A wafer lifting design device for gluing, developing and baking units

Abstract

The present invention relates to the field of semiconductor manufacturing technology, and discloses a device for lifting wafers in a gluing, developing and baking unit, including a guide rail mounting plate and a heating seat, wherein the side wall of the guide rail mounting plate is fixedly connected to a lifting guide rail, and the ejection assembly includes a connecting sleeve, wherein the connecting sleeve is slidably connected to the lifting guide rail, and a first connecting plate is fixedly connected to a side wall of one side of the connecting sleeve, wherein one end of the first connecting plate is fixedly connected to a mounting plate, and a plurality of ejectors are fixedly connected to the top of the mounting plate at equal angles. In the present invention, the ejection assembly is driven by a motor and a ball screw transmission, so that the ejector pins on the ejection assembly can stop at any position within a preset stroke, and by setting a first position sensor and a second position sensor, when the sliding sleeve exceeds the position of the first position sensor and the second position sensor during movement, prompts are given in time to ensure that the ejection assembly does not exceed the preset stroke, thereby improving the practicality of the device.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing, and in particular to a wafer lifting design device for a gluing, developing and baking unit. Background Art

[0002] The glue coating and developing equipment is glue coating, baking and developing equipment used in the production process of integrated circuit wafers. In this production process, there are multiple processes that require heating and baking of wafers. The wafer baking device usually includes a heating plate, which is used to heat the wafers carried on its upper surface. In order to facilitate the placement of wafers from the baking device, an ejector assembly is usually provided under the heating plate to receive the wafers before baking, or to eject the wafers after baking.

[0003] For example, a wafer baking device with publication number CN112349626A includes a shell and a sealing component, a heater and an ejection component arranged in the shell. The device arranges a lifting guide rail on the surface of the shell, and the ejection component and the sealing component are slidably connected to the lifting guide rail, so that the wafer can be ejected or the ejector pin can be returned to its position by the lifting movement of the ejection component in cooperation with the stable heater, and the heater can be sealed or unsealed by the lifting movement of the sealing component in cooperation with the stable heater, thereby overcoming the adverse effects of the lifting and lowering of the heating plate in the prior art, improving the stability of the wafer placement, and having good safety, which is convenient for subsequent placement and placement processes; at the same time, it avoids the direct connection of the lifting component to the heating plate, reduces the requirements for the heat resistance and safety of the lifting device, and broadens the selectivity of the lifting device.

[0004] However, the problems with the above patent are as follows: most existing wafer baking devices use cylinders as the drive of the ejection assembly, resulting in the wafer stopping at only the two extreme points of the cylinder stroke and being unable to stop between the extreme points. Moreover, in actual application, when the cylinder stops for a period of time and then moves again, due to the friction between the inner wall of the cylinder and the piston, the ejection assembly is prone to fluctuations, thereby causing the wafer to slip or fall, affecting subsequent processing steps.

[0005] Therefore, we propose a wafer lifting design device for the coating, developing and baking unit to solve the above-mentioned problems. Summary of the invention

[0006] The object of the present invention is to provide a wafer lifting device designed for a coating, developing and baking unit to solve the problem raised in the above background technology that when a cylinder is used in the prior art, the cylinder can only stop at two extreme points of the cylinder stroke.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a device for lifting wafers in a gluing, developing and baking unit, comprising a guide rail mounting plate and a heating seat, the guide rail mounting plate side wall is fixedly connected to a lifting guide rail, the guide rail mounting plate side wall is installed with a driving assembly, the driving assembly comprises a second fixed plate, a plurality of connecting rods are symmetrically fixedly connected to the top end of the second fixed plate, a plurality of connecting rods are commonly fixedly connected to a first fixed plate, a third fixed plate is fixedly connected between the first fixed plate and the second fixed plate, a first position sensor is fixedly connected to one end of the third fixed plate, and a second position sensor is fixedly connected to the other end, an ejection assembly is installed on the side wall of the guide rail mounting plate, the ejection assembly comprises a connecting sleeve, the connecting sleeve is slidably connected to the lifting guide rail, a first connecting plate is fixedly connected to one side wall of the connecting sleeve, a mounting plate is fixedly connected to one end of the first connecting plate, and a plurality of ejector pins are fixedly connected to the top of the mounting plate at equal angles.

[0008] Preferably, a motor is fixedly connected through the first fixing plate, a rotating shaft is fixedly connected to the output end of the motor, and bearings are embedded and rotatably connected to the bottom wall of the first fixing plate and the top wall of the second fixing plate.

[0009] Preferably, the two bearings are commonly fixedly connected with a ball screw, the rotating shaft and the side wall of the ball screw are both fixedly connected with a synchronous wheel, and the two synchronous wheels are connected by a synchronous belt.

[0010] Preferably, a sliding sleeve is threadedly connected to the side wall of the ball screw, and the sliding sleeve is located between the first position sensor and the second position sensor.

[0011] Preferably, the side wall of the sliding sleeve is fixedly connected with a second connecting plate, the top end of the connecting sleeve is fixedly connected with an adapter plate, and the second connecting plate is fixedly connected to the adapter plate.

[0012] Preferably, the bottom end of the heating seat is symmetrically fixedly connected with legs, the two legs are commonly fixedly connected with a support plate, and the top end of the heating seat is fixedly connected with a heating plate.

[0013] Preferably, a plurality of through holes are formed at equal angles on the top of the heating plate, and the ejector pin penetrates the bottom wall of the heating seat and is slidably connected with adjacent through holes.

[0014] Preferably, a sealing cover is fixedly connected to the bottom end of the mounting plate, and a cavity is defined at the connection between the sealing cover and the mounting plate.

[0015] Preferably, a connecting hole is provided inside each ejector pin, the connecting hole is connected to the cavity, and a universal rotating joint is fixedly connected to the side wall of the sealing cover.

[0016] Preferably, one end of the universal rotary joint is communicated with the cavity, and the other end of the universal rotary joint is fixedly connected to a vacuum pipe.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The ejector assembly is driven by a motor and a ball screw, so that the ejector pin on the ejector assembly can stop at any position within a preset stroke, and by setting a first position sensor and a second position sensor, when the sliding sleeve exceeds the position of the first position sensor and the second position sensor during movement, prompts are given in time, thereby ensuring that the ejector assembly does not exceed the preset stroke, solving the problem that the ejector assembly can only stop at the two extreme points of the cylinder stroke when driven by a cylinder in the prior art, and improving the practicality of the device.

[0019] 2. An internal cavity is opened at the connection between the mounting plate and the sealing cover, and the cavity is connected with the connecting hole inside the ejector pin. After the ejector pin lifts the wafer, air is evacuated through the vacuum pipe to create a negative pressure in the cavity and the connecting hole, thereby adsorbing the wafer and making it stably adsorbed on the ejector pin. This solves the problem of fluctuations in the ejection process caused by the friction between the inner wall of the cylinder and the piston, thereby causing the wafer to slip or fall, and affecting subsequent processing procedures. This ensures the smooth production of the wafer and improves the production stability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a structural schematic diagram of the ejection assembly in the present invention;

[0022] Figure 3 It is a schematic cross-sectional structural diagram of the mounting plate in the present invention;

[0023] Figure 4 It is a structural schematic diagram of the heating seat in the present invention;

[0024] Figure 5 It is a schematic diagram of the structure of the driving component in the present invention;

[0025] Figure 6 This is a schematic diagram of the structure of the drive assembly in the present invention in the rearward direction;

[0026] Figure 7 It is an exploded schematic diagram of the driving assembly in the present invention.

[0027] In the figure: 1. guide rail mounting plate; 11. lifting guide rail; 2. heating plate; 21. through hole; 22. support leg; 23. support plate; 24. heating seat; 3. ejector assembly; 31. adapter plate; 32. ejector pin; 33. mounting plate; 34. first connecting plate; 35. sealing cover; 36. universal rotary joint; 37. vacuum pipe; 38. connecting sleeve; 39. cavity; 310. connecting hole; 4. driving assembly; 41. motor; 42. synchronous belt; 43. synchronous wheel; 44. ball screw; 45. bearing; 46. second connecting plate; 47. first position sensor; 48. second position sensor; 49. sliding sleeve; 410. first fixed plate; 411. second fixed plate; 412. rotating shaft; 413. third fixed plate; 414. connecting rod. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Example 1: Please refer to Figure 1 - Figure 2 and Figure 5 - Figure 7 The present invention provides a technical solution: a wafer lifting design device for a coating, developing and baking unit, comprising a guide rail mounting plate 1 and a heating seat 24, wherein a lifting guide rail 11 is fixedly connected to the side wall of the guide rail mounting plate 1, a driving assembly 4 is installed on the side wall of the guide rail mounting plate 1, and the driving assembly 4 comprises a second fixing plate 411, a plurality of connecting rods 414 are symmetrically fixedly connected to the top of the second fixing plate 411, and a first fixing plate 410 is fixedly connected to the plurality of connecting rods 414. A third fixing plate 410 is fixedly connected between the first fixing plate 410 and the second fixing plate 411. The fixed plate 413, one end of the third fixed plate 413 is fixedly connected to the first position sensor 47, and the other end is fixedly connected to the second position sensor 48, the side wall of the guide rail mounting plate 1 is installed with an ejection assembly 3, the ejection assembly 3 includes a connecting sleeve 38, the connecting sleeve 38 is slidably connected to the lifting guide rail 11, one side wall of the connecting sleeve 38 is fixedly connected to the first connecting plate 34, one end of the first connecting plate 34 is fixedly connected to the mounting plate 33, and a plurality of ejector pins 32 are fixedly connected at equal angles to the top of the mounting plate 33, and a lifting guide rail 11 is provided on the surface of the guide rail mounting plate 1.

[0030] The first fixed plate 410 is penetrated and fixedly connected with a motor 41, and a rotating shaft 412 is fixedly connected to the output end of the motor 41, and the bottom wall of the first fixed plate 410 and the top wall of the second fixed plate 411 are both embedded with bearings 45 for rotational connection; the two bearings 45 are commonly fixedly connected with a ball screw 44, and the rotating shaft 412 and the side walls of the ball screw 44 are both fixedly connected with synchronous wheels 43, and the two synchronous wheels 43 are connected by a synchronous belt 42; the side wall of the ball screw 44 is threadedly connected with a sleeve 49, and the sleeve 49 is located between the first position sensor 47 and the second position sensor 48; the side wall of the sleeve 49 is fixedly connected with a second connecting plate 46, and the top of the connecting sleeve 38 is fixedly connected with an adapter plate 31, and the second connecting plate 46 is fixedly connected to the adapter plate 31.

[0031] In this embodiment: when in use, first place the wafer on the heating plate 2 in the heating seat 24, heat the wafer through the heating plate 2, and after the heating is completed, start the motor 41, drive the rotating shaft 412 to rotate through the motor 41, and drive the ball screw 44 to rotate under the transmission cooperation of the synchronous wheel 43 and the synchronous belt 42, so that the sliding sleeve 49 can be lifted up and down, and the ejection assembly 3 is driven to move synchronously through the second connecting plate 46 and the adapter plate 31, so that the heated wafer is lifted by the ejector pin 32; and by setting the first position sensor The first position sensor 47 and the second position sensor 48 are used to ensure that when the sleeve 49 exceeds the position of the first position sensor 47 and the second position sensor 48 during movement, prompts are given in time, thereby ensuring that the ejection assembly 3 does not exceed the preset stroke; the ejection assembly 3 is driven by the motor 41 and the ball screw 44, so that the ejector pin 32 on the ejection assembly 3 can stop at any position within the preset stroke, which overcomes the problem that the prior art can only stop at the two extreme points of the cylinder stroke when the cylinder is used for driving, thereby improving the practicality of the device.

[0032] Example 2: Please refer to Figure 3 - Figure 4 The bottom end of the heating seat 24 is symmetrically fixedly connected with supporting legs 22, and the two supporting legs 22 are commonly fixedly connected with a supporting plate 23. The top end of the heating seat 24 is fixedly connected with a heating plate 2; a plurality of through holes 21 are provided at equal angles on the top end of the heating plate 2, and a pin 32 penetrates the bottom wall of the heating seat 24 and is slidably connected with the adjacent through holes 21; a sealing cover 35 is fixedly connected with the bottom end of the mounting plate 33, and a cavity 39 is provided at the connection between the sealing cover 35 and the mounting plate 33.

[0033] A connecting hole 310 is provided inside each ejector pin 32, and the connecting hole 310 is connected to the cavity 39. A universal rotary joint 36 is fixedly connected to the side wall of the sealing cover 35. One end of the universal rotary joint 36 is connected to the cavity 39, and the other end of the universal rotary joint 36 is fixedly connected to a vacuum pipe 37. After the ejector pin 32 lifts the wafer, air is evacuated through the vacuum pipe 37, so that negative pressure is present in the cavity 39 and the connecting hole 310, thereby adsorbing the wafer.

[0034] In this embodiment: during the wafer lifting process, when a cylinder is used, the friction between its inner wall and the piston will cause fluctuations in the ejection process, thereby causing the wafer to slip or fall, affecting the subsequent processing steps. During the lifting movement of the ejection assembly 3 along the lifting guide rail 11, the ejector pin 32 penetrates the heating seat 24 and the heating plate 2, so that it can extend out of the surface of the heating plate 2 with the lifting movement to lift the wafer. A cavity 39 is provided at the connection between the mounting plate 33 and the sealing cover 35 and the mounting plate 33, and a connecting hole 310 is provided inside the ejector pin 32. The cavity 39 is connected to the connecting hole 310 inside the ejector pin 32, and a universal rotary joint 36 is provided on the side wall of the sealing cover 35 for connecting to a vacuum pipe 37. When the ejector pin 32 lifts the wafer, air is evacuated through the vacuum pipe 37 to make the cavity 39 and the connecting hole 310 negative pressure, thereby adsorbing the wafer and stably adsorbing the wafer on the ejector pin 32, thereby ensuring the smooth production of the wafer and improving the generation stability of the device.

[0035] Working principle: by setting the guide rail mounting plate 1, the heating plate 2, the ejector assembly 3 and the driving assembly 4, wherein the surface of the guide rail mounting plate 1 is provided with a lifting guide rail 11; the heating plate 2 is used to carry and heat the wafer, and a plurality of through holes 21 are provided on the surface; the ejector assembly 3 is connected to the lifting guide rail 11 through the adapter plate 31, and can be lifted and lowered along the lifting guide rail 11, and an ejector pin 32 is provided, and a connecting hole is provided inside the ejector pin 32 for adsorbing the wafer, and the ejector pin 32 passes through the heating plate 2 and can extend out of the surface of the heating plate 2 with the lifting and lowering movement; the ejector pin 32 is installed through the mounting plate 33, and the mounting plate 33 is connected to the adapter plate 31 through the first connecting plate 34, and a sealing cover 35 provided at the bottom of the mounting plate 33 is provided with a cavity 39 at the connection between the mounting plate 33, and the cavity 39 is connected with the connecting hole 310 inside the ejector pin 32, and a universal rotary joint 36 is provided on the sealing cover 35 for connecting a vacuum pipe 37;

[0036] After the motor 41 is driven, the ball screw 44 is driven by the synchronous belt 42 and the synchronous wheel 43 to convert the rotation into linear motion in the up and down directions. Bearings 45 are provided at both ends of the ball screw 44. A connecting sleeve 38 is threadedly connected on the ball screw 44 to connect the ejection assembly 3 and drive the ejection assembly 3 to move up and down. The driving assembly 4 is also provided with a first position sensor 47 and a second position sensor 48 to protect the ejection assembly 3 from exceeding the preset stroke.

[0037] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0038] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer lifting device for a coating, developing and baking unit, comprising a guide rail mounting plate (1) and a heating seat (24), characterized in that: The side wall of the guide rail mounting plate (1) is fixedly connected to a lifting guide rail (11), the side wall of the guide rail mounting plate (1) is installed with a driving assembly (4), the driving assembly (4) comprising a second fixing plate (411), a top end of the second fixing plate (411) being symmetrically fixedly connected to a plurality of connecting rods (414), the plurality of connecting rods (414) being commonly fixedly connected to a first fixing plate (410), a third fixing plate (413) being fixedly connected between the first fixing plate (410) and the second fixing plate (411), the third fixing plate (413) being one of the fixing plates (413) and the second fixing plate (410). A first position sensor (47) is fixedly connected to one end of the guide rail mounting plate (1), and a second position sensor (48) is fixedly connected to the other end of the guide rail mounting plate (1). An ejection assembly (3) is installed on the side wall of the guide rail mounting plate (1). The ejection assembly (3) comprises a connecting sleeve (38). The connecting sleeve (38) is slidably connected to the lifting guide rail (11). A first connecting plate (34) is fixedly connected to one side wall of the connecting sleeve (38). A mounting plate (33) is fixedly connected to one end of the first connecting plate (34). A plurality of ejector pins (32) are fixedly connected at equal angles to the top of the mounting plate (33). A motor (41) is fixedly connected to the first fixing plate (410), an output end of the motor (41) is fixedly connected to a rotating shaft (412), and a bearing (45) is embedded and rotatably connected to the bottom wall of the first fixing plate (410) and the top wall of the second fixing plate (411); The two bearings (45) are fixedly connected to a ball screw (44), the rotating shaft (412) and the side wall of the ball screw (44) are fixedly connected to a synchronous wheel (43), and the two synchronous wheels (43) are connected via a synchronous belt (42); A sliding sleeve (49) is threadedly connected to a side wall of the ball screw (44), and the sliding sleeve (49) is located between the first position sensor (47) and the second position sensor (48); The side wall of the sliding sleeve (49) is fixedly connected to a second connecting plate (46), the top end of the connecting sleeve (38) is fixedly connected to an adapter plate (31), and the second connecting plate (46) is fixedly connected to the adapter plate (31); The bottom end of the heating seat (24) is symmetrically fixedly connected to the legs (22), the two legs (22) are commonly fixedly connected to a support plate (23), and the top end of the heating seat (24) is fixedly connected to a heating plate (2); The top end of the heating plate (2) is provided with a plurality of through holes (21) at equal angles, and the ejector pin (32) penetrates the bottom wall of the heating seat (24) and is slidably connected with adjacent through holes (21).

2. The device for designing wafer lifting for a coating, developing and baking unit according to claim 1, characterized in that: A sealing cover (35) is fixedly connected to the bottom end of the mounting plate (33), a cavity (39) is provided at the connection between the sealing cover (35) and the mounting plate (33), and a communication hole (310) is provided inside each ejector pin (32).

3. The wafer lifting design device for the glue coating, developing and baking unit according to claim 2 is characterized in that: The communication hole (310) is in communication with the cavity (39), and a universal rotating joint (36) is fixedly connected to the side wall of the sealing cover (35).

4. The wafer lifting design device for the glue coating, developing and baking unit according to claim 3 is characterized in that: One end of the universal rotating joint (36) is in communication with the cavity (39), and the other end of the universal rotating joint (36) is fixedly connected to a vacuum pipe (37).

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