plate (310) is slidably arranged inside the auxiliary seat. A clamping frame (311) is fixedly connected to the bottom of the sliding plate (310).

5. The high-altitude automated wafer handling system according to claim 4, characterized in that, The auxiliary seat has a fourth through slot in the middle, and a fifth through slot is formed on the inner wall of the fourth through slot. A first gear (38) is rotatably connected to the inner cavity of the fifth through slot, and a second gear (39) is rotatably connected to the inner cavity of the fifth through slot. The first gear (38) and the second gear (39) mesh with each other. A drive seat is rotatably connected to the top of the first gear (38), and the bottom of the drive seat is rotatably connected to the sliding plate (310). A first reversing gear (36) is driven to the output end of the second motor (35). A second reversing gear (37) is fixedly connected to the top of the second gear (39), and the first reversing gear (36) and the second reversing gear (37) are in contact with each other.

6. The high-altitude automated wafer handling system according to claim 4, characterized in that, The top of the wafer box (2) is fixedly connected to a clamping seat (10), and the inside of the fixing box (31) is fixedly connected to a carrier seat (462). The side of the carrier seat (462) is provided with a snap-fit ​​seat (461). The side of the snap-fit ​​seat (461) is provided with a second snap tooth. The second snap tooth meshes with the first snap tooth. The side of the snap-fit ​​seat (461) is fixedly connected to the carrier seat (462).

7. The high-altitude automated wafer handling system according to claim 1, characterized in that, The moving mechanism (5) includes a support rail (51), an auxiliary rail (52), a driving member (53), and a traction member. The driving member (53) is slidably disposed at the bottom of the support rail (51). The traction member is fixedly connected to the top of the lifting box (41). The traction member is located at the bottom of the auxiliary rail (52). The bottom of the driving member (53) is slidably connected to the auxiliary rail (52).

8. The high-altitude automated wafer handling system according to claim 1, characterized in that, The rotating mechanism (6) includes an assembly plate (61), a connecting box (62), a support conveyor line (63), a guide wheel (64), and a third motor (65). The third motor (65) is fixedly connected to the bottom of the assembly plate (61). The output end of the third motor (65) is connected to the support conveyor line (63) for transmission. The guide wheel (64) is rotatably connected to the side of the support conveyor line (63). Position sensors (66) are installed on both the support conveyor line (63) and the connecting conveyor line (9).

9. A method for automated handling of high-altitude wafers, characterized in that, The specific steps include the following: Step 1: Draw or import the conveyor line layout diagram to form a dataset; Step 2: Classify the nodes in the dataset obtained in Step 1, including storage sites, routes, and basic device data; Step 3: Create the basic data table for optimal path calculation; Step 4: The wafer cassette enters the conveyor line from any storage site, and its unique number is read by radio frequency identification, waiting for the host system to generate the target storage site; Step 5: Calculate the optimal path between the starting point and the destination using a path algorithm, where the path algorithm is F(n) = g(n) + h(n), g(n) is the actual cumulative cost from the starting node to node n, and h(n) is the heuristically estimated cost from node n to the target node. Step 6: If an optimal path exists, the wafer cassette begins transportation, selecting the corresponding path branch based on the known path nodes, until the target storage site is reached; Step 7: If no optimal path exists, notify the host system to generate an alarm and generate an automatic backflow task to return to the storage site.

10. The high-altitude automated wafer handling method according to claim 9, characterized in that, The path algorithm implementation steps in step five are as follows: S1: Create an open list to store the nodes to be processed. Initially, it only contains the starting node and assigns it g(n) = 0 and the corresponding h(n); S2: Create a closed list to store the processed nodes, initially empty; S3: Select the node current with the smallest evaluation function F(n) value from the open list; S4: If current is the target node, the algorithm ends, and the shortest path has been found; S5: Otherwise, move current to the closed list and operate on all its unprocessed adjacent nodes. Specifically, calculate the g(n) value of the new node neighbor (g(neighbor) = g(current) + cost(current->neighbor)). If neighbor is not in the open list or the newly calculated g(n) value is less than the existing g(n) value, update neighbor's g(n) and F(n) and set its parent node to current. If neighbor was not added to the open list before, repeat S3 until the target node is found or the open list is empty.

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