A full array measurement method and system for high-density electrical method
Through the full arrangement measurement method and rolling power supply technology, the problem of low data acquisition efficiency of high-density electrical method is solved, and the acquisition of multiple device arrangement data in a short time is realized, which improves the acquisition efficiency and data quality.
Patent Information
- Application Number
- CN202411195869.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2044-08-29
AI Technical Summary
When collecting data, high-density electrical methods require separate measurement modes, resulting in large repetitive workload and low acquisition efficiency. Especially during three-dimensional measurement, the number of electrodes is large, and the acquisition time is as long as dozens of hours, so it is impossible to obtain the update in a short time. More information.
Using a full arrangement measurement method, the power supply electrodes A and B are moved sequentially through rolling power supply, and the electrode closest to the zero potential position is selected as the reference electrode C, and the potential difference series data between the measurement electrode and the reference electrode is obtained, and combined with the power supply electrode Position, measuring electrode position, power supply current, power supply voltage and time are used as raw data, and the profile data arranged by each device are extracted to achieve a complete rolling power supply at one time.
It greatly improves data acquisition efficiency, can obtain profile data arranged in multiple devices in a short time, reduces the number of repeated measurements, improves the quality and accuracy of data, and reduces redundant observations.
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Figure CN118688865B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of geophysical electrical prospecting, and in particular to a full-array measurement method and system for high-density electrical prospecting. Background Art
[0002] High-density electrical method is one of the most widely used methods in engineering exploration. Its basic principle is to lay out all electrodes at one time, control the switching status of all electrodes in the entire arrangement through instruments, and quickly obtain geoelectric data of various device arrangements. Compared with the traditional three-dimensional resistivity method, it greatly improves work efficiency.
[0003] At present, the high-density electrical data acquisition method is to pre-set the measurement mode of a specific device, and the instrument collects the geoelectric profile data of the set device arrangement. The controller determines a pair of electrodes as power supply electrodes, a pair or multiple pairs of electrodes as measurement electrodes, and the remaining electrodes are disconnected. Only one or several data of a specific device are collected at a single power supply. When the number of arranged electrodes is large, the measurement time of the entire survey line will increase exponentially.
[0004] When data from another device needs to be collected, the measurement mode needs to be reset and data collected again, which increases the amount of repeated work and greatly reduces work efficiency. Especially in three-dimensional high-density electrical measurement, due to the large number of electrodes, the collection time is as long as dozens of hours. It is impossible to obtain more information in a shorter measurement time.
[0005] It can be seen that providing a measurement method and a data processing system with a relatively short measurement time and capable of obtaining more device arrangement data is an urgent problem to be solved by those skilled in the art. Summary of the invention
[0006] The purpose of the present invention is to provide a full arrangement measurement method and system for high-density electrical methods in order to solve the problems that each device arrangement must be collected separately, only one or several data of a specific device are collected in a single power supply, and the collection efficiency is low.
[0007] The above-mentioned purpose of the present application is achieved through the following technical solutions:
[0008] S1: Assume that there are K electrodes in the entire electrode arrangement, and the distance between two adjacent electrodes is L; the distance between the power supply electrode A and the power supply electrode B is expressed as the power supply electrode distance;
[0009] S2: The first electrode is used as the power supply electrode A, and the power supply electrode B is rolled from the second electrode to the Kth electrode in sequence to supply power in sequence; after the power supply electrode A is used as the first electrode to supply power, the power supply electrode A is moved backward by an electrode distance L to the second electrode position and fixed, and the power supply electrode B is rolled from the third electrode to the Kth electrode in sequence, and the above steps are repeated until the power supply electrode A is rolled to the K-1th electrode, so as to supply power for the rolling of the power supply electrode on the electrode arrangement;
[0010] S3: According to the power supply electrode distance, select the electrode closest to the zero potential position as the reference electrode C;
[0011] S4: After each power supply is completed, a potential difference series between the measuring electrode and the reference electrode C is obtained, and the potential difference series and the power supply electrode position, the measuring electrode position, the power supply current, the power supply voltage and the power supply time are used as the original data of the high-density electrical method full array measurement;
[0012] S5: extracting and separating various device arrangements from the original data according to the characteristics of the acquisition method of each device arrangement to obtain profile data; the devices include: Wenner device, Schlumberger forward and reverse device, dipole-dipole device and custom device, etc.; the profile data include: apparent resistivity, natural potential and apparent excitation rate;
[0013] S6: Draw a profile diagram based on the profile data and complete the full array measurement of high-density electrical method.
[0014] Optionally, the specific steps of the rolling power supply include:
[0015] S21: starting from the first electrode, the power supply electrode A is fixed as the first electrode, and the power supply electrode B is the second electrode; the power supply electrode A and the power supply electrode B are powered once in the forward and reverse directions, and the power supply electrode B moves backward by a power supply electrode distance L; until the power supply electrode B moves to the Kth electrode, completing the full arrangement rolling power supply mode in which the power supply electrode A is the power supply electrode of the first electrode;
[0016] S22: After completing one rolling power supply, the power supply electrode A moves backward by one electrode distance to the second electrode and is fixed, and the power supply electrode B starts from the third electrode to the Kth electrode and performs rolling power supply; that is, the power supply electrode A is used as the second electrode and the rolling power supply of the power supply electrode distance from L to K is completed;
[0017] S23: until the power supply electrode A is fixed as the K-1th electrode, the power supply electrode B is set as the Kth electrode, and power supply is performed once, completing the rolling power supply process of the entire power supply electrode in the entire electrode arrangement.
[0018] Optionally, step S3 includes:
[0019] S31: when the power supply electrode A is the first electrode and the power supply electrode distance is the minimum power supply electrode distance L, select an electrode farthest from the power supply electrode A as the reference electrode C, that is, select the Kth electrode as the reference electrode C;
[0020] S32: when the power supply electrode distance is not the minimum power supply electrode distance L, select an electrode closest to the center point of the power supply electrode as a reference electrode C; the center point of the power supply electrode represents the center point of the power supply electrode A and the power supply electrode B;
[0021] S33: When the power supply electrode A is not the first electrode and the power supply electrode distance is the minimum power supply electrode distance L, calculate the distance between the first electrode in the electrode arrangement and the power supply electrode A and the distance between the Kth electrode in the electrode arrangement and the power supply electrode B, and determine whether the reference electrode C is the first electrode or the Kth electrode by comparing and calculating the sizes of the two distances.
[0022] Optionally, step S32 includes:
[0023] S32a: When the power supply electrode distance is not the minimum power supply electrode distance L and is an even multiple of L, the electrode at the center point of the power supply electrode is selected as the reference electrode C;
[0024] S32b: When the power supply electrode distance is not the minimum power supply electrode distance L and is an odd multiple of L, the electrode with a smaller electrode number among the two electrodes closest to the center point of the power supply electrode is selected as the reference electrode C.
[0025] Optionally, step S4 includes:
[0026] S41: After each power supply is completed, all electrodes except the power supply electrode and the reference electrode C are used as measuring electrodes to obtain a series of potential differences between the measuring electrodes and the reference electrode C;
[0027] S42: The potential difference series between the measuring electrode and the reference electrode C, the power supply electrode position, the measuring electrode position, the power supply current, the power supply voltage and the power supply time are used as the original data of the high-density electrical method full array measurement.
[0028] Optionally, according to the acquisition characteristics of the dipole-dipole device, the raw data is extracted and separated by device arrangement, and the specific steps include:
[0029] Determine the maximum transmission and reception distance and the maximum power supply electrode distance of the dipole-dipole device;
[0030] According to the maximum receiving and transmitting distance and the maximum power supply electrode distance, a cross-sectional data of a dipole-dipole device from the starting end to the ending end and a cross-sectional data of a dipole-dipole device from the ending end to the starting end are extracted from the original data.
[0031] Optionally, according to the characteristics of the acquisition method of the Wenner device, the original data is extracted and separated by device arrangement, and the specific steps include:
[0032] Determine the maximum power supply electrode distance of the Wenner device and extract a profile data of the Wenner device from the original data.
[0033] Optionally, according to the collection characteristics of the Schlumberger device, the raw data is extracted and separated by device arrangement, and the specific steps include:
[0034] The maximum power supply electrode distance and the ratio of the maximum power supply electrode distance to the measuring electrode distance of the Schlumberger device are determined, and from the original data, a profile data of a Schlumberger device with a power supply electrode distance greater than the measuring electrode distance and a profile data of an inverted Schlumberger device with a power supply electrode distance less than the measuring electrode distance are extracted.
[0035] A computer-readable storage medium stores instructions, which, when executed, perform a full array measurement method for high-density electrical methods.
[0036] The beneficial effects of the technical solution provided by this application are:
[0037] 1. For the power supply of the primary power supply electrode, all other measuring electrodes measure the potential difference signal between it and the reference electrode C, and then extract the profile data of each device arrangement through the high-density electrical method full-array measurement raw data device profile extraction algorithm, realize a complete rolling power supply, and obtain profile data of multiple device arrangements, which greatly improves the data acquisition efficiency.
[0038] 2. Data quality evaluation and accuracy analysis are performed by extracting profile data of two dipole-dipole devices that exchange the power supply electrode and the measuring electrode. BRIEF DESCRIPTION OF THE DRAWINGS
[0039] The present application will be further described below with reference to the accompanying drawings and embodiments, in which:
[0040] Figure 1 It is a step diagram of the high-density electrical method for full array measurement in an embodiment of the present application;
[0041] Figure 2 This is a schematic diagram of the first rolling power supply process of the high-density electrical method full array measurement method in an embodiment of the present application;
[0042] Figure 3 This is a schematic diagram of the second rolling power supply process of the high-density electrical method full array measurement method in an embodiment of the present application;
[0043] Figure 4 This is a schematic diagram of the third rolling power supply process of the high-density electrical method full-array measurement method in an embodiment of the present application;
[0044] Figure 5 It is a schematic diagram of the first cross-sectional data extracted based on a dipole-dipole device in the high-density electrical method for full array measurement in the embodiment of the present application;
[0045] Figure 6 It is a schematic diagram of the second cross-sectional data extracted based on the dipole-dipole device in the high-density electrical method full array measurement method in the embodiment of the present application;
[0046] Figure 7 It is a schematic diagram of cross-sectional data extracted based on a Wenner device in the high-density electrical method for full array measurement in the embodiment of the present application;
[0047] Figure 8 It is a schematic diagram of cross-sectional data extracted based on a Schlumberger device in a high-density electrical method full array measurement method in an embodiment of the present application;
[0048] Fig. 9 It is a schematic diagram of cross-sectional data extracted based on an inverted Schlumberger device in the high-density electrical method for full array measurement in the embodiment of the present application. DETAILED DESCRIPTION
[0049] In order to have a clearer understanding of the technical features, purposes and effects of the present application, the specific implementation methods of the present application are now described in detail with reference to the accompanying drawings.
[0050] The embodiments of the present application provide a full array measurement method for high-density electrical methods.
[0051] Please refer to Figure 1 , Figure 1 1 is a step diagram of a full array measurement method for high-density electrical method in an embodiment of the present application, including:
[0052] S1: Assume that there are K electrodes in the entire electrode arrangement, and the distance between two adjacent electrodes is L; the distance between the power supply electrode A and the power supply electrode B is expressed as the power supply electrode distance;
[0053] S2: The first electrode is used as the power supply electrode A, and the power supply electrode B is rolled from the second electrode to the Kth electrode in sequence to supply power in sequence; after the power supply electrode A is used as the first electrode to supply power, the power supply electrode A is moved backward by an electrode distance L to the second electrode position and fixed, and the power supply electrode B is rolled from the third electrode to the Kth electrode in sequence, and the above steps are repeated until the power supply electrode A is rolled to the K-1th electrode, so as to supply power for the rolling of the power supply electrode on the electrode arrangement;
[0054] The specific steps of the rolling power supply include:
[0055] S21: starting from the first electrode, the power supply electrode A is fixed as the first electrode, and the power supply electrode B is the second electrode; the power supply electrode A and the power supply electrode B are powered once in the forward and reverse directions, and the power supply electrode B moves backward by a power supply electrode distance L; until the power supply electrode B moves to the Kth electrode, completing the full arrangement rolling power supply mode in which the power supply electrode A is the power supply electrode of the first electrode;
[0056] Specifically, the specific process of supplying power to the power supply electrode A and the power supply electrode B once each is as follows: after determining the positions of the power supply electrode A and the power supply electrode B on the electrode arrangement, the positive and negative electrodes of the regulated current power supply are respectively connected to supply power once, and then the negative and positive electrodes of the regulated current power supply are respectively connected to supply power once.
[0057] S22: After completing one rolling power supply, the power supply electrode A moves backward by one electrode distance to the second electrode and is fixed, and the power supply electrode B starts from the third electrode to the Kth electrode and performs rolling power supply; that is, the power supply electrode A is used as the second electrode and the rolling power supply of the power supply electrode distance from L to K is completed;
[0058] S23: until the power supply electrode A is fixed as the K-1th electrode, the power supply electrode B is set as the Kth electrode, and power supply is performed once, completing the rolling power supply process of the entire power supply electrode in the entire electrode arrangement.
[0059] Specifically, Figure 2 , Figure 3 , Figure 4 As shown, starting from the 1st electrode, the power supply electrode A is fixed as the 1st electrode, and the power supply electrode B starts from the 2nd electrode and rolls backward to the Kth electrode in sequence. This process is called completing one rolling power supply. After completing one rolling power supply, the power supply electrode A is fixed as the 2nd electrode, and the power supply electrode B repeats the above rolling power supply from the 3rd electrode; until the power supply electrode A is fixed as the K-1th electrode, the power supply electrode B is set at the Kth electrode, and the last power supply is performed, that is, the whole rolling power supply process is completed.
[0060] Specifically, Figure 2 As shown, after each power supply electrode is powered, the remaining measuring electrodes collect a series of potential difference signals with the reference electrode C after the power supply electrode A and the power supply electrode B are powered.
[0061] In the prior art, completing a rolling power supply process can only complete the profile data of one device measurement, such as the Wenner device. The method disclosed in the present invention can realize the completion of a rolling power supply, and can obtain a raw data containing a series of potential difference data of a large number of measuring points. The raw data includes a large collection of measurement data of various devices and custom devices in the prior art. From the raw data, the data of all device profiles can be directly extracted according to the acquisition characteristics of the device. Originally, multiple independent measurements were required to obtain profile data of multiple devices. The method disclosed in the present invention only requires one rolling power supply and measurement (such as laying out 100 electrodes at a time, which takes about 2-4 hours), and all profile data including Wenner, dipole-dipole, Schlumberger forward and reverse devices and custom devices can be extracted from the raw data. Compared with the full-arrangement observation method of traditional devices, the technical solution of the present application has the following advantages:
[0062] (1) It is more reasonable in theory, collects more data, and improves the inversion effect.
[0063] (2) It is more convenient in actual construction, reduces the redundancy of observation data, and reduces the number of repeated measurements, thereby improving data collection efficiency.
[0064] (3) The completeness of the observation data is guaranteed to the greatest extent.
[0065] S3: According to the power supply electrode distance, select the electrode closest to the zero potential position as the reference electrode C;
[0066] Specifically, Figure 2 As shown, when the power supply electrode distance is the minimum electrode distance L, the distance between the first electrode in the arrangement and the power supply electrode A and the distance between the last electrode in the arrangement and the power supply electrode B are calculated, and the reference electrode C is determined to be the first electrode or the last electrode in the arrangement by comparing and calculating the sizes of the two distances.
[0067] Step S3 includes:
[0068] S31: when the power supply electrode A is the first electrode and the power supply electrode distance is the minimum power supply electrode distance L, select an electrode farthest from the power supply electrode A as the reference electrode C, that is, select the Kth electrode as the reference electrode C;
[0069] S32: when the power supply electrode distance is not the minimum power supply electrode distance L, select an electrode closest to the center point of the power supply electrode as a reference electrode C; the center point of the power supply electrode represents the center point of the power supply electrode A and the power supply electrode B;
[0070] Step S32 includes:
[0071] S32a: When the power supply electrode distance is not the minimum power supply electrode distance L and is an even multiple of L, the electrode at the center point of the power supply electrode is selected as the reference electrode C;
[0072] S32b: When the power supply electrode distance is not the minimum power supply electrode distance L and is an odd multiple of L, the electrode with a smaller electrode number among the two electrodes closest to the center point of the power supply electrode is selected as the reference electrode C.
[0073] S33: When the power supply electrode A is not the first electrode and the power supply electrode distance is the minimum power supply electrode distance L, calculate the distance between the first electrode in the electrode arrangement and the power supply electrode A and the distance between the Kth electrode in the electrode arrangement and the power supply electrode B, and determine whether the reference electrode C is the first electrode or the Kth electrode by comparing and calculating the sizes of the two distances.
[0074] S4: After each power supply is completed, a potential difference series between the measuring electrode and the reference electrode C is obtained, and the potential difference series and the power supply electrode position, the measuring electrode position, the power supply current, the power supply voltage and the power supply time are used as the original data of the high-density electrical method full array measurement;
[0075] Specifically, the potential difference information between any two measuring electrodes can be obtained by simply subtracting the potential difference between the two electrodes and the reference electrode C.
[0076] Step S4 includes:
[0077] S41: After each power supply is completed, all electrodes except the power supply electrode and the reference electrode C are used as measuring electrodes to obtain a series of potential differences between the measuring electrodes and the reference electrode C;
[0078] S42: The potential difference series between the measuring electrode and the reference electrode C, the power supply electrode position, the measuring electrode position, the power supply current, the power supply voltage and the power supply time are used as the original data of the high-density electrical method full array measurement.
[0079] S5: extracting and separating various device arrangements from the original data according to the characteristics of the acquisition method of each device arrangement to obtain profile data; the devices include: Wenner device, Schlumberger forward and reverse device, dipole-dipole device and custom device, etc.; the profile data include: apparent resistivity, natural potential and apparent excitation rate;
[0080] According to the acquisition characteristics of the dipole-dipole device, the raw data is extracted and separated by device arrangement. The specific steps include:
[0081] Determine the maximum transmission and reception distance and the maximum power supply electrode distance of the dipole-dipole device;
[0082] According to the maximum receiving and transmitting distance and the maximum power supply electrode distance, a section data of a dipole-dipole device from the starting end to the ending end and a section data of a dipole-dipole device from the ending end to the starting end are extracted from the original data.
[0083] Specifically, according to the acquisition characteristics of the dipole-dipole device, the original data is extracted and separated by device arrangement, such as Figure 5 , Figure 6 shown.
[0084] According to the characteristics of the acquisition method of the Wenner device, the original data is extracted and separated by device arrangement. The specific steps include:
[0085] Determine the maximum power supply electrode distance of the Wenner device and extract a profile data of the Wenner device from the original data.
[0086] Specifically, according to the characteristics of the acquisition method of the Wenner device, the original data is extracted and separated by device arrangement, such as Figure 7 shown.
[0087] According to the collection characteristics of the Schlumberger device, the original data is extracted and separated by device arrangement. The specific steps include:
[0088] The maximum power supply electrode distance and the ratio of the maximum power supply electrode distance to the measuring electrode distance of the Schlumberger device are determined, and from the original data, a profile data of a Schlumberger device with a power supply electrode distance greater than the measuring electrode distance and a profile data of an inverted Schlumberger device with a power supply electrode distance less than the measuring electrode distance are extracted.
[0089] Specifically, according to the characteristics of the collection method of the Schlumberger device, the original data is extracted and separated by device arrangement, such as Figure 8 , Fig. 9 shown.
[0090] Specifically, this embodiment uses a high-density electrical method multi-channel full-array measurement method to measure the power supply of a power supply electrode, and all other measuring electrodes measure the potential difference series signals between it and the reference electrode C. Then, the profile data of each device arrangement is extracted through the high-density electrical method full-array measurement raw data device profile extraction algorithm, achieving a complete rolling power supply, and obtaining multiple device arrangement profile data, which greatly improves the data acquisition efficiency. At the same time, the extracted two dipole-dipole profile data of the exchange power supply electrode and the measuring electrode can also be cross-precision evaluated to determine the quality of the data.
[0091] S6: Draw a profile diagram based on the profile data and complete the full array measurement of high-density electrical method.
[0092] Specifically, Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 The cross-sectional diagram of the corresponding device arrangement data extracted from the raw data of the high-density electrical method full arrangement measurement is shown in FIG. In the figure, the red rectangular blocks represent the power supply electrodes A and B, the yellow rectangular blocks represent the measuring electrodes M and N, the blue rectangular blocks represent the reference electrode C, and the black circles represent the apparent positions of the corresponding measuring points.
[0093] in, Figure 5 The schematic diagram of the first cross-sectional data of the dipole device is shown. According to the measurement characteristics of the dipole arrangement, when a pair of power supply electrodes A and B supply power, multiple data are measured by multiple measuring electrodes M and N on the right side of the power supply electrodes, so that the distance between the power supply and measuring electrodes increases successively and rolls from left to right successively, and finally obtains the following Figure 5 Shown is the first profile measurement data of a complete dipole arrangement device. Figure 6 A schematic diagram showing the second cross-sectional data of the dipole device, and Figure 5 The first cross-sectional measurement data shown is different in that the plurality of measurement electrodes M and N are located on the left side of the power supply electrodes A and B. Figure 7 The schematic diagram of the cross-sectional data of the Wenner device shows that the measuring electrodes M and N are contained inside the power supply electrodes A and B. When a pair of power supply electrodes A and B supply power, only a pair of measuring electrodes M and N measures one data, and the AM electrode distance, MN electrode distance and NB electrode distance are equal. By increasing the power supply electrode distance, the detection depth is increased. The power supply is rolled from left to right in sequence, and the following is obtained: Figure 7 Shown is a complete profile measurement data of the Wenner device. Figure 8 A schematic diagram of the profile data of the Schlumberger device. Unlike the profile data of the Wenner device, the AB electrode distance and MN electrode distance of the Schlumberger device are proportionally rolled. The vertical resolution of the profile data for underground detection can be changed by selecting different proportional coefficients. Fig. 9 Schematic diagram showing cross-sectional data of an inverted Schlumberger device, and Figure 8 The measurement method of the Schlumberger device shown is the same, the difference is that the power supply electrodes A and B are on the inside and the measuring electrodes M and N are on both sides.
[0094] A high-density electrical method full array measurement system, the system comprises: a high-density electrical method full array measurement command generation module, a high-density electrical method full array measurement raw data storage module, and a high-density electrical method full array measurement raw data device profile extraction module;
[0095] The high-density electrical method full array measurement command generation module is connected to the high-density electrical method full array measurement raw data storage module; the high-density electrical method full array measurement raw data storage module is connected to the high-density electrical method full array measurement raw data device profile extraction module;
[0096] The high-density electrical method full array measurement command generation module is used to generate data acquisition commands that can be recognized by the high-density electrical method host hardware according to user needs; the data acquisition commands include: power supply electrode position, reference electrode position, and measurement electrode position;
[0097] The high-density electrical method full array measurement raw data storage module is used to store in real time the potential difference series between each measuring electrode and the reference electrode C, the power supply electrode position, the measuring electrode position, the power supply current size, the power supply voltage size and the power supply time collected by the high-density electrical method full array measurement electrodes;
[0098] The high-density electrical method full-array measurement raw data device profile extraction module is used to extract profile data of a Wenner device, a dipole-dipole device, a Schlumberger forward-inverted device and a custom device.
[0099] Specifically, the dipole-dipole device profile can extract two profile measurement data of the exchanged power supply electrode and the measuring electrode. After a measurement through the high-density electrical method full-array measurement raw data device profile extraction module, profile data including the Wenner device, dipole-dipole device, Schlumberger device, inverted Schlumberger device and custom device can be obtained.
[0100] The present application also discloses a computer-readable storage medium storing a plurality of instructions, wherein the instructions are suitable for a processor to load to execute the above-mentioned full-array measurement method for high-density electrical method.
[0101] The above are only exemplary embodiments of the present disclosure and cannot be used to limit the scope of the present disclosure. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the disclosure of the specification and the truth of practice, those skilled in the art will easily think of other embodiments of the present disclosure.
[0102] This application is intended to cover any variation, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the art not described in the present disclosure. The description and examples are to be regarded as exemplary only, and the scope and spirit of the present disclosure are defined by the claims.
Claims
1. A full array measurement method for high-density electrical method, characterized in that: The method comprises the following steps: S1: Assume that there are K electrodes in the entire electrode arrangement, and the distance between two adjacent electrodes is L; the distance between the power supply electrode A and the power supply electrode B is expressed as the power supply electrode distance; S2: The first electrode is used as the power supply electrode A, and the power supply electrode B is rolled from the second electrode to the Kth electrode in sequence to supply power in sequence; after the power supply electrode A is used as the first electrode to supply power, the power supply electrode A is moved backward by an electrode distance L to the second electrode position to be fixed, and the power supply electrode B is rolled from the third electrode to the Kth electrode in sequence, and the above steps are repeated until the power supply electrode A rolls to the K-1th electrode, so as to supply power for the rolling of the power supply electrode on the electrode arrangement; the power supply electrode A and the power supply electrode B are supplied with power once in the forward and reverse directions respectively; S3: According to the power supply electrode distance, select the electrode closest to the zero potential position as the reference electrode C; Step S3 includes: S31: when the power supply electrode A is the first electrode and the power supply electrode distance is the minimum power supply electrode distance L, select an electrode farthest from the power supply electrode A as the reference electrode C, that is, select the Kth electrode as the reference electrode C; S32: when the power supply electrode distance is not the minimum power supply electrode distance L, select an electrode closest to the center point of the power supply electrode as a reference electrode C; the center point of the power supply electrode represents the center point of the power supply electrode A and the power supply electrode B; Step S32 includes: S32a: When the power supply electrode distance is not the minimum power supply electrode distance L and is an even multiple of L, the electrode at the center point of the power supply electrode is selected as the reference electrode C; S32b: when the power supply electrode distance is not the minimum power supply electrode distance L and is an odd multiple of L, selecting an electrode with a smaller electrode number among the two electrodes closest to the center point of the power supply electrode as the reference electrode C; S33: when the power supply electrode A is not the first electrode and the power supply electrode distance is the minimum power supply electrode distance L, calculate the distance between the first electrode in the electrode arrangement and the power supply electrode A and the distance between the Kth electrode in the electrode arrangement and the power supply electrode B, and determine whether the reference electrode C is the first electrode or the Kth electrode by comparing and calculating the two distances; S4: After each power supply is completed, a potential difference series between the measuring electrode and the reference electrode C is obtained, and the potential difference series and the power supply electrode position, the measuring electrode position, the power supply current, the power supply voltage and the power supply time are used as the original data of the high-density electrical method full array measurement; Step S4 includes: S41: After each power supply is completed, all electrodes except the power supply electrode and the reference electrode C are used as measuring electrodes to obtain a series of potential differences between the measuring electrodes and the reference electrode C; S42: taking the potential difference series between the measuring electrode and the reference electrode C, the power supply electrode position, the measuring electrode position, the power supply current, the power supply voltage and the power supply time as the original data of the high-density electrical method full array measurement; S5: extracting and separating various device arrangements from the original data according to the characteristics of the acquisition method of each device arrangement to obtain profile data; the devices include: Wenner device, Schlumberger forward and reverse device, and dipole-dipole device; S6: Draw a profile diagram based on the profile data and complete the full array measurement of high-density electrical method.
2. A full array measurement method for high-density electrical method as claimed in claim 1, characterized in that: The specific steps of the rolling power supply include: S21: starting from the first electrode, the power supply electrode A is fixed as the first electrode, and the power supply electrode B is the second electrode; the power supply electrode A and the power supply electrode B are powered once in the forward and reverse directions, and the power supply electrode B moves backward by a power supply electrode distance L; until the power supply electrode B moves to the Kth electrode, completing the full arrangement rolling power supply mode in which the power supply electrode A is the power supply electrode of the first electrode; S22: After completing one rolling power supply, the power supply electrode A moves backward by one electrode distance to the second electrode and is fixed, and the power supply electrode B starts from the third electrode to the Kth electrode and performs rolling power supply; that is, the power supply electrode A is used as the second electrode and the rolling power supply of the power supply electrode distance from L to K is completed; S23: until the power supply electrode A is fixed as the K-1th electrode, the power supply electrode B is set as the Kth electrode, and power supply is performed once, completing the rolling power supply process of the entire power supply electrode in the entire electrode arrangement.
3. A full array measurement method for high-density electrical method as claimed in claim 1, characterized in that: According to the acquisition characteristics of the dipole-dipole device, the raw data is extracted and separated by device arrangement. The specific steps include: Determine the maximum transmission and reception distance and the maximum power supply electrode distance of the dipole-dipole device; According to the maximum receiving and transmitting distance and the maximum power supply electrode distance, a cross-sectional data of a dipole-dipole device from the starting end to the ending end and a cross-sectional data of a dipole-dipole device from the ending end to the starting end are extracted from the original data.
4. A full array measurement method for high-density electrical method as claimed in claim 1, characterized in that: According to the characteristics of the acquisition method of the Wenner device, the original data is extracted and separated by device arrangement. The specific steps include: Determine the maximum power supply electrode distance of the Wenner device and extract a profile data of the Wenner device from the original data.
5. A full array measurement method for high-density electrical method as claimed in claim 1, characterized in that: According to the collection characteristics of the Schlumberger device, the original data is extracted and separated by device arrangement. The specific steps include: The maximum power supply electrode distance and the ratio of the maximum power supply electrode distance to the measuring electrode distance of the Schlumberger device are determined, and from the original data, a profile data of a Schlumberger device with a power supply electrode distance greater than the measuring electrode distance and a profile data of an inverted Schlumberger device with a power supply electrode distance less than the measuring electrode distance are extracted.
6. A high-density electrical method full array measurement system, used to implement a full array measurement method for high-density electrical method as claimed in any one of claims 1 to 5, characterized in that: The system includes: a high-density electrical method full array measurement command generation module, a high-density electrical method full array measurement raw data storage module, and a high-density electrical method full array measurement raw data device profile extraction module; The high-density electrical method full array measurement command generation module is connected to the high-density electrical method full array measurement raw data storage module; the high-density electrical method full array measurement raw data storage module is connected to the high-density electrical method full array measurement raw data device profile extraction module; The high-density electrical method full array measurement command generation module is used to generate data acquisition commands that can be recognized by the high-density electrical method host hardware according to user needs; the data acquisition commands include: power supply electrode position, reference electrode position, and measurement electrode position; The high-density electrical method full array measurement raw data storage module is used to store in real time the potential difference series between each measuring electrode and the reference electrode C, the power supply electrode position, the measuring electrode position, the power supply current size, the power supply voltage size and the power supply time collected by the high-density electrical method full array measurement electrodes; The high-density electrical method full-array measurement raw data device profile extraction module is used to extract profile data of a Wenner device, a dipole-dipole device, a Schlumberger forward-inverted device and a custom device.
7. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores instructions, and when the instructions are executed by a computer, the method steps according to any one of claims 1 to 5 are performed.
