Moving device and working machine

Abstract

The present application provides a kind of moving device and working machine, including engagement mechanism and transport mechanism, engagement mechanism is equipped with engagement device for taking and placing electronic component, transport mechanism is equipped with the moving tool that can be displaced along transport path, moving tool is equipped with multiple carriers and image pickup device, multiple carriers are used for engagement device to take out or place electronic component, image pickup device can image electronic component;Moving tool can transport multiple carriers, image pickup device and electronic component are displaced along transport path synchronously, not only make multiple carriers carry and be moved in / out electronic component, but also make image pickup device relative engagement device, so that the placement position and appearance of electronic component on engagement device can be imaged and detected, to reduce the operation time of detecting electronic component, and further improve production efficiency.

Description

Technical Field

[0001] This invention relates to a transfer device that can reduce the timing and spatial configuration of detection operations to improve production efficiency. Background Technology

[0002] In modern electronic component processing machines, the electronic components to be tested are placed in the receiving section of the feeding stage and transported to one side of the test stand by X-direction displacement. The crimping device then removes the electronic components to be tested from the feeding stage and moves them into the test stand to perform electrical testing. The tested electronic components are then removed from the test stand and moved into the receiving section of an output stage for discharge.

[0003] However, during the transport of electronic components, the electronic components may slip within the receiving section of the feeding platform, or there may be errors in the movement of the crimping device or its own structural assembly. This can cause the position of the electronic components picked up by the crimping device to deviate, making it impossible for the contacts of the electronic components to make accurate and effective contact with the probes of the test socket, thus affecting the test quality. In particular, as electronic components become increasingly precise and miniaturized, the accuracy requirements are extremely high. If the electronic components transferred by the crimping device are slightly off-center, the electronic components will not be able to perform the test operation accurately, thus reducing the test quality.

[0004] Furthermore, multiple contacts on the bottom surface of an electronic component may detach before testing, preventing the component from making effective electrical contact with the test socket and thus affecting test quality; or multiple contacts may detach after testing, which also fails to ensure the component's factory quality. Summary of the Invention

[0005] The purpose of this invention is to provide a moving device and a working machine.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] A transfer device, characterized in that it comprises:

[0008] Connection mechanism: It is provided with at least one connector for picking up and placing electronic components;

[0009] The transport mechanism includes a moving device, a plurality of platforms, and at least one image sensor. The moving device is capable of moving along a transport path. The plurality of platforms are capable of supporting a plurality of electronic components and are mounted on the moving device to move synchronously for the connector to pick up and place electronic components. The image sensor is mounted on the moving device to move synchronously and captures images to detect the electronic components of the connector.

[0010] The aforementioned moving device, wherein: the conveying mechanism is provided with at least one conveying driver for driving the moving device to move along the conveying path.

[0011] The aforementioned transfer device, wherein: the moving part of the transport mechanism is equipped with the plurality of platforms on its top surface, and the image sensor is equipped on the top surface or any side surface of the moving part.

[0012] The aforementioned transfer device, wherein: the moving part of the transport mechanism is equipped with the plurality of platforms on a plurality of sides, and the image sensor is mounted on the top surface or any of the sides of the moving part.

[0013] The aforementioned moving device, wherein: the transport mechanism is provided with an image acquisition adjuster on the moving part for adjusting the image acquisition height position of the image acquisition device.

[0014] The aforementioned transfer device, wherein: the moving part of the transport mechanism is capable of moving the image sensor to a first position on the transport path, so that the image sensor can detect electronic components.

[0015] The aforementioned transfer device, wherein: the transport path of the transport mechanism further includes a second position and a third position, the second position being for one of the platforms to perform an electronic component feeding operation, and the third position being for another of the platforms to perform an electronic component unloading operation.

[0016] The aforementioned transfer device, wherein the connector of the coupling mechanism is capable of displacement in at least one direction to pick up and place electronic components.

[0017] The aforementioned transfer device, wherein the coupling mechanism has at least one temperature control for use with temperature control electronics.

[0018] A work machine, characterized in that it comprises:

[0019] Machine tool;

[0020] Feeding device: disposed on the machine and equipped with at least one feeder for accommodating at least one electronic component to be operated;

[0021] Material receiving device: disposed on the machine and equipped with at least one material receiving device for accommodating at least one completed electronic component;

[0022] Operating device: disposed on the machine and equipped with at least one operating device to perform preset operations on electronic components;

[0023] At least one of the aforementioned transfer devices: assembling the machine base;

[0024] Central control unit: Used to control and integrate the operation of various devices to perform automated operations.

[0025] This invention utilizes a movable device to transport multiple platforms, an image sensor, and electronic components simultaneously along a transport path. This not only transports multiple platforms for the connector to pick up and place electronic components, but also transports the image sensor relative to the connector along the same transport path. This allows the image sensor to capture images and detect the placement or appearance of the electronic components picked up by the connector, facilitating the adjustment of the electronic component placement to accurately execute preset operations, and detecting whether electronic components have detached from contacts, thereby improving testing quality and production efficiency.

[0026] The transfer device provided by the present invention has a transport mechanism that uses a moving device to transport a plurality of platforms, image sensors and electronic components to move synchronously along the transport path. This can effectively reduce the timing of the driver and detection operation used to transport the image sensor, thereby facilitating space configuration and saving costs. Attached Figure Description

[0027] Figure 1 This is a top view of the transfer device of the present invention.

[0028] Figure 2 This is a front view of the transfer device of the present invention.

[0029] Figures 3 to 7 This is a schematic diagram of the transfer device of the present invention applied to a work machine.

[0030] Explanation of reference numerals in the attached drawings: Transfer device 10; Coupler 11; Coupler jig 111; Temperature control device 112; Coupler driver 12; Moving device 13; Motor 141; Pulley assembly 142; First platform 15; First receiving part 151; Second platform 16; Second receiving part 161; Image sensor 17; Image sensor adjuster 171; First transfer device 181; Second transfer device 182; First position A1; Second position A2; Third position A3; Transport path B; Machine base 20; Feeding device 30; Feeder 31; Receiving device 40; Receiving device 41; Working device 50; Circuit board 51; Test socket 52; Electronic component 61. Detailed Implementation

[0031] To provide a better understanding of the present invention, a preferred embodiment is described in detail below with reference to the accompanying drawings:

[0032] Please see Figure 1 , Figure 2 The transfer device 10 of the present invention includes a coupling mechanism and a transport mechanism.

[0033] The coupling mechanism is provided with at least one coupling member 11 for picking up and placing electronic components. Furthermore, the coupling member 11 is capable of displacement in at least one direction to pick up and place electronic components; for example, the coupling member 11 is capable of displacement in a third direction (such as the Z direction) to pick up and place electronic components; for example, the coupling member 11 is capable of displacement in a second and third direction (such as the YZ direction) to be displaced to a preset position and to pick up and place electronic components.

[0034] Depending on the operational requirements, the connector 11 can simply pick up and place electronic components, or it can pick up, place, and press electronic components.

[0035] Depending on the operational requirements, the bonding mechanism is provided with at least one temperature control device on the bonding unit 11 for temperature control electronic components. The temperature control device may be a heating element, a cooling wafer, or a fluid-containing seat.

[0036] Depending on the operational requirements, the connector 11 also includes a fine-tuning unit and a coupling fixture, and the fine-tuning unit is used to fine-tune the placement of the coupling fixture.

[0037] In this embodiment of the invention, the connector 11 of the bonding mechanism is a crimper and is provided with a bonding fixture 111 with a suction nozzle to perform the operation of picking up and crimping electronic components; the bonding mechanism is provided with a bonding driver 12 on the machine base 20, which drives the connector 11 to move in the YZ direction, so that the connector 11 can be moved to the work machine (not shown) and the preset first position A1. The preset first position A1 allows the connector 11 to pick up and place electronic components, and allows the camera of the transport mechanism to perform detection operation on the electronic components.

[0038] Depending on the operational requirements, since the connector 11 can be displaced in at least one direction, the connector 11 can perform the operation of picking up and placing electronic components and the operation of detecting electronic components at a plurality of different preset positions. For example, the connector 11 can perform the operation of picking up and placing electronic components at a preset first position and the operation of detecting electronic components at a preset fourth position. Therefore, it is also possible for the connector 11 to be displaced in different directions and perform the operation of picking up and placing electronic components or the operation of detecting electronic components at different preset positions.

[0039] In an embodiment of the present invention, the connector 11 is provided with a temperature control 112 that can cool the wafer, so that the electronic components can perform test operations at a temperature that simulates the future application environment.

[0040] The transport mechanism includes a moving device 13, a plurality of platforms and at least one image sensor. The moving device 13 is capable of displacement along the transport path B. The plurality of platforms are capable of holding a plurality of electronic components and are mounted on the moving device 13 so as to be synchronously displaced by the connector 11. The image sensor is mounted on the moving device 13 so as to be synchronously displaced and to capture images to detect the electronic components on the connector 11.

[0041] Depending on the operational requirements, the transport mechanism may be equipped with a plurality of platforms on the top surface of the mobile device 13, and the image sensor may be mounted on the top surface or any side surface of the mobile device 13. Alternatively, the transport mechanism may be equipped with a plurality of platforms on a plurality of sides of the mobile device 13, and the image sensor may be mounted on the top surface or any side surface of the mobile device 13.

[0042] Depending on the operational requirements, the transport mechanism is equipped with an image acquisition adjuster on the mobile device 13 to adjust the image acquisition height position of the image acquisition device.

[0043] The conveying mechanism is provided with at least one conveying drive to drive the moving part 13 to move along the conveying path B. The conveying drive may be a linear motor, a cylinder, or a combination of a motor and at least one transmission assembly, which may be a pulley assembly or a screw and socket assembly, etc. In an embodiment of the present invention, the conveying mechanism is provided with a conveying driver, which includes a motor 141 and a pulley assembly 142. The motor 141 can drive the pulley assembly 142, which is arranged in a first direction (such as the X direction). The transmission path of the pulley assembly 142 is the conveying path B. The pulley assembly 142 is connected to a moving device 13 to move along the conveying path B in the first direction. The conveying path B includes a first position A1, a second position A2 and a third position A3. The first position A1 is used for the connector 11 to pick up and place electronic components on a plurality of platforms and for the camera to perform detection operations on the electronic components on the connector 11. The second position A2 is located on one side of the first position A1 and is used for one platform of the conveying mechanism to perform feeding electronic components. The third position A3 is located on the other side of the first position A1 and is used for another platform of the conveying mechanism to perform discharging electronic components.

[0044] The moving device 13 can be a base or a connecting plate; for example, the moving device 13 is a base, the top surface of which can be used to mount a plurality of platforms and an image sensor; for example, the moving device 13 is a connecting plate, the plurality of sides of which can be used to connect a plurality of platforms, and the top surface is used to mount an image sensor. In an embodiment of the present invention, the moving device 13 is a base and is connected to and mounted on a pulley assembly 142, and is driven by the pulley assembly 142 to move in the X direction along the transport path B, passing through the first position A1, the second position A2 and the third position A3.

[0045] Depending on the operational requirements, multiple platforms of the transport mechanism are detachably or fixedly mounted on the moving device 13. Each platform has at least one receiving portion for accommodating electronic components. The multiple platforms include a first platform 15 and a second platform 16, which are independently mounted on opposite sides of the top surface of the moving device 13. The first platform 15 has an upward-facing first receiving portion 151 for accommodating electronic components to be processed, and the second platform 16 has an upward-facing second receiving portion 161 for accommodating electronic components that have already been processed. The first platform 15 and the second platform 16 can be driven by the moving device 13 to move synchronously along the transport path B in the X direction, passing through a first position A1, a second position A2, and a third position A3 in sequence. The moving device 13 moves the first platform 15 to the second position A2, where electronic components to be processed can be moved in. The moving device 13 moves the first platform 15 to the first position A1, allowing the connector 11 to remove the electronic component to be worked on. The moving device 13 moves the second platform 16 to the third position A3, allowing the worked electronic component to be removed, and the second platform 16 is in the first position A1, allowing the connector 11 to move the worked electronic component in.

[0046] The image sensor 17 of the transport mechanism can be a CCD and is mounted on the top surface of the transfer carrier 13, located between the first platform 15 and the second platform 16. The transport mechanism has an image sensor adjuster 171 on the moving carrier 13 to adjust the image sensor height position. The moving carrier 13 moves the image sensor 17 to the first position A1, so that the image sensor 17 is relative to the connector 11, allowing the image sensor 17 to capture images from bottom to top to detect the placement and appearance of the electronic components to be operated or the electronic components already operated on the connector 11. In addition, the image sensor 17 can transmit the image data to a processor (not shown), which analyzes and judges the image data, for example, it can analyze whether the placement position of the electronic components is offset, or whether the contacts of the electronic components are detached.

[0047] Please see Figures 3-7 The electronic component processing machine includes a machine base 20, a feeding device 30, a receiving device 40, a processing device 50, a transfer device 10 of the present invention, and a central control device (not shown in the figure). The central control device controls and integrates the operation of each device to perform automated operation.

[0048] A feeding device 30 is disposed on the machine base 20 and is provided with at least one feeder 31 for accommodating at least one electronic component to be operated. A receiving device 40 is disposed on the machine base 20 and is provided with at least one receiving device 41 for accommodating at least one electronic component that has been operated.

[0049] A working device 50 is disposed on a machine base 20 and is provided with at least one working device to perform preset operations on electronic components. The working device 50 may be a testing device or a printing device, etc., and the working device may be a testing device or a printing device, etc., to perform testing operations or printing operations, etc., and is not limited to the embodiments of the present invention. In the embodiments of the present invention, the working device 50 is a testing device, and its working device is a testing device. The testing device includes an electrically connected circuit board 51 and a transmission component (such as a probe). The circuit board 51 itself may have a test program, or be electrically connected to a testing machine. In the embodiments of the present invention, the testing device is provided with an electrically connected circuit board 51 and a test socket 52 with a plurality of probes. The test socket 52 is used to hold and test electronic components.

[0050] Depending on the operational requirements, the operating device 50 is equipped with a test chamber for the tester to perform testing operations. The test chamber may be equipped with at least one delivery pipe (not shown in the figure) to deliver dry air to the test chamber, allowing the electronic components to undergo cold testing in a test chamber that simulates the ambient temperature of future use. However, depending on the operational requirements, a blower (not shown in the figure) may be installed in the test chamber to blow hot air and raise the internal temperature of the test chamber during hot testing operations.

[0051] The conveying mechanism of the transfer device 10 further includes at least one transferor for transferring electronic components. Furthermore, the transferor is capable of displacement in at least one direction. In this embodiment of the invention, the conveying mechanism further includes a first transferor 181 and a second transferor 182. The first transferor 181 is capable of displacement in the XYZ directions to transfer the electronic component to be tested between the feeding device 30 and the first stage 15. The second transferor 182 is capable of displacement in the XYZ directions to transfer the tested electronic component between the second stage 16 and the receiving device 40.

[0052] The first transfer device 181 of the conveying mechanism of the transfer device 10 moves in the XYZ direction to remove the electronic component 61 to be tested from the feeding device 30. The motor 141 of the conveying mechanism drives the pulley group 142, which drives the moving device 13 to move in the X direction along the conveying path B. The moving device 13 drives the first platform 15, the second platform 16 and the image sensor 17 to move in the X direction simultaneously, so that the first platform 15 is located at the second position A2 on the conveying path B, so that the first transfer device 181 can move the electronic component 61 to be tested into the first receiving part 151 of the first platform 15. Motor 141 drives moving device 13 to move in the X direction along transport path B via pulley assembly 142. Moving device 13 drives first stage 15, second stage 16, image sensor 17 and electronic component 61 under test to move in the X direction simultaneously, so that first stage 15 is located at first position A1 on transport path B. The coupling mechanism drives coupling device 11 to move in the Y direction to first position A1 on transport path B and above first stage 15, and moves in the Z direction to remove electronic component 61 under test from first stage 15.

[0053] Since the connector 11 of the coupling mechanism is already located at the first position A1 on the transport path B, the motor 141 drives the moving device 13 to move in the X direction along the transport path B via the pulley group 142. The moving device 13 drives the first platform 15, the second platform 16, the image sensor 17 and the electronic component 61 under test to move in the X direction simultaneously, causing the first platform 15 to retract and the image sensor 17 to be located at the first position A1 on the transport path B. The image sensor 17 picks up the electronic component 61 under test relative to the connector 11. The connector 11 does not need to transfer the electronic component 61 to another path for detection, or transfer the image sensor 17 to another path for detection of the electronic component. This can reduce the operation time of the connector 11 or the image sensor 17, thereby improving production efficiency. Therefore, the image sensor 17 captures an image of the electronic component 61 under test from below and upward at the first position A1 on the transport path B, and transmits the image data to a processor (not shown). The processor analyzes and determines whether the placement of the electronic component 61 under test is off-center and whether the contacts are detached, etc., to improve the test quality. After image acquisition, the bonding driver 12 drives the bonding unit 11 to move in the YZ direction, so that the bonding unit 11 moves the electronic component 61 under test into the test holder 52 to perform the test operation.

[0054] Since the image sensor 17 is located at the first position A1, after the test is completed, the coupling driver 12 drives the coupling 11 to move in the YZ direction to move the tested electronic component 61 out of the test holder 52 and transfer it to the first position A1 on the transport path B. This makes the tested electronic component 61 relative to the image sensor 17. The image sensor 17 takes an image of the tested electronic component 61 from the first position A1 and transmits the image data to a processor for analysis and judgment to determine whether the tested electronic component 61 has experienced contact detachment after the test is completed, thereby improving the quality of the product.

[0055] After image acquisition, motor 141 drives moving device 13 to move in the X direction along transport path B via pulley assembly 142. Moving device 13 drives first stage 15, second stage 16, and image sensor 17 to move synchronously in the X direction, causing image sensor 17 to retract and second stage 16 to be positioned at first position A1 on transport path B. Engaging mechanism drives engagement device 11 to move in the Z direction via engagement driver 12, moving the measured electronic component 61 into second stage 16. Motor 141 drives moving device 13 to move in the X direction along transport path B via pulley assembly 142. Moving device 13 drives first stage 15, second stage 16, image sensor 17, and image sensor 17 to move synchronously in the X direction. Electronic component 61 is simultaneously displaced in the X direction, causing the second stage 16 to transport the tested electronic component 61 to the third position A3 on the transport path B for discharge. The second transfer device 182 then displaces in the XYZ directions on the second stage 16 to retrieve the tested electronic component 61. Based on the test results, the tested electronic component 61 is transferred to the receiving device 40 for sorting and storage. Therefore, the transport mechanism can move the first stage 15, the image sensor 17, and the second stage 16 along the travel of the transport path B using the moving device 13, so that the connector 11 can pick up and put in electronic components, and the image sensor 17 can detect the electronic components of the connector 11, thereby improving test quality and production capacity.

Claims

1. A transfer device, characterized in that, Include: Connection mechanism: It is provided with at least one connector for picking up and placing electronic components; The transport mechanism includes a moving device, a plurality of platforms, and at least one image sensor. The moving device is capable of moving along a transport path. The plurality of platforms are capable of supporting a plurality of electronic components and are mounted on the moving device to move synchronously for the connector to pick up and place electronic components. The image sensor is mounted on the moving device to move synchronously and captures images to detect the electronic components of the connector.

2. The transfer device as described in claim 1, characterized in that: The transport mechanism is equipped with at least one transport drive to drive the moving vehicle to move along the transport path.

3. The transfer device as described in claim 1, characterized in that: The transport mechanism has a plurality of platforms mounted on its top surface, and the image sensor is mounted on the top surface or any side surface of the transport mechanism.

4. The transfer device as described in claim 1, characterized in that: The transport mechanism has a plurality of platforms mounted on a plurality of sides, and the image sensor is mounted on the top surface of the transport mechanism or any of the sides.

5. The transfer device as described in claim 1, characterized in that: The transport mechanism is equipped with an image acquisition adjuster on the mobile device to adjust the image acquisition height position of the image acquisition device.

6. The transfer device as described in claim 1, characterized in that: The moving part of the conveying mechanism can move the image sensor to a first position on the conveying path so that the image sensor can detect electronic components.

7. The transfer device as described in claim 6, characterized in that: The transport path of the transport mechanism also includes a second position and a third position, the second position for one of the platforms to perform feeding electronic components and the third position for another of the platforms to perform discharging electronic components.

8. The transfer device as described in claim 1, characterized in that: The connector of the engagement mechanism is capable of displacement in at least one direction to pick up and place electronic components.

9. The transfer device as described in claim 1, characterized in that: The coupling mechanism has at least one temperature control for use with temperature control electronics.

10. A work machine, characterized in that, Include: Machine tool; Feeding device: disposed on the machine and equipped with at least one feeder for accommodating at least one electronic component to be operated; Material receiving device: disposed on the machine and equipped with at least one material receiving device for accommodating at least one completed electronic component; Operating device: disposed on the machine and equipped with at least one operating device to perform preset operations on electronic components; At least one transfer device as described in claim 1: assembling the machine base; Central control unit: Used to control and integrate the operation of various devices to perform automated operations.

Images