Ceramic copper-clad substrate film peeling device and method for reducing wiring generation

Abstract

The present invention relates to the technical field of production of ceramic copper-clad carrier boards, and specifically to a device and method for tearing film on ceramic copper-clad carrier boards that reduces the generation of connection lines. The device comprises a mounting platform, wherein two vertical parts of an inverted U-shaped frame are symmetrically arranged on the left side of the upper end of the mounting platform, the vertical part of an L-shaped plate is installed on the left end of the transverse part of the inverted U-shaped frame, the left end of the vertical part of the L-shaped plate is slidably connected to a moving plate, the upper end of the moving plate is provided with a movable part of a lifting member, a glue-releasing member is movably installed at the front end of the moving plate, a fixed plate is arranged at the front end of the moving plate, the lower end of the fixed plate is provided with a fixed part of a first lifting device, an auxiliary plate is installed at the lower end of the movable part of the first lifting device, a pressure column is installed on the lower side of the auxiliary plate, the fixed part of a second lifting device is installed on the upper end of the auxiliary plate, the movable part of the second lifting device passes through the auxiliary plate and is connected to the pressure column. The design realizes automatic mechanical film tearing of the ceramic copper-clad carrier board, effectively reduces the probability of connection lines occurring in subsequent development and etching due to manual film tearing, and effectively ensures the quality of the ceramic copper-clad carrier board.

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