Semiconductor processing device and adjustment mechanism and adjustment method thereof

Abstract

The present invention relates to the field of semiconductor equipment, and provides a semiconductor processing device and an adjustment mechanism and an adjustment method thereof, wherein the adjustment mechanism comprises a bottom plate, an intermediate plate, a top plate, a horizontal adjustment member and a vertical adjustment member; the top plate or the bottom plate is fixedly connected to a transmission mechanism in the processing device, and the transmission mechanism is configured to drive a wafer tray through a wafer supporting mechanism; the horizontal adjustment member is movably connected to a limiting hole of a limiting boss, and the horizontal position of the wafer tray is adjusted by moving the bottom plate and the intermediate plate in the x direction and the y direction, respectively, or by moving the top plate and the intermediate plate in the x direction and the y direction, respectively, and the x direction and the y direction are perpendicular to each other; the vertical adjustment member is movably connected to the top plate or the bottom plate, and the vertical position of the top plate or the bottom plate is adjusted to adjust the horizontality of the wafer tray. The adjustment mechanism has good anti-bending ability and higher adjustment accuracy.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to a semiconductor processing device and an adjusting mechanism and an adjusting method thereof. Background Art

[0002] Existing processes such as Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) require the wafer to rotate and rise and fall in the processing chamber in order to place and retrieve the wafer or perform thin film deposition. The wafer is supported in the processing chamber by a wafer support mechanism. Usually, the wafer support mechanism includes a wafer tray located in the processing chamber and a support shaft extending at one end into the processing chamber. The other end of the aforementioned support shaft is connected to a transmission mechanism outside the cavity, and the transmission mechanism drives the support shaft to rise and fall and rotate, thereby driving the wafer tray to rotate and rise.

[0003] In order to make the wafer tray run smoothly and have uniform temperature so as to obtain a higher quality film on the wafer surface, the wafer tray needs an adjustment mechanism to level it. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor processing device and an adjusting mechanism and an adjusting method thereof, wherein the adjusting mechanism has good anti-bending ability and higher adjustment accuracy.

[0005] In the first aspect, the present invention provides an adjustment mechanism for a semiconductor processing device, the adjustment mechanism comprising a bottom plate, an intermediate plate, a top plate, a horizontal adjustment member and a vertical adjustment member; the bottom plate, the intermediate plate and the top plate are each provided with a corresponding hollow portion; the bottom plate, the intermediate plate and the top plate are stacked in sequence; a first side surface of the bottom plate and the top plate is provided with a limiting boss or a limiting groove with a limiting hole, the first side surface is a side facing the intermediate plate, and correspondingly, a limiting groove corresponding to the limiting boss or a limiting boss corresponding to the limiting groove is provided on the intermediate plate, the limiting groove and the limiting boss are matched in a concave-convex manner, so that the bottom plate, the intermediate plate and the top plate can move relative to each other in pairs; the bottom plate or the top plate is adjustably fixedly connected to The processing chamber in the processing device, accordingly, the top plate or the bottom plate is fixedly connected to the transmission mechanism in the processing device, and the transmission mechanism is configured to drive the wafer tray through the wafer supporting mechanism; the wafer supporting mechanism is partially located in the hollow portion; the horizontal adjustment member is movably connected to the limiting hole of the limiting boss, and the horizontal position of the wafer tray is adjusted by moving the middle plate and the bottom plate along the x direction and the y direction respectively, or by moving the top plate and the middle plate along the x direction and the y direction respectively, and the x direction is perpendicular to the y direction; the vertical adjustment member is movably connected to the top plate or the bottom plate, and the horizontality of the wafer tray is adjusted by adjusting the vertical position of the top plate or the bottom plate.

[0006] The beneficial effects of the method of the present invention are: 1. The present application sets a bottom plate, a middle plate, and a top plate that can move relatively, which has low processing difficulty and saves costs; 2. Since the bottom plate, the middle plate, and the top plate of the present application are stacked, the adjustment mechanism has better bending resistance and is not easy to deform.

[0007] Optionally, the horizontal adjustment member includes a first horizontal bolt and a second horizontal bolt; the first horizontal bolt is movably connected to the top plate, and is used to adjust the relative position of the top plate and the middle plate in the x direction; the second horizontal bolt is movably connected to the bottom plate, and is used to adjust the relative position of the middle plate and the bottom plate in the y direction.

[0008] Optionally, it also includes: a fixing assembly, the fixing assembly including a first fixing bolt and a second fixing bolt, the first fixing bolt is arranged on the opposite side of the first horizontal bolt, and the second fixing bolt is arranged on the opposite side of the second horizontal bolt; wherein the first fixing bolt is configured to fix the top plate and the middle plate in the x-direction; and the second fixing bolt is configured to fix the middle plate and the bottom plate in the y-direction.

[0009] Optionally, the vertical adjustment members are provided in a plurality of groups, and the plurality of groups of vertical adjustment members are arranged in a circumferentially separated manner along the top plate; the adjustment mechanism also includes a third fixing bolt, and the third fixing bolt is arranged to match the number of the vertical adjustment members and is arranged at a matching position of the vertical adjustment member.

[0010] Optionally, it also includes a plurality of fixed brackets respectively located on the peripheral sides of the top plate, each fixed bracket is provided with two through holes, the two through holes are respectively used to set the vertical adjustment member and the third fixing bolt, the fixed bracket is fixed to the bottom of the top plate by the third fixing bolt, and the fixed bracket is fixedly connected to the processing chamber in the processing device.

[0011] Optionally, a first limiting assembly is provided between the top plate and the middle plate, and a second limiting assembly is provided between the middle plate and the bottom plate; the first limiting assembly is used to limit the relative displacement of the top plate and the middle plate in the y direction and the relative displacement in the z direction; the second limiting assembly is used to limit the relative displacement of the middle plate and the bottom plate in the x direction and the relative displacement in the z direction.

[0012] Optionally, the first limiting assembly and the second limiting assembly both include a bushing and a corresponding bushing groove; the bushing groove provided in the middle plate is adapted to the bushing fixedly connected to the top plate; the bushing groove provided in the bottom plate is adapted to the bushing fixedly connected to the middle plate.

[0013] Optionally, a receiving groove is provided in the top plate, a gasket is provided in the receiving groove, the gasket abuts against the end of the vertical adjustment member, and the vertical adjustment member extends from the bottom plate in a direction toward the top plate and abuts against the gasket.

[0014] Optionally, the limiting groove is arranged on the edge of the middle plate; the limiting boss is arranged on the edge of the top plate and the edge of the bottom plate, an elastic member is arranged in the limiting groove, one end of the elastic member acts on the limiting boss, and the other end of the elastic member acts on the middle plate.

[0015] Optionally, an elastic member that can be elastically deformed along the x-direction is provided between the top plate and the middle plate; and an elastic member that can be elastically deformed along the y-direction is provided between the middle plate and the bottom plate.

[0016] In a second aspect, the present invention provides a semiconductor processing device, comprising a semiconductor wafer processing chamber, a wafer support mechanism, a transmission mechanism and at least one adjustment mechanism as described in any one of the first aspects; the wafer support mechanism is fixedly connected to the transmission mechanism, and the transmission mechanism is configured to drive the wafer support mechanism to rise and fall and rotate; the wafer support mechanism comprises a support shaft and a wafer tray, and the support shaft supports the wafer tray through a bracket and drives the wafer tray to rotate and rise; the adjustment mechanism adjusts the horizontal position and horizontality of the wafer tray by adjusting the displacement of the transmission mechanism in the x direction, the y direction and / or the z direction.

[0017] Optionally, the transmission mechanism includes: a magnetic fluid sealing assembly; the magnetic fluid sealing assembly includes a stator and a rotor; the stator is relatively fixed to the base plate; the rotor is accommodated inside the stator, and the rotor is configured to be relatively rotatable with the stator; the rotor has a accommodating through hole, the support shaft passes through the accommodating through hole and the support shaft is configured to be clamped by the rotor; the accommodating through hole includes a first limiting section located at one end of the rotor, a second limiting section located at the other end of the rotor, and an intermediate section extending between the first limiting section and the second limiting section; the inner diameters of the first limiting section and the second limiting section are both smaller than the inner diameter of the intermediate section.

[0018] Optionally, the magnetic fluid sealing assembly further comprises a support block; the support block comprises a receiving groove, and the bottom end of the support shaft is supported in the receiving groove; the support block is fixed to the rotor.

[0019] Optionally, O-rings are provided in both the first limiting section and the accommodating groove; the O-rings are used to clamp the support shaft; a clamping block is also installed in the accommodating groove, and the clamping block is used to squeeze the O-ring to clamp the bottom end of the support shaft; the clamping block, the rotor and the support shaft are coaxially arranged.

[0020] Optionally, the bottom of the rotor is configured as a protrusion, a gear is provided on the outer side of the rotor, the protrusion passes through the gear and extends to the accommodating groove; the gear and the support block are fixedly connected to the rotor.

[0021] Optionally, the portion of the accommodating groove corresponding to the clamping block is provided with an inclined surface, and the portion of the protruding portion corresponding to the clamping block is provided with a first inner surface; the inclined surface and the first inner surface are both used to abut against the O-ring so that the O-ring clamps the support shaft.

[0022] In a third aspect, the present invention provides an adjustment method for an adjustment mechanism, which is applied to the adjustment mechanism described in any one of the first aspects, comprising: when the wafer tray is offset in the x direction, adjusting the position of the middle plate in the x direction by a first horizontal bolt; the bottom plate and the middle plate move together in the x direction relative to the top plate, and then the wafer tray is driven to move in the x direction by the transmission mechanism and the wafer support mechanism; when the wafer tray is offset in the y direction, adjusting the position of the bottom plate in the y direction by a second horizontal bolt; and then the wafer tray is driven to move in the y direction by the transmission mechanism and the wafer support mechanism; adjusting the vertical displacement of the top plate at the vertical adjustment member by adjusting at least one of the vertical adjustment members, and adjusting the horizontality of the wafer tray; repeating at least one of the above processes, and fixing the top plate, the middle plate and the bottom plate with fixing members when appropriate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the three-dimensional structure of an embodiment of an adjustment mechanism of a semiconductor processing device provided by the present invention;

[0024] Figure 2 for Figure 1 Explosion diagram of

[0025] Figure 3 A cross-sectional schematic diagram of an adjustment mechanism provided by the present invention having a bushing arranged in an inverted T shape;

[0026] Figure 4 A three-dimensional cross-sectional schematic diagram of an adjustment mechanism provided with a liner core provided by the present invention;

[0027] Figure 5 A partial cross-sectional schematic diagram of the fixing bracket and the top plate provided by the present invention;

[0028] Figure 6 A schematic structural diagram of a semiconductor processing device provided by the present invention;

[0029] Figure 7 A schematic diagram of the installation structure of a magnetic fluid sealing assembly and a support shaft provided by the present invention;

[0030] Figure 8 The present invention provides Figure 7 A schematic diagram of the structure at B in FIG.

[0031] Fig. 9 A schematic flow chart of an adjustment method for an adjustment mechanism provided by the present invention.

[0032] Numbers in the figure:

[0033] 100, top plate; 101, gasket; 102, fastener; 103, extension; 200, middle plate; 300, bottom plate; 401, vertical bolt; 402, third fixing bolt; 403, fixing bracket; 404, through hole; 501, limiting boss; 502, limiting groove; 531, first horizontal bolt; 532, second horizontal bolt; 504, elastic member; 551, first fixing bolt; 552, second fixing bolt; 600, hollow part; 610, liner; 611, first liner; 612, second liner; 620, bushing; 630, bushing groove; 640, triangular bracket; 7, transmission mechanism; 8, magnetic fluid sealing assembly; 80, support shaft; 810, mounting plate; 81, first O-ring; 82. second O-ring; 83. third O-ring; 84. support ring; 85. support block; 850. accommodating groove; 8501. inclined surface; 851. flange portion; 86. clamping block; 87. rotor; 870. accommodating through hole; 871. first limiting section; 872. second limiting section; 873. middle section; 874. first end; 875. second end; 8750. protruding portion; 8751. end face; 8752. first inner surface; 8753. second inner surface; 88. stator; 89. gear; 891. first mounting bolt; 892. second mounting bolt; 91. wafer processing chamber; 92. wafer supporting mechanism; 921. wafer tray; 922. bracket; 93. adjustment mechanism. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0035] In view of the problems existing in the existing technology, such as Figure 1As shown, the first embodiment of the present invention provides an adjustment mechanism for a semiconductor processing device, including a top plate 100, an intermediate plate 200 and a bottom plate 300. The top plate 100 is adjustably fixedly connected to a processing chamber in the processing device, and the bottom plate 300 is fixedly connected to a transmission mechanism 7 in the processing device. The transmission mechanism 7 is configured to drive the wafer support mechanism to rise and fall and rotate. A hollow portion 600 is provided in the middle of the top plate 100, the intermediate plate 200 and the bottom plate 300. The top plate 100, the intermediate plate 200 and the bottom plate 300 are stacked in sequence, and the hollow portion 600 is for the wafer support mechanism to pass through. In another embodiment, the bottom plate 300 is adjustably fixedly connected to the processing chamber in the processing device, and the top plate 100 is fixedly connected to the transmission mechanism 7 in the processing device. The following will mainly describe the embodiment of "the top plate 100 is adjustably fixedly connected to the processing chamber in the processing device, and the bottom plate 300 is fixedly connected to the transmission mechanism 7 in the processing device".

[0036] like Figure 2 As shown, a plurality of limiting bosses 501 are provided on the upper part of the bottom plate 300 and the lower part of the top plate 100, and limiting grooves 502 corresponding to the limiting bosses 501 are provided on the middle plate 200. When the bottom plate 300, the middle plate 200 and the top plate 100 are stacked in sequence, the limiting bosses 501 are at least partially located in the limiting grooves 502.

[0037] In addition, the adjustment mechanism of the semiconductor processing device also includes a fixing component, a horizontal adjustment member and a vertical adjustment member. Figure 2As shown, the horizontal adjustment member is movably connected to the limiting hole of the limiting boss 501, and is used to adjust the relative positions of the bottom plate 300, the middle plate 200 and the top plate 100 in the horizontal direction. Exemplarily, the horizontal adjustment member includes a first horizontal bolt 531 and a second horizontal bolt 532. The first horizontal bolt 531 is threaded through the limiting boss 501 of the top plate 100, and the top of the first horizontal bolt 531 abuts against the bottom of the limiting groove 502 of the middle plate 200. The first horizontal bolt 531 is used to adjust the relative position of the top plate 100 and the middle plate 200 in the x direction. Exemplarily, after the top plate 100 is fixed to the processing chamber of the processing device, the first horizontal bolt 531 is screwed toward the middle plate 200, and the middle plate 200 will move relative to the top plate 100 along the horizontal x direction. After the adjustment is completed, the position of the first horizontal bolt 531 can be locked using a nut. The second horizontal bolt 532 is threaded through the limiting boss 501 of the bottom plate 300, and the top end of the second horizontal bolt 532 abuts against the bottom of the limiting groove 502 of the middle plate 200. The second horizontal bolt 532 is used to adjust the position of the bottom plate 300 relative to the middle plate 200 in the horizontal y direction. Exemplarily, after the position adjustment of the top plate 100 and the middle plate 200 is completed, the second horizontal bolt 532 is screwed toward the middle plate 200, and the bottom plate 300 will move relative to the middle plate 200 in the direction opposite to the y direction. Similarly, after the adjustment is completed, the position of the second horizontal bolt 532 can be locked using a nut.

[0038] The fixing assembly is used to relatively fix the bottom plate 300, the middle plate 200 and the top plate 100 through the limiting hole 506 of the limiting boss 501 opposite to the first horizontal bolt 531 or opposite to the second horizontal bolt 532 after the position adjustment is completed.

[0039] Exemplarily, the fixing assembly includes a first fixing bolt 551 and a second fixing bolt 552. The first fixing bolt 551 is arranged on the opposite side of the first horizontal bolt 531. Specifically, the first fixing bolt 551 is screwed through the limiting hole 506 of the limiting boss 501 fixedly connected to the top plate 100 and abuts against the bottom of the corresponding limiting groove 502 of the middle plate 200, and is tightened with a nut. The second fixing bolt 552 is arranged on the opposite side of the second horizontal bolt 532. Specifically, the second fixing bolt 552 is screwed through the limiting hole 506 of the limiting boss 501 fixedly connected to the bottom plate 300 and abuts against the bottom of the corresponding limiting groove 502 of the middle plate 200, and is tightened with a nut. Among them, the first fixing bolt 551 is configured to fix the top plate 100 and the middle plate 200 in the x direction. The second fixing bolt 552 is configured to fix the middle plate 200 and the bottom plate 300 in the y direction.

[0040] Exemplarily, when the position of the middle plate 200 needs to be adjusted, the nut on the first fixing bolt 551 is first loosened, and the first fixing bolt 551 is screwed out at least a distance in the direction away from the middle plate 200. The nut on the first horizontal bolt 531 is loosened, and the first horizontal bolt 531 is screwed in a certain distance in the direction toward the middle plate 200, and the middle plate 200 is moved to the target position, and the nut on the first horizontal bolt 531 is tightened to lock the position of the middle plate 200 on the side of the first horizontal bolt 531 relative to the top plate 100, and then, the first fixing bolt 551 is rotated to make it abut against the middle plate 200 and the nut on the first fixing bolt 551 is tightened to lock the position of the middle plate 200 on the side of the first fixing bolt 551 relative to the top plate 100, and at this point, one adjustment of the middle plate 200 along the x direction is completed. The adjustment of the bottom plate 300 relative to the middle plate 200 along the y direction is similar, and will not be further expanded. It is worth noting that the above-mentioned adjustment parts and fixing components can all be standard parts, which are easy to replace and maintain.

[0041] Please refer to Figure 2 In the illustrated embodiment, an elastic member 504 is provided in the limiting groove 502 , one end of the elastic member 504 acts on the limiting boss 501 , and the other end of the elastic member 504 acts on the middle plate 200 .

[0042] In the illustrated embodiment, the elastic member 504 is a spring. The spring is sleeved on the outside of the first horizontal bolt 531 and the second horizontal bolt 532. One end of the spring close to the hollow portion 600 is connected or abutted to the bottom of the limiting groove 502, and one end of the spring away from the hollow portion 600 is connected or abutted to the limiting boss 501. In some examples, the elastic member 504 can also be set as a disc spring, an elastic rod, a hydraulic shock absorber or an air spring.

[0043] In the illustrated embodiment, the middle plate 200 is reset to its initial position relative to the top plate 100 in a non-stressed state by means of the elastic member 504 sleeved on the outside of the first horizontal bolt 531, and the bottom plate 300 is reset to its initial position relative to the middle plate 200 in a non-stressed state by means of the elastic member 504 sleeved on the outside of the second horizontal bolt 532. This embodiment can realize automatic reset of the bottom plate 300 and the middle plate 200, without frequent calibration, saving time and effort, and facilitating the improvement of production capacity.

[0044] In the illustrated embodiment, the elastic member 504 is sleeved on the outer side of the first horizontal bolt 531 and the second horizontal bolt 532. In other embodiments of the present invention, the elastic member 504 may also be provided separately, rather than being sleeved on the outer side of the first horizontal bolt 531 or the second horizontal bolt 532. Exemplarily: a groove is provided on the middle plate 200, and correspondingly, a protrusion is provided on the top plate 100, and the protrusion is at least partially located in the groove of the middle plate 200, and an elastic member is provided between the groove wall of the groove of the middle plate 200 and the protrusion of the top plate 100, and the elastic member can be compressed in the x direction or in the y direction. In some examples, the limiting groove 502 is provided at the edge of the middle plate 200. The limiting boss 501 is provided at the edge of the top plate 100 and the edge of the bottom plate 300. In other examples, the limiting groove 502 can be provided on the side of the hollow portion 600. Exemplarily, the limiting boss 501 is provided on the side of the hollow portion 600 of the top plate 100 and the side of the hollow portion 600 of the bottom plate 300. Correspondingly, the limiting groove 502 is provided on the hollow portion 600 side of the middle plate 200 .

[0045] It is worth noting that, when observed from one end in the vertical z direction, the hollow portion 600 may be a U-shaped opening, a C-shaped opening or a through hole.

[0046] In some other embodiments, the adjustment mechanism of the semiconductor processing device further includes vertical adjustment members, and a plurality of groups of vertical adjustment members are arranged in a spaced relationship along the circumference of the top plate 100. The fixing assembly in the adjustment mechanism further includes third fixing bolts 402, which are arranged to match the number of the vertical adjustment members and are arranged at matching positions of the vertical adjustment members.

[0047] like Figure 4 As shown, in some embodiments, the vertical adjustment member is a vertical bolt 401, which is threaded through a fixing bracket 403 and abuts against the extension 103 of the top plate 100, and is used to adjust the position of the top plate 100, thereby adjusting the positions of the bottom plate 300 and the middle plate 200. In the illustrated embodiment, the number of the third fixing bolts 402, the vertical bolts 401, and the extension 103 are all 3, which are arranged in a circumferential separation along the top plate 100 (can also be described as: arranged in a circumferential separation along the middle plate 200 or arranged in a circumferential separation along the bottom plate 300), and each third fixing bolt 402 is arranged in parallel with the vertical bolt 401.

[0048] like Figure 2 As shown, specifically, each fixed bracket 403 is provided with two through holes 404, and the two through holes 404 are respectively used to set the third fixing bolt 402 and the vertical bolt 401. The fixed bracket 403 is fixed under the extension portion 103 of the top plate 100 by the third fixing bolt 402, and the fixed bracket 403 is directly or indirectly fixedly connected to the processing chamber in the processing device.

[0049] It should be understood that in this embodiment, the top plate 100, the middle plate 200, the bottom plate 300, the horizontal adjustment member and the vertical adjustment member are provided to achieve translation adjustment and tilt adjustment of the wafer support mechanism relative to the processing chamber. The fixing assembly is used to achieve reliable positioning of the semiconductor processing device. The adjustment directions of the horizontal adjustment member and the vertical adjustment member are intuitive and easy to operate.

[0050] Please refer to Figure 4 In some embodiments, three fixed brackets 403 are respectively located in the opposite direction of the x direction, the y direction, and the opposite direction of the y direction of the middle plate 200. In other embodiments, the three fixed brackets 403 surround the middle plate 200 and are evenly spaced at 120° intervals about the axis of the z direction. The fixed brackets 403 are fixed below the extension of the top plate 100 and are fixedly connected to the processing chamber of the semiconductor processing device.

[0051] Exemplarily, each fixing bracket 403 is provided with two through holes 404 in the z direction, which are connected to the vertical bolt 401 and the third fixing bolt 402 respectively. The three vertical bolts 401 are used to support and adjust the vertical height and levelness of the top plate 100. After the position adjustment is completed, the relative position of the fixing bracket 403 and the top plate 100 can be fixed by tightening the third fixing bolt 402. This embodiment uses three vertical bolts 401 to adjust the levelness and vertical height.

[0052] In some embodiments, the vertical adjustment member adjusts the vertical position of the top plate 100 upward along the direction from the bottom plate 300 to the top plate 100, thereby driving and adjusting the vertical positions of the bottom plate 300 and the middle plate 200. Exemplarily, the screw portion of the vertical bolt 401 is threadedly engaged with the through hole 404 of the fixing bracket 403. Figure 4At A in the figure, when the vertical bolt 401 is screwed through the fixed bracket 403 in the z direction and screwed into the extension 103, the vertical bolt 401 lifts the extension 103. Since the fixed bracket 403 is fixedly connected to the processing chamber, the extension 103 interacting with the vertical bolt 401 will be lifted to a position closer to the processing chamber, and accordingly, the part of the top plate 100 adjacent to the vertical bolt 401 is also lifted to a position closer to the processing chamber, so that the top plate 100 is rotated from the opposite direction of the x direction to the z direction. The top plate 100 is lifted, and accordingly, the middle plate 200 and the bottom plate 300 are also lifted together, and the adjustment mechanism as a whole rotates from the opposite direction of the x direction to the z direction. Then, the wafer tray 921 is driven to rotate through the transmission mechanism 7 and the support shaft 80 to adjust the horizontality of the wafer tray 921. When the vertical bolt 401 is screwed out of the fixed bracket 403 in the opposite direction of the z direction, the top plate 100 rotates from the z direction to the opposite direction of the x direction. Similarly, the wafer tray 921 is driven to rotate by the transmission mechanism 7 and the support shaft 80, thereby adjusting the horizontality of the wafer tray 921. Similarly, by rotating the three vertical bolts 401 located at different positions, the top plate 100 can be rotated and raised and lowered in any direction. This embodiment is suitable for application scenarios where the space above the top plate 100 is limited, and is easy to operate.

[0053] like Figure 5 As shown, in some embodiments, a receiving groove is provided in the top plate 100, and a gasket 101 is provided in the receiving groove, and the gasket 101 is fastened in the receiving groove by a fastener 102. The end of the vertical adjustment member extends through the fastener 102 and abuts against the gasket 101. The gasket 101 is a high-hardness wear-resistant member. The fastener 102 can be relatively fixed to the aforementioned receiving groove by screwing or crimping, and fix the gasket 101 in the receiving groove. In some embodiments, the gasket 101 can be embedded in the receiving groove, and a round bottom hole is provided at the bottom end of the gasket 101, and the end of the screw portion of the vertical bolt 401 is round-headed and abuts against the aforementioned round bottom hole. When the vertical bolt 401 rotates to adjust the relative position between the fixed bracket 403 and the top plate 100, the end of the screw portion cooperates with the round bottom hole to rotate relatively. In other embodiments, the gasket 101 can be fixedly connected to the top plate 100 or detachably connected. In addition, the bottom end of the gasket 101 may be provided with a tapered hole, and the end of the screw portion of the vertical bolt 401 is tapered. The end of the tapered screw portion cooperates with the aforementioned tapered hole to rotate relative to each other. It should be understood that the shape of the end of the screw portion of the vertical bolt 401 is adapted to the hole at the bottom end of the gasket 101.

[0054] Please refer to Figure 3 and Figure 4In some embodiments, a first stopper assembly is provided between the top plate 100 and the middle plate 200, and a second stopper assembly is provided between the middle plate 200 and the bottom plate 300. Both the first stopper assembly and the second stopper assembly include a bushing 620 and a corresponding bushing groove 630. In the illustrated embodiment, the bushing groove 630 provided in the middle plate 200 is adapted to the bushing 620 fixedly connected to the top plate 100. The bushing groove 630 provided in the bottom plate 300 is adapted to the bushing 620 fixedly connected to the middle plate 200.

[0055] like Figure 3 As shown, specifically, the cross-sections of the bushing 620 and the bushing groove 630 are both inverted T-shaped. The bushing groove 630 provided in the bottom plate 300 extends along the y direction, and the bottom plate 300 can move relative to the middle plate 200 along the y direction under the limitation of the bushing 620 fixedly connected to the middle plate 200. The bushing groove 630 provided in the middle plate 200 extends along the x direction, and the middle plate 200 can move relative to the top plate 100 along the x direction under the limitation of the bushing 620 fixedly connected to the top plate 100. When the middle plate 200 moves relative to the top plate 100 along the x direction, the bottom plate 300 moves along the x direction together with the middle plate 200 under the limitation of the bushing 620 fixedly connected to the middle plate 200.

[0056] In some other embodiments, see Figure 4 The first limiting assembly further includes a first liner core 611 disposed in the middle plate 200. Each first liner core 611 passes through two bushing grooves 630 in the middle plate 200. The first liner core 611 extends along the x direction, and the bushing 620 fixedly connected to the top plate 100 is located in the bushing groove 630 of the middle plate 200 and is sleeved and slidably connected to the first liner core 611, while limiting the movement of the middle plate 200 and the top plate 100 in the y direction and the z direction.

[0057] In some other specific embodiments, the second limiting assembly further includes a second liner core 612 disposed in the bottom plate 300. Each second liner core 612 passes through two bushing grooves 630 in the bottom plate 300. The second liner core 612 extends along the y direction, and the bushing 620 fixedly connected to the middle plate 200 is located in the bushing groove 630 of the bottom plate 300 and is sleeved and slidably connected to the second liner core 612, thereby limiting the movement of the middle plate 200 and the bottom plate 300 in the x direction and the z direction.

[0058] Exemplarily, the first liner core 611 and the second liner core 612 are perpendicular to each other. The first liner core 611 and the second liner core 612 are both provided in pairs. It is worth noting that the bushing 620 can be provided as an oil-free bushing 620 or a guide sleeve, and the liner core 610 is provided as a linear bearing or a guide column. This embodiment realizes the translation adjustment of the wafer tray 921 with two degrees of freedom in the horizontal direction.

[0059] According to the adjustment mechanism of the above embodiment of the present invention, by setting mutually matching limiting bosses and limiting grooves on the top plate 100, the middle plate 200 and the bottom plate 300, and setting a liner core between the top plate 100 and the middle plate 200, after the top plate 100 is fixed, by adjusting the first horizontal bolt 531, the middle plate 200 and the bottom plate 300 can move together relative to the top plate 100 along the x direction. By adjusting the second horizontal bolt 532, the bottom plate 300 moves relative to the middle plate 200 along the y direction. By adjusting the vertical bolts 401 at different positions, the vertical height and the overall horizontality of the top plate 100 at different positions are adjusted. Thereby, the horizontal displacement and horizontality of the wafer tray 921 are adjusted. This adjustment mechanism is roughly arranged around the outer periphery of the support shaft 80, so that the overall structure of the adjustment mechanism and the support shaft 80 is more compact and occupies less space. In addition, when adjusting in the target direction (x direction, y direction, z direction), fewer parts are involved and the accuracy is more guaranteed.

[0060] In the above embodiments, the first limit assembly and the second limit assembly enable the middle plate 200 and the bottom plate 300 to follow the top plate 100 when the top plate 100 moves in the vertical direction. In particular, the limit assembly with the liner core makes the structure of the entire adjustment mechanism more compact and the adjustment accuracy higher.

[0061] The second limiting assembly enables the bottom plate 300 to move along with the middle plate 200 when the middle plate 200 moves in the x-axis direction.

[0062] In some embodiments, the following movement among the top plate 100 , the middle plate 200 and the bottom plate 300 may also be achieved through the limiting grooves 502 and the limiting bosses 501 .

[0063] like Figure 4 As shown, in some embodiments, two triangular brackets 640 are further included below the bottom plate 300 for supporting the bottom plate 300. One end of the triangular bracket 640 is fixedly connected to the bottom plate 300, and the other end of the triangular bracket 640 is fixed to a support plate for fixing the magnetic fluid. In other embodiments, the bracket provided below the bottom plate 300 can be in any shape.

[0064] In the above-mentioned embodiment, the limiting bosses 501 are respectively provided on the top plate 100 and the bottom plate 300, and the limiting grooves 502 are provided on the middle plate 200. In other embodiments of the present invention, the limiting grooves 502 can also be provided on the top plate 100 and the bottom plate 300, and the limiting bosses 501 are provided on the middle plate 200.

[0065] like Figure 6As shown, the second embodiment provides a semiconductor processing device, including a semiconductor wafer processing chamber 91, a wafer support mechanism 92, a transmission mechanism 7 and an adjustment mechanism 93 disclosed in the present invention. The wafer support mechanism 92 is fixedly connected to the transmission mechanism 7, and the transmission mechanism 7 is configured to drive the wafer support mechanism 92 to rise and fall and rotate. The wafer support mechanism 92 includes a support shaft 80 and a wafer tray 921. The support shaft 80 supports the wafer tray 921 through a bracket 922 and drives the wafer tray 921 to rotate and rise together. The adjustment mechanism 93 adjusts the horizontal position and levelness of the wafer tray 921 by adjusting the displacement of the transmission mechanism 7 in the x direction, the y direction and / or the z direction.

[0066] Specifically, the semiconductor processing device includes a wafer processing chamber 91, a wafer supporting mechanism 92, a transmission mechanism 7 and an adjustment mechanism 93. The wafer supporting mechanism 92 also includes a bracket 922, one end of the bracket 922 is connected to the support shaft 80, and the other end of the bracket 922 is connected to the wafer tray 921. The wafer tray 921 is used to load the wafer. The support shaft 80 passes through the bottom end of the wafer processing chamber 91, and the transmission mechanism 7 is fixedly connected to the support shaft 80. For example, refer to Figure 1 The top plate 100 of the adjustment mechanism is connected to the outer wall of the wafer processing chamber 91 .

[0067] In some other specific embodiments, the semiconductor processing device includes a wafer processing chamber 91, N wafer supporting mechanisms 92, N transmission mechanisms 7 and N adjustment mechanisms 93, where N is an integer greater than 1. The N adjustment mechanisms are all connected to the same wafer processing chamber 91, and the N adjustment mechanisms 93 are connected to the N transmission mechanisms 7 in a one-to-one correspondence. The N transmission mechanisms 7 are connected to the N wafer supporting mechanisms 92 in a one-to-one correspondence. The N adjustment mechanisms 93 are used to independently adjust the horizontal position and horizontality of the N transmission mechanisms 7.

[0068] like Figure 7 and Figure 8As shown, in some embodiments, it also includes: a magnetic fluid sealing assembly 8. The magnetic fluid sealing assembly 8 includes a stator 88, a rotor 87 and a support block 85. The stator 88 is relatively fixed to the base plate 300. In the illustrated embodiment, the semiconductor processing device also includes a mounting plate 810. The mounting plate 810 is fixed to the base plate 300 of the adjustment mechanism disclosed in the present invention, and the mounting plate 810 is fixedly connected to the stator 88. The stator 88 is sleeved outside the rotor 87, and the stator 88 can rotate relative to the rotor 87. A receiving through hole 870 extending along the z direction is provided in the rotor 87, and the support shaft 80 passes through the receiving through hole 870, and the support shaft 80 is tightly held to the rotor 87. The bottom end of the rotor 87 is relatively fixed to the support block 85, and the support block 85 is used to support the bottom end of the support shaft 80. The receiving through hole 870 includes a first limiting section 871 and a second limiting section 872. The first limiting section 871 is located at the upper end of the accommodating through hole 870, and the second limiting section 872 is located at the lower end of the accommodating through hole 870, and the first limiting section 871 and the second limiting section 872 are separated from each other. The accommodating through hole 870 also includes an intermediate section 873 extending between the first limiting section 871 and the second limiting section 872. The first limiting section 871 and the second limiting section 872 are both used to constrain the movable space of the support shaft 80 in the rotor 87. In this embodiment, two limiting sections are set at a distance apart to limit the position of the support shaft 80, so that the rotor 87 has a stronger restriction on the position of the support shaft 80, and the relative position change between the two is smaller, so that the adjustment of the magnetic fluid sealing assembly 8 by the adjustment mechanism can be more accurately transmitted to the support shaft 80, so as to achieve more accurate adjustment and positioning of the position of the support shaft 80. Specifically, the rotor 87 has a first end 874 (at Figure 7 The rotor 87 has a first end close to the mounting plate 810 and a second end 875 opposite to the first end (at Figure 7 87, the second end of the rotor 87 is close to the support block 85). The second end 875 of the rotor 87 includes a protrusion 8750. The protrusion 8750 extends from the second end 875 in a direction away from the first end 874.

[0069] The first limiting section 871 at the first end 874 has an annular groove, in which a first O-ring 81 is disposed. The first O-ring 81 is squeezed by the annular groove to hold the support shaft 80 tightly.

[0070] The semiconductor processing device further includes a gear 89. The gear 89 is sleeved on the protruding portion 8750. The gear 89 and the rotor 87 are fixedly connected by a first mounting bolt 891. Specifically, the first mounting bolt 891 passes through the gear 89 and the end surface 8751 of the second end 875 to tighten the two.

[0071] The support block 85 includes a receiving groove 850. The bottom end of the support shaft 80 is supported in the receiving groove 850. The support block 85 has a flange portion 851. The flange portion 851 is fixed to the gear 89. Specifically, the second mounting bolt 892 passes through the flange portion 851 and the gear 89 in a direction perpendicular to the end surface of the gear to fix the two.

[0072] In this embodiment, the gear 89 and the rotor 87 are fixedly connected by the first mounting bolt 891, and the flange 851 and the gear 89 are fixedly connected by the second mounting bolt 892. The support block 85, the gear 89 and the rotor 87 are relatively fixed. In this embodiment, the support block 85 has a simple structure, is easy to manufacture, is easy to disassemble and assemble, is conducive to efficient maintenance, and because the number of structural parts is small, the cumulative error is small, which is conducive to improving accuracy.

[0073] The bottom end of the support shaft 80 is supported by a support ring 84 located at the bottom of the receiving groove 850. In the illustrated embodiment, the support ring 84 is an O-ring.

[0074] The semiconductor processing device further includes a clamping block 86. The clamping block 86 is an annular member, and the cross section of the annular member is in a "convex" shape. The clamping block 86 is sleeved on the bottom end of the support shaft 80 and is accommodated in the accommodating groove 850. The clamping block 86 is adapted to the accommodating groove 850.

[0075] The protruding portion 8750 of the rotor 87 extends into the accommodating groove 850. The protruding portion 8750 has a first inner surface 8752 in the shape of an inverted funnel and a second inner surface 8753 in the shape of a cylinder. Part of the clamping block 86 is accommodated in the second inner surface 8753. A first annular space having a triangular cross section is formed between the upper surface of the clamping block 86 and the first inner surface 8752, and a second O-ring 82 is arranged in the first annular space. The second O-ring 82 is squeezed and then tightly holds the support shaft 80 (friction force increases).

[0076] The receiving groove 850 has a funnel-shaped inclined surface 8501. A second annular space with a triangular cross section is formed between the lower end surface of the pressing block 86 and the inclined surface 8501, and a third O-ring 83 is arranged in the second annular space. The third O-ring 83 is squeezed and then tightly holds the support shaft 80 (friction force increases).

[0077] The first O-ring 81 , the second O-ring 82 and the third O-ring 83 also play a sealing role to prevent the air inside the chamber from communicating with the outside air.

[0078] The pressing block 86 , the rotor 87 and the support shaft 80 are coaxially arranged.

[0079] In some embodiments, the wafer processing chamber is fixedly connected to the top plate 100, and the stator 88 is fixedly connected to the bottom plate 300. In other embodiments, the wafer processing chamber is fixedly connected to the bottom plate 300, and the stator 88 is fixedly connected to the top plate 100.

[0080] The gear 89 meshes with the driving wheel. When the driving wheel rotates, the gear 89, the rotor 87 and the support block 85 rotate relative to the stator 88 together.

[0081] In the embodiment described above, the support block 85 and the gear 89 are fixedly connected by bolts, and the gear 89 and the rotor 87 are fixedly connected by another bolt. In some other embodiments, the gear 89, the rotor 87 and the support block 85 can be connected by the same bolt.

[0082] In some further specific embodiments, the inner diameter D1 of the first limiting section 871, the inner diameter D2 of the second limiting section 872 and the outer diameter d of the support shaft 80 satisfy:

[0083]

[0084] Exemplarily, along the vertical downward direction, the variation trend of the inner diameter of the rotor 87 includes: increasing from D1 to a maximum value, and decreasing from the maximum value to D2.

[0085] The inner diameter D2 of the second limiting section 872 is the minimum inner diameter of the accommodating through hole 870. This embodiment is conducive to restraining the support shaft 80 in the rotor 87, while preventing the support shaft 80 from being directly squeezed by the inner wall of the rotor 87 and damaged.

[0086] In some other specific embodiments, the maximum distance between the first limiting section 871 and the second limiting section 872 is H, the distance between the first O-ring 81 and the second O-ring 82 is h, and H is greater than h. The inner diameter of the first O-ring 81 is R1, the inner diameter of the second O-ring 82 is R2, the inner diameter of the third O-ring 83 is R3, the inner diameter of the support ring 84 is R4, and the inner diameter of the clamping block 86 is R5, satisfying:

[0087]

[0088] d is the outer diameter of the support shaft 80 .

[0089] like Fig. 9 and Figure 2As shown, the third embodiment provides an adjustment method of an adjustment mechanism, which is applied to the adjustment mechanism of any one of the above embodiments, including: S1, when the wafer tray 921 is offset in the x direction, the displacement of the middle plate 200 in the x direction is adjusted by the first horizontal bolt. S2, the bottom plate 300 and the middle plate 200 move together in the x direction relative to the top plate 100, and the displacement in the x direction is transmitted to the wafer support mechanism by the transmission mechanism 7, thereby driving the wafer tray 921 to move in the x direction. S3, when the wafer tray 921 is offset in the y direction, the displacement of the bottom plate 300 in the y direction is adjusted by the second horizontal bolt. S4, the bottom plate 300 moves in the y direction relative to the middle plate 200, and the displacement in the y direction is transmitted to the wafer support mechanism by the transmission mechanism 7, thereby driving the wafer tray 921 to move in the y direction. S5, by adjusting at least one vertical adjustment member, the vertical displacement of the top plate 100 at the vertical adjustment member is adjusted to adjust the horizontality of the wafer tray 921. S6, repeat at least one of the above processes until the wafer tray 921 is in a position required by the process.

[0090] Specifically, S1 includes: when the wafer tray 921 is offset by a distance L1 in the x direction, the displacement of the middle plate 200 in the x direction is adjusted to -L1 by the first horizontal bolt. S2 includes: the bottom plate 300 and the middle plate 200 are displaced by -L1 in the x direction relative to the top plate 100, and the displacement -L1 in the x direction is transmitted to the wafer support mechanism by the transmission mechanism 7, thereby driving the wafer tray 921 to move -L1 in the x direction.

[0091] Similarly, S3 includes: when the wafer tray 921 is offset by a distance L2 in the y direction, the displacement of the bottom plate 300 in the y direction is adjusted to -L2 by the second horizontal bolt. S4 includes: the bottom plate 300 moves -L2 in the y direction relative to the middle plate 200, and the displacement in the y direction is transmitted to the wafer support mechanism by the transmission mechanism 7, thereby driving the wafer tray 921 to move -L2 in the y direction.

[0092] Specifically, S5 also includes adjusting each vertical adjustment member to move the top plate 100 in the z direction, so that the top plate 100, the middle plate 200 and the bottom plate 300 are raised by L3 in the z direction, and the displacement in the z direction is transmitted to the wafer support mechanism by the transmission mechanism 7, thereby driving the wafer tray 921 to rise by L3 in the z direction. Or adjusting each vertical adjustment member to move the top plate 100 in the z direction, so that the top plate 100, the middle plate 200 and the bottom plate 300 are lowered by L4 in the z direction, and the displacement in the z direction is transmitted to the wafer support mechanism by the transmission mechanism, thereby driving the wafer tray 921 to lower by L4 in the z direction.

[0093] Alternatively, one or more vertical adjustment members may be adjusted according to actual needs to adjust the level of the top plate 100, which is then transmitted to the wafer support mechanism through the middle plate 200, the bottom plate 300, and the transmission mechanism 7 to adjust the level of the wafer tray.

[0094] In the foregoing description and in the flow chart, symbols such as S1-S6 and arrows pointing in sequence are used for ease of explanation, but it should be understood that the order of adjustment in each direction should not be limited to the order in the description of the present invention.

[0095] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. An adjustment mechanism for a semiconductor processing device, characterized in that: The adjustment mechanism includes a bottom plate, a middle plate, a top plate, a horizontal adjustment member and a vertical adjustment member; The middle parts of the bottom plate, the middle plate and the top plate are respectively provided with hollow parts; The bottom plate, the middle plate and the top plate are stacked in sequence; The first side surfaces of the bottom plate and the top plate are provided with a limiting boss or a limiting groove having a limiting hole, the first side surface is a side facing the middle plate, and correspondingly, the middle plate is provided with a limiting groove corresponding to the limiting boss or a limiting boss corresponding to the limiting groove, the limiting groove and the limiting boss are matched in a concave-convex manner, so that the bottom plate, the middle plate and the top plate can move relative to each other in pairs; The bottom plate or the top plate is adjustably fixedly connected to the processing chamber in the processing device, and correspondingly, the top plate or the bottom plate is fixedly connected to a transmission mechanism in the processing device, and the transmission mechanism is configured to drive the wafer tray through a wafer supporting mechanism; the wafer supporting mechanism is partially located in the hollow portion; The horizontal adjustment member is movably connected to the limiting hole of the limiting boss, and the horizontal position of the wafer tray is adjusted by moving the middle plate and the bottom plate in the x direction and the y direction respectively, or by moving the top plate and the middle plate in the x direction and the y direction respectively, wherein the x direction is perpendicular to the y direction; an elastic member that can be elastically deformed in the x direction is provided between the top plate and the middle plate; an elastic member that can be elastically deformed in the y direction is provided between the middle plate and the bottom plate; A first limiting assembly is provided between the top plate and the middle plate, and a second limiting assembly is provided between the middle plate and the bottom plate; the first limiting assembly and the second limiting assembly both include bushings and corresponding bushing grooves; the bushing groove provided in the middle plate is matched with the bushing fixedly connected to the top plate; the bushing groove provided in the bottom plate is matched with the bushing fixedly connected to the middle plate; the first limiting assembly also includes a first bushing core extending along the x-direction and passing through the middle plate and passing through the bushing in the bushing groove of the middle plate; the second limiting assembly also includes a second bushing core extending along the y-direction and passing through the bottom plate and passing through the bushing in the bushing groove of the bottom plate; the vertical adjustment member is movably connected to the top plate or the bottom plate, and the horizontality of the wafer tray is adjusted by adjusting the vertical position of the top plate or the bottom plate.

2. The adjustment mechanism according to claim 1, characterized in that: The horizontal adjustment member includes a first horizontal bolt and a second horizontal bolt; The first horizontal bolt is movably connected to the top plate and is used to adjust the relative position of the top plate and the middle plate in the x direction; The second horizontal bolt is movably connected to the bottom plate and is used to adjust the relative position of the middle plate and the bottom plate in the y direction.

3. The adjustment mechanism according to claim 2, characterized in that: Also included: a fixing assembly, the fixing assembly including a first fixing bolt and a second fixing bolt, the first fixing bolt being arranged on an opposite side of the first horizontal bolt, and the second fixing bolt being arranged on an opposite side of the second horizontal bolt; The first fixing bolts are configured to fix the top plate and the middle plate in the x-direction; and the second fixing bolts are configured to fix the middle plate and the bottom plate in the y-direction.

4. The adjustment mechanism according to claim 1, characterized in that: The vertical adjustment members are provided in a plurality of groups, and the plurality of groups of vertical adjustment members are separately arranged along the circumference of the top plate; The adjustment mechanism further includes third fixing bolts, which are arranged to match the number of the vertical adjustment members and are arranged at matching positions of the vertical adjustment members.

5. The adjustment mechanism according to claim 4, characterized in that: It also includes a plurality of fixing brackets respectively located on the peripheral sides of the top plate, each fixing bracket is provided with two through holes, the two through holes are respectively used to set the vertical adjustment member and the third fixing bolt, the fixing bracket is fixed to the bottom of the top plate by the third fixing bolt, and the fixing bracket is fixedly connected to the processing chamber in the processing device.

6. The adjustment mechanism according to claim 1, characterized in that: The first limiting assembly is used to limit the relative displacement of the top plate and the middle plate in the y direction and the relative displacement in the z direction; the second limiting assembly is used to limit the relative displacement of the middle plate and the bottom plate in the x direction and the relative displacement in the z direction.

7. The adjustment mechanism according to claim 1, characterized in that: The top plate is provided with a receiving groove, the receiving groove is provided with a gasket, the gasket abuts against the end of the vertical adjustment member, and the vertical adjustment member extends from the bottom plate in a direction pointing to the top plate and abuts against the gasket.

8. The adjustment mechanism according to claim 1, characterized in that: The limiting groove is arranged at the edge of the middle plate; the limiting boss is arranged at the edge of the top plate and the edge of the bottom plate, an elastic member is arranged in the limiting groove, one end of the elastic member acts on the limiting boss, and the other end of the elastic member acts on the middle plate.

9. A semiconductor processing device, characterized in that: comprising a semiconductor wafer processing chamber, a wafer supporting mechanism, a transmission mechanism and at least one adjustment mechanism as claimed in any one of claims 1 to 8; The wafer support mechanism is fixedly connected to the transmission mechanism, and the transmission mechanism is configured to transmit power to drive the wafer support mechanism to rise, fall and rotate; The wafer support mechanism includes a support shaft and a wafer tray, wherein the support shaft supports the wafer tray through a bracket, and the support shaft drives the wafer tray to rotate and rise and fall; The adjustment mechanism adjusts the horizontal position and levelness of the wafer tray by adjusting the displacement of the transmission mechanism in the x direction, the y direction and / or the z direction.

10. The processing device according to claim 9, characterized in that The transmission mechanism comprises: a magnetic fluid sealing assembly; the magnetic fluid sealing assembly comprises a stator and a rotor; the stator is relatively fixed to the base plate; the rotor is accommodated inside the stator, and the rotor is configured to be relatively rotatable with the stator; The rotor has a receiving through hole, the support shaft passes through the receiving through hole and the support shaft is configured to be tightly embraced by the rotor; The accommodating through hole comprises a first limiting section located at one end of the rotor, a second limiting section located at the other end of the rotor, and a middle section extending between the first limiting section and the second limiting section; The inner diameters of the first limiting section and the second limiting section are both smaller than the inner diameter of the middle section.

11. The processing device according to claim 10, characterized in that The magnetic fluid sealing assembly also includes a support block; The support block includes a receiving groove in which the bottom end of the support shaft is supported; and the support block is fixed to the rotor.

12. The processing device according to claim 11, characterized in that The first limiting section and the containing groove are both provided with O-rings; the O-rings are used to clamp the supporting shaft; A clamping block is also installed in the accommodating groove, and the clamping block is used to squeeze the O-ring to clamp the bottom end of the supporting shaft; the clamping block, the rotor and the supporting shaft are coaxially arranged.

13. The processing device according to claim 11, characterized in that The bottom of the rotor is arranged as a protruding portion, a gear is arranged on the outer side of the rotor, the protruding portion passes through the gear and extends to the containing groove; the gear and the supporting block are fixedly connected to the rotor.

14. The processing device according to claim 13, characterized in that The portion of the accommodating groove corresponding to the pressing block is provided with an inclined surface, and the portion of the protruding portion corresponding to the pressing block is provided with a first inner surface; the inclined surface and the first inner surface are both abutted with an O-ring so that the O-ring clamps the support shaft.

15. A method for adjusting an adjusting mechanism, applied to the adjusting mechanism according to any one of claims 1 to 8, characterized in that: include: When the wafer tray is offset in the x-direction, the position of the middle plate in the x-direction is adjusted by a first horizontal bolt; The bottom plate and the middle plate move together relative to the top plate in the x direction, and then drive the wafer tray to move in the x direction through the transmission mechanism and the wafer support mechanism; When the wafer tray is offset in the y direction, the position of the bottom plate in the y direction is adjusted by the second horizontal bolt; Then, the transmission mechanism and the wafer support mechanism drive the wafer tray to move in the y direction; Adjusting the vertical displacement of the top plate at the vertical adjustment member by adjusting at least one of the vertical adjustment members to adjust the horizontality of the wafer tray; Repeat at least one of the above processes, and use fixing members to fix the top plate, the middle plate and the bottom plate when appropriate.

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