Die-level test apparatus having vacuum pressure generation structure for mobile chuck movement
The die-level test device stabilizes semiconductor dies through a mobile chuck system with controlled vacuum pressure management, addressing positioning challenges and ensuring reliable electrical testing.
WO2026146897A1PCT designated stage Publication Date: 2026-07-09SEMICS INC
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SEMICS INC
- Filing Date
- 2025-11-27
- Publication Date
- 2026-07-09
Smart Images
Figure KR2025019949_09072026_PF_FP_ABST
Abstract
Disclosed is a die-level test apparatus having a vacuum pressure generation structure for mobile chuck movement. The die-level test apparatus, according to one aspect of the present invention, may comprise: a mobile chuck having a seating surface on which dies are seated, and a plurality of vacuum suction holes for vacuum-holding the dies on the seating surface; a chuck base disposed under the mobile chuck to support the mobile chuck; chuck hands for supporting the lower surface of the mobile chuck such that the mobile chuck can be moved; a vacuum generation unit connected to the vacuum suction holes to generate vacuum pressure; and a controller for controlling operation of the vacuum generation unit.
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