Vertical grinding device

Abstract

The application relates to the grinding technical field and provides a vertical grinding device. The vertical grinding device comprises a supporting base and a headstock mechanism, a tailstock mechanism and a grinding mechanism which are installed on the supporting base. The tailstock mechanism is arranged above the headstock mechanism, the tailstock mechanism can move along the vertical direction relative to the headstock mechanism, and the tailstock mechanism has a first position and a second position which are arranged at intervals along the vertical direction relative to the headstock mechanism. The grinding mechanism comprises a first rotary table and a first grinding tool group and a second grinding tool group which are movably connected to the first rotary table. The first grinding tool group and the second grinding tool group are arranged at an angle, and the first grinding tool group and the second grinding tool group can be selectively rotated to the headstock mechanism under the action of the first rotary table. The vertical grinding device provided by the application can meet different grinding requirements, and the equipment does not need to be replaced according to different grinding requirements in the whole grinding process of the crystal, so that the grinding efficiency and machining precision are improved.

Description

Technical Field

[0001] This application relates to the field of grinding technology, and in particular to a vertical grinding apparatus. Background Technology

[0002] In crystal material processing, crystal rods need to be cut into multiple cylindrical crystal blocks, which are then ground to form the wafers required for subsequent production. During the crystal block grinding process, the end faces of the crystal need to be ground to change the crystal thickness, and the circumferential surfaces of the crystal need to be ground to change the crystal diameter, thereby achieving the required wafer size.

[0003] When performing end face grinding, the end face of the crystal needs to be exposed; when performing circumferential surface grinding, the circumferential surface of the crystal needs to be exposed. Therefore, different grinding methods require different crystal fixing methods, necessitating the use of different grinding equipment to meet the corresponding clamping and fixing requirements when grinding different positions. However, changing equipment requires repositioning and re-fixing, and assembly errors exist between different equipment, which not only easily compromises machining accuracy but also reduces machining efficiency. Summary of the Invention

[0004] Therefore, it is necessary to provide a vertical grinding device that can meet different grinding needs, and eliminate the need to change equipment according to different grinding needs during the entire crystal grinding process, thereby improving grinding efficiency and processing accuracy.

[0005] A vertical grinding apparatus includes a support base and a headstock mechanism, a tailstock mechanism, and a grinding mechanism mounted on the support base. The tailstock mechanism is positioned above the headstock mechanism and is vertically movable relative to the headstock mechanism. The tailstock mechanism has a first position and a second position arranged vertically at intervals relative to the headstock mechanism. The grinding mechanism includes a first rotary table and a first and a second grinding tool group movably connected to the first rotary table. The first and second grinding tool groups are angled together, and one of them can rotate to the headstock mechanism under the action of the first rotary table. In the first position, the tailstock mechanism is close to the headstock mechanism and is used to clamp the two ends of a workpiece in the vertical direction. The first grinding tool group rotates to the headstock mechanism and is used to grind the circumferential surface of the workpiece. In the second position, the tailstock mechanism is far from the headstock mechanism. The headstock mechanism is used to fix one end of the workpiece in the vertical direction, and the second grinding tool group rotates to the headstock mechanism and is used to grind the other end of the workpiece.

[0006] Understandably, the support base is primarily designed to integrate the headstock mechanism, tailstock mechanism, and grinding mechanism. Based on this, the vertical movement of the tailstock mechanism relative to the headstock mechanism allows for changing their positions. Furthermore, the headstock mechanism not only works with the tailstock mechanism to clamp and fix the crystal at both ends but can also fix the crystal independently. Simultaneously, the first and second grinding tool groups can be adjusted relative to the headstock mechanism by the first rotary table, allowing for adjustment of the corresponding grinding tool group according to different fixing methods, thus satisfying both end-face and circumferential surface grinding of the crystal. In this way, it is possible to adapt to the corresponding grinding method while meeting different fixing requirements. Therefore, during the entire crystal grinding process, there is no need to change equipment according to different grinding needs, thereby reducing multiple positioning steps caused by errors between different equipment during equipment changes, improving grinding efficiency; and it also minimizes assembly errors when clamping different equipment, improving machining accuracy.

[0007] In some embodiments, the headstock mechanism includes a support platform and a first gripper group. The first gripper group is disposed around the circumferential periphery of the support platform and forms a first clamping space. At least one of the first gripper group and the support platform is movable in a vertical direction. In the first position, the support platform and the first gripper group move relative to each other so that the support platform is located outside the first clamping space, and the support platform can cooperate with the tailstock mechanism for clamping. In the second position, the support platform and the first gripper group move relative to each other so that the support platform is located within the first clamping space, and the first gripper group is used to clamp the outer circumferential surface of the workpiece.

[0008] In some embodiments, the head frame mechanism further includes a power shaft and an assembly base. The power shaft is rotatably connected to the assembly base, and one end of the power shaft along its own axial direction is connected to the support platform for driving the support platform to rotate about the axis of the power shaft. The assembly base is connected to the first gripper assembly at one end along the axial direction of the power shaft and facing the support platform.

[0009] In some embodiments, the headframe mechanism further includes a linear drive group; the linear drive group is connected to one end of the power shaft away from the support platform, and is used to drive the power shaft to move vertically relative to the assembly base, so as to drive the support platform to move synchronously; or, the headframe mechanism further includes a linear drive group connected between the assembly base and the first gripper group, and is used to drive the first gripper group to move vertically; or, the first gripper group includes a gripper assembly base, a gripper seat, and a gripper movably connected to the gripper seat, the gripper assembly base is connected to the assembly base, and the linear drive group is connected between the gripper seat and the gripper assembly base, and is used to drive the gripper seat to drive the gripper to move vertically.

[0010] In some embodiments, the vertical grinding device further includes a tailstock support frame connected to the tailstock mechanism, the tailstock support frame being mounted on the support base; the grinding mechanism and the tailstock support frame are arranged at intervals along a second direction and are both movable along the second direction; the headstock mechanism is spaced between the grinding mechanism and the tailstock support frame, and the headstock mechanism is movable along a first direction; the first direction, the second direction, and the vertical direction are arranged at angles to each other; the first grinding tool group and the second grinding tool group are both movable relative to the first rotary table along the vertical direction.

[0011] In some embodiments, the support base is configured with crystal orientation detection stations, diameter detection stations, thickness detection stations, and grinding stations arranged at intervals along a first direction; the vertical grinding device further includes a headstock conveyor rail mounted on the support base, the headstock mechanism being slidably disposed on the headstock conveyor rail and capable of moving along the length direction of the headstock conveyor rail to flow between the crystal orientation detection stations, the diameter detection stations, the thickness detection stations, and the grinding stations.

[0012] In some embodiments, the grinding mechanism further includes a third grinding tool group connected to the first rotary table, and the third grinding tool group is movable relative to the first rotary table in a vertical direction; the third grinding tool group, the first grinding tool group, and the second grinding tool group are arranged circumferentially at intervals along the first rotary table; the first grinding tool group has a first central axis, the second grinding tool group has a second central axis, and the third grinding tool group has a third central axis, the second central axis and the third central axis are substantially parallel, and both are set at an angle to the first central axis.

[0013] In some embodiments, the vertical grinding apparatus further includes a flipping mechanism mounted on the support base and used to flip the workpiece; the flipping mechanism includes a flipping bracket, a second rotary table, and a flipping gripper; the flipping bracket is mounted on the support base, the second rotary table is mounted on the flipping bracket, and the flipping gripper is connected to the second rotary table; the second rotary table has a rotation axis arranged along a first direction for driving the flipping gripper to rotate around the rotation axis.

[0014] In some embodiments, the second rotary table is movable vertically relative to the flipping bracket; and / or, the flipping gripper includes a drive rod and a first clamping arm and a second clamping arm drively connected to the drive rod, the drive rod being rotatable about its own axis to drive the first clamping arm and the second clamping arm to move toward each other or backwards.

[0015] In some embodiments, the vertical grinding apparatus further includes a detection mechanism mounted on the support base; the detection mechanism includes at least a thickness detection component, which is disposed above the headstock mechanism and spaced apart from the tailstock mechanism along a first direction, and is used to detect the thickness information of the workpiece; and / or, the detection mechanism includes at least a diameter detection component, which is located below the tailstock mechanism and disposed close to the tailstock mechanism in the first direction, and is used to detect the diameter information of the workpiece.

[0016] In some embodiments, the thickness detection component and / or the diameter detection component includes a fifth drive group, a contact structure, and a sensing structure; the contact structure is slidably connected to the fifth drive group and has a contact portion and a test portion arranged at intervals in the vertical direction; the sensing structure is connected to the fifth drive group and located on the side of the test portion opposite to the contact portion, and the sensing structure is arranged at intervals in the vertical direction relative to the test portion; wherein, the fifth drive group is used to drive the contact structure and the sensing structure to move in the vertical direction, and the sensing structure is configured to emit a sensing signal in response to the contact portion abutting against the test portion when the contact portion abuts against the workpiece at a stop. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the vertical grinding apparatus provided in this application;

[0019] Figure 2 This is a first schematic diagram of the headstock mechanism in the vertical grinding apparatus provided in this application;

[0020] Figure 3 This is a second schematic diagram of the headstock mechanism in the vertical grinding apparatus provided in this application;

[0021] Figure 4 A schematic diagram of the grinding mechanism in the vertical grinding apparatus provided in this application;

[0022] Figure 5 A schematic diagram of the tailstock mechanism in the vertical grinding apparatus provided in this application;

[0023] Figure 6 A schematic diagram of the tilting mechanism in the vertical grinding apparatus provided in this application;

[0024] Figure 7 This is a schematic diagram of the flipping gripper in the flipping mechanism provided in this application;

[0025] Figure 8 This is a first partial schematic diagram of the thickness detection component in the vertical grinding apparatus provided in this application;

[0026] Figure 9 This is a second partial schematic diagram of the thickness detection component in the vertical grinding apparatus provided in this application;

[0027] Figure 10 A schematic diagram of the tailstock mechanism and diameter detection component in the vertical grinding apparatus provided in this application;

[0028] Figure 11 A schematic diagram of a pre-grinding diameter detection component provided in an embodiment of this application;

[0029] Figure 12 This is a schematic diagram of a grinding diameter detection component provided in one embodiment of this application.

[0030] Reference numerals: 10, Support base; 20, Headstock mechanism; 21, Support platform; 22, First gripper assembly; 23, Drive shaft; 24, Assembly base; 25, Corner platform; 211, Groove structure; 221, Gripper; 222, Gripper seat; 223, Gripper assembly seat; 251, Fixed support seat; 252, Movable support seat; 2511, Arc-shaped slide rail; 30, Tailstock mechanism; 31, Pressure head; 32, Pressure head support seat; 33, Pressure head driver; 34, Tailstock linear driver; 40. Grinding mechanism; 41. First grinding assembly; 42. Second grinding assembly; 43. First rotary table; 44. Third grinding assembly; 45. First lifting module; 51. Tailstock support frame; 52. Headstock conveyor rail; 53. First linear drive mechanism; 54. Second linear drive mechanism; 60. Tilting mechanism; 61. Tilting bracket; 62. Second rotary table; 63. Tilting gripper; 64. Support plate; 65. Second lifting module; 631. Transmission rod; 632. First clamping arm; 633. Second clamping arm Arm; 634, Supporting substrate; 635, First nut; 636, Second nut; 6311, First helical segment; 6312, Second helical segment; 70, Detection mechanism; 71, Crystal orientation instrument; 72, Thickness detection assembly; 73, Diameter detection assembly; 73a, Diameter detection assembly before grinding; 73b, Diameter detection assembly after grinding; 74, Detection mounting base; 75, Thickness support frame; 701, Fifth drive group; 702, Contact structure; 703, Sensing structure; 704, Limiting assembly; 7 05. First mounting bracket; 751. Column; 752. Crossbeam; 753. First protective shell; 721. Contact plate; 724. Thickness power source; 731. Contact roller; 732. Roller frame; 733. First diameter power source; 734. Second diameter power source; 761. Support arm; 762. Second protective shell; 7011. Connecting plate; 7012. Connecting seat; 7021. Guide rod; 7023. Adjusting seat; 7041. First limiting block; 7042. Second limiting block. Detailed Implementation

[0031] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0036] Please see Figures 1 to 5As shown, one embodiment of this application provides a vertical grinding apparatus, including a support base 10 and a headstock mechanism 20, a tailstock mechanism 30, and a grinding mechanism 40 mounted on the support base 10. The tailstock mechanism 30 is disposed above the headstock mechanism 20 and is movable relative to the headstock mechanism 20 in a vertical direction, so that the tailstock mechanism 30 has a first position and a second position arranged at intervals in a vertical direction relative to the headstock mechanism 20. The grinding mechanism 40 includes a first rotary table 43 and a first grinding tool group 41 and a second grinding tool group 42 movably connected to the first rotary table 43. The first grinding tool group 41 and the second grinding tool group 42 are arranged at an angle, and both can be selectively rotated to the headstock mechanism 20 under the action of the first rotary table 43. In the first position, the tailstock mechanism 30 is close to the headstock mechanism 20 in a vertical direction, and the two cooperate to clamp the two ends of the workpiece in a vertical direction. The first grinding tool group 41 rotates to the headstock mechanism 20 for grinding the circumferential surface of the workpiece. In the second position, the tailstock mechanism 30 is away from the headstock mechanism 20. The headstock mechanism 20 is used to fix one end of the workpiece in the vertical direction. The second grinding tool group 42 rotates to the headstock mechanism 20 to grind the other end of the workpiece.

[0037] It is important to note that the term "fixed" here refers to the support of the headstock mechanism 20 for the workpiece, ensuring that the workpiece does not move arbitrarily during grinding, thus limiting the workpiece's movement. Also, the vertical direction mentioned above refers to the Z-axis direction.

[0038] In practical applications, the workpiece can be a crystal. During processing, a crystal is cut into cylindrical blocks by a crystal rod, and then the blocks are ground to form wafers, facilitating subsequent manufacturing processes. In this embodiment, the workpiece refers to a cylindrical crystal block that needs to be ground, collectively referred to as a crystal. During grinding, the circumferential surface and the end faces of the crystal need to be ground.

[0039] Since the tailstock mechanism 30 can move vertically to adjust its position relative to the headstock mechanism 20 in the vertical direction, and the first grinding tool group 41 and the second grinding tool group 42 can rotate around the Z-axis under the action of the first rotary table 43 to adjust their positions relative to the headstock mechanism 20. In the first position, the tailstock mechanism 30 moves downward vertically to approach the headstock mechanism 20, and the two ends of the crystal held by the headstock mechanism 20 in cooperation with the headstock mechanism 20 in the vertical direction are exposed, so that the outer peripheral surface of the crystal is exposed; at this time, the first grinding tool group 41 rotates to be directly opposite the headstock mechanism 20 for grinding the circumferential surface of the crystal, that is, circumferential surface grinding. In the second position, the tailstock mechanism 30 moves upward in the vertical direction to move away from the headstock mechanism 20. One end of the crystal is supported on the headstock mechanism 20 and fixed by the headstock mechanism 20, while the other end of the crystal is exposed. At this time, the second grinding tool group 42 rotates to face the headstock mechanism 20 and is used to grind the exposed end of the crystal, i.e., end face grinding.

[0040] In other words, the support base 10 is mainly used to integrate the headstock mechanism 20, the tailstock mechanism 30, and the grinding mechanism 40. Based on this, the positions of the tailstock mechanism 30 and the headstock mechanism 20 can be changed by moving the tailstock mechanism 30 relative to the headstock mechanism 20 in the vertical direction. Furthermore, the headstock mechanism 20 not only cooperates with the tailstock mechanism 30 to clamp and fix the two ends of the crystal, but can also fix the crystal independently. Simultaneously, the first grinding tool group 41 and the second grinding tool group 42 can be adjusted relative to the headstock mechanism 20 under the action of the first rotary table 43, so as to adjust the corresponding grinding tool group according to different fixing methods, thereby satisfying the end face grinding and circumferential surface grinding of the crystal. Therefore, the vertical grinding device provided in this embodiment can be used for end face grinding and circumferential surface grinding. It only requires adjusting the positions of the tailstock mechanism 30 and the headstock mechanism 20, as well as the positions of the first grinding tool group 41 and the second grinding tool group 42 relative to the headstock mechanism 20, to adapt the grinding tool to the corresponding angle while satisfying the fixing methods under different grinding requirements. Therefore, there is no need to change equipment according to different grinding requirements during the entire crystal grinding process, which reduces the need for multiple positioning processes caused by errors between different equipment when changing equipment, thus improving grinding efficiency; and, it avoids assembly errors when clamping different equipment as much as possible, thus improving machining accuracy.

[0041] like Figure 4 As shown, in an optional embodiment, the grinding mechanism 40 further includes a third grinding tool group 44 movably connected to the first rotary table 43. The third grinding tool group 44, the first grinding tool group 41, and the second grinding tool group 42 are arranged circumferentially at intervals along the first rotary table 43. The rotation axis of the first rotary table 43 is set along the Z-axis, and the three grinding tool groups can be arranged at 90-degree intervals. In this way, the three grinding tool groups can be adjusted to face the headstock mechanism 20 according to the grinding requirements, thereby avoiding interference during individual grinding. The third grinding tool group 44 can be used for V-groove machining. The first grinding tool group 41, the second grinding tool group 42, and the third grinding tool group 44 all include a grinding tool body and a grinding tool holder. The grinding tool body is connected to the grinding tool holder, and each grinding tool holder is connected to the first rotary table 43. The grinding tool body can be a grinding wheel, and the diameter of the grinding tool body of the first grinding tool group 41 and the second grinding tool group 42 is larger than the diameter of the grinding tool body of the third grinding tool group 44. Meanwhile, the first grinding assembly 41, the second grinding assembly 42, and the third grinding assembly 44 also include a grinding driver mounted on the grinding base and connected to the grinding body, used to drive the grinding body to rotate around its own axis. In some specific embodiments, the grinding body of the third grinding assembly 44 can be a V-groove grinding wheel for machining V-grooves on crystals.

[0042] Since the crystal is held between the headstock mechanism 20 and the tailstock mechanism 30, the crystal's axis is vertical. Furthermore, in circumferential surface grinding, the grinding tool body does not rotate, but in end-face grinding, the grinding tool body needs to rotate. Therefore, the first grinding tool group 41 cannot be used for end-face grinding, and a second grinding tool group 42 is required to meet the end-face grinding needs.

[0043] In practical use, the first grinding tool group 41 has a first central axis, the second grinding tool group 42 has a second central axis, and the third grinding tool group 44 has a third central axis. The second and third central axes are basically parallel and are both set at an angle to the first central axis. It is worth noting that the central axis of each grinding tool group refers to the central axis of the corresponding grinding tool body. Specifically, the grinding tool body in the first grinding tool group 41 is used for circumferential surface grinding, and its circumferential surface is tangent to the circumferential surface of the crystal; therefore, the first central axis is set in the vertical direction. The second and third central axes are set in the horizontal direction.

[0044] like Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, in an optional embodiment, the headstock mechanism 20 includes a support platform 21 and a first gripper assembly 22. The first gripper assembly 22 is disposed around the circumferential periphery of the support platform 21 and forms a first clamping space. At least one of the first gripper assembly 22 and the support platform 21 is movable in the vertical direction. In a first position, the support platform 21 and the first gripper assembly 22 move relative to each other so that the support platform 21 is located outside the first clamping space. The support platform 21 can cooperate with the tailstock mechanism 30 to clamp the crystal at both ends in the vertical direction. In a second position, the support platform 21 and the first gripper assembly 22 move relative to each other so that the support platform 21 is located within the first clamping space. The first gripper assembly 22 is used to clamp the outer peripheral surface of the crystal. Here, relative movement does not mean that both must move simultaneously, but rather the displacement generated relative to each other. This displacement can be caused by one being fixed and the other moving, or by both moving simultaneously.

[0045] Please see Figure 1 and Figure 5Furthermore, the vertical grinding device also includes a tailstock support frame 51 connected to the tailstock mechanism 30. The tailstock support frame 51 is mounted on the support base 10 to suspend the tailstock mechanism 30 above the headstock mechanism 20. The tailstock mechanism 30 includes a pressure head 31, a pressure head support 32, and a pressure head driver 33. The pressure head support 32 is slidably connected to the tailstock support frame 51, and the pressure head driver 33 is mounted on the pressure head support 32. The pressure head 31 is connected to the pressure head driver 33 to rotate around the Z-axis under the action of the pressure head driver 33. At the same time, a tailstock linear driver 34 is also provided on the tailstock support frame 51, which is connected to the pressure head support 32, thereby driving the pressure head support 32 to reciprocate along the Z-axis direction, realizing the position change of the pressure head 31 relative to the support table 21.

[0046] In the first position, the support platform 21 is located outside the first clamping space to avoid interference from the first gripper assembly 22 in fixing the end face of the crystal. At this time, the pressure head 31, under the action of the tailstock linear actuator 34, moves downward along the Z-axis with the pressure head support 32 to cooperate with the support platform 21 and clamp at both ends of the crystal in the axial direction (i.e., the Z-axis direction). The diameters of both the pressure head 31 and the support platform 21 are smaller than the diameter of the crystal, ensuring that the outer circumference of the crystal can be exposed during clamping, facilitating grinding to change the crystal's diameter. During circumferential surface grinding, both the pressure head 31 and the support platform 21 can rotate around the Z-axis to drive the crystal to rotate, achieving uniform grinding of the circumferential surface.

[0047] In the second position, the support platform 21 is located within the first clamping space to avoid interference with the clamping of the first gripper assembly 22 relative to the crystal. The first gripper assembly 22 includes at least two grippers 221 spaced apart around the Z-axis to clamp the crystal's circumferential surface. At this time, the end face of the crystal facing away from the tailstock mechanism 30 along the Z-axis can be supported on the support platform 21. The support platform 21 then restricts the portion of the crystal housed within the first clamping space, ensuring that the end of the crystal facing away from the support platform 21 can be located outside the first clamping space, facilitating end face grinding to change the crystal's thickness (i.e., its dimension along the Z-axis).

[0048] In some specific embodiments, the first gripper assembly 22 includes two grippers 221 spaced 180 degrees apart. The first gripper assembly 22 also includes a gripper seat 222, to which both grippers 221 are connected, and at least one gripper 221 is slidably connected relative to the gripper seat 222 to move radially along the support platform 21, thereby clamping and releasing the crystal. Alternatively, each gripper 221 corresponds to one gripper seat 222, in which case the first gripper assembly 222 also includes a gripper mounting base 223, to which both gripper seats 222 are connected. The grippers 221 can be pneumatically or electrically controlled. Alternatively, each gripper 221 can be rotatably connected relative to the gripper seat 222 to achieve clamping and releasing by oscillation. The diameter of the first clamping space defined by the two grippers 221 can be slightly larger than the diameter of the crystal, so that the grippers 221 only need to make a small movement to clamp the crystal. In practical applications, the crystal can be ground on its end face first, followed by circumferential grinding. Conversely, the reverse is also possible.

[0049] In other words, by using the headstock mechanism 20 provided in this embodiment, the positions of the support platform 21 and the first gripper group 22 along the Z-axis can be adjusted to meet the crystal fixing methods corresponding to both end face grinding and circumferential surface grinding, without the need to change different equipment at different grinding positions. This not only reduces the time spent transferring between different equipment and the time spent on loading and unloading processes during transfer, thus improving crystal processing efficiency, but also minimizes assembly errors when clamping different equipment, improving processing accuracy. Furthermore, compared to the use of wax to fix the crystal in related technologies, the headstock mechanism 20 provided in this embodiment eliminates the wax adhesion and dewaxing process, significantly shortening processing time.

[0050] In some embodiments, the support stage 21 is constructed with a plurality of spaced-apart adsorption holes to fix the crystal by vacuum adsorption. Specifically, the support stage 21 is also constructed with air channels connecting the various adsorption holes, and the air channels are connected to a vacuum pump via air pipes. Figure 3 As shown, the support platform 21 has a recessed groove structure 211 on the side facing the pressure head 31 along the Z-axis. The bottom of each groove structure 211 is constructed with multiple spaced adsorption holes for vacuum adsorption.

[0051] Alternatively, the support platform 21 also features multiple spaced-apart protrusions along the Z-axis towards the pressure head 31, as well as annular protrusions surrounding the outer periphery of these protrusions and located at the edge of the support platform 21. These protrusions can be arc-shaped and are referred to as arc-shaped protrusions. The arc-shaped and annular protrusions create a groove structure on the side of the support platform 21 facing the tailstock mechanism 30. Multiple adsorption holes can be spaced apart at the bottom of the groove structure, or part of the hole wall can be located on the protrusions. When the crystal is supported on the arc-shaped and annular protrusions, a gas flow space defined by the groove structure is formed between the crystal and the support platform 21. This effectively increases the adsorption area and range of each adsorption hole acting on the crystal, improving the reliability of adsorption fixation. Furthermore, the annular protrusions act as a seal for the gas flow space between the crystal and the support platform 21, preventing the gas flow space from communicating with the external environment and ensuring adsorption performance.

[0052] In practical use, during the loading and unloading of the crystal relative to the headstock mechanism 20 during grinding, the support table 21 can use vacuum adsorption to fix the crystal, preventing it from falling during loading and unloading and improving safety. For example, when loading a crystal to be ground, the support table 21 can further improve the fixing effect on the crystal based on the first gripper group 22, preventing the crystal from falling due to instability relative to the first gripper group 22. Moreover, when unloading the ground crystal, since the crystal has changed its diameter after circumferential grinding, the adsorption effect of the support table 21 can be used to fix the crystal to cooperate with the handling robot for unloading. At the same time, during circumferential grinding, the grinding mechanism 40 will exert a radial force on the crystal. At this time, the adsorption and fixing of the crystal by the support table 21 reduces the crystal's radial movement and ensures grinding accuracy.

[0053] Please see Figure 2 and Figure 3For example, the headstock mechanism 20 also includes a power shaft 23 and an assembly base 24. The power shaft 23 is rotatably connected to the assembly base 24. One end of the power shaft 23 along its own axial direction is connected to the support platform 21, for driving the support platform 21 to rotate around the axis of the power shaft 23. The end of the assembly base 24 along the axial direction of the power shaft 23 and facing the support platform 21 is connected to the first gripper assembly 22. The axial direction of the power shaft 23 is the Z-axis direction. The power shaft 23 is configured to drive the support platform 21 to rotate around the Z-axis, thereby cooperating with the pressure head 31 to achieve circumferential surface grinding of the crystal. The rotation of the power shaft 23 can be driven by a motor, with the motor shaft connected to the power shaft 23; or, the power shaft 23 can serve as the motor shaft of a motor. It only needs to be able to drive the rotation of the power shaft 23. The assembly base 24 is connected to the gripper assembly seat 223 in the first gripper assembly 22 to satisfy the assembly of the first gripper assembly 22. A bearing is installed between the assembly base 24 and the power shaft 23 for rotational support. The mounting base 24 can be used to mount on the support base 10.

[0054] The power shaft 23 can be configured as a hollow shaft, and the air tube for supporting the vacuum adsorption of the platform 21 passes through the hollow shaft cavity of the power shaft 23 for easy storage and wiring.

[0055] Furthermore, the headframe mechanism 20 also includes a linear drive assembly connected to the end of the power shaft 23 facing away from the support platform 21. This assembly drives the power shaft 23 to move relative to the mounting base 24 along the axial direction (i.e., the Z-axis direction), thereby causing the support platform 21 to move along the Z-axis direction, achieving position adjustment of the support platform 21 relative to the first clamping space. The linear drive assembly is installed at the end of the mounting base 24 facing away from the first gripper assembly 22 to ensure stability and prevent interference with the rotation of the power shaft 23. In this case, the gripper mounting base 223 of the first gripper assembly 22 has through holes for the power shaft 23 to pass through, avoiding interference with the rotation and linear movement of the power shaft 23. The linear drive assembly can be cylinder-driven. In this case, a mounting pair can be installed between the piston rod of the cylinder and the power shaft 23, with a bearing between the mounting pair and the power shaft 23 to reduce wear between the power shaft 23 and the mounting pair during rotation. The cylinder drives the power shaft 23 to perform linear reciprocating motion in the Z-axis direction through the mounting pair. A floating head can be connected between the cylinder and the assembly to reduce the vibration acting on the power shaft 23 during cylinder start-up and shutdown. The linear drive assembly can also be a hydraulic cylinder or other drive structure capable of linear drive.

[0056] Alternatively, the first gripper assembly 22 can move along the Z-axis to position the support platform 21 within or outside the first clamping space. In this case, the first gripper assembly 22 includes a gripper base 222 and at least two grippers 221 connected to the gripper base 222. A linear drive assembly is connected between the assembly base 24 and the gripper base 222 to drive the first gripper assembly 22 to move along the Z-axis, thereby adjusting the position of the support platform 21 and the first gripper assembly 22 along the Z-axis. The linear drive assembly can be configured with at least two units, arranged at 180-degree intervals around the Z-axis to ensure uniform driving force.

[0057] In another alternative embodiment, when the first gripper assembly 22 includes a gripper mounting base 223, a gripper seat 222, and at least two grippers 221, each gripper 221 corresponds to a gripper seat 222 and is slidably connected to the corresponding gripper seat 222. The gripper mounting base 223 is connected to the mounting base 24, and a linear drive group is connected between the gripper mounting base 223 and the gripper seat 222. Each gripper seat 222 corresponds to a linear drive group, thereby enabling the movement of each gripper 221 along the Z-axis direction.

[0058] like Figure 1 As shown, in an optional embodiment, the grinding mechanism 40 and the tailstock support frame 51 are arranged at intervals along the second direction and are both movable along the second direction. The headstock mechanism 20 is spaced between the grinding mechanism 40 and the tailstock support frame 51, and the headstock mechanism 20 is movable along the first direction. The first direction, the second direction, and the vertical direction are arranged at angles to each other. The example is given with the first direction being the X-axis and the second direction being the Y-axis.

[0059] Understandably, the movement of the grinding mechanism 40 and the tailstock support 51 along the Y-axis is used to adjust their respective positions relative to the headstock mechanism 20 along the Y-axis. For example, during end-face grinding, the second grinding tool assembly 42 needs to move to the headstock mechanism 20. At this time, the tailstock mechanism 30 can move along the Y-axis away from the grinding mechanism 40 to avoid interference with the grinding mechanism 40. Simultaneously, the movement of the grinding mechanism 40 along the Y-axis allows for grinding of the crystal along the Y-axis; it also allows the grinding mechanism 40 to be adjusted away from the headstock mechanism 20 along the Y-axis, so that the grinding tool body moves out of the area of ​​the support table 21, facilitating the cooperation between the tailstock mechanism 30 and the headstock mechanism 20 to clamp the crystal at both ends axially. The movement of the headstock mechanism 20 along the X-axis facilitates the movement of the crystal to different workstations for different operations during the grinding process.

[0060] like Figure 1As shown, for example, the support base 10 is configured with crystal orientation detection stations, diameter detection stations, thickness detection stations, and grinding stations arranged at intervals along the X-axis direction. In this case, the vertical grinding device also includes a headstock transport track 52 mounted on the support base 10. The headstock mechanism 20 is slidably disposed on the headstock transport track 52 and can move along the length direction (i.e., the X-axis direction) of the headstock transport track 52 to move between the crystal orientation detection stations, diameter detection stations, thickness detection stations, and grinding stations.

[0061] The crystal orientation detection station is used to detect the crystal orientation, the diameter detection station is used to detect the crystal diameter, the thickness detection station is used to detect the crystal thickness, and the grinding station is used to grind the crystal. The grinding station is located at the intersection of the grinding mechanism 40, the tailstock support frame 51, and the headstock mechanism 20. When grinding is required, the headstock mechanism 20 simply moves to the grinding station along the headstock conveyor track 52.

[0062] Furthermore, the vertical grinding device also includes a first linear drive mechanism 53 for driving the tailstock support frame 51 to move along the Y-axis and a second linear drive mechanism 54 for driving the grinding mechanism 40 to move along the Y-axis. Both the first linear drive mechanism 53 and the second linear drive mechanism 54 can be screw drive mechanisms. Simultaneously, the first grinding tool group 41, the second grinding tool group 42, and the third grinding tool group 44 are respectively provided with first lifting modules 45. The first rotary table 43 includes a rotary shaft, a base connected to the rotary shaft, and a support column connected to the base. Each first lifting module 45 is arranged at intervals around the Z-axis on the support column. Each first lifting module 45 can also employ a four-bar drive mechanism to drive its corresponding grinding tool group to move up and down along the Z-axis, adjusting the position relative to the crystal and adapting to different grinding operations. The first rotary table 43 also includes a rotary seat, which is used to mount on the support base 10 and rotate the supporting rotary shaft.

[0063] like Figure 2 and Figure 3As shown, in an optional embodiment, the headframe mechanism 20 further includes a corner platform 25, which is slidably connected to the headframe conveyor track 52 via a slider, and the mounting base 24 is mounted on the corner platform 25. The corner platform 25 allows adjustment of the pitch angle of the headframe mounting base, thereby achieving pitch angle adjustment of the support platform 21. Furthermore, due to the connection between the support platform 21 and the power shaft 23, the horizontal angle of the support platform 21 can be adjusted by driving the support platform 21 to rotate around the Z-axis via the power shaft 23. This allows for adaptation to various testing requirements such as crystal orientation detection, thickness detection, and diameter detection. The corner platform 25 includes a fixed support base 251 and a movable support base 252 slidably connected to the fixed support base 251. The fixed support base 251 has an arc-shaped slide rail 2511 with a first axis, and the movable support base 252 can swing relative to the fixed support base 251 on the arc-shaped slide rail 2511 around the first axis. The mounting base 24 is installed on the side of the movable support 252 opposite to the fixed support 251.

[0064] Specifically, the fixed support 251 has an assembly cavity on the side facing the movable support 252. Two arc-shaped slide rails 2511 are provided, located on either side of the assembly cavity along the Y-axis. The corner stage 25 also includes a motor, a lead screw connected to the motor, a transmission seat threaded to the lead screw, and a movable seat hinged to the transmission seat. The movable seat is connected to the movable support 252. The motor is located outside the assembly cavity, while the transmission seat and movable seat are both located inside the assembly cavity. Part of the lead screw is located outside, and the other part is located inside the assembly cavity to cooperate with the transmission seat. The bottom of the movable support 252 has a curved surface adapted to the arc-shaped extension direction of the arc-shaped slide rail 2511. The motor drives the lead screw to reciprocate along the axial direction (X-axis) of the lead screw, thereby driving the movable support 252 to reciprocate along the extension direction (X-axis) of the arc-shaped slide rail 2511 via the movable seat, achieving pitch angle adjustment.

[0065] Please see Figure 1 , Figure 6 and Figure 7In an optional embodiment, the vertical grinding apparatus further includes a flipping mechanism 60, which is mounted on the support table 21 and used to flip the workpiece. The flipping mechanism 60 includes a flipping bracket 61, a second rotary table 62, and a flipping gripper 63. The flipping bracket 61 is mounted on the support base 10, the second rotary table 62 is mounted on the flipping bracket 61, and the flipping gripper 63 is connected to the second rotary table 62. The second rotary table 62 has a rotation axis set along the X-axis and is used to drive the flipping gripper 63 to rotate around the rotation axis. Using the flipping mechanism 60, the crystal can be flipped 180 degrees, enabling grinding of both ends of the crystal along its own axial direction. The flipping bracket 61 is arranged vertically and located on the side of the headstock mechanism 20 away from the tailstock mechanism 30 along the X-axis, for example, near the edge of the support base 10, to reduce interference with other structures. The tilting mechanism 60 also includes a second lifting module 65, mounted on the tilting bracket 61. Its power output end is connected to a support plate 64, used to drive the support plate 64 to rise and fall along the Z-axis. The second rotary table 62 drives the tilting gripper 63 to rise and fall synchronously with the support plate 64. The second lifting module 65 includes a movable guide rail disposed on the side of the tilting bracket 61 facing the head frame mechanism 20, and the second rotary table 62 is mounted on a support plate 64, which is slidably connected to the movable guide rail. This allows adjustment of the position of the tilting gripper 63 relative to the head frame mechanism 20 along the Z-axis.

[0066] Specifically, a flipping station is also provided on the support base 10 along the headstock conveyor track 52. After one end of the crystal on the headstock mechanism 20 is ground, the headstock mechanism 20 moves along the headstock conveyor track 52 to the flipping station, and the flipping jaw 63 descends to hold the crystal on the support table 21; then, the flipping jaw 63 moves upward along the Z-axis to ensure that the flipping jaw 63 has sufficient flipping space relative to the support table 21 in the Z-axis direction. Next, the flipping jaw 63 rotates 180 degrees around the X-axis under the action of the second rotary table 62, so that the other end of the crystal faces the support table 21. After the flipping is completed, the flipping jaw 63 moves downward along the Z-axis to place the flipped crystal on the support table 21, where it is held and fixed by the support table 21. The first jaw group 22 can also hold and fix the crystal, and then the headstock mechanism 20 moves to the grinding station to grind the other end. The flipping jaw 63 can rise along the Z-axis.

[0067] like Figure 6 and Figure 7As shown, the flipping gripper 63 further includes a transmission rod 631 and a first clamping arm 632 and a second clamping arm 633 connected to the transmission rod 631. The transmission rod 631 can rotate around its own axis to drive the first clamping arm 632 and the second clamping arm 633 to move towards each other or away from each other, thereby achieving clamping and releasing. Simultaneously, the flipping gripper 63 includes a support base 634, which is connected to the power output end of the second rotary table 62. A transmission rod support seat protrudes from the side of the support base 634 opposite to the second rotary table 62 for the rotational assembly of the transmission rod 631. One end of the transmission rod 631 is connected to a motor, and the transmission rod 631 is provided with a first helical segment 6311 and a second helical segment 6312 arranged at intervals along its own axial direction, with opposite helical directions. The first clamping arm 632 is connected to the first helical segment 6311 via a first nut 635, and the second clamping arm 633 is connected to the second helical segment 6312 via a second nut 636. In this way, it can be ensured that when the transmission rod 631 rotates, the first nut 635 and the second nut 636 can move towards each other or away from each other along the circumference (i.e., the Y-axis direction) of the transmission rod 631. At the same time, a guide rail is provided on the support base plate 634 to slide with both the first nut 635 and the second nut 636, satisfying the movement guidance.

[0068] The second rotary table 62 can be driven by a worm gear. A turntable is installed on the side of the worm gear away from the flipping bracket 61 along its own axis so that the turntable can be used to connect to the flipping gripper 63. Alternatively, the worm gear can be directly connected to the support base plate 634 in the flipping gripper 63.

[0069] Please see Figure 1 , Figure 8 , Figure 9 and Figure 10 For example, the vertical grinding apparatus also includes a detection mechanism 70 mounted on the support base 10. The detection mechanism 70 is used to detect the size and orientation information of the crystal to facilitate subsequent grinding operations. The size information of the crystal includes the thickness information and the diameter information of the crystal, and the diameter information includes the diameter before grinding and the diameter after grinding.

[0070] Specifically, the inspection mechanism 70 includes a crystal orientation analyzer 71, a thickness detection component 72, and a diameter detection component 73. The crystal orientation analyzer 71 is used to detect the crystal orientation information of the crystal, the thickness detection component 72 is used to detect the thickness of the crystal before grinding, and the diameter detection component 73 is used to detect the diameter of the crystal. Since the diameter of the crystal needs to be detected both before and after grinding, the diameter detection component 73 includes a pre-grinding diameter detection component 73a and a post-grinding straight-line detection component. In actual use, the inspection mechanism 70 also includes an inspection mounting base 74 mounted on the support base 10. The crystal orientation analyzer 71 is mounted on the inspection mounting base 74 and is arranged at intervals relative to the tailstock support frame 51 along the X-axis direction to correspond to the crystal orientation detection station set on the support base 10. A guide rail is also provided between the crystal orientation analyzer 71 and the inspection mounting base 74 to facilitate adjustment of the position of the crystal orientation analyzer 71 along the X-axis and Y-axis directions, changing its position relative to the crystal, and realizing the inspection. The thickness detection component 72 can be installed near the flipping mechanism 60, and the thickness detection component 72 can be suspended above the second clamping space enclosed by the flipping gripper 63 by the thickness support frame 75. The pre-grinding diameter detection component 73a and the post-grinding diameter detection component 73b are both installed on the tailstock support frame 51, and are respectively arranged on both sides of the tailstock support frame 51 along the X-axis direction.

[0071] In some specific embodiments, along the X-axis, the stations are arranged in sequence: crystal orientation detection station, post-grinding diameter detection station, grinding station, pre-grinding diameter detection station, thickness detection station, and flipping station. The thickness detection station and flipping station can overlap on the Z-axis.

[0072] The following describes the thickness detection component 72, the pre-grinding diameter detection component 73a, and the post-grinding diameter detection component 73b.

[0073] like Figure 8 and Figure 9 As shown, as some examples, the thickness detection assembly 72 includes a fifth drive group 701, a contact structure 702 slidably connected to the fifth drive group 701, and a sensing structure 703 connected to the fifth drive group 701. The contact structure 702 has an abutment portion and a test portion arranged at intervals along the Z-axis direction. The abutment portion is used to abut against the crystal for positioning. The sensing structure 703 is located on the side of the test portion opposite to the abutment portion and is arranged at intervals relative to the test portion along the Z-axis direction. The fifth drive group 701 is used to drive the contact structure 702 and the sensing structure 703 to move along the Z-axis direction. The sensing structure 703 is configured to abut against the test portion and emit a detection signal in response to the abutment portion abutting against the crystal at a stop.

[0074] Further, the contact structure 702 includes a contact disk 721 and a guide rod 7021. The two sides of the contact disk 721 along its thickness direction are defined as a test section and an abutment section, respectively. The guide rod 7021 is connected to the side of the contact disk 721 located at the test section and extends along the thickness direction of the contact disk 721 towards the side opposite to the abutment section. The fifth drive group 701 includes a thickness power source 724, a connecting plate 7011 connected to the thickness power source 724, and a connecting seat 7012 connected to the connecting plate 7011. The connecting seat 7012 has a guide hole axially along the Z-axis direction. The guide rod 7021 passes through the guide hole and can move within the guide hole along the Z-axis direction. An elastic element is also connected between the contact disk 721 and the connecting seat 7012 to apply a force to the contact disk 721 to move it towards the side opposite to the connecting seat 7012. The guide rod 7021 passes through the guide hole and is connected to an adjusting seat 7023 at one end opposite to the contact plate 721. The adjusting seat 7023 can abut against the side of the connecting seat 7012 opposite to the contact plate 721. A linear bearing can also be provided between the guide rod 7021 and the connecting seat 7012 to provide a guiding function.

[0075] Furthermore, the sensing structure 703 includes a first displacement sensor and a mounting base, the mounting base being used to detachably connect the first displacement sensor to the side of the connecting plate 7011 opposite to the connecting base 7012. The first displacement sensor has a sensing post, which is configured to emit a detection signal in response to compression upon contact with the testing unit.

[0076] During thickness detection, the thickness power source 724 drives the connecting plate 7011 to move along the Z-axis. The connecting plate 7011 drives the sensing structure 703 and the contact structure 702 to move simultaneously along the Z-axis toward the side closer to the crystal, until the abutment portion on the contact plate 721 abuts against the crystal. At this time, the contact plate 721 stops moving forward under the limiting action of the crystal. Due to the sliding connection between the guide rod 7021 and the connecting seat 7012, as the thickness power source 724 continues to drive, the contact plate 721 will generate a relative displacement relative to the connecting seat 7012 along the Z-axis toward the side away from the crystal. Furthermore, due to the spaced arrangement of the sensing structure 703 relative to the contact plate 721 along the Z-axis, the sensing structure 703 can continue to move along the Z-axis toward the side closer to the crystal as driven by the thickness power source 724, until the sensing post of the first displacement sensor abuts against the testing portion of the contact plate 721. As the thickness power source 724 continues to drive, the sensing column is compressed and displaced, converting linear motion into an electrical signal, which in turn outputs a digital signal to obtain the thickness of the crystal blank. The distance between the detection end of the first displacement sensor and the fixed center of the crystal is fixed; therefore, the thickness can be the difference between this distance and the displacement of the first displacement sensor under the drive of the thickness power source 724.

[0077] The adjustment seat 7023 and the elastic element effectively limit both ends of the guide rod 7021 relative to the connecting seat 7012 along the Z-axis, preventing the guide rod 7021 and the contact plate 721 from completely disengaging from the connecting seat 7012. Furthermore, this design ensures that the elastic element remains slightly compressed after assembly, causing the contact plate 721 to tend to move away from the sensing structure 703 along the Z-axis. This ensures that the contact plate 721 and the sensing structure 703 do not initially contact each other, guaranteeing testing accuracy. The adjustment seat 7023 and the guide rod 7021 can be threaded together. Rotating the adjustment seat 7023 adjusts its installation position relative to the guide rod 7021, thereby changing the length of the guide rod 7021 between the contact plate 721 and the connecting seat 7012, thus adjusting the installation position of the contact plate 721 relative to the connecting seat 7012. Meanwhile, a locking nut is also installed on the side of the adjusting seat 7023 opposite to the connecting seat 7012. The locking nut is threadedly connected to the guide rod 7021 for locking.

[0078] In practical use, the thickness detection mechanism 70 also includes a limiting component 704 and a first mounting bracket 705 mounted on the thickness support frame 75. The thickness power source 724 is mounted on the first mounting bracket 705, and the connecting plate 7011 is slidably connected to the first mounting bracket 705 via guide rails and sliders. The limiting component 704 is connected between the first mounting bracket 705 and the connecting plate 7011 to limit the driving stroke of the thickness power source 724. The thickness power source 724 is a cylinder, that is, the piston rod extension length of the cylinder is limited to prevent excessive extension. The limiting component 704 includes a first limiting block 7041 and a second limiting block 7042, one of which is mounted on the first mounting bracket 705, and the other is mounted on the connecting plate 7011. When the connecting plate 7011 moves along the Z-axis towards the direction closer to the crystal under the action of the thickness power source 724, the first limiting block 7041 and the second limiting block 7042 can abut to limit the driving stroke. The first limiting block 7041 can be installed on the first mounting bracket 705, and the second limiting block 7042 can be installed on the connecting plate 7011, or vice versa.

[0079] Furthermore, the thickness support frame 75 includes a column 751 and two crossbeams 752 connected to the column 751. The two crossbeams 752 are arranged at intervals along the Z-axis direction, and one end of them facing away from the column 751 is connected to a first protective housing 753. The thickness detection component 72 is installed inside the first protective housing 753 to improve safety.

[0080] like Figures 10 to 12As shown, the pre-grinding diameter detection component 73a and the post-grinding diameter detection component 73b are respectively installed on both sides of the tailstock support frame 51 along the X-axis direction. The tailstock support frame 51 is provided with a support arm 761 and a second protective housing 762 connected to the support arm 761. The pre-grinding diameter detection component 73a and the post-grinding diameter detection component 73b are respectively installed on the corresponding second protective housing 762. The structure of the pre-grinding diameter detection component 73a is basically similar to that of the thickness detection component 72, except that the contact structure 702 and the sensing structure 703 in the pre-grinding diameter detection component 73a move along the Y-axis direction to perform diameter detection; and the contact structure 702 in the pre-grinding diameter detection component 73a includes a contact roller 731 and a roller frame 732. The roller frame 732 is connected to the guide rod 7021, and the contact roller 731 and the roller frame 732 are rotatably connected via a rotating shaft. The roller frame 732 has a testing section on the side facing the sensing structure 703 along the Y-axis, and a contact roller 731 has a contact section on the side away from the roller frame 732 along the Y-axis. The contact roller 731 is used to abut against the crystal, and the axis of the contact roller 731 is parallel to the axis of the crystal. The sensing post of the second displacement sensor abuts against the side wall of the roller frame 732 away from the contact roller 731. During diameter detection before grinding, the contact roller 731 abuts against the circumferential surface of the crystal under the action of the first diameter power source 733. At this time, the first diameter power source 733 continues to drive the crystal so that the sensing post of the second displacement sensor abuts against the roller frame 732, and then drives the crystal to rotate around its own axis for one revolution, thereby obtaining the detection data on one revolution of the crystal, which is convenient for subsequent calculation and grinding.

[0081] For the grinding diameter detection component 73b, since it is used for grinding diameter detection, it can be obtained from the initial detection data and grinding feed rate, etc., and the fixed center of the crystal remains unchanged. Therefore, only the sensing structure 703 is needed. That is, the third displacement sensor is used to abut against the circumferential surface of the crystal under the action of the second diameter power source 734, so that the diameter can be obtained by the displacement change.

[0082] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A vertical grinding device, characterized in that, include: Support base; The head frame mechanism is mounted on the support base; The tailstock mechanism is mounted on the support base and positioned above the headstock mechanism. The tailstock mechanism is capable of moving vertically relative to the headstock mechanism and has a first position and a second position arranged vertically at intervals relative to the headstock mechanism. A grinding mechanism is installed on the support base. The grinding mechanism includes a first rotary table and a first grinding tool group and a second grinding tool group that are movably connected to the first rotary table. The first grinding tool group and the second grinding tool group are set at an angle, and the first grinding tool group and the second grinding tool group can be selectively rotated to the head frame mechanism under the action of the first rotary table. In the first position, the tailstock mechanism is close to the headstock mechanism and is used to clamp the two ends of the workpiece in the vertical direction. The first grinding tool assembly rotates to the headstock mechanism and is used to grind the circumferential surface of the workpiece. In the second position, the tailstock mechanism is far from the headstock mechanism. The headstock mechanism is used to fix one end of the workpiece in the vertical direction. The second grinding tool assembly rotates to the headstock mechanism and is used to grind the other end of the workpiece. The head frame mechanism includes a support platform and a first gripper group. The first gripper group is disposed on the circumferential periphery of the support platform and forms a first gripping space. At least one of the first gripper group and the support platform can move in the vertical direction. In the first position, the support platform and the first gripper group move relative to each other so that the support platform is located outside the first clamping space, and the support platform can cooperate with the tailstock mechanism to clamp; in the second position, the support platform and the first gripper group move relative to each other so that the support platform is located within the first clamping space, and the first gripper group is used to clamp the outer peripheral surface of the workpiece. The head frame mechanism further includes a power shaft and an assembly base. The power shaft is rotatably connected to the assembly base. One end of the power shaft along its own axial direction is connected to the support platform for driving the support platform to rotate around the axis of the power shaft. One end of the assembly base along the axial direction of the power shaft and facing the support platform is connected to the first gripper assembly.

2. The vertical grinding apparatus according to claim 1, characterized in that, The headframe mechanism further includes a linear drive assembly connected to the end of the power shaft opposite to the support platform, for driving the power shaft to move vertically relative to the mounting base, thereby causing the support platform to move synchronously; or... The headframe mechanism further includes a linear drive assembly connected between the assembly base and the first gripper assembly, used to drive the first gripper assembly to move vertically; or... The first gripper assembly includes a gripper mounting base, a gripper seat, and a gripper movably connected to the gripper seat. The gripper mounting base is connected to the mounting base. The head frame mechanism further includes a linear drive group connected between the gripper seat and the gripper mounting base, which drives the gripper seat to move the gripper in the vertical direction.

3. The vertical grinding apparatus according to claim 1, characterized in that, The vertical grinding device also includes a tailstock support frame connected to the tailstock mechanism, and the tailstock support frame is mounted on the support base; The grinding mechanism and the tailstock support frame are arranged at intervals along the second direction and are both capable of moving along the second direction. The headstock mechanism is spaced between the grinding mechanism and the tailstock support frame and is capable of moving along the first direction. The first direction, the second direction, and the vertical direction are arranged at angles to each other. Both the first and second grinding tool groups are capable of moving vertically relative to the first rotary table.

4. The vertical grinding apparatus according to claim 1 or 3, characterized in that, The support base is constructed with crystal orientation detection stations, diameter detection stations, thickness detection stations and grinding stations arranged at intervals along a first direction. The vertical grinding device also includes a headstock conveying track installed on the support base. The headstock mechanism is slidably disposed on the headstock conveying track and can move along the length direction of the headstock conveying track to flow between the crystal orientation detection station, the diameter detection station, the thickness detection station and the grinding station.

5. The vertical grinding apparatus according to claim 1, characterized in that, The grinding mechanism further includes a third grinding tool group connected to the first rotary table, and the third grinding tool group is capable of moving relative to the first rotary table in a vertical direction. The third grinding tool group, the first grinding tool group, and the second grinding tool group are arranged at intervals along the circumference of the first rotary table; the first grinding tool group has a first central axis, the second grinding tool group has a second central axis, and the third grinding tool group has a third central axis. The second central axis and the third central axis are substantially parallel and are both set at an angle to the first central axis.

6. The vertical grinding apparatus according to claim 1, characterized in that, The vertical grinding device also includes a tilting mechanism, which is mounted on the support base and used to tilt the workpiece. The flipping mechanism includes a flipping bracket, a second rotary table, and a flipping gripper. The flipping bracket is mounted on the support base, the second rotary table is mounted on the flipping bracket, and the flipping gripper is connected to the second rotary table. The second rotary table has a rotation axis arranged along a first direction for driving the flipping gripper to rotate around the rotation axis.

7. The vertical grinding apparatus according to claim 6, characterized in that, The second rotary table is capable of moving vertically relative to the flipping bracket; and / or, the flipping gripper includes a transmission rod and a first clamping arm and a second clamping arm pulsatingly connected to the transmission rod, the transmission rod being capable of rotating about its own axis to drive the first clamping arm and the second clamping arm to move toward each other or backwards.

8. The vertical grinding apparatus according to claim 1, characterized in that, The vertical grinding device also includes a detection mechanism installed on the support base; The detection mechanism includes at least a thickness detection component, which is disposed above the headstock mechanism and spaced apart from the tailstock mechanism along a first direction. The thickness detection component is used to detect the thickness information of the workpiece. And / or, the detection mechanism includes at least a diameter detection component, which is located below the tailstock mechanism and disposed close to the tailstock mechanism in the first direction. The diameter detection component is used to detect the diameter information of the workpiece.

9. The vertical grinding apparatus according to claim 8, characterized in that, The thickness detection component and / or the diameter detection component include: Fifth drive group; The contact structure is slidably connected to the fifth drive group, and the contact structure has a contact portion and a test portion arranged at intervals along the vertical direction; A sensing structure is connected to the fifth drive group and located on the side of the test part away from the contact part, and the sensing structure is arranged at intervals in the vertical direction relative to the test part; The fifth drive group is used to drive the contact structure and the sensing structure to move along the vertical direction. The sensing structure is configured to emit a sensing signal in response to the contact portion abutting against the test portion when the contact portion abuts against the workpiece at the contact limit.

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