Display panel and preparation method thereof

Abstract

A display panel and a preparation method thereof, wherein the preparation method of the display panel comprises: providing a substrate comprising a first surface and a second surface opposite to each other, the first surface comprising a first region and a second region, the first region being formed with a first conductive layer, and the second region being formed with a boundary layer; forming a micro-nano structure on a surface of the boundary layer; forming an initial conductive layer on the first surface by using an evaporation process, the initial conductive layer comprising a second conductive layer covering the first conductive layer and a third conductive layer at least partially covering the boundary layer; and removing the third conductive layer. By using the technical solution of the present disclosure, the evaporation metal on the surface of the boundary layer can be effectively removed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED, in particular to a display panel and a preparation method thereof. BACKGROUND

[0002] Micro-LED (Micro Light Emitting Diode, also known as micro LED), also known as mLED or μLED, is an electroluminescent device composed of an array of micron-scale semiconductor light-emitting units, which can convert electrical energy into light energy. This display technology is based on the miniaturization and matrix of micro light-emitting diodes (LEDs), with a single light-emitting unit size of less than 50 μm and a high density of integration on a chip. Each Micro-LED pixel is composed of red, green and blue sub-pixels, each of which is independently controlled, so that the brightness, color and contrast of the display can be accurately controlled.

[0003] In the production process of the display panel, a plurality of Micro LEDs need to be installed on the substrate of the display panel. In this process, the preparation process of the Bump (metal protrusion) used for bonding with the Micro LED is a crucial link. At present, the mainstream Bump preparation process includes PVD (Physical Vapor Deposition, physical vapor deposition), electroplating and electroplating. Among them, PVD evaporation is the current mainstream choice due to its advantages of no need for complex pretreatment, good film quality and good film thickness uniformity. However, as the size of the substrate increases, the area of the upper surface of the boundary layer also increases, which brings challenges to the subsequent process of stripping the metal thin film. In the stripping process, it may not be able to be stripped normally, thereby affecting the quality and performance of the display panel.

[0004] In order to solve this problem, the industry currently mainly uses Mask (mask) to shield, but this method has obvious disadvantages. Large-size Mask is expensive, increasing production costs; moreover, Mask must be accurately matched with product Panel (display panel part of display screen or touch screen), which limits its universality, making the production process more complex and tedious. Therefore, although Mask can solve the stripping problem to some extent, it also brings the risk of increased evaporation cost and decreased product competitiveness. Therefore, there is an urgent need for a method that is more convenient to remove the metal thin film evaporated on the surface of the boundary layer. SUMMARY

[0005] The technical problem solved by the present application is how to effectively remove the evaporated metal on the surface of the boundary layer.

[0006] To solve the above technical problems, the display panel provided by the embodiment of the present application comprises: a substrate, the substrate comprises a first surface and a second surface opposite to each other, the first surface comprises a first region and a second region; a first conductive layer is located in the first region; a boundary layer is located in the second region; a second conductive layer is located on the side of the first conductive layer away from the substrate, and the second conductive layer is electrically connected with the corresponding first conductive layer; the boundary layer comprises a micro-nano structure, and the micro-nano structure is located at least on the surface of the side of the boundary layer away from the substrate.

[0007] Optionally, the thickness of the boundary layer is greater than the sum of the thicknesses of the first conductive layer and the second conductive layer.

[0008] Optionally, the thickness of the boundary layer is 1.5-2 times the thickness of the second conductive layer.

[0009] Optionally, the cross-sectional shape of the boundary layer is an inverted trapezoid or a T shape.

[0010] Optionally, the projection of the boundary layer on the first surface and the projection of the first conductive layer on the first surface partially overlap.

[0011] Optionally, the included angle between the side wall of the boundary layer and the surface of the boundary layer away from the first surface is an acute angle.

[0012] Optionally, the micro-nano structure comprises a plurality of protruding portions, and the plurality of protruding portions extend from the boundary layer in a direction away from the substrate.

[0013] Optionally, the cross-sectional shape of the protruding portion is selected from a rectangle, an inverted trapezoid and a triangle.

[0014] Optionally, the cross-sectional shape of at least one of the plurality of protruding portions is different from the cross-sectional shape of the other protruding portions.

[0015] Optionally, the protruding height of the protruding portion is less than 1 micrometer.

[0016] Optionally, the period width of the micro-nano structure is taken from [10, 2500] nanometers.

[0017] Optionally, the aspect ratio of the micro-nano structure is greater than 2.

[0018] Optionally, the plurality of protruding portions are arranged in a rectangular array.

[0019] Optionally, the distance between at least one pair of adjacent protruding portions in the plurality of protruding portions is not equal.

[0020] Optionally, the maximum width of the cross section of the protruding portion is greater than 20 nanometers.

[0021] Optionally, the micro-nano structure has a depth-to-width ratio greater than 3.

[0022] Optionally, a non-zero gap exists between any adjacent protrusions, the non-zero gap containing metal particles, the metal particles in different non-zero gaps being in an isolated state under the isolation of surrounding protrusions.

[0023] Optionally, the display panel further comprises: a light shielding layer covering the boundary layer and the micro-nano structure.

[0024] Optionally, the second conductive layer comprises a plurality of metal protrusions arranged in an array, adjacent metal protrusions being separated by a boundary layer, the sidewalls of the metal protrusions at different positions and the first surface forming different angles.

[0025] To solve the above technical problems, the embodiment of the present application further provides a preparation method of a display panel, the method comprising: providing a substrate, the substrate comprising opposite first and second surfaces, the first surface comprising a first region and a second region, the first region being formed with a first conductive layer, and the second region being formed with a boundary layer; forming a micro-nano structure on the surface of the boundary layer; forming an initial conductive layer on the first surface by using an evaporation process, the initial conductive layer comprising a second conductive layer covering the first conductive layer and a third conductive layer at least partially covering the boundary layer; and removing the third conductive layer.

[0026] Optionally, the removing of the third conductive layer comprises: pasting the third conductive layer with a tear-off tape; and tearing off the tear-off tape.

[0027] Optionally, the method further comprises: covering the boundary layer and the surface of the micro-nano structure with a light shielding material to form the light shielding layer.

[0028] Optionally, the micro-nano structure comprises a plurality of protrusions, the number of the plurality of protrusions after the removal of the third conductive layer being less than or equal to the number of the plurality of protrusions before the removal of the third conductive layer.

[0029] Compared with the prior art, the technical scheme of the embodiment of the present application has the following beneficial effects:

[0030] The embodiment of the present application provides a display panel, comprising: a substrate, the substrate comprising opposite first and second surfaces, the first surface comprising a first region and a second region; a first conductive layer located in the first region; a boundary layer located in the second region; a second conductive layer located on the side of the first conductive layer away from the substrate, the second conductive layer being electrically connected with the corresponding first conductive layer; and the boundary layer comprising a micro-nano structure, the micro-nano structure being located at least on the surface of the side of the boundary layer away from the substrate.

[0031] By forming the micro-nano structure on the surface of the defining layer, the metal film (for example, the third conductive layer) evaporated on the upper surface of the defining layer can be removed more easily, and complex chemical treatment or mechanical operation is avoided. This not only simplifies the preparation process, reduces the production cost, but also improves the production efficiency. At the same time, due to the accuracy of the micro-nano structure, the damage to other parts of the device during the gold tearing process is also greatly reduced, further improving the quality and reliability of the display panel.

[0032] Further, the thickness of the defining layer is greater than the sum of the thicknesses of the first conductive layer and the second conductive layer. This design forms a height difference between the defining layer and the first conductive layer, and the second conductive layer and the third conductive layer are naturally disconnected during the evaporation process. Thus, the adhesion between the second conductive layer and the third conductive layer during the removal of the third conductive layer can be avoided, and the removal effect is affected.

[0033] The embodiment of the present application also provides a display panel, comprising: a substrate, the substrate comprising opposite first and second surfaces, the first surface comprising a first region and a second region; a first conductive layer located in the first region; a defining layer located in the second region; a second conductive layer located on the side of the first conductive layer away from the substrate, the second conductive layer being electrically connected to the corresponding first conductive layer; the defining layer comprising a micro-nano structure, the micro-nano structure being located at least on the surface of the side of the defining layer away from the substrate.

[0034] By forming the micro-nano structure on the surface of the defining layer, the metal film (for example, the third conductive layer) evaporated on the upper surface of the defining layer can be removed more easily, and complex chemical treatment or mechanical operation is avoided. This not only simplifies the preparation process, reduces the production cost, but also improves the production efficiency. At the same time, due to the accuracy of the micro-nano structure, the damage to other parts of the device during the gold tearing process is also greatly reduced, further improving the quality and reliability of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 is a flow chart of a display panel preparation method according to an embodiment of the present application;

[0036] Figures 2 to 16 is a device cross-sectional structure schematic diagram corresponding to each step in the preparation process of the display panel according to an embodiment of the present application. DETAILED DESCRIPTION

[0037] As described in the background, in the existing display panel preparation process, due to the increase in the size of the substrate, the area of the upper surface of the defining layer also increases, which brings challenges to the subsequent metal film peeling process. In the peeling process, it may not be able to be peeled off normally, thereby affecting the quality and performance of the display panel.

[0038] To solve the above technical problems, the embodiment of the present application provides a display panel and a preparation method thereof.

[0039] In order to make the above objectives, characteristics and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings.

[0040] Figure 1 is a flow chart of a preparation method of a display panel according to an embodiment of the present application.

[0041] Reference Figure 1 The preparation method of the display panel can include the following steps:

[0042] Step S11, providing a substrate, the substrate includes opposite first and second surfaces, the first surface includes a first region and a second region, the first region is formed with a first conductive layer, and the second region is formed with a boundary layer;

[0043] Step S12, forming a micro-nano structure on the surface of the boundary layer;

[0044] Step S13, forming an initial conductive layer on the first surface by using an evaporation process, the initial conductive layer includes a second conductive layer covering the first conductive layer and a third conductive layer covering the boundary layer;

[0045] Step S14, removing the third conductive layer.

[0046] As described above, after removing the third conductive layer, the second conductive layers located in different first regions are insulated from each other, which can effectively avoid damage to the display panel caused by short circuit and the like due to electrical connection between adjacent second conductive layers.

[0047] Next, the embodiments of the present application will be described exemplarily in combination with the specific structure of the display panel and the preparation method.

[0048] Reference Figures 2 to 8The display panel prepared by the preparation method of the display panel comprises: a substrate 1, the substrate 1 comprises opposite first and second surfaces 11 and 12, the first surface 11 comprises a first region 111 and a second region 112; a first conductive layer 2 is located in the first region 111; a boundary layer 3 is located in the second region 112; a second conductive layer 4 is located on the side of the first conductive layer 2 away from the substrate 1, and the second conductive layer 4 is electrically connected with the corresponding first conductive layer 2; the boundary layer 3 comprises a micro-nano structure 5, and the micro-nano structure 5 is located at least on the surface of the boundary layer 3 away from the substrate 1.

[0049] For example, the second conductive layer 4 and the corresponding first conductive layer 2 can be electrically connected between the part of the second conductive layer 4 and the part of the first conductive layer 2 located on the same first region, and the part of the second conductive layer 4 and the part of the first conductive layer 2 located on different first regions are insulated from each other.

[0050] Specifically, Figure 2 A top view of the substrate 1 is shown in FIG. 1. The substrate 1 can be, for example, a base material structure used in the Micro LED (Micro Light Emitting Diode, also known as micro LED) bonding process.

[0051] Referring to Figure 2 The substrate 1 comprises opposite first and second surfaces 11 and 12, and the first surface 11 comprises a first region 111 and a second region 112. For ease of description, the direction in which the second surface 12 points to the first surface 11 is referred to as the first direction D1.

[0052] In some embodiments, a plurality of first regions 111 can be provided on the first surface 11. The plurality of first regions 111 are arranged according to the subsequent use and processing technology of the display panel. For example, the plurality of first regions 111 are arranged in six as an array group, and a plurality of array groups are uniformly distributed on the first surface 11.

[0053] Further, the second region 112 can be, for example, a part of the first surface 11 other than the first region 111. In other words, on the first surface 11, the second region 112 surrounds any one of the first regions 111.

[0054] Further, the material of the substrate 1 can be selected from glass, ceramic, metal, etc. Due to the different optical, thermal and mechanical properties of these materials, they can be selected according to specific application scenarios and needs in practice. For example, the glass substrate 1 has good optical transparency and stability, and is suitable for display applications that require high definition and high stability; while the ceramic substrate 1 has high thermal stability and chemical stability, and is suitable for applications in high temperature or harsh environments.

[0055] It should be understood that, Figure 2 The number and shape of the first regions 111 and the distribution on the first face 11 are only exemplary and do not constitute any limitation on the scope of protection of the present application. In actual production and application of the embodiments of the present application, the number and shape of the first regions 111 can be set according to actual needs.

[0056] Further, the display panel further comprises a first conductive layer 2 and a boundary layer 3. The first conductive layer 2 is located in the first region 111, and the boundary layer 3 is located in the second region 112. Further, the boundary layer 3 can function to isolate the first conductive layer 2 in different first regions 111, so that the first conductive layer 2 in different first regions 111 are insulated from each other on the first face 11.

[0057] Further, the cross-sectional shape of the boundary layer 3 is an inverted trapezoid or a T shape.

[0058] Figure 3 is Figure 2 The cross-sectional view of the region B along the A-A view in Figure 4 , Figure 6 , Figures 8 to 16 The view in Figure 3 is consistent with the view in

[0059] Referring to Figure 3 , the cross-sectional shape of the boundary layer 3 is an inverted trapezoid. In other words, the area of the surface of the boundary layer 3 facing the first direction D1 can be greater than the area of the surface of the boundary layer 3 in contact with the second region 112.

[0060] In some embodiments, the projection of the boundary layer 3 on the first face 11 and the projection of the first conductive layer 2 on the first face 11 partially overlap. Thus, when step S12 is subsequently performed, the initial conductive layer 10 formed by evaporation can naturally break between the boundary layer 3 and the first conductive layer 2.

[0061] In a variant, the cross-sectional shape of the boundary layer 3 can also be, for example, a T shape.

[0062] Further, the angle between the side wall of the boundary layer 3 and the surface of the boundary layer 3 facing away from the first face 11 is an acute angle. Thus, the initial conductive layer 10 can be prevented from being formed on the side wall of the boundary layer 3, so that the second conductive layer 4 and the third conductive layer 7 are prevented from being adhered to each other and difficult to separate.

[0063] Further, after step S12 is performed, the boundary layer 3 is formed with a micro-nano structure 5, as shown in Figure 4The micro-nano structure 5 is located at least on the surface of the boundary layer 3 away from the substrate 1. That is, the micro-nano structure 5 can be arranged on the surface of the boundary layer 3 facing the first direction D1.

[0064] In some embodiments, the micro-nano structure 5 can be prepared by etching, lithography, or other processing of materials through photolithography technology, electron beam exposure technology, etc.

[0065] Further, with reference to Figure 4 , the micro-nano structure 5 includes a plurality of protruding portions 51 extending from the boundary layer 3 in a direction away from the substrate 1. The direction away from the substrate 1 can be, for example, the first direction D1.

[0066] Further, the cross-sectional shape of the protruding portion 51 can be selected from a rectangle, an inverted trapezoid, and a triangle.

[0067] In some embodiments, the cross-sectional shape of at least one of the protruding portions 51 is different from that of the other protruding portions 51. Thus, protruding portions 51 with different cross-sectional shapes can be arranged on the surface of the boundary layer 3 facing the first direction D1 according to actual needs. For example, the cross-sectional shape of the protruding portion 51 close to the first conductive layer 2 can be, for example, a triangle. Since the protruding portion 51 with a triangular cross-sectional shape has a sharp end, after step S13 is performed, the portion of the initial conductive layer 10 located at the sharp end is relatively thin or even naturally broken, which is more conducive to subsequent removal of the third conductive layer 7 using a gold tearing tape.

[0068] It should be noted that in the embodiments of the present application, the top view shape (i.e., the cross-sectional shape) of the protruding portion 51 is not limited.

[0069] In some embodiments, with reference to Figures 4 to 8 , the cross-sectional shape of the protruding portion 51 can be, for example, a rectangle. Compared with other shapes, the protruding portion 51 with a rectangular cross-sectional shape is easier to process, which is conducive to saving production costs.

[0070] In some embodiments, the protruding height of the protruding portion 51 along the first direction D1 is less than 1 micrometer.

[0071] In some embodiments, the period width of the micro-nano structure 5 is taken from [10, 2500] nanometers. The period width can be, for example, the distance between the same parts (e.g., geometric centers) of adjacent protruding portions 51.

[0072] In some embodiments, the aspect ratio of the micro-nano structure 5 is greater than 2. The aspect ratio can be, for example, the ratio of the depth to the width of the gap between two adjacent protruding portions 51.

[0073] From the above, in combination Figure 6 , the initial conductive layer 10 is formed on one side of the micro-nano structure 5 towards the first direction D1, which will be slightly deformed due to the micro-nano structure 5. Specifically, the part of the initial conductive layer 10 above the protruding part 51 protrudes above the part of the initial conductive layer 10 above the gap between the protruding parts 51, thereby increasing the actual area of the third conductive layer 7 away from the surface of the substrate 1. When the third conductive layer 7 is pasted with the tear tape, the tear tape itself also has flexibility and can be deformed to adapt to the third conductive layer 7. Thus, the contact area between the tear tape and the third conductive layer 7 is greater than the contact area between the micro-nano structure 5 and the third conductive layer 7, and when the tear tape is pulled, the third conductive layer 7 can be easily removed.

[0074] Further, referring to Figure 5 , the plurality of protruding parts 51 are arranged in a rectangular array.

[0075] In a variant, the arrangement of the plurality of protruding parts 51 can also be designed according to the actual production needs of the display panel.

[0076] In some embodiments, the distance between at least one pair of adjacent protruding parts 51 in the plurality of protruding parts 51 is not equal. That is, the density of the protruding parts 51 at different positions of the surface of the boundary layer 3 towards the first direction D1 can be different. For example, the density of the protruding parts 51 close to the first conductive layer 2 can be greater than the density of the protruding parts 51 away from the first conductive layer 2. Thus, when the third conductive layer 7 is removed, the tear tape can easily pull up the edge of the third conductive layer 7.

[0077] In a preferred embodiment, the maximum width of the cross-section of the protruding part 51 is greater than 20 nanometers. Further, the aspect ratio of the micro-nano structure 5 is greater than 3. Thus, after step S13 is performed, the third conductive layer 7 can form a deformation as shown in Figure 6 .

[0078] It is worth noting that Figure 6 only for exemplary display, the actual cross-sectional shape of the third conductive layer 7 is not strictly consistent with Figure 6 .

[0079] Further, the top view of the device after step S13 is performed is as shown in Figure 7 . Referring to Figure 7 , after the evaporation process, the initial conductive layer 10 is formed on the workpiece, which includes the second conductive layer 4 covering the first conductive layer 2 and the third conductive layer 7 covering the boundary layer 3.

[0080] Further, step S14 is performed to remove the third conductive layer 7 to form Figure 8The device structure shown.

[0081] With reference to the foregoing Figure 4 , Figure 6 , Figures 8 to 16 The thickness of the boundary layer 3 is greater than the sum of the thicknesses of the first conductive layer 2 and the second conductive layer 4.

[0082] In some embodiments, the thickness of the boundary layer 3 is 1.5-2 times the thickness of the second conductive layer 4. Thus, when the initial conductive layer 10 is formed, the initial conductive layer 10 is naturally broken at the junction of the boundary layer 3 and the first conductive layer 2 due to the height difference between the boundary layer 3 and the first conductive layer 2. That is, the second conductive layer 4 and the third conductive layer 7 are naturally separated due to the presence of the height difference, avoiding adhesion with the second conductive layer 4 when the third conductive layer 7 is subsequently removed.

[0083] In some embodiments, the angle between the side wall of the boundary layer 3 and the surface of the boundary layer 3 facing away from the first surface 11 is an acute angle. Thus, it can be avoided that the formation of a metal film on the side wall of the boundary layer 3 when step S13 is performed causes difficulty in separating the second conductive layer 4 and the third conductive layer 7.

[0084] In some embodiments, with reference to Figure 9 The cross-sectional shape of the protrusion 51 is an inverted trapezoid. Further, there is a non-zero gap between any adjacent protrusions 51.

[0085] Further, when the initial conductive layer 10 is formed by evaporation, part of the evaporated metal particles 8 will fall into the non-zero gap. Further, the metal particles 8 located in different non-zero gaps are in an isolated state under the isolation of the surrounding protrusions 51. The isolated state means that the metal particles 8 located in different non-zero gaps are insulated from each other and from the second conductive layer 4.

[0086] Thus, with reference to Figure 10 The third conductive layer 7 formed on the end surface of the boundary layer 3 facing the first direction D1 cannot form a complete film, which is more convenient for subsequent removal by tearing the gold tape. At the same time, even if part of the metal particles 8 falling into the non-zero gap is retained, it will not cause the occurrence of faults such as short circuit.

[0087] In the above embodiments, after step S14 is completed, the cross-sectional view of the device after the third conductive layer 7 formed on the end surface of the boundary layer 3 facing the first direction D1 is removed by the gold tape can refer to Figure 11 .

[0088] In some embodiments, with reference to Figure 12The display panel further comprises a light shielding layer 6 covering the boundary layer 3 and the micro-nano structure 5. That is, after step S14 is performed, a light shielding material can be further coated on the surface of the boundary layer 3 and the micro-nano structure 5 to form the light shielding layer 6. In this way, the residual metal particles 8 can be prevented from reflecting light and affecting the display effect of the display panel. In addition, the light shielding material can further play an insulating effect, encapsulating the metal particles 8 remaining in the non-zero gap to prevent the metal particles 8 from falling off during subsequent transportation and use, and causing short circuit and other faults caused by the migration of the metal particles 8.

[0089] In some embodiments, with reference to Figure 13 , the cross-sectional shape of the protrusion 51 is triangular. That is, the overall topography of the protrusion 51 is conical or pyramidal.

[0090] Further, the structural schematic diagram of the device after step S13 is performed can refer to Figure 14 .

[0091] With reference to Figure 14 , the protrusion 51 with a triangular cross-sectional shape can make the third conductive layer 7 located at the tip of the triangle weak or even naturally broken. The continuity of the third conductive layer 7 film can be effectively destroyed, which facilitates the operation and execution of subsequent step S14.

[0092] In some embodiments, the number of the plurality of protrusions 51 after the third conductive layer 7 is removed is less than or equal to the number of the plurality of protrusions 51 before the third conductive layer 7 is removed.

[0093] For example, in some scenarios, the device structure after the third conductive layer 7 is removed by tearing the gold tape can refer to Figure 15 . Figure 15 The number of protrusions 51 in Figure 13 and Figure 14 is consistent with the number of protrusions 51 in .

[0094] In other scenarios, when the third conductive layer 7 is removed by tearing the gold tape, part of the protrusions 51 closely adhered to the third conductive layer 7 can be removed together. The device structure after the third conductive layer 7 is removed can refer to Figure 16 . Figure 16 The number of protrusions 51 in Figure 13 and Figure 14 is less than the number of protrusions 51 in

[0095] Further, in some embodiments, the second conductive layer 4 comprises a plurality of metal protrusions arranged in an array, adjacent metal protrusions are separated by the defining layer 3, and the included angle between the sidewall of the metal protrusion at different positions and the first surface 11 is different. When step S13 is performed, because the distances between each first conductive layer 2 and the evaporation center are different, the morphology of the metal protrusion formed above the first conductive layer 2 after evaporation is also different. For example, the included angle between the sidewall of the metal protrusion closer to the evaporation center and the first surface 11 is close to 90°. And for a single metal protrusion, the included angle between the sidewall closer to the evaporation center and the first surface 11 is greater than the included angle of the sidewall away from the evaporation center. This is due to the characteristics of the evaporation process itself.

[0096] Therefore, by forming the micro-nano structure 5 on the surface of the defining layer 3, the metal film (for example, the third conductive layer 7) evaporated on the upper surface of the defining layer 3 can be removed more easily, and complex chemical treatment or mechanical operation is avoided. This not only simplifies the preparation process, reduces the production cost, but also improves the production efficiency. At the same time, due to the accuracy of the micro-nano structure 5, the damage to other parts of the device during the tearing gold process is also greatly reduced, further improving the quality and reliability of the display panel.

[0097] Further, the thickness of the defining layer 3 is greater than the sum of the thicknesses of the first conductive layer 2 and the second conductive layer 4. This design forms a height difference between the defining layer 3 and the first conductive layer 2, and the second conductive layer 4 and the third conductive layer 7 are naturally disconnected during the evaporation process. Thus, it can avoid the adhesion between the second conductive layer 4 and the third conductive layer 7 when removing the third conductive layer 7, which affects the removal effect.

[0098] It should be understood that the term "and / or" herein merely describes an associated relationship of associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " herein represents an "or" relationship between the front and rear associated objects. As used herein, unless otherwise explicitly stated, the term "or" encompasses all possible combinations, unless not feasible. For example, if it is stated that a component can include A or B, the component can include A, or B, or A and B, unless otherwise explicitly stated or not feasible. As a second example, if it is stated that a component can include A, B, or C, the component can include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C, unless otherwise explicitly stated or not feasible.

[0099] "Plurality" appearing in the embodiments of the present application means two or more.

[0100] The relational terms herein, such as first, second, and the like, are used solely to distinguish one entity or action from another, without necessarily requiring or implying any actual relationship or order between such entities or actions. Moreover, the words "comprises," "has," and "includes" and other similar forms are intended to be equivalent in meaning and be open-ended, such that any item or list of items following any form of these words is not meant to be an exhaustive listing of such item or items, or meant to be limited to only the items specifically listed. In the drawings and specification, there have been disclosed exemplary embodiments. However, it is understood that many variations and modifications can be made to these embodiments. Accordingly, although specific terms are employed, they are used in a generic and descriptive sense only and not for purposes of limitation, the scope of the embodiments being set forth in the following claims.

[0101] Although the present application has been disclosed in its currently best embodiment, it will be appreciated that various modifications can be made to this application without departing from the spirit and scope of the application as set forth in the claims.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate comprising a first surface and a second surface opposite to each other, the first surface comprising a first region and a second region; a first conductive layer on the first region; a boundary layer on the second region; a second conductive layer on a side of the first conductive layer away from the substrate, the second conductive layer being electrically connected to the corresponding first conductive layer; the boundary layer comprises a micro-nano structure on a surface of the boundary layer away from the substrate; the micro-nano structure comprises a plurality of protrusions extending from the boundary layer away from the substrate; a non-zero gap exists between any adjacent protrusions, the non-zero gap containing metal particles, the metal particles in different non-zero gaps being in an isolated state under the isolation of surrounding protrusions; the isolated state means that the metal particles in different non-zero gaps are insulated from each other and from the second conductive layer.

2. The display panel of claim 1, wherein, The thickness of the boundary layer is greater than the sum of the thicknesses of the first conductive layer and the second conductive layer.

3. The display panel of claim 1, wherein, The thickness of the boundary layer is 1.5-2 times the thickness of the second conductive layer.

4. The display panel of claim 1, wherein, The cross-sectional shape of the boundary layer is an inverted trapezoid or a T shape.

5. The display panel of claim 4, wherein, The projection of the boundary layer on the first surface and the projection of the first conductive layer on the first surface partially overlap.

6. The display panel of claim 1, wherein, The included angle between the side wall of the boundary layer and the surface of the boundary layer away from the first surface is an acute angle.

7. The display panel of claim 1, wherein, The cross-sectional shape of the protrusion is selected from the group consisting of a rectangle, an inverted trapezoid, and a triangle.

8. The display panel of claim 1, wherein, The cross-sectional shape of at least one protrusion in the plurality of protrusions is different from the cross-sectional shape of other protrusions.

9. The display panel of claim 1, wherein, The protrusion height of the protrusion is less than 1 micrometer; and / or, The period width of the micro-nano structure is taken from [10, 2500] nanometers; and / or, The aspect ratio of the micro-nano structure is greater than 2; and / or, The plurality of protrusions are arranged in a rectangular array; and / or, The distance between at least one pair of adjacent protrusions in the plurality of protrusions is not equal.

10. The display panel of claim 9, wherein, The maximum width of the cross-section of the protrusion is greater than 20 nanometers, and / or the aspect ratio of the micro-nano structure is greater than 3.

11. The display panel of claim 1, wherein, Further comprising: a light shielding layer covering the boundary layer and the micro-nano structure.

12. The display panel of claim 1, wherein, The second conductive layer comprises a plurality of metal protrusions arranged in an array, adjacent metal protrusions being separated by the boundary layer, the included angle between the side wall of the metal protrusion at different positions and the first surface being different.

13. A method for manufacturing a display panel, characterized by, A method for manufacturing the display panel of any one of claims 1-12, the method comprising: providing a substrate comprising a first surface and a second surface opposite to each other, the first surface comprising a first region and a second region, the first region being formed with a first conductive layer, and the second region being formed with a boundary layer; forming a micro-nano structure on the surface of the boundary layer; forming an initial conductive layer on the first surface by a vapor deposition process, the initial conductive layer comprising a second conductive layer covering the first conductive layer and a third conductive layer at least partially covering the boundary layer; removing the third conductive layer.

14. The method of claim 13, wherein, The removing of the third conductive layer comprises: applying a gold tearing tape to the third conductive layer; tearing and pulling the gold tearing tape.

15. The method of claim 13, wherein, Further comprising: An opaque layer is formed by covering the defined layer and the micro-nano structure surface with an opaque material.

16. The method of claim 13, wherein, The micro-nano structure includes a plurality of protrusions, and after the third conductive layer is removed, the number of the plurality of protrusions is less than or equal to the number of the plurality of protrusions before the third conductive layer is removed.

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