Mounting device for wafer cleaning machine and cleaning machine mounting method

Abstract

The application discloses a mounting device for a wafer cleaning machine and a cleaning machine mounting method, wherein the device comprises: a first mounting piece, which is arranged at two ends of a base of the wafer cleaning machine and is connected with bearing seats arranged at the two ends of the base; the first mounting piece is provided with a mounting groove, and the bearing seat is arranged in the mounting groove; a second mounting piece, which is arranged on a motor mounting sheet of the wafer cleaning machine; two motor mounting sheets are arranged at the two ends of the base respectively, the motor mounting sheets are connected with the bearing seats, the motor mounting sheets are provided with motor mounting holes, and the second mounting piece comprises: a main plate and a clamping plate, the clamping plate is arranged on the main plate, the clamping plate is arranged in the motor mounting hole and tightly matches the motor mounting hole, and the top end of the main plate is arranged in alignment with the top end of the motor mounting sheet. The application can realize the calibration of the coaxiality of the motor mounting sheet in the process of mounting the wafer cleaning machine.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to an installation device and a method for installing a wafer cleaning machine. Background Technology

[0002] Wafer cleaning machines are the main equipment for wafer cleaning. The wafer cleaning module includes two cleaning units: megasonic cleaning and brush cleaning. The brush cleaning unit has at least two parallel brushes, namely a support roller and a drive roller. During cleaning, the wafer contacts the brush, and the dirt on the wafer is removed by the rotation of the brush.

[0003] When installing a wafer cleaning machine, the two ends of the cleaning brush rollers need to be mounted on the mounting plates of the cleaning machine. Currently, during installation, the bearing mounting base of the cleaning machine is first fixed directly to the base plate, and then the mounting plates are installed on the bearing mounting base without calibrating the coaxiality of the mounting holes on the mounting plates. This results in the cleaning brushes not being mounted coaxially or parallel on the cleaning machine, which in turn affects the overall transmission stability of the cleaning machine and the service life of the cleaning brush drive motor. Summary of the Invention

[0004] To address at least one technical problem in the prior art, embodiments of the present invention provide an installation device and a method for installing a wafer cleaning machine. The technical solution is as follows:

[0005] In a first aspect, the present invention discloses an installation device for a wafer cleaning machine, comprising:

[0006] The first mounting component is disposed at both ends of the base of the wafer cleaning machine and connected to the bearing seats disposed at both ends of the base. The first mounting component has a mounting groove, and the bearing seats are disposed in the mounting groove.

[0007] The second mounting component is disposed on the motor mounting plate of the wafer cleaning machine. Two motor mounting plates are respectively disposed at both ends of the base. The motor mounting plates are connected to the bearing seat and have motor mounting holes. The second mounting component includes a main board and a snap-fit ​​plate. The snap-fit ​​plate is disposed on the main board and disposed in the motor mounting hole and is tightly fitted to the motor mounting hole. The top end of the main board is aligned with the top end of the motor mounting plate.

[0008] Furthermore, the second mounting component also includes a connecting plate, which is connected to the top of the main board and is disposed on the top of the motor mounting plate.

[0009] Furthermore, the first mounting component is also provided with a slot, which is located at the bottom of the first mounting component, and the first mounting component is engaged with the end of the base through the slot.

[0010] Furthermore, a connecting spindle is provided between the motor mounting plates at both ends of the base.

[0011] Furthermore, the bearing housing includes a mounting portion and a connecting portion, the mounting portion and the connecting portion being vertically connected, the mounting portion being disposed in the mounting groove of the first mounting member, and the connecting portion being connected to the motor mounting plate.

[0012] Furthermore, the wafer cleaning machine also includes: a fixed base, which is disposed at both ends of the base, and a bearing seat disposed on the fixed base. The bearing seat has an oblong hole and is connected to the fixed base through the oblong hole.

[0013] Secondly, this invention discloses an installation method for a wafer cleaning machine, comprising:

[0014] The first mounting component is installed at both ends of the base of the wafer cleaning machine. The first mounting component has a mounting groove, and the bearing seat is placed in the mounting groove.

[0015] The motor mounting plate of the wafer cleaning machine is pre-installed on the bearing seat, and two motor mounting plates are respectively provided at both ends of the base. The first mounting parts at both ends of the base are removed.

[0016] The second mounting component is installed on the top of the motor mounting plate. The motor mounting component has a motor mounting hole. The second mounting component includes a main board and a snap-fit ​​plate. The snap-fit ​​plate is disposed on the main board and disposed in the motor mounting hole so that the snap-fit ​​plate fits tightly with the motor mounting hole. The top of the main board is aligned with the top of the motor mounting plate.

[0017] The motor mounting plate is fixedly installed on the bearing housing, and the second mounting component is removed.

[0018] Furthermore, the second mounting component further includes a connecting plate, and the method further includes:

[0019] The connecting plate is installed on top of the main board and the motor mounting plate.

[0020] Furthermore, before installing the second mounting component, the method further includes: mounting the connecting spindle of the wafer cleaning machine between the motor mounting plates at both ends of the base.

[0021] Furthermore, the method also includes:

[0022] The mounting base of the wafer cleaning machine is placed in the mounting groove of the first mounting component. The bearing seat has an oblong hole, and the bearing seat is connected to the mounting base through the oblong hole.

[0023] The beneficial effects of the technical solutions provided in the embodiments of the present invention include at least the following:

[0024] 1. The installation device for a wafer cleaning machine disclosed in this invention restricts the position of the bearing seat by a first mounting component to ensure that the installation positions of the motor mounting pieces on both sides of the base are opposite, and ensures the parallelism of the installation positions of the motor mounting pieces located on the same side of the base by a second mounting component, thereby enabling the calibration of the coaxiality of the motor mounting pieces during the installation of the wafer cleaning machine.

[0025] 2. The installation method of the wafer cleaning machine disclosed in the embodiments of the present invention can achieve coaxiality calibration of the motor mounting plate during the installation process, avoid the problem of tilting when installing the cleaning brush later, and ensure the wafer cleaning effect. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the assembly structure of the installation device and the wafer cleaning machine provided in the embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the structure of the first mounting component provided in an embodiment of the present invention;

[0029] Figure 3 This is a schematic diagram of the structure of the second mounting component provided in an embodiment of the present invention;

[0030] Figure 4 This is a schematic diagram of the motor mounting plate structure provided in an embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram of the bearing housing structure provided in an embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of the fixed base assembly structure provided in an embodiment of the present invention.

[0033] In the diagram: 11 Base, 12 Bearing seat, 13 Motor mounting plate; 14 Connecting spindle; 15 Fixed seat;

[0034] 121 Mounting part; 122 Connecting part; 123 Oblong hole; 131 Motor mounting hole;

[0035] 21 First mounting component; 22 Second mounting component;

[0036] 211 Mounting slot; 212 Card slot; 221 Motherboard; 222 Card connector board; 223 Connecting board. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0038] It should be noted that the terms "first" and "second" used in the embodiments of the present invention are used to distinguish between two entities or parameters with the same name but different names. It is clear that "first" and "second" are only for the convenience of expression and should not be construed as limiting the embodiments of the invention. Subsequent embodiments will not explain this in detail.

[0039] To address the coaxiality issue of the motor mounting plate of the cleaning brush during the assembly of a wafer cleaning machine, this invention proposes a mounting device and method for a wafer cleaning machine. The specific technical solution is as follows:

[0040] like Figure 1 As shown, the wafer cleaning machine includes: a base 11, bearing seats 12, and motor mounting plates 13. The installation requirements for the wafer cleaning machine include: mounting the bearing seats 12 at both ends of the base 11, ensuring that the bearing seats 12 at both ends of the base 11 are aligned axially along the base 11. The motor mounting plates 13 are used to mount the rollers of the cleaning brushes. There are four motor mounting plates 13; two motor mounting plates 13 are mounted at each end of the base 11. The motor mounting plates 13 are connected to the bearing seats 12. The motor mounting plates 13 have motor mounting holes 131. It is necessary to ensure that the motor mounting holes 131 on the motor mounting plates 13 at both ends of the base 11 are coaxially aligned, and that the motor mounting holes 131 on the motor mounting plates 13 at the same end of the base 11 are aligned.

[0041] A mounting device for a wafer cleaning machine includes a first mounting member 21 and a second mounting member 22. The first mounting member 21 is disposed at both ends of a base 11 and connected to bearing seats 12 disposed at both ends of the base 11. Figure 2 As shown, the first mounting member 21 has a mounting groove 211, and the bearing seat 12 is disposed in the mounting groove 211. Exemplarily, the first mounting member 21 is a plate, with one side of the plate recessed inward to form the mounting groove 211. The side of the first mounting member 21 can abut against the end face of the base 11. Figure 1 As shown, the first mounting member 21 is used to limit the position of the bearing seat 12 and ensure that the mounting positions of the motor mounting pieces 13 on both sides of the base 11 are opposite, that is, to ensure that the positions of the motor mounting pieces 13 in the x-axis direction are opposite.

[0042] In one embodiment, such as Figure 2 As shown, the first mounting member 21 further includes a slot 212. The slot 212 is disposed at the bottom of the first mounting member 21 for engaging the first mounting member 21 onto the end of the base 11. Exemplarily, the first mounting member 21 is a plate, the slot 212 is recessed from the bottom surface to the top surface of the first mounting member 21, and has an open opening at one end of the plate. The shape of the slot 212 is adapted to the shape of the end of the base 11, thereby allowing the first mounting member 21 to be pushed onto the base 11 from the open opening of the slot 212 during installation, so that the end of the base 11 enters the slot 212.

[0043] The second mounting component 22 is mounted on the motor mounting plate 13, such as Figure 3 As shown, the second mounting component 22 includes a main board 221 and a snap-fit ​​plate 222. The snap-fit ​​plate 222 is disposed on the main board 221 and is embedded in the motor mounting hole 131, and is tightly fitted with the motor mounting hole 131. The top end of the main board 221 is aligned with the top ends of the two motor mounting pieces 13 on the same side. For example, as shown... Figure 4 As shown, the motor mounting hole 131 on the motor mounting plate 13 is a round hole, the snap-fit ​​plate 222 of the second mounting component 22 is a round plate, and the main plate 221 is a rectangular plate. The snap-fit ​​plate 222 is disposed in the motor mounting hole 131. Figure 1 As shown, the second mounting component 22 is used to ensure the parallelism of the installation position of the motor mounting piece 13 located on the same side of the base 11, that is, to ensure that the positions of the motor mounting pieces 13 in the y-axis direction are relative, and to ensure that the parallelism and height of the motor mounting pieces 13 on the same side are consistent.

[0044] In one embodiment, such as Figure 1 As shown, the second mounting component 22 further includes a connecting plate 223, which is connected to the top of the main board 221 and is disposed on the top of the motor mounting plate 13. Specifically, the connecting plate 223 is vertically connected to the main board 221, the main board 221 is fixed to the side of the motor mounting plate 13, and the connecting plate 223 is fixed to the top of the motor mounting plate 13. Further, the connecting plate 223 and the main board 221 can be an integral connector.

[0045] In one embodiment, a connecting spindle 14 is disposed between the motor mounting plates 13 at both ends of the base 11. Further, the connecting spindle 14 is fixed by bolts. The connecting spindle 14 and the second mounting member 22 together ensure the parallelism of the motor mounting plates 13.

[0046] In one embodiment, such as Figure 5 As shown, the bearing housing 12 includes a mounting portion 121 and a connecting portion 122. The mounting portion 121 and the connecting portion 122 are vertically connected to form a right-angle corner structure. The mounting portion 121 is disposed in the mounting groove 211 of the first mounting member 21, and the connecting portion 122 is connected to the motor mounting plate 13. It should be noted that, as Figure 1 As shown, in one case, one bearing housing 12 can connect two motor mounting plates 13, and a bearing housing 12 is respectively provided at both ends of the base 11; as Figure 6 As shown, in another case, a main bearing housing 12 can be connected to a motor mounting plate 13, and two bearing housings 12 are respectively provided at both ends of the base 11.

[0047] In one embodiment, such as Figure 6 As shown, the wafer cleaning machine also includes: a fixed base 15, which is disposed at both ends of the base 11; a bearing seat 12 is disposed on the fixed base 15; the bearing seat 12 has an oblong hole 123, and the bearing seat 12 is connected to the fixed base through the oblong hole 123. The bearing seat 12's connection to the fixed base 15 through the oblong hole 123 allows for a certain sliding space relative to the fixed base 15, which can be used to adjust the position of the bearing seat 12. Furthermore, the fixed base 15 has a right-angle corner structure, and is disposed in the mounting groove 211 of the first mounting member 21, with the bearing seat 12 disposed in the corner space of the fixed base 15.

[0048] Based on the installation device for a wafer cleaning machine disclosed in the above embodiments of the present invention, the present invention also provides an installation method for a wafer cleaning machine, comprising:

[0049] S1. The first mounting component 21 is installed at both ends of the base 11 of the wafer cleaning machine. The first mounting component 21 has a mounting groove 211, and the bearing seat 12 is placed in the mounting groove 211.

[0050] In one embodiment, the first mounting member 21 further includes a slot 212, which is disposed at the bottom of the first mounting member 21. Step S1 specifically includes:

[0051] The first mounting component 21 is snapped onto the end of the base 11 through the slot 212, and the position of the first mounting component 21 is determined by the cooperation between the slot 212 and the base 11.

[0052] In one embodiment, the bearing housing 12 includes a mounting portion 121 and a connecting portion 122, which are vertically connected. The mounting portion 121 is disposed in the mounting groove 211 of the first mounting member 21, and the connecting portion 122 is connected to the motor mounting plate 13.

[0053] In one embodiment, the bearing housing 12 has an oblong hole 123. During the process of setting the mounting base of the wafer cleaning machine in the mounting groove 211 of the first mounting member 21, step S1 disclosed in this embodiment further includes: connecting the bearing housing 12 to the mounting base 15 through the oblong hole 123. As described above, the bearing housing 12 can slide on the mounting base 15 through the oblong hole 123. According to process requirements, after the motor mounting piece 13 is installed, the relative position of the bearing housing 12 and the mounting base 15 can be adjusted. After adjustment, the bearing housing 12 is fixed to the base 11 through the oblong hole 123.

[0054] S2. Pre-install the motor mounting plate 13 of the wafer cleaning machine on the bearing seat 12. Set two motor mounting plates 13 at both ends of the base 11 respectively. Remove the first mounting parts 21 at both ends of the base 11.

[0055] In one embodiment, after removing the first mounting component 21, the method disclosed in this embodiment further includes: installing the connecting spindle 14 of the wafer cleaning machine between the motor mounting plates 13 at both ends of the base 11. Exemplarily, the connecting spindle 14 and the motor mounting plates 13 are pre-connected (not locked) by five screws. The second mounting component 22 is then installed on the two motor mounting plates 13 and locked with screws to adjust the coaxiality and levelness of the two motor mounting plates 13. At this point, the two motor mounting plates 13 located on the same side are calibrated. Subsequently, the position between the motor mounting plates 13 and the connecting spindle 14 is limited by set screws, and then the five screws are tightened.

[0056] S3. Install the second mounting component 22 on the top of the motor mounting plate 13. The motor mounting component has a motor mounting hole 131. The second mounting component 22 includes a main board 221 and a snap-fit ​​plate 222. The snap-fit ​​plate 222 is disposed on the main board 221 and disposed in the motor mounting hole 131 so that the snap-fit ​​plate 222 fits tightly with the motor mounting hole 131. The top end of the main board 221 is aligned with the top end of the motor mounting plate 13.

[0057] In one embodiment, the second mounting component 22 further includes a connecting plate 223. Step S3 disclosed in this embodiment further includes mounting the connecting plate 223 on the top of the main board 221 and the motor mounting plate 13. In this embodiment, the connecting plate 223 is mainly used to ensure that the top of the main board 221 and the motor mounting plate 13 are flush. Further, the connecting plate 223, the main board 221, and the snap-fit ​​plate 222 can be an integral connector.

[0058] S4. Fix the motor mounting plate 13 onto the bearing seat 12 and remove the second mounting piece 22.

[0059] The installation method of the wafer cleaning machine disclosed in the above embodiments of the present invention can achieve coaxiality calibration of the motor mounting plate 13 during the installation process, avoid the problem of tilting when installing the cleaning brush later, and ensure the wafer cleaning effect.

[0060] The technical solutions provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

[0061] All of the above-mentioned optional technical solutions can be combined in any way to form optional embodiments of the present invention, and will not be described in detail here.

[0062] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An installation device for a wafer cleaning machine, characterized in that, include: The first mounting component is disposed at both ends of the base of the wafer cleaning machine and connected to the bearing seats disposed at both ends of the base. The first mounting component has a mounting groove, and the bearing seats are disposed in the mounting groove. The first mounting component is further provided with a slot, which is located at the bottom of the first mounting component, and the first mounting component is engaged with the end of the base through the slot; The second mounting component is disposed on the motor mounting plate of the wafer cleaning machine. Two motor mounting plates are respectively disposed at both ends of the base. The motor mounting plates are connected to the bearing seat and have motor mounting holes. The second mounting component includes a main board and a snap-fit ​​plate. The snap-fit ​​plate is disposed on the main board and disposed in the motor mounting hole and is tightly fitted to the motor mounting hole. The top end of the main board is aligned with the top end of the motor mounting plate. A connecting spindle is provided between the motor mounting plates at both ends of the base.

2. The mounting device for a wafer cleaning machine as described in claim 1, characterized in that, The second mounting component further includes a connecting plate, which is connected to the top of the main board and is disposed on the top of the motor mounting plate.

3. The mounting device for a wafer cleaning machine as described in claim 1, characterized in that, The bearing housing includes a mounting portion and a connecting portion, which are vertically connected. The mounting portion is disposed in the mounting groove of the first mounting member, and the connecting portion is connected to the motor mounting plate.

4. The mounting device for a wafer cleaning machine as described in claim 3, characterized in that, The wafer cleaning machine further includes: a fixed base, which is disposed at both ends of the base, and a bearing seat disposed on the fixed base. The bearing seat has an oblong hole and is connected to the fixed base through the oblong hole.

5. A method for installing a wafer cleaning machine, characterized in that, include: The bottom of the first mounting component is provided with a slot, which is snapped into both ends of the base of the wafer cleaning machine so that the first mounting component is installed at both ends of the base of the wafer cleaning machine. The first mounting component has a mounting groove in which the bearing seat is placed. The motor mounting plate of the wafer cleaning machine is pre-installed on the bearing seat, and two motor mounting plates are respectively provided at both ends of the base. The first mounting parts at both ends of the base are removed. The second mounting component is installed on the top of the motor mounting plate. The motor mounting component has a motor mounting hole. The second mounting component includes a main board and a snap-fit ​​plate. The snap-fit ​​plate is disposed on the main board and disposed in the motor mounting hole so that the snap-fit ​​plate fits tightly with the motor mounting hole. The top of the main board is aligned with the top of the motor mounting plate. The motor mounting plate is fixedly installed on the bearing seat, and the second mounting component is removed; Before installing the second mounting component, the method further includes: mounting the connecting spindle of the wafer cleaning machine between the motor mounting plates at both ends of the base.

6. The installation method of the wafer cleaning machine as described in claim 5, characterized in that, The second mounting component further includes a connecting plate, and the method further includes: The connecting plate is installed on top of the main board and the motor mounting plate.

7. The installation method of the wafer cleaning machine as described in claim 5, characterized in that, The method further includes: The mounting base of the wafer cleaning machine is placed in the mounting groove of the first mounting component. The bearing seat has an oblong hole, and the bearing seat is connected to the mounting base through the oblong hole.

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