A chip and its temperature control method, electronic device and computer storage medium

Abstract

The embodiment of the present invention provides a chip and its temperature control method, electronic device and computer-readable storage medium, which relate to the field of vehicle machine technology, including: the system-on-chip SOC includes a first processor domain for acquiring temperature data, at least one second processor domain for temperature control based on the temperature data and a memory space, after the first processor domain acquires the temperature data of the area to be detected in the SOC, the temperature data can be written into the memory space, after at least one second processor domain acquires the temperature data from the memory space, at least one second processor domain can perform temperature control on the target hardware unit of the SOC according to the temperature data. The embodiment of the present invention realizes that each domain can acquire temperature data, so that each domain performs independent temperature control without interfering with each other, and jointly completes the temperature control of the chip.

Description

Technical Field

[0001] The present invention relates to the field of vehicle computer technology, and in particular to a cross-domain chip temperature control method, a chip, an electronic device and a computer-readable storage medium. Background Art

[0002] At present, the vehicle's smart cockpit chip contains multiple independent CPU (Central Processing Unit) domains and modules for processing voltage, temperature, and PVT. In the vehicle system, it is necessary to detect temperature changes in real time. When the temperature exceeds a certain threshold, certain strategies need to be adopted to ensure that the temperature of the chip is controlled within a certain range, thereby ensuring stable and high-performance operation of the vehicle system.

[0003] Since the PVT module only supports allocation to one CPU domain and cannot support temperature detection on multiple independent CPU domains, how multiple CPU domains can jointly complete cross-domain temperature control is a major challenge currently faced. Summary of the invention

[0004] In view of the above problems, embodiments of the present invention are proposed to provide a cross-domain chip temperature control method, a chip, an electronic device and a computer-readable storage medium that overcome the above problems or at least partially solve the above problems.

[0005] An embodiment of the present invention discloses a cross-domain chip temperature control method, which is applied to a system-on-chip (SOC), wherein the SOC includes a first processor domain for acquiring temperature data, at least one second processor domain for performing temperature control based on the temperature data, and a memory space; the method includes:

[0006] The first processor domain acquires temperature data of a to-be-detected area in the SOC;

[0007] The first processor domain writes the temperature data into the memory space;

[0008] At least one of the second processor domains obtains the temperature data from the memory space;

[0009] At least one of the second processor domains performs temperature control on a target hardware unit of the SOC according to the temperature data.

[0010] In one or more embodiments, the SOC further includes a voltage and temperature PVT processing module, and the first processor domain is provided with a PVT driver corresponding to the PVT module; the first processor domain acquires temperature data of the area to be detected in the SOC, including:

[0011] The first processor domain acquires the collected temperature data of the area to be detected in the SOC from the PVT module through the PVT driver.

[0012] In one or more embodiments, each of the second processor domains is provided with a virtual PVT driver; and the at least one second processor domain obtains the temperature data from the memory space, including:

[0013] At least one of the second processor domains obtains the temperature data from the memory space through the virtual PVT driver.

[0014] In one or more embodiments, when at least one of the second processor domains is provided with a temperature control driver, a core program hwmon core in a hardware monitoring framework hwmon, and a core program thermal_core in a thermal framework, at least one of the second processor domains performs temperature control on a target hardware unit of the SOC according to the temperature data, including:

[0015] The second processor domain reports the temperature data obtained from the virtual PVT driver to the hwmoncore and then to thermal_core;

[0016] The temperature data is sent to the temperature control driver, and the second processor domain performs temperature control on a target hardware unit of the SOC according to the temperature data through the temperature control driver.

[0017] In one or more embodiments, when any second processor domain of at least one of the second processor domains is provided with a temperature control management program, at least one of the second processor domains performs temperature control on a target hardware unit of the SOC according to the temperature data, including:

[0018] The second processor domain sends the temperature data to the temperature control management program through a virtual PVT driver, and the second processor domain performs temperature control on a target hardware unit of the SOC according to the temperature data through the temperature control management program.

[0019] In one or more embodiments, the second processor domain controls the temperature of the target hardware unit of the SOC according to the temperature data through the temperature control driver, including:

[0020] When the temperature control driver determines that the temperature data exceeds a first temperature threshold and does not exceed a second temperature threshold, the second processor domain performs frequency reduction processing on a target hardware unit of the SOC through the temperature control driver;

[0021] When the temperature control driver determines that the temperature data exceeds the second temperature threshold and does not exceed the third temperature threshold, the second processor domain shuts down the preset core processing unit of the target hardware unit of the SOC through the temperature control driver;

[0022] When the temperature control driver determines that the temperature data exceeds the third temperature threshold, the second processor domain restarts the target hardware unit of the SOC through the temperature control driver.

[0023] In one or more embodiments, the area to be detected includes: a graphics processor area, an application processor area, a safety island area, and a top-level circuit area.

[0024] In one or more embodiments, the at least one second processor domain obtains the temperature data from the memory space, including:

[0025] After each preset time interval, at least one of the second processor domains obtains the temperature data from the memory space.

[0026] In one or more embodiments, when the second processor domain is an application processor domain, the application processor domain further includes a thermal mitigation framework layer thermal HAL, which is used to obtain the temperature data from the hwmon core and display the temperature data.

[0027] In one or more embodiments, when the second processor domain is a cluster processor, the cluster processor domain further includes a temperature management service program thermal_manager, which is used to obtain the temperature data from the hwmon core and display the temperature data.

[0028] Accordingly, an embodiment of the present invention discloses a system-on-chip (SOC), wherein the system-on-chip (SOC) comprises a first processor domain for acquiring temperature data, at least one second processor domain for performing temperature control based on the temperature data, and a memory space;

[0029] The first processor domain is used to obtain temperature data of a to-be-detected area in the SOC;

[0030] The first processor domain is further used to write the temperature data into the memory space;

[0031] at least one of the second processor domains, configured to obtain the temperature data from the memory space;

[0032] At least one of the second processor domains is further configured to perform temperature control on a target hardware unit of the SOC according to the temperature data.

[0033] In one or more embodiments, the SOC further includes a processing voltage temperature PVT module, and the first processor domain is provided with a PVT driver corresponding to the PVT module;

[0034] The first processor domain is further used to obtain the collected temperature data of the area to be detected in the SOC from the PVT module through the PVT driver.

[0035] In one or more embodiments, each of the second processor domains is provided with a virtual PVT driver;

[0036] At least one of the second processor domains is further configured to obtain the temperature data from the memory space through the virtual PVT driver.

[0037] In one or more embodiments, when at least one of the second processor domains is provided with a temperature control driver, a core program hwmon core in a hardware monitoring framework hwmon, and a core program thermal_core in a thermal framework, the second processor domain is further configured to:

[0038] Report the temperature data obtained from the virtual PVT driver to the hwmon core and then to thermal_core;

[0039] The temperature data is sent to the temperature control driver, and the second processor domain performs temperature control on a target hardware unit of the SOC according to the temperature data through the temperature control driver.

[0040] In one or more embodiments, when any second processor domain in at least one of the second processor domains is provided with a temperature control management program, the second processor domain is further configured to:

[0041] The temperature data is sent to the temperature control management program through a virtual PVT driver, and the second processor domain performs temperature control on a target hardware unit of the SOC according to the temperature data through the temperature control management program.

[0042] In one or more embodiments, the second processor domain is further configured to:

[0043] When the temperature control driver determines that the temperature data exceeds a first temperature threshold and does not exceed a second temperature threshold, the temperature control driver performs frequency reduction processing on a target hardware unit of the SOC;

[0044] When the temperature control driver determines that the temperature data exceeds the second temperature threshold and does not exceed the third temperature threshold, shutting down the preset core processing unit of the target hardware unit of the SOC through the temperature control driver;

[0045] When the temperature control driver determines that the temperature data exceeds the third temperature threshold, the target hardware unit of the SOC is restarted by the temperature control driver.

[0046] In one or more embodiments, the area to be detected includes: a graphics processor area, an application processor area, a safety island area, and a top-level circuit area.

[0047] In one or more embodiments, the at least one second processor domain is further configured to:

[0048] After each preset time interval, the temperature data is obtained from the memory space.

[0049] In one or more embodiments, when the second processor domain is an application processor domain, the application processor domain further includes a thermal mitigation framework layer thermal HAL, which is used to obtain the temperature data from the hwmon core and display the temperature data.

[0050] In one or more embodiments, when the second processor domain is a cluster processor, the cluster processor domain further includes a temperature management service program thermal_manager, which is used to obtain the temperature data from the hwmon core and display the temperature data.

[0051] Correspondingly, an embodiment of the present invention discloses an electronic device, comprising: a processor, a memory, and a computer program stored in the memory and capable of running on the processor, wherein the computer program implements the various steps of the above-mentioned cross-domain chip temperature control method embodiment when executed by the processor.

[0052] Accordingly, an embodiment of the present invention discloses a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, each step of the above-mentioned cross-domain chip temperature control method embodiment is implemented.

[0053] The embodiments of the present invention include the following advantages:

[0054] The system-on-chip (SOC) comprises a first processor domain for acquiring temperature data, at least one second processor domain for performing temperature control based on the temperature data, and a memory space. After acquiring the temperature data of the area to be detected in the SOC, the first processor domain can write the temperature data into the memory space. After at least one of the second processors acquires the temperature data from the memory space, at least one of the second processor domains can perform temperature control on the target hardware unit of the SOC according to the temperature data. In this way, the temperature data is shared with each CPU domain through the memory space, which solves the problem that the PVT module only supports the allocation of one CPU domain, resulting in other CPU domains being unable to acquire temperature data, and enables each domain to acquire temperature data, so that each domain performs independent temperature control without interfering with each other, and jointly completes the temperature control of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 It is a flow chart of steps of an embodiment of a cross-domain chip temperature control method of the present invention;

[0056] Figure 2 It is a schematic diagram of the SOC architecture of the present invention. DETAILED DESCRIPTION

[0057] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0058] One of the core concepts of the embodiment of the present invention is to share temperature data with each CPU domain through memory space, thereby solving the problem that the PVT module only supports the allocation of one CPU domain, resulting in other CPU domains being unable to obtain temperature data, and realizing that each domain can obtain temperature data, so that each domain performs independent temperature control without interfering with each other, and jointly completes the temperature control of the chip.

[0059] Reference Figure 1 , showing a flow chart of steps of a cross-domain chip temperature control method embodiment of the present invention, which can be applied to the system-on-chip SOC (System on Chip) of the smart cockpit of the vehicle, such as Figure 2As shown, the SOC may include a first processor domain, at least one second processor domain and a memory space LPDDR (Low Power Double Data Rate) and a processing voltage temperature PVT module. The first processor domain may include an MP (Microcontroller Processors) domain, the second processor domain may include an AP (Application Processors) domain, a CP (Cluster processor) domain and an RP (Real-time Processors) domain, the AP domain is used to run IVI (In-Vehicle Infotainment) services, the CP domain is used to run vehicle instrument services, the RP domain is used to run real-time safety-related services, and the MP domain is used to manage power consumption and other services.

[0060] Furthermore, the Android OS (Operating System) can be run in the AP domain. In addition, the AP domain can include the local area Native and the kernel area Kemel. Kemel includes the virtual PVT driver virtual pvt driver, the core program hwmon core in the hwmon framework, the core program thermal_core in the thermal framework, and the temperature control driver cooling_device. Native includes the thermal mitigation framework layer thermal HAL, which is used to obtain temperature data from the hwmon core and display the temperature data; wherein the virtual PVT driver is used to obtain temperature data from the memory space at a regular interval and report it to the hwmon core through the hwmon interface; hwmon core is a standard subsystem of Linux; thermal_core is used to associate the temperature control strategy with the temperature control device for subsequent temperature control; the temperature control driver is used to perform temperature control on the target hardware unit (not shown in the figure) in the AP domain. Among them, the target hardware unit in the AP domain includes but is not limited to the CPU unit, GPU (graphics processing unit) unit, and NPU (Neural Processing Unit) unit.

[0061] Linux OS can be run in the CP domain. The CP domain can include the runtime area Runtime and the kernel area Kemel. Kemel includes the virtual PVT driver virtual pvt driver, the core program hwmon core in the hwmon framework, the core program thermal_core in the thermal framework, and the temperature control driver cooling_device. The Runtime includes the temperature management service program thermal_manager in the user space, which is used to obtain temperature data from the hwmon core and display the temperature data; wherein the virtual PVT driver is used to obtain temperature data from the memory space regularly and report it to the hwmon core through the hwmon interface; hwmon core is a standard subsystem of Linux; thermal_core is used to associate the temperature control strategy with the temperature control device for subsequent temperature control; the temperature control driver is used to perform temperature control on the target hardware unit (not shown in the figure) in the CP domain. Among them, the target hardware units in the CP domain include but are not limited to CPU units, GPU units, and NPU units.

[0062] Safety OS can run in the RP domain. The RP domain includes the virtual PVT driver and the thermal strategy management program. The thermal strategy is used to control the temperature of the RP domain.

[0063] The MP domain includes the physical driver pvt driver of PVT, which is used to read the temperature data of the area to be detected obtained by the PVT module, wherein the area to be detected includes but is not limited to: GPU0 area (i.e., graphics processor area), AP (CPU processor) 0 area (i.e., application processor area), SAF (Safety Software Framework, safety island) area (i.e., safety island area) and Top logic area (i.e., top circuit area). The SAF area can be the area of ​​the hardware unit (or core unit) responsible for the functional safety of the vehicle in the vehicle chip module. The Top logic area can be the top-level logic circuit inside the chip unit or system-level chip, including the top-level circuit (or integrated circuit) inside the chip, the management unit (circuit or integrated circuit) and the overall control logic unit (circuit or integrated circuit), etc.

[0064] further, Figure 2 The links for the temperature data are as follows (“=>” indicates the direction of data flow):

[0065] 2.pvt=>1.pvt driver=>8.LPDDR=>7.virtual pvt driver=>5.hwmon core=>6.thermal_core=>4.cooling_device and 5.hwmon core=>3.thermal HAL;

[0066] 2.pvt=>1.pvt driver=>8.LPDDR=>13.virtual pvt driver=>11.hwmon core=>12.thermal_core=>10.cooling_device and 11.hwmon core=>9.thermal_manager;

[0067] 2.pvt=>1.pvt driver=>8.LPDDR=>15.virtual pvt driver=>14.thermalstrategy.

[0068] Based on this, the embodiment of the present invention may specifically include the following steps:

[0069] Step 101: The first processor domain obtains temperature data of a to-be-detected area in the SOC.

[0070] As described above, the areas to be detected in the SOC may be the GPU0 area, the AP0 area, the SAF area, and the Top logic area, and the first processor domain may obtain temperature data of these areas.

[0071] In an embodiment of the present invention, the SOC further includes a voltage and temperature PVT processing module, and the first processor domain is provided with a PVT driver corresponding to the PVT module; the first processor domain acquires temperature data of a to-be-detected area in the SOC, including:

[0072] The first processor domain acquires the collected temperature data of the area to be detected in the SOC from the PVT module through the PVT driver.

[0073] Specifically, after the PVT module obtains the temperature data collected by each temperature sensor, the first processor domain can read the temperature data of the area to be detected from the PVT module through the pvt driver. The PVT module supports four temperature sensors to collect the temperature data of the area to be detected.

[0074] Furthermore, the pvt driver may read temperature data from the PVT module periodically, may obtain temperature data in real time, or may obtain temperature data in other ways. In practical applications, the temperature data may be adjusted according to actual needs, and the embodiment of the present invention does not limit this.

[0075] Step 102: The first processor domain writes the temperature data into the memory space.

[0076] After acquiring the temperature data, the pvt driver in the first processor domain may write the temperature data into the memory space LPDDR.

[0077] Step 103: at least one of the second processor domains obtains the temperature data from the memory space.

[0078] After the temperature data is written into the memory space, each second processor domain can obtain the temperature data from the memory space, so that when the PVT module supports one CPU domain, other CPU domains can still obtain the temperature data.

[0079] In the embodiment of the present invention, each of the second processor domains is provided with a virtual PVT driver; the at least one second processor domain obtains the temperature data from the memory space, including:

[0080] At least one of the second processor domains obtains the temperature data from the memory space through the virtual PVT driver.

[0081] Specifically, since the hwmon core or thermal strategy in the second processor domain cannot interact with the memory space for data, the embodiment of the present invention innovatively sets a virtual PVT driver in each second processor domain, so that each second processor domain can simultaneously obtain the temperature data from the memory space through the virtual PVT driver.

[0082] In the embodiment of the present invention, the at least one second processor domain obtains the temperature data from the memory space, including:

[0083] After each preset time interval, at least one of the second processor domains obtains the temperature data from the memory space.

[0084] Specifically, the virtual PVT driver in each second processor domain can read the temperature data from the memory space at regular intervals, for example, once every 1 second or 1 minute. Of course, the virtual PVT driver in each second processor domain can also obtain the temperature data in real time, or in other ways. In actual applications, it can be adjusted according to actual needs, and the embodiment of the present invention does not limit this.

[0085] Step 104: at least one of the second processor domains performs temperature control on a target hardware unit of the SOC according to the temperature data.

[0086] After each second processor domain obtains the temperature data, it can independently perform temperature control on the target hardware unit in its own domain according to the temperature data without interfering with each other, thereby jointly completing the temperature control.

[0087] The principle of temperature control is as follows:

[0088] 1) Take corresponding measures (lower frequency, shut down core, etc.) on the target hardware unit to reduce heat generation, so that the temperature of the area to be detected can be reduced. In other words, the purpose of reducing frequency, shutting down core, etc. is to reduce power consumption and thus reduce heat generation;

[0089] 2) Reduce heat generation, achieve a balance between heat generation and heat dissipation, and avoid damage to the target hardware unit due to operation at high temperatures.

[0090] In an embodiment of the present invention, when at least one of the second processor domains is provided with a temperature control driver, a core program hwmon core in a hardware monitoring framework hwmon, and a core program thermal_core in a thermal framework, at least one of the second processor domains performs temperature control on a target hardware unit of the SOC according to the temperature data, including:

[0091] The second processor domain reports the temperature data obtained from the virtual PVT driver to the hwmoncore and then to thermal_core;

[0092] The temperature data is sent to the temperature control driver, and the second processor domain performs temperature control on a target hardware unit of the SOC according to the temperature data through the temperature control driver.

[0093] Specifically, when the second processor domain is the AP domain and the CP domain, the temperature control driver, the core program hwmon core in the hardware monitoring framework hwmon, and the core program thermal_core in the thermal framework can be set in both the AP domain and the CP domain. Then, the virtual PVT driver in the AP domain and the CP domain can obtain temperature data from the memory space, and then the virtual PVT driver reports the temperature data to hwmon core, hwmon core reports the temperature data to thermal_core, thermal_core reports the temperature data to the temperature control driver, and the temperature control driver performs temperature control on the target hardware unit according to the temperature data.

[0094] In an embodiment of the present invention, the second processor domain performs temperature control on a target hardware unit of the SOC according to the temperature data through the temperature control driver, including:

[0095] When the temperature control driver determines that the temperature data exceeds a first temperature threshold and does not exceed a second temperature threshold, the second processor domain performs frequency reduction processing on a target hardware unit of the SOC through the temperature control driver;

[0096] When the temperature control driver determines that the temperature data exceeds the second temperature threshold and does not exceed the third temperature threshold, the second processor domain shuts down the preset core processing unit of the target hardware unit of the SOC through the temperature control driver;

[0097] When the temperature control driver determines that the temperature data exceeds the third temperature threshold, the second processor domain restarts the target hardware unit of the SOC through the temperature control driver.

[0098] Specifically, when the second processor domain is an AP domain and a CP domain, the second processor domain also includes target hardware units, including but not limited to CPU units, GPU units, and NPU units. When the temperature control driver determines that the temperature data exceeds the first temperature threshold but does not exceed the second temperature threshold, the second processor domain can use the temperature control driver to reduce the frequency of the target hardware unit. For example, when the temperature control driver determines that the temperature data exceeds 90°C but does not exceed 110°C, the second processor domain can use the temperature control driver to reduce the frequency of the CPU unit, GPU unit, and NPU unit; when the temperature data does not exceed 90°C, the frequency of the CPU unit, GPU unit, and NPU unit can be restored through the temperature control driver.

[0099] When the temperature control driver determines that the temperature data exceeds the second temperature threshold but does not exceed the third temperature threshold, the second processor domain can shut down the preset core processing unit in the target hardware unit through the temperature control driver. For example, when the temperature control driver determines that the temperature data exceeds 110°C but does not exceed 125°C, the second processor domain can shut down some core processing units of the CPU unit, GPU unit and NPU unit through the temperature control driver; when the temperature control driver determines that the temperature data does not exceed 110°C, the second processor domain can restore the shut down core processing units in the CPU unit, GPU unit and NPU unit through the temperature control driver.

[0100] When the temperature control driver determines that the temperature data exceeds the third temperature threshold, the second processor domain may restart the CPU unit, the GPU unit, and the NPU unit through the temperature control driver.

[0101] It should be noted that the target hardware unit may include not only a CPU unit, a GPU unit and an NPU unit, but also other processors. In practical applications, these may be configured according to actual needs, and the embodiments of the present invention do not impose any restrictions on this.

[0102] In an embodiment of the present invention, when any second processor domain in at least one of the second processor domains is provided with a temperature control management program, at least one of the second processor domains performs temperature control on a target hardware unit of the SOC according to the temperature data, including:

[0103] The second processor domain sends the temperature data to the temperature control management program through a virtual PVT driver, and the second processor domain performs temperature control on a target hardware unit of the SOC according to the temperature data through the temperature control management program.

[0104] Specifically, when the second processor domain is the RP domain, a temperature control management program may be set in the RP domain. Then, the virtual PVT driver in the RP domain may obtain temperature data from the memory space, and then the virtual PVT driver reports the temperature data to the temperature control management program, and the temperature control management program performs temperature control on the target hardware unit according to the temperature data.

[0105] In an embodiment of the present invention, a system-on-chip SOC includes a first processor domain for acquiring temperature data, at least one second processor domain for performing temperature control based on the temperature data, and a memory space. After acquiring the temperature data of the area to be detected in the SOC, the first processor domain can write the temperature data into the memory space. After at least one of the second processor domains acquires the temperature data from the memory space, at least one of the second processor domains can perform temperature control on a target hardware unit of the SOC according to the temperature data. In this way, the temperature data is shared with each CPU domain through the memory space, which solves the problem that the PVT module only supports the allocation of one CPU domain, resulting in other CPU domains being unable to acquire temperature data, and enables each domain to acquire temperature data, so that each domain performs independent temperature control without interfering with each other, and jointly completes the temperature control of the chip.

[0106] It should be noted that, for the sake of simplicity, the method embodiments are described as a series of action combinations, but those skilled in the art should be aware that the embodiments of the present invention are not limited by the order of the actions described, because according to the embodiments of the present invention, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments of the present invention.

[0107] The embodiment of the present invention discloses a system-on-chip of the present invention, wherein the SOC comprises a first processor domain for acquiring temperature data, at least one second processor domain for performing temperature control based on the temperature data, and a memory space;

[0108] The first processor domain is used to obtain temperature data of a to-be-detected area in the SOC;

[0109] The first processor domain is further used to write the temperature data into the memory space;

[0110] at least one of the second processor domains, configured to obtain the temperature data from the memory space;

[0111] At least one of the second processor domains is further configured to perform temperature control on a target hardware unit of the SOC according to the temperature data.

[0112] In an embodiment of the present invention, the SOC further includes a processing voltage and temperature PVT module, and the first processor domain is provided with a PVT driver corresponding to the PVT module;

[0113] The first processor domain is further used to obtain the collected temperature data of the area to be detected in the SOC from the PVT module through the PVT driver.

[0114] In the embodiment of the present invention, each of the second processor domains is provided with a virtual PVT driver;

[0115] At least one of the second processor domains is further configured to obtain the temperature data from the memory space through the virtual PVT driver.

[0116] In an embodiment of the present invention, when at least one of the second processor domains is provided with a temperature control driver, a core program hwmon core in a hardware monitoring framework hwmon, and a core program thermal_core in a thermal framework, the second processor domain is further used for:

[0117] Report the temperature data obtained from the virtual PVT driver to the hwmon core and then to thermal_core;

[0118] The temperature data is sent to the temperature control driver, and the second processor domain performs temperature control on a target hardware unit of the SOC according to the temperature data through the temperature control driver.

[0119] In an embodiment of the present invention, when any second processor domain in at least one of the second processor domains is provided with a temperature control management program, the second processor domain is further configured to:

[0120] The temperature data is sent to the temperature control management program through a virtual PVT driver, and the second processor domain performs temperature control on a target hardware unit of the SOC according to the temperature data through the temperature control management program.

[0121] In the embodiment of the present invention, the second processor domain is further used for:

[0122] When the temperature control driver determines that the temperature data exceeds a first temperature threshold and does not exceed a second temperature threshold, the temperature control driver performs frequency reduction processing on a target hardware unit of the SOC;

[0123] When the temperature control driver determines that the temperature data exceeds the second temperature threshold and does not exceed the third temperature threshold, shutting down the preset core processing unit of the target hardware unit of the SOC through the temperature control driver;

[0124] When the temperature control driver determines that the temperature data exceeds the third temperature threshold, the target hardware unit of the SOC is restarted by the temperature control driver.

[0125] In an embodiment of the present invention, the area to be detected includes: a graphics processor area, an application processor area, a safety island area and a top-level circuit area.

[0126] In the embodiment of the present invention, the at least one second processor domain is further configured to:

[0127] After each preset time interval, the temperature data is obtained from the memory space.

[0128] In an embodiment of the present invention, when the second processor domain is an application processor domain, the application processor domain further includes a thermal mitigation framework layer thermal HAL, which is used to obtain the temperature data from the hwmon core and display the temperature data.

[0129] In the embodiment of the present invention, when the second processor domain is a cluster processor, the cluster processor domain further includes a temperature management service program thermal_manager, which is used to obtain the temperature data from the hwmon core and display the temperature data.

[0130] As for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0131] An embodiment of the present invention further provides an electronic device, including:

[0132] It includes a processor, a memory, and a computer program stored in the memory and capable of running on the processor. When the computer program is executed by the processor, the various processes of the above-mentioned cross-domain chip temperature control method embodiment are implemented, and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0133] An embodiment of the present invention also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the various processes of the above-mentioned cross-domain chip temperature control method embodiment are implemented, and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0134] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0135] It should be understood by those skilled in the art that the embodiments of the present invention can be provided as methods, devices, or computer program products. Therefore, the embodiments of the present invention can take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the embodiments of the present invention can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0136] The embodiments of the present invention are described with reference to the flowcharts and / or block diagrams of the methods, terminal devices (systems), and computer program products according to the embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0137] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0138] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce a computer-implemented process, thereby providing instructions for executing on the computer or other programmable terminal device to implement the process. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0139] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0140] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0141] The above is a detailed introduction to a cross-domain chip temperature control method and a cross-domain chip temperature control device provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A cross-domain chip temperature control method, characterized in that: Applied to a system-on-chip (SOC), the SOC includes a first processor domain for acquiring temperature data, at least one second processor domain for temperature control based on the temperature data, a memory space and a voltage-temperature PVT module, the first processor domain is provided with a PVT driver corresponding to the PVT module; the method includes: The first processor domain acquires temperature data of a to-be-detected area in the SOC; The first processor domain writes the temperature data into the memory space; At least one of the second processor domains obtains the temperature data from the memory space; At least one of the second processor domains performs temperature control on a target hardware unit of the SOC according to the temperature data; The first processor domain acquires temperature data of a to-be-detected area in the SOC, including: The first processor domain acquires the collected temperature data of the area to be detected in the SOC from the PVT module through the PVT driver; Each of the second processor domains is provided with a virtual PVT driver; the at least one second processor domain obtains the temperature data from the memory space, including: At least one of the second processor domains obtains the temperature data from the memory space through the virtual PVT driver.

2. The chip temperature control method according to claim 1, characterized in that: When at least one of the second processor domains is provided with a temperature control driver, a core program hwmon core in a hardware monitoring framework hwmon, and a core program thermal_core in a thermal framework, at least one of the second processor domains performs temperature control on a target hardware unit of the SOC according to the temperature data, including: The second processor domain reports the temperature data obtained from the virtual PVT driver to the hwmon core and then to thermal_core; The temperature data is sent to the temperature control driver, and the second processor domain performs temperature control on a target hardware unit of the SOC according to the temperature data through the temperature control driver.

3. The chip temperature control method according to claim 1, characterized in that: When any second processor domain of at least one of the second processor domains is provided with a temperature control management program, at least one of the second processor domains performs temperature control on a target hardware unit of the SOC according to the temperature data, including: The second processor domain sends the temperature data to the temperature control management program through a virtual PVT driver, and the second processor domain performs temperature control on a target hardware unit of the SOC according to the temperature data through the temperature control management program.

4. The chip temperature control method according to claim 2, characterized in that: The second processor domain controls the temperature of the target hardware unit of the SOC according to the temperature data through the temperature control driver, including: When the temperature control driver determines that the temperature data exceeds a first temperature threshold and does not exceed a second temperature threshold, the second processor domain performs frequency reduction processing on a target hardware unit of the SOC through the temperature control driver; When the temperature control driver determines that the temperature data exceeds the second temperature threshold and does not exceed the third temperature threshold, the second processor domain shuts down the preset core processing unit of the target hardware unit of the SOC through the temperature control driver; When the temperature control driver determines that the temperature data exceeds the third temperature threshold, the second processor domain restarts the target hardware unit of the SOC through the temperature control driver.

5. The cross-domain chip temperature control method according to claim 1, characterized in that: The area to be detected includes: a graphics processor area, an application processor area, a safety island area and a top-level circuit area.

6. The cross-domain chip temperature control method according to claim 1, characterized in that: The at least one second processor domain obtains the temperature data from the memory space, including: After each preset time interval, at least one of the second processor domains obtains the temperature data from the memory space.

7. The cross-domain chip temperature control method according to claim 2, characterized in that: When the second processor domain is an application processor domain, the application processor domain further includes a thermal mitigation framework layer thermal HAL, which is used to obtain the temperature data from the hwmoncore and display the temperature data.

8. The cross-domain chip temperature control method according to claim 2, characterized in that: When the second processor domain is a cluster processor, the cluster processor domain further includes a temperature management service program thermal_manager, which is used to obtain the temperature data from the hwmon core and display the temperature data.

9. A chip, characterized in that: The chip SOC includes a first processor domain for acquiring temperature data, at least one second processor domain for performing temperature control based on the temperature data, and a memory space; the first processor domain is used to acquire temperature data of a to-be-detected area in the SOC; The first processor domain is further used to write the temperature data into the memory space; at least one of the second processor domains, configured to obtain the temperature data from the memory space; at least one of the second processor domains is further configured to perform temperature control on a target hardware unit of the SOC according to the temperature data; The SOC further includes a processing voltage and temperature PVT module, and the first processor domain is provided with a PVT driver corresponding to the PVT module; The first processor domain is further used to obtain the collected temperature data of the area to be detected in the SOC from the PVT module through the PVT driver; Each of the second processor domains is provided with a virtual PVT driver; At least one of the second processor domains is further configured to obtain the temperature data from the memory space through the virtual PVT driver.

10. An electronic device, characterized in that: include: A processor, a memory, and a computer program stored in the memory and capable of running on the processor, wherein when the computer program is executed by the processor, the steps of the cross-domain chip temperature control method as described in any one of claims 1 to 8 are implemented.

11. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by the processor, the steps of the cross-domain chip temperature control method as described in any one of claims 1 to 8 are implemented.

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