Display panel

Abstract

Embodiments of the present application provide a display panel. The display panel comprises an array substrate, a pixel definition layer and a partition structure, and the partition structure covers part of the pixel opening towards the side edge of the pixel opening. By arranging the partition structure in the display panel, the partition structure can partition the light emitting device layer in the display panel, thereby avoiding the horizontal movement of the charges in the light emitting device layer and causing the display problem of the adjacent sub-pixels appearing to be bright, and effectively improving the display effect and quality of the panel.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of manufacturing display panels and display devices, and in particular to a display panel. BACKGROUND

[0002] With the continuous upgrading of electronic products, people have higher requirements on the quality and performance of display panels to enhance the use experience.

[0003] Compared with traditional liquid crystal displays (LCDs), organic light-emitting diode (OLED) devices have the advantages of being light, having a wide viewing angle, and high luminous efficiency, and are widely used in various fields. The OLED device provided in the prior art causes horizontal movement of charges in the light-emitting functional layer corresponding to two adjacent sub-pixels of different colors when the OLED device normally emits light. As a result, the sub-pixel that does not need to emit light is brightened due to the movement of charges generated in other sub-pixels, thereby causing display problems such as stealing light or color mixing, reducing the display effect of the display panel, and being not conducive to further improving the comprehensive performance of the display panel.

[0004] In summary, the display panel in the prior art is prone to horizontal movement of electron holes when different functional film layers in the display panel are arranged, which causes the adjacent sub-pixel to be lit at the same time, resulting in display problems such as stealing light or color mixing, and reducing the display effect of the display panel. SUMMARY

[0005] The display panel provided by the embodiments of the present application effectively improves the display problem of stealing light of adjacent sub-pixels caused by horizontal movement of charges when the light-emitting functional layer of the existing display panel is normally working.

[0006] To solve the above technical problems, the first aspect of the embodiments of the present application provides a display panel, comprising:

[0007] an array substrate;

[0008] a pixel definition layer disposed on the array substrate, the pixel definition layer comprising a plurality of pixel openings;

[0009] a partition structure disposed on a side of the pixel definition layer away from the array substrate; and

[0010] a light-emitting functional layer, at least part of the light-emitting functional layer being disposed in the pixel opening, and the light-emitting functional layer being disconnected at the edge of the partition structure;

[0011] The edge of the partition structure towards the pixel opening side covers part of the pixel opening; the partition structure comprises a first opening, a first separation layer, and a second separation layer arranged on the side of the first separation layer away from the array substrate, the first opening is arranged towards the pixel opening, and the edge of the second separation layer protrudes from the edge of the first separation layer.

[0012] According to an embodiment of the present application, the partition structure further comprises a third separation layer, and the third separation layer is arranged on the side of the second separation layer away from the first separation layer;

[0013] The length of the third separation layer is less than or equal to the length of the second separation layer.

[0014] According to an embodiment of the present application, the partition structure further comprises a third separation layer, and the first separation layer is arranged on the side of the third separation layer away from the pixel definition layer;

[0015] The length of the third separation layer is greater than or equal to the length of the first separation layer.

[0016] According to an embodiment of the present application, the second separation layer comprises a first protruding part protruding from the edge of the first separation layer, and the third separation layer comprises a second protruding part protruding from the edge of the pixel definition layer;

[0017] The length of the second protruding part is greater than the length of the first protruding part.

[0018] According to an embodiment of the present application, the ratio of the protruding length of the edge of the partition structure protruding from the edge of the pixel definition layer to the protruding length of the edge of the second separation layer protruding from the edge of the first separation layer is set to 2-4.

[0019] According to an embodiment of the present application, the first separation layer and the second separation layer are both arranged as metal film layers, and the etching rate of the first separation layer is greater than the etching rate of the second separation layer.

[0020] According to an embodiment of the present application, the light-emitting functional layer comprises at least two light-emitting layers and a charge generation layer arranged between the light-emitting layers;

[0021] At least the charge generation layer is arranged discontinuously in the area corresponding to the partition structure and the pixel opening.

[0022] According to an embodiment of the present application, the pixel definition layer further comprises a partition opening, at least one partition opening is arranged between two adjacent light-emitting functional layers of different colors, and the edge of the partition structure towards the partition opening side covers part of the partition opening.

[0023] According to an embodiment of the present application, the partition structure further comprises a second opening, which is arranged towards the partition opening, and an edge of a second layer of the partition structure protrudes from a first layer of the partition structure in the region of the second opening.

[0024] According to an embodiment of the present application, an opening area of the pixel opening is greater than an opening area of the partition opening, and a slope of an inner wall of the pixel definition layer in the pixel opening is smaller than a slope of an inner wall of the pixel definition layer in the partition opening.

[0025] The display panel provided by the embodiments of the present application has the following advantages: compared with the prior art, the display panel provided by the embodiments of the present application comprises an array substrate, a pixel definition layer and a partition structure, and an edge of the partition structure protrudes from an edge of the pixel definition layer. By arranging the partition structure, the light-emitting functional layer in the display panel forms a cut-off undercut structure under the action of the partition structure. When the display panel is lighted, the problem of horizontal movement of charges in the light-emitting functional layer and the problem of light stealing can be effectively avoided, and the display effect and quality of the display panel are effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0027] Figure 1 The film layer structure schematic diagram of the display panel provided in the embodiments of the present application.

[0028] Figure 2 The film layer schematic diagram of the first partition structure provided in the embodiments of the present application.

[0029] Figure 3 The other structure schematic diagram of the partition structure provided in the embodiments of the present application.

[0030] Figure 4 The structure schematic diagram of the light-emitting functional layer provided in the embodiments of the present application. Figure 1 The partial film layer structure of the display panel in the pixel opening region in the display panel provided in the embodiments of the present application.

[0031] Figure 5 The structure schematic diagram of the light-emitting functional layer provided in the embodiments of the present application.

[0032] Figures 6-7 The corresponding film layer structure of the display panel in the preparation process of the display panel provided in the embodiments of the present application.

[0033] Figure 8 A schematic diagram of a sealing film layer of a display panel provided in an embodiment of the present application. DETAILED DESCRIPTION

[0034] In the following detailed description, only certain embodiments of the application are shown and described, by way of illustration. As those skilled in the art can readily understand, the embodiments described herein can be modified in various ways without departing from the spirit or scope of the application.

[0035] In the drawings, the thickness of layers, films, plates, regions, etc., can be exaggerated for clarity. Also, unless explicitly described otherwise, the word "comprise" and variations such as "comprising" or "comprises" will be understood to imply the inclusion of a stated element, but not the exclusion of any other element. Further, in the description, the word "over" or "on" indicates that a layer is positioned above or below another layer, but not necessarily in contact with it.

[0036] It will be understood that, although the terms "first", "second" etc. can be used herein to describe various components, these components should not be limited by these terms. These components are only used to distinguish one component from another.

[0037] In the process of setting up a display panel, a plurality of different sub-pixels need to be arranged in the display area of the display panel to ensure the display performance of the display panel. However, in the prior art, as the number of sub-pixel arrangements increases, the arrangement space between adjacent sub-pixels will decrease. When the panel is working normally, the charges in the light-emitting layer of the two adjacent sub-pixels of different colors are prone to horizontal movement, which causes another sub-pixel to appear bright, thereby reducing the display quality of the display panel.

[0038] The display panel provided in an embodiment of the present application effectively solves the technical problem that the charges in the two adjacent sub-pixels of the display panel appear to move horizontally when the display panel is in light-emitting display, causing the sub-pixel to appear bright.

[0039] As shown in Figure 1 , a display panel provided in an embodiment of the present application is shown. Figure 1 A schematic diagram of a film layer structure of a display panel provided in an embodiment of the present application. The display panel includes, as shown in Figure 1 , a plurality of functional film layers and corresponding electrode layers arranged on the array substrate 10. Figure 1 A schematic diagram of a film layer structure of a display panel provided in an embodiment of the present application. Specifically, the display panel can include an array substrate 10 and a plurality of functional film layers and corresponding electrode layers arranged on the array substrate 10.

[0040] Specifically, when the array substrate 10 is arranged, the array substrate 10 is arranged as a thin film transistor array substrate, and the array substrate 10 comprises a substrate 101, a first buffer layer 102, a second buffer layer 103, a first insulating layer 104, and a first gate insulating layer 105 and a second gate insulating layer 106. Specifically, the first buffer layer 102 is arranged on the substrate 101, the second buffer layer 103 is arranged on the first buffer layer 102, the first insulating layer 104 is arranged on the second buffer layer 103, the first gate insulating layer 105 is arranged on the first insulating layer 104, and the second gate insulating layer 106 is arranged on the first gate insulating layer 105.

[0041] Further, the array substrate 10 further comprises a thin film transistor 40, and the thin film transistor 40 comprises an active layer 418, a first gate 415, a second gate 416, a source 414 and a drain 413. The active layer 418 is arranged on the second buffer layer 103, the first gate 415 is arranged on the first insulating layer 104, the first gate insulating layer 105 covers the first gate 415, the second gate 416 is arranged on the first gate insulating layer 105, the second gate insulating layer 106 is arranged on the second gate 416, and the source 414 and the drain 413 are arranged on the second gate insulating layer 106 and electrically connected to the active layer 418 through corresponding via structures, so as to form a structure of the thin film transistor 40.

[0042] Further, the array substrate 10 further comprises a light shielding layer 301, and the light shielding layer 301 is arranged on the first buffer layer 102 and arranged at a position corresponding to the active layer 418, and is arranged as a metal light shielding layer, so as to shield light through the light shielding layer 301. Meanwhile, the metal layer corresponding to the source / drain of the array substrate 10 is electrically connected to the light shielding layer 301 through another via structure, and when the array substrate normally works, the excess static electricity in the array substrate can be directly led out through the light shielding layer 301, so as to improve the working stability of the device.

[0043] In the embodiment of the present application, a groove 417 is arranged on the light shielding layer 301, and the groove 417 is arranged at a position corresponding to the drain 413, so as to effectively reduce the thickness of the film layer in the vertical region and improve the total thickness of the array substrate.

[0044] Further, when the functional film layers of the array substrate 10 are arranged, the display panel further comprises a first planarization layer 107 and a pixel definition layer 109. The first planarization layer 107 is arranged on the array substrate 10 and covers the source 414 and the drain 413 of the array substrate 10. Meanwhile, the pixel definition layer 109 is arranged on the first planarization layer 107.

[0045] In this embodiment, the pixel definition layer 109 is patterned and etched during its fabrication. Specifically, the pixel definition layer 109 includes a plurality of pixel openings 30. The pixel openings 30 can be correspondingly disposed with the source 414 or drain 413 of the array substrate 10. In this embodiment, in subsequent processes, different colored light-emitting functional layers are provided within the pixel openings 30 to achieve the requirements for light emission and color display.

[0046] Meanwhile, an anode 411 is also disposed within the pixel opening 30. The anode 411 is disposed on the first planarization layer 107 and electrically connected to the source and drain of the thin-film transistor 40 through a via. Control signals within the array substrate 10 can be transmitted to the light-emitting functional layer through the anode 411.

[0047] See details Figure 1 In this embodiment of the structure, the pixel definition layer 109 is further provided with a partition opening 31. The partition opening 31 can be correspondingly disposed between two adjacent pixel openings 30, such as between two adjacent light-emitting functional layers of different colors. Specifically, a red sub-pixel is set within a pixel opening 30, and a green or red sub-pixel is set within an adjacent pixel opening 30, with a partition opening 31 disposed between these two different colored sub-pixels. The number of partition openings 31 can be determined based on the reserved positions of two adjacent pixel openings 30, and can be one or more partition openings 31. In this embodiment of the application, the partition openings 31 are used to further improve the display effect of the display panel.

[0048] In this embodiment, the opening area of ​​the isolation opening 31 is smaller than the opening area of ​​the pixel opening 30. For example, the opening area of ​​the isolation opening 31 is set to 1 / 2, 1 / 4 or other ratios of the opening area of ​​the pixel opening 30. In this way, by adjusting the opening area of ​​the isolation opening 31, the isolation effect of the isolation opening 31 on the light-emitting functional layer can be improved.

[0049] Further, when setting the partition opening 31 corresponding to the pixel definition layer 109 and the pixel opening 30, the slopes of the inner walls of the pixel definition layer 109 in the two different openings are different. In the embodiment of the present application, the slope of the inner wall of the pixel definition layer 109 is the size of the included angle formed by the inner wall of the pixel definition layer 109 relative to the bottom plane thereof, which is shown by the slope a of the inner wall of the pixel definition layer 109 in the pixel opening 30 in the figure. Specifically, the slope of the inner wall of the pixel definition layer 109 in the pixel opening 30 is smaller than the slope of the inner wall of the pixel definition layer 109 in the partition opening 31. In the embodiment of the present application, the slopes of the inner walls of the pixel definition layer at different positions are set to be different, thereby ensuring the partition effect of the pixel opening 30 and the partition opening 31 on the film layer, and further avoiding the horizontal movement of the charges of the subsequent light-emitting functional layer in operation, and avoiding the technical problem of light stealing of adjacent sub-pixels.

[0050] Further, the display panel further includes a partition structure 48 and a light-emitting functional layer 501. The partition structure 48 is arranged on the side of the pixel definition layer 109 away from the array substrate 10. In the region of the pixel opening 30, the edge of the partition structure 48 on the side of the pixel opening 30 protrudes beyond the edge of the pixel definition layer 109. That is, in the region of the pixel opening 30, the edge of the partition structure 48 on the side of the pixel opening 30 covers part of the pixel opening 30. The partition structure 48 includes a first covering portion 60, which covers part of the pixel opening 30. Thus, when depositing other film layers, the first covering portion 60 can partition the same, thereby avoiding the horizontal movement of the charges.

[0051] Further, in the region corresponding to the partition opening 31, the edge of the partition structure 48 on the side of the partition opening protrudes beyond the partition opening 31, and part of the partition structure 48 covers part of the partition opening 31. In this way, the partition structure 48 also forms a second covering portion 61 of a certain length around the partition opening 31. In the embodiment of the present application, in the region of the partition opening 31, the partition structure 48 further includes a second opening 65, which is arranged toward the partition opening 31, such as toward the center of the partition opening 31. In the region corresponding to the second opening 65, the edge of the second partition layer 402 of the partition structure 48 protrudes beyond the edge of the first partition layer 401, thereby forming an undercut structure for the second opening 65. When other film layers are prepared on the undercut structure, the film layers can be effectively disconnected.

[0052] In the embodiment of the present application, the length of the first covering portion 60 can be smaller than or equal to the length of the second covering portion 61. In this way, the length of the covering portion in the pixel opening 30 is prevented from being too long to affect the light-emitting area of the pixel, thereby ensuring the light output of the pixel opening.

[0053] In this embodiment, the partition structure 48 is protruding at the corresponding positions of any of the above-mentioned pixel openings 30 and partition openings 31, forming a corresponding covering portion. This covering portion isolates other film layers, thereby blocking charge movement and preventing adjacent sub-pixels from having a problem of stealth lighting.

[0054] Furthermore, in the embodiments of this application, when setting the partition structure 48, see details. Figure 1 In the film layer structure, the partition structure 48 is configured as a stacked structure, such as the partition structure 48 including at least a first partition layer 401 and a second partition layer 402. The first partition layer 401 is disposed on the pixel definition layer 109, and the second partition layer 402 is disposed on the side of the first partition layer 401 away from the pixel definition layer 109, and the edge of the second partition layer 402 protrudes beyond the edge of the first partition layer 401. In this way, the second partition layer 402 and the first partition layer 401 will also form an elongated structure, which will cut off the subsequent film layer to avoid the problem of lateral movement of charge in adjacent sub-pixels.

[0055] like Figure 2 As shown, Figure 2 This is a schematic diagram of the membrane layer of the first type of partition structure provided in this application embodiment. Wherein, Figure 2 Taking only a portion of the partition structure 48 as an example, this portion of the film layer can be the structure corresponding to the partition opening or the edge of the pixel opening. When describing the partition structure 48, since it is composed of multiple stacked film layers, when the partition structure 48 is configured with only two film layers, it includes a first partition layer 401 and a second partition layer 402, with the second partition layer 402 disposed on the side of the first partition layer 401 away from the array substrate. Furthermore, during configuration, at the corresponding positions of the pixel opening 30 and the partition opening 31, the edge of the first partition layer 401 protrudes beyond the aforementioned openings, forming a covering portion of a certain length. This causes the edge of the first partition layer 401 to be recessed relative to the edge of the second partition layer 402, thereby isolating other film layers and achieving the purpose of blocking the lateral movement of charge.

[0056] Furthermore, such as Figure 3 As shown, Figure 3 This is a schematic diagram of other structures of the partition structure provided in the embodiments of this application. (In conjunction with...) Figure 2In the structure described above, when the partition structure 48 is provided, the partition structure 48 may further include a first opening 64 and a third partition layer 403. By changing the relative positional relationship between the third partition layer 403 and the first partition layer 401 and the second partition layer 402, and through the first opening 64 of the partition structure 48, the partition effect on the film layer is achieved. In this embodiment, the first opening 64 is disposed facing the pixel opening 30, and in the area where the first opening 64 is located, the edge of the second partition layer 402 protrudes beyond the edge of the first partition layer 401. That is, the edge of the first partition layer 401 is recessed relative to the edge of the second partition layer 402.

[0057] See details Figure 3 middle, Figure 3 Different stacked structures are formed by adjusting the relative positions of the third layer 403. Combined with... Figure 1 as well as Figure 2 The structure in Figure 3 The partition structure is illustrated using a three-layer membrane stacked structure as an example. The three different partition layers are stacked to form four different structures, namely A, B, C, and D.

[0058] Specifically, in Figure A, for the partition structure 48, the third partition layer 403 is disposed on the pixel definition layer 109, and the first partition layer 401 is disposed on the third partition layer 403, while the second partition layer 402 is disposed on the first partition layer 401. The edges of both the second partition layer 402 and the third partition layer 403 protrude beyond the edge of the first partition layer 401. Thus, the three different partition layers form the first opening 64 provided in this application. When a light-emitting functional layer or other film layer is disposed on the partition structure 48, the first opening 64 and the corresponding protrusions form an undercut, thereby separating the film layer at this location. In this embodiment, the protrusion lengths of the edges of the third partition layer 403 and the second partition layer 402 can be set as needed. For example, the protrusion length of the second partition layer 402 can be greater than or equal to the protrusion length of the edge of the third partition layer 403, thereby forming an "I"-shaped structure. This allows the undercut structure to better separate the film layer, preventing lateral movement of charges within adjacent sub-pixels and ensuring its effectiveness.

[0059] The third separation layer 403 and the second separation layer 402 are made of one of metal material or metal oxide material. The conductivity of the material of the third separation layer 403 and the second separation layer 402 is less than that of the first separation layer 401. When etching, the etching rate of the third separation layer 403 and the second separation layer 402 is less than that of the first separation layer 401 under the same etching condition or etching state. The first separation layer 401 is etched more when etching for the same time, so as to form the first opening 64. Specifically, the material of the third separation layer 403 can be one of indium tin oxide, Ti, the material of the second separation layer 402 can be one of Cu, indium gallium zinc oxide (IGZO), and the material of the first separation layer 401 can be one of Al, indium zinc oxide, or other materials with different etching rates.

[0060] In B, the edge of the third separation layer 403 is flush with that of the first separation layer 401, and the edge of the second separation layer 402 protrudes from the third separation layer 403 and the first separation layer 401. Similarly, the protruding second separation layer 402 can separate the film layer thereon, so as to prevent the problem of transverse leakage current between the electrodes of the light emitting layer. In the embodiment, the separation structure is a "T" shaped structure.

[0061] The material of the third separation layer 403 and the first separation layer 401 can be the same metal material, and the etching rate of the second separation layer 402 is less than that of the second and first separation layers, so as to ensure that a protruding part with a certain length is formed above the first separation layer 401 after etching.

[0062] Similarly, in C, the third separation layer 403 is arranged on the side of the second separation layer 402 away from the first separation layer 401. Specifically, the first separation layer 401 is arranged on the pixel definition layer 109, the second separation layer 402 is arranged on the first separation layer 401, and the third separation layer 403 is arranged on the second separation layer 402. In the embodiment, the edge of the second separation layer 402 protrudes from the first separation layer 401 and the third separation layer 403, and the length of the third separation layer 403 can be less than or equal to that of the second separation layer 402. At this time, the length of the second separation layer 402 is the longest, so that the second separation layer 402 with different lengths is combined with the first separation layer 401, so as to form the first opening 64 provided in the application. In the preparation process of the film layer, the first opening 64 can form an undercut structure, so as to separate the light emitting functional layer 501 and other film layers thereon, and prevent the problem of transverse leakage current between adjacent sub-pixels.

[0063] In the setting of the third barrier layer 403 in the C diagram, the material of the third barrier layer 403 and the first barrier layer 401 can be set as the same material, and the first barrier layer 401 is set as a different material. For example, the material of the third barrier layer 403 and the third barrier layer is set as metal Al, and the material of the first barrier layer 401 is set as metal Ti. In the etching process, the etching rate of the first barrier layer 401 is greater than the etching rate of the second barrier layer 402, and the etching rate of Al is greater than the etching rate of Ti. Therefore, after the etching process, the isolation structure as shown in the C diagram is formed.

[0064] Similarly, in the D diagram, the first barrier layer 401 is set on the pixel definition layer 109, and the edges of the third barrier layer 403 and the second barrier layer 402 protrude from the edge of the first barrier layer 401, that is, the edge of the first barrier layer 401 is recessed in the second barrier layer 402 and the third barrier layer 403. In this way, the second barrier layer 402, the third barrier layer 403 and the first barrier layer 401 form an undercut structure at the edge of the film layer. When other film layers are prepared on this structure, the film layers are isolated during the preparation process, thereby avoiding the problem of easy horizontal leakage current between adjacent sub-pixels.

[0065] At this time, the third barrier layer 403 and the second barrier layer 402 are set as the same metal material, and the third barrier layer 403 is set as another type of metal material, and the etching rate of the first barrier layer is greater than the etching rate of the second barrier layer and the third barrier layer. Therefore, corresponding etching grooves and step structures are formed between the first barrier layer and the second barrier layer, and other film layers on them are isolated. The above different barrier layer materials can be selected according to requirements.

[0066] Further, as shown in Figure 4 , Figure 4 is a partial film layer structure of the display panel in Figure 1 provided in the embodiments of the present application at the pixel opening region. In combination with the film layer in Figure 1 , and the isolation structure in Figure 3 , in the embodiments of the present application, the edge of the third barrier layer 403 protrudes from the edge of the pixel definition layer 109, and forms a first covering part 60 at the pixel opening 30 region.

[0067] The first covering portion 60 has a second protrusion 82. Regarding the second separator 402 and the first separator 401, the edge of the second separator 402 protrudes beyond the edge of the first separator 401, and the second separator 402 has a first protrusion 81 relative to the edge of the first separator 401. Thus, an undercut structure is formed between the pixel definition layer 109 and the third separator 403, and the first openings corresponding to the first separator 401 and the second separator 402 also form an undercut structure. When other film layers are fabricated on this separation structure, the two different undercut structures effectively separate the film layers and prevent the problem of lateral charge movement.

[0068] In this embodiment, the first protrusion 81 has a length D1, and the second protrusion 82 has a length D2. The length D2 is greater than the length D1. Optionally, the ratio of length D2 to length D1 can be set to 2-4, such as length D2 being twice the length D1. In this way, the second protrusion 82 is longer and corresponds to the main cutting area, while the first protrusion 81 is shorter and corresponds to the secondary cutting area.

[0069] Specifically, the length D2 of the second protrusion 82 can be set to 20 angstroms to 1000 angstroms. For example, the length D2 can be set to 200 angstroms, 400 angstroms, or 500 angstroms. This ensures that the film layer is separated while avoiding the obstruction of light within the pixel opening.

[0070] Meanwhile, the length D1 of the first protrusion 81 can be set from 10 angstroms to 500 angstroms. For example, the length D1 can be set to 100 angstroms, 200 angstroms, 250 angstroms, or according to the type of product.

[0071] Furthermore, for the second covering portion 61 corresponding to the partition opening 31, the length of the protrusion of the second covering portion 61 is less than the length of the second protrusion 82 corresponding to the first covering portion 60. Also, in the partition opening 31, the length of the second partition 402 protruding relative to the first partition 401 is less than the length of the first protrusion 81 of the second partition 402 protruding relative to the first partition 401 within the pixel opening 30. The specific protrusion length can be set according to the size of different products, and different parameter combinations are all within the scope of protection of this application.

[0072] Combination Figure 1 The panel structure in the middle, when Figure 4 After the partition structure is fabricated, when fabricating the light-emitting functional layer 501, due to the aforementioned partition structure, protrusions will form between different layers of the partition structure. These protrusions will have an undercutting effect, thereby separating the light-emitting functional layer 501. See details. Figure 1In the embodiment, the light emitting functional layer 501 is disconnected at the pixel opening 30 and the partition opening 31, and when the light emitting functional layer 501 corresponding to a sub-pixel of one color normally emits light, the charge generated by the light emitting functional layer 501 cannot be transmitted from the sub-pixel to the adjacent sub-pixel, thereby avoiding the display problem of the adjacent sub-pixel appearing to be bright.

[0073] Further, in the embodiment, the first partition layer 401, the second partition layer 402, and the third partition layer 403 are arranged in the order of the first partition layer 401, the second partition layer 402, and the third partition layer 403. Figure 1 In the embodiment, the film layer structure is arranged, and when the first partition layer 401, the second partition layer 402, and the third partition layer 403 are arranged, the film layer thickness of the first partition layer 401 is greater than the film layer thicknesses of the second partition layer 402 and the third partition layer 403. For example, the thickness of the first partition layer 401 is 200 angstroms to 10,000 angstroms, for example, the thickness of the first partition layer 401 is 600 angstroms, and the thicknesses of the second partition layer 402 and the third partition layer 403 are the same, both of which are 300 angstroms. In this way, after the etching of the partition layers of the partition structure 48 is completed, the height between the first partition layer 401 and the second partition layer 402 and the third partition layer 403 can be ensured, thereby improving the cutting effect of the partition structure on other film layers.

[0074] Further, as shown in FIG. 5, Figure 5 Figure 5 FIG. 5 is a structural schematic diagram of a light emitting functional layer provided in the embodiment. The light emitting functional layer 501 can also be arranged in a stacked structure, Figure 5 only part of the film layer in the pixel opening 30 is shown. At this time, the light emitting functional layer 501 is arranged to have multiple light emitting layers, and the multiple light emitting layers are stacked, thereby improving the brightness of the device and reducing the power consumption of the display panel.

[0075] Specifically, the light emitting functional layer 501 in the red sub-pixel is taken as an example. The light emitting functional layer 501 includes a hole transport layer (HTL) 911, a light emitting layer 912, an N-type charge generation layer (CGL) 913, a P-type charge generation layer 914, and the light emitting layer 912 arranged in sequence. The above-mentioned film layers are arranged in sequence along the light emitting direction. In this way, the light emitting functional layer 501 includes two light emitting layers 912. The light emitting brightness of the light emitting functional layer 501 is effectively improved by the two light emitting layers 912. Optionally, the light emitting layer 912 is arranged as a red light emitting layer, and the number of the light emitting layer 912 can be increased to further improve the light emitting performance.

[0076] In the embodiment, the first partition layer 401, the second partition layer 402, and the third partition layer 403 are arranged in the order of the first partition layer 401, the second partition layer 402, and the third partition layer 403. Figure 1 ​In the structure of the application, when the display panel is normally working, the charge 910 will be formed in the hole transport layer 911. In the embodiment of the application, because the partition structure 48 is arranged on the pixel definition layer 109, the partition structure 48 will partition the corresponding light-emitting functional layer 501 in the two sub-pixels of different colors. At least the N-type charge generation layer 913 and the P-type charge generation layer 914 are disconnected at the partition structure 48 when partitioning, so as to avoid the horizontal movement of the charge. The partition structure 48 and the pixel definition layer form the first partition, and the different partition layers in the partition structure 48 form the second partition. In this way, the light-emitting functional layer 501 corresponding to the adjacent two sub-pixels is disconnected through multiple partitions, so as to avoid the problem of the adjacent sub-pixel being brightened due to the horizontal movement of the charge 910.

[0077] Further, as shown in Figures 6-7 , Figures 6-7 The display panel provided in the application is a corresponding film structure in the preparation process. In combination with the display panel structure in Figure 1 , the array substrate 10, the first planarization layer 107, and the pixel definition layer 109 are sequentially prepared and formed, and the partition structure 48 is deposited on the pixel definition layer 109.

[0078] As shown in Figure 6 , after the preparation of the partition structure 48, the etching treatment is performed on the composite partition structure 48. For example, etching is performed at the positions of the pixel opening 30 and the partition opening 31 to form a plurality of openings. In the embodiment of the application, because the etching rates of the first partition layer 401, the second partition layer 402, and the third partition layer 403 in the partition structure 48 are different, after etching for the same time, the first partition layer 401 is etched more, and the third partition layer 403 and the second partition layer 402 protrude from the first partition layer 401, so that the partition structure 48 forms an undercut and a corresponding opening.

[0079] As shown in Figure 7 , after the preparation of the partition structure 48, the etching treatment is performed on the pixel definition layer 109, for example, dry etching. The pixel opening 30 is formed on the anode 411, and the anode 411 is completely exposed. At the same time, the partition opening 31 is formed at the corresponding position. In the application, the opening height of the partition opening 31 can be less than or equal to the thickness of the pixel definition layer 109 when the partition opening 31 is formed. In this way, the etching process can be improved according to different products, and the partition effect is improved.

[0080] The specific structure of the pixel opening 30 and the partition opening 31 formed by etching can refer to the above description. During the etching process, the partition structure 48 is arranged to protrude relative to the pixel definition layer 109, so that the partition structure 48 and the pixel definition layer 109 form another partition structure.

[0081] As Figure 8 shown, Figure 8 is a schematic diagram of a sealing film layer of the display panel provided in the embodiments of the present application. In combination with the structure in Figure 1 , and the corresponding film layer diagram of the preparation process, after the preparation of the light-emitting functional layer 501, the cathode layer 761 is continuously prepared on the light-emitting functional layer 501, after the preparation of the cathode layer 761, the sealing layer 762 is continuously prepared on the cathode layer 761, and the film layers in the display panel are sealed through the sealing layer 762, and finally the display panel provided in the present application is formed. In the present application, when the light-emitting functional layer 501 is prepared on the above-mentioned partition structure 48, the plurality of cutting structures can cut the light-emitting functional layer 501, thereby avoiding the horizontal movement of the electric charge and causing the problem of stealing light of the adjacent sub-pixels.

[0082] Further, the embodiments of the present application also provide a display device, which comprises the display panel provided in the embodiments of the present application, and the film layer structure inside the display panel is improved to effectively avoid the problem of stealing light between adjacent sub-pixels caused by the horizontal movement of the electric charge in the panel. The display device can be a mobile phone, a computer, an electronic paper, a display, a wearable glasses, or any product or component having display, fingerprint identification or other functions, and the specific type is not specifically limited.

[0083] In summary, the above describes in detail the display panel provided in the embodiments of the present application, and the principles and implementation manners of the present application are described by applying specific examples. The above embodiment is only used to help understand the technical solutions and core ideas of the present application; although the present application is disclosed as above with preferred embodiments, the above preferred embodiments are not used to limit the present application, and any person skilled in the art can make various changes and decorations without departing from the spirit and scope of the present application, therefore the protection scope of the present application is based on the scope defined by the claims.

Claims

1. A display panel, characterized in that, include: Array substrate; A pixel definition layer is disposed on the array substrate, and the pixel definition layer includes a plurality of pixel openings; A partition structure is disposed on the side of the pixel definition layer away from the array substrate; and, A light-emitting functional layer, at least a portion of which is disposed within the pixel opening, wherein the light-emitting functional layer is interrupted at the edge of the partition structure; Wherein, the edge of the partition structure facing the pixel opening covers a portion of the pixel opening; and the partition structure includes a first opening, a first partition layer, and a second partition layer disposed on the side of the first partition layer away from the array substrate, the first opening is disposed facing the pixel opening, and in the area where the first opening is located, the edge of the second partition layer protrudes beyond the edge of the first partition layer. The pixel definition layer also includes a partition opening, and at least one partition opening is provided between two adjacent light-emitting functional layers of different colors, and the edge of the partition structure facing the partition opening covers part of the partition opening.

2. The display panel according to claim 1, characterized in that, The partition structure further includes a third partition layer, and the third partition layer is disposed on the side of the second partition layer away from the first partition layer; The length of the third partition is less than or equal to the length of the second partition.

3. The display panel according to claim 1, characterized in that, The partition structure further includes a third partition layer, wherein the first partition layer is disposed on the side of the third partition layer away from the pixel definition layer; The length of the third partition is greater than or equal to the length of the first partition.

4. The display panel according to claim 3, characterized in that, The second partition includes a first protrusion that extends beyond the edge of the first partition, and the third partition includes a second protrusion that extends beyond the edge of the pixel definition layer; The length of the second protrusion is greater than the length of the first protrusion.

5. The display panel according to claim 1, characterized in that, Both the first and second separators are metal film layers, and under the same etching conditions, the etching rate of the first separator is greater than that of the second separator.

6. The display panel according to claim 1, characterized in that, The light-emitting functional layer includes at least two light-emitting layers and a charge generation layer disposed between the light-emitting layers; Wherein, at least the charge generation layer is disconnected in the region corresponding to the partition structure and the pixel opening.

7. The display panel according to claim 1, characterized in that, The partition structure further includes a second opening, which is disposed toward the partition opening, and in the area where the second opening is located, the edge of the second partition layer of the partition structure protrudes beyond the edge of the first partition layer of the partition structure.

8. The display panel according to claim 1, characterized in that, The opening area of ​​the pixel opening is greater than the opening area of ​​the partition opening, and the slope of the inner wall of the pixel definition layer within the pixel opening is less than the slope of the inner wall of the pixel definition layer within the partition opening.

9. The display panel according to claim 1, characterized in that, The ratio of the protrusion length of the edge of the partition structure beyond the edge of the pixel definition layer to the protrusion length of the edge of the second partition layer beyond the edge of the first partition layer is set to 2~4.

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