A high-precision chip non-contact picking device based on swirl picking

Abstract

The present application belongs to the field of chip picking, and specifically discloses a high-precision chip non-contact picking device based on swirl picking, which includes a frame body, a test platform, a swirl picking head, a horizontal displacement adjustment mechanism, a leveling mechanism, and a sensor measurement mechanism; the test platform is horizontally mounted on the frame body through the horizontal displacement adjustment mechanism and can move in the horizontal direction; the leveling mechanism includes a first manual Z-axis and a three-axis adjustment frame, the three-axis adjustment frame is mounted on the frame body through the first manual Z-axis and can move in the vertical direction, the swirl picking head is mounted on the three-axis adjustment frame to achieve leveling, and the swirl picking head is located above the test platform. The present application can fully realize the design, debugging and performance testing of the picking head based on the swirl picking method through a multi-module integrated setting, is easy to operate, has comprehensive functions, can effectively improve the iteration speed of the swirl picking method, reduce the cost of experimental testing, and accelerate the industrialization process of the swirl picking method.

Description

Technical Field

[0001] The present application belongs to the field of chip picking, and more specifically, to a high-precision chip non-contact picking device based on swirl picking. Background Art

[0002] Chip picking and transfer is an extremely critical process in advanced electronic packaging. As chips become ultra-thin and interconnection density increases, the mechanical scratches and electrostatic interference on the chip surface caused by traditional vacuum adsorption picking are becoming increasingly important. Therefore, developing a stable non-contact chip picking method is the key to maintaining high-yield advanced packaging.

[0003] In the related technologies, pneumatic non-contact picking devices have the advantages of long service life, wide applicable materials, and no need for control circuits. They have developed rapidly in recent years. Among them, the more traditional pneumatic non-contact picking based on the Bernoulli principle has disadvantages such as high gas consumption, serious loss and excessive noise, which limits its scope of application.

[0004] The non-contact picking method based on vortex flow effectively solves the above-mentioned defects and has higher practical value and broad development prospects in the field of non-destructive chip picking. However, the non-contact chip picking method based on vortex flow still has the problem of unstable picking, which makes it difficult to directly apply it to high-precision chip picking process. Summary of the invention

[0005] In view of the defects of the prior art, the present application provides a high-precision chip non-contact picking device based on vortex picking, which aims to solve the problem of unstable picking of chips in the existing vortex vortex non-contact picking of chips.

[0006] The present application provides a high-precision chip non-contact picking device based on swirl picking, which specifically includes a rack body, a test platform, a swirl picking head, a horizontal displacement adjustment mechanism, a leveling mechanism and a sensor measurement mechanism;

[0007] The test platform is horizontally mounted on the frame body through a horizontal displacement adjustment mechanism and can move in the horizontal direction;

[0008] The leveling mechanism includes a first manual Z-axis and a three-axis adjustment frame, the three-axis adjustment frame is mounted on the frame body through the first manual Z-axis and can move in the vertical direction, the swirl pickup head is mounted on the three-axis adjustment frame to achieve leveling, and the swirl pickup head is located above the test platform;

[0009] The sensing and measuring mechanism comprises a first measuring component for measuring the picking force of the swirl pickup head and a second measuring component for measuring the pressure distribution below the swirl pickup head. The first measuring component and the second measuring component are both arranged on a test platform.

[0010] Through the above technical scheme conceived by the present application, compared with the prior art, the test platform can be moved to the bottom of the swirl pickup head through the horizontal displacement adjustment mechanism, the first manual Z-axis drives the three-axis adjustment frame and the swirl pickup head to descend, and then the swirl pickup head is adjusted to be horizontal through the three-axis adjustment frame to improve the stability when picking up the chip, and then the picking force of the swirl pickup head is measured by the first measuring component, and the pressure distribution of the effective picking position of the swirl pickup head is measured by the second measuring component. The performance of swirl pickup heads of different designs and the actual picking effect evaluation can be carried out, and by adjusting the parameters of the swirl pickup head during picking, the swirl pickup head can have a better picking effect.

[0011] As further preferred, the horizontal displacement adjustment mechanism includes an XY-axis electric translation stage, the XY-axis electric translation stage is fixedly connected to the frame body, and the test platform is fixedly connected to the output end of the XY-axis electric translation stage and is horizontally arranged.

[0012] As a further preferred embodiment, the first measuring component includes a force sensor, which is arranged on the test platform. When the test platform moves to the bottom of the swirl pickup head, the force sensor can measure the force exerted by the swirl pickup head on the test platform at different inlet pressures and heights, and thus determine the pickup force of the swirl pickup head.

[0013] As a further preferred embodiment, the second measuring component includes a pressure sensor, which is fixedly mounted on the bottom of the test platform. An airflow collection hole is provided on the test platform. The test platform moves under the drive of the horizontal displacement adjustment mechanism. When the airflow collection hole on the test platform moves to the bottom of the swirl pickup head, the pressure sensor measures the pressure below the swirl pickup head.

[0014] As a further preference, the picking device further comprises an oscillation detection mechanism for detecting the movement posture of the chip when the swirl picking head picks up the chip.

[0015] As further preferred, the oscillation detection mechanism includes at least three optical fiber sensors, which are all arranged on the test platform and surround a triangular detection area, and the optical fiber sensors are used to measure the distance between the lower surface of the chip picked up by the swirl pickup head and the test platform.

[0016] As a further preferred embodiment, the oscillation detection mechanism also includes an observation camera and an XZ manual adjustment axis, the XZ manual adjustment axis is fixedly connected to the frame body, the observation camera is fixedly connected to the output end of the XZ manual adjustment axis and is horizontally arranged, and the observation camera is located on one side of the test platform for photographing the chip picked up by the vortex pickup head.

[0017] As a further preference, the test platform is provided with a plurality of loading slots for placing chips, and the opening directions of the plurality of loading slots are different.

[0018] As a further preference, an integrally formed mounting rod is provided at the bottom of the three-axis adjustment frame, and the swirl pickup head is detachably connected to the mounting rod.

[0019] As further preferred, the picking device also includes a positioning camera arranged on the frame body, the positioning camera is located above the test platform, and its shooting window is vertically downward.

[0020] In general, the above technical solutions conceived by this application have the following technical advantages compared with the prior art:

[0021] 1. The present application can move the test platform to the bottom of the swirl pickup head through the horizontal displacement adjustment mechanism, the first manual Z-axis drives the three-axis adjustment frame and the swirl pickup head to descend, and then the swirl pickup head is adjusted to be horizontal through the three-axis adjustment frame to improve the stability when picking up the chip, and then the picking force of the swirl pickup head is measured by the first measuring component, and the pressure distribution of the effective picking position of the swirl pickup head is measured by the second measuring component. The performance test and actual picking effect evaluation of swirl pickup heads of different designs can be carried out, and the parameters of the swirl pickup head during picking can be adjusted to achieve a better picking effect of the swirl pickup head;

[0022] 2. The distance between the bottom surface of the chip and three points on the test platform is measured by an optical fiber sensor to reflect the oscillation posture of the chip. At the same time, the observation camera can assist in observing the degree of chip jitter, which more intuitively reflects the stability of the non-contact picking of the swirl pickup head;

[0023] 3. The swirl pickup head is detachably connected to the three-axis adjustment frame through the mounting rod, which is convenient for replacement and maintenance, thereby optimizing the success rate and stability of non-contact pickup and improving the effect of non-destructive chip pickup and transfer;

[0024] 4. This application, through a multi-module integrated setting, can fully realize the design, debugging and performance testing of the picking head based on the swirl picking method. It is easy to operate and has comprehensive functions. It can effectively improve the iteration speed of the swirl picking method, reduce the experimental testing cost, and accelerate the industrialization process of the swirl picking method. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of this application;

[0026] Figure 2 This is a schematic diagram of the overall structure of the rack body from a first perspective provided by an embodiment of the present application;

[0027] Figure 3 is a schematic diagram of the overall structure of the rack body from a second viewing angle provided by an embodiment of the present application;

[0028] Figure 4 It is a schematic diagram of the overall structure of the test platform provided in the embodiment of the present application;

[0029] Figure 5 yes Figure 3 Enlarged view of part A in the middle;

[0030] Figure 6 It is a schematic diagram of the overall structure of the sensor measurement mechanism provided in the embodiment of the present application.

[0031] Throughout the drawings, the same reference numerals are used to denote the same elements or structures, wherein:

[0032] 1. Rack body; 2. Test platform; 21. Airflow collection hole; 22. Loading trough; 3. Swirl pickup head; 4. Horizontal displacement adjustment mechanism; 41. XY axis electric shift stage; 5. Leveling mechanism; 51. First manual Z axis; 52. Three-axis adjustment frame; 53. Mounting rod; 6. Sensing and measuring mechanism; 61. First measuring component; 611. Force sensor; 62. Second measuring component; 621. Pressure sensor; 7. Oscillation detection mechanism; 71. Optical fiber sensor; 72. Observation camera; 73. XZ manual adjustment axis; 8. Positioning mechanism; 81. Positioning camera; 82. Second manual Z axis. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0034] The present application discloses a high-precision chip non-contact picking device based on swirl picking. Figure 1-6A high-precision chip non-contact picking device based on swirl picking includes a rack body 1, a test platform 2, a swirl picking head 3, a horizontal displacement adjustment mechanism 4, a leveling mechanism 5, a sensor measurement mechanism 6, an oscillation detection mechanism 7 and a positioning mechanism 8; wherein the rack body 1 includes a lower base, a fixed plate and a fixed frame, the fixed plate is fixedly connected to the lower base, and the fixed frame is fixedly connected to the fixed plate along the X-axis direction; the test platform 2 is horizontally installed on the fixed plate in the rack body 1 through the horizontal displacement adjustment mechanism 4, and the horizontal displacement adjustment mechanism 4 can drive the test platform 2 to move in the horizontal direction, and the positioning mechanism 8 determines the position of each part on the fixed plate, so that the moving position is more Accurate; the swirl picking head 3 is connected to the fixed frame in the frame body 1 through the leveling mechanism 5. After the swirl picking head 3 is adjusted by the leveling mechanism 5, the lower part is in a horizontal state to improve the picking stability of the chip; the picking force of the swirl picking head 3 and the pressure distribution of the effective picking position of the swirl picking head 3 are measured by the sensing and measuring mechanism 6; the movement state of the chip when the swirl picking head 3 picks up the chip can be detected by the oscillation detection mechanism 7, and the oscillation state of the chip can be judged. The present application can perform performance tests and actual picking effect evaluations on swirl picking heads 3 of different designs, and by adjusting the parameters of the swirl picking head 3 when picking up, the swirl picking head 3 can have a better picking effect.

[0035] To facilitate the control of the device, the device also includes a control module. The control module collects sensor data through an industrial computer and transmits it to a host computer, so as to realize visualization of the sensor data and equipment control in the host computer. The main functions of the software include camera field of view visualization, picking force data feedback, air intake pressure setting and pressure feedback, visualization of observation data of the optical fiber sensor 71, motion control of the XY-axis electric translation stage 41, etc. The control module is a commonly used module in this field and will not be described here.

[0036] In addition, the device of the present application also includes an air circuit module for providing air flow to the swirl picking head 3. The air circuit module is composed of a filter pressure regulating valve, a finger valve, a proportional valve and a flow meter. The proportional valve can be selected from ITV0030 and ITV2050, and the pressure ranges are 0.3MPa and 0.9MPa respectively, to achieve fine air inlet pressure control; the flow meter can be selected from PF2M710S, and the flow range is 0.1-10L / min, to achieve adjustable air circuit flow. The air circuit module is also a commonly used module in this field and will not be described here.

[0037] In this embodiment, three loading slots 22 for placing chips to be picked up are opened on the upper surface of the test platform 2, and the opening directions of the three loading slots 22 are different. The target chip size used in this embodiment is 12.8×12.5×0.05mm.

[0038] To drive the test platform 2 to move, the horizontal displacement adjustment mechanism 4 includes an XY-axis electric shifting stage 41, which is fixedly connected to a fixed plate in the frame body 1. The test platform 2 is fixedly connected to the output end of the XY-axis electric shifting stage 41 and is horizontally arranged. The repeatability of the XY-axis electric shifting stage 41 is 0.01mm, thereby realizing XY bidirectional high-precision displacement of the test platform 2 and ensuring the accuracy of positioning.

[0039] The positioning mechanism 8 includes a positioning camera 81 and a second manual Z-axis 82. The second manual Z-axis 82 is fixedly connected to the leftmost end of the fixed frame in the frame body 1. The positioning camera 81 is fixedly connected to the second manual Z-axis 82, and the shooting window of the positioning camera 81 is vertically downward. The accuracy of the second manual Z-axis 82 is 0.1mm, which can achieve fine-tuning of the position of the positioning camera 81. The positioning camera 81 is located above the test platform 2. A positioning feature is provided on the test platform 2. The positioning feature is moved to the center of the field of view of the positioning camera 81 by controlling the XY electric shifting stage, and the XY axis position coordinates of the positioning feature are recorded at this time. Since the relative positions of the functional modules on the operating platform are fixed, the coordinate values ​​corresponding to the other functional modules can be calculated from the coordinate values ​​corresponding to the positioning feature, thereby achieving accurate positioning of each module.

[0040] In this embodiment, the leveling mechanism 5 includes a first manual Z-axis 51 and a three-axis adjustment frame 52. The three-axis adjustment frame 52 is installed on the frame body 1 through the first manual Z-axis 51 and can move in the vertical direction. Specifically, the first manual Z-axis 51 is fixedly connected to the middle of the fixed frame in the frame body 1, and the three-axis adjustment frame 52 is fixedly connected to the first manual Z-axis 51. The swirl pickup head 3 is installed on the three-axis adjustment frame 52 to achieve leveling, and the swirl pickup head 3 is located above the test platform 2. The three-axis adjustment frame 52 adopts a pressure ring design for easy disassembly. The flatness of the pressure ring is adjusted by three leveling bolts, and the bottom of the three-axis adjustment frame 52 is provided with an integrally formed mounting rod. 53. The swirl pickup head 3 is detachably connected to the mounting rod 53. Specifically, an M3 threaded hole is opened on the side of the lower end of the mounting rod 53 and is locked with a top screw to facilitate the disassembly and replacement of the pickup head. A small hole is opened in the center of the bottom surface of the mounting rod 53 to facilitate assembly with the shaft feature of the upper end of the swirl pickup head 3. The hole and the shaft adopt a clearance fit. The bottom surface of the mounting rod 53 is also designed with a circular groove feature. When assembling with the pickup head, an annular rubber ring is embedded in the groove, which can effectively prevent gas leakage and improve the success rate of non-contact picking. The first manual Z-axis 51 has a stroke of ±12.5mm, a moving accuracy of 0.005mm, and a minimum reading of the differential head of 0.01mm, thereby realizing high-precision Z-axis movement of the swirl pickup head 3.

[0041] In this embodiment, the sensing and measuring mechanism 6 includes a first measuring component 61 and a second measuring component 62. The first measuring component 61 and the second measuring component 62 are both arranged on the test platform 2. The picking force of the swirl picking head 3 is measured by the first measuring component 61, and the pressure distribution corresponding to the effective picking position below the swirl picking head 3 is measured by the second measuring component 62.

[0042] The first measuring component 61 includes a force sensor 611, which is arranged on the test platform 2 and is specifically fixed to one side of the test platform 2 by bolts. When the test platform 2 moves to the bottom of the swirl pickup head 3, the force sensor 611 can measure the force of the swirl pickup head 3 on the test platform 2 under different air inlet pressures and heights, and then determine the picking force of the swirl pickup head 3. Specifically, the force sensor 611 is used to detect the size of the picking force during the swirl picking process, with a rated load of 10N and an accuracy of 0.002N. The picking force of the swirl pickup head 3 is measured by the force sensor 611. The measuring process is as follows: the test platform 2 moves to the bottom of the swirl pickup head 3, and the swirl pickup head 3 is moved down by adjusting the first manual Z-axis 51 until its lower surface contacts the surface of the test platform. Touch, record the first manual Z-axis 51 scale h0 at this time, set the inlet pressure P, open the air valve to allow air flow, record the force sensor 611 indication F0, adjust the first manual Z-axis 51 to make the swirl pickup head 3 move up a certain height, record the first manual Z-axis 51 scale h1 and the force sensor 611 indication F1 at this time, repeat the process to collect experimental data until the force sensor 611 indication returns to zero, and process the collected data to obtain the relationship curve between the pickup force F and the gap h between the lower surface of the pickup head and the upper surface of the chip when the inlet pressure is P, so as to determine the important performance indicators such as the stable suspension area and stable position of the chip under the inlet pressure condition, and by changing the inlet pressure P for repeated tests, the pickup force performance comparison under different inlet pressure conditions can be obtained.

[0043] The second measuring side piece includes a pressure sensor 621, which is fixedly installed at the bottom of the test platform 2. An airflow collection hole 21 is opened on the test platform 2. The size of the airflow collection hole 21 is 0.5mm, which can be used as a positioning feature. The test platform 2 moves under the drive of the horizontal displacement adjustment mechanism. When the airflow collection hole 21 on the test platform 2 moves to the bottom of the swirl pickup head 3, the pressure sensor 621 measures the pressure below the swirl pickup head 3. Specifically, the airflow collection hole 21 is used to collect the generated air pressure signal. The lower end of the airflow collection hole 21 leads the flow channel to the pressure sensor 621 through a pressure-maintaining design to achieve pressure measurement of the target position. The horizontal displacement adjustment mechanism 4 drives the test platform 2 to move the airflow collection hole 21 below the effective pickup position of the swirl pickup head 3. The range of the pressure sensor 621 is -10Kpa to 10Kpa. The measurement process is as follows: the test platform 2 moves so that the airflow collection hole 21 is located directly below the swirl pickup head 3. The swirl pickup head is adjusted by adjusting the first manual Z-axis 51. 3 moves down until its lower surface contacts the surface of the test bench, and the Z2 axis scale h0 at this time is recorded. The first manual Z axis 51 is adjusted to make the swirl pickup head 3 move up a certain height H, the inlet pressure P is set, the air valve is opened to allow air flow, and the reading p0 of the pressure sensor 621 is recorded. In the control software, the Y axis is set to be fixed, and the X axis is stepping motion with a step value of 0.05 mm. Click the software step button and record the reading pi (i=1.2.3...) of the pressure sensor 621 at the current position, that is, a data is collected every 0.05 mm until the air hole moves out of the effective pickup position of the swirl head. The collected data is imported and processed to obtain a relationship curve of the pressure p with the X-direction position distribution of the pickup head when the inlet pressure is P and the gap height is H. By changing the gap height H and the inlet pressure P for repeated testing, a comparison of radial pressure distribution under different parameter conditions can be obtained. Similarly, in the control software, the X axis is set to be fixed, and the Y axis is stepping motion. Repeating the above process can obtain a relationship curve of the pressure p with the Y-direction position distribution of the pickup head.

[0044] When the chip is actually picked up, the test chip is stuck in the loading slot 22 to be tested, and the corresponding loading slot 22 is located directly below the swirl pickup head 3 by moving the test platform 2. The swirl pickup head 3 is moved down by adjusting the first manual Z-axis 51 until the bottom surface of the swirl pickup head 3 and the upper surface of the chip reach the set value H, the air inlet pressure P is set, the air valve is opened to allow air flow, and the actual picking effect of the chip is observed. By changing the height setting value H and the air inlet pressure P, the non-contact picking effect of the pickup head under different parameter conditions can be explored.

[0045] After the chip is picked up, the chip state is detected by the oscillation detection mechanism 7. The oscillation detection mechanism 7 includes three fiber optic sensors 71. The three fiber optic sensors 71 are fixedly mounted on the test platform 2 and the three fiber optic sensors 71 surround a triangular detection area. The fiber optic sensor 71 can measure the distance between the lower surface of the chip picked up by the swirl pickup head 3 and the test platform 2, thereby reflecting the oscillation posture of the chip with a resolution of 0.25 μm. In addition, the oscillation detection mechanism 7 also includes an observation camera 72 and an XZ manual adjustment shaft 73. The XZ manual adjustment shaft 73 is fixedly connected to the rightmost side of the fixed plate in the frame body 1, and the observation is fixedly connected to the XZ manual adjustment shaft. The output end of the axis 73 is arranged horizontally, and the observation camera 72 is located on one side of the test platform 2 for photographing the chip picked up by the swirl pickup head 3. The test platform 2 moves so that the optical fiber sensor 71 is located directly below the swirl pickup head 3, and at the same time, the first manual Z axis 51 is adjusted to ensure that the picked chip is located in the field of view of the observation camera 72. The observation camera 72 can intuitively see the dynamic motion posture of the chip by adjusting the focal length and aperture, qualitatively judge the oscillation of the chip, and perform preliminary measurements in the software interface; the three optical fiber sensors 71 respectively test the distance between the three points on the lower surface of the chip and the test platform 2, quantitatively reflecting the degree of chip jitter, and the measurement accuracy can reach 10 -4 mm. In this embodiment, the chip oscillation amplitude is less than 0.01 mm under the condition of 50 Kpa inlet pressure, and non-contact picking of the target chip can be achieved.

[0046] It should be understood that expressions such as "include" and "may include" used in this application indicate the existence of the disclosed functions, operations or constituent elements, and do not limit one or more additional functions, operations and constituent elements. In this application, terms such as "include" and / or "have" may be interpreted as indicating specific characteristics, numbers, operations, constituent elements, components or combinations thereof, but may not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components or combinations thereof.

[0047] It should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0048] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0049] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0050] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A high-precision chip non-contact picking device based on swirl picking, characterized in that: It comprises a frame body (1), a test platform (2), a swirl pickup head (3), a horizontal displacement adjustment mechanism (4), a leveling mechanism (5) and a sensor measurement mechanism (6); The test platform (2) is horizontally mounted on the frame body (1) via a horizontal displacement adjustment mechanism (4) and is capable of moving in the horizontal direction; The leveling mechanism (5) comprises a first manual Z-axis (51) and a three-axis adjustment frame (52), wherein the three-axis adjustment frame (52) is mounted on the frame body (1) via the first manual Z-axis (51) and is movable in the vertical direction, and the swirl pickup head (3) is mounted on the three-axis adjustment frame (52) to achieve leveling, and the swirl pickup head (3) is located above the test platform (2); The sensing and measuring mechanism (6) comprises a first measuring component (61) for measuring the picking force of the swirl picking head (3) and a second measuring component (62) for measuring the pressure distribution below the swirl picking head (3), wherein the first measuring component (61) and the second measuring component (62) are both arranged on the test platform (2); The first measuring component (61) comprises a force sensor (611), wherein the force sensor (611) is arranged on the test platform (2), and when the test platform (2) moves to the bottom of the swirl pickup head (3), the force sensor (611) can measure the force exerted by the swirl pickup head (3) on the test platform (2) at different inlet pressures and heights, thereby determining the pickup force of the swirl pickup head (3); The second measuring component (62) comprises a pressure sensor (621), the pressure sensor (621) is fixedly mounted on the bottom of the test platform (2), an airflow collection hole (21) is provided on the test platform (2), the test platform (2) moves under the drive of the horizontal displacement adjustment mechanism (4), and when the airflow collection hole (21) on the test platform (2) moves to the bottom of the swirl pickup head (3), the pressure sensor (621) measures the pressure below the swirl pickup head (3); The picking device also includes an oscillation detection mechanism (7) for detecting the movement posture of the chip when the swirl picking head (3) picks up the chip; The oscillation detection mechanism (7) comprises at least three optical fiber sensors (71), the three optical fiber sensors (71) are all arranged on the test platform (2) and surround a triangular detection area, and the optical fiber sensors (71) are used to measure the distance between the lower surface of the chip picked up by the swirl pickup head (3) and the test platform (2).

2. A high-precision chip non-contact pickup device based on swirl pickup as claimed in claim 1, characterized in that: The horizontal displacement adjustment mechanism (4) comprises an XY-axis electric shifting stage (41), the XY-axis electric shifting stage (41) is fixedly connected to the frame body (1), and the test platform (2) is fixedly connected to the output end of the XY-axis electric shifting stage (41) and is arranged horizontally.

3. A high-precision chip non-contact picking device based on swirl picking as claimed in claim 1, characterized in that: The oscillation detection mechanism (7) further comprises an observation camera (72) and an XZ manual adjustment shaft (73), wherein the XZ manual adjustment shaft (73) is fixedly connected to the frame body (1), the camera (72) is fixedly connected to the output end of the XZ manual adjustment shaft (73) and is arranged horizontally, and the observation camera (72) is located on one side of the test platform (2) for photographing the chip picked up by the swirl pickup head (3).

4. A high-precision chip non-contact pickup device based on swirl pickup as claimed in claim 1, characterized in that: The test platform (2) is provided with a plurality of loading slots (22) for placing chips, and the opening directions of the plurality of loading slots (22) are different.

5. The high-precision chip non-contact picking device based on swirl picking as claimed in claim 1, characterized in that: An integrally formed mounting rod (53) is provided at the bottom of the three-axis adjustment frame (52), and the swirl pickup head (3) is detachably connected to the mounting rod (53).

6. A high-precision chip non-contact pickup device based on swirl pickup as claimed in claim 1, characterized in that: The picking device also includes a positioning camera (81) arranged on the frame body (1); the positioning camera (81) is located above the test platform (2) and its shooting window is vertically downward.

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