A printed circuit board potting and stable curing device

Abstract

The present application relates to the technical field of potting and smooth curing of printed circuit boards, and in particular to a device for potting and smooth curing of printed circuit boards, including an operating table, a supporting bracket, a lifting plate, an adjustment mechanism and a potting tube. The lifting plate designed in the present invention can support the printed circuit board during the lifting process. When the degree of depression on the surface of the printed circuit board is different, the fine-tuning of different positions of the printed circuit board can be carried out by driving the fine-tuning plate to lift, which has stronger applicability. When the surface of the printed circuit board is convex, the fine-tuning plate is driven to rise and then the convex part of the printed circuit board is adsorbed by the vacuum suction cup and then the fine-tuning plate is driven to move to one side of the operating table to make the convex part of the printed circuit board flat. Then, the surface of the printed circuit board can be flattened by the above method, avoiding the problem of uneven thickness of the surface glue layer caused by the uneven surface defects of the circuit board, so that the printed circuit board can be smoothly installed on the electrical appliance, thereby improving the later assembly effect of the printed circuit board.

Description

Technical Field

[0001] The present application relates to the technical field of potting and smooth curing of printed circuit boards, and in particular to a device for potting and smooth curing of printed circuit boards. Background Art

[0002] Printed circuit boards are a common electrical component, mainly composed of pads, vias, mounting holes, wires, components, connectors, fillings, electrical boundaries, etc. They play an important role in the mass production of fixed circuits and optimizing the layout of electrical appliances.

[0003] After assembly, printed circuit boards need to be potted and cured before they can be installed on electrical appliances. Potting and curing are important steps to protect circuit board components, block air, and ensure the reliability of electrical connections. It is usually necessary to coat the circuit board with potting material and cure the potting material.

[0004] For example, a potting and anti-corrosion device for an integrated circuit board with announcement number CN211630525U is provided, which comprises a driving cylinder and a third motor, wherein the bottom end of the driving cylinder is fixedly connected to the fixing frame by bolts, and a push rod is movably installed at the bottom end of the driving cylinder, so that the fourth roller drives the clamping frame to move up and down through the third belt, and then drives the hose to move up and down through the clamping frame, so that the hose can move downward to the surface of the integrated circuit board during potting. After the surface of the integrated circuit board is potted with sealant, the driving cylinder pushes the push rod downward, so that the push rod drives the pressure plate to move downward until it is against the integrated circuit board, so that the pressure plate applies a force to the integrated circuit board, so that the sealant is flattened on the surface of the integrated circuit board, so that the thickness of the sealant will not be uneven after curing, thereby facilitating the later assembly of the integrated circuit board.

[0005] However, the above-mentioned prior art still has some defects when it comes to potting and curing the circuit board: 1. The circuit board may be bent due to manufacturing or transportation, resulting in a slightly uneven surface, and then the thickness of the glue layer on the surface of the circuit board is uneven during the potting process of the circuit board. Although the above-mentioned prior art can also solve the problem of uneven thickness of the circuit board after the sealing glue is cured, it cannot solve the problem of uneven thickness of the surface glue layer caused by the uneven surface of the circuit board, and its applicability is poor.

[0006] 2. The components on the circuit board are usually installed on the circuit board by welding or plugging, so there is a certain gap between the circuit board and the components on its surface. Since the potting sealant is relatively thick and the gap between the circuit board and the components is small, the sealant flows to the gap between the components and the circuit board at a slow speed or even cannot enter the gap between the components and the circuit board, affecting the potting effect of the circuit.

[0007] Based on this, and in accordance with the above-mentioned viewpoints, there is still room for improvement in the existing technology for encapsulating and curing circuit boards. Summary of the invention

[0008] In order to solve the above-mentioned technical problems, the present application provides a printed circuit board potting and smooth curing device, which adopts the following technical solution: a printed circuit board potting and smooth curing device, comprising an operating table, wherein the operating table is symmetrically equipped with a T-shaped support frame along the middle of its length direction, and a plurality of lifting plates evenly distributed along its length direction are installed on the operating table, and an adjustment mechanism is installed on the lifting plate. The operating table is also provided with a potting tube that moves along its length direction.

[0009] The adjustment mechanism includes an adjustment block which is symmetrically arranged to slide along the length direction of the lifting plate on the side of the lifting plate away from the operating table, and an elastic telescopic rod is installed on the side of the lifting plate away from the operating table and between the two adjustment blocks. A fine-tuning plate that cooperates with the adjustment block is installed on the telescopic end of the elastic telescopic rod, and a plurality of vacuum suction cups are evenly installed on the upper end surface of the fine-tuning plate along the circumference of its length direction.

[0010] The side of the potting tube close to the operating table is evenly provided with multiple feeding ports along the width direction of the operating table. Multiple annular frames staggered with the feeding ports are slidably installed on the potting tube, and a flexible rubber rod is installed on the outer wall of the annular frame and on the side close to the operating table.

[0011] Preferably, placement grooves are provided on opposite sides of the support frame, and moving blocks symmetrically distributed along the length direction of the support frame are slidably arranged on the side of the horizontal section of the support frame away from the operating table, and a fixed protrusion is installed in the middle part of the side of the horizontal section of the support frame away from the operating table, and a bidirectional screw extending along the length direction of the horizontal section of the support frame is rotatably installed on the fixed protrusion, and the threaded sections of the bidirectional screw are respectively transmission connected to the moving blocks on the same side by threaded connections.

[0012] A support frame is installed between two moving blocks located in the length direction of the operating table.

[0013] Preferably, the placement groove is provided with a clearance groove on the side away from the operating table, and a lower pressure plate is arranged inside the clearance groove. A driving rod corresponding to the moving block is installed on the side of the lower pressure plate away from the operating table, and the driving rods pass through the supporting bracket on the same side. A fixed block is installed on the side of the driving rod away from the corresponding lower pressure plate, and a return spring is sleeved on the driving rod, whose two ends are respectively connected to the fixed block and the corresponding supporting bracket, and an adjusting connecting block for adjusting the height of the corresponding fixed block is installed on the moving block.

[0014] Preferably, inclined slopes are provided on the opposite surfaces of the adjusting blocks on the same lifting plate. On one side of the fine-tuning plate close to the adjusting block, supporting protrusions corresponding to the adjusting blocks are provided, and the supporting protrusions are abutted against the inclined slopes. A bidirectional threaded rod is rotatably installed on the lifting plate through a bearing, and the threaded sections of the bidirectional threaded rod are respectively connected to the adjusting blocks on the same side in a threaded connection manner for transmission.

[0015] Preferably, connecting protrusions symmetrically distributed along the length direction of the horizontal section are installed on the vertical sections of the supporting brackets. A supporting rod is jointly installed between the two connecting protrusions along the length direction of the operating table. Two height-adjusting plates in a figure-eight structure are installed between the lifting plate and the corresponding sliding frame, and the height-adjusting plates are respectively slidably connected to the corresponding supporting rods.

[0016] Preferably, sliding frames corresponding to the lifting plates are slidably and limitedly arranged on the operating table. On the upper end surfaces of the sliding frames, distance-adjusting blocks symmetrically distributed along the width direction of the operating table are slidably arranged. One ends of the height-adjusting plates far from the operating table are respectively slidably connected to the corresponding lifting plates, and one ends of the adjusting plates close to the operating table are respectively abutted against the corresponding distance-adjusting blocks.

[0017] Preferably, a push plate is slidably arranged through the distance-adjusting blocks on one side of the operating table along the length direction. Double-acting cylinders are installed on the opposite surfaces of the vertical sections of the supporting brackets through cylinder seats, and the telescopic ends of the double-acting cylinders are respectively connected to the corresponding push plates. Limit rods symmetrically distributed along the length direction are installed on the sliding frames, and limit plates corresponding to the limit rods are installed on the lifting plates, and the limit rods penetrate through the corresponding limit plates.

[0018] Preferably, a U-shaped frame with an opening facing the operating table is slidably arranged on the operating table. Fixed connecting blocks symmetrically distributed along the width direction of the horizontal section of the U-shaped frame are installed on the horizontal section of the U-shaped frame close to the operating table, and the potting tube is installed on the two fixed connecting blocks. A linkage rod is jointly installed on one side of the annular frame close to the horizontal section of the U-shaped frame. A connecting block is arranged on the horizontal section of the U-shaped frame and close to the operating table, and a second elastic telescopic rod is installed on the connecting block. The telescopic end of the second elastic telescopic rod is connected to one end of the linkage rod close to the fixed connecting block.

[0019] Preferably, vertical frames corresponding to the supporting brackets are installed on the operating table. A linkage frame is jointly installed between the vertical frames. A plurality of trapezoidal blocks evenly distributed along the length direction of the linkage frame are installed on one side of the linkage frame close to the potting tube. A roller matched with the trapezoidal blocks is installed on one end of the linkage rod close to the linkage frame.

[0020] Preferably, an oscillating rod with an L-shaped structure is arranged on the annular frame close to the second elastic telescopic rod, and the horizontal section of the oscillating rod is detachably connected to the corresponding annular frame.

[0021] In summary, the present application includes at least one of the following beneficial technical effects:

[0022] 1. The present invention can smooth the surface of the printed circuit board, avoid the problem of uneven thickness of the surface adhesive layer caused by the uneven surface defects of the circuit board, so that the printed circuit board can be smoothly installed on the electrical appliance, and improve the later assembly effect of the printed circuit board.

[0023] 2. The annular frame designed in the present invention moves back and forth along the length direction of the operating table driven by the potting tube. During the movement of the annular frame, the flexible rubber rod can be driven to stir the potted sealant, thereby puncturing the gas inside the sealant to discharge the gas, thereby reducing the possibility of bubbles inside the sealant after solidification, resulting in a deterioration in the sealing effect of the glue layer, and improving the potting and curing effect of the printed circuit board.

[0024] 3. The annular frame designed in the present invention can synchronously move back and forth along the width direction of the operating table, so that the flexible rubber rod can stir the sealant in a wave-like manner, extend the stirring path of the flexible rubber rod and increase its stirring area, so that the flexible rubber rod stirs the sealant more fully, and further improves the effect of the flexible rubber rod on removing bubbles inside the sealant. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a three-dimensional structural schematic diagram of the present invention.

[0026] Figure 2 It is a schematic diagram of the three-dimensional structure of the regulating mechanism of the present invention.

[0027] Figure 3 It is a schematic diagram of the three-dimensional installation structure between the potting tube, the annular frame and the flexible rubber rod of the present invention.

[0028] Figure 4 It is a schematic diagram of the three-dimensional installation structure between the support bracket, the bidirectional screw and the moving block of the present invention.

[0029] Figure 5 It is a schematic diagram of the three-dimensional installation structure between the lower pressing plate, the driving rod and the bidirectional screw etc. of the present invention.

[0030] Figure 6 The present invention Figure 5 A partial enlarged view of point A.

[0031] Figure 7 It is a partial three-dimensional structural schematic diagram of the present invention.

[0032] Figure 8 It is a schematic diagram of the three-dimensional installation structure between the sliding frame, the distance adjustment block and the height adjustment plate of the present invention.

[0033] Fig. 9 The present invention Figure 7 A partial enlarged view of point B.

[0034] Fig.10 It is a schematic diagram of the three-dimensional installation structure among the U-shaped frame, potting tube, vertical frame, etc. of the present invention.

[0035] Fig.11 It is a schematic diagram of the three-dimensional installation structure among the U-shaped frame, linkage rod, oscillating rod, etc. of the present invention.

[0036] Fig.12 is the present invention Fig.11 Partial enlarged view of part C.

[0037] Explanation of reference numerals in the drawings: 1, operating table; 11, sliding frame; 12, distance adjusting block; 121, pushing plate; 122, double-axis cylinder; 123, limiting rod; 124, limiting plate; 13, rectangular block; 14, limiting connecting frame; 2, supporting bracket; 21, placing groove; 211, relief groove; 212, lower pressing plate; 213, driving rod; 214, fixing block; 215, return spring; 216, adjusting connecting block; 22, moving block; 23, bidirectional screw; 24, support frame; 25, supporting rod; 26, height adjusting plate; 3, lifting plate; 4, adjusting mechanism; 41, adjusting block; 42, elastic telescopic rod I; 43, fine-tuning plate; 44, vacuum chuck; 45, bidirectional threaded rod; 5, potting tube; 51, annular frame; 511, oscillating rod; 52, flexible rubber rod; 53, U-shaped frame; 54, fixing connecting block; 55, linkage rod; 551, roller; 56, connecting connecting block; 57, elastic telescopic rod II; 58, vertical frame; 59, linkage frame; 50, trapezoidal block. Detailed implementation manners

[0038] The following will further elaborate on this application with reference to the Figures 1 to 12 drawings.

[0039] The embodiment of this application discloses a printing circuit board potting and smooth curing device, which can support or pull down the surface of a long circuit board to ensure that the surface of the long circuit board is flat, avoid the problem of uneven thickness of the surface glue layer, and at the same time increase the rate of the sealant entering between the components and the long circuit board.

[0040] Embodiment 1:

[0041] Refer to Figure 1 , a printing circuit board potting and smooth curing device, including an operating table 1. Symmetrically installed on the middle part of the operating table 1 along its length direction is a support bracket 2 with a T-shaped structure. A plurality of lifting plates 3 evenly distributed along the length direction are installed on the operating table 1, which can support the depressions on the surface of the printing circuit board. An adjusting mechanism 4 is installed on the lifting plate 3. A potting tube 5 that moves along the length direction is also provided on the operating table 1 to fill the printing circuit board with sealant.

[0042] Refer to Figure Figure 2The adjustment mechanism 4 includes an adjustment block 41 which is symmetrically slidably arranged on the side of the lifting plate 3 away from the operating table 1 and along the length direction of the lifting plate 3. An elastic telescopic rod 42 is installed on the side of the lifting plate 3 away from the operating table 1 and between the two adjustment blocks 41. A fine-tuning plate 43 matching with the adjustment block 41 is installed at the telescopic end of the elastic telescopic rod 42. The adjustment block 41 can drive the fine-tuning plate 43 to rise and fall. A plurality of vacuum suction cups 44 are evenly installed on the upper end surface of the fine-tuning plate 43 along its length direction to adsorb the printed circuit board.

[0043] When the surface of the printed circuit board is concave, the lifting plate 3 designed in the present invention can support the printed circuit board during the lifting process. When the degree of concaveness of the surface of the printed circuit board is different, the fine-tuning plate 43 can be driven to lift and lower to perform fine-tuning on different positions of the printed circuit board, which has stronger applicability. When the surface of the printed circuit board is convex, the fine-tuning plate 43 is driven to rise and then the convex part of the printed circuit board is adsorbed by the vacuum suction cup 44 and then the fine-tuning plate 43 is driven to move to one side of the operating table 1 to make the convex part of the printed circuit board flat. Then, the surface of the printed circuit board can be flattened by the above method, avoiding the problem of uneven thickness of the surface glue layer caused by the uneven surface of the circuit board, which makes the printed circuit board unable to adapt to the electrical appliance, so that the printed circuit board can be smoothly installed on the electrical appliance, thereby improving the later assembly effect of the printed circuit board.

[0044] See also Figure 3 A plurality of discharge ports are evenly arranged on one side of the potting tube 5 close to the operating table 1 along the width direction of the operating table 1. A plurality of annular frames 51 staggered with the discharge ports are slidably mounted on the potting tube 5. A flexible rubber rod 52 is mounted on the outer wall of the annular frame 51 close to the operating table 1 to stir the sealant.

[0045] The annular frame 51 designed in the present invention is driven by the potting tube 5 to reciprocate along the length direction of the operating table 1. During the movement of the annular frame 51, the flexible rubber rod 52 can be driven to stir the potted sealant, thereby puncturing the gas inside the sealant to discharge the gas, reducing the possibility of bubbles inside the sealant after solidification, resulting in poor sealing effect of the glue layer, and improving the potting and curing effect of the printed circuit board. The flexible rubber rod 52 can stir the sealant. When the flexible rubber rod 52 touches the components on the printed circuit board, the flexible rubber rod 52 can bend to make way for the components, thereby avoiding the possibility of the flexible rubber rod 52 damaging the components on the printed circuit board.

[0046] See also Figure 4 and Figure 5, placement grooves 21 are provided on the opposite sides of the support bracket 2 for placing printed circuit boards, and moving blocks 22 symmetrically distributed along the length direction of the support bracket 2 are slidably provided on the side of the horizontal section of the support bracket 2 away from the operating table 1, and a fixed protrusion is installed in the middle part of the side of the horizontal section of the support bracket 2 away from the operating table 1, and a bidirectional screw 23 extending along the length direction of the horizontal section of the support bracket 2 is rotatably installed on the fixed protrusion, driving the two moving blocks 22 to move synchronously, and the threaded sections of the bidirectional screw 23 are respectively connected to the moving blocks 22 on the same side by threaded connection.

[0047] A support frame 24 is installed between two moving blocks 22 located in the length direction of the operating table 1 to support the printed circuit board.

[0048] The support frame 24 is an L-shaped structure. During operation, the two ends of the printed circuit board are manually inserted into the corresponding placement grooves 21. At this time, the printed circuit board is located between the support frames 24, and the bidirectional screw 23 is driven to rotate by an external driving force (motor, manual screw, etc.). During the rotation of the bidirectional screw 23, the moving block 22 on the corresponding side is driven to move toward each other. During the movement of the moving block 22 toward each other, the support frame 24 is simultaneously driven to move. When the support frame 24 moves to both sides of the printed circuit board, its horizontal section can support the printed circuit board, wherein the side of the horizontal section of the support frame 24 close to the printed circuit board is exactly flush with the side of the printed circuit board close to the operating table 1, and the opposite surface of the horizontal section of the support frame 24 is provided with a guiding inclined surface, which can ensure that the uneven part of the printed circuit board plays a guiding role, so that the printed circuit board can be completely moved to the horizontal section of the support frame 24, avoiding rigid collision between the uneven part of the printed circuit board and the opposite surface of the horizontal section of the support frame 24.

[0049] See also Figure 5 and Figure 6 A clearance groove 211 is provided on the side of the placement groove 21 away from the operating table 1, and a lower pressure plate 212 is arranged inside the clearance groove 211, which plays a locking and limiting role on the printed circuit board. A driving rod 213 corresponding to the moving block 22 is installed on the side of the lower pressure plate 212 away from the operating table 1, and the driving rod 213 runs through the supporting bracket 2 on the same side. A fixed block 214 is installed on the side of the driving rod 213 away from the corresponding lower pressure plate 212. A reset spring 215 is sleeved on the driving rod 213, and its two ends are respectively connected to the fixed block 214 and the corresponding supporting bracket 2, which plays a reset role on the fixed block 214. An adjusting connecting block 216 for adjusting the height of the corresponding fixed block 214 is installed on the moving block 22.

[0050] The opposite surface of the adjusting connecting block 216 is provided with a guiding inclined surface matched with the fixed block 214. During specific operation, the movable block 22 drives the adjusting connecting block 216 to move toward each other during the movement. The guiding inclined surface of the adjusting connecting block 216 can drive the fixed block 214 to move toward one side of the supporting bracket 2 during the movement. During the movement of the fixed block 214, the return spring 215 is compressed and the lower pressing plate 212 is driven to contact the printed circuit board through the driving rod 213, and then the lower pressing plate 212 can press down the printed circuit board. After the pressing is completed, the adjusting connecting block 216 is reset by the driving of the movable block 22. At this time, the elastic force of the reset spring 215 can drive the fixed block 214 to reset, and then the fixed block 214 drives the lower pressing plate 212 to reset through the driving rod 213.

[0051] Therefore, the printed circuit board can be limited by the cooperation between the support frame 24 and the lower pressure plate 212 to prevent the printed circuit board from shaking and ensure the stability of the printed circuit board during the subsequent leveling process. At the same time, the vertical section of the support frame 24 and the lower pressure plate 212 can also block the sealant encapsulated in the printed circuit board to prevent the sealant from flowing outward around the printed circuit board to cause environmental pollution and waste of sealant.

[0052] After the printed circuit board is fixed and limited, the levelness of the surface of the printed circuit board is detected by an existing level meter (not shown in the figure), and the protruding or recessed parts of the printed circuit board are marked.

[0053] See also Figure 7 and Figure 8 The vertical sections of the support frame 2 are equipped with connecting protrusions symmetrically distributed along the length direction of the horizontal section thereof, a supporting rod 25 is installed between the two connecting protrusions along the length direction of the operating platform 1, and two height-adjusting plates 26 with an eight-shaped structure are installed between the lifting plate 3 and the corresponding sliding frame 11. The height-adjusting plates 26 are respectively slidably connected to the corresponding supporting rods 25, and the height-adjusting plates 26 can also rotate around the supporting rods 25.

[0054] The upper limit sliding arrangement of the operating platform 1 is a sliding frame 11 corresponding to the lifting plate 3 one by one, and the upper end surface of the sliding frame 11 is slidably provided with a distance adjusting block 12 symmetrically distributed along the width direction of the operating platform 1, and the end of the height adjusting plate 26 away from the operating platform 1 is slidably connected to the corresponding lifting plate 3, and the end of the adjustment plate close to the operating platform 1 is abutted against the corresponding distance adjusting block 12.

[0055] Rectangular blocks 13 are symmetrically installed along the length direction of the operating platform 1 and on one side of the width direction of the operating platform 1 , and limited position connecting frames 14 are slidably arranged between the rectangular blocks 13 .

[0056] Lift the limit connecting frame 14 upwards, and push the sliding frame 11 to move to the marked position of the uneven part of the printed circuit board, and then reset the limit connecting frame 14. At this time, the limit connecting frame 14 is squeezed downward by an external driving force (counterweight block, etc.), so that the limit connecting frame 14 can fix the sliding frame 11 on the operating table 1, so as to prevent the sliding frame 11 from shaking during the potting and curing process, which affects the potting and curing effect of the printed circuit board.

[0057] When the depression degree of the surface of the printed circuit board is the same, after the sliding frame 11 is limited, the distance adjusting block 12 is pushed to move toward each other along the corresponding sliding frame 11. During the movement of the distance adjusting block 12, the height adjusting plate 26 is driven to rotate around the supporting rod 25. At this time, the angle between the height adjusting plates 26 with an eight-shaped structure is reduced. At this time, the end of the height adjusting plate 26 away from the distance adjusting block 12 slides on the lifting plate 3 and drives the lifting plate 3 to move away from the operating table 1. The vacuum suction cup 44 is adsorbed on the printed circuit board. At this time, the lifting plate 3 can support the depression on the surface of the printed circuit board through the fine-tuning plate 43 during the movement of the lifting plate 3, thereby ensuring the flatness of the surface of the printed circuit board and avoiding the problem of uneven thickness of the glue layer during the subsequent sealant pouring and curing process.

[0058] When the raised degree of the surface of the printed circuit board is the same, the distance adjusting block 12 is pushed to move toward each other along the corresponding sliding frame 11. During the movement of the distance adjusting block 12, the height adjusting plate 26 is driven to rotate around the supporting rod 25. At this time, the angle between the height adjusting plates 26 with an eight-shaped structure is reduced. At this time, the end of the height adjusting plate 26 away from the distance adjusting block 12 slides on the lifting plate 3 and drives the lifting plate 3 to move. During the movement of the lifting plate 3, the vacuum suction cup 44 is adsorbed on the printed circuit board through the fine adjustment plate 43. At this time, the elastic telescopic rod 42 is stretched to drive the distance adjusting block 12 to move the distance adjusting plate 26. The distance blocks 12 move away from each other, and the adjustment blocks 41 move away from each other, driving the height adjustment plates 26 to rotate around the supporting rods 25. At this time, the angle between the height adjustment plates 26 in an eight-shaped structure increases, and the end of the height adjustment plates 26 away from the distance adjustment blocks 12 slides on the lifting plate 3 and drives the lifting plate 3 to move toward the operating table 1. During the movement of the lifting plate 3, the elastic telescopic rod 42 is reset and drives the protruding part of the printed circuit board to move through the cooperation of the fine-tuning plate 43 and the vacuum suction cup 44, so that the protruding part of the printed circuit board can be pulled and leveled.

[0059] See also Fig. 9In order to reduce the tediousness of pushing the distance adjusting block 12 one by one, the pushing plate 121 and the double-axis cylinder 122 provided by the present invention cooperate with each other to drive the distance adjusting block 12 to move synchronously. Specifically, the distance adjusting block 12 located on one side of the length direction of the operating table 1 is provided with a pushing plate 121 that penetrates and slides therethrough, and the opposite sides of the vertical sections of the supporting frame 2 are provided with double-axis cylinders 122 through cylinder seats, and the telescopic ends of the double-axis cylinders 122 are respectively connected to the corresponding pushing plates 121, and the sliding frame 11 is provided with limit rods 123 that are symmetrically distributed along its length direction, and the lifting plate 3 is provided with limit plates 124 corresponding to the limit rods 123, and the limit rods 123 penetrate the corresponding limit plates 124.

[0060] The sliding cooperation between the pushing plate 121 and the distance adjusting block 12 can ensure that the distance adjusting block 12 will not interfere with the pushing plate 121 when it moves along the length direction of the operating table 1. During specific operation, when it is necessary to drive the distance adjusting block 12 to move, the double-axis cylinder 122 is started. The telescopic ends of the double-axis cylinder 122 move toward each other, driving the pushing plate 121 to move toward each other. The pushing plate 121 can drive the distance adjusting block 12 to move during the movement toward each other. Then, the pushing plate 121 and the double-axis cylinder 122 cooperate with each other to drive the distance adjusting block 12 to move synchronously. The limiting plate 124 and the limiting rod 123 cooperate with each other to limit the lifting plate 3 to prevent the lifting plate 3 from tilting and affecting the flatness of the printed circuit board.

[0061] Replay Figure 2 When the degree of depression of the surface of the printed circuit board is different, the lifting plate 3 is synchronously moved to the specified position, and then the position of the fine-tuning plate 43 is adjusted. Specifically, the opposite surfaces of the adjustment blocks 41 on the same lifting plate 3 are provided with inclined slopes, and the side of the fine-tuning plate 43 close to the adjustment block 41 is provided with a supporting protrusion corresponding to the adjustment block 41, and the supporting protrusion rests on the inclined slope. A bidirectional threaded rod 45 is rotatably installed on the lifting plate 3 through a bearing, and the threaded sections of the bidirectional threaded rod 45 are respectively transmission connected with the adjustment block 41 on the same side through a threaded connection.

[0062] During specific operation, the lifting plate 3 is moved to the specified position through the height adjustment plate 26. At this time, the bidirectional threaded rod 45 is rotated according to the recessed parts marked on the printed circuit board so that the bidirectional threaded rod 45 rotates different numbers of times. During the rotation of the bidirectional threaded rod 45, the adjustment block 41 is driven to move toward each other. During the movement of the adjustment block 41, the fine-tuning plate 43 is driven to move toward one side of the printed circuit board through the supporting protrusion. At this time, the fine-tuning plate 43 can support different recessed parts of the printed circuit board.

[0063] When the degree of protrusion on the surface of the printed circuit board is different, the lifting plate 3 is moved to the specified position through the height adjustment plate 26. At this time, the bidirectional threaded rod 45 is rotated according to the depression marked on the printed circuit board so that the bidirectional threaded rod 45 rotates different times. During the rotation of the bidirectional threaded rod 45, the adjusting block 41 is driven to move toward each other. During the movement of the adjusting block 41, the fine-tuning plate 43 is driven to move toward one side of the printed circuit board through the supporting protrusion. At this time, the elastic telescopic rod 42 is stretched. When the fine-tuning plate 43 contacts the printed circuit board and the vacuum suction cup 44 is adsorbed on the printed circuit board, the bidirectional screw 23 is rotated in the opposite direction to drive the adjusting block 41 to reset. At this time, the elastic telescopic rod 42 drives the fine-tuning plate 43 to reset. Then, the fine-tuning plate 43 can pull and level the different protrusions of the printed circuit board.

[0064] When the surface of the printed circuit board is uneven, the lifting plate 3 is moved to the specified position by the height adjustment plate 26, and the sliding frame 11 is moved to the specified position. The above-mentioned working steps with different degrees of protrusion on the surface of the printed circuit board are repeated at the protruding parts of the printed circuit board, and the above-mentioned working steps with different degrees of depression on the surface of the printed circuit board are repeated at the depressed parts of the printed circuit board, so that the surface of the printed circuit board can be leveled.

[0065] Furthermore, the above method can be used to smooth the uneven surfaces on the surface of the printed circuit board, wherein the vacuum suction cup 44 is connected to an external air pump through an existing pipeline (not shown in the figure), and when the vacuum suction cup 44 is in contact with the printed circuit board, the external air pump is started to discharge the air inside the vacuum suction cup 44 through the existing pipeline. At this time, due to the pressure difference between the inside and outside of the vacuum suction cup 44, the vacuum suction cup 44 is adsorbed on the printed circuit board. When the vacuum suction cup 44 needs to be removed from the printed circuit board, the vacuum suction cup 44 is inflated by the external air pump. At this time, the pressure difference between the inside and outside of the vacuum suction cup 44 is consistent, and the vacuum suction cup 44 is separated from the printed circuit board.

[0066] When the surface of the printed circuit board is flattened and corrected, the printed circuit board is potted. In the specific operation, the external sealant is pumped into the potting tube 5 through the pump body through the feed port on the potting tube 5. At this time, the external drive (electric slider, etc.) drives the mold frame 53 along the Figure 1 The potting tube 5 moves in the direction of the arrow, wherein in the starting position, the molding frame 53 is on the operating table 1 and is located at the end in the opposite direction of the arrow. During the movement of the potting tube 5, the sealant inside it leaks out through the discharge port and is spread on the printed circuit board. During the movement of the potting tube 5, the annular frame 51 can drive the flexible rubber rod 52 to stir the potted sealant, and then the gas inside the sealant can be punctured to discharge the gas, thereby reducing the possibility of bubbles inside the sealant after solidification, resulting in a deterioration in the sealing effect of the glue layer, thereby improving the potting and curing effect of the printed circuit board.

[0067] See also Figures 10 to 12, in order to further reduce the possibility of air bubbles existing inside the sealant, the present invention can make the flexible rubber rod 52 reciprocate in the width direction of the operating table 1 during the movement, that is, the stirring area of the flexible rubber rod 52 in the sealant can be increased. Specifically, a U-shaped frame 53 with an opening facing the operating table 1 is slidably arranged on the operating table 1. Fixed connecting blocks 54 symmetrically distributed along the width direction of the horizontal section of the U-shaped frame 53 are installed on the horizontal section of the U-shaped frame 53 close to the operating table 1, and the potting tube 5 is installed on the two fixed connecting blocks 54. A linkage rod 55 is commonly installed on one side of the annular frame 51 close to the horizontal section of the U-shaped frame 53. A connecting connecting block 56 is arranged on the horizontal section of the U-shaped frame 53 and close to the operating table 1. An elastic telescopic rod two 57 is installed on the connecting connecting block 56, and the telescopic end of the elastic telescopic rod two 57 is connected to the end of the linkage rod 55 close to the fixed connecting block 54.

[0068] Vertical frames 58 corresponding to the supporting brackets 2 one by one are installed on the operating table 1. A linkage frame 59 is commonly installed between the vertical frames 58. A plurality of trapezoidal blocks 50 evenly distributed along the length direction of the linkage frame 59 are installed on one side of the linkage frame 59 close to the potting tube 5. A roller 551 matched with the trapezoidal block 50 is installed at one end of the linkage rod 55 close to the linkage frame 59 to reduce the friction between the linkage rod 55 and the trapezoidal block 50.

[0069] Among them, the minimum distance of the trapezoidal block 50 in the width direction of the operating table 1 is less than the distance between adjacent blanking ports, so as to avoid the annular frame 51 coinciding with the blanking port during the reciprocating movement, affecting the blanking effect of the sealant, and at the same time avoiding the annular frame 51 being adhered with sealant, resulting in mutual adhesion between the annular frame 51 and the potting tube 5 and affecting the reciprocating movement effect of the annular frame 51. Among them, the waist of the trapezoidal block 50 that first contacts the roller 551 at the starting position is called waist one, and the other waist of the trapezoidal block 50 is called waist two.

[0070] During specific operation, when the U-shaped frame 53 moves, it drives the potting tube 5 to move synchronously. At this time, the potting tube 5 drives the linkage rod 55 to move synchronously through the annular frame 51. When the linkage rod 55 moves through the roller 551 and contacts waist one of the trapezoidal block 50, the linkage rod 55 moves to the side away from the linkage frame 59. At this time, the elastic telescopic rod two 57 is compressed, and the linkage rod 55 drives the flexible rubber rod 52 to move synchronously through the annular frame 51. When the linkage rod 55 moves out of waist one through the roller 551 and continues to move along the side of the trapezoidal block 50 away from the linkage frame 59, when the linkage rod 55 moves to waist two through the roller 551, at this time, the elastic telescopic rod two 57 resets and drives the linkage rod 55 to move towards the direction close to the linkage frame 59. When the linkage rod 55 moves out of waist two through the roller 551, at this time, the linkage rod 55 drives the flexible rubber rod 52 to return to the starting position synchronously through the annular frame 51.

[0071] Therefore, the multiple trapezoidal blocks 50 cooperate with each other to enable the flexible rubber rod 52 to move in the width direction of the operating table 1 while moving in the length direction of the operating table 1, so that the flexible rubber rod 52 can stir the sealant in a wave-like manner, extend the stirring path of the flexible rubber rod 52 and increase its stirring area, so that the flexible rubber rod 52 stirs the sealant more fully, and further improves the effect of the flexible rubber rod 52 on removing bubbles inside the sealant.

[0072] At the same time, the reciprocating flexible rubber rod 52 can also give external force to the sealant, so that the sealing block is in a flowing state on the printed circuit board, speeding up the speed at which the sealant enters the gap between the components and the printed circuit board, and improving the potting effect of the sealant.

[0073] When potting is completed and the sealant on the sealing plate is cured, all the components of the device are reset and the printed circuit board after potting and curing is taken out.

[0074] Embodiment 2:

[0075] See also Fig.11 On the basis of the first embodiment, the present invention further provides an oscillation rod 511 that can drive the printed circuit board to vibrate. Specifically, an L-shaped oscillation rod 511 is provided on the ring frame 51 close to the second elastic telescopic rod 57, and the horizontal section of the oscillation rod 511 is connected to the corresponding ring frame 51 in a detachable manner.

[0076] The inclination of the waist 2 is greater than that of the waist 1, so that the linkage rod 55 obtains a faster speed when it is reset through the roller 551. The oscillation rod 511 is installed on the ring frame 51 close to the elastic telescopic rod 2 57 through a threaded connection. Before the support frame 24 supports the printed circuit board, the oscillation rod 511 is removed. At this time, the oscillation rod 511 is tightly against the support frame 24 on the side away from the linkage frame 59. When the support frame 24 completes the support of the printed circuit board, the oscillation rod 511 is reset. When the linkage rod 55 moves to the waist 2 through the roller 551, the elastic telescopic rod 2 57 is reset. The linkage rod 55 is driven to move quickly toward the direction approaching the linkage frame 59. When the linkage rod 55 is moved out of the waist through the roller 551, the linkage rod 55 cooperates with the oscillation rod 511 through the annular frame 51 to give an impact force to the support frame 24 on the side away from the linkage frame 59. Therefore, the linkage rod 55 can drive the oscillation rod 511 to reciprocate and knock the support frame 24 on this side during the reciprocating movement, thereby driving the printed circuit board to vibrate and the sealant to vibrate at the same time. Therefore, during the vibration of the printed circuit board, the speed at which the sealant enters the gap between the components and the printed circuit board can be further accelerated, thereby improving the sealing effect of the sealant.

[0077] The implementation principle of the present invention is:

[0078] (1): Manually insert the two ends of the printed circuit board into the corresponding placement grooves 21 respectively. At this time, the printed circuit board is located between the support frames 24. The bidirectional screw 23 is driven to rotate by an external driving force (motor, manual screw, etc.). During the rotation of the bidirectional screw 23, the moving block 22 on the corresponding side is driven to move toward each other. During the movement of the moving block 22, the support frame 24 is simultaneously driven to move, thereby supporting the printed circuit board. During the movement of the moving block 22, the adjusting connecting block 216 is driven to move toward each other. During the movement of the adjusting connecting block 216, its guiding inclined surface can drive the fixed block 214 to move toward one side of the support frame 2. During the movement of the fixed block 214, the return spring 215 is compressed, and the lower pressing plate 212 is driven to contact the printed circuit board through the driving rod 213, so that the lower pressing plate 212 can press down the printed circuit board.

[0079] (2): During the movement of the distance adjusting block 12, the height adjusting plate 26 is driven to rotate around the supporting rod 25. At this time, the angle between the height adjusting plates 26 in the eight-shaped structure changes, so that during the movement of the lifting plate 3, the surface of the printed circuit board can be supported or pulled down for flattening through the cooperation of the fine-tuning plate 43 and the vacuum suction cup 44.

[0080] (3): The external sealant is pumped into the filling tube 5 through the pump body and the feed port on the filling tube 5. At this time, the external drive (electric slider, etc.) drives the mold frame 53 along the filling tube 5. Figure 1 The potting tube 5 moves in the direction of the arrow, wherein in the starting position, the mold frame 53 is on the operating table 1 and is located at the end in the opposite direction of the arrow. During the movement of the potting tube 5, the sealant inside it leaks out through the discharge port and is spread on the printed circuit board. During the movement of the potting tube 5, the annular frame 51 can drive the flexible rubber rod 52 to stir the potted sealant, thereby puncturing the gas inside the sealant to discharge the gas.

[0081] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0082] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A printed circuit board potting and stable curing device, comprising an operating table (1), characterized in that: The operating table (1) is symmetrically provided with a T-shaped support frame (2) along the middle of its length direction, a plurality of lifting plates (3) evenly distributed along its length direction are installed on the operating table (1), an adjustment mechanism (4) is installed on the lifting plates (3), and a potting tube (5) movable along its length direction is also provided on the operating table (1), wherein: The opposite sides of the support frame (2) are provided with placement grooves (21), and the side of the horizontal section of the support frame (2) away from the operating table (1) is slidably provided with moving blocks (22) symmetrically distributed along the length direction of the support frame (2), and the middle part of the side of the horizontal section of the support frame (2) away from the operating table (1) is provided with a fixed protrusion, and the fixed protrusion is penetrated and rotatably provided with a bidirectional screw (23) extending along the length direction of the horizontal section of the support frame (2), and the threaded sections of the bidirectional screw (23) are respectively connected to the moving blocks (22) on the same side by threaded connection. A support frame (24) is installed between two moving blocks (22) located in the length direction of the operating table (1); The vertical sections of the support frame (2) are all provided with connecting protrusions symmetrically distributed along the length direction of the horizontal section thereof, a supporting rod (25) is installed between two connecting protrusions along the length direction of the operating table (1), and two height adjustment plates (26) in an eight-shaped structure are installed between the lifting plate (3) and the corresponding sliding frame (11), and the height adjustment plates (26) are respectively slidably connected to the corresponding supporting rods (25); The adjustment mechanism (4) comprises an adjustment block (41) which is symmetrically slidably arranged on a side of the lifting plate (3) away from the operating table (1) and along the length direction of the lifting plate (3); an elastic telescopic rod (42) is installed on a side of the lifting plate (3) away from the operating table (1) and between two adjustment blocks (41); a fine adjustment plate (43) which cooperates with the adjustment block (41) is installed at the telescopic end of the elastic telescopic rod (42); and a plurality of vacuum suction cups (44) are evenly installed on the upper end surface of the fine adjustment plate (43) along the length direction thereof; The opposite surfaces of the adjustment block (41) on the same lifting plate (3) are all provided with inclined surfaces, and a support protrusion corresponding to the adjustment block (41) is provided on one side of the fine-tuning plate (43) close to the adjustment block (41), and the support protrusion abuts against the inclined surface. A bidirectional threaded rod (45) is rotatably mounted on the lifting plate (3) through a bearing, and the threaded sections of the bidirectional threaded rod (45) are respectively transmission-connected with the adjustment block (41) on the same side through a threaded connection mode; A plurality of discharge openings are evenly arranged on a side of the potting tube (5) close to the operating table (1) along the width direction of the operating table (1); a plurality of annular frames (51) staggeredly matched with the discharge openings are slidably mounted on the potting tube (5); and a flexible rubber rod (52) is mounted on the outer side wall of the annular frame (51) close to the operating table (1).

2. The printed circuit board potting and stable curing device according to claim 1, characterized in that: The placement groove (21) is provided with a clearance groove (211) on the side away from the operating table (1), and a lower pressure plate (212) is arranged inside the clearance groove (211). A driving rod (213) corresponding to the moving block (22) is installed on the side of the lower pressure plate (212) away from the operating table (1), and the driving rod (213) passes through the support frame (2) on the same side. A fixed block (214) is installed on the side of the driving rod (213) away from the corresponding lower pressure plate (212). A return spring (215) is sleeved on the driving rod (213), and the two ends are respectively connected to the fixed block (214) and the corresponding support frame (2). An adjusting connecting block (216) for adjusting the height of the corresponding fixed block (214) is installed on the moving block (22).

3. The printed circuit board potting and stable curing device according to claim 1, characterized in that: The operating table (1) is provided with a sliding frame (11) on the upper limit position slidingly corresponding to the lifting plate (3), and the upper end surface of the sliding frame (11) is provided with distance adjustment blocks (12) symmetrically distributed along the width direction of the operating table (1) in a sliding manner. The end of the height adjustment plate (26) away from the operating table (1) is slidably connected to the corresponding lifting plate (3), and the end of the adjustment plate close to the operating table (1) is abutted against the corresponding distance adjustment block (12).

4. The printed circuit board potting and stable curing device according to claim 3, characterized in that: A push plate (121) is slidably provided on the distance adjustment block (12) located on one side of the operating table (1) in the length direction, and a double-axis cylinder (122) is installed on the back side of the vertical section of the support frame (2) through a cylinder seat, and the telescopic ends of the double-axis cylinder (122) are respectively connected to the corresponding push plate (121), and the sliding frame (11) is installed with a limit rod (123) symmetrically distributed along the length direction thereof, and a limit plate (124) corresponding to the limit rod (123) is installed on the lifting plate (3), and the limit rod (123) passes through the corresponding limit plate (124).

5. The printed circuit board potting and stable curing device according to claim 1, characterized in that: The operating table (1) is slidably provided with a profile frame (53) with an opening facing the operating table (1); a fixed connecting block (54) symmetrically distributed along the width direction of the horizontal section of the profile frame (53) is installed on the horizontal section of the profile frame (53) close to the operating table (1); and the sealing tube (5) is installed on the two fixed connecting blocks (54); a linkage rod (55) is installed on one side of the annular frame (51) close to the horizontal section of the profile frame (53); a connecting connecting block (56) is installed on the horizontal section of the profile frame (53) close to the operating table (1); and a second elastic telescopic rod (57) is installed on the connecting connecting block (56); and the telescopic end of the second elastic telescopic rod (57) is connected to the end of the linkage rod (55) close to the fixed connecting block (54).

6. The printed circuit board potting and stable curing device according to claim 5, characterized in that: The operating table (1) is provided with vertical frames (58) corresponding to the supporting frames (2) one by one, and a linkage frame (59) is installed between the vertical frames (58). A plurality of trapezoidal blocks (50) evenly distributed along the length direction of the linkage frame (59) are installed on one side of the linkage frame (59) close to the potting tube (5), and a roller (551) matching with the trapezoidal block (50) is installed on one end of the linkage rod (55) close to the linkage frame (59).

7. The printed circuit board potting and stable curing device according to claim 6, characterized in that: An L-shaped oscillating rod (511) is arranged on the annular frame (51) close to the second elastic telescopic rod (57), and a horizontal section of the oscillating rod (511) is connected to the corresponding annular frame (51) in a detachable manner.

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