Apparatus and method for processing probes for a probe card

Abstract

The application discloses a processing device and method for probes of a probe card. The device comprises an upper tray, a first main body and a plurality of first support parts, the first main body is annular, a plurality of first support parts are arranged at intervals in the first main body to support the metal substrate, there is a first space between two adjacent first support parts, and the upper tray is further provided with a positioning structure for fixing the metal substrate; a lower tray, a second main body and a plurality of second support parts, a plurality of second support parts are arranged at intervals on the second main body, when the upper tray and the lower tray are assembled, a plurality of second support parts are respectively embedded in a plurality of first spaces and support the metal substrate. The scheme simplifies the probe processing flow, reduces the labor cost, avoids defects such as bending, falling off or surface scratch caused by repeated mounting in the probe processing process, and improves the yield of the probe.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, specifically to a probe processing apparatus and method for probe cards. Background Technology

[0002] Wafer testing, a crucial step before chip packaging, significantly improves the yield rate of packaged chips. Probe cards act as a bridge between the wafer and the testing machine, transmitting test signals from the testing machine to the wafer and transmitting response signals from the wafer back to the testing machine, thus determining the wafer's quality.

[0003] Probe cards composed of vertical probes are primarily used on wafers with micro-pitch, high-density arrays to enable high-density parallel measurements. The manufacturing process for vertical probes involves metal growth and metal cutting. Metal cutting uses a laser to cut the probe shape from a prepared metal substrate, followed by cleaning, release, electroplating, and other operations to obtain the finished probe. From the metal substrate to the finished probe, multiple processes are required, and each process necessitates remounting the substrate. This remounting process not only increases manual labor but also easily causes defects such as probe bending, detachment, and surface scratches, significantly reducing the probe yield. Summary of the Invention

[0004] To overcome the deficiencies in the prior art, embodiments of the present invention provide a processing apparatus and method for probes in a probe card, which are used to solve the above-mentioned problems.

[0005] This application discloses a processing apparatus for probes used in probe cards, wherein the probes are cut from a metal substrate, and the processing apparatus for the probes used in probe cards includes:

[0006] The upper tray includes a first body and a plurality of first support parts. The first body is ring-shaped, and the plurality of first support parts are spaced apart inside the first body to support the metal substrate. There is a first space between two adjacent first support parts. The upper tray is also provided with a positioning structure for fixing the metal substrate.

[0007] The lower tray includes a second body and a plurality of second support parts. The plurality of second support parts are spaced apart on the second body. When the upper tray and the lower tray are assembled, the plurality of second support parts are respectively embedded in the plurality of first spaces and support the metal substrate.

[0008] Specifically, there is a second space between two adjacent second support parts, and when the upper tray and the lower tray are assembled, the plurality of first support parts are respectively embedded in the plurality of second spaces.

[0009] Specifically, the positioning structure includes a first airflow channel and a plurality of second airflow channels. The first airflow channel is disposed on the first main body, and the plurality of second airflow channels are respectively disposed on a plurality of first support parts. The first airflow channel is connected to the plurality of second airflow channels respectively, and the first airflow channel is also connected to a negative pressure system.

[0010] Specifically, the first main body has an annular stepped surface, the upper end surfaces of multiple first support parts are flush with the stepped surface, the first airflow channel is disposed on the stepped surface, and the two ends of any second airflow channel are respectively connected to the first airflow channel.

[0011] Specifically, the side wall of the first main body is provided with a through hole for connecting the first airflow channel and the negative pressure system, and a check valve is provided in the through hole.

[0012] Specifically, the lower tray is provided with a positioning post, the upper tray is provided with a positioning hole corresponding to the positioning post, and the upper tray and the lower tray are connected by fasteners.

[0013] This application also discloses a method for fabricating probes for a probe card, comprising the following steps:

[0014] The upper tray and the lower tray are assembled into one piece. The upper tray includes a first main body and a plurality of first support parts. The first main body is ring-shaped, and the plurality of first support parts are spaced apart inside the first main body to support the metal substrate. There is a first space between two adjacent first support parts. The upper tray is also provided with a positioning structure for fixing the metal substrate. The lower tray includes a second main body and a plurality of second support parts. The plurality of second support parts are spaced apart on the second main body. When the upper tray and the lower tray are assembled, the plurality of second support parts are respectively embedded in the plurality of first spaces and support the metal substrate.

[0015] A metal substrate is fixed on an upper tray. The metal substrate includes a cutting area and a non-cutting area. The non-cutting area is used to connect with the first body.

[0016] A laser cutting device is used to cut multiple probes in the area to be cut of the metal substrate, and the two ends of the probes are respectively connected to two adjacent non-cut areas.

[0017] Specifically, the area to be cut of the metal substrate includes the portion of the metal substrate corresponding to the second support portion, and the non-cutting area of ​​the metal substrate includes the portion of the metal substrate corresponding to the first support portion and the step surface.

[0018] The present invention has at least the following beneficial effects: When the upper and lower trays of this embodiment are assembled as a whole, multiple first support parts and multiple second support parts constitute a plane for supporting the metal substrate, ensuring support stability. After the probe is cut, when the lower tray is removed from the upper tray, the probe and part of the metal substrate (its non-cut area) are still adsorbed on the upper tray, and the probe is in a suspended state, which facilitates subsequent cleaning, release and electroplating processes. This solution simplifies the probe processing flow, reduces labor costs, avoids defects such as bending, falling off or surface scratches caused by repeated mounting during the probe processing, and improves the probe yield.

[0019] To make the above and other objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a probe processing device for a probe card in an embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram of the upper tray structure in an embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram of the lower tray structure in an embodiment of the present invention;

[0024] Figure 4 yes Figure 2 A magnified view of a section at point A in the middle;

[0025] Figure 5 This is a schematic diagram of the metal substrate placed on the upper tray in an embodiment of the present invention;

[0026] Figure 6 This is a schematic diagram of the probe cut out on the metal substrate in an embodiment of the present invention.

[0027] The reference numerals in the above figures are as follows: 1. Upper tray; 11. First body; 111. Stepped surface; 112. Positioning hole; 12. First support part; 121. First space; 21. First airflow channel; 22. Second airflow channel; 3. Lower tray; 31. Second body; 311. Positioning post; 32. Second support part; 321. Second space; 4. Check valve; 5. Metal substrate; 51. Area to be cut; 52. Non-cutting area; 6. Probe. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "fixing," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "below," and "over" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0031] In the description of this embodiment, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this application.

[0032] Furthermore, the terms "first" and "second" are used only to distinguish between different terms in description and do not have any special meaning.

[0033] like Figure 1 and Figure 6 As shown, the probe 6 for the probe card in this embodiment is cut from a metal substrate 5.

[0034] Combination Figures 1 to 3 As shown, the probe processing device for the probe card in this embodiment includes an upper tray 1 and a lower tray 3. The upper tray 1 includes a first body 11 and a plurality of first support portions 12. The first body 11 is annular, and the plurality of first support portions 12 are spaced apart inside the first body 11 to support the metal substrate 5. A first space 121 exists between adjacent first support portions 12, thus the first body 11 has a plurality of first spaces 121. The lower tray 3 includes a second body 31 and a plurality of second support portions 32. The plurality of second support portions 32 are spaced apart on the second body 31. When the upper tray 1 and the lower tray 3 are assembled, the plurality of second support portions 32 are respectively embedded within the plurality of first spaces 121, and the plurality of second support portions 32 are used to support the metal substrate 5. The upper tray 1 also has a positioning structure for fixing the metal substrate 5 to improve the accuracy of cutting and subsequent processing.

[0035] After the upper tray 1 and the lower tray 3 are assembled, the plurality of first support parts 12 and the plurality of second support parts 32 form a plane for supporting the metal substrate 5. Therefore, preferably, the size of the first space 121 is slightly larger than the thickness of the second support parts 32. This allows the second support parts 32 to easily enter and exit the first space 121, and also avoids the first space 121 being too large, which would result in the metal substrate 5 lacking sufficient support.

[0036] Specifically, such as Figure 1 As shown, in this embodiment, the metal substrate 5 can be circular, and the first body 11 of the upper tray 1 is also generally annular, with multiple first support portions 12 disposed on the inner wall of the first body 11. The second body 31 of the lower tray 3 can also be annular, with multiple second support portions 32 disposed at intervals on the inner wall of the second body 31, and a second space 321 formed between two adjacent second support portions 32, so that when the upper tray 1 and the lower tray 3 are assembled, the multiple second support portions 32 are respectively embedded in the multiple second spaces 321, improving the assembly accuracy of the upper tray 1 and the lower tray 3. In another embodiment, the second body 31 of the lower tray 3 can be a continuous circular plate, with multiple second support portions 32 protruding from the upper surface of the second body 31 and disposed thereon.

[0037] The upper tray 1 and the lower tray 3 can be fixedly connected by fasteners. For example... Figure 2 and Figure 3 As shown, the lower tray 3 is provided with a positioning post 311, and the upper tray 1 is provided with a positioning hole 112 corresponding to the positioning post 311. After the upper tray 1 and the lower tray 3 are aligned and assembled through the positioning post 311 and the positioning hole 112, they are fastened together by fasteners to avoid relative movement between the upper tray 1 and the lower tray 3 during the laser cutting of the metal substrate 5, which would affect the cutting accuracy.

[0038] Combination Figure 2 and Figure 4 As shown, the positioning structure of this embodiment includes a first airflow channel 21 and multiple second airflow channels 22. The first airflow channel 21 is disposed on the first main body 11, and the multiple second airflow channels 22 are respectively disposed on multiple first support parts 12. The first airflow channel 21 and the multiple second airflow channels 22 are respectively connected, and the first airflow channel 21 is also connected to an external negative pressure system (not shown). Using the above scheme, after the metal substrate 5 is positioned on the first tray, the first airflow channel 21 and the second airflow channels 22 are evacuated by activating the negative pressure system. A negative pressure is formed inside the first airflow channel 21 and the second airflow channel 22, which can adsorb and fix the metal substrate 5, thereby realizing the positioning and leveling of the metal substrate 5.

[0039] Furthermore, continue to refer to Figure 2 and Figure 4 As shown, the first main body 11 has an annular stepped surface 111, which is recessed into the interior of the first main body 11 relative to its upper surface. The upper surfaces of the plurality of first support parts 12 are flush with the stepped surface 111. A first airflow channel 21 is disposed on the stepped surface 111, and both ends of any second airflow channel 22 are respectively connected to the first airflow channel 21, which is beneficial to improving the airflow velocity.

[0040] The first main body 11 has a through hole (not shown in the figure) on its side wall for connecting the first airflow channel 21 and the negative pressure system. A check valve 4 is installed in the through hole. When a negative pressure is formed inside the first airflow channel 21 and the second airflow channel 22, the check valve 4 is closed to maintain the negative pressure state inside the channel, so that the metal substrate 5 is adsorbed onto the upper tray 1.

[0041] Based on the above-described processing apparatus, the processing method for probes in a probe card according to this embodiment includes the following steps:

[0042] Step 1: Assemble the upper tray 1 and the lower tray 3 into one piece and fasten them together. In this step, the first support portion 12 of the upper tray 1 and the second support portion 32 of the lower tray 3 form a nearly continuous plane for supporting the metal substrate 5 (the plane can be nearly continuous when the distance between the two first support portions 12 is approximately equal to the thickness of one second support portion 32).

[0043] Step 2: Fix the metal substrate 5 onto the upper tray 1. Specifically, place the metal substrate 5 on the stepped surface 111 of the first body 11, activate the negative pressure system to create negative pressure inside the first airflow channel 21 and the second airflow channel 22, close the check valve 4, and the metal substrate 5 is adsorbed onto the first body 11, while simultaneously being leveled. The metal substrate 5 includes a cutting area 51 and a non-cutting area 52. The cutting area 51 is used to cut out multiple probes 6, and the non-cutting area 52 is used to connect with the stepped surface 111 and the first support 12 of the first body 11. Simultaneously, the non-cutting area 52 also connects the multiple probes 6, preventing the probes 6 from being completely separated from the metal substrate 5, thus facilitating subsequent cleaning and other processes. Further, as... Figure 5 and Figure 6 As shown, the area to be cut 51 in this embodiment mainly includes the part of the metal substrate 5 corresponding to the second support part 32 of the lower tray 3 (or, the part corresponding to the first space 121 of the upper tray 1), and the non-cutting area 52 includes the part of the metal substrate 5 corresponding to the first support part 12 and the step surface 111 of the upper tray 1.

[0044] Step 3: Using a laser cutting device, cut multiple probes 6 within the area 51 to be cut on the metal substrate 5. Each probe 6 is connected at both ends to two adjacent non-cut areas 52 (e.g., ...). Figure 6 (As shown). More precisely, one end of each probe 6 is connected to the non-cutting area 52 corresponding to the previous first support 12, and the other end is connected to the non-cutting area 52 corresponding to the next first support 12.

[0045] Step 4: Separate the upper tray 1 and the lower tray 3. Remove the lower tray 3. The cut probe 6, along with the non-cut area 52 of the metal substrate 5, remains attached to the upper tray 1. At this point, the probe 6 is suspended, facilitating subsequent cleaning, release, and electroplating processes. In other words, during the subsequent cleaning, release, and electroplating processes, the probe 6 remains attached to the upper tray 1. This eliminates the need for repeated disassembly and reassembly of the probe 6 in each process, simplifying the workflow, reducing labor costs, and preventing defects such as bending, detachment, or surface scratches caused by repeated attachment during probe 6 processing, thus improving the yield rate of the probe 6.

[0046] Specific embodiments have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this invention. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. A processing apparatus for a probe for a probe card, wherein the probe is cut from a metal substrate, characterized in that, include: The upper tray includes a first body and a plurality of first support parts. The first body is ring-shaped, and the plurality of first support parts are spaced apart inside the first body to support the metal substrate. There is a first space between two adjacent first support parts. The upper tray is also provided with a positioning structure for fixing the metal substrate. The lower tray includes a second body and a plurality of second support parts. The plurality of second support parts are spaced apart on the second body. When the upper tray and the lower tray are assembled, the plurality of second support parts are respectively embedded in the plurality of first spaces and support the metal substrate.

2. The probe processing apparatus for a probe card according to claim 1, characterized in that, There is a second space between two adjacent second support parts. When the upper tray and the lower tray are assembled, the plurality of first support parts are respectively embedded in the plurality of second spaces.

3. The probe processing apparatus for a probe card according to claim 1, characterized in that, The positioning structure includes a first airflow channel and a plurality of second airflow channels. The first airflow channel is disposed on the first main body, and the plurality of second airflow channels are respectively disposed on a plurality of first support parts. The first airflow channel is connected to the plurality of second airflow channels respectively, and the first airflow channel is also connected to a negative pressure system.

4. The probe processing apparatus for a probe card according to claim 3, characterized in that, The first main body has an annular stepped surface, the upper end surfaces of multiple first support parts are flush with the stepped surface, the first airflow channel is disposed on the stepped surface, and the two ends of any second airflow channel are respectively connected to the first airflow channel.

5. The probe processing apparatus for a probe card according to claim 4, characterized in that, The first main body has a through hole on its side wall for connecting the first airflow channel and the negative pressure system, and a check valve is installed in the through hole.

6. The probe processing apparatus for a probe card according to claim 1, characterized in that, The lower tray is provided with a positioning post, and the upper tray is provided with a positioning hole corresponding to the positioning post. The upper tray and the lower tray are connected by fasteners.

7. A method for fabricating a probe for a probe card, characterized in that, Includes the following steps: The upper tray and the lower tray are assembled into one piece. The upper tray includes a first main body and a plurality of first support parts. The first main body is ring-shaped, and the plurality of first support parts are spaced apart inside the first main body to support the metal substrate. There is a first space between two adjacent first support parts. The upper tray is also provided with a positioning structure for fixing the metal substrate. The lower tray includes a second main body and a plurality of second support parts. The plurality of second support parts are spaced apart on the second main body. When the upper tray and the lower tray are assembled, the plurality of second support parts are respectively embedded in the plurality of first spaces and support the metal substrate. A metal substrate is fixed on an upper tray. The metal substrate includes a cutting area and a non-cutting area. The non-cutting area is used to connect with the first body. A laser cutting device is used to cut multiple probes in the area to be cut of the metal substrate, and the two ends of the probes are respectively connected to two adjacent non-cut areas.

8. The method for fabricating a probe for a probe card according to claim 7, characterized in that, The positioning structure includes a first airflow channel and a plurality of second airflow channels. The first airflow channel is disposed on the first main body, and the plurality of second airflow channels are respectively disposed on a plurality of first support parts. The first airflow channel is connected to the plurality of second airflow channels respectively, and the first airflow channel is also connected to a negative pressure system.

9. The method for fabricating a probe for a probe card according to claim 8, characterized in that, The first main body has an annular stepped surface, the upper end surfaces of multiple first support parts are flush with the stepped surface, the first airflow channel is disposed on the stepped surface, and the two ends of any second airflow channel are respectively connected to the first airflow channel.

10. The method for fabricating a probe for a probe card according to claim 9, characterized in that, The area to be cut of the metal substrate includes the portion of the metal substrate corresponding to the second support portion, and the non-cutting area of ​​the metal substrate includes the portion of the metal substrate corresponding to the first support portion and the step surface.

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