A precise positioning method of FPC circuit board based on security camera

Abstract

The present invention relates to a method for accurately locating an FPC circuit board based on a security camera, and relates to the technical field of data processing. The method comprises the following steps: establishing an equivalent circuit model for simulating the electrical characteristics of a circuit board according to key parameters; calculating the impedance value of each element within a frequency range according to the equivalent circuit model to form a frequency domain contribution factor database; analyzing the frequency domain contribution factor database to identify the dominant element by comparing the impedance value changes of each element; calculating the contribution factor of the dominant element to the overall performance of the circuit board according to the node admittance matrix of the FPC circuit board; quantitatively analyzing the contribution factor, analyzing the size and change trend of each factor to obtain the analysis result; and locating the key area on the circuit board according to the analysis result. The present invention can accurately identify and optimize the key area of ​​the FPC circuit board, thereby improving the overall performance and stability of the security camera.

Description

Technical Field

[0001] The present invention relates to the technical field of data processing, and more specifically, to a precise positioning method for an FPC circuit board based on a security camera. Background Art

[0002] Flexible printed circuit boards (FPCs) are increasingly widely used in various electronic devices. Especially in high-precision devices such as security cameras, the performance of the FPC circuit board directly affects the overall performance and stability of the device. However, due to the complex structure of the FPC circuit board, its electrical characteristics are easily affected by various factors such as material properties, circuit layout, and manufacturing processes. Therefore, how to accurately locate and optimize the performance of the FPC circuit board has become an urgent problem to be solved.

[0003] Traditional methods for positioning the performance of FPC circuit boards mainly rely on experimental testing and empirical judgment. This method is not only time-consuming and laborious, but also has low positioning accuracy and cannot meet the requirements of modern electronic devices for high precision and high stability. In recent years, although there have been some positioning methods based on simulation, due to the failure to fully consider factors such as the actual electrical characteristics and manufacturing processes of FPC circuit boards, the positioning results often deviate significantly from the actual situation. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a precise positioning method for an FPC circuit board based on a security camera, which can accurately identify and optimize the key areas of the FPC circuit board, thereby improving the overall performance and stability of the security camera.

[0005] To solve the above technical problem, the basic concept of the technical solution adopted by the present invention is as follows:

[0006] In a first aspect, a precise positioning method for an FPC circuit board based on a security camera includes:

[0007] Obtaining the design information and manufacturing data of the FPC circuit board, including the layout of the circuit and material properties;

[0008] Processing the design information and manufacturing data to extract the key parameters of the circuit board, where the key parameters include line width, spacing, and dielectric constant;

[0009] Based on the key parameters, establishing an equivalent circuit model for simulating the electrical characteristics of the circuit board;

[0010] Based on the equivalent circuit model, calculating the impedance values of each element within a frequency range to form a frequency domain contribution factor database;

[0011] Analyzing the frequency domain contribution factor database and identifying the dominant elements by comparing the impedance value changes of each element;

[0012] According to the nodal admittance matrix of the FPC circuit board, calculate the contribution factor of the leading element to the overall performance of the circuit board;

[0013] Conduct a quantitative analysis of the contribution factors, analyze the magnitude and change trend of each factor to obtain the analysis result;

[0014] Locate the key areas on the circuit board according to the analysis result.

[0015] Preferably, for the precise positioning method of the FPC circuit board based on the security camera, process the design information and manufacturing data, and extract the key parameters of the circuit board, including:

[0016] Receive the electronic files of the design information and manufacturing data through the network interface. The electronic files include design drawings, bill of materials, and process documents;

[0017] Parse the electronic file to obtain the parsed data;

[0018] Conduct feature recognition on the parsed data to obtain the key features of the circuit board and extract the information related to the dielectric from the bill of materials;

[0019] Estimate the key parameters of the circuit board according to the key features of the circuit board and the information related to the dielectric.

[0020] Preferably, for the precise positioning method of the FPC circuit board based on the security camera, establish an equivalent circuit model simulating the electrical characteristics of the circuit board according to the key parameters, including:

[0021] Construct the specific structure of the circuit board, and analyze the specific structure of the circuit board and the connection method of electrical components to determine the basic structure of the model;

[0022] Use the key parameters of the circuit board to calculate the parameter values of each circuit element;

[0023] Establish an equivalent circuit model simulating the electrical characteristics of the circuit board according to the basic structure of the model and the parameter values of the circuit elements.

[0024] Preferably, for the precise positioning method of the FPC circuit board based on the security camera, according to the equivalent circuit model, form a frequency-domain contribution factor database by calculating the impedance values of each element within the frequency range, including:

[0025] Determine the resistance elements, inductance elements, and capacitance elements in the equivalent circuit model;

[0026] Determine the frequency range of the elements according to the resistance elements, inductance elements, and capacitance elements;

[0027] Calculate the impedance values of each element according to the frequency range of the elements;

[0028] Fuse the impedance values of each element at different frequencies together to form a frequency-domain contribution factor database.

[0029] Preferably, for the precise positioning method of the FPC circuit board based on a security camera, analyze the frequency-domain contribution factor database, and identify the dominant elements by comparing the impedance value changes of each element, including:

[0030] Preprocess the data in the contribution factor database to obtain preprocessed data;

[0031] According to the preprocessed data, analyze the impedance change trend to obtain a comparative analysis result;

[0032] According to the comparative analysis result, identify the dominant elements at each key frequency point.

[0033] Preferably, for the precise positioning method of the FPC circuit board based on a security camera, calculate the contribution factor of the dominant element to the overall performance of the circuit board according to the nodal admittance matrix of the FPC circuit board, including:

[0034] According to the nodal admittance matrix of the FPC circuit board, through Calculate the contribution factor of the dominant element to the overall performance of the circuit board, where CF ij represents the contribution factor of element (i, j), y ij represents the admittance value of element (i, j) in the nodal admittance matrix, W ij represents the weight factor of element (i, j), d ij represents the distance from element (i, j) to the nearest power supply, p represents the attenuation factor of the distance, which is a constant; E ij represents the minimum distance from element (i, j) to the edge of the circuit board; F sij represents the power supply factor related to element (i, j), F tij represents the thermal effect factor related to element (i, j), N represents the size of the nodal admittance matrix, that is, the number of nodes, p represents the attenuation factor of the distance; i and j represent the row index and column index in the nodal admittance matrix of the circuit board; F sij represents the power supply factor related to element (i, j); F tii represents the thermal effect factor related to element (i, j); y kl represents the admittance value of element (k, l) in the nodal admittance matrix, w kl represents the weight factor of element (k, l), d kl represents the distance from element (k, l) to the nearest power supply; E kl represents the minimum distance from element (k, l) to the edge of the circuit board; F skl represents the power supply factor related to element (k, l), F tklDenote the thermal effect factor associated with the element (k, l); k and l are indices representing all node pairs in the node admittance matrix of the circuit board.

[0035] Preferably, for the FPC circuit board precise positioning method based on a security camera, perform a quantitative analysis on the contribution factors, analyze the magnitudes and change trends of each factor to obtain an analysis result, including:

[0036] Obtain the historical data of all contribution factors;

[0037] Use the profile analysis method to determine the number of clusters K, and randomly select K points from the historical data as the initial centers;

[0038] Assign each data point to the corresponding cluster center to form K clusters;

[0039] Recalculate the center points of each cluster, repeat the steps until reaching the preset number of iterations to obtain the clustering result;

[0040] According to the clustering result, analyze the magnitude distribution of the contribution factors in each cluster, identify the dominant factors, and for the dominant factors in each cluster, analyze their change trends over time to obtain the analysis result.

[0041] In a second aspect, an FPC circuit board precise positioning system based on a security camera includes:

[0042] An acquisition module, configured to acquire the design information and manufacturing data of the FPC circuit board, including the layout of the circuit and material properties; process the design information and manufacturing data to extract the key parameters of the circuit board, where the key parameters include the line width, spacing, and dielectric constant; establish an equivalent circuit model simulating the electrical characteristics of the circuit board according to the key parameters;

[0043] A processing module, configured to form a frequency-domain contribution factor database by calculating the impedance values of each element within a frequency range according to the equivalent circuit model; analyze the frequency-domain contribution factor database, identify the dominant elements by comparing the impedance value changes of each element; calculate the contribution factors of the dominant elements to the overall performance of the FPC circuit board according to the node admittance matrix of the FPC circuit board; perform a quantitative analysis on the contribution factors, analyze the magnitudes and change trends of each factor to obtain the analysis result; and locate the key areas on the circuit board according to the analysis result.

[0044] In a third aspect, a computing device includes:

[0045] One or more processors;

[0046] A storage device, configured to store one or more programs, and when the one or more programs are executed by the one or more processors, enable the one or more processors to implement the described method.

[0047] In a fourth aspect, a computer-readable storage medium stores a program which, when executed by a processor, implements the method described above.

[0048] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art:

[0049] The present invention can accurately locate the key areas on the FPC circuit board, which helps to quickly and accurately find the possible problem points. By identifying the dominant elements and key areas on the circuit board, these areas can be optimized specifically; the traditional trial-and-error method may require multiple experiments and modifications to achieve the ideal design effect. By accurately locating and optimizing the key areas on the FPC circuit board, the stability and service life of the security camera can be effectively improved; adopting advanced positioning technology can enhance the performance and quality of the product, making the security camera more competitive in the market and meeting the needs of consumers for high-quality products. The accurate positioning method helps to reduce unnecessary inspections and repairs during the production process, thereby improving production efficiency and shortening the product development cycle. Description of the Drawings

[0050] The drawings described herein are used to provide a further understanding of the present application and form a part of the present application. The illustrative embodiments and descriptions thereof of the present application are used to explain the present application and do not constitute an improper limitation of the present application. Some specific embodiments of the present application will be described in detail hereinafter with reference to the drawings in an exemplary rather than restrictive manner. The same reference numerals in the drawings denote the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0051] Figure 1 is a schematic flow chart of the accurate positioning method for the FPC circuit board of the present invention based on a security camera.

[0052] Figure 2 is a schematic diagram of the accurate positioning system for the FPC circuit board of the present invention based on a security camera. Detailed Embodiments

[0053] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0054] The following embodiments of this application will take the precise positioning method of the FPC circuit board based on a security camera as an example to elaborate on the solution of this application in detail. However, this embodiment does not limit the protection scope of this application.

[0055] As Figure 1 shown, the present invention provides a precise positioning method for an FPC circuit board based on a security camera. The method includes the following steps:

[0056] Step 11: Obtain the design information and manufacturing data of the FPC circuit board, including the layout of the circuit and material properties;

[0057] Step 12: Process the design information and manufacturing data to extract the key parameters of the circuit board. The key parameters include line width, spacing, and dielectric constant;

[0058] Step 13: According to the key parameters, establish an equivalent circuit model simulating the electrical characteristics of the circuit board;

[0059] Step 14: According to the equivalent circuit model, calculate the impedance values of each element within the frequency range to form a frequency-domain contribution factor database;

[0060] Step 15: Analyze the frequency-domain contribution factor database and identify the dominant elements by comparing the impedance value changes of each element;

[0061] Step 16: According to the node admittance matrix of the FPC circuit board, calculate the contribution factors of the dominant elements to the overall performance of the circuit board;

[0062] Step 17: Conduct a quantitative analysis of the contribution factors, analyze the magnitudes and change trends of each factor to obtain an analysis result;

[0063] Step 18: According to the analysis result, locate the key areas on the circuit board.

[0064] In an embodiment of the present invention, the present invention can collect comprehensive design information and manufacturing data of the FPC circuit board. The comprehensive acquisition of data can collect comprehensive design information and manufacturing data of the FPC circuit board and extract key parameters. Through the processing of the design information and manufacturing data, parameters crucial to the performance of the circuit board, such as line width, spacing, and dielectric constant, can be accurately extracted. By calculating the impedance values of each element within the frequency range, a comprehensive frequency-domain contribution factor database is formed. By comparing and analyzing the changes in the impedance values of each element, the dominant element that has the greatest impact on the performance of the circuit board can be accurately identified. According to the nodal admittance matrix of the FPC circuit board, the contribution factor of the dominant element to the overall performance of the circuit board can be calculated, enabling the quantification of the specific impact of each element on the performance. Through the quantitative analysis of the contribution factors, a deep understanding of the magnitude and change trend of each factor can be obtained, accurately evaluating the performance of the circuit board and the potential improvement space. Based on the analysis results, the key areas on the circuit board can be accurately located, reducing the cost of blind optimization and experimentation and improving work efficiency.

[0065] In another preferred embodiment of the present invention, the above step 11 may include:

[0066] Step 111, determine the design objectives of the FPC circuit board, including the type of transmitted signal, power supply requirements, number of layers required, number of signals, power supplies, and interfaces, as well as the size of the circuit board, etc. Use Altium Designer design software to draw the circuit diagram and wiring diagram. Among them, the circuit diagram includes circuit components, devices, the connection and layout of signal lines, and the wiring diagram includes key layout information such as the number of circuit layers, the connection method between layers, and the direction and width of the metal foil, etc. Export the manufacturing data of the circuit board from Altium Designer, including the layout information of the lines (such as line width, spacing), material properties (such as substrate type, metal foil type and thickness), etc. Confirm the detailed properties of the selected materials, such as the dielectric constant and loss factor of the insulating material, the conductivity of the metal foil, etc.

[0067] In a preferred embodiment of the present invention, the above step 12 may include:

[0068] Step 121, receive electronic files of design information and manufacturing data through a network interface. The electronic files include design drawings, bills of materials, and process documents. In this step, the electronic files are received from a server through a network interface (such as Ethernet, Wi-Fi, etc.). These files are transmitted through FTP, SFTP, HTTP, or a custom protocol. If the design information and manufacturing data are already stored in a local or cloud-based internal storage system, the system will directly access these data through a file read / write interface (such as API calls, file sharing protocols, etc.). The received electronic files usually include design drawings (such as DWG, DXF, Gerber, etc. formats), bills of materials (BOM, usually in Excel, CSV, or a specific ERP system format), and process documents (documents describing the manufacturing process and specifications).

[0069] Step 122, parse the electronic files to obtain parsed data. In this step, according to the format of the electronic files (such as CAD drawings, Excel tables, etc.), corresponding parsing libraries or tools (such as AutoCAD API, OpenXML SDK, etc.) are called to read the file content. During the parsing process, the system extracts information related to the FPC circuit board design from the file, such as circuit traces, dimensions, layer stack structures, etc., as well as component models and quantities in the bill of materials.

[0070] Step 123, perform feature recognition on the parsed data to obtain the key features of the circuit board and extract dielectric-related information from the bill of materials. In this step, the system uses edge detection to identify the key features in the parsed data, such as the width, spacing, and trace of the circuit. At the same time, the system filters out dielectric-related entries from the bill of materials, such as substrate type, thickness, dielectric constant, etc. Among them, when specifically performing edge detection, it may include:

[0071] Define the Sobel operator. The Sobel operator uses two 3×3 convolution kernels, one for detecting edges in the horizontal direction G x and the other for detecting edges in the vertical direction G y , where

[0072] G x =[-1 0 1 -2 0 2 -1 0 1];

[0073] G y =[-1 -2 -1 0 0 0 1 2 1];

[0074] Convolve these two convolution kernels with the image respectively to obtain the edge intensity of each pixel point in the horizontal and vertical directions; for each pixel in the image, according to G x and G yFrom the convolution result, the edge strength (the magnitude of the gradient) and direction can be calculated. The edge strength can be calculated by the following formula:

[0075] And the edge direction is the angle θ between G x and G y That is:

[0076] By scanning the edge image, finding continuous edge segments, and calculating the vertical distance between these segments, the width of the circuit can be obtained; after identifying different circuits, calculating the distance between the centerlines of adjacent circuits as the circuit spacing; according to the calculation result of the edge direction, the circuit orientation can be determined;

[0077] Step 124, according to the key features of the circuit board and the information related to the dielectric, estimate the key parameters of the circuit board. In this step, based on the identified key features and dielectric information, estimate the key parameters of the circuit board, such as characteristic impedance, transmission delay, loss, etc. Specifically, it includes: extracting the width w, length l of the circuit and the relative dielectric constant ε r of the dielectric and the loss tangent tan(δ) from the key feature recognition step; through calculate the characteristic impedance Z 0 , where h is the thickness of the dielectric; through calculate the transmission delay t pd , where c is the speed of light; through calculate the dielectric loss α d , where f is the frequency of the signal and tan(δ) is the loss tangent of the dielectric; through calculate the conductor loss α c , where R s is the surface resistance of the conductor; sum the dielectric loss and the conductor loss to obtain the total loss α t .

[0078] In the embodiment of the present invention, receiving files through the network interface provides a flexible data receiving path; through the parsing of electronic files, complex design drawings, bills of materials, and process files can be converted into data formats that can be understood and operated by a computer; the feature recognition technology can automatically extract the key features of the circuit board, such as circuit width, spacing, etc., from the parsed data; according to the extracted key features and dielectric information, the key parameters of the circuit board, such as dielectric constant, etc., can be estimated.

[0079] In a preferred embodiment of the present invention, the above step 13 may include:

[0080] Step 131: Construct the specific structure of the circuit board and analyze the specific structure of the circuit board and the connection method of electrical components to determine the basic structure of the model;

[0081] Step 132: Use the key parameters of the circuit board to calculate the parameter values of each circuit component;

[0082] Step 133: Establish an equivalent circuit model simulating the electrical characteristics of the circuit board according to the basic structure of the model and the parameter values of the circuit components.

[0083] In the embodiment of the present invention, by constructing the specific structure of the circuit board and analyzing the connection method of electrical components, it is ensured that the equivalent circuit model is highly consistent with the physical structure of the actual circuit board; understanding the specific structure of the circuit board and the component connection method helps to discover potential design problems; using the key parameters of the circuit board to calculate the parameter values of each circuit component can ensure that the component parameters in the equivalent circuit model match the component characteristics in the actual circuit board, thereby improving the accuracy of the model; accurate component parameter values enable the model to more realistically predict the electrical performance of the circuit board during actual operation, which helps to discover and solve potential problems during the design stage; through the equivalent circuit model, efficient electrical performance simulation can be carried out on a computer, so as to quickly evaluate the advantages and disadvantages of the circuit board design and reduce the time and cost of physical testing.

[0084] In another preferred embodiment of the present invention, in step 13, when specifically applied, obtain necessary materials such as the design drawings, bill of materials, and process documents of the circuit board; use the data processing library to analyze in detail the specific structural features of the circuit board, such as the layout, number of layers, line width, and spacing; according to the connection method between each electrical component on the circuit board and their connection points with the circuit board; based on the above analysis, determine the basic framework of the equivalent circuit model, such as the transmission line model, RLCG model; obtain the key parameters such as the line width, line spacing, and dielectric constant of the equivalent circuit and the parameter values of each circuit component. Through the PI CE circuit simulation software, build an equivalent circuit model according to the basic structure of the equivalent circuit model and the circuit component parameter values.

[0085] For example: There is an FPC circuit board for a security camera, and its equivalent circuit model needs to be established for performance analysis; first, collect the design drawings and bill of materials of the FPC circuit board. Through analysis, it is determined that the circuit board is a four-layer structure, including a signal layer, a ground layer, a power layer, and another signal layer. The electrical components mainly include a camera interface, a memory interface, and some passive components. The connection methods are mainly series and parallel; use the data such as the line width and line spacing in the design drawings and the dielectric constant provided in the bill of materials to calculate the parameter values of each circuit component. In the PICE simulation software, build an equivalent circuit model according to the calculated parameter values.

[0086] In a preferred embodiment of the present invention, step 14 may include:

[0087] Step 141, determining the resistance element, inductance element and capacitance element in the equivalent circuit model;

[0088] Step 142, determining the frequency range of the elements according to the resistance element, inductance element and capacitance element;

[0089] Step 143, calculating the impedance values of each element according to the frequency range of the elements;

[0090] Step 144, fusing the impedance values of each element at different frequencies together to form a frequency-domain contribution factor database.

[0091] In an embodiment of the present invention, by determining elements such as resistance, inductance, and capacitance in the equivalent circuit model, the basic composition of the model can be clearly understood; by calculating the impedance values of each element at different frequencies, the electrical performance of the circuit board at a specific frequency can be accurately understood. Fusing the impedance values of each element at different frequencies together to form a frequency-domain contribution factor database, the frequency-domain contribution factor database can accelerate the design iteration process and improve the design efficiency.

[0092] In another preferred embodiment of the present invention, when specifically applied, first, obtain the equivalent circuit model, identify the resistance, inductance, and capacitance elements therein, for each identified element, record its position and connection relationship in the equivalent circuit model, and determine an effective frequency range for each element according to the frequency response characteristics of the resistance, inductance, and capacitance elements;

[0093] For each element, within the determined frequency range, calculate the impedance value. The impedance of the inductor is proportional to the frequency, and the impedance of the capacitor is inversely proportional to the frequency; create a database or data structure for storing the impedance values of each element at different frequencies, fill the impedance values into the database, and ensure that there is a corresponding impedance value for each element and each frequency point.

[0094] For example: For a PCB circuit board used for wireless communication, its operating frequency range is from 100 MHz to 1 GHz. It is necessary to establish a frequency-domain contribution factor database. In the equivalent circuit model, multiple key resistance, inductance, and capacitance elements are identified, which represent different parts of the circuit board, such as wires, vias, pads, etc. According to the operating frequency range of the circuit board from 100 MHz to 1 GHz, multiple sampling frequency points within this range are determined for each element, such as 100 MHz, 200 MHz, 500 MHz, and 1 GHz. For each element and each sampling frequency point, the impedance value is calculated using the corresponding formula.

[0095] For example, the impedance of a certain inductance element L at 100 MHz is jωL, where ω is the angular frequency and j is the imaginary unit. Similarly, the impedance values of other elements at all sampling frequency points are also calculated. Finally, the impedance values of all elements at all sampling frequency points are integrated into a database, which contains not only the real and imaginary parts of the impedance, but also the element and frequency information associated with each impedance value.

[0096] In a preferred embodiment of the present invention, step 15 may include:

[0097] Step 151, preprocess the data in the contribution factor database to obtain preprocessed data;

[0098] Step 152, analyze the impedance change trend based on the preprocessed data to obtain a comparative analysis result;

[0099] Step 153, identify the dominant elements at each key frequency point according to the comparative analysis result.

[0100] In another preferred embodiment of the present invention, through the contribution factor database and the corresponding data analysis process, the impedance characteristics of each component at different frequencies can be quickly understood, so as to avoid potential performance problems at the design stage and improve the design efficiency. After identifying the dominant elements at each key frequency point, optimization design can be carried out for these elements, such as selecting appropriate capacitance and inductance values or replacing components with better performance, so as to effectively improve the overall performance of the circuit. By performing sufficient impedance analysis at the design stage, the possibility of later modification and rework can be reduced, and the production cost and time cost can be reduced.

[0101] When specifically applied, it specifically includes the following steps:

[0102] Clean the data in the database to ensure the accuracy and effectiveness of the data; according to the analysis requirements, extract the impedance-related feature data from the database, such as the impedance values of resistors, inductors, and capacitors at various frequencies, etc.; select a series of representative frequency points from the preprocessed contribution factor database, and these points should cover the main frequency range of the circuit board operation; for each selected frequency point, obtain the impedance values of each element from the database, and use Excel or software to plot the curve of impedance changing with frequency; by comparing the impedance values at different frequency points, analyze the trend of each element's impedance changing with frequency, and find out possible anomalies or key points; according to the change trend of the impedance curve and the comparative analysis result, determine several key frequency points; at each key frequency point, compare the impedance value magnitudes of each element, and identify the element that contributes the most to the impedance at this frequency point, which is the dominant element.

[0103] For example, there is a high-speed digital circuit board with an operating frequency range from 100 MHz to 2 GHz. To optimize its signal integrity, it is necessary to identify the dominant electrical elements at various critical frequency points. Impedance data of resistors, inductors, and capacitors in the range of 100 MHz to 2 GHz are extracted from the contribution factor database; after data cleaning and conversion to ensure that all data are stored in a unified format and unit, four representative frequency points of 100 MHz, 500 MHz, 1 GHz, and 2 GHz are selected, and MATLAB is used to plot the impedance curves of resistors, inductors, and capacitors at these frequency points. Through comparative analysis, it is found that the impedance of the inductor increases significantly in the high-frequency band, while the impedance of the capacitor decreases with the increase in frequency; at 100 MHz, the impedance of the resistor is the largest, so the resistor is the dominant element at this time; as the frequency increases, at 500 MHz and 1 GHz, the impedance of the inductor gradually exceeds that of the resistor and capacitor and becomes the dominant element. At 2 GHz, although the impedance of the inductor is still large, the impedance of the capacitor has become very small and can almost be ignored, so the inductor is still the dominant element.

[0104] In a preferred embodiment of the present invention, the above step 16 may include:

[0105] According to the node admittance matrix of the FPC circuit board, by calculating the contribution factor of the dominant element to the overall performance of the circuit board, where CF ij represents the contribution factor of element (i, j), y ij represents the admittance value of element (i, j) in the node admittance matrix, w ij represents the weight factor of element (i, j), d ij represents the distance from element (i, j) to the nearest power supply, p represents the attenuation factor of the distance, which is a constant; E ij represents the minimum distance from element (i, j) to the edge of the circuit board; F sij represents the power supply factor related to element (i, j), F tij represents the thermal effect factor related to element (i, j), N represents the size of the node admittance matrix, that is, the number of nodes, p represents the attenuation factor of the distance; i and j represent the row index and column index in the node admittance matrix of the circuit board; F sij represents the power supply factor related to element (i, j); F tij represents the thermal effect factor related to element (i, j); y kl represents the admittance value of element (k, l) in the node admittance matrix, w kl represents the weight factor of element (k, l), d kl represents the distance from element (k, l) to the nearest power supply; E kl represents the minimum distance from element (k, l) to the edge of the circuit board; Fskl Denote the power factor related to the element (k, l), F tkl Denote the thermal effect factor related to the element (k, l); k and l are indices representing all node pairs in the node admittance matrix of the circuit board.

[0106] In an embodiment of the present invention, by calculating the contribution factors of each element to the overall performance of the circuit board, it is possible to clarify which elements have the greatest impact on the performance; understanding the dominant elements and their contribution factors helps to reasonably allocate design and manufacturing costs; by preferentially improving the elements with large contributions to the performance, the cost-effectiveness can be maximized; according to the calculation results of the contribution factors, it is possible to quickly identify the parts that need to be focused on and optimized, thereby reducing the number of design iterations and shortening the product development cycle; by optimizing the dominant elements, the electrical performance and thermal performance of the circuit board can be significantly improved, thereby enhancing the stability and reliability of the entire system.

[0107] In a preferred embodiment of the present invention, the above step 17 may include:

[0108] Step 171, obtaining historical data of all contribution factors;

[0109] Step 172, using the silhouette analysis method to determine the number of clusters K, and randomly selecting K points from the historical data as the initial centers;

[0110] Step 173, assigning each data point to the corresponding cluster center to form K clusters;

[0111] Step 174, recalculating the center points of each cluster, and repeating the steps until the preset number of iterations is reached to obtain the clustering result;

[0112] Step 175, according to the clustering result, analyzing the size distribution of the contribution factors in each cluster, identifying the dominant factors, and analyzing the change trend of the dominant factors in each cluster over time to obtain the analysis result.

[0113] In an embodiment of the present invention, by using the silhouette analysis method to determine the number of clusters K, the historical data can be classified more effectively, the optimal number of clusters can be automatically determined, avoiding the subjectivity and errors of manual setting, thereby improving the accuracy and efficiency of data processing. Clustering analysis can reveal the hidden relationships and patterns among the contribution factors; by analyzing the size distribution of the contribution factors in each cluster, the dominant factors can be accurately identified; analyzing the change trend of the dominant factors over time can help predict the future changes in the performance of the circuit board; understanding which factors are the dominant factors and their change trends can help enterprises allocate resources more reasonably;

[0114] When specifically applied, it specifically includes:

[0115] Extract the historical records of contribution factors from the database, use the silhouette analysis method to determine the number of clusters K, calculate the silhouette coefficients for different values of K. The silhouette coefficient is an indicator to measure the clustering effect, and the closer its value is to 1, the better the clustering effect. Select the value of K with the largest silhouette coefficient as the optimal number of clusters. Randomly select K points from the historical data as the initial cluster centers, and assign each data point to the corresponding cluster center. For each contribution factor data point in the historical data, calculate its Euclidean distance from each cluster center, and assign each data point to the cluster center with the closest distance, thus forming K clusters. For each cluster, calculate the average value of all data points in it as the new cluster center, that is, reassign the data points to the closest cluster center and recalculate the new cluster center until the preset number of iterations is reached. For each cluster, analyze the size distribution of the contribution factors in it, find the dominant factor in this cluster, and for the dominant factor of each cluster, draw a time series graph or perform trend analysis to observe its change over time. For example, an electronic device manufacturer wants to optimize the performance of its FPC circuit board, collects data on various contribution factors in the past year, extracts the historical data of all contribution factors in one year from the production database, cleans the data, and removes the outliers caused by equipment failures or operation mistakes. Using the silhouette analysis method, calculates the silhouette coefficients for K from 2 to 10, and finds that when K = 4, the silhouette coefficient reaches the maximum. Therefore, select 4 as the optimal number of clusters, randomly select 4 historical data points as the initial cluster centers, through iterative calculations, assign the data points to the closest cluster center, and recalculate the cluster center. After multiple iterations, the positions of the cluster centers tend to be stable. Analyze the contribution factors in each cluster, and find that the dominant factors in cluster A are admittance value and weight factor, the dominant factor in cluster B is power supply factor, the dominant factor in cluster C is thermal effect factor, and the contributions of various factors in cluster D are relatively balanced. Further analyze the change trends of these dominant factors over time, and find that the admittance value and weight factor in cluster A have shown an upward trend in the past few months, which may be related to some recent changes to the circuit board. Based on these analyses, the manufacturer decides to further optimize and adjust the admittance value and weight factor in cluster A in order to improve the overall performance of the circuit board.

[0116] In another preferred embodiment of the present invention, step 18 aims to locate the key areas on the circuit board according to the previous analysis results. The following is the detailed implementation process of this step:

[0117] Based on the design objectives and uses of the circuit board, determine which performance indicators are critical. For example, for a circuit board used for high-speed data transmission, characteristic impedance and transmission delay may be critical indicators. Compare the data obtained from actual measurement or calculation with the thresholds or ranges of the critical indicators, and screen out those data points that exceed the thresholds or are outside the expected range. These points correspond to the critical areas on the circuit board. Use electronic design automation (EDA) software to map the screened data points onto the physical layout of the circuit board. In this way, it is possible to visually see which areas have abnormal data, thereby locating the critical areas. Therefore, through the above steps, the critical areas on the circuit board can be effectively located.

[0118] Figure 2 As shown, an embodiment of the present invention further provides an FPC circuit board precise positioning system based on a security camera, including:

[0119] An acquisition module, configured to acquire the design information and manufacturing data of the FPC circuit board, including the layout of the circuit and material properties; process the design information and manufacturing data to extract the key parameters of the circuit board, where the key parameters include line width, spacing, and dielectric constant; establish an equivalent circuit model for simulating the electrical characteristics of the circuit board according to the key parameters;

[0120] A processing module, configured to form a frequency-domain contribution factor database by calculating the impedance values of each element within a frequency range according to the equivalent circuit model; analyze the frequency-domain contribution factor database, identify the dominant element by comparing the impedance value changes of each element; calculate the contribution factor of the dominant element to the overall performance of the circuit board according to the node admittance matrix of the FPC circuit board; perform quantitative analysis on the contribution factors, analyze the magnitudes and change trends of each factor to obtain an analysis result; and locate the critical areas on the circuit board according to the analysis result.

[0121] It should be noted that this system corresponds to the above method. All implementation manners in the above method embodiments are applicable to this embodiment and can achieve the same technical effects.

[0122] An embodiment of the present invention further provides a computing device, including: a processor and a memory storing a computer program. When the computer program is run by the processor, it executes the method as described above. All implementation manners in the above method embodiments are applicable to this embodiment and can achieve the same technical effects.

[0123] An embodiment of the present invention further provides a computer-readable storage medium storing instructions. When the instructions are run on a computer, the computer is caused to execute the method as described above. All implementation manners in the above method embodiments are applicable to this embodiment and can achieve the same technical effects.

[0124] Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in hardware or software depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present invention.

[0125] Those skilled in the art can clearly understand that for the convenience and conciseness of description, the specific working processes of the systems, devices, and units described above can refer to the corresponding processes in the foregoing method embodiments, and will not be elaborated herein.

[0126] In the embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection between each other can be through some interfaces. The indirect coupling or communication connection of the devices or units can be in electrical, mechanical or other forms.

[0127] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place, or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0128] In addition, the functional units in each embodiment of the present invention can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit.

[0129] If the functions are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in each embodiment of the present invention. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, ROM, RAM, magnetic disks, or optical discs that can store program codes.

[0130] In addition, it should be noted that in the devices and methods of the present invention, obviously, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present invention. Moreover, the steps of performing the above series of processes can naturally be executed chronologically in the described order, but it is not necessary to execute them necessarily in chronological order. Some steps can be executed in parallel or independently of each other. For those of ordinary skill in the art, it is possible to understand that all or any steps or components of the method and device of the present invention can be implemented in any computing device (including processors, storage media, etc.) or a network of computing devices in the form of hardware, firmware, software, or a combination thereof, which can be achieved by the basic programming skills of those of ordinary skill in the art after reading the description of the present invention.

[0131] Therefore, the object of the present invention can also be achieved by running a program or a set of programs on any computing device. The computing device can be a well-known general-purpose device. Therefore, the object of the present invention can also be achieved simply by providing a program product containing program code for implementing the method or device. That is to say, such a program product also constitutes the present invention, and a storage medium storing such a program product also constitutes the present invention. Obviously, the storage medium can be any well-known storage medium or any storage medium developed in the future. It should also be noted that in the devices and methods of the present invention, obviously, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present invention. Moreover, the steps of performing the above series of processes can naturally be executed chronologically in the described order, but it is not necessary to execute them necessarily in chronological order. Some steps can be executed in parallel or independently of each other.

[0132] The above is the preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle described in the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A method for accurately locating an FPC circuit board based on a security camera, characterized in that: include: Obtain design information and manufacturing data of FPC circuit boards, including circuit layout and material properties; Process design information and manufacturing data to extract key parameters of the circuit board, including line width, spacing and dielectric constant; According to key parameters, an equivalent circuit model is established to simulate the electrical characteristics of the circuit board; According to the equivalent circuit model, the impedance value of each element within the frequency range is calculated to form a frequency domain contribution factor database; Analyze the frequency domain contribution factor database and identify the dominant element by comparing the impedance value changes of each element; According to the node admittance matrix of the FPC circuit board, the contribution factor of the dominant element to the overall performance of the circuit board is calculated, including: according to the node admittance matrix of the FPC circuit board, through Calculate the contribution factor of the dominant element to the overall performance of the circuit board, where: represents the contribution factor of element (i, j), represents the admittance value of element (i, j) in the node admittance matrix, represents the weight factor of element (i, j), represents the distance from element (i, j) to the nearest power source, and p represents the attenuation factor of the distance, which is a constant; Indicates the minimum distance from element (i, j) to the edge of the circuit board; represents the power factor associated with element (i, j), represents the thermal effect factor associated with element (i, j), N represents the size of the node admittance matrix, that is, the number of nodes; i and j represent the row index and column index in the circuit board node admittance matrix; Represents the element (k, l ), Represents an element (k, l ), Represents an element (k, l ) distance to the nearest power source; Represents an element (k, l ) minimum distance to the edge of the circuit board; Represents the same as element (k, l ) related power factor, Represents the same as element (k, l ) related thermal effect factors; k and l is the index, representing all node pairs in the circuit board node admittance matrix; Quantitatively analyze the contribution factors of the dominant elements to the overall performance of the circuit board, analyze the size and change trend of each factor to obtain the analysis results; Based on the analysis results, locate the critical areas on the circuit board.

2. The FPC circuit board precise positioning method based on a security camera according to claim 1 is characterized in that: Process design information and manufacturing data to extract key parameters of the circuit board, including: Receive electronic files of design information and manufacturing data through a network interface, the electronic files including design drawings, material lists and process files; Parsing the electronic file to obtain parsed data; Perform feature recognition on the parsed data to obtain key features of the circuit board and extract dielectric-related information from the bill of materials; Estimate the key parameters of the circuit board based on the key characteristics of the circuit board and information related to the dielectric.

3. The FPC circuit board precise positioning method based on security camera according to claim 2 is characterized in that: Based on key parameters, an equivalent circuit model is established to simulate the electrical characteristics of the circuit board, including: Construct the specific structure of the circuit board and analyze the specific structure of the circuit board and the connection method of electrical components to determine the basic structure of the model; Using the key parameters of the circuit board, calculate the parameter value of each circuit component; According to the basic structure of the model and the parameter values ​​of the circuit elements, an equivalent circuit model simulating the electrical characteristics of the circuit board is established.

4. The FPC circuit board precise positioning method based on security camera according to claim 3 is characterized in that: According to the equivalent circuit model, the impedance value of each element within the frequency range is calculated to form a frequency domain contribution factor database, including: Determine the resistance elements, inductance elements, and capacitance elements in the equivalent circuit model; Determine the frequency range of the element based on the resistance element, the inductance element, and the capacitance element; Calculate the impedance value of each element based on the frequency range of the element; The impedance values ​​of each element at different frequencies are fused together to form a frequency domain contribution factor database.

5. The FPC circuit board precise positioning method based on security camera according to claim 4 is characterized in that: Analyze the frequency domain contribution factor database and identify the dominant elements by comparing the impedance value changes of each element, including: Preprocessing the data of the contribution factor database to obtain preprocessed data; According to the pre-processed data, the impedance change trend is analyzed to obtain comparative analysis results; Based on the comparative analysis results, the dominant elements at each key frequency point are identified.

6. The FPC circuit board precise positioning method based on security camera according to claim 5 is characterized in that: Quantitatively analyze the contribution factors of the dominant elements to the overall performance of the circuit board, analyze the size and change trend of each factor, and obtain the analysis results, including: Obtain historical data on the contribution factors of all dominant elements to the overall performance of the circuit board; Use the silhouette analysis method to determine the number of clusters K, and randomly select K points in the historical data as the initial centers; Assign each data point to the corresponding cluster center to form K clusters; Recalculate the center point of each cluster and repeat the steps until the preset number of iterations is reached to obtain the clustering result; According to the clustering results, the size distribution of the contribution factors of the dominant elements in each cluster to the overall performance of the circuit board is analyzed, the dominant factors are identified, and the changing trends of the dominant factors in each cluster over time are analyzed to obtain the analysis results.

7. A precise positioning system for FPC circuit boards based on security cameras, characterized in that: include: The acquisition module is used to obtain the design information and manufacturing data of the FPC circuit board, including the layout of the circuit and the material properties; Process the design information and manufacturing data to extract the key parameters of the circuit board, including line width, spacing and dielectric constant; based on the key parameters, establish an equivalent circuit model that simulates the electrical characteristics of the circuit board; A processing module is used to form a frequency domain contribution factor database by calculating the impedance value of each element within the frequency range according to the equivalent circuit model; analyze the frequency domain contribution factor database, and identify the dominant element by comparing the impedance value changes of each element; According to the node admittance matrix of the FPC circuit board, the contribution factor of the dominant element to the overall performance of the circuit board is calculated, including: according to the node admittance matrix of the FPC circuit board, through Calculate the contribution factor of the dominant element to the overall performance of the circuit board, where: represents the contribution factor of element (i, j), represents the admittance value of element (i, j) in the node admittance matrix, represents the weight factor of element (i, j), represents the distance from element (i, j) to the nearest power source, and p represents the attenuation factor of the distance, which is a constant; Indicates the minimum distance from element (i, j) to the edge of the circuit board; represents the power factor associated with element (i, j), represents the thermal effect factor associated with element (i, j), N represents the size of the node admittance matrix, that is, the number of nodes; i and j represent the row index and column index in the circuit board node admittance matrix; Represents the element (k, l ), Represents an element (k, l ), Represents an element (k, l ) distance to the nearest power source; Represents an element (k, l ) minimum distance to the edge of the circuit board; Represents the same as element (k, l ) related power factor, Represents the same as element (k, l ) related thermal effect factors; k and l It is an index, representing all node pairs in the node admittance matrix of the circuit board; quantitatively analyze the contribution factors of the dominant elements to the overall performance of the circuit board, analyze the size and change trend of each factor to obtain the analysis results; locate the key areas on the circuit board based on the analysis results.

8. A computing device, characterized in that include: one or more processors; A storage device, used for storing one or more programs, when the one or more programs are executed by the one or more processors, the one or more processors implement the method according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a program, which, when executed by a processor, implements the method according to any one of claims 1 to 6.

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