Power supply equipment, loads and electronic equipment
By placing output capacitors on the back of the system board and using staggered connection methods for load pins and power supply pins, the problems of loss and poor filtering effect in high current power supply are solved, achieving efficient power supply and filtering effect and reducing production costs.
Patent Information
- Application Number
- CN202310294700.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-03-23
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2043-03-23
AI Technical Summary
In high-current power supply applications, the loss caused by horizontal power supply, especially when powering processor chips, is a problem. Existing vertical power supply solutions fail to effectively meet the placement requirements of the output capacitor, affecting the filtering effect and power supply efficiency.
The output capacitor is placed on the back of the system board, and the load pins and power supply pins are arranged in an alternating pattern and connected by a conductive structure to form a Z-shaped trace. This ensures that the output capacitor and power supply are placed properly to avoid mutual interference and improve the filtering effect.
It improved power supply efficiency, reduced power loss, enhanced the power supply capacity of the power supply device to the load, reduced production costs, and increased the yield rate of production products.
Smart Images

Figure CN118689290B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of power electronics technology, specifically to a power supply device, load, and electronic equipment. Background Technology
[0002] With the rapid development of mobile internet, big data, and artificial intelligence, an increasing amount of massive amounts of data needs to be processed, analyzed, and computed, leading to ever-increasing computing power in processor chips (such as CPUs, GPUs, and DPUs). Higher computing power necessitates a larger and more powerful power supply to the processor chip. The most common power supply method is... Figure 1 and Figure 2 The illustrated horizontal power supply configuration places the power supply unit 103 and the processor chip 102 on the same side of the system board 101. To deliver current to the processor chip 102, the power supply unit 103 connects all its Vo pins (power output pin 1031) to the Vo pins (load input pin 1021) of the processor chip 102 via PCB traces on the system board 101. Similarly, the power supply unit 103's GND pin (power ground pin 1032) is connected to the processor chip 102's GND pin (load ground pin 1022). The Vo and GND pins of the processor chip 102 are typically staggered for better decoupling; therefore, the PCB traces below the processor chip 102 form a Z-shape to connect the Vo and GND pins together. To ensure a stable and reliable power supply to the processor chip 102, a certain number of output capacitors 104 must be placed on the back of the system board 101, facing the processor. The output capacitors 104 are electrically connected to the processor chip 102 through the system board vias 1011. In addition to interconnecting the processor chip 102 on the front of the system board 101 with the output capacitors 104 on the back, the system board vias 1011 can also interconnect the multi-layer traces inside the system board 101. The multi-layer trace interconnection provides more paths for current to be transferred to the processor chip 102, increases the current-carrying area, and reduces the current-carrying impedance to meet the power supply requirements of high current.
[0003] However, even with the interconnection of multi-layer traces within the system board 101 using system board vias 1011, significant losses still occur over the distance L from the power supply unit 103 to the pins of the processor chip 102 in applications requiring higher current. Simulations and measurements show that when the processor chip 102 draws approximately 500A, the losses on the horizontally powered system board 101 reach 5.1% of the overall output power. When the processor current reaches 1000A, the losses on the system board 101 reach 10.2% of the overall output power. These losses severely reduce the system's power supply efficiency.
[0004] Currently, vertical power supply is a possible solution to address the power loss problem caused by high-current horizontal power supply. An existing structure for vertically powered electronic devices is as follows: Figure 3 As shown. Unlike horizontal power supply, vertical power supply uses a power supply device 103 and a processor chip 102 that are vertically distributed and placed on the upper and lower sides of the system board 101, respectively. This brings the power supply device 103 closer to the processor chip 102, and the current output from the power supply device 103 goes directly to the processor chip 102 after passing through the system board 101. This greatly reduces the losses caused by the long trace distance between the power supply device 103 and the processor chip 102 in horizontal power supply applications. This loss value can be reduced from 5%-10% to less than 1%.
[0005] However, vertical power supply also needs to meet the following requirements.
[0006] Requirement 1: Since the output capacitor 104 needs to be connected to the back of the system board 101, and the pins of the power supply device 103 also need to be connected to the back of the system board 101, and both the output capacitor 104 and the power supply device 103 are placed vertically to the processor chip 102, the output capacitor 104 and the power supply device 103 need to be placed reasonably to avoid each other.
[0007] Requirement 2 requires meeting the placement requirements of the output capacitor 104. Since the processor chip 102 has multiple Vo and GND pins, adjacent Vo and GND pins can be considered a pin pair. In principle, each pin pair requires the output capacitor 104 to be placed close to the back of the motherboard for better filtering.
[0008] Requirement 3: The current path from power supply unit 103 to processor chip 102 is: pins of power supply unit 103 → system board vias 1011 on the soldering surface → traces on system board 101 → processor chip 102. Since the vias 1011 on system board 101 have a maximum current carrying capacity limitation, and only one via 1011 can be placed between adjacent pins of processor chip 102 on system board 101, the number of vias 1011 is close to and limited in number to the number of pins on processor chip 102. Therefore, the pins of power supply unit 103 need to be connected to as many vias 1011 as possible to ensure that the current passing through a single via 1011 does not exceed the physical limit that the system board via 1011 can withstand.
[0009] To meet the above requirements, related technologies have proposed, for example... Figure 4The diagram shows another electronic device. To meet requirement 1, the prior art integrates the output capacitor 104 into the power supply device 103, so that the output capacitor 104 is not directly placed on the system board 101, and the pins of the power supply device 103 do not need to avoid the output capacitor 104. To solve problem 3, the pins of the power supply device 103 and the pins of the processor chip 102 are arranged in the same way and connected one-to-one. Because there are corresponding system board vias 1011 near each pin of the processor chip 102, the power supply device 103 can fully connect to these system board vias 1011.
[0010] However Figure 3 The structure shown does not adequately meet requirement 2 because the output capacitor 104 is integrated into the power supply unit 103, such as... Figure 4 As shown, the output capacitor 104 needs to be connected to the system board 101 via the power supply PCB board 1033 and pins 1031 and 1032 of the power supply 103. This connection method results in high impedance, affecting the filtering effect, and causing the power supply 103 to integrate more output capacitors 104 to achieve the originally expected filtering effect.
[0011] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention
[0012] In view of the problems in the related technologies, the purpose of this application is to provide a power supply device, load and electronic equipment that can help improve the power supply capability to the load.
[0013] The first aspect of this application provides an electronic device, comprising:
[0014] The system board includes a first surface and a second surface disposed opposite to each other along a first direction;
[0015] A load is disposed on the first side of the system board. The load includes a power supply area, which includes load pins arranged in multiple rows along a second direction and in multiple columns along a third direction.
[0016] At least one column of output capacitors, each column of the output capacitors being disposed on the second side of the system board along the third direction;
[0017] In the power supply area, at least one row is a first row, the first row includes a plurality of load pin groups arranged sequentially along the second direction, each load pin group includes at least two load pins of the same polarity, and the polarity of each load pin group is opposite to that of the adjacent load pin group;
[0018] In the first row, the first load pin of each load pin group along the second direction is a first position pin, and the two ends of the vertical projection of the output capacitor in each column in the power supply area are located on both sides of at least one first position pin on the third upward center line.
[0019] Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.
[0020] A second aspect of this application provides a power supply device for supplying power to a load on a system board, the system board including a first surface and a second surface disposed opposite to each other along a first direction;
[0021] The load is disposed on the first side of the system board, and the load includes a power supply area, the power supply area including load pins arranged in multiple rows along the second direction and in multiple columns along the third direction;
[0022] The power supply device is disposed on the second side of the system board. The power supply device has multiple power supply pins on the side facing the system board. Each power supply pin is connected to the load pin of the same polarity through the conductive structure of the system board.
[0023] At least one column of output capacitors is connected in parallel between the power supply device and the load, and each column of output capacitors is disposed on the second side of the system board along the third direction;
[0024] In the power supply area, at least one row is a first row, the first row includes a plurality of load pin groups arranged sequentially along the second direction, each load pin group includes at least two load pins of the same polarity, and the polarity of each load pin group is opposite to that of the adjacent load pin group;
[0025] In the first row, the first load pin of each load pin group along the second direction is a first position pin, and the two ends of the vertical projection of the output capacitor in each column in the power supply area are located on both sides of at least one first position pin on the third upward center line.
[0026] Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.
[0027] A third aspect of this application provides a load, including:
[0028] A power supply area, the power supply area including load pins arranged in multiple rows along a second direction and in multiple columns along a third direction;
[0029] The power supply area includes at least one row as a first row, which includes a plurality of load pin groups arranged sequentially along the second direction. Each load pin group includes at least two load pins of the same polarity, and the polarity of each load pin group is opposite to that of the adjacent load pin group. The power supply area also includes at least one second row, in which the load pin arrangement of the second row is offset by one load pin along the second direction compared to the load pin arrangement of the first row. The at least one first row is arranged adjacent to the at least one second row.
[0030] Wherein, the second direction and the third direction are perpendicular to each other.
[0031] A fourth aspect of this application provides an electronic device including a load as described in the third aspect above, and further including a power supply device, at least one column of output capacitors, and a system board. The system board includes a first surface and a second surface disposed opposite to each other along a first direction. The load is disposed on the first surface of the system board, and the power supply device and the output capacitors are disposed on the second surface of the system board.
[0032] The power supply device, load, and electronic equipment provided in this application have the following advantages:
[0033] By adopting this application, the output capacitor used for filtering is placed on the back of the system board, and is closer to the load input pin and load ground pin, resulting in better filtering performance. Furthermore, the output capacitor and power supply device are strategically placed, avoiding each other. The positions of the power supply output pin and power supply ground pin of the power supply device correspond to conductive structures of the same polarity, ensuring that all conductive structures can carry current without exceeding their current-carrying capacity. The output capacitors can be arranged neatly with opposite polarities, making it easier to bring out the power supply device leads. Attached Figure Description
[0034] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings.
[0035] Figure 1 This is a schematic diagram of the structure of a horizontally powered electronic device in the prior art;
[0036] Figure 2 yes Figure 1 The schematic diagram of the electronic device from another perspective shows the pins of a horizontally powered load;
[0037] Figure 3 This is a schematic diagram of the structure of a vertically powered electronic device in the prior art;
[0038] Figure 4 This is a schematic diagram of the structure of a vertically powered electronic device in related technologies;
[0039] Figure 5 yes Figure 4 Enlarged view inside the middle circle;
[0040] Figure 6 This is a side view of an electronic device according to an embodiment of this application;
[0041] Figure 7 yes Figure 6 The schematic diagram of the electronic device from another perspective shows one arrangement of the power supply area of the load;
[0042] Figure 8 yes Figure 7 A schematic diagram of a first row of power supply areas for the load shown;
[0043] Figure 9 yes Figure 7 A schematic diagram of a second row of the power supply area for the load shown;
[0044] Figure 10 (a) and Figure 10 (b) is a schematic diagram of the wiring arrangement of the power supply area of a load according to an embodiment of this application;
[0045] Figure 11 (a) and (b) are schematic diagrams of the structure of an electronic device according to another embodiment of this application, showing another wiring layout of the power supply area of the load;
[0046] Figure 12 This is a schematic diagram of the structure of an electronic device according to another embodiment of the present application, showing another arrangement of the power supply area of the load;
[0047] Figure label:
[0048] Related technologies
[0049] 101 System Board 1031 Power Supply Output Pin
[0050] 1011 System board via 1032 Power supply / ground pin
[0051] 102 Processor Chip 1033 Power Supply PCB Board
[0052] 1021 Load Input Pin; 1034 Power Supply PCB Via.
[0053] 1022 Load ground pin; 104 Output capacitor
[0054] 103 Power Supply Unit
[0055] This application
[0056] 1 System board 23 load pin group
[0057] 11 First face 231 First position pin
[0058] 12 Page 2, Section 3: Power Supply Device
[0059] 13 Conductive structure 31 Power output pin
[0060] 2. Load 32 power supply ground pin
[0061] 21 Load input pin 4 Output capacitor
[0062] 22 Load ground pin Detailed Implementation
[0063] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The words “or” and “or” in the specification may mean “and” or “or”. Although the terms “upper,” “lower,” “between,” etc., may be used in this specification to describe different exemplary features and components of this application, these terms are used herein only for convenience, such as the orientation according to the examples described in the accompanying drawings. Nothing in this specification should be construed as requiring a specific three-dimensional orientation of the structure to fall within the scope of this application. Although “first” or “second,” etc., are used in this specification to denote certain features, they are merely indicative of function and not as a limitation on the number or importance of specific features.
[0064] Figures 6-10 The structure of an electronic device according to an embodiment of this application is shown. In this embodiment, the electronic device 100 includes a system board 1, a load 2, at least one column of output capacitors 4, and a power supply device 3. The output capacitors 4 are connected between the power supply device 3 and the load 2 for filtering the energy input to the load 2. Definition Figure 6 The z-direction shown is the first direction, and the x-direction is the second direction. Figure 7The y-direction shown is the third direction. The first direction z, the second direction x, and the third direction y are perpendicular to each other. The load 2 is, for example, a processor chip, which includes a CPU, GPU, TPU, or NPU. In other alternative embodiments, the load 2 can also be other types of powered electronic devices, components, or assemblies, all of which are within the scope of protection of this application. The system board 1 is a PCB board, including a first surface 11 and a second surface 12 disposed opposite to each other along the first direction z. Figure 6 From the perspective of the first side 11, it is the upper surface of the system board 1, and the second side 12 is the lower surface of the system board 1, which can also be called the back side.
[0065] like Figure 6 As shown, the load 2 is disposed on the first surface 11 of the system board 1, and the load 2 includes a rectangular power supply area, such as... Figure 7 As shown, the power supply area includes load pins arranged in multiple rows along a second direction x and in multiple columns along a third direction y, i.e., the second direction x is the row direction and the third direction y is the column direction. Preferably, the power supply area includes at least three rows of load pins, and the load pins include multiple load input pins 21 and load ground pins 22. Each column of the output capacitors 4 is disposed on the second surface 12 of the system board 1 along the third direction y. The power supply device 3 is disposed on the second surface 12 of the system board 1, and the side of the power supply device 3 facing the system board 1 has multiple power supply pins, and each power supply pin is connected to the load pin of the same polarity through the conductive structure 13 of the system board 1. The conductive structure 13 includes vias or blind / buried vias.
[0066] The power supply area includes at least one first row, which can be one or more rows. For example... Figure 7 As shown, in this embodiment, the three rows corresponding to y=1, y=3, and y=5 are one or more rows. For example... Figure 8 As shown, the first arrangement row includes a plurality of load pin groups 23 arranged sequentially along the second direction x. Each load pin group 23 includes at least two load pins of the same polarity, and the polarity of each load pin group 23 is opposite to that of its adjacent load pin group 23. Therefore, in the first arrangement row, load pin groups 23 of different polarities can be staggered in the x-direction, which is beneficial for staggered decoupling. Furthermore, load pins of the same polarity appear consecutively each time, and each consecutive appearance is at least twice.
[0067] Figure 8Each dashed box in the diagram represents a load pin group 23. The first load pin group 23 includes two load input pins 21, the second load pin group 23 includes two load ground pins 22, the third load pin group 23 includes two load input pins 21, and so on. In this embodiment, in the first row, the number of pins in each group of load input pins 21 is the same, the number of pins in each group of load ground pins 22 is the same, and the number of pins in each group of load input pins 21 is the same as the number of pins in each group of load ground pins 22, but this application is not limited to this. The number of load pins in each load pin group 23 is not limited to 2, but can also be 3, 4, or more, as long as the number of load pins in each load pin group 23 is greater than or equal to 2. In the first row, the first load pin of each load pin group 23 along the second direction x is defined as the first position pin 231, such as... Figure 8 The leftmost pin in each dashed box is the first position pin 231. The power supply area may include one or more first rows, and when multiple first rows are included, each first row has the same arrangement.
[0068] Combination Figure 7 and Figure 8 It can be seen that the two ends of the vertical projection of each column of output capacitors 4 in the power supply area are located on both sides of at least one of the first position pins 231 on the third-direction upward center line. In this embodiment, the vertical projection of the output capacitors 4 in the power supply area refers to the orthographic projection of the output capacitors 4 along the third direction z in the xy plane. For example, in Figure 7From the perspective of [reference to a specific location], the two ends of the vertical projection of the first column of output capacitors 4 in the power supply area are located on the left and right sides of the first position pin 231 of the first load pin group 23 on the third upward center line. The two ends of the vertical projection of the second column of output capacitors 4 in the power supply area are located on the left and right sides of the first position pin 231 of the second load pin group 23 on the third upward center line, and so on. In this embodiment, the number of columns of output capacitors 4 is equal to the number of load pin groups 23 in a row of the first arrangement. That is, for a row of the first arrangement, the first position pin 231 of each load pin group 23 corresponds to one column of output capacitors 4, and the two ends of the vertical projection of each column of output capacitors 4 in the power supply area are located on the left and right sides of the corresponding first position pin 231 on the third upward center line. In other alternative embodiments, fewer columns of output capacitors 4 can be provided, such as only the first position pin 231 of the first load pin group 23 and the third load pin group 23 corresponding to one column of output capacitors 4, etc., all of which are within the protection scope of this application. In the third direction y, the vertical projection of the output capacitors 4 in the power supply area is located between two adjacent rows of load pins. A row of output capacitors 4 is provided between every two adjacent rows of load pins. In different embodiments, the number of rows of output capacitors 4 can be increased or decreased as needed. A larger number of output capacitors 4 can achieve better filtering results.
[0069] Therefore, as Figure 6 As shown, the output capacitor 4 used for filtering is placed on the back of the system board 1, and is closer to the load input pin 21 and the load ground pin 22, resulting in better filtering. Furthermore, the output capacitor 4 and the power supply device 3 are strategically placed to avoid each other. Figure 7 As shown, the two poles (two ends) of the output capacitor 4 can be neatly distributed on both sides of the center line of the third direction y of the first row of pins. The connection between the power supply pins of the power supply device 3 and the system board 1 is more regular, and more conductive structures 13 can carry the current of the power supply device 3. The structure of this electronic device can effectively improve the vertical power supply capability of the power supply device 3 to the load 2, enabling the power supply device 3 to provide a larger vertical power supply current to the load 2.
[0070] like Figure 7 As shown, the power supply area also includes a second row, which can be one or more rows, such as... Figure 7 The two rows corresponding to y=2 and y=4 are the second row arrangement. When the power supply area includes multiple second rows, the arrangement of the multiple second rows is also the same. The first row and the second row are alternately arranged in the third direction y, but this application is not limited to this. Figure 9An exemplary configuration of a second row is shown. The load pin arrangement of the second row is offset by one load pin along the second direction x compared to the load pin arrangement of the first row. The polarity of the first and second load pins in the second row along the second direction x is opposite. (Comparison) Figure 9 and Figure 8 It can be seen that the load pins of the first row are shifted to the right by one load pin to become the corresponding load pins of the second row. Furthermore, based on the polarity of the second load pin in the second row after the shift, a load pin with the opposite polarity is determined and becomes the first load pin of the second row. Figure 9 In the example, because the second load pin in the second row after offset is the load input pin 21, the first load pin in the second row is the load ground pin 22. The number of the second row can be selected and set as needed. In different embodiments, all rows of the power supply area can be the first row, or a combination of one or more first rows and one or more second rows. The first and second rows can be staggered in the third direction y, for example, rows 1, 3, and 5 are the first row, and rows 2 and 4 are the second row. They can also be arranged randomly, for example, rows 1, 2, and 5 are the first row, and rows 3 and 4 are the second row, or rows 1, 2, 4, and 5 are the first row, and row 3 is the second row.
[0071] Figure 10 It shows Figure 7 Wiring method for medium load pins. From Figure 10 As can be seen, by adopting this arrangement, the first load input pin 21 or load ground pin 22 of each first row can ultimately be interconnected through Z-shaped traces, preventing any disconnection and facilitating the wiring design of system board 1. The conductive structures 13 in each column are connected by Z-shaped traces, all sharing the same polarity, and at least two adjacent columns of conductive structures share the same polarity, which is beneficial for wiring layout design. In a structure with both first and second rows, in addition to interleaving in the second direction x, interleaving can also be achieved in the third direction y, allowing for more flexible placement of the output capacitors 4.
[0072] like Figure 10 (a) and Figure 10As shown in (b), the power supply device 3 has power supply output pins 31 (represented as Vo in the figure) and power supply ground pins 32 (represented as GND in the figure). Each power supply pin is located between two adjacent columns of output capacitors 4, thus providing a spatially advantageous positional relationship for vertical power supply among the load pins, output capacitors 4, and power supply pins. Both the power supply output pin 31 and the load input pin 21 are Vo polarity, and both the power supply ground pin 32 and the load ground pin 22 are GND polarity. The power supply output pin 31 and the power supply ground pin 32 are staggered in the second direction x. In the second direction x, the length of each power supply pin is less than or equal to the center-to-center distance between two adjacent first position pins 231 minus the length D of the output capacitor 4. In this embodiment, the center-to-center distance between two adjacent first position pins 231 is equal to 2*pitch (pitch represents the center-to-center distance between two adjacent load pins). Therefore, in the second direction x, the length d of each power supply pin ≤ 2*pitch - D, and the center-to-center distance between two adjacent power supply pins is 2*pitch.
[0073] like Figure 10 (a) and Figure 10 As shown in (b), the system board 1 has multiple columns of conductive structures 13 corresponding to the position of the power supply area. Each column of conductive structures 13 is located on one side of a column of output capacitors 4, and each conductive structure 13 is aligned with the adjacent output capacitor 4 in the second direction x. The load pins of the column of output capacitors 4 adjacent to the first side of the vertical projection of the power supply area have the same polarity, and the load pins of the column of output capacitors 4 adjacent to the second side have the same polarity. The polarities of the load pins of the column of output capacitors 4 on the first side are opposite to those of the load pins of the column of output capacitors 4 on the second side. For example, the load pins adjacent to the right of the first column of output capacitors 4 (load pins with x=2) are all load input pins 21; the load pins adjacent to the left of the second column of output capacitors 4 (load pins with x=2) are all load input pins 21; the load pins adjacent to the right of the second column of output capacitors 4 (x=4) are all load ground pins 22; the load pins adjacent to the left of the third column of output capacitors 4 (x=4) are all load ground pins 22; the load pins adjacent to the right of the third column of output capacitors 4 (x=6) are all load input pins 21, and so on.
[0074] like Figure 10 (a) and Figure 10 As shown in (b), in this embodiment, the conductive structures 13 in the same column are connected to the power supply pins of the same polarity, so the output capacitors 4 can be arranged in columns between the two columns of conductive structures 13. For example, in Figure 10 (a) and Figure 10From the perspective of (b), the first column of conductive structures 13 are all connected to the power output pin 31 via Z-shaped traces, the second column of conductive structures 13 are all connected to the power output pin 31 via Z-shaped traces, and the third column of conductive structures 13 are all connected to the power ground pin 32 via Z-shaped traces. The positions of the power output pin 31 and the power ground pin 32 of the power supply device 3 correspond to the conductive structures 13 of the same polarity, and all conductive structures 13 can carry current without exceeding their current carrying capacity. The output capacitors 4 can achieve opposite polarities and be neatly arranged, making it easier to bring out the leads of the power supply device 3. In the second direction x, the capacitor pins of two adjacent output capacitors 4 have the same polarity. The polarity of each power supply pin and the pin of the adjacent output capacitor 4 is the same. For example, in Figure 10 (a) and Figure 10 From the perspective of (b), in the second direction x, the right end of the first column output capacitor 4 is opposite to the left end of the second column output capacitor 4, and they have the same polarity. The right end of the second column output capacitor 4 is opposite to the left end of the third column output capacitor 4, and they have the same polarity, and so on, with subsequent columns of output capacitor 4 having the same characteristics. The space between two adjacent columns of output capacitor 4 can be used for the pins of the power supply device 3 to make connections. Figure 10 (a) and Figure 10 (b) Another feature of the arrangement is that the first row and the second row are arranged alternately. In addition to the benefits mentioned above, it is also possible to form an alternate arrangement of pins with different polarities in the Y direction. In this way, the output capacitors can even be rotated 90° and arranged along the Y direction, which improves the flexibility of the output capacitor arrangement and is more conducive to the system design.
[0075] like Figure 11 Figures (a) and (11b) show schematic diagrams of another electronic device and its power supply area arrangement according to an embodiment of this application. This embodiment is similar to... Figure 10 The difference between the layouts shown in (a) and (10b) lies in the arrangement of the first row. Figure 11 In the arrangements shown in (a) and (11b), y=1, y=2, y=4, and y=6 form the first row, and y=3 and y=5 form the second row. In the first row, the first load pin group 23 includes three load ground pins 22, the second load pin group 23 includes two load input pins 21, the third load pin group 23 includes four load ground pins 22, the fourth load pin group 23 includes three load input pins 21, and the fifth load pin group 23 includes two load ground pins 22. Therefore, Figure 11 (a) and Figure 11The first row in (b) also satisfies the rule of including multiple load pin groups 23 arranged sequentially along the second direction, each load pin group 23 including at least two load pins of the same polarity, and the load pin group 23 having opposite polarities to its adjacent load pin group 23. Furthermore, different load pin groups 23 with the same polarity may include different numbers of load pins, and different load pin groups 23 with different polarities may also include different numbers of load pins. The load pin arrangement of the second row is offset by one load pin along the second direction x compared to the load pin arrangement of the first row, and the first load pin of the second row along the second direction has opposite polarities to the second load pin.
[0076] like Figure 11 (a) and Figure 11 As shown in (b), the two ends of the vertical projection of each column of the output capacitor 4 in the power supply area are located on both sides of at least one of the first position pins 231 on the third upward center line. For example, in Figure 11 (a) and Figure 11 From the perspective of (b), the two ends of the vertical projection of the first column of output capacitors 4 in the power supply area are located on the left and right sides of the first position pin 231 of the first load pin group 23 on the third-direction upward center line. The two ends of the vertical projection of the second column of output capacitors 4 in the power supply area are located on the left and right sides of the first position pin 231 of the second load pin group 23 on the third-direction upward center line, and so on. In this embodiment, the number of columns of output capacitors 4 is equal to the number of load pin groups 23 in a row of the first arrangement, that is, for a row of the first arrangement, the first position pin 231 of each load pin group 23 corresponds to a column of output capacitors 4, and the two ends of the vertical projection of each column of output capacitors 4 in the power supply area are located on the left and right sides of the corresponding first position pin 231 on the third-direction upward center line. In the third direction y, the vertical projection of the output capacitors 4 in the power supply area is located between two adjacent rows of load pins. There is one row of output capacitors 4 between each two adjacent rows of load pins. In different embodiments, the number of rows and columns of output capacitors 4 can be increased or decreased as needed. When the number of output capacitors 4 is large, a better filtering effect can be obtained.
[0077] This arrangement also provides excellent load power supply performance. Specifically, the output capacitor 4 used for filtering is placed on the back of the system board 1, and is closer to the load input pin 21 and the load ground pin 22, resulting in better filtering. Furthermore, the output capacitor 4 and the power supply device 3 are strategically placed, avoiding each other. The two terminals of the output capacitor 4 can be neatly distributed on both sides of the center line of the head pin in the third direction (y). The connection between the power supply pins of the power supply device 3 and the system board 1 is more regular, allowing for simpler manufacturing processes to produce this neatly arranged pin configuration, reducing production costs. Simultaneously, this connection allows for more conductive structures 13 to carry the current of the power supply device 3. This electronic device structure effectively improves the vertical power supply capability of the power supply device 3 to the load 2, enabling the power supply device 3 to provide a larger vertical current to the load 2.
[0078] from Figure 11 (a) and Figure 11 As shown in (b), by adopting this arrangement, the first load input pin 21 or load ground pin 22 of each first row can ultimately be interconnected through Z-shaped traces, preventing any disconnection and facilitating the wiring design of system board 1. The conductive structures 13 in each column are connected by Z-shaped traces, all sharing the same polarity, and at least two adjacent columns of conductive structures share the same polarity, which is beneficial for wiring layout design. In a structure with both first and second rows, in addition to interleaving in the second direction x, interleaving can also be achieved in the third direction y, allowing for more flexible placement of the output capacitor 4.
[0079] like Figure 11 (a) and Figure 11 As shown in (b), each of the power supply pins is respectively located between two adjacent columns of output capacitors 4. The power supply output pin 31 and the power supply ground pin 32 are staggered in the second direction x. In the second direction x, the length of each power supply pin is less than or equal to the center distance between two adjacent first position pins 231 minus the length D of the output capacitor 4. In this embodiment, the center distance between the first position pins 231 of the first load pin group 23 and the first position pins 231 of the second load pin group 23 is equal to 3 * pitch (pitch represents the center distance between two adjacent load pins, see...). Figure 10 (a) and Figure 10 (Example of (b)) Therefore, in the second direction x, the length of the first power supply pin is ≤3*pitch-D. By increasing the center distance between two adjacent first position pins, the maximum pin length of the power supply device can also be increased, which facilitates the fabrication of the power supply device pins, reduces production difficulty, and improves production yield.
[0080] like Figure 11 (a) and Figure 11 As shown in (b), the system board 1 has multiple columns of conductive structures 13 corresponding to the position of the power supply area. Each column of conductive structures 13 is located on one side of a column of output capacitors 4, and each conductive structure 13 is aligned with the adjacent output capacitor 4 in the second direction. The load pins of the column of output capacitors 4 adjacent to the first side of the vertical projection of the power supply area have the same polarity, and the load pins of the column of output capacitors 4 adjacent to the second side have the same polarity. The polarities of the load pins of the column of output capacitors 4 on the first side are opposite to those of the load pins of the column of output capacitors 4 on the second side. For example, the load pins adjacent to the right of the first column of output capacitors 4 (load pins with x=2) are all load ground pins 22; the load pins adjacent to the left of the second column of output capacitors 4 (load pins with x=3) are all load ground pins 22; the load pins adjacent to the right of the second column of output capacitors 4 (x=5) are all load input pins 21; the load pins adjacent to the left of the third column of output capacitors 4 (x=5) are all load input pins 21; the load pins adjacent to the right of the third column of output capacitors 4 (x=7) are all load ground pins 22, and so on.
[0081] like Figure 11 (a) and Figure 11 As shown in (b), in this embodiment, the conductive structures 13 in the same column are connected to the power supply pins of the same polarity, so the output capacitors 4 can be arranged in columns between the two columns of conductive structures 13. For example, in Figure 11 (a) and Figure 11 From the perspective of (b), the first column of conductive structures 13 are all connected to the power supply ground pin 32 via Z-shaped traces; the second column of conductive structures 13 are all connected to the power supply ground pin 32 via Z-shaped traces; the third column of conductive structures 13 are all connected to the power supply ground pin 32 via Z-shaped traces; the fourth column of conductive structures 11 are all connected to the power supply output pin 31 via Z-shaped traces; and the fifth column of conductive structures 11 are all connected to the power supply output pin 31 via Z-shaped traces. The positions of the power supply output pin 31 and the power supply ground pin 32 of the power supply device 3 correspond to the conductive structures 13 of the same polarity, and all conductive structures 13 can carry current without exceeding their current carrying capacity. The output capacitors 4 can achieve opposite polarities and be neatly arranged, making it easier to lead out the pins of the power supply device 3. In the second direction x, the capacitor pins of two adjacent output capacitors 4 have the same polarity. The polarity of each power supply pin and the pin of the adjacent output capacitor 4 is the same. For example, in Figure 11 (a) and Figure 11From the perspective of (b), in the second direction x, the right end of the first column output capacitor 4 is opposite to the left end of the second column output capacitor 4, and they have the same polarity. The right end of the second column output capacitor 4 is opposite to the left end of the third column output capacitor 4, and they have the same polarity, and so on, with subsequent columns of output capacitor 4 having the same characteristics. The space between two adjacent columns of output capacitor 4 can be used for the pins of the power supply device 3 to make connections.
[0082] like Figure 12 The diagram shows another embodiment of the power supply area layout according to this application. This layout is similar to... Figure 10 (a) and Figure 10 (b) and Figure 11 (a) and Figure 11 (b) The difference in the arrangement shown is that each row in the power supply area is the first arrangement row, that is, there is no second arrangement row, and the polarity of the load pins in the same column in the power supply area is the same. This structure also has Figure 10 (a) and Figure 10 (b) and Figure 11 (a) and Figure 11 The main advantages of the structure in (b) are as follows: The output capacitor 4 for filtering is placed on the back of the system board 1, and is closer to the load input pin 21 and the load ground pin 22, resulting in the best filtering effect. Furthermore, the output capacitor 4 and the power supply device 3 are rationally placed, avoiding each other. The two poles of the output capacitor 4 can be neatly distributed on both sides of the center line of the head pin in the third direction y. The connection between the power supply pin of the power supply device 3 and the system board 1 is more regular, and more conductive structures 13 can carry the current of the power supply device 3. The load pins adjacent to the first side of the vertical projection of each column of output capacitors 4 in the power supply area have the same polarity, and the load pins adjacent to the second side have the same polarity. The load pins in the first side have opposite polarities to those in the second side. The conductive structures 13 in the same column are connected to the power supply pins of the same polarity. In the second direction x, the capacitor pins of two adjacent output capacitors 4 have the same polarity. (Except for...) Figure 10 (a) and Figure 10 (b) and Figure 11 (a) and Figure 11 (b) In addition to similar advantages, this neat and regular arrangement facilitates the design of internal traces in the processor, especially for larger processor chips with more pins.
[0083] like Figure 10-11This application embodiment also provides a power supply device 3 for supplying power to a load 2 on a system board 1. The system board 1 includes a first surface 11 and a second surface 12 disposed opposite to each other along a first direction. The load 2 is disposed on the first surface of the system board and includes a power supply area. The power supply area includes load pins arranged in multiple rows along a second direction and multiple columns along a third direction. The power supply device 3 is disposed on the second surface of the system board. The side of the power supply device 3 facing the system board has multiple power supply pins, and each power supply pin is connected to the load pins of the same polarity through the conductive structure of the system board 1. At least one column of output capacitors is connected between the power supply device 3 and the load 2. The output capacitor is disposed on the second surface of the system board along the third direction; wherein, at least one row in the power supply area is a first arrangement row, the first arrangement row includes a plurality of load pin groups arranged sequentially along the second direction, each load pin group includes at least two load pins of the same polarity, and the polarity of each load pin group is opposite to that of the adjacent load pin group; in the first arrangement row, the first load pin of each load pin group along the second direction is a first position pin, and the two ends of the vertical projection of each column of the output capacitor in the power supply area are located on both sides of at least one first position pin on the center line of the third direction; wherein, the first direction, the second direction, and the third direction are perpendicular to each other. The pins of the power supply device can be neatly arranged, which is easy to manufacture and reduces manufacturing costs; because the pins are neat, the power supply device is also easy to solder to the system board, improving production efficiency.
[0084] like Figure 10-12 This application also provides a load 2, comprising: a power supply area, the power supply area including load pins arranged in multiple rows along a second direction and in multiple columns along a third direction; wherein, at least one row in the power supply area is a first row, the first row including multiple load pin groups arranged sequentially along the second direction, each load pin group including at least two load pins of the same polarity, and each load pin group having opposite polarity to its adjacent load pin group; the power supply area further includes at least one second row, the load pin arrangement of the second row being offset by one load pin along the second direction compared to the load pin arrangement of the first row, the at least one first row being adjacent to the at least one second row; wherein, the second direction and the third direction are perpendicular to each other. The load, through a specific pin arrangement, allows pins of the same polarity to be more concentrated, and pins of different polarities to be arranged alternately, facilitating the placement of filter capacitors; simultaneously, the combination of the first row and the second row facilitates the system board to connect pins of the same polarity using Z-shaped traces, simplifying board design.
[0085] In some embodiments, the power supply area includes at least two rows of the first arrangement and at least two rows of the second arrangement, with the first and second rows alternating. In some embodiments, each load pin group in the first row contains the same number of load pins.
[0086] like Figure 10-12 This application also provides an electronic device 100, including the load 2 described above, and further including a power supply device 3, at least one row of output capacitors 4 and a system board 1. The system board 1 includes a first surface 11 and a second surface 12 disposed opposite to each other along a first direction. The load 2 is disposed on the first surface 11 of the system board 1, and the power supply device 3 and the output capacitors 4 are disposed on the second surface 12 of the system board 1.
[0087] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.
Claims
1. An electronic device, characterized in that, include: The system board includes a first surface and a second surface disposed opposite to each other along a first direction; A load is disposed on the first side of the system board. The load includes a power supply area, which includes load pins arranged in multiple rows along a second direction and in multiple columns along a third direction. At least one column of output capacitors, each column of the output capacitors being disposed on the second side of the system board along the third direction; In the power supply area, at least one row is a first row, the first row includes a plurality of load pin groups arranged sequentially along the second direction, each load pin group includes at least two load pins of the same polarity, and the polarity of each load pin group is opposite to that of the adjacent load pin group; In the first row, the first load pin of each load pin group along the second direction is a first position pin, and the two ends of the vertical projection of the output capacitor in each column in the power supply area are located on both sides of at least one first position pin on the third upward center line. Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.
2. The electronic device according to claim 1, characterized in that, Also includes: A power supply device is disposed on the second side of the system board. The power supply device has multiple power supply pins on the side facing the system board. Each power supply pin is connected to the load pin of the same polarity through the conductive structure of the system board. The output capacitor is connected between the power supply device and the load.
3. The electronic device according to claim 1, characterized in that, Each row in the power supply area is the first arrangement row, and the polarity of the load pins in the same column in the power supply area is the same.
4. The electronic device according to claim 1, characterized in that, The power supply area further includes at least one second row, wherein the load pin arrangement of the second row is offset by one load pin compared to the load pin arrangement of the first row along the second direction; and, The first load pin of the second row along the second direction has the opposite polarity to the second load pin.
5. The electronic device according to claim 1, characterized in that, For a first row, the first position pin of each load pin group corresponds to a column of output capacitors, and the two ends of the vertical projection of each column of output capacitors in the power supply area are respectively located on both sides of the corresponding first position pin on the third upward center line.
6. The electronic device according to claim 1, characterized in that, In the third direction, the vertical projection of the output capacitor in the power supply area lies between two adjacent rows of load pins.
7. The electronic device according to claim 6, characterized in that, The at least one column of output capacitors includes multiple columns of output capacitors, and in the third direction, there is a row of output capacitors between every two adjacent rows of load pins.
8. The electronic device according to claim 1, characterized in that, The load pins of each column of output capacitors on the first side of the vertical projection of the power supply area have the same polarity, the load pins of each column on the second side have the same polarity, and the load pins of the first side have opposite polarities to the load pins of the second side.
9. The electronic device according to claim 2, characterized in that, The power supply device includes a power output pin and a power ground pin, which are alternately arranged in the second direction.
10. The electronic device according to claim 9, characterized in that, The at least one column of output capacitors includes multiple columns of output capacitors, and each of the power supply pins is respectively located between two adjacent columns of output capacitors.
11. The electronic device according to claim 10, characterized in that, In the second direction, the length of each of the power supply pins is less than or equal to the center distance between two adjacent first position pins minus the length of the output capacitor.
12. The electronic device according to claim 10, characterized in that, The conductive structure includes vias or blind vias; The system board has multiple columns of conductive structures corresponding to the position of the power supply area. Each column of conductive structures is located on one side of a column of output capacitors, and each conductive structure is aligned with the adjacent output capacitor in the second direction.
13. The electronic device according to claim 12, characterized in that, The conductive structures in the same column are connected to the power supply pins of the same polarity.
14. The electronic device according to claim 1, characterized in that, The at least one column of output capacitors includes multiple columns of output capacitors, and in the second direction, the capacitor pins of two adjacent output capacitors have the same polarity.
15. The electronic device according to claim 2, characterized in that, The polarity of each of the power supply pins and the pins of the adjacent output capacitors is the same.
16. The electronic device according to claim 1, characterized in that, The load pins include load input pins and load ground pins. In the first row, each group of load input pins has the same number of pins, and each group of load ground pins has the same number of pins.
17. The electronic device according to claim 1, characterized in that, The power supply area includes multiple first rows, and the load pins of the multiple first rows have the same arrangement. The power supply area includes at least 3 rows and at least 6 columns of load pins, and the at least one column of output capacitors includes at least 2 rows and at least 2 columns of output capacitors.
18. The electronic device according to claim 1, characterized in that, The load is a processor chip, which includes a CPU, GPU, TPU, or NPU.
19. A power supply device, characterized in that, The power supply device is used to supply power to the load on the system board, the system board including a first surface and a second surface disposed opposite to each other along a first direction; The load is disposed on the first side of the system board, and the load includes a power supply area, the power supply area including load pins arranged in multiple rows along the second direction and in multiple columns along the third direction; The power supply device is disposed on the second side of the system board. The power supply device has a plurality of power supply pins on the side facing the system board. Each of the power supply pins is connected to the load pin of the same polarity through the conductive structure of the system board. At least one column of output capacitors is connected between the power supply device and the load, and each column of output capacitors is disposed on the second side of the system board along the third direction; In the power supply area, at least one row is a first row, the first row includes a plurality of load pin groups arranged sequentially along the second direction, each load pin group includes at least two load pins of the same polarity, and the polarity of each load pin group is opposite to that of the adjacent load pin group; In the first row, the first load pin of each load pin group along the second direction is a first position pin, and the two ends of the vertical projection of the output capacitor in each column in the power supply area are located on both sides of at least one first position pin on the third upward center line. Wherein, the first direction, the second direction, and the third direction are perpendicular to each other.
20. A load, characterized in that, include: A power supply area, the power supply area including load pins arranged in multiple rows along a second direction and in multiple columns along a third direction; The power supply area includes at least one row as a first row, which includes a plurality of load pin groups arranged sequentially along the second direction. Each load pin group includes at least two load pins of the same polarity, and the polarity of each load pin group is opposite to that of the adjacent load pin group. The power supply area also includes at least one second row, in which the load pin arrangement of the second row is offset by one load pin along the second direction compared to the load pin arrangement of the first row. The at least one first row is arranged adjacent to the at least one second row. Wherein, the second direction and the third direction are perpendicular to each other.
21. The load according to claim 20, characterized in that, Within the power supply area, there are at least two rows of the first arrangement and at least two rows of the second arrangement, and the first arrangement and the second arrangement are arranged alternately.
22. The load according to claim 20, characterized in that, Each of the load pin groups in the first row contains the same number of load pins.
23. An electronic device, characterized in that, The load comprising any one of claims 20 to 22 further comprises a power supply device, at least one column of output capacitors and a system board, the system board comprising a first side and a second side disposed opposite to each other along a first direction, the load being disposed on the first side of the system board, and the power supply device and the output capacitors being disposed on the second side of the system board.
Citation Information
Patent Citations
Semiconductor module and semiconductor device
CN113557605A
Power supply system and electronic device
US20220217836A1