Method of manufacturing a Halbach array magnet assembly

Abstract

The application relates to the technical field of Halbach array magnet, and particularly discloses a manufacturing method of a Halbach array magnet assembly, which comprises the following steps: 1) preliminarily processing a blank material to obtain a permanent magnet blank with a thickness not greater than 1.5 mm and a length-diameter ratio greater than 20; 2) performing Halbach array arrangement, marking a fitting surface and a non-fitting surface on the permanent magnet blank; 3) coating an adhesive layer on the fitting surface and an anti-oxidation layer on the non-fitting surface, fitting the fitting surface, and performing diffusion connection treatment under vacuum pressure to obtain an assembly product after heat treatment; 4) performing secondary processing to meet the size requirement of a target Halbach array, and forming a Halbach array magnet assembly semi-finished product; 5) performing surface processing treatment; and 6) performing integrated magnetization according to an orientation direction to obtain the Halbach array magnet assembly. According to the application, the single-piece magnet with a thickness not greater than 1.5 mm and a length-diameter ratio greater than 20 can be uniformly and densely fitted and is not prone to deformation in the process of manufacturing the Halbach array magnet assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of Halbach array magnet, more particularly, it relates to a manufacturing method of Halbach array magnet assembly. BACKGROUND

[0002] Halbach array is a kind of magnet structure, which is an approximate ideal structure in engineering. Permanent magnets with different magnetization directions are arranged in a certain order, so that the magnetic field of the working surface is significantly enhanced, and the magnetic field of the non-working surface is significantly weakened. The goal is to generate the strongest magnetic field with the least amount of magnets, while reducing the influence of stray fields on other components on the non-working surface.

[0003] The traditional Halbach array magnet assembly is a magnet assembly formed by bonding and assembling single magnets processed to the specified size. However, when the required size is small, subsequent assembly processes such as machining and electroplating operations can cause large deviations in the size of the small single magnets, which can eventually lead to the formation of unqualified Halbach array magnet assemblies.

[0004] In the application field of consumer electronics or small motors, the thickness of single magnets and the bonding effect between magnets in the Halbach array magnet assembly are more demanding. If the traditional Halbach array magnet assembly method is used, the following problems may exist:

[0005] 1. The machining process requires high accuracy in the machining size of single magnets. The thickness of the single magnets is small, so it is difficult to accurately control the thickness uniformity of the glue bonding layer, which can cause size differences in the magnet assembly. After assembly, the magnet assembly is difficult to be further machined due to the presence of glue, so the Halbach array magnet assembly made by this method is prone to size uniformity problems.

[0006] In addition, each single magnet has a specific magnetization direction. When the arrangement direction of single magnets is different, there will be a large repulsive force between the magnets, which can cause the glue to fall off, resulting in misalignment of the Halbach array magnet assembly during operation and damage to the equipment.

[0007] 2. In addition, if the Halbach array magnet assembly processing process involves grain boundary diffusion-welding and other processes that require high temperature treatment, the temperature conditions used are usually 700-1000℃. The single magnets are too thin and can easily deform during high temperature treatment (see Figure 1 and Figure 2 ), which can eventually lead to welding failure.

[0008] Therefore, Hellbeck array magnet components assembled with glue are prone to problems such as uneven overall size and glue peeling. When using high-temperature processing such as grain boundary diffusion-welding, deformation problems are likely to occur, ultimately leading to product defects. Summary of the Invention

[0009] In order to reduce the problems of uneven dimensions and glue detachment caused by glue bonding during the manufacturing process of Helbeck array magnets using single magnet blanks (or permanent magnet blanks) with a thickness of no more than 1.5 mm and an aspect ratio of more than 20, and to reduce the problem of magnet deformation caused by grain boundary diffusion-welding operation requirements, this application provides a manufacturing method for Helbeck array magnet components.

[0010] Firstly, this application provides the following technical solution:

[0011] The method for manufacturing a Helbeck array magnet assembly includes the following steps:

[0012] 1) Perform preliminary processing on the raw material according to the size requirements to obtain permanent magnet blanks;

[0013] 2) Arrange the Hellbeck array and mark the mating and non-matting surfaces on the permanent magnet blank;

[0014] 3) Apply an adhesive layer to the bonding surface of the permanent magnet blank, apply an anti-oxidation layer to the non-bonding surface of the magnet blank, bond the bonding surfaces together, and then perform diffusion bonding treatment under vacuum pressure to obtain the heat-treated component product.

[0015] 4) The heat-treated components are further processed to meet the size requirements of the target Helbeck array, forming a semi-finished Helbeck array magnet component;

[0016] 5) Perform surface processing on the semi-finished Heilbeck array magnet assembly;

[0017] 6) The semi-finished Helbeck array magnet assembly after surface processing is magnetized in one piece according to the orientation direction to obtain the Helbeck array magnet assembly;

[0018] The thickness of the permanent magnet blank after preliminary processing in step 1) is no more than 1.5 mm, and the length-to-diameter ratio is greater than 20.

[0019] By adopting the technical scheme, the present application mainly aims at manufacturing the Halbach array magnet assembly by using the permanent magnet blank with a thickness of not more than 1.5 mm and a length-diameter ratio of more than 20. The main reason is that when the thickness of the permanent magnet blank as the Halbach array magnet assembly is not more than 1.5 mm and the length-diameter ratio is more than 20, the machining precision of the permanent magnet blank is difficult to control, and the phenomenon of delamination is prone to occur after integral magnetization.

[0020] In step 1), the permanent magnet blank is arranged in a Halbach array according to actual needs, and there are numerous cases. Therefore, in step 2), the bonding surface and the non-bonding surface in the arrangement process are marked to facilitate subsequent operation.

[0021] In the process of manufacturing the Halbach array magnet assembly, the mutual cooperation of the materials coated between the bonding surface and the non-bonding surface in step 3), combined with the process condition control in the operation process, makes the adhesive layer on the bonding surface and the anti-oxidation layer on the non-bonding surface more dense, not prone to defects, and also makes the coating thickness more uniform, thereby facilitating the improvement of the adhesion effect and the anti-oxidation effect.

[0022] In step 4), the permanent magnet blank is processed according to the size requirements of the target product (see Figure 3 ). The uneven anti-oxidation layer on the non-bonding surface is processed to be flat. Generally, there is a processing size allowance on the surface of the non-bonding surface. The thickness direction size is first processed to be in place, which also removes part of the uneven anti-oxidation layer on the non-bonding surface. In the present application, the permanent magnet blank is first coarsely processed, and then the size is precisely processed, which is different from the traditional manufacturing method of the Halbach array magnet.

[0023] In step 5), the surface processing treatment is performed on the Halbach array magnet assembly semi-finished product obtained in step 4), which is chamfered, electroplated or surface sprayed to improve the corrosion resistance and anti-collision ability of the Halbach array magnet assembly, and further improve the service life of the Halbach array magnet assembly.

[0024] Finally, the Halbach array magnet assembly semi-finished product obtained after assembly is subjected to integral magnetization, which is more convenient and beneficial to improve the processing efficiency.

[0025] Through the processing of all the above steps, not only can the Halbach array magnet assembly be quickly assembled and the size precision be controlled, but also the adhesion uniformity and adhesion effect of the Halbach array magnet assembly as a whole can be improved to ensure that the magnet assembly will not be separated due to repulsion between magnets with different orientations in the subsequent use process, causing failure.

[0026] Further, the thickness of the permanent magnet blank preliminarily processed in step 1) is 0.15-1.5 mm.

[0027] Since the factory processing mostly uses the above thickness range, the processing method of the permanent magnet blank in the thickness range and the subsequent assembly are more skilled. Other sizes can also be processed according to actual requirements.

[0028] Further, in the step three, the thickness of the adhesive layer on the bonding surface between the adjacent permanent magnet blanks is 0.3-150 μm; the coating thickness on the non-bonding surface is 0.3-200 μm.

[0029] By adopting the above technical scheme, when coating on the bonding surface and the non-bonding surface, the coating thickness of the adhesive layer and the oxidation-resistant layer needs to be controlled, especially the thickness of the adhesive layer on the bonding surface, which needs to be maintained at 0.3-150 μm. If the thickness of the adhesive layer is too small, different thin magnets cannot be well bonded together, resulting in low bonding strength; if the thickness of the adhesive layer is too large, it will first increase the cost of the coating material, and secondly cause the fluctuation of the size of the magnet assembly.

[0030] And the coating thickness of the adhesive layer and the oxidation-resistant layer in the Halbach array magnet assembly can be the same or different.

[0031] Further, in the step three, the thickness of the adhesive layer on the bonding surface between the adjacent permanent magnet blanks is 2.5-25 μm; the coating thickness on the non-bonding surface is 14.5-60 μm.

[0032] The thickness of the adhesive layer and the oxidation-resistant layer commonly used by the applicant is within the above range, which is beneficial to make the magnet assembly have better adhesive effect, oxidation resistance and good integrity of the magnet assembly.

[0033] Further, the vacuum degree in the step 3) is <1.0E-04, and the pressure is 2-30 Mpa.

[0034] By adopting the above technical scheme, the vacuum degree and the pressure in the step 3) are maintained in this state, which is beneficial to make the adhesive layer and the oxidation-resistant layer obtained after coating have better density and uniformity, and are not prone to defects, for reducing the deformation amount of the thin magnet in the preparation of the Halbach array magnet assembly due to the high temperature effect in the subsequent diffusion connection process, and can optimize the effect produced by the diffusion connection, and can more persistently play the effect of the Halbach array magnet assembly itself.

[0035] Further, in the step 3), the main component of the oxidation-resistant layer coated on the non-bonding surface of the permanent magnet blank is metal powder and / or alloy powder, and / or the oxidation-resistant layer is a high-temperature resistant film layer.

[0036] The main component of the adhesive layer coated on the bonding surface of the permanent magnet blank is metal powder and / or alloy powder.

[0037] In the present application, the adhesive layer is obtained by coating the bonding surface with a coating liquid containing metal powder, or containing alloy powder, or containing both metal powder and alloy powder, so as to adhere the single-piece permanent magnet blanks to form a Halbach array magnet assembly.

[0038] The oxidation-resistant layer can be obtained by coating the non-bonding surface with a coating liquid containing metal powder, or containing alloy powder, or containing both metal powder and alloy powder, and can also be obtained by coating the non-bonding surface with a high-temperature-resistant film layer, but in most cases, the coating method is preferred.

[0039] Further, the metal elements in the metal powder include one of Tb, Dy, Gd, Ce, Pr, Nd, Al, Cu, Ag, Ni, Zn, Ga, Nb, Co, Sn, and low-melting-point rare earth alloy powder; the alloy powder is formed by at least two elements of Tb, Dy, Gd, Ce, Pr, Nd, Al, Cu, Ag, Ni, Zn, Ga, Nb, Co, Sn, and low-melting-point rare earth alloy;

[0040] The composition of the low-melting-point rare earth alloy powder is RE-X, wherein RE is at least one of Tb, Dy, Pr, Nd, Gd, and Ce; X is at least one of Fe, Cu, Al, Ni, Sn, Nb, Ga, Ag, and Co;

[0041] The high-temperature-resistant film layer includes a high-temperature-resistant metal film layer and a high-temperature-resistant ceramic film layer, the high-temperature-resistant metal film layer is deposited by a high-melting-point metal, the high-melting-point metal includes at least one of Ti, Cr, Ta, W, Mo, and V; the high-temperature-resistant ceramic film layer is a nitride or carbide ceramic film.

[0042] In the present application, when the bonding surface and the non-bonding surface are coated to obtain the adhesive layer or the oxidation-resistant layer, there are many optional cases of metal powder and alloy powder, and the materials coated on the bonding surface and the non-bonding surface can be the same or different.

[0043] When the non-bonding surface is coated to form a high-temperature-resistant film layer as the oxidation-resistant layer, it is also feasible.

[0044] On the non-bonding surface, whether the coating or deposition method is used to form the oxidation-resistant layer, the non-bonding surface can have good oxidation resistance, and can also weaken the deformation of the magnet during the diffusion bonding process at high temperature.

[0045] Further, the particle size of the metal powder and alloy powder used in the non-adhesion surface coating is 2-50 μm; the particle size of the metal powder and alloy powder used in the adhesion surface coating is 2-10 μm.

[0046] By using the above technical solution, the adhesion layer and the oxidation prevention layer coated on the non-adhesion surface and the adhesion surface are more uniform, the adhesion effect and the compactness between the single-piece magnets are increased, and the non-adhesion surface maintains good oxidation prevention effect, and the deformation amount of the magnet in the diffusion connection processing process at high temperature is reduced.

[0047] Further, the coating liquid used in the adhesion layer coating is composed of metal powder and / or alloy powder and a solvent, and the solvent is at least one of oxidation prevention glue and ethanol.

[0048] The coating liquid used in the oxidation prevention layer coating is composed of metal powder and / or alloy powder and terpineol.

[0049] By using the above technical solution, the metal powder and / or alloy powder is fully dispersed by the solvent, and in the selection of the solvent, the selected metal powder and / or alloy powder can be adjusted, so that the obtained coating liquid is uniform in texture and easy to coat, so that the obtained adhesion layer and oxidation prevention layer are uniform in texture, the oxidation prevention effect of the magnet in the diffusion connection processing process at high temperature is improved, and the deformation amount of the magnet in the diffusion connection processing process at high temperature is further reduced.

[0050] In summary, the present application has the following beneficial effects:

[0051] In the present application, the non-adhesion surface and the adhesion surface are respectively coated, the heat treatment is limited in vacuum and pressure, and the Halbach array magnet assembly is subjected to diffusion connection processing, so that the single-piece magnet with a single-piece thickness of not more than 1.5 mm and a length-diameter ratio of more than 20 can be uniformly and densely adhered during the manufacturing of the Halbach array magnet assembly, and deformation is not easy to occur.

[0052] Further, the material used in the coating is limited in the present application, so that the adhesion effect of the magnet in the obtained Halbach array magnet assembly is good, and at the same time, since the Halbach array magnet assembly after heat treatment is relatively regular, subsequent reprocessing is relatively convenient, and material waste is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0053] Figure 1 , the side view comparison of the Halbach array magnet assembly before and after deformation in the grain boundary diffusion process.

[0054] Figure 2 , the front view comparison of the Halbach array magnet assembly before and after deformation in the grain boundary diffusion process.

[0055] Figure 3 The process diagram of the size processing according to the requirements in the application.

[0056] Figure 4 The arrangement diagram and orientation direction of the Halbach array magnet assembly in Example 1.

[0057] Figure 5 The arrangement diagram and orientation direction of the Halbach array magnet assembly in Example 3.

[0058] Figure 6 The arrangement diagram and orientation direction of the Halbach array magnet assembly in Example 4.

[0059] Figure 7 The arrangement diagram and orientation direction of the Halbach array magnet assembly in Example 5.

[0060] Figure 8 The surface morphology diagram of the test sample in Example 4.

[0061] Figure 9 The fracture morphology diagram of the test sample in Example 4, ×50.

[0062] Figure 10 The fracture morphology diagram of the test sample in Example 4, ×100.

[0063] Figure 11 The fracture morphology diagram of the test sample in Example 4, ×500.

[0064] Figure 12 The fracture morphology diagram of the test sample in Example 5 after grinding, ×500.

[0065] Figure 13 The fracture morphology diagram of the test sample in Example 6 after grinding, ×500. DETAILED DESCRIPTION

[0066] Example

[0067] Example 1: The manufacturing method of the Halbach array magnet assembly, specifically comprising the following steps:

[0068] 1) Process the magnet blank according to the size requirements.

[0069] 2) Arrange 3 single-piece permanent magnet blanks in a Halbach array (arrange according to the Halbach array structure), the arrangement diagram is as follows: Figure 1As shown, the thickness of each single piece of permanent magnet blank is 1.5 mm, the length-diameter ratio is 34.0, and the size specifications of the single piece of permanent magnet blank from left to right are: 51*1.5*36.5M, 51*1.5M*36.5, 51*1.5*36.5M, and the arrow direction represents the orientation direction. In addition, the fitting surface (i.e., the surface fitting with the adjacent magnet blank) and the non-fitting surface (i.e., the surface other than the fitting surface) are marked on each magnet blank.

[0070] 3) A bonding layer is coated on the fitting surface of the magnet blank, and an oxidation-resistant layer is coated on the non-fitting surface of the magnet blank, and then the product is subjected to diffusion bonding treatment under vacuum / high pressure conditions (pressure of 2.03 MPa, vacuum of 9.5x10E-5).

[0071] The oxidation-resistant layer on the non-fitting surface is obtained by magnetron sputtering with a thickness of 20±2.0 μm, and the material of the oxidation-resistant layer is Al powder;

[0072] The material of the bonding layer coated on the fitting surface is TbFe alloy powder, which is mixed with ethanol in a ratio of TbFe alloy powder (g): ethanol (ml)=1:2 to obtain a bonding layer coating liquid, and then manually coated. The thickness of the coated bonding layer is 15±5.0 μm.

[0073] The parameters of the above-mentioned magnetron sputtering are: argon pressure 0.02 Torr, voltage 1000 V, and current 0.1 A.

[0074] And the specific operation of diffusion bonding is:

[0075] The stacked magnet is fixed and placed in a diffusion furnace. First, argon gas is introduced into the diffusion furnace until the pressure in the furnace reaches 2.0 MPa, and then heated to a temperature of 650°C for heat treatment for 30 min. Then, the temperature is raised to 900°C for heat treatment for 20 h, and the vacuum is ensured to be <1.0E-04. Finally, it is transferred into a tempering furnace and tempered at 480°C for 4 h.

[0076] 4) The product after the above-mentioned heat treatment is processed to the size of the target array. This time, only the surface is micro-processed, and the slightly uneven places are processed without affecting the functions of the oxidation-resistant layer and the bonding layer, forming a Halbach array magnet semi-finished product.

[0077] 5) The Halbach array magnet semi-finished product is subjected to surface processing.

[0078] 6) The Halbach array magnet semi-finished product after surface processing is subjected to integrated magnetization to obtain a Halbach array magnet assembly.

[0079] Embodiment 2: The manufacturing method of the Halbach array magnet assembly, the Halbach array arrangement is the same as that in Embodiment 1, and the main difference from Embodiment 1 is that the thickness of each single-piece permanent magnet blank is 0.7 mm, the length-diameter ratio is 21.4, and the size specifications of the single-piece permanent magnet blank from left to right are 15*5.87M*0.7, 15*5.87*0.7M, and 15*5.87M*0.7.

[0080] The anti-oxidation layer coated on the non-adhesion surface in Step 3 is sequentially composed of a Dy layer and an Al layer from inside to outside, and the thickness of the Al layer is 10±1.0 μm and the thickness of the Dy layer is 3±0.5 μm.

[0081] The bonding layer coated on the adhesion surface by means of magnetron sputtering is a Dy layer, and the thickness of the Dy layer is 3±0.5 μm.

[0082] Embodiment 3: The manufacturing method of the Halbach array magnet assembly, the difference from Embodiment 1 is that three single-piece permanent magnet blanks are arranged in a Halbach array, and the arrangement diagram is as shown in Figure 2 The thickness of each single-piece permanent magnet blank is 0.5 mm, the length-diameter ratio is 104.0, and the size specifications of the single-piece permanent magnet blank from left to right are 52*39.9*0.5M, 52*39.9M*0.5, and 52*39.9*0.5M.

[0083] In Step 3, the anti-oxidation layer with a thickness of 15±2.0 μm is obtained on the non-adhesion surface by means of magnetron sputtering, and the raw material is Al powder.

[0084] The bonding layer with a thickness of 3±0.5 μm is obtained on the adhesion surface by means of magnetron sputtering, and the raw material is Al powder.

[0085] Embodiment 4: The manufacturing method of the Halbach array magnet assembly, the difference from Embodiment 1 is that five single-piece permanent magnet blanks are arranged in a Halbach array, and the arrangement diagram is as shown in Figure 3 The thickness of each single-piece permanent magnet blank is 0.43 mm, the length-diameter ratio is 117.7, and the size specifications of the single-piece permanent magnet blank from left to right are 50.6*0.43*43.2M, 50.6*0.43M*43.2, 50.6*0.43*43.2 M, 50.6*0.43M*43.2, and 50.6*0.43*43.2 M.

[0086] In Step 3, the anti-oxidation layer is obtained by manual coating on the non-adhesion surface, and the specific operation is as follows: first, the anti-oxidation layer coating solution is obtained by fully mixing PrNd alloy powder (g) and terpineol (g) according to the ratio of 5:1, then the coating solution is manually coated to obtain an oxidation layer (PrNd layer) with a thickness of 15±2.0 μm.

[0087] The PrTbAl alloy powder and the Cu powder are mixed in a mass ratio of 2:1 to form a mixed metal powder; the mixed metal powder (g): antioxidant glue (g): alcohol (ml) = 50:1:200 is mixed to obtain a bonding layer coating liquid. The bonding layer is coated on the bonding surface by manual coating, and is bonded to finally obtain a bonding layer with a thickness of 3±0.5 μm.

[0088] In the diffusion connection process of step 5), the stacked magnet is fixed and placed in a diffusion furnace. First, argon is introduced into the diffusion furnace until the pressure in the furnace reaches 2.0 MPa, and the temperature is raised to 650°C for heat treatment for 30 min; then the temperature is raised to 810°C for heat treatment for 20 h, ensuring that the vacuum is <1.0E-04; finally, it is transferred into a tempering furnace and tempered at 480°C for 4 h.

[0089] Example 5: A manufacturing method of a Halbach array magnet assembly, which is different from example 1 in that the 4s piece single-piece permanent magnet blank is arranged in a Halbach array, and the arrangement diagram is as shown in Figure 4 The thickness of each single-piece permanent magnet blank is 0.2 mm, the aspect ratio is 253.0, and the size specifications of the single-piece permanent magnet blank from left to right are: 50.6*0.20*43.2M; 50.6*0.20M*43.2; 50.6*0.20M*43.2; 50.6*0.20*43.2M.

[0090] In step 3), the antioxidant layer is obtained by manual coating on the non-bonding surface. The specific operation is as follows: first, the PrNd alloy powder (g): terpineol (g) = 5:1 is mixed to obtain an antioxidant layer coating liquid, which is manually coated to obtain an oxidation layer (PrNd layer) with a thickness of 50±10.0 μm.

[0091] The DyHx alloy powder (g): ethanol (ml) = 1:2 is mixed under nitrogen protection to form a bonding layer coating liquid, which is manually coated on the bonding surface and bonded to finally obtain a bonding layer with a thickness of 15±5.0 μm.

[0092] In the diffusion connection process of step 5), the stacked magnet is fixed and placed in a diffusion furnace. First, argon is introduced into the diffusion furnace until the pressure in the furnace reaches 2.0 MPa, and the temperature is raised to 650°C for heat treatment for 30 min; then the temperature is raised to 810°C for heat treatment for 20 h, ensuring that the vacuum is <1.0E-04; finally, it is transferred into a tempering furnace and tempered at 480°C for 4 h.

[0093] Example 6: The manufacturing method of Halbach array magnet assembly, the difference from Example 3 is that the thickness of each single piece of permanent magnet blank (from left to right) is 0.15mm (corresponding to the aspect ratio of 337.3), 0.15mm (corresponding to the aspect ratio of 337.3), and 0.4mm (corresponding to the aspect ratio of 126.5), and the size of the single piece of permanent magnet blank is 50.6*0.15M*43.2; 50.6*0.15*43.2M; 50.6*0.40M*43.2 from left to right.

[0094] In step 3), the anti-oxidation layer is manually coated on the non-adhesion surface, and the specific operation is as follows: first, the anti-oxidation coating solution is obtained by mixing PrNd alloy powder (g) and terpineol (g) in a mass ratio of 5:1, then manually coating, and an oxidation layer (PrNd layer) with a thickness of 50±10.0μm is obtained.

[0095] The TbFe alloy powder and the Ag powder are mixed in a mass ratio of 2:1 to obtain a mixed metal powder;

[0096] The mixed metal powder (g), the anti-oxidation glue (g), and the ethanol (ml) are mixed in a manner of 50:1.0:200 to form an adhesive layer coating solution, which is manually coated on the adhesion surface and bonded, and finally an adhesive layer with a thickness of 20±5.0μm is obtained.

[0097] In the diffusion connection process of step 5), the stacked magnet is fixed and placed in the diffusion furnace, the stacked magnet is fixed and placed in the diffusion furnace, first, argon is introduced into the diffusion furnace until the pressure in the furnace reaches 2.0MPa, and then the temperature is raised to 650℃ for heat treatment for 30min; then the temperature is raised to 810℃ for heat treatment for 20h, and the vacuum is ensured to be less than 1.0E-04; finally, it is transferred into a tempering furnace and tempered at 480℃ for 4h.

[0098] The diffusion connection processes adopted in Examples 1-6 are all feasible and successful.

[0099] The test sample after the diffusion connection process in Example 4-6 is observed under a microscope, and the results are shown in Figure 6 - Figure 13 .

[0100] Figure 8 The surface morphology of the test sample in Example 4 is shown in Figure 9 The fracture morphology of the test sample in Example 4 after being cut by a tool according to the size requirement is shown in Figure 10 - 11 . Figure 9 The enlarged view of .

[0101] From Figure 8 , it can be seen that the thickness of each layer coated on the adhesion surface is relatively uniform, and theFigure 9 As can be seen, the connection between the individual permanent magnet blanks is good, uniform, and dense, and the resulting Helbeck array magnet assembly semi-finished product already has good integrity. Figure 10 - 11 The bonding between individual permanent magnet blanks is more clearly visible and the bonding effect is better.

[0102] Figure 12 This is an enlarged view of the fracture surface morphology of the test sample in Example 5 after it was cut according to the dimensional requirements using a tool.

[0103] from Figure 12 As can be seen, the adjacent single permanent magnet blanks are tightly and densely bonded, giving the assembled magnet assembly good integrity. Such magnet assemblies are less prone to deformation.

[0104] Figure 13 This is an enlarged view of the fracture surface morphology of the test sample in Example 6 after it was cut according to the dimensional requirements using a tool.

[0105] from Figure 13 As can be seen, the adjacent single permanent magnet blanks are tightly and densely bonded, giving the assembled magnet assembly good integrity. Such magnet assemblies are less prone to deformation.

[0106] Comparative Example 1: The method for manufacturing the Hellbeck array magnet assembly differs from Example 2 in that...

[0107] In step 3), no anti-oxidation layer was applied to the non-bonding surface; the bonding layer applied to the bonding surface by magnetron sputtering is a Dy layer, and the thickness of the Dy layer is 3±0.5μm.

[0108] Comparative Example 2: The manufacturing method of the Heilbeck array magnet assembly differs from that of Example 1 in that magnets with different magnetization directions are first magnetized, and then a single permanent magnet is bonded with anti-oxidation adhesive to form a magnetic assembly with a specific magnetic field distribution. The thickness of the anti-oxidation adhesive layer is 15±5.0μm.

[0109] Comparative Example 3: The manufacturing method of the Hellbeck array magnet assembly differs from Example 1 in that the coating thickness of the non-adhesive surface and the adhesive surface is 0.2 μm.

[0110] Comparative Example 4: The manufacturing method of the Hellbeck array magnet assembly differs from Example 1 in that the coating thickness of the non-adhesive surface and the adhesive surface is 201 μm.

[0111] The samples before diffusion connection treatment in Examples 1-6 and Comparative Examples 1-4 are subjected to overall magnet flatness test and the data are recorded; the test samples 1-6 and the control samples 1-4 finally obtained in Examples 1-6 and Comparative Examples 1-4 are subjected to magnet flatness test again, and the data are recorded, as shown in Table 1.

[0112] Wherein, the magnet flatness is a deformation measurement index, which refers to taking the center point of the magnet as zero point, measuring the relative height data except the center point by means of height gauge and other tools, and measuring the maximum value and the minimum value of the whole surface of the magnet. When the flatness < 0.25, it is small deformation; when the flatness is 0.25-0.75, it is medium deformation; when the flatness > 0.75, it is large deformation.

[0113] Table 1 Overall magnet flatness at different stages in Examples 1-6 and Comparative Examples 1-4

[0114] Examples and Comparative Examples Overall magnet flatness before diffusion bonding / mm Overall magnet flatness of final obtained sample / mm Example 1 0.020 0.064 Example 2 0.022 0.089 Example 3 0.03 0.097 Example 4 0.005 0.021 Example 5 0.005 0.025 Example 6 0.005 0.036 Comparative Example 1 0.023 1.129 Comparative Example 2 0.006 0.466 Comparative Example 3 0.007 1.038 Comparative Example 4 0.006 0.497

[0115] Test analysis:

[0116] From the above data, it can be seen that the overall magnet flatness of the samples in Examples 1-6 is better than that of the samples in Comparative Examples 1-4. Figure 1 It can be seen that the Halbach array magnet assembly prepared by the grain boundary diffusion process is prone to deformation, and the single-piece magnet also deforms, and the magnets cannot be tightly attached again. Figure 2 From the above data, it can be seen that the overall magnet flatness of the samples in Examples 1-6 is better than that of the samples in Comparative Examples 1-4.

[0117] From the above data, it can be seen that the overall magnet flatness of the samples in Examples 1-6 is better than that of the samples in Comparative Examples 1-4.

[0118] The specific embodiments are merely an explanation of the present application, and are not a limitation of the present application. Those skilled in the art can make modifications to the embodiments without creative contribution after reading the present specification, and the modifications are protected by the patent law as long as they are within the scope of the claims of the present application.

Claims

1. A method for manufacturing a Hellbeck array magnet assembly, characterized in that, Includes the following steps: 1) Perform preliminary processing on the raw material according to the size requirements to obtain permanent magnet blanks; 2) Arrange the Hellbeck array and mark the mating and non-matting surfaces on the permanent magnet blank; 3) Apply an adhesive layer to the bonding surface of the permanent magnet blank, apply an anti-oxidation layer to the non-bonding surface of the magnet blank, bond the bonding surfaces together, and then perform diffusion bonding treatment under vacuum pressure to obtain the heat-treated component product. 4) The heat-treated components are further processed to meet the size requirements of the target Helbeck array, forming a semi-finished Helbeck array magnet component; 5) Perform surface processing on the semi-finished Heilbeck array magnet assembly; 6) The semi-finished Helbeck array magnet assembly after surface processing is magnetized in one piece according to the orientation direction to obtain the Helbeck array magnet assembly; The thickness of the permanent magnet blank after preliminary processing in step 1) is no more than 1.5 mm, and the length-to-diameter ratio is greater than 20.

2. The method for manufacturing the Hellbeck array magnet assembly according to claim 1, characterized in that, The thickness of the permanent magnet blank after preliminary processing in step 1) is 0.15-1.5mm.

3. The method for manufacturing the Hellbeck array magnet assembly according to claim 1, characterized in that, In step 3), the thickness of the adhesive layer on the bonding surface between adjacent permanent magnet blanks is 0.3μm-150μm; the coating thickness on the non-bonding surface is 0.3μm-200μm.

4. The method for manufacturing the Hellbeck array magnet assembly according to claim 2, characterized in that, In step 3), the thickness of the adhesive layer on the bonding surface between adjacent permanent magnet blanks is 2.5μm-25μm; the coating thickness on the non-bonding surface is 14.5μm-60μm.

5. The method for manufacturing the Hellbeck array magnet assembly according to claim 1, characterized in that, The vacuum degree in step 3) is <1.0E-04, and the pressure is 2-30 MPa.

6. The method for manufacturing the Hellbeck array magnet assembly according to claim 1, characterized in that, In step 3), the main components of the anti-oxidation layer coated on the non-adhesive surface of the permanent magnet blank are metal powder and / or alloy powder, and / or the anti-oxidation layer is a high-temperature resistant film layer. The adhesive layer applied to the bonding surface of the permanent magnet blank mainly consists of metal powder and / or alloy powder.

7. The method for manufacturing the Hellbeck array magnet assembly according to claim 6, characterized in that, The metal powder contains one of the following metal elements: Tb, Dy, Gd, Ce, Pr, Nd, Al, Cu, Ag, Ni, Zn, Ga, Nb, Co, and Sn; the alloy powder is a low-melting-point rare earth alloy powder or is formed from at least two elements selected from Tb, Dy, Gd, Ce, Pr, Nd, Al, Cu, Ag, Ni, Zn, Ga, Nb, Co, Sn, and rare earth compounds. The low-melting-point rare earth alloy powder has a composition of RE-X, wherein RE is at least one of Tb, Dy, Pr, Nd, Gd, and Ce; and X is at least one of Fe, Cu, Al, Ni, Sn, Nb, Ga, Ag, and Co. The high-temperature resistant film layer includes a high-temperature resistant metal film layer and a high-temperature resistant ceramic film layer. The high-temperature resistant metal film layer is deposited from a high-melting-point metal, and the high-melting-point metal includes at least one of Ti, Cr, Ta, W, Mo, and V. The high-temperature resistant ceramic film layer is a nitride or carbide ceramic film.

8. The method for manufacturing the Hellbeck array magnet assembly according to claim 6, characterized in that, The particle size of the metal powder or alloy powder used for coating the non-bonded surface is 2-50 μm; the particle size of the metal powder or alloy powder used for coating the bonded surface is 2-10 μm.

9. The method for manufacturing a Hellbeck array magnet assembly according to claim 6, characterized in that the coating liquid used when coating the adhesive layer is composed of metal powder and / or alloy powder and a solvent, wherein the solvent is at least one of anti-oxidation adhesive and ethanol; The coating solution used when applying the anti-oxidation layer is composed of metal powder and / or alloy powder and terpineol.

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