Display panel and display device

Abstract

The present application provides a display panel and a display device, which belong to the field of display technology. The display panel has a display area and a frame area; the frame area includes a signal connection area and an isolation dam area arranged in sequence in a direction away from the display area, and there is a safety distance between the signal connection area and the isolation dam area. The signal connection area includes a driving substrate, a connection electrode, a connection definition layer, a conductive isolation structure and a packaging layer stacked in sequence. The conductive isolation structure is electrically coupled to the cathode, the connection electrode is electrically coupled to the power supply line, and the packaging layer includes an organic packaging layer. Among them, the connection definition layer defines a plurality of connection openings to expose the connection electrode; the conductive isolation structure protrudes from the connection definition layer and is in contact with the connection electrode through the connection opening; the conductive isolation structure is meshed to form a plurality of packaging openings, and the organic packaging layer is filled in the packaging opening and covers the conductive isolation structure. The display panel can shorten the leveling distance of the organic packaging layer and reduce the width of the frame.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the continuous development of display technology, under the process route scheme of the conductive suspension structure without mask, the conductive suspension structure needs to be set on the pixel definition layer to evaporate the film layer between each pixel and form an independent package.

[0003] Then, if the traditional fine metal mask (FMM) route design packaging solution is directly used in the frame packaging area, the conductive suspension structure covers the entire surface above the connecting electrode, is connected to the connecting electrode through a via, and then connected to the peripheral power supply line through the connecting electrode. This packaging solution will cause the leveling distance required for the organic packaging layer in the frame area to be too large, thereby increasing the width of the frame. Summary of the invention

[0004] The present application provides a display panel and a display device, aiming to solve the problem in the prior art that the conductive overhanging structure in the frame area of ​​the display panel covers the entire surface above the connecting electrode, resulting in an increase in the frame width.

[0005] In order to solve the above technical problems, the first technical solution provided by the present application is: to provide a display panel. The display panel has a display area and a frame area located around the display area; the frame area includes a signal connection area and an isolation dam area arranged in sequence in a direction away from the display area; there is a safety distance between the signal connection area and the isolation dam area.

[0006] In which, in a direction perpendicular to the display panel, the signal connection area includes a driving substrate, a connecting electrode, a connection definition layer, a conductive isolation structure and a packaging layer which are stacked in sequence; wherein the conductive isolation structure is electrically coupled to the cathode of the display area, and the connecting electrode is electrically coupled to the power supply line in the driving substrate; the packaging layer includes an organic packaging layer.

[0007] Among them, the conductive isolation structure protrudes from the connection definition layer and is arranged in a mesh shape to form multiple packaging openings; the connection definition layer defines multiple connection openings, the connection openings expose the connection electrodes, and the orthographic projection of the connection openings on the driving substrate is within the orthographic projection of the conductive isolation structure, and the conductive isolation structure contacts and conducts with the connection electrodes through the connection openings; the organic packaging layer fills the packaging openings and covers the conductive isolation structure.

[0008] In some embodiments, in a direction perpendicular to the display panel, the conductive isolation structure includes a conductive enclosure structure and a top structure that are stacked;

[0009] The conductive enclosure structure is arranged on a side of the connection definition layer away from the driving substrate, and the positive projection of the conductive enclosure structure on the driving substrate is in a mesh shape to enclose and form a plurality of packaging openings; the conductive enclosure structure covers the connection openings in a direction perpendicular to the driving substrate to contact and conduct with the connection electrodes through the connection openings;

[0010] The top structure is arranged on the upper surface of the conductive enclosure structure, covers the conductive enclosure structure, and extends out of the conductive enclosure structure in a direction parallel to the connection definition layer; the package opening exposes the connection definition layer.

[0011] In some embodiments, the display area is provided with a plurality of pixel openings arranged in an array, and sub-pixel units are provided in the pixel openings;

[0012] The opening area of ​​the package opening is not less than half of the opening area of ​​the pixel opening.

[0013] In some embodiments, the package openings are arranged in a plurality of rows along a direction away from the display area; wherein each row of package openings is staggered with respect to the package openings in an adjacent row.

[0014] In some embodiments, the connecting electrode has a plurality of hollow portions; the area of ​​the hollow portions is smaller than the area of ​​the package opening, and the orthographic projection of each package opening on the driving substrate covers the orthographic projection of at least one hollow portion on the driving substrate.

[0015] In some embodiments, the orthographic projection of each package opening on the driving substrate covers the orthographic projections of 2 to 4 hollow portions on the driving substrate.

[0016] In some embodiments, the connection opening includes a first opening extending along a first direction and a second opening extending along a second direction, the first opening and the second opening are interconnected to form a mesh-like connection channel, and the connection channel exposes the connection electrode; the conductive isolation structure is arranged at the connection channel to contact and conduct with the connection electrode through the connection channel; wherein the first direction intersects with the second direction.

[0017] In some embodiments, the connecting electrode is disposed in the same layer as the anode of the display area.

[0018] In some embodiments, the isolation dam region is provided with two dams spaced in sequence in a direction away from the display region; in a direction perpendicular to the display panel, the dam includes a dam base and a conductive isolation structure stacked in layers, for blocking the organic encapsulation layer;

[0019] The encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer; the organic encapsulation layer covers the display area and the signal connection area, and extends in the direction close to the isolation dam area, and the extension distance does not exceed the safety distance; the first inorganic encapsulation layer and the second inorganic encapsulation layer cover the display area and the frame area, and in the isolation dam area, the first inorganic encapsulation layer overlaps and is in contact with the second inorganic encapsulation layer.

[0020] In order to solve the above technical problem, the second technical solution provided by the present application is: to provide a display device. The display device includes a display panel as described in the above technical solution.

[0021] Beneficial effects of the present application: Different from the prior art, the present application provides a display panel and a display device, wherein the display panel has a display area and a frame area located around the display area; the frame area includes a signal connection area and an isolation dam area sequentially arranged in a direction away from the display area. In an embodiment of the present application, in a direction perpendicular to the display panel, the signal connection area includes a driving substrate, a connection electrode, a connection definition layer, a conductive isolation structure and a packaging layer stacked in sequence. Among them, by defining a plurality of connection openings on the connection definition layer to expose the connection electrode, and making the conductive isolation structure protrude from the connection definition layer and cover the connection opening, so as to contact and conduct with the connection electrode through the connection opening, so as to realize the electrical coupling of the cathode with the connection electrode through the conductive isolation structure, and then electrically coupling with the peripheral power supply line through the connection electrode, so as to realize signal connection, and by electrically coupling the conductive isolation structure with the connection electrode, the voltage drop between the cathode and the connection electrode can be reduced. Furthermore, by making the conductive isolation structure in a mesh shape to form a plurality of packaging openings, the organic packaging layer will be filled in the packaging openings during the leveling process, so that the conductive isolation structure has a more significant blocking effect on the organic packaging layer, which can effectively shorten the leveling distance of the organic packaging layer, and thus effectively shorten the safety distance between the signal connection area and the isolation dam area, thereby effectively reducing the width of the border of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] Figure 1 It is a schematic diagram of the planar structure of a display panel provided by a technical solution;

[0024] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of a display panel along the AA direction provided in an embodiment;

[0025] Figure 3 yes Figure 2 Schematic diagram of the plane structure corresponding to area A in the embodiment.

[0026] Figure 4 is a schematic diagram of the planar structure of a display panel provided in the first embodiment of the present application;

[0027] Figure 5 yes Figure 4 A schematic diagram of a local planar structure of region B in the embodiment;

[0028] Figure 6 yes Figure 5 A schematic cross-sectional structure diagram of a display panel taken along line BB shown;

[0029] Figure 7 is a schematic diagram of the planar structure of a display panel provided in the second embodiment of the present application;

[0030] Figure 8 is a schematic diagram of the planar structure of a display panel provided in the third embodiment of the present application;

[0031] Fig. 9 yes Figure 8 A schematic diagram of a cross-sectional structure along the CC direction of a display panel provided in an embodiment;

[0032] Fig.10 is a schematic cross-sectional structure diagram of an isolation dam area provided in an embodiment of the present application;

[0033] Fig.11 It is a schematic diagram of the structure of a display device provided in one embodiment of the present application.

[0034] Reference numerals:

[0035] 100-display panel; 101-display area; 102-frame area; 1021-signal connection area; 1022-isolation dam area; 10-driving substrate; 11-power supply wiring; 12-connecting electrode; 121-hollow portion; 13-substrate; 14-driving layer; 21-pixel definition layer; 211-conductive via; 212-pixel opening; 22-conductive isolation structure; 221-conductive structure; 222-roof structure; 23-encapsulation layer; 231-first inorganic encapsulation layer; 232-organic encapsulation layer; 233-second inorganic encapsulation layer; 24-first conductive isolation layer Isolation structure; 25-light-emitting layer; 26-cathode; 30-sub-pixel unit; 31-first sub-pixel unit; 32-second sub-pixel unit; 33-third sub-pixel unit; 41-connection definition layer; 411-connection opening; 4111-first opening; 4112-second opening; 50-second conductive isolation structure; 51-conductive enclosure structure; 511-packaging opening; 52-second top structure; 60-dam; 61-dam base; 62-third conductive isolation structure; D-safety distance; W-width; R-intrusion path; X-first direction; Y-second direction. DETAILED DESCRIPTION

[0036] The scheme of the embodiment of the present application is described in detail below in conjunction with the drawings of the specification.

[0037] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] The terms "first", "second" and "third" in this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second" and "third" can explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of this application are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0040] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0041] See also Figure 1-3 , Figure 1 is a schematic diagram of a planar structure of a display panel 100 provided by a technical solution, Figure 2 yes Figure 1 A schematic diagram of a partial cross-sectional structure of a display panel 100 provided in an embodiment, Figure 3 yes Figure 2 Schematic diagram of the planar structure corresponding to area A in the embodiment. In this embodiment, a display panel 100 is provided, which has a display area 101 and a frame area 102 located around the display area 101, and the frame area 102 includes a signal connection area 1021 and an isolation dam area 1022 arranged in sequence in a direction away from the display area 101. A safety distance D is reserved between the signal connection area 1021 and the isolation dam area 1022 to reserve a leveling area for the leveling of the organic encapsulation layer 232 to prevent the organic encapsulation layer 232 from overflowing.

[0042] Specifically, Figure 2As shown, in a direction perpendicular to the display panel 100, the signal connection area 1021 includes a driving substrate 10, a connecting electrode 12, a pixel definition layer 21, a conductive isolation structure 22 and an encapsulation layer 23 which are sequentially stacked. The pixel definition layer 21 is arranged on the side of the connecting electrode 12 away from the driving substrate 10 and covers the connecting electrode 12. The conductive isolation structure 22 includes a conductive structure 221 arranged on the pixel definition layer 21 and a roof structure 222 arranged on the conductive structure 221. The orthographic projection of the conductive structure 221 on the driving substrate 10 overlaps with the orthographic projection of the connecting electrode 12 on the driving substrate 10 at least partially. The pixel definition layer 21 located in the overlapping area is provided with a plurality of conductive vias 211. The conductive structure 221 is connected to the connecting electrode 12 through the conductive vias 211. The connecting electrode 12 is electrically connected to the power supply wiring 11 on the driving substrate 10 through the vias. The conductive structure 221 is electrically coupled to the cathode of the display area 101, thereby realizing the signal connection between the cathode and the signal wiring.

[0043] The encapsulation layer 23 includes an organic encapsulation layer 232, which is disposed on a side of the roof structure 222 away from the driving substrate 10, and extends to the isolation dam area 1022 in a direction away from the display area 101. However, this encapsulation method allows the organic encapsulation layer 232 to flow directly through the roof structure 222 of the conductive isolation structure 22 toward the isolation dam area, and the leveling distance required for the organic encapsulation layer 232 is too large, and the safety distance D that needs to be reserved is large, thereby increasing the frame width.

[0044] The display panel 100 provided in the embodiment of the present application changes the connection method between the conductive isolation structure 22 and the connection electrode 12 in the signal connection area 1021, so that the conductive isolation structure 22 has the function of blocking the organic encapsulation layer 232, which can effectively shorten the leveling distance of the organic encapsulation layer 232, reduce the safety distance D, and effectively reduce the width W of the border of the display panel 100.

[0045] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0046] See also Figure 4-6 , Figure 4 is a schematic diagram of a planar structure of a display panel 100 provided in the first embodiment of the present application, Figure 5 yes Figure 4 A schematic diagram of a local planar structure of region B in the embodiment, Figure 6 yes Figure 5 The cross-sectional structure diagram of the display panel along the BB line is shown in FIG. In this embodiment, a display panel 100 is provided. The display panel 100 has a display area 101 and a frame area 102 located around the display area 101 .

[0047] The display panel 100 includes a driving substrate 10, and the driving substrate 10 is divided into a display area 101 and a frame area 102 located around the display area 101. Figure 5 As shown, the display area 101 is used to display images. The display area 101 is provided with a mesh pixel definition layer (covered, not shown). The pixel definition layer has a plurality of pixel openings 212, which are used to separate each sub-pixel unit 30 to avoid pixel light crosstalk problems; the plurality of pixel openings 212 are arranged in an array. At the same time, a mesh first conductive isolation structure 24 is protrudingly provided on the pixel definition layer. The first conductive isolation structure 24 has a plurality of cathode openings. The cathode openings correspond to the pixel openings 212 one by one, and the positive projection of the pixel opening 212 on the driving substrate 10 is within the positive projection of the cathode opening on the driving substrate 10, that is, the cathode opening is slightly larger than the pixel opening 212 and surrounds the pixel opening 212. The first conductive isolation structure 24 can replace the mask plate (FMM) for evaporating the light-emitting layer and the cathode and other film layers to form the sub-pixel unit 30, and can also be used to connect the cathodes of each sub-pixel unit 30. Specifically, a sub-pixel unit 30 is provided in the pixel opening 212, and the sub-pixel unit 30 includes an anode, a light-emitting layer and a cathode (not shown) stacked in sequence in a direction away from the driving substrate 10; wherein the cathode extends in the pixel opening 212, and extends to the cathode opening to contact and conduct with the first conductive isolation structure 24, so that the cathodes of each sub-pixel unit 30 are conducted through the first conductive isolation structure 24, forming a mesh connection of the entire surface of the cathode, and realizing the uniformity of the signal of the entire surface of the cathode. Specifically, the sub-pixel unit 30 includes a first sub-pixel unit 31, a second sub-pixel unit 32 and a third sub-pixel unit 33 with different luminous colors, and the luminous colors can be red, green and blue, respectively, to realize full-color display of the image. In other embodiments, the sub-pixel unit 30 may also include a fourth sub-pixel unit 30 with a luminous color of white, so as to improve the display brightness of the pixel unit, and to cooperate with colors with different saturations to improve the color gamut range.

[0048] Among them, the border area 102 includes a signal connection area 1021 and an isolation dam area 1022 arranged in sequence along a direction away from the display area 101, and a safety distance D is reserved between the signal connection area 1021 and the isolation dam area 1022 to reserve space for leveling the organic encapsulation layer 232 to prevent the organic encapsulation layer 232 from overflowing the border area 102.

[0049] Specifically, Figure 6As shown, in a direction perpendicular to the display panel 100, the signal connection area 1021 includes a driving substrate 10, a connection electrode 12, a connection definition layer 41, a second conductive isolation structure 50 and an encapsulation layer 23 which are stacked in sequence. The connection definition layer 41 is arranged in the same layer as the pixel definition layer and can be manufactured in the same patterning process; the second conductive isolation structure 50 is arranged in the same layer as the first conductive isolation structure 24 and is connected to it, and can be manufactured in the same process. The second conductive isolation structure 50 is arranged in the same layer as the first conductive isolation structure 24 and is connected to it, so that the second conductive isolation structure 50 is electrically coupled to the cathode of the display area 101.

[0050] Specifically, the connection definition layer 41 is disposed on a side of the connection electrode 12 away from the drive substrate 10, and defines a plurality of connection openings 411, and the connection openings 411 expose the connection electrode 12. The second conductive isolation structure 50 is disposed protruding from the connection definition layer 41, and is arranged in a mesh shape to form a plurality of package openings 511. It can be understood that, similar to the opening design of the display area 101, the second conductive isolation structure 50 is mesh-shaped, and is protruding from the connection definition layer 41, and is mesh-shaped to form a plurality of package openings 511.

[0051] Furthermore, the orthographic projection of the connection opening 411 on the driving substrate 10 is located within the orthographic projection of the second conductive isolation structure 50 on the driving substrate 10, so that the second conductive isolation structure 50 is in contact with and conductive with the connection electrode 12 through the connection opening 411; at the same time, the second conductive isolation structure 50 is connected to the first conductive isolation structure 24 of the display area 101 to form an electrical coupling, and the first conductive isolation structure 24 is electrically coupled to the cathode, so that the cathode can be electrically coupled to the connection electrode 12 through the first conductive isolation structure 24 and the second conductive isolation structure 50, so that the cathode and the connection electrode 12 can be electrically coupled, and the connection electrode 12 is electrically coupled to the power supply line 11 in the driving substrate 10, so that the cathode can realize signal connection with the power supply line 11 through the first conductive isolation structure 24, the second conductive isolation structure 50 and the connection electrode 12, and can reduce the voltage drop between the second conductive isolation structure 50 and the connection electrode 12.

[0052] Furthermore, in the process of manufacturing the light-emitting layer 25 and the cathode 26 in the display area 101, since the light-emitting layer 25 and the cathode 26 are deposited on each substrate by scanning the evaporation source on the master, the light-emitting layer 25 and the cathode 26 are also deposited in the package opening 511 formed by the second conductive isolation structure 50 located in the frame area 102. Therefore, in the package opening 511, the light-emitting layer 25 and the cathode 26 are also stacked between the connection definition layer 41 and the package layer 23. Among them, the cathode 26 is located in the package opening 511, and extends to the second conductive isolation structure 50 and contacts and conducts with the second conductive isolation structure 50, which can further reduce the impedance of the cathode 26, and the cathode 26 can be further electrically coupled to the connection electrode 12 through the second conductive isolation structure 50.

[0053] Specifically, the driving substrate 10 also includes a power line 11 located in the border area 102. The power line 11 and the connecting electrode 12 at least partially overlap in a direction perpendicular to the driving substrate 10. In the overlapping area, the connecting electrode 12 is electrically connected to the power line 11 through a connecting through hole, thereby achieving coupling between the cathode and the power signal.

[0054] In this embodiment, the encapsulation layer 23 at least includes an organic encapsulation layer 232. In the display area 101, the organic encapsulation layer 232 is disposed on a side of the first conductive isolation structure 24 away from the drive substrate 10, and is filled in each pixel opening 212 to encapsulate each sub-pixel unit 30 to prevent external water and oxygen from invading and causing failure of the sub-pixel unit 30. The organic encapsulation layer 232 extends to the signal connection area 1021 in a direction parallel to the drive substrate 10. In the signal connection area 1021, the organic encapsulation layer 232 is filled in each encapsulation opening 511, and continues to extend in a direction away from the display area 101 to a side of the isolation dam area 1022 close to the signal connection area 1021.

[0055] It is easy to understand that since the second conductive isolation structure 50 of the signal connection area 1021 is mesh-shaped and has multiple packaging openings 511, the signal connection area 1021 is formed with multiple protrusions and recesses. Therefore, it has a blocking effect on the organic packaging layer 232, thereby reducing the leveling distance of the organic packaging layer 232 between the signal connection area 1021 and the isolation dam area 1022, and can effectively reduce the safety distance D between the signal connection area 1021 and the isolation dam area 1022, thereby effectively reducing the width of the border of the display panel 100.

[0056] Among them, the isolation dam area 1022 is provided with at least one dam 60 for blocking the organic encapsulation layer 232, confining the organic encapsulation layer 232 within the area enclosed by the isolation dam area 1022, and preventing the organic encapsulation layer 232 material from overflowing, so as to ensure the encapsulation effectiveness of the organic encapsulation frame (TFE), thereby ensuring the reliability of the product.

[0057] Specifically, in a direction perpendicular to the display panel 100, the second conductive isolation structure 50 includes a stacked conductive enclosure structure 51 and a second top structure 52. The conductive enclosure structure 51 is disposed on a side of the connection definition layer 41 away from the drive substrate 10, protruding from the connection definition layer 41, and the positive projection of the conductive enclosure structure 51 on the drive substrate 10 is in a mesh shape, so that the conductive enclosure structure 51 is surrounded to form a plurality of opening structures, namely, encapsulation openings 511, which have a blocking effect on the organic encapsulation layer 232, so as to shorten the leveling distance of the organic encapsulation layer 232, thereby reducing the width of the frame area 102, which is conducive to the design of a narrow frame.

[0058] The conductive enclosure structure 51 covers the connection opening 411 in a direction perpendicular to the drive substrate 10, that is, the conductive enclosure structure 51 is located above the connection opening 411 and fills into the connection opening 411, so that the conductive enclosure structure 51 can contact and conduct with the connection electrode 12 through the connection opening 411. At the same time, the conductive enclosure structure 51 and the conductive structure of the first conductive isolation structure 24 are arranged in the same layer and connected, so that the conductive enclosure structure 51 is electrically coupled to the cathode through the first conductive isolation structure 24, so that the cathode is electrically coupled to the connection electrode 12, so as to realize the signal connection between the cathode and the power supply line 11.

[0059] The second top structure 52 is arranged on the upper surface of the conductive enclosure structure 51, covering the conductive enclosure structure 51, and extending the conductive enclosure structure 51 in a direction parallel to the connection definition layer 41 to form a suspended overhanging structure, which can further block the organic encapsulation layer 232, enhance the blocking effect on the organic encapsulation layer 232, further shorten the leveling distance of the organic encapsulation layer 232, and reduce the width of the border area 102.

[0060] Specifically, in this embodiment, the driving substrate 10 includes a substrate 13 and a driving layer 14, the driving layer 14 is arranged on the substrate 13, and the driving layer 14 includes a pixel driving circuit (not shown) and a power supply line 11. Among them, the substrate 13 can adopt an optical-grade glass substrate or a flexible substrate, and the flexible substrate can adopt a substrate of polyimide (PI) material. In the driving layer 14, the pixel driving circuit is located in the display area 101 and is electrically connected to the anode of the corresponding sub-pixel unit 30 to drive the sub-pixel to emit light. The power supply line 11 is located in the frame area 102 and surrounds the display area 101. The power supply line 11 can be arranged in the same layer as the first metal layer (gate layer) or the second metal layer (source and drain layer) in the pixel driving circuit.

[0061] In this embodiment, Figure 6As shown, the opening area of ​​the package opening 511 in the signal connection area 1021 is not less than half of the opening area of ​​the pixel opening 212 in the display area 101. It can be understood that the opening area of ​​the package opening 511 is at least half of the opening area of ​​the pixel opening 212 in the display area 101, so that the difference between the capacity of the organic packaging material that can be accommodated by the package opening 511 and the capacity of the organic packaging material that can be accommodated by the pixel opening 212 in the display area 101 is small, thereby ensuring that the flow-out effect of the organic packaging layer 232 in the signal connection area 1021 is basically consistent with that in the display area 101, and improving the flow-out uniformity of the organic packaging layer 232 in the display area 101 and the signal connection area 1021. At the same time, by setting the opening size of the packaging opening 511 as mentioned above, the blocking effect of the second conductive isolation structure 50 on the organic packaging layer 232 can be further enhanced, the leveling distance of the organic packaging layer 232 can be further reduced, and the safety distance D between the signal connection area 1021 and the isolation dam area 1022 can be shortened to further reduce the border width.

[0062] Please refer to Figure 4 and Figure 7 , Figure 7 : is a schematic diagram of the planar structure of the display panel provided in the second embodiment of the present application. In this embodiment, in the signal connection area 1021, along the circumferential direction around the display area 101, multiple packaging openings 511 are arranged around the display area 101; at the same time, along the direction away from the display area 101, the multiple packaging openings 511 are arranged in multiple rows. It can be understood that the multiple packaging openings 511 surround the display area 101 in multiple circles along the circumferential direction of the display area 101 to block the organic packaging layer 232 around the display area 101.

[0063] In this embodiment, due to the above-mentioned configuration of the second conductive isolation structure 50, the external water and oxygen intrusion is mainly carried out through the second top structure 52 of the second conductive isolation structure 50 and the encapsulation layer 23 to enter the display area 101 along the conductive path. Therefore, if the mesh structure of the second conductive isolation structure 50 is a linear structure in the direction away from the display area 101, that is, the second conductive isolation structure 50 is a horizontal and vertical mesh structure, then the intrusion path R of the external water and oxygen will be a straight line. Due to the design of the narrow frame, the intrusion path R of the water and oxygen is shortened, which is not conducive to the reliability of the encapsulation.

[0064] To solve the above technical problems, in the present embodiment, further, in the direction away from the display area 101, in the multiple rows of packaging openings 511, each row of packaging openings 511 is staggered with the adjacent row of packaging openings 511, so that the second conductive isolation structure 50 is a zigzag structure in the direction away from the display area 101, and is no longer a straight line structure, so that the invasion path R of external water and oxygen in the signal connection area 1021 is also a zigzag, and cannot invade in a straight line. Therefore, the length of the invasion path R of external water and oxygen in the signal connection area 1021 is greater than the width W of the signal connection area 1021, which effectively increases the length of the water and oxygen invasion path R, thereby effectively improving the packaging reliability of the packaging layer 23. It should be noted that the width W of the signal connection area 1021 involved in the embodiment of the present application specifically refers to the width W of the signal connection area 1021 in the direction away from the display area 101.

[0065] In a specific embodiment, the shape of the package opening 511 may be a rectangle, a circle, a polygon or other irregular shapes, and may be set as required. In this embodiment, the shape design and the opening size design of the package opening 511 may be used to design the invasion path R of water and oxygen, and the length of the invasion path R of external water and oxygen in the signal connection area 1021 may be appropriately increased, so that the length of the invasion path R is greater than or equal to twice the width W of the signal connection area 1021, thereby effectively improving the packaging reliability of the packaging layer 23.

[0066] In this embodiment, Figure 7 As shown, the connection electrode 12 has a plurality of hollow portions 121, so that the connection electrode 12 forms a mesh structure. The orthographic projection of the hollow portion 121 on the drive substrate 10 is located within the orthographic projection of the package opening 511 on the drive substrate, and the hollow portion 121 corresponds to the package opening 511 one by one, and the area of ​​the hollow portion 121 is slightly smaller than the opening area of ​​the package opening 511, so as to reduce the material of the connection electrode 12, and at the same time, the connection electrode 12 can have a breathable structure, which is beneficial to the circuit design of the drive layer 14.

[0067] See also Figure 8 and Fig. 9 , Figure 8 is a schematic diagram of a planar structure of a display panel provided in the third embodiment of the present application, Fig. 9 yes Figure 8 A schematic diagram of a cross-sectional structure of a display panel along the CC direction provided in an embodiment. Figure 7What is different from the embodiment is that, in the display panel 100 provided in the present embodiment, in the signal connection area 1021, the connection electrode 12 has a plurality of hollow portions 121, the area of ​​the hollow portions 121 is smaller than the area of ​​the packaging opening 511, and the orthographic projection of each packaging opening 511 on the driving substrate 10 covers the orthographic projection of at least one hollow portion 121 on the driving substrate 10. That is, in the direction perpendicular to the driving substrate 10, at least one hollow portion 121 is covered below each packaging opening 511; that is, the corresponding relationship between the packaging opening 511 and the connection opening 411 can be one-to-one or one-to-many. Alternatively, it can be understood that, in the signal connection area 1021, each packaging opening 511 surrounds at least one hollow portion 121 in the direction parallel to the driving substrate 10, that is, each packaging opening 511 can surround one or more hollow portions 121. By making the packaging opening 511 surround the plurality of connection openings 411 , the area of ​​the hollow portion 121 is reduced, thereby increasing the laying area of ​​the connection electrode 12 , and effectively reducing the impedance of the connection electrode 12 , thereby reducing the heating of the connection electrode 12 and reducing the signal voltage drop.

[0068] In a specific embodiment, in the signal connection area 1021, the orthographic projection of each package opening 511 on the drive substrate 10 can cover the orthographic projection of 2 to 4 hollow portions 121 on the drive substrate 10, so that the impedance of the connection electrode 12 is effectively reduced. For example, in this embodiment, the orthographic projection of each package opening 511 on the drive substrate 10 covers two hollow portions 121, that is, each package opening 511 surrounds two hollow portions 121 in a direction parallel to the drive substrate 10, so as to reduce the impedance of the connection electrode 12 and reduce the heat generation of the connection electrode 12.

[0069] In this embodiment, the connection electrode 12 can be arranged in the same layer as the anode of the sub-pixel unit 30 in the display area 101. That is, the connection electrode 12 and the anode are manufactured in the same patterning process; at the same time, the connection definition layer 41 and the pixel definition layer can be arranged in the same layer, and the connection definition layer 41 and the pixel definition layer are prepared after the connection electrode 12 and the anode are prepared, and the connection definition layer 41 and the pixel definition layer are formed in a preset shape through a patterning process, so as to facilitate the manufacturing without generating additional process steps.

[0070] In the present application embodiment, Figure 5 and Figure 8As shown, the connection opening 411 defined by the connection definition layer 41 includes a first opening 4111 extending along the first direction X and a second opening 4112 extending along the second direction Y. The first opening 4111 and the second opening 4112 are interconnected to form a mesh connection channel, and the connection channel exposes the connection electrode 12. The second conductive isolation structure 50 is disposed at the connection channel to contact and conduct with the connection electrode through the connection channel. The first direction X intersects with the second direction Y. In this embodiment, taking the horizontal direction as the first direction X and the vertical direction as the second direction Y as an example, a connection channel is opened on the connection definition layer 41 below the second conductive isolation structure 50 to expose the connection electrode 12, so that the second conductive isolation structure 50 is in contact with and conductive with the connection electrode 12 through the connection channel; wherein the connection channel includes a first opening 4111 in the horizontal direction and a second opening 4112 in the vertical direction, the first opening 4111 and the second opening 4112 intersect and communicate with each other to form a mesh shape identical to the second conductive isolation structure 50, so that the contact area between the second conductive isolation structure 50 and the connection electrode 12 is increased, thereby making the current signal more dispersed, avoiding the generation of more heat that causes damage to the connection structure, and making the electrical connection between the second conductive isolation structure 50 and the connection electrode 12 more reliable.

[0071] Of course, in other embodiments, the connection opening 411 may also be a through hole. On the connection definition layer 41, a plurality of unconnected through holes are opened below the second conductive isolation structure 50 to expose the connection electrode 12, so that the second conductive isolation structure 50 is in contact with and conductive to the connection electrode 12 through the connection opening 411 in the form of a through hole to form an electrical connection.

[0072] Please refer to Figure 8 and Fig.10 , Fig.10 1 is a schematic diagram of the cross-sectional structure of the isolation dam area provided in an embodiment of the present application. In the embodiment of the present application, the isolation dam area 1022 is provided with two dams 60 spaced in sequence in a direction away from the display area 101, which are used to block the organic encapsulation layer 232, so as to limit the organic encapsulation layer 232 to the side of the isolation dam area 1022 close to the display area 101, so as to ensure the effectiveness of the encapsulation.

[0073] Specifically, along the direction perpendicular to the display panel 100, the dam 60 includes a dam base 61 and a third conductive isolation structure 62 which are stacked. The dam base 61 can be arranged in the same layer as the pixel definition layer 21 and the connection definition layer 41, that is, the dam base 61, the pixel definition layer 21 and the connection definition layer 41 can be manufactured in the same process to save process steps; the third conductive isolation structure 62 arranged on the dam base 61 can be arranged in the same layer as the first conductive isolation structure 24 and the second conductive isolation structure 50, and can be manufactured in the same production process to save process steps. In this embodiment, by forming the third conductive isolation structure 62 on the dam base 61 in the process of manufacturing the conductive isolation structure, the height of the dam 60 in the direction perpendicular to the display panel 100 can be effectively increased, thereby enhancing the blocking effect of the dam 60 on the organic encapsulation layer 232.

[0074] Specifically, the encapsulation layer 23 includes a first inorganic encapsulation layer 231, an organic encapsulation layer 232, and a second inorganic encapsulation layer 233 which are stacked in sequence. The organic encapsulation layer 232 covers the display area 101 and the signal connection area 1021, and extends in a direction close to the isolation dam area 1022, and the extension distance does not exceed the safety distance D. The first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 233 cover the display area 101 and the frame area 102, and in the isolation dam area 1022, the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 233 overlap and contact in a direction perpendicular to the display panel 100, that is, the edges of the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 233 exceed the organic encapsulation layer 232, and the organic encapsulation layer 232 is wrapped between the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 233, so as to prevent external water and oxygen from invading the display area 101 from between the organic encapsulation layer 232 and the inorganic encapsulation layer, so as to ensure the effectiveness of the organic encapsulation frame (TFE) and the reliability of the product.

[0075] It should be noted that, since the light-emitting layer 25 and the cathode 26 are deposited on the substrate by scanning evaporation from an evaporation source in a direction parallel to the display panel 100, the light-emitting layer 25 and the cathode 26 are also deposited in the area corresponding to the safety distance D and the isolation dam area 1022 (not shown). In the area of ​​the safety distance D, the light-emitting layer 25 and the cathode 26 are located between the drive substrate 10 and the first inorganic encapsulation layer 231, and the cathode 26 extends to the third conductive isolation structure 62 to contact and conduct with the third conductive isolation structure 62; in the isolation dam area 1022, the light-emitting layer 25 and the cathode 26 are located in the groove formed between the two dams 60, between the drive substrate 10 and the first inorganic encapsulation layer 231, and the cathode 26 extends to the third conductive isolation structure 62 to contact and conduct with the third conductive isolation structure 62, so as to further reduce the impedance and facilitate the signal connection between the cathode 26 and the peripheral signal wiring. Of course, before setting the encapsulation layer 23, the light-emitting layer 25 and the cathode 26 in the area of ​​the safety distance D and the isolation dam area 1022 can be removed, for example, by etching, and then the encapsulation layer 23 can be set. The specific setting can be based on actual needs and is not limited to this.

[0076] Fig.11 1 is a schematic diagram of the structure of a display device provided in an embodiment of the present application. In this embodiment, a display device is provided, which can be used in the fields of tablets, mobile phones, vehicles, lighting, etc.

[0077] The display device includes a display panel 100. The specific structure and function of the display panel 100 are the same as or similar to the specific structure and function of the display panel 100 in the above embodiment, and can achieve the same technical effect. For details, please refer to the detailed description above and will not be repeated here.

[0078] The display panel 100 in the display device adopts the display panel 100 in the above embodiment, which can improve the reliability of the electrical connection between the cathode and the connecting electrode 12, and can effectively shorten the frame width, increase the length of the external water and oxygen invasion path R, and improve the packaging reliability.

[0079] The above are only implementation methods of the present application, and are not intended to limit the patent protection scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, comprising a display area and a frame area located around the display area; the frame area comprises a signal connection area and an isolation dam area sequentially arranged in a direction away from the display area; a safety distance is provided between the signal connection area and the isolation dam area; In a direction perpendicular to the display panel, the signal connection area includes a driving substrate, a connection electrode, a connection definition layer, a conductive isolation structure and a packaging layer which are stacked in sequence; wherein, The conductive isolation structure is electrically coupled to the cathode of the display area, and the connecting electrode is electrically coupled to the power supply line in the driving substrate; the encapsulation layer includes an organic encapsulation layer; The conductive isolation structure protrudes from the connection definition layer and is arranged in a mesh to form a plurality of packaging openings; the connection definition layer defines a plurality of connection openings, the connection openings expose the connection electrodes, and the orthographic projections of the connection openings on the drive substrate are located within the orthographic projections of the conductive isolation structure, and the conductive isolation structure contacts and conducts with the connection electrodes through the connection openings; The organic packaging layer fills the packaging opening and covers the conductive isolation structure.

2. The display panel according to claim 1, characterized in that: In a direction perpendicular to the display panel, the conductive isolation structure includes a conductive enclosure structure and a top structure that are stacked; The conductive enclosure structure is arranged on a side of the connection definition layer away from the driving substrate, and the orthographic projection of the conductive enclosure structure on the driving substrate is in a mesh shape to enclose and form a plurality of packaging openings; The conductive enclosure structure covers the connection opening in a direction perpendicular to the drive substrate so as to contact and conduct with the connection electrode through the connection opening; The top structure is disposed on the upper surface of the conductive enclosure structure, covers the conductive enclosure structure, and extends out of the conductive enclosure structure in a direction parallel to the connection definition layer; The package opening exposes the connection definition layer.

3. The display panel according to claim 2, characterized in that: The display area is provided with a plurality of pixel openings arranged in an array, and sub-pixel units are provided in the pixel openings; Wherein, the opening area of ​​the packaging opening is not less than half of the opening area of ​​the pixel opening.

4. The display panel according to claim 2, characterized in that: The packaging openings are arranged in a plurality of rows along a direction away from the display area; wherein the packaging openings in each row are staggered with the packaging openings in an adjacent row.

5. The display panel according to claim 2, characterized in that: The connecting electrode has a plurality of hollow portions; the area of ​​the hollow portions is smaller than the area of ​​the packaging opening, and the orthographic projection of each packaging opening on the driving substrate covers the orthographic projection of at least one of the hollow portions on the driving substrate.

6. The display panel according to claim 5, characterized in that: The orthographic projection of each packaging opening on the driving substrate covers the orthographic projections of 2 to 4 hollow portions on the driving substrate.

7. The display panel according to claim 1, characterized in that: The connection opening includes a first opening extending along a first direction and a second opening extending along a second direction, the first opening and the second opening are connected to each other to form a mesh-shaped connection channel, and the connection channel exposes the connection electrode; The conductive isolation structure is disposed at the connection channel to contact and conduct with the connection electrode through the connection channel; wherein the first direction intersects with the second direction.

8. The display panel according to claim 1, characterized in that: The connecting electrode is arranged in the same layer as the anode of the display area.

9. The display panel according to claim 1, characterized in that: The isolation dam area is provided with two dams spaced in sequence in a direction away from the display area; along a direction perpendicular to the display panel, the dam includes a dam base and a conductive isolation structure stacked in layers, for blocking the organic encapsulation layer; The encapsulation layer includes a first inorganic encapsulation layer, the organic encapsulation layer, and a second inorganic encapsulation layer; the organic encapsulation layer covers the display area and the signal connection area, and extends in a direction close to the isolation dam area, and the extension distance does not exceed the safety distance; the first inorganic encapsulation layer and the second inorganic encapsulation layer cover the display area and the frame area, and in the isolation dam area, the first inorganic encapsulation layer overlaps and is in contact with the second inorganic encapsulation layer.

10. A display device, characterized in that: The invention comprises a display panel as claimed in any one of claims 1 to 9.

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